CN117832370A

CN117832370A - Laminate for MIP encapsulation, preparation method, encapsulation structure and preparation method

Info

Publication number: CN117832370A
Application number: CN202311787239.3A
Authority: CN
Inventors: 鲍亚童; 毛云飞; 刘雨峰; 高原
Original assignee: Hangzhou Foster Electronic Materials Co ltd
Current assignee: Hangzhou Foster Electronic Materials Co ltd
Priority date: 2023-12-22
Filing date: 2023-12-22
Publication date: 2024-04-05

Abstract

The invention belongs to the technical field of light emitting devices. A laminate for MIP packaging includes a photoconductive layer and a contrast layer; the lining layer is arranged on one side of the photoconductive layer; through 1000mJ/cm ² After energy irradiation and treatment at 150 ℃ for 60min, the glass transition temperature of the photoconductive layer is 40 ℃ or more. The invention also discloses a preparation method of the laminated body. The invention also provides a packaging structure. The invention also discloses a preparation method of the packaging structure. The laminated body has higher rigidity, the cut end face is flat and free of burrs, the flatness of the end face of the packaging structure after cutting can be obviously improved, and the cutting quality and the yield are improved.

Description

Laminate for MIP encapsulation, preparation method, encapsulation structure and preparation method

Technical Field

The invention belongs to the technical field of luminescence, and particularly relates to a lamination body for MIP encapsulation, a preparation method, an encapsulation structure and a preparation method.

Background

In the current packaging scheme of the light emitting device, MIP (Micro LED in Package) packaging of the light emitting device gives consideration to yield and cost, and has mass production feasibility.

MIP packaging is to transfer a large number of light emitting devices onto a substrate on an epitaxial wafer and directly package the light emitting devices into a display module; then cutting the display module into a packaging structure containing single or multiple light-emitting units, and detecting and mixing light.

However, in the process of implementing the technical scheme in the embodiment of the present application, the applicant finds that at least the following technical problems exist in the above technology:

after the display module is cut, the problem that the cut end face of the packaging structure is uneven can occur. The cutting quality and yield are seriously affected by the uneven cutting end face of the packaging structure.

Disclosure of Invention

According to the embodiment of the application, the problem that the end face is uneven after the packaging structure is cut is solved, and the product yield is improved.

The embodiment of the application provides a laminated body for MIP packaging, which comprises a light guiding layer and a lining layer, wherein the lining layer is arranged on one side of the light guiding layer; through 1000mJ/cm ² After energy irradiation and treatment at 150 ℃ for 60min, the glass transition temperature of the photoconductive layer is 40 ℃ or more.

Further, 1000mJ/cm ² After energy irradiation and treatment at 150 ℃ for 60min, the contrast layer satisfies at least one of the condition (I) or the condition (II); the condition (I) is that the glass transition temperature of the contrast layer is more than or equal to 40 ℃; the condition (II) is that the surface hardness of the lining layer is more than or equal to 2H.

Further, the peel strength between the contrast layer and the photoconductive layer is 50N/cm or more ² 。

Further, a ratio of a thickness of the photoconductive layer to a thickness of the contrast layer is 1.5 or more and 5 or less.

Further, the photoconductive layer has a thickness of 7-200 μm and the contrast layer has a thickness of 5-60 μm.

Further, the photoconductive layer includes a first curing material including at least one of a photo-curing composition, a thermal curing composition, or a photo-thermal dual curing composition; the contrast layer includes a second cured material including at least one of a photo-cured composition, a thermal cured composition, or a photo-thermal dual-cured composition.

Further, the laminated body further comprises a supporting layer, wherein the supporting layer is arranged between the light guiding layer and the contrast layer, is arranged on one side of the light guiding layer far away from the contrast layer or on one side of the contrast layer far away from the light guiding layer, and the thickness of the supporting layer is 8-50 mu m.

Further, the laminate further comprises a release layer, wherein the release layer is arranged on one side far away from the light guide layer or one side far away from the contrast layer, and the thickness of the release layer is 5-50 mu m.

The embodiment of the application also provides a preparation method of the laminated body, which is used for preparing any laminated body; the preparation method comprises one of the steps of (I) or (II); coating lining layer glue solution and photoconductive layer glue solution on a substrate layer in sequence, and preparing a laminated body through heat treatment; coating lining layer glue solution on a substrate layer and performing heat treatment to form a lining layer, and pressing a photoconductive layer onto the lining layer or the side, far away from the lining layer, of the substrate layer to prepare a laminated body.

Further, the method (I) specifically comprises the steps of coating lining layer glue solution on a substrate layer, performing heat treatment at 65-85 ℃ for 1-10min, coating light guide layer glue solution, and performing heat treatment at 80-100 ℃ for 10-20min to obtain a laminated body; the method (II) specifically comprises the steps of coating a lining layer glue solution on a substrate layer, performing heat treatment at 80-100 ℃ for 10-20min to form a lining layer, and pressing a photoconductive layer onto the lining layer or the side, far away from the lining layer, of the substrate layer to prepare a laminated body.

The embodiment of the application also provides a packaging structure, which comprises at least one light-emitting unit and a packaging layer arranged on the light-emitting unit; the encapsulation layer is formed from any of the above-described laminates or a laminate prepared by any of the above-described preparation methods; the light-emitting unit comprises a substrate and a light-emitting device arranged on the substrate, the packaging layer comprises a light guide part and a lining part, the lining part is arranged on the periphery of the light-emitting device, and the light guide part is arranged on one side, far away from the substrate, of the light-emitting device.

Further, the methodThe adhesion between the lining part and the substrate is 80N/cm or more ² The adhesion between the lining part and the light guide part is 80N/cm or more ² 。

The embodiment of the application also provides a preparation method of the packaging structure, which is used for preparing any packaging structure; the preparation method specifically comprises the steps of pressing: attaching the laminated body to a plate provided with a light-emitting unit, and pressing for 30-120s at a temperature of 30-65 ℃ and a pressure of 1-10atm to form a display module; exposure: the display module is arranged at 400-6000mJ/cm ² Exposing at 100-200deg.C for 15-90min; cutting: and cutting the exposed display module to obtain the packaging structure.

The present application provides a laminate having a high glass transition temperature and a high rigidity, and being less likely to deform after dicing. The package structure formed by the package stack is smoother after cutting.

Drawings

FIG. 1 is a schematic cross-sectional view of a laminate according to one embodiment of the present application;

FIG. 2 is a schematic cross-sectional view of a laminate according to another embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of a laminate according to another embodiment of the present application;

FIG. 4 is a schematic cross-sectional view of a laminate according to another embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of a laminate according to another embodiment of the present application;

FIG. 6 is a schematic cross-sectional view of a package structure according to an embodiment of the present application;

FIG. 7 is a schematic cross-sectional view of a package structure according to another embodiment of the present disclosure;

FIG. 8 is a schematic cross-sectional view of a package structure according to another embodiment of the present disclosure;

fig. 9 is a schematic diagram of a method for manufacturing a package structure according to another embodiment of the present application.

In the figure: laminate 100, photoconductive layer 11, contrast layer 12, support layer 13, release layer 14; package structure 200, light emitting unit 21, substrate 211, light emitting device 212, package layer 22, light guide portion 221, contrast portion 222, and support portion 223; a light emitting module 300.

Detailed Description

In order to make the technical solution of the present application better understood by those skilled in the art, the technical solution of the specific embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application.

Embodiments of the present application provide a stack 100 for MIP encapsulation as shown in fig. 1. The laminate 100 includes a photoconductive layer 11 and a lining layer 12, and the lining layer 12 is provided on one side of the photoconductive layer 11. The light guiding layer 11 can transmit light, protect and homogenize light, and the contrast layer 12 can improve contrast. After passing 1000mJ/cm ² After energy irradiation and treatment at 150 ℃ for 60min, the glass transition temperature of the photoconductive layer 11 is 40 ℃ or higher. Preferably, the glass transition temperature of the photoconductive layer 11 is 45 ℃ or higher. More preferably, the glass transition temperature of the photoconductive layer 11 is 50 ℃ or higher. Further preferably, the glass transition temperature of the photoconductive layer 11 is 55 ℃ or higher. Still further preferably, the glass transition temperature of the photoconductive layer 11 is 60 ℃ or higher. Under the same temperature condition, the film layer with low glass transition temperature is more flexible, the fracture plastic shearing state is correspondingly changed, the pulling phenomenon is easy to occur during cutting, the boundary between the shearing belt and the fracture belt is fuzzy, secondary shearing and repeated extrusion are carried out, and the end face is rough; in the case of a multilayer film, secondary shearing and repeated extrusion in the cutting process of the upper film can lead to uneven end surfaces of the lower film, and thus uneven cutting of the whole film is caused. The laminate 100 is subjected to light irradiation or heat treatment during packaging, and is subjected to a heat treatment of 1000mJ/cm ² After energy irradiation and treatment at 150 ℃ for 60min, the glass transition temperature of the photoconductive layer 11 is 40 ℃ or higher, so that the cut end face of the encapsulation layer formed by the laminate 100 can be ensured to be flat. When the laminate 100 encapsulates the light emitting device, the light guiding layer 11 is mostly located above the light emitting device for major protection, the thickness of the light guiding layer 11 is usually greater than the thickness of the contrast layer 12, and the cut-off knife is contacted first during the cutting process, thus improving the cutting of the light guiding layer 11The flatness of the rear end face can significantly improve the flatness of the laminate 100 at the cut rear end face.

As an alternative embodiment, the ratio of the thickness of the photoconductive layer 11 to the thickness of the contrast layer 12 is 1.5 or more and 5 or less. After the light emitting device is packaged by the laminate 100, the photoconductive layer 11 is generally disposed on the outermost layer, and mainly plays a role in protecting the light emitting device and homogenizing light, and the contrast layer 12 mainly plays a role in improving contrast, so that the packaged light emitting device is better protected, and the contrast, brightness and thinness are simultaneously achieved, and the thickness of the photoconductive layer 11 is generally greater than that of the contrast layer 12. Preferably, the ratio of the thickness of the photoconductive layer 11 to the thickness of the contrast layer 12 is 1.6 or more and 5 or less. More preferably, the ratio of the thickness of the photoconductive layer 11 to the thickness of the contrast layer 12 is 1.7 or more and 4.8 or less. It is further preferable that the ratio of the thickness of the photoconductive layer 11 to the thickness of the contrast layer 12 is 1.8 or more and 4.5 or less. Still further preferably, the ratio of the thickness of the photoconductive layer 11 to the thickness of the contrast layer 12 is 1.9 or more and 4.2 or less. Still more preferably, the ratio of the thickness of the photoconductive layer 11 to the thickness of the contrast layer 12 is 2.0 or more and 4.0 or less.

As an alternative embodiment, the thickness of the light guiding layer 11 is 7-200 μm. Preferably, the photoconductive layer 11 has a thickness of 15-200 μm. More preferably, the photoconductive layer 11 has a thickness of 25 to 180 μm. It is further preferred that the thickness of the photoconductive layer 11 is 50-150 μm. The thickness of the light guiding layer 11 is 7-200 μm, which enables to ensure a good encapsulation of the light guiding layer 11. The thickness of the contrast layer 12 is 5-60 μm. Preferably, the thickness of the contrast layer 12 is 8-55 μm. More preferably, the thickness of the contrast layer 12 is 10-50 μm. It is further preferred that the thickness of the contrast layer 12 is 15-45 μm. Still further preferably, the thickness of the contrast layer 12 is 20-40 μm. Other things being equal, the thickness of the contrast layer 12 determines the blackness of the contrast layer 12. Too thin a contrast layer 12 may result in insufficient blackness, affecting its contrast, and at the same time, the contrast layer 12 may not adequately and smoothly fill the gap of the light emitting device when packaged. Too thick a contrast layer 12 may cause the contrast layer 12 to block the light emitting device, affect display brightness, and increase packaging cost.

As an alternative to practiceEmbodiments, 1000mJ/cm ² After energy irradiation and treatment at 150 ℃ for 60min, the contrast layer 12 satisfies at least one of the following conditions (i) or (ii);

the condition (I) is that the glass transition temperature of the contrast layer 12 is 40 ℃ or higher;

the condition (II) is that the surface hardness of the lining layer 12 is 2H or more.

As an alternative embodiment, the process is carried out at 1000mJ/cm ² After the irradiation with energy and the treatment at 150 ℃ for 60 minutes, the glass transition temperature of the contrast layer 12 is 40 ℃ or higher, preferably 45 ℃ or higher, more preferably 50 ℃ or higher, still more preferably 55 ℃ or higher, and still more preferably 60 ℃ or higher. The glass transition temperature of the lining layer 12 is high, so that phenomena such as burrs and the like on the cut end face of the lining layer 12 can be prevented, the cut end face of the lining layer 12 is smoother, and the flatness of the cut end face of the laminated body 100 is further improved.

As an alternative embodiment, the process is carried out at 1000mJ/cm ² After energy irradiation and treatment at 150 ℃ for 60min, the surface hardness of the lining layer 12 is 2H or more. The contrast layer 12 is typically placed on the bottom. When the hardness of the backing layer 12 is too low, a small deformation occurs due to the action of the cutting force, and the contact position between the cutting blade and the photoconductive layer 11 cannot be always maintained flush, so that burrs are generated on the cut end face of the laminate 100. The surface hardness of the lining layer 12 is greater than or equal to 2H, so that the lining layer 12 can be ensured to have enough hardness, the contact position of the cutting blade and the photoconductive layer 11 can be kept flush, and the flatness of the end face of the laminated body 100 after cutting can be improved.

As an alternative embodiment, the peel strength between the photoconductive layer 11 and the contrast layer 12 is 50N/cm or more ² . The light guiding layer 11 and the lining layer 12 have high adhesion, so that the structure of the laminated body 100 can be ensured to be more stable, and delamination is not easy to occur under the condition of external force. The high peel strength between the photoconductive layer 11 and the contrast layer 12 also prevents the laminate 100The offset of the cutter blade contact position, the secondary shearing, etc. caused by delamination during cutting reduce the possibility of burrs generated after cutting the laminate 100, and improve the flatness of the cut end face of the laminate 100. Preferably, the peel strength between the photoconductive layer 11 and the contrast layer 12 is 55N/cm or more ² . More preferably, the peel strength between the photoconductive layer 11 and the contrast layer 12 is 60N/cm or more ² . Further preferably, the peel strength between the photoconductive layer 11 and the contrast layer 12 is 65N/cm or more ² . Still further preferably, the peel strength between the photoconductive layer 11 and the contrast layer 12 is 70N/cm or more ² . Still more preferably, the peel strength between the photoconductive layer 11 and the contrast layer 12 is 75N/cm or more ² . Still further preferably, the peel strength between the photoconductive layer 11 and the contrast layer 12 is 80N/cm or more ² 。

As an alternative embodiment, the photoconductive layer 11 may be colorless or gray, the colorless photoconductive layer 11 may make the light transmitted bright and clear, and the gray photoconductive layer 11 may make the light softer. The contrast layer 12 may be black or other dark colors having a black value greater than the light guiding layer 11. The contrast layer 12 is used to enhance contrast and to make the color of the light more vivid.

As an alternative embodiment, the light transmittance of the light guiding layer 11 is greater than the light transmittance of the contrast layer 12, and the difference between the light transmittance of the light guiding layer 11 and the light transmittance of the contrast layer 12 is 70% or more. Preferably, the difference between the light transmittance of the light guiding layer 11 and the light transmittance of the contrast layer 12 is 75% or more. More preferably, the difference between the light transmittance of the light guiding layer 11 and the light transmittance of the contrast layer 12 is 80% or more. Further preferably, the difference between the light transmittance of the light guiding layer 11 and the light transmittance of the contrast layer 12 is 85% or more. The light transmittance of the photoconductive layer 11 and the light transmittance of the contrast layer 12 have a certain difference, so that contrast, uniform luminosity and brightness can be considered, and the user's look and feel can be improved.

As an alternative embodiment, the light transmittance of the light guiding layer 11 is 80% or more and the light transmittance of the contrast layer 12 is 10% or less. When packaged, the photoconductive layer 11 is arranged above the light emitting devices, and the lining layer 12 is arranged at the gaps between the adjacent light emitting devices. Preferably, the light transmittance of the light guiding layer 11 is 85% or more. More preferably, the light transmittance of the light guiding layer 11 is 90% or more. Further preferably, the light transmittance of the light guiding layer 11 is 95% or more. The light guiding layer 11 has better light transmission effect, so that the light transmitted through the light guiding layer 11 is clear and bright, the loss of the light in the transmission process is reduced, and the energy consumption is reduced. The transmittance of the contrast layer 12 is 10% or less. Preferably, the transmittance of the contrast layer 12 is 9% or less. More preferably, the transmittance of the contrast layer 12 is 8% or less. Further preferably, the transmittance of the contrast layer 12 is 7% or less. Still further preferably, the transmittance of the contrast layer 12 is 6% or less. Still more preferably, the transmittance of the contrast layer 12 is 5% or less. The low transmittance of the contrast layer 12 can prevent light from being transmitted between adjacent light emitting devices, and can better improve the contrast, make the contrast of patterns stronger, reduce "Buddha light" and "halation", etc.

As an alternative embodiment, the photoconductive layer 11 includes a first cured material including at least one of a photo-cured material, a thermosetting material, or a photo-thermal dual-cured material.

As an alternative embodiment, the contrast layer 12 includes a second cured material including at least one of a photo-cured material, a thermally cured material, or a photo-thermal dual-cured material. The materials of the contrast layer 12 and the photoconductive layer 11 are selected independently of each other and may be the same or different.

As an alternative embodiment, the photocurable material includes a material which undergoes a curing reaction upon irradiation with light to make it insoluble in an organic solvent, and may be at least one of a composition containing a photoacid generator and an alkali-soluble resin, or a composition containing a photopolymerization initiator and an alkali-soluble resin, etc., and an alkali-soluble resin such as a carboxyl-containing resin including at least one of an acrylic resin and an alkali-soluble polyimide resin. Preferably, the alkali-soluble resin in the above composition is 100 parts by mass and the photoacid generator, photobase generator or photopolymerization initiator is 0 to 8 parts by mass.

As an alternative embodiment, the thermosetting material may use a composition containing a thermally reactive compound such as at least one of an epoxy resin, a peroxide-based crosslinking agent, an isocyanate-based thermosetting agent, or a triazine-based compound, and a host resin, the epoxy resin including at least one of a bisphenol-type epoxy resin, a biphenyl-type epoxy resin, a novolac-type epoxy resin, an epoxy resin containing a naphthalene ring, or an alicyclic-type epoxy resin; the bisphenol type epoxy resin is selected from at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin or bisphenol S type epoxy resin; the phenolic epoxy resin is selected from at least one of phenolic epoxy resin or phenolic epoxy resin; the isocyanate-based thermosetting agent includes an aromatic diisocyanate and its isomers, a polymer, an aliphatic diisocyanate, an alicyclic diisocyanate and its isomers, and the like, and specifically, the isocyanate-based thermosetting agent includes at least one of an aromatic diisocyanate and its isomers, such as 4,4' -diphenylmethane diisocyanate, toluene diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, biphenyl diisocyanate, diphenyl sulfone diisocyanate, diphenyl ether diisocyanate, and the like, an aliphatic diisocyanate such as hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane diisocyanate, xylylene diisocyanate, or the like, or an alicyclic diisocyanate and its isomer obtained by hydrogenating the aromatic diisocyanate, or other general-purpose diisocyanates. Peroxide-based crosslinking agents include 1, 1-bis (t-butylperoxy) -3, 5-trimethylcyclohexane, 2, 5-dimethylhexane-2, 5-di-t-butylperoxide, 2, 5-dimethyl-2, 5-bis (benzoyl-peroxy) -hexane, dicumyl peroxide, bis (2-t-butylperoxy isopropyl) benzene, t-butylcumyl peroxide, di-t-butyl peroxide, t-amyl perbenzoate, 2-bis (t-amyl peroxy) -butane, di-t-amyl peroxide, t-butyl peroxybenzoate, t-butyl peroxy-2-ethylhexanoate, t-butyl peroxy-3, 5-trimethylhexanoate, dibenzoyl peroxide, bis (4-chlorobenzoyl) peroxide, bis (2, 4-dichlorobenzoyl) peroxide, bis (4-methylbenzoyl) peroxide, n-butyl-4, 4-bis (t-butyl peroxy) valerate, ethyl-3, 3-bis (t-butyl peroxy) butyrate, t-butyl peroxy-isopropyl carbonate, t-butyl peroxy-2-hexyl carbonate, ortho-tertiary butyl-ortho-isopropyl-mono-peroxycarbonate, ortho-tertiary butyl-ortho- (2-ethylhexyl) -mono-peroxycarbonate, ortho, at least one of ortho-tertiary amyl-ortho- (2-ethylhexyl) -mono-peroxycarbonate. The host resin may be selected from an alkali-soluble resin or a polyolefin resin including at least one of ethylene-vinyl acetate copolymer, copolymer of ethylene and alpha olefin, and polyvinyl butyral. Preferably, the composition contains 100 parts by mass of the main resin and 5 to 20 parts by mass of the thermally reactive compound.

As an alternative embodiment, the photo-thermal dual curing material may be selected from a composition containing an alkali-soluble resin, a thermally reactive compound, a photo-acid generator, or a composition containing an alkali-soluble resin, a thermally reactive compound, a photo-polymerization initiator. Preferably, the alkali-soluble resin in the above composition is 100 parts by mass, the thermally reactive compound is 5 to 20 parts by mass, and the photoacid generator, photobase generator or photopolymerization initiator is 0 to 8 parts by mass.

The above-mentioned photo-curing material, thermosetting material or photo-thermal dual curing material may further include a compound having an ethylenically unsaturated bond as a diluent and a monomer of the curing reaction. Compounds having ethylenic unsaturation include, but are not limited to, monofunctional acrylates, monofunctional methacrylates, difunctional acrylates, difunctional methacrylates, trifunctional acrylates, trifunctional methacrylates, multifunctional acrylates or multifunctional methacrylates, specifically, such as ethoxyphenol acrylate, ethoxyphenol methacrylate, stearic acid acrylate, ethoxynonylphenol methacrylate, propoxynonylphenol acrylate, propoxynonylphenol methacrylate, ethoxytetrahydrofurfuryl acrylate, ethoxytetrahydrofurfuryl methacrylate, propoxytetrahydrofurfuryl acrylate, propoxytetrahydrofurfuryl methacrylate, 1, 6-hexanediol diacrylate, tricyclodecanedimethanol diacrylate, dioxane glycol diacrylate, ethoxylated bisphenol A dimethacrylate, propoxylated bisphenol A diacrylate, propoxylated bisphenol A dimethacrylate, polyethylene glycol (400) diacrylate, polypropylene glycol (600) diacrylate, ethoxytrimethylolpropane triacrylate, ethoxytrimethylolpropane trimethacrylate, propoxylated trimethylolpropane trimethacrylate, pentaerythritol triacrylate, tris (2-hydroxyethyl) isocyanurate triacrylate, dipentaerythritol hexaacrylate, ethoxylated pentaerythritol tetraacrylate or dipentaerythritol hexaacrylate, and the like, the compound having an ethylenically unsaturated bond is preferably added in an amount of 10 to 50 parts by mass. Further, the photo-setting material, the thermosetting material or the photo-thermal dual-setting material may further contain pigments, fillers and other additives such as a color developer, a plasticizer, a defoaming agent, a polymerization inhibitor, an antioxidant and the like.

In order to adjust the glass transition temperature of the photoconductive layer 11 and the contrast layer 12 after being treated under specific conditions, it is possible to cut in from the aspects of flexibility of molecular chains, branching degree of molecular chains, steric hindrance of substituents, molecular weight, crosslinking density, plasticizer content, and the like. The percentage of alkali-soluble resin or polyolefin resin is more than 50wt% of the composition, which determines the physicochemical properties of the film layer as a whole, and improving alkali-soluble resin or polyolefin resin is the most effective way to improve the glass transition temperature of each layer of the laminate 100. In view of coatability, toughness and mechanical strength, the weight average molecular weight of the alkali-soluble resin or polyolefin resin is preferably 1000 to 100000, and in this range, if the glass transition temperature is too low, the weight average molecular weight can be appropriately increased without affecting coatability and flexibility, or an alkali-soluble resin or polyolefin resin having a higher branching degree, having a long-chain branch, having a side group with greater steric hindrance can be selected. In order to reduce the possibility of yellowing, the alkali-soluble resin or polyolefin resin, the thermally reactive compound and the compound having an ethylenically unsaturated bond in the composition are generally preferably compounds not containing an aromatic ring structure, but in order to raise the glass transition temperature, the alkali-soluble resin or polyolefin resin containing an aromatic ring, the thermally reactive compound and the compound having an ethylenically unsaturated bond may be appropriately selected.

From the viewpoint of the degree of crosslinking, the amount of the thermally reactive compound or the compound having an ethylenic unsaturated bond (in the case of a photocurable material or a photothermal dual-curable material) to be added may be increased, and a thermally reactive compound having a larger number of functional groups, such as an epoxy resin having a functionality of more than two, may be selected, and the epoxy equivalent of the epoxy resin in the composition is generally 50 to 350g/eq. And the softening point is 40 to 200. The glass transition temperature may be increased by selecting an epoxy resin having an epoxy equivalent or a softening point higher in this range. When the composition contains a compound having an ethylenically unsaturated bond, the double bond equivalent thereof is generally 100 to 600g/mol, and the selection of a compound having a higher double bond equivalent or higher functionality in this range is advantageous in increasing the crosslinking point density and thus the glass transition temperature. The alkali-soluble resin is generally carboxyl-containing resin, and carboxyl reacts with epoxy groups to generate a crosslinked structure in the thermal reaction process; the acid value of the alkali-soluble resin is generally 10 to 120mgKOH/g, and in this range, a type having a higher acid value may be selected in order to improve the degree of crosslinking.

Adjusting the plasticizer content is the most convenient way to improve the glass transition temperature of each layer of the laminate 100, and if the glass transition temperature is too low, the amount of plasticizer added can be appropriately reduced; however, if the amount of plasticizer to be added is reduced to such an extent that it is difficult to apply and process, it is considered that the glass transition temperature is adjusted from another angle, and the plasticizer content cannot be excessively reduced.

The photo-curing material, the heat-curing material or the photo-thermal dual-curing material can be subjected to curing reaction under the light and/or heat conditions in the packaging process, and the curing before use can improve the hardness, the mechanical strength and the surface flatness of the lining layer 12 and the light guide layer 11, reduce the number of internal active groups and improve the reliability and the ageing resistance. If the light-emitting device is cured when leaving the factory, the light-emitting device is easy to damage and turn off when in laminated contact with the light-emitting device due to overlarge hardness; and the peel strength with the substrate cannot meet the requirement, and the processability is poor.

As an alternative embodiment, as shown in fig. 2, the laminate 100 further includes a support layer 13, where the support layer 13 is disposed between the light guiding layer 11 and the contrast layer 12 (as shown in fig. 2), on a side of the light guiding layer 11 away from the contrast layer 12 (as shown in fig. 3), or on a side of the contrast layer 12 away from the light guiding layer 11 (as shown in fig. 4). The support layer 13 can protect the light emitting device and improve the hardness and flatness of the laminate 100. When the support layer 13 is arranged above the light emitting device during packaging, the support layer can be a transparent layer, and the packaging layer is ensured to have better light transmittance. The thickness of the supporting layer 13 is 8-50 μm, and the thickness of the supporting layer 13 is more preferably 10-40 μm, so that the supporting layer 13 is thinner and has better protection and supporting capability.

As an alternative embodiment, as shown in fig. 5, the laminate 100 further includes a release layer 14, where the release layer 14 is disposed at least one of on a side far from the light guiding layer 11 or on a side far from the lining layer 12, and the release layer 14 is disposed on an outermost layer of the laminate 100, so that scraping of the light guiding layer 11 or the lining layer 12 of the laminate 100 during transportation can be prevented, and the yield of the laminate 100 is improved. The release layer 14 also ensures that the stack 100 between adjacent layers does not stick to each other while the stack 100 is stored. When the laminate 100 is used for packaging, the release layer 14 on the surface of the laminate 100 is removed, and a flat laminate 100 without scratches can be obtained. The thickness of the release layer 14 is 5-50 μm, so that the release layer 14 has better protection capability.

The present embodiment provides a method for producing the laminate 100, which is used to produce any one of the above-described laminate 100. The preparation method specifically comprises one of the following method (I) or method (II);

the method (I) comprises the steps of coating lining layer 12 glue solution and photoconductive layer 11 glue solution on a substrate layer in sequence, and performing heat treatment to obtain a laminated body 100;

the method (II) comprises coating the substrate layer with the adhesive solution of the contrast layer 12 and performing heat treatment to form the contrast layer 12, and pressing the photoconductive layer 11 onto the contrast layer 12 or the side of the substrate layer away from the contrast layer 12 to obtain the laminated body 100.

The method (I) specifically comprises coating the substrate layer (or supporting layer 13) with the lining layer 12 glue solution, and heat treating at 65-85deg.C for 1-10min. And coating the glue solution of the photoconductive layer 11 on the side of the substrate layer coated with the glue solution of the contrast layer 12 or the side of the substrate layer not coated with the glue solution of the contrast layer 12, and performing heat treatment at 80-100 ℃ for 10-20min to form the photoconductive layer 11.

The method (II) specifically comprises the steps of coating the substrate layer with the lining layer 12 glue solution, and performing heat treatment at 80-100 ℃ for 10-20min to form the lining layer 12. And then sequentially pressing the rest layers (such as the light guide layer 11, the supporting layer 13 or the release layer 14) to one side of the lining layer 12 or the substrate layer far away from the lining layer 12, so as to complete the preparation of the laminated body 100.

In the preparation process of the laminated body 100, stress exists in the film layer due to uneven glue solution coating or uneven solvent volatilization in the drying process, so that the response of different positions of the laminated body 100 to external force is different in the slitting process, and uneven cutting end surfaces of the laminated body 100 can be caused. The base material layer may be a support layer 13, and may increase the hardness of the laminate 100 after being prepared between the photoconductive layer 11 and the contrast layer 12. The substrate layer may also be a release layer 14 that remains on the surface of the laminate 100 after preparation to prevent scratching of the interior of the laminate 100. The substrate layer can also adopt a conventional carrier such as a glass substrate and the like, and is only used as a substrate for preparation, and the substrate layer is removed after the preparation is completed.

The embodiment of the application provides a package structure 200 as shown in fig. 6, where the package structure 200 includes at least one light emitting unit 21 and a package layer 22 disposed on the light emitting unit 21. The package structure 200 may include only one light emitting unit 21 (shown in fig. 7) or may include a plurality of light emitting units 21 (shown in fig. 6). The encapsulation layer 22 is formed from any of the laminates 100 described above or from a laminate 100 prepared by any of the methods of preparation described above. The light emitting unit 21 includes a substrate 211 and a light emitting device 212 provided on the substrate 211. The encapsulation layer 22 includes a light guide portion 221 and a contrast portion 222, the light guide layer 11 of the stack 100 forming the light guide portion 221 of the encapsulation layer 22, and the contrast layer 12 of the stack 100 forming the contrast portion 222 of the encapsulation layer 22. The lining portion 222 is connected to the substrate 211 and disposed around the light emitting device 212. The light guide 221 is disposed at one side of the light emitting unit 21, and the light guide 221 may be directly connected to the contrast portion 222 and the light emitting device 212.

As an alternative embodiment, as shown in fig. 8, the encapsulation layer 22 may further include a support 223. The support portion 223 is formed by the support layer 13 of the laminate 100. The support portion 223 is provided between the light guide portion 221 and the contrast portion 222, or may be provided on a side of the light guide portion 221 away from the contrast portion 222, or may be provided on a side of the contrast portion 222 away from the light guide portion 221.

As an alternative embodiment, the thickness of the encapsulation layer 22 is less than or equal to 3 μm, so that the encapsulation material has better flatness, and the encapsulation structure 200 has better light emitting effect. The height of the light emitting device 212 is greater than or equal to the thickness of the contrast portion 222, so that the contrast portion 222 does not shade the light emitting device 212, and the package structure 200 has higher light emitting intensity.

As an alternative embodiment, the adhesion between the contrast portion 222 and the substrate 211 is 80N/cm or more ² . When the supporting portion 223 is not present in the package material, the adhesion between the contrast portion 222 and the light guiding portion 221 is 80N/cm or more ² More preferably 85N/cm or more ² 、90N/cm ² 、95N/cm ² 100N/cm ² . When the supporting portion 223 is included in the package material, the adhesion between the lining portion 222 and the supporting portion 223 is 80N/cm or more ² The structure between the packaging layers and between the packaging layer 22 and the light-emitting unit 21 is ensured to be stable, the packaging layers are not easy to separate, and the packaging reliability is improved; prevent the cutter blade contact position deviation, secondary shearing and the like caused by delamination during cutting, and improve the flatness of the cutting end face.

The embodiment of the application provides a method for preparing a packaging structure 200, which is used for preparing the packaging structure 200. The manufacturing method of the package structure 200 is shown in fig. 9, and the manufacturing method specifically includes pressing, exposing and cutting. The lamination is performed to attach the laminate 100 to a board provided with the light emitting device 212 in such a manner that the lining layer 12 is close to the light emitting module. When the release layer 14 is provided on the surface of the laminate 100, the release layer 14 on the surface is removed and then bonded. Laminating at 30-65deg.C under 1-10atm and 30-120s to form display module 300. After lamination, the display module 300 is exposed with the exposure energy of 400-6000mJ/cm ² . Finally, the display module 300 is packaged after being placed for 15-90min at the temperature of 100-200 ℃. And cutting the cut sheet material with the light-emitting units 21 according to the requirements to obtain the packaging structure 200 with smoother cut end surfaces and no burrs.

The present application is further described below with reference to examples, but the scope of protection of the present application is not limited to the examples.

Examples and comparative examples were set up according to tables 1 and 2 below.

Table 1: examples table

Table 2: examples and comparative examples tables

In the table 1 and the table 2,

a1: acid-modified epoxy acrylate resin (Japanese chemical Co., ltd., ZFR-1401H, bisphenol F, 60% in solid content, acid value 98 mgKOH/g);

a2: acrylate resin (cellophane cyclodextrin P (ACA) Z250, solid content 45%, acid value 70 mgKOH/g);

a3: ethylene-vinyl acetate resin (dupont EVA240, VA content 28%, molecular weight 5000); b1: cresol novolac type epoxy resin (DIC EPICLON N-660, epoxy equivalent 202-212 g/eq); b2: bisphenol A type epoxy resin (Japanese epoxy resin jER828, epoxy equivalent 184-194 g/eq); b3: ortho, ortho-tertiary amyl-ortho- (2-ethylhexyl) -mono-peroxycarbonate (Guangzhou Liben (giant dragon) rubber raw materials trade Co., ltd.);

c1:2,2', 4-tris (2-chlorophenyl) -5- (3, 4-dimethoxyphenyl) -4',5 '-diphenyl-1, 1' -diimidazole (a strong electron in the constant state);

c2: 9-phenylacridine (Shanghai ladder loving chemical industry);

d1: poly (propylene glycol) diacrylate (microphone, double bond equivalent 527 g/mol);

d2: propoxylated trimethylolpropane tri (propyl) acrylate (sartomer, double bond equivalent 213 g/mol); e1: plasticizer-p-methylbenzenesulfonamide (Shanghai ladder loving chemical industry);

f1: carbon black-MA 7 (Mitsubishi Japanese).

1. Performance test:

the same light emitting module was packaged with the stacks of the examples and comparative examples, respectively, and the packaged package structure was subjected to performance test.

1. Peel strength: test methods reference standard GB/T2790 test method for 180℃peel strength of Adhesives Flexible vs. rigid Material. Sample size: 100mm x 100mm; stretching speed: 100mm/min.

2. Thickness tolerance value: the maximum and minimum thickness values were measured by a metallographic microscope and the difference values were recorded.

3. Flatness of the cut end face: flatness of a cut surface is observed through a metallographic microscope and can be classified into three grades: c: the cutting face contains burr fracture, B: the cutting surface has no burr fracture, contains ripple fracture, A: the cutting surface has no burrs and ripples, and the whole body is smooth.

4. Glass transition temperature: the laminate sample was subjected to 1000mJ/cm using a differential scanning calorimeter (U.S. TA-Q20 a) ² Energy irradiation and treatment at 150deg.C for 60min, and peeling; about 5mg of the peeled photoconductive layer/contrast layer was weighed, and the resultant was placed in a DSC crucible and tested at a temperature rise rate of 10℃per minute, and a glass transition temperature value was obtained by DSC self-contained analysis software.

5. Surface hardness: test methods are referred to the standard GB6739-86 pencil test for hardness of coating film.

2. Test results

The results of the performance tests of the examples and comparative examples are shown in Table 3.

Table 3: test results

As can be seen from the table, the glass transition temperature of the laminate of comparative example 1 after treatment was less than 40℃and the flatness of the cut end face after encapsulation was poor, as can be seen from comparison of comparative example 1 with examples 1 to 11. The laminate in example 7 resulted in lower glass strength of the photoconductive layer and the liner layer after encapsulation due to lower interlayer peel strength before encapsulation, but the flatness of example 7 was still due to the comparative example.

The laminates of different materials and structures in examples 1-11 all had sufficient peel strength, less burrs and ripples on the cut end surfaces after encapsulation, high flatness, and higher yields.

It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.

Claims

1. A stack for MIP encapsulation, comprising:

a light guiding layer;

the lining layer is arranged on one side of the light guide layer;

through 1000mJ/cm ² After energy irradiation and treatment at 150 ℃ for 60min, the glass transition temperature of the light guiding layer is more than or equal to 40 ℃.

2. The laminate of claim 1, wherein:

through 1000mJ/cm ² After energy irradiation and treatment at 150 ℃ for 60min, the contrast layer satisfies at least one of the following conditions (i) or (ii);

the condition (I) is that the glass transition temperature of the contrast layer is more than or equal to 40 ℃;

and (2) the condition (II) is that the surface hardness of the lining layer is more than or equal to 2H.

3. The laminate of claim 1, wherein:

the peel strength between the lining layer and the photoconductive layer is 50N/cm or more ² 。

4. The laminate of claim 1, wherein:

the ratio of the thickness of the photoconductive layer to the thickness of the contrast layer is 1.5 or more and 5 or less;

preferably, the photoconductive layer has a thickness of 7-200 μm and the contrast layer has a thickness of 5-60 μm.

5. The laminate of claim 1, wherein:

the photoconductive layer includes a first cured material including at least one of a photo-curable composition, a thermal curable composition, or a photo-thermal dual curable composition;

the contrast layer includes a second cured material including at least one of a photo-cured composition, a thermal cured composition, or a photo-thermal dual-cured composition.

6. A method of producing a laminate, characterized by:

the production method for producing the laminate according to any one of claims 1 to 7;

the preparation method specifically comprises one of the following method (I) or method (II);

coating lining layer glue solution and photoconductive layer glue solution on a substrate layer in sequence, and preparing the laminated body through heat treatment;

the method (II) comprises the steps of coating a lining layer glue solution on a substrate layer and performing heat treatment to form a lining layer, and then laminating the photoconductive layer on the lining layer or the side, away from the lining layer, of the substrate layer to obtain the laminated body.

7. The method of manufacturing according to claim 6, wherein:

the method (I) specifically comprises the steps of coating the lining layer glue solution on the substrate layer, carrying out heat treatment for 1-10min at 65-85 ℃, coating the photoconductive layer glue solution, and carrying out heat treatment for 10-20min at 80-100 ℃ to obtain the laminated body;

the method (II) specifically comprises the steps of coating the lining layer glue solution on the substrate layer, forming the lining layer by heat treatment for 10-20min at the temperature of 80-100 ℃, and then laminating the photoconductive layer on the lining layer or on the side, far away from the lining layer, of the substrate layer to obtain the laminated body.

8. A package structure, characterized in that:

the packaging structure comprises at least one light-emitting unit and a packaging layer arranged on the light-emitting unit;

the encapsulation layer is formed from the laminate according to any one of claims 1 to 5 or the laminate produced by the production method according to any one of claims 6 to 7;

the light-emitting unit comprises a substrate and a light-emitting device arranged on the substrate, the packaging layer comprises a light guide part and a lining part, the lining part is arranged around the light-emitting device, and the light guide part is arranged on one side, far away from the substrate, of the light-emitting device.

9. The package structure of claim 8, wherein:

the adhesion between the lining part and the substrate is 80N/cm or more ² The adhesion between the lining part and the light guide part is 80N/cm or more ² 。

10. A preparation method of a packaging structure is characterized by comprising the following steps:

the manufacturing method is used for manufacturing the packaging structure according to any one of claims 8 to 9;

the preparation method specifically comprises the steps of,

pressing: attaching the laminated body to a plate provided with the light emitting unit, and pressing for 30-120s at a temperature of 30-65 ℃ and a pressure of 1-10atm to form a display module;

exposure: the display module is arranged at 400-6000mJ/cm ² Exposing at 100-200deg.C for 15-90min;

cutting: and cutting the exposed display module to obtain the packaging structure.