CN117825411B - Electroplating defect detection device and detection method for electroplated PCB - Google Patents
Electroplating defect detection device and detection method for electroplated PCB Download PDFInfo
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- CN117825411B CN117825411B CN202410030670.1A CN202410030670A CN117825411B CN 117825411 B CN117825411 B CN 117825411B CN 202410030670 A CN202410030670 A CN 202410030670A CN 117825411 B CN117825411 B CN 117825411B
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- 238000001514 detection method Methods 0.000 title claims abstract description 135
- 230000007547 defect Effects 0.000 title claims abstract description 48
- 238000009713 electroplating Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000000523 sample Substances 0.000 claims description 16
- 238000007689 inspection Methods 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 7
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 27
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 27
- 230000000903 blocking effect Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
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- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
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- Food Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
The invention relates to a device and a method for detecting electroplating defects after PCB electroplating, which belong to the technical field of PCB and comprise a supporting piece, a scanning component arranged on the supporting piece and used for scanning the surface of the PCB, and a via hole detection mechanism arranged on the supporting piece, wherein the scanning component and the via hole detection mechanism are externally connected with a control system, a CCD camera is controlled by the control system to scan the PCB, collected images are fed back through a computer display screen, then a driving part is controlled by the control system to drive a positioning part to slide along the supporting piece, so that the detection part is driven to move above the via hole, finally the detection part is inserted into the via hole to detect defects in the via hole, and the problem that the defects in the via hole cannot be detected due to the fact that the CCD cannot scan the inner wall of the via hole when the PCB is scanned in the prior art.
Description
Technical Field
The invention belongs to the technical field of PCB boards, and particularly relates to a device and a method for detecting electroplating defects of a PCB board after electroplating.
Background
PCB (PrintedCircuitBoard), the Chinese name is printed circuit board, also called printed circuit board, it is an important electronic component, it is the supporting body of the electronic component, it is the provider that the electronic component is electrically connected, because it is made by adopting the electronic printing technique, so called "printed" circuit board, and PCB board usually adopts the appearance inspection machine to detect the defect of PCB board after the electroplating is finished, the appearance inspection machine obtains the accurate picture through CCD scanning based on optical image processing and computer vision recognition technology principle, then pass the computer and compare and process the circuit board scanned and judge, then divide the device according to the control signal fed back by the computer and divide and examine PCB (OK/NG) automatically, can carry on the accurate detection to the foreign matter, copper exposure, oil make-up, fish tail, gold plating bad, character error, green oil uneven, the pad is uneven, copper residue, leak printing, development, etc. appearance flaws.
However, the existing appearance inspection machine has some problems when detecting defects of the PCB: the existing appearance inspection machine can detect surface defects of a PCB by scanning the PCB through a CCD, but due to the fact that the PCB is provided with a plurality of through holes, particularly when the PCB is thicker, the CCD cannot scan the inner wall of the through holes due to the blocking of the inner wall of the through holes when the PCB is scanned, and defects in the through holes cannot be detected, so that the electroplating defect detection device and the electroplating defect detection method after electroplating of the PCB are provided.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a device and a method for detecting electroplating defects after electroplating of a PCB, and solves the problem that defects in a via cannot be detected due to the fact that CCD cannot scan the inner wall of the via due to the blocking of the inner wall of the via in the prior art when the PCB is scanned.
The aim of the invention can be achieved by the following technical scheme: the utility model provides an electroplating defect detection device after PCB board electroplates, includes support piece, sets up the scanning subassembly that is used for scanning PCB board surface on support piece and sets up the via hole detection mechanism on support piece, scanning subassembly and via hole detection mechanism all connect control system, via hole detection mechanism is including sliding location portion, detection portion and the drive division that set up on support piece, location portion and support portion form rectangular structure, location portion and external control system communication connection, drive division drive location portion slides along support piece, location portion drive detection portion moves the via hole top, makes detection portion detect the defect in the via hole.
As a further scheme of the invention, the positioning part comprises two positioning rods which are arranged on the supporting piece in a sliding way, the two positioning rods and the supporting piece form a rectangular structure, one ends of the two positioning rods are respectively arranged on the supporting piece in a sliding way, and the other ends of the two positioning rods are vertically intersected.
As a further scheme of the invention, the two positioning rods are all first electric telescopic rods, and are arranged on the supporting piece in a sliding manner through the electric sliding blocks, and the first electric telescopic rods and the electric sliding blocks are electrically connected with the control system.
As a further scheme of the invention, the detection part comprises a second electric telescopic rod which is perpendicular to one ends of the two perpendicular intersecting positioning rods and a rotatable miniature detection probe which is arranged on the second electric telescopic rod, and the miniature detection probe and the second electric telescopic rod are electrically connected with a control system.
As a further scheme of the invention, the miniature detection probe and the aperture of the detection via hole form a straight line.
As a further scheme of the invention, the miniature detection probe is provided with a buzzer.
As a further scheme of the invention, the scanning component is in communication connection with a computer display screen, and the scanning component feeds back the scanned image of the surface of the PCB through the computer display screen.
A method for detecting electroplating defects of a PCB after electroplating comprises the following steps:
S1: the method comprises the steps that through holes on the PCB positioned on the first same straight line are defined as a first detection area, through holes on the PCB positioned on the adjacent same straight line are defined as a second detection area, and the like, through Kong Huachu N detection areas on the PCB are defined;
S2: counting the number of holes on the first detection area and the second detection area respectively, wherein the number of holes on the N detection area is recorded as N1 and N2;
s3: x-rays are adopted to pass through a hole without defects, and the thickness of the hole acquired by the X-rays is recorded and is recorded as M;
s4: and adopting X rays to respectively pass through the first detection areas, recording the thickness of the X rays passing through the holes as Q1, comparing whether Q1 is equal to MN1, if not, adopting the detection part to detect the holes of the first detection areas, if so, not needing to detect the holes of the first detection areas, and the like, so as to finish the detection of the N detection areas.
As a further aspect of the present invention, the result of the X-ray detection in S3 is fed back through a computer display screen.
As a further scheme of the invention, the sizes of the through holes on the PCB selected in the step S1 are the same.
The beneficial effects of the invention are as follows:
(1) The CCD camera is controlled by the control system to scan the PCB, the acquired image is fed back through the computer display screen, then the control system is used for controlling the driving part to drive the positioning part to slide along the supporting part, so that the detection part is driven to move above the via hole, and finally the detection part is inserted into the via hole to detect the defect in the via hole, thereby solving the problem that the defect in the via hole cannot be detected because the CCD cannot be scanned due to the blocking of the inner wall of the via hole when the PCB is scanned when the PCB is thicker in the prior art;
(2) Through passing Kong Huachu N detection areas on the PCB, X rays are adopted to pass through the first detection areas respectively, holes of the first detection areas are detected by the detection parts, and the detection method can be used for detecting a plurality of holes at one time, so that the detection efficiency is greatly improved.
Drawings
The present invention is further described below with reference to the accompanying drawings for the convenience of understanding by those skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a detecting unit according to the present invention;
Description of main reference numerals:
in the figure: 1. a support; 2. a scanning assembly; 3. a via detection mechanism; 31. a positioning part; 32. a detection unit; 321. a second electric telescopic rod; 322. a miniature detection probe; 4. and a PCB board.
Detailed Description
In order to further describe the technical means and effects adopted by the invention for achieving the preset aim, the following detailed description is given below of the specific implementation, structure, characteristics and effects according to the invention with reference to the attached drawings and the preferred embodiment.
Referring to fig. 1-2, the embodiment provides a device for detecting electroplating defects of a PCB 4 after electroplating, which comprises a support member 1, a scanning assembly 2 arranged on the support member 1 and used for scanning the surface of the PCB 4, and a via hole detection mechanism 3 arranged on the support member 1, wherein the scanning assembly 2 and the via hole detection mechanism 3 are both externally connected with a control system, the scanning assembly 2 is in communication connection with a computer display screen, an image scanned by the scanning assembly 2 on the surface of the PCB 4 is fed back through the computer display screen, the scanning assembly 2 is a CCD camera, the CCD camera is used for scanning the surface of the PCB 4 so as to acquire an image, the CCD camera is also connected with an image processing system, the image processing system feeds back the acquired image to the computer display screen after processing the image, the image acquisition part is an important component of the whole system, the camera and the lens are equivalent to eyes of people in machine vision and are responsible for shooting images of objects, the image acquisition part is an important link for detecting the PCB 4 and is also the basis of detection processing, the via hole detection mechanism 3 comprises a positioning part 31, a detection part 32 and a driving part, wherein the positioning part 31 mainly aims at the holes on the PCB 4 to avoid inaccurate detection, the positioning part 31 and the supporting part form a rectangular structure, the supporting part mainly supports the positioning part 31 and the detection part 32, the positioning part 31 is in communication connection with an external control system, the driving part drives the positioning part 31 to slide along the supporting part 1, the positioning part 31 drives the detection part 32 to move above the via hole to enable the detection part 32 to detect defects in the via hole, the positioning part 31, the detection part 32 and the driving part move, are all controlled by an external control system.
When the defects of the PCB 4 are detected by adopting an appearance inspection machine after electroplating, an accurate image is obtained through CCD scanning, the scanned circuit board is processed through computer comparison and judged, then the PCB is automatically inspected by a separate device according to control signals fed back by the computer, and the defects in the through holes can not be detected due to the blocking of the inner walls of the through holes, in the embodiment, the defects in the appearance aspects such as uneven bonding pads, copper residue, printing leakage, development and the like can be accurately detected, but when the PCB 4 is provided with a plurality of through holes, the surface defects of the PCB 4 can be detected through CCD scanning when the PCB 4 is thinner, the defects in the through holes can not be detected due to the blocking of the inner walls of the through holes when the PCB 4 is scanned, in the embodiment, the defects in the through holes can not be detected, the CCD scanning can not be detected, in the through holes, in the control system is firstly, the PCB 4 is scanned, the CCD scanning is driven by the computer, and the CCD scanning is driven by the control system, and then the CCD scanning is driven by the CCD scanning is stopped by the inner walls of the CCD scanning 4, so that the defects in the through holes can not be detected, and the defects in the through holes can not be detected, and the through holes are detected by the PCB 4 when the PCB is scanned by the PCB 4.
Because when detecting the via hole on the PCB 4, the position of each via hole needs to be determined first, so that the detection portion 32 is convenient to detect, but the via hole is uneven, possibly at the edge on the PCB 4, and possibly at other positions on the PCB 4, a structure is required that can locate the via hole at any position, in which, in an embodiment, the locating portion 31 includes two locating rods slidably disposed on the support member 1, the two locating rods and the support member 1 form a rectangular structure, the two locating rods can be telescopic to locate the via hole at any position, one ends of the two locating rods are slidably disposed on the support member 1, the other ends of the two locating rods vertically intersect, the two locating rods and the support member 1 form a rectangular structure corresponding to two sides of the rectangular structure, and the other two sides slide and telescope along the two sides of the fixed rectangle, and the intersection point of the two movable rectangle sides serves as a locating center point, so as to achieve the locating.
Considering the precision of the instrument when detecting the defects of the PCB board 4, it is necessary to ensure that the two sides of the positioning portion 31 when moving need to be controlled simultaneously by the control system, in order to make the positioning portion 31 cooperate with the control system, for this, in an embodiment, the two positioning rods are both first electric telescopic rods and are both arranged on the support member 1 through the electric sliding blocks in a sliding manner, the first electric telescopic rods and the electric sliding blocks are both electrically connected with the control system, and by arranging the first electric telescopic rods and the electric sliding blocks, and the first electric telescopic rods and the electric sliding blocks are electrically connected with the control system, so that the two positioning rods can be controlled simultaneously by the control system, and the electric sliding blocks can be ensured to move simultaneously along with the two positioning rods, and meanwhile, the position sensor for detecting the position of the through hole is arranged at the intersection of the two first electric telescopic rods and is in communication connection with the control system.
After the positioning portion 31 positions the via hole, the detecting portion 32 will insert into the via hole to detect the defect condition in the via hole, but because the detecting portion 32 also can block the inner wall of the via hole after entering the via hole, in order to avoid the problem that the detecting effect is bad because the detecting portion 32 blocks the inner wall of the via hole, in this regard, in an embodiment, the detecting portion 32 includes a second electric telescopic rod 321 perpendicular to one end of two perpendicular intersecting positioning rods and a rotatable micro detection probe 322 arranged on the second electric telescopic rod 321, the micro detection probe 322 and the second electric telescopic rod 321 are electrically connected with the control system, the aperture of the micro detection probe 322 and the aperture of the detection via hole form a straight line, and a buzzer is installed on the micro detection probe 322.
It should be noted that, since the sizes of the PCB boards 4 are different, when the larger PCB boards 4 are faced, and the number of through holes on the PCB boards 4 is too large, then a large amount of engineering is required for each inspection of all the through holes, and more inspection time is required, in order to solve the problem, a plurality of inspection portions 32 may be installed, but if a plurality of inspection portions 32 are installed, the cost of the overall inspection device and the control difficulty of the control system are increased, so in order to solve the problem, a method for inspecting the electroplating defect of the PCB boards 4 after electroplating is provided herein, which includes the following steps:
S1: the method comprises the steps that a via hole on a PCB 4 positioned on a first same straight line is defined as a first detection area, a via hole on a PCB 4 positioned on an adjacent same straight line is defined as a second detection area, kong Huachu N detection areas on the PCB 4 are marked by analogy, and when the method is specifically operated, the transverse direction, the vertical direction or the inclined direction can be selected, so long as the divided lines are parallel, kong Huachu N detection areas on the PCB 4 are marked by the method;
S2: counting the number of holes on the first detection area and the second detection area respectively, wherein the number of holes on the N detection area is recorded as N1 and N2; the number of holes in the first detection area and the second detection area counted here are then counted, and in order to facilitate recording, a mark can be made outside the holes which are convenient for each area, and the mark is removed after detection;
s3: the hole is detected by the detection part 32, if no defect is determined, the hole is selected as the hole through which the X-ray passes, the thickness of the hole acquired by the X-ray is recorded as M, and the detection result of the X-ray is fed back through the computer display screen;
S4: the thickness of the X-ray passing hole is Q1, comparing whether Q1 is equal to MN1 or not is recorded, MN1 is M times N1 here, because the thickness of all holes on the X-ray passing first detection area is to be compared, if not, the holes of the first detection area are detected by the detection part 32, if not, the holes of the first detection area are not required to be detected, and the like, the detection of the N detection areas is completed, a plurality of holes can be detected at one time, when Q1 and MN1 are not equal, it is positively shown that a problem occurs in a certain hole on the first detection area, at this time, only the hole on the area is required to be detected, other areas without problems do not need to be detected, and only the holes on the first detection area are detected, and the detection methods of the rest areas are the same, so that the detection is not repeated, all through holes do not need to be detected independently, and the detection efficiency is greatly improved.
Further, since the sizes of the through holes on the PCB board 4 may not be the same, the sizes of the selected through holes in the above detection method need to be the same, but the detection method may be used for holes with different sizes, firstly, the through holes on the PCB board 4 are classified according to different sizes, the same sizes are used as one type, then the step S3 may be performed multiple times, and the same method as the step S3 is adopted to select one comparison hole for each type of hole, so that the problem of rapid detection for holes with different sizes can be solved.
The working principle and the using flow of the invention are as follows:
When the device is used, the CCD camera is controlled by the control system to scan the PCB 4, the acquired image is fed back through the computer display screen, then the control system is used for controlling the driving part to drive the two positioning rods to move, the intersection point of the two movable rectangular sides is used as a positioning center point to realize positioning, the control system is used for controlling the second electric telescopic rod 321 to stretch out and draw back, the micro detection probe 322 is driven to be inserted into the through hole, and then the micro motor is used for driving the micro detection probe 322 to rotate, so that the micro detection probe 322 detects the whole inner wall of the hole, and the problem that the detection part 32 blocks the inner wall of the through hole, so that the detection effect is poor is solved;
When the larger PCB 4 is faced, and too many through holes are formed in the PCB 4, a large amount of engineering is needed for each detection of all the through holes, more detection time is needed, at this time, through the fact that the through holes formed in the PCB 4 positioned on the first same straight line are defined as a first detection area, the through holes formed in the PCB 4 positioned on the adjacent straight line are defined as a second detection area, and so on, through Kong Huachu N detection areas formed in the PCB 4, the number of the holes formed in the first detection area and the second detection area is counted, the number of the holes formed in the N detection area is counted as N1 and N2, the number of the holes formed in the N detection area is counted, the holes formed in the N detection area are detected as N, N are detected as N, and X rays pass through a hole without defects, the holes can be detected by adopting the detection part 32, if no defects are determined, the holes formed in the holes are selected as comparison holes, the thicknesses of the holes collected by the X rays are recorded as M, and the X ray detection results are fed back through a computer display screen; the X-rays are adopted to respectively pass through the first detection areas, the thickness of the X-rays passing through the holes is recorded to be Q1, whether the Q1 is equal to MN1 is compared, if not, the holes of the first detection areas are detected by the detection part 32, if so, the holes of the first detection areas are not required to be detected, and the like, the detection of the N detection areas is completed, a plurality of holes can be detected at one time, and the detection efficiency is greatly improved.
The present invention is not limited to the above embodiments, but is capable of modification and variation in detail, and other modifications and variations can be made by those skilled in the art without departing from the scope of the present invention.
Claims (8)
1. The electroplating defect detection device after the PCB is electroplated is characterized by comprising a support piece, a scanning assembly and a via hole detection mechanism, wherein the scanning assembly is arranged on the support piece and used for scanning the surface of the PCB, the via hole detection mechanism is arranged on the support piece, the scanning assembly and the via hole detection mechanism are externally connected with a control system, the via hole detection mechanism comprises a positioning part, a detection part and a driving part, the positioning part and the support part are arranged on the support piece in a sliding manner, the positioning part is in communication connection with the externally connected control system, the driving part drives the positioning part to slide along the support piece, the positioning part drives the detection part to move above the via hole, so that the detection part detects defects in the via hole, and after the positioning part positions the via hole, the detection part is inserted into the via hole to detect the defect condition in the via hole;
The positioning part comprises two positioning rods which are arranged on the supporting piece in a sliding way, the two positioning rods and the supporting piece form a rectangular structure, one ends of the two positioning rods are respectively arranged on the supporting piece in a sliding way, and the other ends of the two positioning rods are vertically intersected;
The two locating rods are all first electric telescopic rods, the two locating rods are arranged on the supporting piece in a sliding mode through the electric sliding blocks, and the first electric telescopic rods and the electric sliding blocks are electrically connected with the control system.
2. The device for detecting electroplated defects of a PCB board according to claim 1, wherein the detecting portion comprises a second electric telescopic rod perpendicular to one ends of the two perpendicular intersecting positioning rods and a rotatable miniature detecting probe arranged on the second electric telescopic rod, and the miniature detecting probe and the second electric telescopic rod are electrically connected with the control system.
3. The device for detecting electroplated defects of a PCB of claim 2, wherein the micro inspection probe is aligned with the aperture of the inspection via.
4. The device for detecting electroplated defects of a PCB board according to claim 2, wherein a buzzer is provided on the micro-inspection probe.
5. The device for detecting electroplating defects after electroplating of a PCB according to claim 1, wherein the scanning assembly is in communication connection with a computer display screen, and the scanning assembly feeds back the scanned image of the surface of the PCB through the computer display screen.
6. A method for detecting electroplating defects after electroplating a PCB board, based on the device for detecting electroplating defects after electroplating a PCB board according to any one of claims 1 to 5, comprising the steps of:
S1: the method comprises the steps that through holes on the PCB positioned on the first same straight line are defined as a first detection area, through holes on the PCB positioned on the adjacent same straight line are defined as a second detection area, and the like, through Kong Huachu N detection areas on the PCB are defined;
S2: the number of holes in the first detection region and the second detection region were counted and denoted as N 1、N2......Nn;
S3: x-rays are adopted to pass through a hole without defects, and the thickness of the hole acquired by the X-rays is recorded and is recorded as M;
S4: and (3) adopting X rays to respectively pass through the first detection areas, recording the thickness of the X rays passing through the holes to be Q1, comparing whether the thickness of the X rays passing through the holes is equal to MN 1, if not, adopting the detection part to detect the holes of the first detection areas, if so, not needing to detect the holes of the first detection areas, and the like, so as to finish the detection of the N detection areas.
7. The method for detecting electroplating defects after electroplating of a PCB according to claim 6, wherein the result of the X-ray detection in S3 is fed back through a computer display screen.
8. The method for detecting electroplated defects of a PCB according to claim 6, wherein the sizes of the through holes on the PCB selected in the step S1 are the same.
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| CN202410030670.1A CN117825411B (en) | 2024-01-09 | 2024-01-09 | Electroplating defect detection device and detection method for electroplated PCB |
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| CN202410030670.1A CN117825411B (en) | 2024-01-09 | 2024-01-09 | Electroplating defect detection device and detection method for electroplated PCB |
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| CN117825411B true CN117825411B (en) | 2024-05-28 |
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Denomination of invention: A electroplating defect detection device and detection method for PCB boards after electroplating Granted publication date: 20240528 Pledgee: Jiangmen Rural Commercial Bank Co.,Ltd. Pledgor: Jiangmen Zhongyang Circuit Technology Co.,Ltd. Registration number: Y2024980023080 |