CN117832371A - Manufacturing method of COB backlight lamp strip - Google Patents
Manufacturing method of COB backlight lamp strip Download PDFInfo
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- CN117832371A CN117832371A CN202410062351.9A CN202410062351A CN117832371A CN 117832371 A CN117832371 A CN 117832371A CN 202410062351 A CN202410062351 A CN 202410062351A CN 117832371 A CN117832371 A CN 117832371A
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- glue
- dam
- fluorescent glue
- white
- fluorescent
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 199
- 239000000463 material Substances 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000011521 glass Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 17
- 238000005507 spraying Methods 0.000 claims description 5
- 239000006082 mold release agent Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 27
- 238000012536 packaging technology Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The invention provides a manufacturing method of a COB backlight lamp bar, which comprises the following specific steps: (1) A white glue surrounding dam is arranged on the glass plate, and comprises a first white glue surrounding dam and a second white glue surrounding dam; (2) filling a fluorescent glue layer in the first white glue surrounding dam; (3) The second white glue surrounding dam forms a cavity for accommodating the LED chip, and fluorescent glue materials are formed after baking; (4) Cutting the fluorescent glue material, and separating the fluorescent glue material from the glass plate; (5) placing the LED chip on a substrate and performing die bonding; (6) spot-coating a transparent glue layer on the LED chip after die bonding is completed; (7) Placing the fluorescent glue material on the transparent glue layer to enable the LED chip to be located in the cavity of the second white glue surrounding dam; (8) And baking is carried out to obtain the COB backlight lamp bar, and the light color consistency is good.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a manufacturing method of a COB backlight lamp strip.
Background
An LED is a semiconductor light emitting device that converts electrical energy into visible light and radiant energy. Because of the advantages of low working voltage, low power consumption, high brightness, long service life, environmental protection and the like, particularly the rapid development of high-power LEDs, LEDs are increasingly favored in various illumination fields, and are widely applied to the fields of backlight display, landscape illumination, venue illumination and the like.
Along with the continuous change of market demands, high-power LEDs are continuously developed in the direction of miniaturization and integration, and meanwhile, in consideration of heat dissipation, a high-power bracket is continuously approaching to a flat plate, such as multi-chip integrated LEDs, COB (chip on board), ceramic LEDs and the like which appear in the market, so that the high-power LED packaging technology is a new challenge for the existing LED packaging technology.
COB packaging technology is an integrated packaging technology that is widely used because of the large number of packaged chips.
The main process of the existing COB processing technology is to perform die bonding on a substrate, and then perform a dam process, namely, after die bonding is completed, dispensing dam glue on the area around the chip, and after dam processing is completed, dispensing fluorescent glue on the area above the dam is generally required, so that white light can be emitted better, such as chinese patent application No. CN202011422443.1, publication day 2021.03.12, which discloses a packaging method of dual-color temperature COB, specifically discloses that die bonding is performed on the substrate, then a first fluorescent glue layer is formed on the chip, and a dam is formed on the substrate, then a second fluorescent glue layer is filled in the dam, and then baking is performed, but in this way, the processing technology needs to perform primary baking after dispensing the fluorescent glue layer and the dam, and then perform secondary baking after dispensing the second fluorescent glue layer in the dam, so that LED chips need to be baked for multiple times, thereby easily damaging the LED chips, and since the fluorescent glue layer and the dam are integrally formed on a plurality of LED chips cannot be set individually according to different LED chips, the problem of inconsistent LED light color is solved.
Disclosure of Invention
The invention provides a manufacturing method of COB backlight lamp strips, which is characterized in that a fluorescent rubber dam is manufactured in advance, so that the quality of the fluorescent rubber of each COB backlight lamp strip is ensured to be equal, and the light color of the COB backlight lamp strip is kept consistent.
In order to achieve the above purpose, the technical scheme of the invention is as follows: a manufacturing method of a COB backlight lamp strip comprises the following specific steps:
(1) And arranging a white glue surrounding dam on the glass plate, wherein the white glue surrounding dam comprises a first white glue surrounding dam and a second white glue surrounding dam.
(2) And filling a fluorescent glue layer in the first white glue surrounding dam.
(3) The second white glue surrounding dam forms a cavity for accommodating the LED chip, and fluorescent glue materials are formed after baking.
(4) And cutting the fluorescent glue material, and separating the fluorescent glue material from the glass plate.
(5) And placing the LED chip on a substrate and performing die bonding.
(6) And (5) spot-coating a transparent glue layer on the LED chip after die bonding is completed.
(7) Placing fluorescent glue on the LED chip so that the LED chip is positioned in the cavity of the second white glue dam;
(8) And baking to obtain the COB backlight lamp bar.
According to the setting, the first white glue surrounding dam is arranged on the glass plate, the fluorescent glue layer is filled in the first white glue surrounding dam, the second white glue surrounding dam is arranged on the fluorescent glue layer and the first white glue surrounding dam, so that fluorescent glue materials can be formed after baking, when LED chips are subjected to die bonding, the LED chips are firstly subjected to die bonding on the substrate, and then the fluorescent glue materials are placed on the LED chips, so that COB backlight light bars can be obtained through baking, the LED chips are required to be baked once in the manufacturing process, the surrounding dams are not required to be molded after the die bonding of the LED chips is finished, and the fluorescent glue material surrounding dams are manufactured in advance, so that the quality of the fluorescent glue material surrounding dams can be detected and the color points of the fluorescent glue materials are not consistent before the die bonding of the LED chips, and the problem that the color points of the fluorescent glue materials manufactured by the surrounding dams are inconsistent due to the instability in the manufacturing process of the die bonding of the LED chips is avoided, and the color points of the final COB light bars are inconsistent is solved, and therefore the color points of each COB backlight light bar can be kept consistent through the pre-baking.
Further, the COB backlight lamp strip comprises a substrate, an LED chip and fluorescent glue materials, wherein the LED chip is provided with more than one fluorescent glue materials and arranged on the substrate, the fluorescent glue materials comprise a first white glue surrounding dam, a second white glue surrounding dam and a fluorescent glue layer, the fluorescent glue layer is arranged on the first white glue surrounding dam, the second white glue surrounding dam is arranged on the first white glue surrounding dam, a cavity for accommodating the LED chip is formed in the second white glue surrounding dam, the bottom end of the second white glue surrounding dam is connected with the substrate, a transparent glue layer is arranged in the cavity, and the light emitting angle of the LED chip can be controlled according to the size of the LED chip through the first white glue surrounding dam and the second white glue surrounding dam, so that an optical lens is better matched.
Further, the step (4) specifically includes cutting with the external diameter of the second white glue surrounding dam, so that the external diameters of the second white glue surrounding dam and the first white glue surrounding dam are identical, and the whole fluorescent glue material is tidier and does not influence luminescence.
Further, the step (2) specifically includes baking after the fluorescent glue layer is filled, so that the fluorescent glue layer is solidified and shaped.
Further, the step (4) specifically further includes sorting color points of the fluorescent glue material by using the blue light wafer as a light source.
Above setting, carry out the luminous through the blue light wafer and select separately the fluorescent glue material to select separately the fluorescent glue material of different color point scope and arrange in order, thereby can guarantee when processing COB backlight lamp strip in the follow-up that the fluorescent glue material color point on the COB backlight lamp strip all is in same color point scope, thereby make the color point of COB backlight lamp strip can keep the uniformity.
Further, the step (1) specifically further includes:
(01) And spraying a mold release agent on the glass plate.
Through the setting, through spraying release agent for can conveniently break away from the glass board after the fluorescent glue material shaping, simple to use and reliable.
Further, the step (4) specifically further comprises arranging the sorted fluorescent glue materials on the blue film in sequence according to the range of color points, so that the fluorescent glue materials can be conveniently grabbed and placed on the substrate by the die bonding equipment, and the fluorescent glue materials are orderly arranged according to the range of the color points, so that grabbing is convenient, disorder is not easy, and the consistency of the color points of the final product is ensured.
Further, the first white glue surrounding dam and the second white glue surrounding dam are integrally arranged, so that the whole processing of the white glue surrounding dams is facilitated.
Furthermore, the first white glue surrounding dam and the second white glue surrounding dam are arranged in a split mode, and therefore the first white glue surrounding dam and the second white glue surrounding dam can be conveniently processed in different sizes.
Drawings
Fig. 1 is a flow chart of the operation of the present invention.
Fig. 2 is a schematic structural view of the present invention.
FIG. 3 is a flow chart illustrating a method for manufacturing a fluorescent glue according to an embodiment of the invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and the detailed description.
Example 1.
As shown in fig. 1-3, a method for manufacturing a COB backlight light bar specifically includes the following steps:
(1) A white glue dam 02 is provided on the glass plate 01, and the white glue dam 02 includes a first white glue dam 31 and a second white glue dam 32.
(2) A fluorescent glue layer 33 is filled in the first white glue dam 31.
(3) The second white glue dam 32 forms a cavity 321 for accommodating the LED chip 2, and the fluorescent glue 3 is formed after baking.
In this embodiment, the first and second white glue dams are separately provided, and the first and second white glue dams may be formed by coating or dispensing, and step (3) specifically includes providing a second white glue dam on the first white glue dam, and forming a cavity for accommodating the LED chip in the second white glue dam.
In another embodiment, after the fluorescent glue layer 33 is filled in the first white glue dam 31, a second white glue dam 32 is formed on the first white glue dam 31 and the fluorescent glue layer 33 by coating or molding, and then a cavity is formed on the second white glue dam 32 by cutting according to the size of the LED chip, and the cavity is located right above the fluorescent glue layer. In this embodiment, the length of the cavity is 0.2mm greater than the length of the LED chip.
(4) The fluorescent glue 3 is cut while the fluorescent glue 3 is detached from the glass plate 01.
(5) The LED chip 2 is placed on the substrate 1 and die-bonded.
(6) And (5) a transparent adhesive layer 22 is dotted on the LED chip 2 after die bonding is completed.
(7) Placing the fluorescent glue material 3 on the LED chip 2 so that the LED chip 2 is positioned in the cavity 321 of the second white glue dam 32;
(8) And baking to obtain the COB backlight lamp bar.
As shown in fig. 2, the COB backlight strip includes a substrate 1, an LED chip 2 and a fluorescent glue material 3, the LED chip 2 is provided with more than one and is disposed on the substrate 1, the LED chip 2 is provided with the fluorescent glue material 3, the fluorescent glue material 3 includes a first white glue dam 31, a second white glue dam 32 and a fluorescent glue layer 33, the fluorescent glue layer 33 is disposed on the first white glue dam 31, the second white glue dam 32 is disposed on the first white glue dam 31, a cavity 321 for accommodating the LED chip 2 is disposed on the second white glue dam 32, the bottom end of the second white glue dam 32 is connected with the substrate 1, a transparent glue layer 22 is disposed in the cavity 321, and by disposing the first white glue dam 31 and the second white glue dam 32, the light emitting angle of the LED chip can be controlled according to the size of the LED chip 2, so as to better match with an optical lens.
As shown in fig. 3, step (4) specifically includes cutting with the outer diameter of the second white glue dam 32 (as shown by the vertical line segment in fig. 3), so that the outer diameters of the second white glue dam 32 and the first white glue dam 31 can be ensured to be the same, so that the whole fluorescent glue material 3 is tidier and does not affect the luminescence.
The step (2) specifically includes baking after the fluorescent glue layer 33 is filled, so that the fluorescent glue layer 33 is cured and shaped.
And (4) specifically, sorting the light spots of the fluorescent glue material by taking the blue light wafer as a light source. In this embodiment, the blue light chip is a light source device capable of emitting blue light, and in particular, the prior art is not described here.
The fluorescent glue materials 3 are sorted by the luminescence of the blue light wafer, a batch of fluorescent glue materials 3 can be covered on the blue light wafer to be lightened, and then the fluorescent glue materials 3 in different light spot ranges are sorted and sorted by the sorting machine according to the luminescent color characteristics, so that the light spots of the fluorescent glue materials on one COB backlight strip can be ensured to be in the same light spot range during the subsequent processing of the COB backlight strip, the light spots of the COB backlight strip can be kept consistent, and the specific working principle of the sorting machine is the prior art and is not tired.
The method specifically further comprises the following steps before the step (1):
(01) And spraying a mold release agent on the glass plate.
Through spraying release agent for can conveniently break away from the glass board after fluorescent glue material shaping, it is simple to use and reliable.
Step (4) specifically further comprises arranging the sorted fluorescent glue materials on the blue film in sequence according to the range of the light spots, so that the fluorescent glue materials can be conveniently grabbed and placed on the substrate by the die bonding equipment, and the fluorescent glue materials are orderly arranged according to the range of the light spots, so that grabbing is convenient, disorder is not easy, and the light spot consistency of a final finished product is ensured.
The invention has the beneficial effects that: the first white glue surrounding dam 131 is arranged on the glass plate, the fluorescent glue layer 33 is filled in the first white glue surrounding dam 31, the fluorescent glue layer 33 and the second white glue surrounding dam 32 are arranged on the fluorescent glue layer 33 and the first white glue surrounding dam 31, so that the fluorescent glue 3 can be formed after baking, when the LED chip 2 is subjected to die bonding, the LED chip 2 is firstly bonded on the substrate 1, and then the fluorescent glue 3 is placed on the LED chip 1, so that the COB backlight lamp strip can be obtained by baking, the LED chip 2 needs to be baked once in the manufacturing process, the surrounding dams are formed without the need of baking for many times after the die bonding of the LED chip 2 is finished, and the fluorescent glue 3 surrounding dams are manufactured in advance, so that the quality of the fluorescent glue 3 surrounding dams can be detected and the fluorescent glue 3 with inconsistent light spots before the die bonding of the LED chip 2 is performed, the problem that the final COB backlight lamp strip is caused by the fact that the quality of the surrounding dams is manufactured is inconsistent due to the instability in the manufacturing process of die bonding of the LED chip 2 is avoided, and the problem that the light spots of the fluorescent glue can be kept consistent through the COB backlight lamp strip is solved.
Example 2.
This embodiment differs from embodiment 1 in that: in this embodiment, the first white glue surrounding dam and the second white glue surrounding dam are integrally provided, the first white glue surrounding dam and the second white glue surrounding dam can be formed by dispensing or coating, and then a fluorescent glue layer is dispensed in the first white glue surrounding dam, so that the whole processing of the white glue surrounding dam is facilitated.
Claims (9)
1. A manufacturing method of a COB backlight lamp bar is characterized in that: the method comprises the following specific steps:
(1) A white glue surrounding dam is arranged on the glass plate, and comprises a first white glue surrounding dam and a second white glue surrounding dam;
(2) Filling a fluorescent glue layer in the first white glue surrounding dam;
(3) The second white glue surrounding dam forms a cavity for accommodating the LED chip, and fluorescent glue materials are formed after baking;
(4) Cutting the fluorescent glue material, and separating the fluorescent glue material from the glass plate;
(5) Placing the LED chip on a substrate and carrying out die bonding;
(6) A transparent glue layer is dotted on the LED chip after the die bonding is completed;
(7) Placing the fluorescent glue material on the transparent glue layer to enable the LED chip to be located in the cavity of the second white glue surrounding dam;
(8) And baking to obtain the COB backlight lamp bar.
2. The method for manufacturing the COB backlight fluorescent glue light bar according to claim 1, which is characterized in that: the COB backlight lamp strip comprises a substrate, an LED chip and fluorescent glue materials, wherein the LED chip is provided with more than one fluorescent glue materials arranged on the substrate, the fluorescent glue materials comprise a first white glue surrounding dam, a second white glue surrounding dam and fluorescent glue layers, the fluorescent glue layers are arranged on the first white glue surrounding dam, the second white glue surrounding dam is arranged on the first white glue surrounding dam, a cavity for accommodating the LED chip is formed in the second white glue surrounding dam, the bottom end of the second white glue surrounding dam is connected with the substrate, and a transparent glue layer is arranged in the cavity.
3. The method for manufacturing the COB backlight fluorescent glue light bar according to claim 1, which is characterized in that: the step (4) specifically comprises cutting with the outer diameter of the second white glue dam.
4. The method for manufacturing the COB backlight fluorescent glue light bar according to claim 1, which is characterized in that: and (2) specifically, baking after the fluorescent glue layer is filled, so that the fluorescent glue layer is solidified and shaped.
5. The method for manufacturing the COB backlight fluorescent glue light bar according to claim 1, which is characterized in that: the step (4) specifically further comprises sorting color points of the fluorescent glue material by using the blue light wafer as a light source.
6. The method for manufacturing the COB backlight fluorescent glue light bar according to claim 1, which is characterized in that: the method specifically further comprises the following steps before the step (1):
(01) And spraying a mold release agent on the glass plate.
7. The method for manufacturing the COB backlight fluorescent glue lamp strip according to claim 5, wherein the method comprises the following steps: and (4) arranging the sorted fluorescent glue materials on the blue film in sequence according to the range of color points.
8. The method for manufacturing the COB backlight fluorescent glue light bar according to claim 1, which is characterized in that: the first white glue surrounding dam and the second white glue surrounding dam are integrally arranged.
9. The method for manufacturing the COB backlight fluorescent glue light bar according to claim 1, which is characterized in that: the first white glue surrounding dam and the second white glue surrounding dam are arranged in a split mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410062351.9A CN117832371A (en) | 2024-01-16 | 2024-01-16 | Manufacturing method of COB backlight lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410062351.9A CN117832371A (en) | 2024-01-16 | 2024-01-16 | Manufacturing method of COB backlight lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117832371A true CN117832371A (en) | 2024-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410062351.9A Pending CN117832371A (en) | 2024-01-16 | 2024-01-16 | Manufacturing method of COB backlight lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117832371A (en) |
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- 2024-01-16 CN CN202410062351.9A patent/CN117832371A/en active Pending
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