CN117835585A - Surface treatment method of circuit board and circuit board manufactured by same - Google Patents
Surface treatment method of circuit board and circuit board manufactured by same Download PDFInfo
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- CN117835585A CN117835585A CN202410254232.3A CN202410254232A CN117835585A CN 117835585 A CN117835585 A CN 117835585A CN 202410254232 A CN202410254232 A CN 202410254232A CN 117835585 A CN117835585 A CN 117835585A
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- surface treatment
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004381 surface treatment Methods 0.000 title claims abstract description 29
- -1 imidazole compound Chemical class 0.000 claims abstract description 68
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 60
- HDTRYLNUVZCQOY-UHFFFAOYSA-N α-D-glucopyranosyl-α-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OC1C(O)C(O)C(O)C(CO)O1 HDTRYLNUVZCQOY-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229930195725 Mannitol Natural products 0.000 claims abstract description 22
- HDTRYLNUVZCQOY-WSWWMNSNSA-N Trehalose Natural products O[C@@H]1[C@@H](O)[C@@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 HDTRYLNUVZCQOY-WSWWMNSNSA-N 0.000 claims abstract description 22
- 235000010355 mannitol Nutrition 0.000 claims abstract description 22
- 239000000594 mannitol Substances 0.000 claims abstract description 22
- 239000004386 Erythritol Substances 0.000 claims abstract description 20
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 claims abstract description 20
- 235000019414 erythritol Nutrition 0.000 claims abstract description 20
- 229940009714 erythritol Drugs 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 19
- 150000007524 organic acids Chemical class 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000002253 acid Substances 0.000 claims abstract description 12
- 239000008139 complexing agent Substances 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 150000003839 salts Chemical class 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims abstract description 8
- 239000012530 fluid Substances 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 4
- 239000006193 liquid solution Substances 0.000 claims abstract description 4
- 238000007865 diluting Methods 0.000 claims abstract description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 60
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 18
- DWYHDSLIWMUSOO-UHFFFAOYSA-N 2-phenyl-1h-benzimidazole Chemical compound C1=CC=CC=C1C1=NC2=CC=CC=C2N1 DWYHDSLIWMUSOO-UHFFFAOYSA-N 0.000 claims description 18
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 18
- 239000001630 malic acid Substances 0.000 claims description 18
- 235000011090 malic acid Nutrition 0.000 claims description 18
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 17
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 4
- HDTRYLNUVZCQOY-LIZSDCNHSA-N alpha,alpha-trehalose Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@@H]1O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 HDTRYLNUVZCQOY-LIZSDCNHSA-N 0.000 claims description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 4
- HVCOBJNICQPDBP-UHFFFAOYSA-N 3-[3-[3,5-dihydroxy-6-methyl-4-(3,4,5-trihydroxy-6-methyloxan-2-yl)oxyoxan-2-yl]oxydecanoyloxy]decanoic acid;hydrate Chemical compound O.OC1C(OC(CC(=O)OC(CCCCCCC)CC(O)=O)CCCCCCC)OC(C)C(O)C1OC1C(O)C(O)C(O)C(C)O1 HVCOBJNICQPDBP-UHFFFAOYSA-N 0.000 claims description 3
- 229930186217 Glycolipid Natural products 0.000 claims description 3
- 235000015165 citric acid Nutrition 0.000 claims description 2
- 235000019260 propionic acid Nutrition 0.000 claims description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 13
- 230000008901 benefit Effects 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 11
- 238000012360 testing method Methods 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000007654 immersion Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 150000002460 imidazoles Chemical class 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical group [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 3
- PVFSDGKDKFSOTB-UHFFFAOYSA-K iron(3+);triacetate Chemical group [Fe+3].CC([O-])=O.CC([O-])=O.CC([O-])=O PVFSDGKDKFSOTB-UHFFFAOYSA-K 0.000 description 3
- ZTOKUMPYMPKCFX-CZNUEWPDSA-N (E)-17-[(2R,3R,4S,5S,6R)-6-(acetyloxymethyl)-3-[(2S,3R,4S,5S,6R)-6-(acetyloxymethyl)-3,4,5-trihydroxyoxan-2-yl]oxy-4,5-dihydroxyoxan-2-yl]oxyoctadec-9-enoic acid Chemical group OC(=O)CCCCCCC/C=C/CCCCCCC(C)O[C@@H]1O[C@H](COC(C)=O)[C@@H](O)[C@H](O)[C@H]1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](COC(C)=O)O1 ZTOKUMPYMPKCFX-CZNUEWPDSA-N 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
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- 238000013329 compounding Methods 0.000 description 2
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- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- ONJQDTZCDSESIW-UHFFFAOYSA-N polidocanol Chemical group CCCCCCCCCCCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO ONJQDTZCDSESIW-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003625 trehaloses Chemical class 0.000 description 2
- FEFXAMYFMLSALS-UHFFFAOYSA-N 2-(2,4-dichlorophenyl)-1h-benzimidazole Chemical compound ClC1=CC(Cl)=CC=C1C1=NC2=CC=CC=C2N1 FEFXAMYFMLSALS-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical class OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
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- 238000003672 processing method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000012088 reference solution Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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- 230000001550 time effect Effects 0.000 description 1
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Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present application relates to the field of circuit boards, and more particularly, to a surface treatment method for a circuit board and a circuit board manufactured by the same. A surface treatment method of a circuit board, comprising: step 1): cleaning a circuit board to be treated, and removing greasy dirt on the surface of the circuit board to be treated; step 2): microetching the circuit board to be treated to remove the oxide on the copper surface; step 3): diluting the treatment solution with water to obtain a treatment solution; immersing the circuit board to be treated in a treatment liquid solution; the treatment fluid comprises: 12-20g/L of imidazole compound, 50-100g/L of organic acid, 50-100g/L of long-chain acid, 0.1-5g/L of metal salt, 0.1-1g/L of complexing agent, 1-5g/L of trehalose ester, 0.5-3g/L of mannitol erythritol ester and the balance of water; step 4): and cleaning the circuit board to be processed, and drying to obtain the circuit board. The copper protection device has the advantages of relieving the deformation condition of the circuit board and enhancing the protection effect on copper.
Description
Technical Field
The present application relates to the field of circuit boards, and more particularly, to a surface treatment method for a circuit board and a circuit board manufactured by the same.
Background
The circuit board is a carrier for realizing electrical connection between electronic components, and the current rapid development of the electronic information industry pulls the market demand of the circuit board. The conventional preparation process of the circuit board comprises the following steps: manufacturing inner-layer circuits of a circuit board, shooting holes, detecting and maintaining circuits, pressing, drilling, primary copper plating, secondary copper plating, welding prevention, characters and forming. After copper plating, the circuit board is directly exposed and stored, so that the circuit board is very easily affected by oxygen, moisture, illumination and the like, and copper is oxidized and degenerated, thereby affecting the performance of the circuit board.
Therefore, the surface of the circuit board needs to be treated to alleviate the problems of copper oxidation and deterioration. In the method, the circuit board is directly fused into the solder, and useless solder in holes on the surface area of the substrate is removed by using hot air, so that the solder on the surface of the substrate is uniformly distributed. But the circuit board is easily deformed due to the high operating temperature required. Therefore, there is still a need for improvement.
Disclosure of Invention
In order to relieve the deformation condition of the circuit board and enhance the protection effect on copper, the application provides a surface treatment method of the circuit board and the circuit board manufactured by the surface treatment method.
In a first aspect, the present application provides a surface treatment method for a circuit board, which adopts the following technical scheme:
a surface treatment method of a circuit board, comprising the steps of:
step 1): cleaning a circuit board to be treated, and removing greasy dirt on the surface of the circuit board to be treated;
step 2): microetching the circuit board to be treated to remove the oxide on the copper surface;
step 3): diluting the treatment solution with water to obtain a treatment solution; immersing the circuit board to be treated in a treatment liquid solution;
the treatment fluid comprises the following components: 12-20g/L of imidazole compound, 50-100g/L of organic acid, 50-100g/L of long-chain acid, 0.1-5g/L of metal salt, 0.1-1g/L of complexing agent, 1-5g/L of trehalose ester, 0.5-3g/L of mannitol erythritol ester and the balance of water;
step 4): and (5) cleaning the circuit board to be treated by using water, and drying to obtain the circuit board.
By adopting the technical scheme, the circuit board to be treated is treated by adopting the treatment liquid, so that the problem of deformation of the circuit board caused by hot air is avoided.
The imidazole compound and copper on the surface of the circuit board to be treated undergo crosslinking and complexing reactions to generate chelate, so that a transparent and high-molecular chain complex film is formed. When electronic components are welded on the subsequent circuit board, the complex film can be quickly dissolved by the soldering flux due to high-temperature welding, the fresh copper surface is exposed, and the molten solder and the fresh copper surface are smoothly and quickly combined to finish welding.
However, the complex film cannot be too thin or too thick. If the protective film is too thin, the protective film is easy to scratch and cannot achieve a good protective effect; if too thick, it is difficult to dissolve during welding. Therefore, how to improve the protection performance of the formed complex film without changing the thickness is a new problem to be solved.
Under the co-coordination of imidazole compounds, trehalose esters and mannitol erythritol esters, the surface tension can be effectively reduced, so that more imidazole compounds are rapidly oriented and positioned on the copper surface of a circuit board to form a denser complex film. In addition, the use of the trehalose ester and the mannose erythritol ester can cooperate with the complex film to strengthen the strength of the complex film, so that the complex film is not easy to break; in addition, the complex film and the surface of the circuit board have better adhesion effect, are not easy to fall off the surface of the circuit board, extend and spread on the surface of the circuit board, reduce the condition that the complex film is not completely covered, and effectively improve the connection strength of the generated complex film and the surface of the circuit board.
Preferably, the imidazole compound is one or more of 2-phenylbenzimidazole, 2-arylimidazole and 2-heptadecylimidazole.
Although the imidazole compound can be used for being matched with copper on the surface of the circuit board, the imidazole compound of different types has different degrees of matching effect with copper.
By adopting the technical scheme, the specific imidazole compound is further selected, so that the circuit board is better protected.
Preferably, the imidazole compound is 2-phenylbenzimidazole, 2-heptadecylimidazole, and the mass ratio of the 2-phenylbenzimidazole to the 2-heptadecylimidazole is 1: (0.8-1.2).
Preferably, the imidazole compound is 15-18g/L, the trehalose lipid is 3-5g/L, and the mannitol erythritol ester is 1-2g/L.
By adopting the technical scheme, the imidazole compounds are further defined as 2-phenylbenzimidazole and 2-heptadecylimidazole, and the mass ratio between the two is defined. Under the limitation, the trehalose ester and the mannitol ester can promote the formation of the complex film on the surface of the circuit board by the 2-phenylbenzimidazole and the 2-heptadecylimidazole more quickly, and the complex film has a stronger rigid structure, has better heat resistance and is not easy to scratch.
Preferably, the organic acid is one or more of acetic acid, glycolic acid, propionic acid, malic acid and citric acid.
Preferably, the organic acid is acetic acid and malic acid, and the mass ratio of the acetic acid to the malic acid is (0.4-0.7): 1.
the acetic acid has larger relative molecular weight, is not easy to volatilize, and has little influence on the pH of the whole treatment liquid; but its solubility in long chain acids is still to be enhanced. Thus, the combination of acetic acid and malic acid in a specific proportion is particularly selected, so that the treatment liquid can keep proper pH value, and a good dissolution environment can be provided for long-chain acid, so that the complex film has proper thickness on a circuit board.
In practice, the special combination has good matching effect with trehalose glycolipid and mannitol erythritol ester, and the complex film is promoted to be generated more rapidly, so that the protection effect on the circuit board is effectively enhanced.
Preferably, the concentration of the treatment solution in the step 3) is 1-3%.
By adopting the technical scheme, under the special coordination of the imidazole compound, the trehalose ester and the mannitol erythritol ester, a complex film with better protection effect can be formed on the circuit board by using a lower concentration treatment solution, thereby being more beneficial to reducing the production cost.
In a second aspect, the present application provides a circuit board.
The complex film with the strong protection effect is covered on the surface of the circuit board prepared by the method, the influence of oxygen, illumination and moisture on the circuit board is effectively weakened, the phenomena of copper oxidation and deterioration are effectively relieved, and the circuit board has longer-lasting preservation time effect.
In summary, the present application has the following beneficial effects:
1. the method comprises the steps of soaking the circuit board to be treated by adopting the treatment liquid solution to obtain the circuit board with the film on the surface, wherein the film is compact and tough and is not easy to damage, and the circuit board is protected for a long time; and the circuit board has proper thickness, so that the subsequent welding is not affected. The processing method does not need high-temperature heating, so that the circuit board can maintain a good form, deformation is avoided, and good performance is maintained.
2. Under the co-coordination of the imidazole compound, the trehalose ester and the mannitol ester, the complex film has better adhesion effect with the surface of the circuit board, is not easy to fall off the surface of the circuit board, and extends and spreads on the surface of the circuit board, thereby reducing the condition of incomplete coverage of the complex film and effectively improving the connection strength of the generated complex film and the surface of the circuit board.
3. The organic acid is further limited in type and proportion, and has good matching effect with trehalose glycolipid and mannitol erythritol ester, so that a complex film is promoted to be generated more rapidly, and the protection effect on a circuit board is effectively enhanced.
Detailed Description
The present application is described in further detail below with reference to examples.
The raw materials used in the following examples and comparative examples are all commercially available products.
Example 1
A surface treatment method of a circuit board, comprising the steps of:
step 1): and cleaning the circuit board to be treated by using a commercially available acid degreasing agent, removing greasy dirt on the surface of the circuit board to be treated, and then washing with clear water for three times.
Step 2): microetching the circuit board to be treated to remove the oxide on the copper surface.
The liquid medicine used in microetching mainly comprises sulfuric acid and sodium persulfate, and the solution is acidic.
Step 3): the treatment solution was diluted with water to obtain a treatment solution having a concentration of 2%.
And immersing the circuit board to be treated in the treatment solution, wherein the immersion temperature is adjusted to be 40 ℃, and the immersion time is 60s.
The treatment fluid comprises the following components: 16g of imidazole compound, 80g of organic acid, 80g of long-chain acid, 2g of metal salt, 0.5g of complexing agent, 4g of trehalose grease, 1.5g of mannitol erythritol ester and the balance of water to 1L.
Wherein the imidazole compound is 2-phenylbenzimidazole, 2-heptadecylimidazole, the mass ratio of the 2-phenylbenzimidazole to the 2-heptadecylimidazole is 1:1. namely 8g of 2-phenylbenzimidazole and 8g of 2-heptadecylimidazole.
The organic acid is acetic acid and malic acid, and the mass ratio of the acetic acid to the malic acid is 0.5:1. that is, 27g of acetic acid and 53g of malic acid.
The long-chain acid is hexadecanoic acid.
The metal salt is ferric acetate.
The complexing agent is EDTA-2Na.
The specific amounts are summarized in Table 1.
Step 4): and 3) cleaning the circuit board to be treated soaked in the step 3) by water, so as to reduce acidic substances attached to the surface of the circuit board.
And then drying in hot air at 40 ℃ to obtain the circuit board.
Example 2
A surface treatment method of a circuit board is different from embodiment 1 in that,
in step 3), the treatment solution was diluted with water to obtain a treatment solution having a concentration of 1%.
And immersing the circuit board to be treated in the treatment solution, wherein the immersion temperature is adjusted to be 40 ℃, and the immersion time is 60s.
The treatment fluid comprises the following components: 12g of imidazole compound, 50g of organic acid, 50g of long-chain acid, 0.1g of metal salt, 0.1g of complexing agent, 1g of trehalose ester, 0.5g of mannitol erythritol ester and the balance of water to 1L.
The imidazole compound is 2-phenylbenzimidazole.
The organic acid is acetic acid and malic acid, and the mass ratio of the acetic acid to the malic acid is 0.4:1. i.e. 14g acetic acid and 36g malic acid.
The long-chain acid is hexadecanoic acid.
The metal salt is ferric acetate.
The complexing agent is EDTA-2Na.
The specific amounts are summarized in Table 1.
Example 3
A surface treatment method of a circuit board is different from embodiment 1 in that,
in step 3), the treatment solution was diluted with water to obtain a treatment solution having a concentration of 3%.
And immersing the circuit board to be treated in the treatment solution, wherein the immersion temperature is adjusted to be 40 ℃, and the immersion time is 60s.
The treatment fluid comprises the following components: 20g of imidazole compound, 100g of organic acid, 100g of long-chain acid, 5g of metal salt, 1g of complexing agent, 5g of trehalose ester, 3g of mannitol erythritol ester and the balance of water to 1L.
The imidazole compound is 2-aryl imidazole.
The organic acid is acetic acid and malic acid, and the mass ratio of the acetic acid to the malic acid is 0.7:1. i.e. 41g of acetic acid and 59g of malic acid.
The long-chain acid is octadecanoic acid.
The metal salt is ferric acetate.
The complexing agent is EDTA-2Na.
The specific amounts are summarized in Table 1.
Example 4
A surface treatment method of a circuit board is different from embodiment 1 in that,
in the treatment solution, 18g of an imidazole compound was contained. The imidazole compound is 2-phenylbenzimidazole, 2-heptadecylimidazole, the mass ratio of the 2-phenylbenzimidazole to the 2-heptadecylimidazole is 1:0.8. namely 10g of 2-phenylbenzimidazole and 8g of 2-heptadecylimidazole.
The trehalose lipid was 3g and the mannitol erythritol ester was 1g.
The specific amounts are summarized in Table 1.
Example 5
A surface treatment method of a circuit board is different from embodiment 1 in that,
in the treatment solution, 15g of an imidazole compound was contained. The imidazole compound is 2-phenylbenzimidazole, 2-heptadecylimidazole, the mass ratio of the 2-phenylbenzimidazole to the 2-heptadecylimidazole is 1:1.2. namely 6.8g of 2-phenylbenzimidazole and 8.2g of 2-heptadecylimidazole.
The trehalose lipid was 5g and the mannitol erythritol ester was 2g.
The specific amounts are summarized in Table 1.
TABLE 1
Example 6
A surface treatment method of a circuit board is different from embodiment 1 in that,
in the treatment solution, the imidazole compound is 2- (2, 4-dichlorophenyl) benzimidazole.
Example 7
A surface treatment method of a circuit board is different from embodiment 1 in that,
in the treatment solution, the organic acid is acetic acid.
Example 8
A surface treatment method of a circuit board is different from embodiment 1 in that,
in the treatment liquid, the mass ratio of acetic acid to malic acid is 2:1, i.e. 53g acetic acid and 27g malic acid.
Comparative example 1
A surface treatment method of a circuit board is different from embodiment 1 in that,
in the treatment solution, the trehalose lipid was replaced with sophorolipid, namely 0g of trehalose lipid and 4g of sophorolipid.
Comparative example 2
A surface treatment method of a circuit board is different from embodiment 1 in that,
in the treatment fluid, the mannitol erythritol ester was replaced with AEO-9, namely, 0g of mannitol erythritol ester and 1.5g of AEO-9.
Comparative example 3
A surface treatment method of a circuit board is different from embodiment 1 in that,
in the treatment solution, the trehalose lipid was 0.5g, and the mannitol erythritol ester was 5g.
Performance test
1. Thickness: the circuit boards of examples 1-8 and comparative examples 1-3 were placed in a 250mL beaker, 50mL of 5% strength by mass hydrochloric acid was added, and stirring was performed for 3min to dissolve the complex film completely. The absorption value at 284mm wavelength was measured by an ultraviolet spectrophotometer using 5% by mass hydrochloric acid as a reference solution, and the film thickness (. Mu.m) was calculated and recorded in Table 2.
2. And (3) heat resistance detection: taking example 1 as an example, the circuit board 6 blocks prepared by the surface treatment method of example 1 were prepared and randomly divided into two groups, one group being a test group and one group being a control group.
The control group was left to stand at room temperature for use.
The test group was baked at a constant temperature of 320℃for 10s, left at room temperature for 10s, continued for 5 times, and then cooled at room temperature.
The control group was compared with the test group to see whether the color was changed. If no color change exists, recording 'no'; if the color changes, a "yes" is recorded and the degree of color change is noted.
The circuit boards of examples 2 to 8 and comparative examples 1 to 3 were also tested according to the above-described test methods, and the test results were recorded in table 2.
3. Tin-plating property of through hole: the circuit boards of examples 1 to 8 and comparative examples 1 to 3 were heated for 100 seconds by adjusting the preheating temperature to 120 ℃. The circuit board was then subjected to a dual peak treatment using solder of SnCu at 285 ℃. In the dual-peak treatment, the contact time of the circuit board and the soldering tin is 2.5s, the circuit board is separated from the contact for 3s, and then the circuit board is contacted with the soldering tin for 3s, and cold air is blown. After 5 times of reflow, the soldering condition of the circuit board was observed, and the solder pass rate of the through holes was recorded in table 2.
The tin-coated qualification of the through hole means that the hole is completely filled with solder to be qualified. The pass rate of tin on the through holes is 100% of the number of qualified holes/total holes, and the total number of holes is 200.
TABLE 2
The circuit boards prepared in examples 1 to 8 and comparative examples 1 to 3 were visually examined, and were free from any abnormal appearance and deformation, and all were normal.
As can be seen from comparison of the test data of examples 1-8 and comparative examples 1-3 in Table 2, the thicknesses of examples 1-8 were all 0.30-0.40 μm, and the complex films on the circuit boards had good protective effects at these thicknesses, and were neither too thin nor too thick. The complex films formed on the circuit boards of comparative examples 1-3 were thin, probably because the imidazole compound, the trehalose lipid, and the mannitol erythritol ester were broken together, so that the imidazole compound could not form a complex film on the circuit board rapidly and accurately. The technical scheme that the specific imidazole compound, the trehalose ester and the mannitol erythritol ester are matched in a specific dosage is an organic whole and can not be split at will.
The concentration of the treatment solution is only 1-3%, and the treatment solution still can provide good protection effect for the circuit board at the lower concentration, so that the treatment solution has good economic benefit. The circuit boards of examples 1-8 also have significantly better heat resistance and tin plating performance than the circuit boards of comparative examples 1-3, indicating that the specially formed complex films are dense and tightly bonded, so that the circuit boards can also have significant protective effects without changing the film thickness.
As can be seen from comparison of the test results of examples 1, 4 and 5 and examples 2-3 in Table 2, further limiting the selection and amount of each raw material can produce a more compact, more complete and better binding complex film, thereby protecting the circuit board for a long time.
As is clear from comparison of the test data of example 1 and example 6 in Table 2, the types and the compounding ratios of the imidazole compounds are further limited, and the imidazole compounds can have sufficient compounding effects with trehalose esters and mannitol esters, so that a complex film with a better rigid structure can be formed, and the complex film can be endowed with better heat resistance.
As is clear from comparison of the test data of examples 1 and 7 and 8 in Table 2, the organic acid is further limited in kind, and the organic acid can be more effectively blended with trehalose ester and mannitol erythritol ester, thereby exhibiting better performances in thickness, heat resistance and tin plating property through holes.
The present embodiment is merely illustrative of the present application and is not intended to be limiting, and those skilled in the art, after having read the present specification, may make modifications to the present embodiment without creative contribution as required, but is protected by patent laws within the scope of the claims of the present application.
Claims (8)
1. A surface treatment method of a circuit board, comprising the steps of:
step 1): cleaning a circuit board to be treated, and removing greasy dirt on the surface of the circuit board to be treated;
step 2): microetching the circuit board to be treated to remove the oxide on the copper surface;
step 3): diluting the treatment solution with water to obtain a treatment solution; immersing the circuit board to be treated in a treatment liquid solution;
the treatment fluid comprises the following components: 12-20g/L of imidazole compound, 50-100g/L of organic acid, 50-100g/L of long-chain acid, 0.1-5g/L of metal salt, 0.1-1g/L of complexing agent, 1-5g/L of trehalose ester, 0.5-3g/L of mannitol erythritol ester and the balance of water;
step 4): and (5) cleaning the circuit board to be treated by using water, and drying to obtain the circuit board.
2. The surface treatment method of a circuit board according to claim 1, characterized in that: the imidazole compound is one or more of 2-phenylbenzimidazole, 2-arylimidazole and 2-heptadecylimidazole.
3. The surface treatment method of a circuit board according to claim 2, characterized in that: the imidazole compound is 2-phenylbenzimidazole, 2-heptadecylimidazole, and the mass ratio of the 2-phenylbenzimidazole to the 2-heptadecylimidazole is 1: (0.8-1.2).
4. The surface treatment method of a circuit board according to claim 2, characterized in that: the imidazole compound is 15-18g/L, the trehalose glycolipid is 3-5g/L, and the mannitol erythritol ester is 1-2g/L.
5. The surface treatment method of a circuit board according to claim 1, characterized in that: the organic acid is one or more of acetic acid, glycolic acid, propionic acid, malic acid and citric acid.
6. The surface treatment method of a circuit board according to claim 5, wherein: the organic acid is acetic acid and malic acid, and the mass ratio of the acetic acid to the malic acid is (0.4-0.7): 1.
7. the surface treatment method of a circuit board according to claim 1, characterized in that: the concentration of the treatment solution in the step 3) is 1-3%.
8. A circuit board manufactured based on the surface treatment method of a circuit board according to any one of claims 1 to 7.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110259373A1 (en) * | 2010-04-21 | 2011-10-27 | C. Uyemura Co., Ltd | Method and agent for surface processing of printed circuit board substrate |
| CN108396325A (en) * | 2018-02-27 | 2018-08-14 | 广州天至环保科技有限公司 | A kind of solderable nickel protective agent of water solubility |
| CN112888183A (en) * | 2021-01-14 | 2021-06-01 | 苏州创嘉力电子科技有限公司 | Copper surface bonding solution |
| CN115433929A (en) * | 2022-09-14 | 2022-12-06 | 深圳市豪龙新材料技术有限公司 | Organic weldable copper surface protective agent and preparation method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110259373A1 (en) * | 2010-04-21 | 2011-10-27 | C. Uyemura Co., Ltd | Method and agent for surface processing of printed circuit board substrate |
| CN108396325A (en) * | 2018-02-27 | 2018-08-14 | 广州天至环保科技有限公司 | A kind of solderable nickel protective agent of water solubility |
| CN112888183A (en) * | 2021-01-14 | 2021-06-01 | 苏州创嘉力电子科技有限公司 | Copper surface bonding solution |
| CN115433929A (en) * | 2022-09-14 | 2022-12-06 | 深圳市豪龙新材料技术有限公司 | Organic weldable copper surface protective agent and preparation method thereof |
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