CN117855235A - Cover for image sensor and method of controlling height of adhesive material - Google Patents
Cover for image sensor and method of controlling height of adhesive material Download PDFInfo
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- CN117855235A CN117855235A CN202311295178.9A CN202311295178A CN117855235A CN 117855235 A CN117855235 A CN 117855235A CN 202311295178 A CN202311295178 A CN 202311295178A CN 117855235 A CN117855235 A CN 117855235A
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- cover
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- perimeter
- image sensor
- adhesive material
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- 239000000463 material Substances 0.000 title claims abstract description 90
- 239000000853 adhesive Substances 0.000 title claims abstract description 68
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims description 23
- 238000003825 pressing Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 description 11
- 230000005670 electromagnetic radiation Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 6
- 238000000429 assembly Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
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- 239000011521 glass Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
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- 238000005260 corrosion Methods 0.000 description 2
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- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 229910021532 Calcite Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229940126639 Compound 33 Drugs 0.000 description 1
- PNUZDKCDAWUEGK-CYZMBNFOSA-N Sitafloxacin Chemical compound C([C@H]1N)N(C=2C(=C3C(C(C(C(O)=O)=CN3[C@H]3[C@H](C3)F)=O)=CC=2F)Cl)CC11CC1 PNUZDKCDAWUEGK-CYZMBNFOSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The present invention relates to a cover for an image sensor and a method of controlling the height of an adhesive material. Embodiments of a cover for an image sensor may include a light transmissive portion and a black mask layer applied as a stripe adjacent to a perimeter of a maximum planar surface of the light transmissive portion. The first edge of the strip closest to the perimeter may be spaced a predetermined distance from the perimeter.
Description
Cross Reference to Related Applications
The present application claims the benefit of the filing date of U.S. provisional patent application 63/378,457 to Bardel et al entitled "black mask on glass construction," filed on 5 th month 2022, the disclosure of which is incorporated herein by reference.
Technical Field
The present application relates to a cover for an image sensor and a method of controlling the height of an adhesive material. Aspects of the present application generally relate to packaging of semiconductor die (e.g., image sensor die).
Background
Semiconductor packages have been designed to allow electrical signals to be transmitted from the semiconductor die to a motherboard or to other circuit boards to which the semiconductor package is attached. Semiconductor packages have also been developed to protect semiconductor die from electrostatic discharge or moisture.
Disclosure of Invention
Embodiments of a cover for an image sensor may include a light transmissive portion and a black mask layer applied as a stripe adjacent to a perimeter of a maximum planar surface of the light transmissive portion. The first edge of the strip closest to the perimeter may be spaced a predetermined distance from the perimeter.
Embodiments of a cover for an image sensor may include one, all, or any combination of the following features:
the second edge of the strip closest to the center of the light-transmissive portion may be configured to: when the light-transmitting part can be coupled on the substrate, the second edge protrudes from a set of welding pads of the substrate at a preset distance.
The width of the strip between the first edge and the second edge may be constant around the strip.
For at least two portions of the strip applied adjacent both sides of the light-transmitting portion, the width of the strip between the first and second edges may be the same.
The first edge of the strip closest to the perimeter may be spaced from the perimeter only at portions of the perimeter not surrounded by a circle drawn at predetermined locations within the light-transmitting portion.
Within the circle, a first edge of the band may reach the perimeter.
The cap may include corner regions of the black mask layer embedded in material of the black mask layer exceeding a predetermined distance.
Embodiments of a cover for an image sensor may include a light-transmissive portion and a black mask layer applied as a stripe around a perimeter of a maximum planar surface of the light-transmissive portion, and the cover includes corner regions of the black mask layer embedded in a material of the black mask layer.
Embodiments of a cover for an image sensor may include one, all, or any combination of the following features:
the first edge of the strip closest to the perimeter may be offset back from the perimeter.
The second edge of the strip closest to the center of the light-transmissive portion may be configured to: when the light-transmitting part can be coupled on the substrate, the second edge protrudes from a set of welding pads of the substrate at a preset distance.
The width of the strip between the first edge and the second edge may be constant around the strip.
For at least two portions of the strip applied adjacent both sides of the light-transmitting portion, the width of the strip between the first edge and the second edge may be the same.
The first edge of the strip closest to the perimeter may be spaced from the perimeter only at portions of the perimeter not surrounded by a circle drawn at predetermined locations within the light-transmitting portion.
Within the circle, a first edge of the strip reaches the perimeter.
Embodiments of a method of controlling the height of an adhesive material may include: providing a light transmissive cover and an image sensor die; applying an adhesive material adjacent to a perimeter of the image sensor die; contacting the light-transmitting cover with the adhesive material and pressing the light-transmitting cover into the adhesive material to a first height; pulling the adhesive material to a desired second height above the image sensor die with the light transmissive cover; releasing the light-transmitting cover.
Method embodiments of controlling the height of the adhesive material may include one, all, or any combination of the following features:
the method may include a black mask layer applied as a stripe around the perimeter of the largest planar surface of the light transmissive cover.
The first height may be lower than the second height.
The first height may be lower than an initial height of the adhesive material above the image sensor die.
The method may include creating a uniform bond between the light transmissive cover and the adhesive material by pressing and pulling the adhesive material.
Providing the light transmissive cover and the image sensor die may further include providing a plurality of pads, bond wires, and wire bonds, and wherein applying the adhesive material may further include applying the adhesive material over the plurality of pads, bond wires, and wire bonds.
The foregoing and other aspects, features, and advantages will become apparent to one of ordinary skill in the art from the description and drawings, and the claims.
Drawings
Embodiments will hereinafter be described in conjunction with the appended drawings, wherein like numerals denote like elements, and:
FIG. 1 is a top view of an embodiment of a light transmissive cover coupled to an image sensor die and a substrate and a side view of the light transmissive cover;
FIG. 2 is a side view of an embodiment of an image sensor die coupled to a substrate;
fig. 3 is a side view of the embodiment of the image sensor die of fig. 2 coupled to a substrate after a wire bonding process;
FIG. 4 is a side view of an embodiment of the image sensor die of FIG. 3 after a light transmissive cover is coupled to the image sensor die;
FIG. 5 is a side view of the embodiment of the image sensor die of FIG. 4 after a packaging process;
FIG. 6 is a top view of an embodiment of a light transmissive cover;
FIG. 7 is a top view of an embodiment of a light transmissive cover;
FIG. 8 is a top view of an embodiment of a light transmissive cover;
FIG. 9 is a top view of an embodiment of a light transmissive cover;
FIG. 10 is a top view of an embodiment of a light transmissive cover;
FIG. 11 is a top view of an embodiment of a light transmissive cover;
FIG. 12 is a side view of an embodiment of a light transmissive cover prior to dropping onto an adhesive material;
FIG. 13 is a side view of an embodiment of the light-transmitting cover after it has been dropped onto the adhesive material;
FIG. 14 is a side view of an embodiment of a light transmissive cover after contacting an adhesive material;
FIG. 15 is a side view of the embodiment of the light transmissive cover of FIG. 14 after being pressed into the adhesive material;
fig. 16 is a side view of the embodiment of the light transmissive cover of fig. 15 after pulling the adhesive material.
Detailed Description
The present disclosure, as well as aspects and embodiments thereof, are not limited to the specific components, assembly processes, or method elements disclosed herein. Many additional components, assembly processes, and/or method elements known in the art consistent with the intended cover of the image sensor and related methods will become apparent for use with particular embodiments in light of this disclosure. Thus, for example, although specific embodiments are disclosed, such embodiments and implemented components may include any shape, size, style, type, model, version, measure, concentration, material, quantity, method elements, steps, and/or the like, as known in the art for covers for image sensors and implemented components and methods, and consistent with the intended operations and methods.
Referring to fig. 1, an embodiment of a light transmissive cover (cover for an image sensor) 2 is shown, the light transmissive cover 2 being coupled to an image sensor die 4, the image sensor die 4 being coupled to a substrate 6. The image sensor 4 comprises an array of pixels 8, the array of pixels 8 being visible through the material of the light-transmitting cover 2. In the side view of fig. 2, the light-transmitting cover 2 is shown with a black mask layer (black mask) 10, the black mask layer 10 being coupled to the largest planar surface 12 of the light-transmitting cover 2. While in the embodiment shown in fig. 1, the black mask 10 is attached to the largest planar surface 12 facing the pixel array 8, in other embodiments, the black mask 10 may also be attached to the largest planar surface 14 facing away from the pixel array 8.
In the view of fig. 1, a plurality of pads 15 are visible through the light-transmitting cover 2. These pads 15 have wire bonds formed by bond wires (not shown in fig. 1) that enable electrical signals to be transmitted from the image sensor die 4 to the substrate 6. As shown in fig. 1, the pixel array 8 is not centered within the perimeter 16 of the light-transmissive cover 2 of the image sensor die 4 of fig. 1. The material of the embodiments of the light-transmissive cover disclosed herein may comprise any of a variety of materials, including, for example, but not limited to, glass, plastic, polymer, calcite, quartz, or any other material capable of transmitting electromagnetic radiation of a particular wavelength that the pixel array is designed to receive. The various image sensor packages disclosed herein may be used to detect electromagnetic radiation of any of a variety of wavelengths, including, for example, but not limited to, infrared wavelengths, visible wavelengths, ultraviolet wavelengths, x-ray wavelengths, or any other wavelength.
The various light transmissive cover embodiments disclosed herein can be used in various image sensor package designs and methods of manufacturing such image sensor packages. Referring to fig. 2, an embodiment of an image sensor die (image sensor) 18 bonded to a substrate 20 is shown. Fig. 3 shows image sensor 18 after a wire bonding process in which bond wires 22 are bonded to bond pads 24 on image sensor 18 to connect wire bonds 26 with bond pads 28 on substrate 20. After wire bonding, an adhesive material 30 is applied over the wire bonds 26 and pads 28 on the image sensor 18, and then a light transmissive cover 32 is coupled to the adhesive material 30, forming a package as shown in fig. 4. Various curing processes may be employed in various method embodiments to facilitate the formation of bonds between the adhesive material 30 and the light transmissive cover 32, including, but not limited to, exposure to electromagnetic radiation, exposure to ultraviolet light, heating (thermal curing), exposure to electromagnetic radiation and heating, or any combination thereof, for example. The particular process used depends on the type of material of the adhesive material, which may be, for example, but not limited to, epoxy, resin, glass-attachment epoxy, or any other type of adhesive that is capable of bonding the light transmissive cover material to the image sensor die.
This particular image sensor design shown in fig. 4 is referred to as a wire-in-dam package (wire-in-dam package). However, other image sensor package designs may be employed in various embodiments, including those that bond the light transmissive cover to the die on either side of the bond pad or directly to the substrate itself. Furthermore, while the image sensor packages shown in fig. 2-5 include air gaps, the various system and method embodiments disclosed herein may employ gapped and gapless image sensor package designs.
Referring to fig. 5, the image sensor die 18 is shown after the encapsulant/molding compound 33 is applied over the substrate 20 around the image sensor die 18, the bond wires 22, the light transmissive cover 32. At this point, the image sensor package is ready for final processing steps prior to coupling with a circuit board or other motherboard.
Various embodiments of a black mask are disclosed in the present application. While specific embodiments have been shown in the drawings, it must be understood that these are merely illustrative of the principles disclosed herein and that various combinations of these principles may be employed in various embodiments. One of the challenges presented by the use of a black mask is that the black mask material can interfere with any electromagnetic curing process used to fully or partially cure the adhesive material because the black mask material at least partially shields the adhesive material. Referring to fig. 6, an embodiment of a light transmissive cover 34 coupled to an image sensor 36, the image sensor 36 having been bonded to a substrate 38 is shown. In this embodiment, a black mask 40 is shown, the black mask 40 being visible through the material of the light-transmitting cover 34, the black mask 40 extending beyond/having the same extension as the perimeter 42 of the light-transmitting cover 34. In this embodiment, the black mask 40 will completely block the adhesive material (not shown in fig. 6) applied over the plurality of pads 44. Because the adhesive material is completely shielded from electromagnetic radiation that irradiates the adhesive material in the up-down direction (direction into the page of fig. 6), the ability to achieve the desired initial cure of the adhesive material by electromagnetic radiation may be difficult or impossible to achieve. In addition, the incomplete curing of the adhesive material using electromagnetic radiation may result in the adhesive material not being completely cured even after the thermal curing step is performed, which may lead to corrosion of the pad/wire bond due to migration of ionic contaminants (e.g., chlorine) in the incompletely cured adhesive material during operation of the image sensor.
In the embodiment shown in fig. 6, the edge 48 of the black mask 40 closest to the pixel array 47 reaches almost the edge 50 of the pixel array 47 (protruding from the image sensor 46), except for a short separation distance. Such protrusion of the black mask 40 enables any scattered light to be blocked as much as possible to help reduce/eliminate glare and other defects in the image obtained by the pixel array.
Referring to fig. 7, another embodiment of a light transmissive cover 52 is shown, the light transmissive cover 52 coupled to an image sensor 54 bonded to a substrate 56. Here, the black mask 58 is shown through the material of the light-transmitting cover 52. The black mask 58 takes the form of a strip of material that is coupled around the perimeter 60 of the light-transmitting cover 52/applied around the perimeter 60 of the light-transmitting cover 52/adjacent to the perimeter 60 of the light-transmitting cover 52. Here, the shape of the stripe of the black mask 58 forms a rectangle. As shown, an edge 61 of the black mask 58 closest to the perimeter 60 of the light transmissive cover 52 (first edge) is spaced a predetermined distance 62 from the perimeter 60. In other words, the material/edge 61 of the black mask 58 is offset back from the perimeter 60 by a predetermined distance 62.
In fig. 7, the edge 64 (second edge) of the black mask 58 closest to the center of the light-transmitting cover (portion) 52 is positioned to protrude from the image sensor 54, but the width 66 of the stripe is kept the same on all four sides of the black mask 58 at a fixed width. The constant protrusion results in a different distance between edge 64 and edge 68 of pixel array 71 compared to edge 68 of pixel array 71 because pixel array 71 is not centered within the perimeter of light transmissive cover 52.
The effect of the offset back by the predetermined distance 62 is that the adhesive material is not completely obscured by the black mask 58 in this area. Furthermore, because the electromagnetic radiation source used in the electromagnetic radiation curing step is typically a diffuse light source, the predetermined distance 62 results in a wider actual area being irradiated into the adhesive material, which is exactly the actual width of the predetermined distance 62. This has the effect of increasing the overall cured volume of the adhesive material. The wider the predetermined distance, the less masking of the adhesive material. A tradeoff for the wider predetermined distance is that there is a higher probability of reflecting/scattering light from the surface of the pad/wire bond that is also exposed to ambient light during operation of the image sensor package.
In various light transmissive cover embodiments, the protrusion of the black mask may vary. Referring to fig. 8, another embodiment of a light transmissive cover 70 is shown, the light transmissive cover 70 being coupled to an image sensor 72 bonded to a substrate 74. Here, the black mask 76 includes an edge 78, which edge 78 is offset back from the perimeter 80 of the light-transmissive cover 70 by a predetermined distance that is uniform around the perimeter 80. However, in the embodiment shown in fig. 8, the position of the protrusion or edge 82 of the black mask 76 changes, resulting in a strip that is wider on the sides 84, 86 than on the sides 88, 90 of the light-transmissive cover 70. By observation, the width of the strips of black mask 76 is the same for sides 88, 90, but not for sides 84, 86. In this embodiment, the ability to increase the protrusion to a desired amount may help reduce scattered light that affects the pixel array 92 and causes glare.
Referring to fig. 9, another embodiment of a light transmissive cover 94 is shown, the light transmissive cover 94 coupled to an image sensor 96 bonded to a substrate 98. In fig. 9 a circle 100 is shown, which circle 100 does not actually appear on the light-transmitting cover 94 itself, but is used as a reference to show how the pattern of the black mask 102 is arranged on the light-transmitting cover 94. By observation, the portion of the black mask 102 that is located within the circle 100 has an edge that reaches the perimeter 104 of the light-transmitting cover 94. The portion of the black mask 102 that is outside the circle has a back offset portion that places the edge 106 of the black mask 102 a predetermined distance from the perimeter 104. The predetermined distance in this embodiment is constant outside the circle, but in other embodiments the predetermined distance may vary. While in this embodiment the area within the circle has a black mask reaching the perimeter, while the area outside the circle includes a back offset portion, in other embodiments the opposite may be employed.
In the embodiment of fig. 9, the protrusion formed by edge 108 creates a constant width/distance between edge 108 and edge 110 of pixel array 112. While this is shown in fig. 9, in various other light transmissive cover embodiments, the protrusions may be provided with a constant width of the strip of black mask 102, or with a varying width that does not result in a constant distance between edge 108 and edge 110, as shown in fig. 7 and 8.
Referring to fig. 10, another embodiment of a light transmissive cover 114 is shown, the light transmissive cover 114 coupled to an image sensor 116 bonded to a substrate 118. The circles in this figure are for reference, similar to the circles of fig. 9. In this embodiment, the edges of the black mask 120 reach the perimeter 122 of the substrate 118 and only the corner regions 124, 126, 128, 130 are embedded into the material of the black mask 120, such that the bond pads 131 under these regions are exposed. In this embodiment, the particular size and shape of these corner regions is determined by the desired electromagnetic radiation cure on the exposed pads (and immediately adjacent pads). In this way, by ensuring that it is not blocked by the black mask 120, the negative effects of corrosion on the high voltage pads, for example, located in one of the corner regions, can be reduced/eliminated.
The use of corner regions as shown in fig. 10 may be combined with other embodiments disclosed herein. For example, as shown in fig. 11, an embodiment of a light transmissive cover 132 is shown, the light transmissive cover 132 having a black mask 134, the black mask 134 being offset back to place the edge 136 a constant distance from the perimeter 138 around the entire perimeter 138 at locations other than corner regions 140, 142, 144, 146, the corner regions 140, 142, 144, 146 being embedded in the material of the black mask 134 at predetermined distances and dimensions. In this embodiment, the protrusion of edge 148 of black mask 134 is configured to create a constant distance between edge 148 and edge 150 of pixel array 152. However, in other embodiments, any of the protrusions disclosed herein may be used. Various embodiments of black masks and light transmissive covers incorporating the various principles disclosed herein may be constructed using the principles disclosed herein. The circle in fig. 11 is for reference, similar to the circle of fig. 9.
Referring to fig. 12, an embodiment of an image sensor 154 is shown in which an adhesive material 156 is applied to the image sensor 154 around its perimeter. A light transmissive cover 157 is positioned over the image sensor 154, with the rubber tip 158 of the collet 160 being used to hold the light transmissive cover 157 in place. When the light transmissive cover 157 is positioned over the image sensor 154 at the desired locations on the X and Y coordinates, the vacuum on the rubber tip 158 is released, causing the light transmissive cover 157 to drop through air under the force of gravity until the light transmissive cover 157 contacts the adhesive material 156 (free air drop). Fig. 13 shows the final position of the light-transmitting cover 157 and the position of the adhesive material 156, with the adhesive material 156 being observed to spread out under the weight/impact of the light-transmitting cover 157, resulting in the height of the adhesive material 156 falling from H0 to H1 as shown in fig. 13. One of the challenges presented by the free air drop process is that when the light transmitting cover 157 contacts the bonding material 156 in a free-falling manner, voids are formed in the bonding material 156 that remain once the light transmitting cover reaches a resting position. These voids can result in delamination of the light transmissive cover and/or reduce shear forces separating the adhesive material from the light transmissive cover material. For the free air drop process, problems of intrusion of liquid encapsulation seals (liquid encapsulation sealing, LES), compound holes, glass (lid) tilting and delamination after reliability testing or surface mounting processes of the image sensor package have been noted.
Referring to fig. 14, an embodiment of the light transmissive cover 162 is shown after being placed in direct contact with the adhesive material 164 coupled to the image sensor die 166 by the rubber tip 168 of the collet 170. As shown, at this point in the process, the height of the bonding material 164 is H0. Fig. 15 shows the light-transmitting cover 162 after the light-transmitting cover 162 is pressed onto the adhesive material 164 by the rubber tip 168, which results in the height of the adhesive material 164 being reduced to H1. Here, H1 is lower than H0. Referring to fig. 16, the light transmissive cover 162 is shown after the adhesive material 164 coupled to the light transmissive cover 162 is pulled to a height H2 by retracting the rubber tip 168 (while the vacuum is still on). Here, H2 is higher than H0 and H1. Since the final height of the adhesive material 164 can be set by pulling the adhesive material 164 to a desired height after the initial pressing step, several benefits can be observed. These benefits may include precise height control of the final height of the adhesive material above the surface of the image sensor die 166, uniform bonding between the adhesive material and the material of the light transmissive cover 162, better shear forces, avoidance of composite holes, avoidance of delamination, reduction of LES intrusion, and/or reduction of voids in the adhesive. In a particular embodiment, the height H0 is 400 microns, H1 is 310 microns, and H2 is 360 microns.
Various method embodiments may include: providing a light transmissive cover and an image sensor die, applying an adhesive material adjacent a perimeter of the image sensor die, and contacting the light transmissive cover to the adhesive material and pressing the light transmissive cover into the adhesive material to a first height. The method may further include pulling the adhesive material to a desired second height above the image sensor die with the light transmissive cover, and releasing the light transmissive cover from the rubber tip. The method embodiments disclosed herein for coupling light transmissive covers may be used with any of the types of light transmissive covers disclosed herein and any of the types of image sensor packages disclosed herein. This includes a wire-dam package in which an adhesive material is applied over the wire bonds, pads, and bond wires, as disclosed herein.
In various cap embodiments, the cap includes corner regions of the black mask layer that are embedded in the material of the black mask layer beyond a predetermined distance.
In various cap embodiments, the width of the strip of black mask layer between the first edge and the second edge is constant around the strip.
In various cover embodiments, a second edge of the strip closest to the center of the light-transmissive portion is configured to: when the light-transmitting part is coupled to the substrate, the second edge protrudes from a set of bonding pads of the substrate by a predetermined distance.
In various cover embodiments, the width of the strip between the first edge and the second edge is the same for at least two portions of the strip applied adjacent both sides of the light-transmissive portion.
In various method embodiments, a black mask layer applied as a stripe around the perimeter of the largest planar surface of the light transmissive cover may be used.
In various method embodiments, the method creates a uniform bond between the light transmissive cover and the adhesive material by pressing and pulling the adhesive material.
In various method embodiments, providing the light transmissive cover and the image sensor die further includes providing a plurality of pads, bond wires, and wire bonds, and applying the adhesive material further includes applying the adhesive material over the plurality of pads, bond wires, and wire bonds.
In the above description of specific embodiments involving light transmissive covers and implemented assemblies, sub-assemblies, methods and sub-methods, it should be readily apparent that many modifications are possible without departing from the spirit of the application, and that these embodiments, implemented assemblies, sub-assemblies, methods and sub-methods may be applied to other light transmissive covers.
Claims (10)
1. A cover for an image sensor, comprising:
a light transmitting portion; and
a black mask layer applied as a stripe adjacent to a perimeter of a largest planar surface of the light-transmitting portion;
wherein a first edge of the strip closest to the perimeter is spaced a predetermined distance from the perimeter.
2. The cover of claim 1, wherein a second edge of the strap closest to a center of the light-transmissive portion is configured to: when the light-transmitting part is connected to the substrate, the second edge protrudes from a set of welding pads of the substrate at a preset distance.
3. The cover of claim 1, wherein the width of the strip between the first and second edges is the same for at least two portions of the strip applied adjacent both sides of the light-transmissive portion.
4. The cover of claim 1, wherein a first edge of the strip closest to the perimeter is spaced from the perimeter only at a portion of the perimeter not surrounded by a circle drawn at a predetermined location within the light-transmissive portion, and wherein within the circle the first edge of the strip reaches the perimeter.
5. A cover for an image sensor, comprising:
a light transmitting portion; and
a black mask layer applied as a strip around the perimeter of the largest planar surface of the light transmitting portion, and the cover comprising corner regions of the black mask layer embedded in the material of the black mask layer.
6. The cover of claim 5, wherein a first edge of the strap closest to the perimeter is offset back from the perimeter.
7. The cover of claim 5, wherein a first edge of the strip closest to the perimeter is spaced from the perimeter only at a portion of the perimeter not surrounded by a circle drawn at a predetermined location within the light-transmissive portion, and wherein within the circle the first edge of the strip reaches the perimeter.
8. A method of controlling the height of an adhesive material, the method comprising:
providing a light transmissive cover and an image sensor die;
applying an adhesive material adjacent to a perimeter of the image sensor die;
contacting the light-transmitting cover with the adhesive material and pressing the light-transmitting cover into the adhesive material to a first height;
pulling the adhesive material to a desired second height above the image sensor die with the light transmissive cover; and
releasing the light-transmitting cover.
9. The method of claim 8, wherein the first height is lower than the second height.
10. The method of claim 8, wherein the first height is lower than an initial height of the adhesive material above the image sensor die.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US63/378,457 | 2022-10-05 | ||
| US18/473,659 US20240120355A1 (en) | 2022-10-05 | 2023-09-25 | Black mask on glass systems and related methods |
| US18/473,659 | 2023-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117855235A true CN117855235A (en) | 2024-04-09 |
Family
ID=90535261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311295178.9A Pending CN117855235A (en) | 2022-10-05 | 2023-10-08 | Cover for image sensor and method of controlling height of adhesive material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117855235A (en) |
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2023
- 2023-10-08 CN CN202311295178.9A patent/CN117855235A/en active Pending
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