CN117854831A - TSTC conductor with high current carrying capacity and cable comprising same - Google Patents

Abstract

The application relates to the technical field of superconducting electrician, and specifically provides a TSTC conductor with high current carrying capacity and a cable containing the conductor, wherein the TSTC conductor comprises: a conductor backbone having a cooling medium channel therein; and at least one groove group arranged on the conductor framework; wherein at least one of the at least one groove set comprises a plurality of grooves capable of receiving a multi-layer superconducting tape. With such a configuration, the current carrying capacity of the TSTC conductor can be improved by the combination of the plurality of grooves. Based on this, it is expected to be realized with the new TSTC conductors provided herein in situations where multiple TSTC conductors need to be combined to increase the current carrying capability of high temperature superconducting conductors.

Description

TSTC conductor with high current carrying capacity and cable comprising same

Technical Field

The application belongs to the technical field of superconducting electrician, and particularly relates to a TSTC conductor with high current carrying capacity and a cable comprising the conductor.

Background

With the development of superconducting material technology, a high-current-carrying superconducting conductor based on a second-generation high-temperature superconducting tape gradually becomes a main form in the field of superconducting cables. In particular, compared with the first generation of high-temperature superconducting tapes using noble metal Ag, REBCO (Rare Eearth Barium Copper Oxide, rare earth barium copper oxide) coated conductors of the second generation of high-temperature superconducting tapes have higher critical temperature, critical current density and critical magnetic field, so that the high-temperature superconducting tapes can be applied to higher temperature and magnetic field environments, and the second generation of high-temperature superconducting tapes have the advantage of lower cost, thus playing an important role in improving a power system and becoming one of research hot spots related to superconducting materials in the international range.

At present, a high-temperature superconducting conductor of a high-temperature superconducting Cable based on a high-temperature superconducting material mainly comprises a CORC conductor, a RACC conductor and a TSTC (Twisted Stacked-Tapes Cable) conductor, wherein transposition among high-temperature superconducting strips in the RACC conductor is realized by a method of mutually alternating positive and negative trapezoids, so that the quantity of the required high-temperature superconducting strips is large under the same current carrying capacity, and in addition, the RACC conductor also has the defects of complex manufacturing process and high cost. The main structure of the CORC conductor comprises a central framework, a high-temperature superconducting tape wound on the central framework in a spiral mode and a high-temperature and low-temperature resistant insulating tape wrapping the wound superconducting tape. Because RACC conductors are continuously wound on metal cores, they require more high temperature superconducting tape (as compared to TSTC conductors) for equivalent current carrying capability, although the winding is simple. The structural form of the TSTC conductor is approximately as follows: the high temperature superconducting tapes are stacked in parallel and then embedded in a metal core conductor having spiral grooves. The TSTC conductor has the advantages of good mechanical property, current density, bending property and the like, wherein the current density is taken as an example, the contact resistance of the TSTC conductor is less than 10nΩ under the condition of liquid nitrogen temperature, and the critical current can reach 1.5kA (can reach 10kA under the condition of liquid helium temperature). Compared with CORC conductors and RACC conductors, TSTC conductors have the advantages of less consumption of high-temperature superconducting tapes, reduced anisotropism and relatively simple manufacturing process, and are widely applied to the scenes such as superconducting power equipment, large-scale high-field superconducting magnets and the like.

However, because the high-temperature superconductive tape itself has limited current carrying capacity, the combination of twisting and transposition of multiple high-temperature superconductive tapes in parallel is particularly important or quite necessary, for example, when a high-temperature superconductive conductor with larger current carrying capacity is needed, a single-strand TSTC conductor can be twisted in parallel to form a combination body containing multiple strands of TSTC conductors, so that the current carrying capacity of the high-temperature superconductive conductor is improved. In order to improve the current carrying capacity, the current TSTC conductor is generally required to be capable of placing more high-temperature superconductive tapes by increasing the groove depth, but because the electromagnetic force after passing current is large, the distance between the bottoms of the adjacent grooves cannot be too close, otherwise, the problems of deformation, damage and the like are easy to occur, and the outer diameter of the conductor cannot be infinitely increased in an objective level. This has led to limitations in the current ways of improving current carrying capacity. Accordingly, the stacking mode of the TSTC conductors and the structural form of the formed high-temperature superconductive conductors need to be considered.

Accordingly, there is a need in the art for a new solution to the above-mentioned problems.

Disclosure of Invention

The present application has been made in order to solve at least a part of the above-mentioned technical problems. In particular, where multiple TSTC conductors need to be combined to increase the current carrying capability of a high temperature superconducting conductor, the present application provides a new TSTC conductor to increase the current carrying capability of a high temperature superconducting conductor.

In a first aspect, the present application provides a TSTC conductor having high current carrying capability, the conductor comprising: a conductor backbone having a cooling medium channel therein; and at least one groove group arranged on the conductor framework; wherein at least one of the at least one groove set comprises a plurality of grooves capable of receiving a multi-layer superconducting tape.

With such a configuration, the current carrying capacity of the TSTC conductor can be improved by the combination of the plurality of grooves.

For the TSTC conductors with high current carrying capacity described above, in one possible embodiment, the conductor skeleton has a placement space formed thereon, the conductor including a separator dividing the placement space into a plurality of grooves.

By such a construction, a possible formation of a plurality of grooves is given.

For the TSTC conductors with high current carrying capacity described above, in one possible embodiment, the conductor includes a pedestal with which the groove encloses a rest position capable of receiving a superconducting tape.

With this configuration, a relatively closed placement position can be formed by the engagement of the spacer and the separator.

For the TSTC conductors with high current carrying capacity described above, in one possible embodiment, the conductor includes a sleeve that is located outside of the conductor backbone, with the spacer being located between the conductor backbone and the sleeve.

By means of this construction, possible designs of the TSTC conductor are provided.

For the TSTC conductors with high current carrying capability described above, in one possible embodiment, the separator and/or at least a portion of the spacer is made of a conductive material; and/or the pad frame is fixedly connected with the sleeve and the partition plate respectively.

Since the anisotropy and the width of the superconducting tape cannot be set arbitrarily in general, the separator may be made of a highly conductive metal such as copper. The shelves may be made of copper or other metal to increase fault diversion capability, or superconducting material (e.g., superconducting tape) to increase through-flow capability. By cooperation of the spacer and the pad, the stability of the TSTC conductor can be ensured.

Furthermore, it will be appreciated that the specific manner of securement of the spacer to the sleeve/spacer may be determined by one skilled in the art based on actual requirements.

For the TSTC conductors with high current carrying capacity described above, in one possible embodiment, the separator, the spacer and/or the sleeve are fixedly connected by means of vacuum brazing; and/or the spacer is of a generally planar configuration; and/or the pad frame comprises at least one layer of superconducting tapes stacked along the radial direction of the conductor skeleton or the pad frame is at least one layer of superconducting tapes stacked along the radial direction of the conductor skeleton; and/or the thickness of the separator is a certain value between 0.2 and 0.5 mm.

The planar structure can simplify the production process of the TSTC conductor, and the pad frame comprises a pad frame main body with a planar structure and at least one layer of superconducting tape arranged at the tops of the pad frame main body and the groove group, for example, the outermost side of the at least one layer of superconducting tape and the pad frame main body which are stacked are fixedly connected in a vacuum brazing mode. The thickness of the spacer is such that it occupies as little space as possible within the TSTC conductors while ensuring that the spacer is sufficient to act as a shunt.

For the TSTC conductors with high current carrying capability described above, in one possible embodiment, the size difference and/or relative position misalignment between at least a portion of the plurality of grooves of the groove set, as viewed in a radial direction of the conductor backbone.

With this configuration, the stability of the TSTC conductor can be ensured. Taking the case of a groove group comprising two grooves, for example, the cross section of the two grooves is a set of opposite sides (the same size and the non-aligned positions) of a parallelogram along the radial center line of the conductor skeleton.

For the TSTC conductors with high current carrying capacity described above, in one possible embodiment, the grooves are rectangular in cross section taken along the radial direction of the conductor backbone, with the long sides of the rectangle corresponding to the grooves of the groove group being parallel to each other.

By such a constitution, a possible structural form of the grooves and a relative positional relationship between the plurality of grooves are given.

For the TSTC conductors having high current carrying capacity described above, in one possible embodiment, the ends of the rectangles corresponding to the plurality of grooves of the groove group that are located radially outward are aligned with each other, with a difference between the ends of the rectangles corresponding to the plurality of grooves of the groove group that are located radially inward.

With such a configuration, the stability of the TSTC conductor can be improved.

In a second aspect, the present application provides a cable comprising a TSTC conductor of any preceding claim having a high current carrying capacity.

It will be appreciated that the cable has all of the technical effects of the TSTC conductors with high current carrying capacity described in any of the preceding claims and will not be described in detail herein.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 shows a schematic structural diagram of a conductor backbone of a TSTC conductor with high current carrying capability (excluding bushings and superconducting tapes) according to one embodiment of the present application;

fig. 2 is a schematic view showing a partial structure of a conductor skeleton (excluding a bushing and a superconducting tape) of a TSTC conductor having high current carrying capability according to an embodiment of the present application, mainly showing a placement space corresponding to a groove group;

FIG. 3 is a schematic structural diagram of a cross-section of a TSTC conductor with high current carrying capability showing a conductor backbone, superconducting tape and bushing according to one embodiment of the present application; and

fig. 4 is an enlarged schematic view of a portion a of fig. 3, mainly illustrating the manner in which the superconducting tapes are disposed within the groove group.

In the accompanying drawings:

100. TSTC conductors with high current carrying capability;

1. a conductor backbone;

2. a groove group;

21. a first groove; 22. a second groove; 23. a partition plate; 24. a pad frame;

3. a cooling medium passage;

4. a placement space;

5. a superconducting tape;

6. a sleeve.

Detailed Description

Preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are merely for explaining the technical principles of the present application, and are not intended to limit the scope of the present application.

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of illustrating the present application and are not to be construed as limiting the present application.

As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or coupled. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Furthermore, in order to better illustrate the present application, numerous specific details are set forth in the following detailed description, which it will be understood that the present application may be practiced without some of these specific details. In some instances, the detailed structure of TSTC conductors, the principles of conduction, etc., as are well known to those skilled in the art, have not been described in detail in order to facilitate a salient point of the present application.

Referring mainly to fig. 1 to 4, in one possible embodiment, a TSTC conductor 100 having a high current carrying capacity includes a conductor frame 1, a plurality of groove groups 2 formed on the conductor frame 1, and a cooling medium passage 3 provided at a substantially middle position of the conductor frame in an axial direction of the conductor frame. The conductor skeleton 1 is formed by processing a metal core material, the cross section of the conductor skeleton is usually circular, the groove group 2 is a spiral groove group wound on the outer side of the conductor skeleton, and the spiral groove group is mainly used for placing a placement space 4 of a superconducting tape 5 (for example, the superconducting tape material can be yttrium barium copper oxide, bismuth strontium calcium copper oxide, an iron-based superconductor, and the like). By injecting cooling working media such as liquid nitrogen, liquid helium and the like into the cooling medium channel 3, the superconducting strips accommodated in the spiral groove group are ensured to be always in a superconducting state, and thus TSTC guide is ensured

Reliability of the body. Wherein the groove set 2 comprises a plurality of grooves, any one of which is capable of placing a superconducting tape. The shape, number, positional relationship between the grooves and the conductor skeleton, positional relationship between the different grooves, and the like of the grooves included in the different groove groups may be the same or different.

As in the present example, the groove groups 2 include four distributed along the circumferential direction of the conductor bobbin 1, and the four groove groups 2 are substantially identical and uniformly distributed along the circumferential direction of the conductor bobbin. Obviously, the structural form of the groove groups, the number of the groove groups, the relative positions among the groove groups and the like can be determined according to actual demands by a person skilled in the art, for example, the groove groups can comprise three, five and the like, the structures of the groove groups can be the same or different, and the relative positions of the groove groups along the circumferential direction of the conductor framework can be flexibly adjusted according to the actual demands.

In one possible embodiment, the groove group 2 includes a first groove 21 and a second groove 22, a spacer 23 is provided between sides of the first groove 21 and the second groove that are close to each other in the circumferential direction of the conductor frame 1, the spacer 23 is provided to the conductor frame along the radially inner side of the conductor frame 1, and the spacer 23 is provided with a spacer 24 along the radially outer side of the conductor frame 1. As in the present example, the shelves are generally planar plate-like structures, such as shelves and spacers, which allow for some amount of play, which may facilitate placement of the superconducting tape and allow for some tolerance. The material of the separator 23 is typically copper or another conductive material (conductor) having low resistance and high hardness properties, so that in the event of a fault current, the current can be shunted through the separator. Such as: in the event of a short circuit fault, the TSTC conductor is quenched and the resistance rises sharply, while the resistivity of copper (for example, the material of the separator is copper) is relatively small, so that a large portion of the short circuit current can be carried, and thus the function of protecting the superconducting tape can be achieved. The pad rack is mainly used for supporting the partition board to ensure the reliability of the partition board. Based on this, the current carrying capacity of the TSTC conductor is improved by simultaneously positioning multiple layers of superconducting tape within each groove of the groove set. Specifically, the pad frame is arranged at the radial outer side of the groove group and is connected with the partition plate, so that the stability of the placement of the superconducting tape can be ensured when the superconducting tape is twisted in the corresponding groove, and the dislocation prevention function can be realized.

In this example, the long and short grooves in each groove set are uniform in height above, and in combination with the process of the TSTC conductor (after the superconductive tape is placed, a sleeve 6 is added on the outer side of the TSTC conductor, and the sleeve is mainly used for protecting the superconductive tape). After the process of stacking the superconducting tapes in the long and short grooves is completed, the superconducting tapes near the top in the two grooves can still have the problems of dislocation and the like under the action of electromagnetic force, and in this regard, the problems such as dislocation and the like can be effectively prevented by adding the spacer at the top position between the two grooves. Taking copper (the spacer body) as an example of the material of the spacer, in addition, several layers (e.g., two layers) of superconducting tapes may be simultaneously disposed between the spacer body and the top of the first/second grooves, so that the spacer body plays a supporting role on the mechanical level and thus plays a stabilizing and dislocation preventing role on the superconducting tapes disposed in the first/second grooves while improving the current carrying capability of the TSTC conductor. As in the present example, the spacer is formed by stacking two superconducting tapes.

In this example, the first groove 21 and the second groove 22 are each substantially rectangular in cross section, the length of the rectangle corresponding to the first groove 21 is longer than the length of the rectangle corresponding to the second groove 22, as in this example, the rectangle corresponding to the first groove 21 and the rectangle corresponding to the second groove 22 are arranged in parallel along the long sides, the separator 23 is located between both sides and is substantially equal in length to the long side of the rectangle of the first groove 21, the rectangle corresponding to the first groove 21 is aligned with one end of the rectangle corresponding to the second groove 22 along the long side and the other end is in a staggered distribution, as in the alignment at the end on the outer side in the radial direction of the conductor frame 1, the length is different at the end on the inner side in the radial direction of the conductor frame 1. In other words, the design of the trapezoidal groove obviously enables as much superconducting tape as possible on the conductor former. Meanwhile, a certain distance is kept between the bottoms of the adjacent first grooves and the adjacent second grooves, which are related to the partition board, so that the probability of being damaged is greatly reduced under the action of strong electromagnetic force and mechanical force on the conductor framework.

Taking the rectangular grooves with differences between two long sides as an example, the plurality of groove groups in the example are approximately the same, and under the condition that the superconducting tape is twisted along the groove direction of the rectangle with shorter field side due to the differentiated design of the long sides, the long grooves with longer long sides can play a supporting role, and compared with the design of the rectangle with equal length, the stability of the TSTC conductor is improved.

It is obvious that the person skilled in the art can flexibly adjust the number of groove groups, the number of grooves contained in each groove group, the structure of each groove, the relative positions of different grooves, the form/degree of formation of the differential design between the grooves, etc. according to actual needs, and the groove groups include three grooves (A, B and C respectively) as may include, but are not limited to: ABC is distributed along the circumferential direction of the conductor framework, A and B are not designed differently, and C and A/B are designed differently; c is positioned between A and B along the circumferential direction of the conductor framework, A and B are not designed differently, and C and A/B are designed differently; A. b, C comprise components of a differential design with respect to each other.

In a specific example, the cross-sections of the two grooves in each groove set, i.e. the first groove and the second groove, are all substantially rectangular, wherein the rectangle of the cross-section of the first groove 21 is 8.18mm long and 4mm wide; the rectangular shape of the cross section of the second groove 22 was 5.99mm long and 4mm wide. The installation mode of the superconducting tape can be as follows: the superconducting strips corresponding to the long grooves (the first grooves) are directly embedded into the long grooves after being welded with the partition plates, and the superconducting strips corresponding to the short grooves (the second grooves) are directly placed.

In this example, the thickness of the spacer 23 is 0.2-0.5mm (e.g., 0.3 mm), for example, on the one hand, the spacer is too thin, and the electromagnetic force exerted by the through-flow of the superconducting tape may cause the spacer to perform a stabilizing function, and on the other hand, the spacer is too thick, and the groove pitch of the groove is significantly reduced, thereby affecting the reliability of the installation in the groove of the superconducting tape. Therefore, the thickness of the spacer should be such that it is sufficient to act as a shunt, taking up as little space as possible within the TSTC conductor. Such as separator materials including but not limited to copper, aluminum, and other conductive materials having low resistance, high hardness properties.

The cross-section of a TSTC conductor, such as a superconducting tape, based on the above example is sized to be 4mm wide and 100 μm thick. In this way, 80 superconducting tapes can be placed in the long groove (i.e. the first groove), and 59 superconducting tapes can be placed in the short groove (i.e. the second groove). Two (or more) superconducting tapes may be placed over (radially outside) each groove group to form a spacer (or superconducting tapes may be placed between the spacer body and the tops of the grooves, including a separate spacer body). If the number of superconducting tapes is not necessarily two but should not be too large, if the inner diameter of the sleeve should not be exceeded, the process of combining the TSTC conductors is known that the superconducting tapes are arranged between the upper part of the long and short grooves and the sleeve in a brazing manner. The superconducting tapes arranged above the groove group can be effectively prevented from being misplaced, however, the number of the superconducting tapes arranged in a stacked manner is not excessive, and if the number of the superconducting tapes is excessive, the problem that the current carrying capacity is influenced by factors such as bending characteristics can occur. In this way, 141 superconductive tapes can be placed in total in each groove group of the TSTC conductor based on the above example, for example, assuming that the critical current of each superconductive tape is 120A, so that the critical current of the superconductive tapes in each groove group can be up to 16.92kA, and the critical current of the whole TSTC conductor can be up to 67.68kA.

In addition, it is to be noted that:

in this embodiment, the differential design of the groove is actually given in combination with engineering, and is specifically expressed as follows:

(1) The specifications of the superconducting tape produced by a manufacturer (Shanghai superconducting) for producing the high-temperature superconducting tape mainly comprise three specifications of 3mm, 4mm and 10mm in width. If other dimensions are required, this can theoretically be achieved but the production line needs to be re-established, the costs will increase considerably accordingly; if other sizes of superconducting tapes are realized by cutting, the performance of the produced superconducting tapes is significantly degraded. In addition, the amount of the superconducting tape applied to the high current carrying scene is huge, and the assembly and replacement operation of the superconducting tape with the same specification are relatively simple and can be realized. Thus, a differentiation of the individual grooves in the groove group (such as the width differentiation described above or the differentiation in the length direction or groove length direction) is of course theoretically possible, namely:

it will be appreciated that the specific presentation of the differentiation can be flexibly designed if desired. However, in this example, it is described in connection with a situation that is more consistent with the actual facing scenario, namely: an application example of the present application will be described in conjunction with an example of "selecting a superconducting tape of one specification from existing selectable widths, and fitting the superconducting tape of the same specification in both the first grooves and the second grooves of all groove groups".

(2) Theoretically, more grooves could be included in each groove set, however, more grooves would indicate a wider groove set top and correspondingly a larger space between the groove set top and the sleeve, and the depth of the grooves in the groove set and the distance between adjacent grooves would be significantly limited because this space would be wasted. Unless the ratio between the outer diameter of the conductor former and the width of the superconducting tape is very large, the design of more grooves may not increase the containment volume contained in the superconducting tape. And bending of the conductor backbone is quite difficult, so that the probability of using multiple (e.g., more than three) grooves in engineering practice is low.

(3) The relative position between the two grooves in each groove set may be other than parallel, such as angular, staggered in the longitudinal direction, but such an arrangement obviously adds significant process difficulty. Therefore, in theory, the relative position between the grooves can be flexibly set according to the actual requirement, and in the case of other relative positions which need to be overcome to be realized although the difficulty is increased, the relative position between the two grooves can be adjusted according to the actual requirement.

(4) In this embodiment, the combination of the spacer and the spacer forms two L-shaped support structures (one of the L-shaped support structures is used to form a first positioning position corresponding to the first groove with the spacer and the space on the conductor frame, and the other L-shaped support structure is used to form a second positioning position corresponding to the second groove with the spacer and the conductor frame). Therefore, the structure of the groove group may be realized by integrally forming the separator and the conductor frame in addition to the brazing, but the separator is thin and the first groove and the second groove are formed as spiral grooves, so that the difficulty in integrally forming the separator is very high, and the separator is obviously increased in cost, and is easily damaged in the process of carrying, so that the conductor frame, the separator and the pad frame are designed independently and then are fixedly connected. Similarly, after the superconducting tape is arranged in the groove group, a planar pad frame is directly welded on the top surface of the superconducting tape, and the method has the obvious advantage of simpler process. That is, the pad frame of the planar structure has the advantage of simple process, however, in the case of special requirement, if the pad frame can be changed from the planar structure to a U-shaped structure (for example, two sides of the U-shaped structure are respectively clamped at the inner sides of the groove walls of the first groove and the second groove.

It should be specifically noted that the problems or difficulties presented in the other embodiments mentioned above are merely for explaining the reason why the TSTC conductor with high current carrying capability of the present application is described in connection with the present embodiment, and are not for explaining that the problems or difficulties presented in the other embodiments are therefore excluded by the TSTC conductor with high current carrying capability 100 of the present application. More specifically, it should be understood that the present embodiment describes the TSTC conductor with high current carrying capability of the present application in conjunction with a specific example in which advantages are more easily understood, and related elements may be changed according to actual requirements, and for example, a certain cost increase, an increase in process difficulty, and the like may be appropriately accepted under specific requirements.

It can be seen that in the preferred embodiment of the present application, the grooves of the metal skeleton of the TSTC conductor are designed mainly, so that the TSTC conductor has the advantages of firm and stable structure, multiple selection of placement grooves, easy processing, simple placement of the strip, high safety, and the like. In particular, through the combination of multiple grooves, the TSTC conductor is expected to obtain higher current carrying capacity and current density. On this premise, two or more rows of superconducting tapes in the same layer are easily dislocated under the conditions of mechanical force and electromagnetic force, which may cause damage to the structure of the superconducting tapes. For this, by providing the spacer between the two rows of superconducting tapes (corresponding to the first groove and the second groove) and providing the spacer at the radially outer end of the intermediate spacer, the overall structure of the groove group is ensured to be more stable for the step-shaped groove group including the two grooves having the difference in length. Specifically, when the superconducting tape is twisted along the direction of the rectangular grooves with shorter (long sides), the rectangular grooves with longer (long sides) can support the rectangular grooves, and compared with two rectangular grooves with equal length (long sides), the rectangular grooves with longer (long sides) are more firm in design with different lengths. Since the TSTC conductor includes a plurality of groove groups and each groove group may include a plurality of grooves, the groove for receiving the superconducting tape is more selected. The superconducting tapes can be placed in three first grooves, or in two first grooves and two second grooves. The cross section of each first groove/second groove in the groove group is rectangular, and each groove group surrounds the center of the TSTC conductor in a central symmetry mode, so that the processing is easy, and the stacking placement of the superconducting tapes is simpler. The TSTC conductor also has the advantage of high safety because the separator between two grooves in each groove set acts as a shunt.

Thus far, the technical solution of the present application has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present application is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present application, and such modifications and substitutions will be within the scope of the present application.

Claims (10)

1. A TSTC conductor having high current carrying capability, said conductor comprising:

a conductor backbone having a cooling medium channel therein; and

at least one groove group arranged on the conductor framework;

wherein at least one of the at least one groove set comprises a plurality of grooves capable of receiving a multi-layer superconducting tape.

2. The TSTC conductor with high current carrying capability of claim 1 wherein said conductor backbone has a seating space formed thereon, said conductor including a divider dividing said seating space into a plurality of grooves.

3. The TSTC conductor with high current carrying capability of claim 2 wherein said conductor includes shelves, said grooves and said shelves circumscribing a set point capable of receiving a superconducting tape.

4. The high current carrying capability TSTC conductor of claim 3 wherein said conductor comprises a sleeve, said sleeve being located outside of said conductor backbone, said spacer being located between said conductor backbone and said sleeve.

5. The TSTC conductor with high current carrying capability of claim 4 wherein at least a portion of said spacer and/or said pedestal is of an electrically conductive material; and/or

The pad frame is fixedly connected with the sleeve and the partition plate respectively.

6. The TSTC conductor with high current carrying capacity of claim 5 wherein said spacer, said backing frame and/or said sleeve are fixedly connected by means of vacuum brazing; and/or

The pad frame is of a generally planar structure; and/or

The pad frame comprises at least one layer of superconducting tapes which are overlapped along the radial direction of the conductor framework or the pad frame is at least one layer of superconducting tapes which are overlapped along the radial direction of the conductor framework; and/or

The thickness of the separator is a certain value between 0.2 and 0.5 mm.

7. The TSTC conductor with high current carrying capability of any of claims 1 to 6 wherein at least a portion of the plurality of grooves of said groove set are not dimensionally different and/or relatively positionally misaligned as viewed in a radial direction of said conductor backbone.

8. The TSTC conductor with high current carrying capability of claim 7 wherein said grooves are rectangular in cross section taken along a radial direction of said conductor backbone, the long sides of the rectangle corresponding to a plurality of grooves of said groove set being parallel to each other.

9. The TSTC conductor with high current carrying capacity according to claim 8 wherein ends of long sides of rectangles corresponding to a plurality of grooves of said groove group located radially outward are aligned with each other,

the rectangular long sides of the plurality of grooves corresponding to the groove group have a difference between the ends located radially inward.

10. A cable comprising the TSTC conductor with high current carrying capability of any one of claims 1 to 9.