CN117816625A - Object cleaning method and system - Google Patents
Object cleaning method and system Download PDFInfo
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- CN117816625A CN117816625A CN202410069509.5A CN202410069509A CN117816625A CN 117816625 A CN117816625 A CN 117816625A CN 202410069509 A CN202410069509 A CN 202410069509A CN 117816625 A CN117816625 A CN 117816625A
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- water
- nozzle
- water vapor
- raw material
- vapor
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- 238000004140 cleaning Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 152
- 239000002351 wastewater Substances 0.000 claims abstract description 48
- 239000012530 fluid Substances 0.000 claims abstract description 34
- 239000002994 raw material Substances 0.000 claims abstract description 20
- 238000005507 spraying Methods 0.000 claims abstract description 6
- 230000007246 mechanism Effects 0.000 claims description 63
- 238000002156 mixing Methods 0.000 claims description 34
- 239000007788 liquid Substances 0.000 claims description 14
- 238000011144 upstream manufacturing Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 238000009833 condensation Methods 0.000 abstract description 3
- 230000005494 condensation Effects 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 230000003628 erosive effect Effects 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 7
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003912 environmental pollution Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004630 mental health Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
The invention discloses an object cleaning method and system. The object cleaning method includes: spraying a mixed phase fluid comprising water vapor of a continuous phase and water droplets of a dispersed phase with a nozzle, wherein the water droplets leave the nozzle at a velocity above sonic velocity and the mixed phase fluid is brought into contact with an object to be cleaned and generates wastewater vapor; and heat exchanging the wastewater vapor with a second raw material water to condense the wastewater vapor and heat the second raw material water, and then forming the water droplets with the second raw material water. The invention can realize the condensation treatment of the waste water steam, prevent the equipment erosion and pollution and the heat waste caused by directly discharging the waste water steam, fully recycle the heat energy in the waste water steam and reduce the energy consumption required by heating the second raw material water.
Description
Technical Field
The present invention relates to a method for cleaning an object, and more particularly, to a method for cleaning an object using a combination of water vapor and water.
Background
In the semiconductor processing process, various organic materials such as photoresist and adhesive are generally required, and if the materials remain on the surface or in the semiconductor device, various adverse effects will be caused on the device performance, so that the residual organic materials should be removed thoroughly in an ideal state. The conventional cleaning methods are mainly solvent cleaning, plasma ashing, etc., or a combination thereof. However, these methods have some drawbacks, such as high cost, easy environmental pollution, adverse physical and mental health of operators, inability to cover the whole process of the semiconductor processing technology, and the like.
There has been proposed a method for cleaning an object by spraying a mixed-phase fluid containing water vapor of a continuous phase and water droplets of a dispersed phase onto a surface of a semiconductor substrate or the like to remove dirt remaining on the surface of the semiconductor substrate. Although the method can well realize the cleaning of the semiconductor sample, a large amount of waste water vapor can be generated in the cleaning process, and the waste water vapor can not be directly discharged in the current indoor environment, so that corrosion to cleaning equipment and secondary pollution to the cleaning sample are avoided. The existing treatment mode mainly collects the waste water vapor and discharges the waste water vapor to the outdoor environment, which can cause environmental pollution.
Disclosure of Invention
The main object of the present invention is to provide a method and a system for cleaning objects, which overcome the disadvantages of the prior art.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention comprises the following steps:
one aspect of the present invention provides an object cleaning method including:
spraying a mixed phase fluid comprising water vapor of a continuous phase and water droplets of a dispersed phase with a nozzle, wherein the water droplets leave the nozzle at a velocity above sonic velocity and the mixed phase fluid is brought into contact with an object to be cleaned and generates wastewater vapor;
at least the waste water vapor is heat exchanged with the second raw material water such that the waste water vapor is condensed and the second raw material water is heated, after which the water droplets are formed with the second raw material water.
In one embodiment, the water droplets have a temperature above 35 ℃ and below 65 ℃, preferably 37 ℃ to 62 ℃, more preferably 37 ℃ to 57 ℃, still more preferably 42 ℃ to 57 ℃, still more preferably 47 ℃ to 57 ℃, and particularly preferably 47 ℃ to 52 ℃.
In one embodiment, the temperature of the miscible fluid upon contact with the object is 35 ℃ or greater.
In one embodiment, the water droplets have a diameter of 0.3 to 30 μm.
In one embodiment, the jet outlet of the nozzle is at a distance of 30mm or less from the object.
In one embodiment, the pressure at which the miscible fluid is ejected from the nozzle is between 0.05 and 0.5Mpa.
In one embodiment, the nozzle is a super-high velocity nozzle and is capable of accelerating the droplets above sonic velocity.
In the present invention, the "water droplet" is a concept including not only a water droplet from water but also a minute water droplet from wet saturated water vapor, for example.
In the present invention, the "miscible fluid" is a fluid having a plurality of fluid components such as two fluids or three fluids, and examples thereof include: 1) saturated water vapor and pure water droplets having a boiling point or lower, 2) heated water vapor and pure water droplets having a boiling point or lower, 3) a fluid in which an inert gas or clean high-pressure air is further combined in the 1) or 2). However, when the catalyst is used in applications where there is no concern about oxidation or chemical reaction of an object, oxygen or other active gas may be used.
In the present invention, the "object" is not particularly limited, and may be selected from, for example, electronic parts, semiconductor substrates, glass substrates, lenses, magnetic disk members, precision machining members, molded resin members, and the like, without being limited thereto.
In the present invention, the "cleaning" is not particularly limited, and may be, for example, peeling, washing, processing, or the like, and is not limited thereto.
Another aspect of the present invention provides an object cleaning system comprising:
a water vapor supply mechanism for converting the first raw material water into water vapor;
a water supply mechanism for supplying second raw material water;
a mixing mechanism for mixing the water vapor with the second raw material water to form a mixture of water vapor and liquid water;
a nozzle for receiving the mixture of water vapor and liquid water and spraying a mixed phase fluid comprising water vapor and water droplets to contact an object to be cleaned, wherein the water droplets leave the nozzle at a speed above sonic speed;
the waste water vapor collecting mechanism is used for collecting waste water vapor generated after the object is cleaned by the miscible fluid and conveying the waste water vapor to the heat exchange mechanism;
and the heat exchange mechanism is at least used for carrying out heat exchange on the wastewater steam and the second raw material water so as to enable the wastewater steam to be condensed and enable the second raw material water to be heated and then conveyed to the mixing mechanism.
In one embodiment, the mixing mechanism has a water introduction portion capable of mixing water from an inner wall surface with respect to the flowing water vapor and having a part of the inner wall surface open;
the nozzle is reduced in diameter from the upstream side of the nozzle toward the nozzle outlet, and has a terminal expansion structure that expands in diameter with a throat portion that is the smallest cross-sectional area as a boundary,
the inner wall surface of the mixing mechanism and the inner wall surface of the nozzle form a substantially continuous curved surface,
mixing water from an inner wall surface of the mixing mechanism with the water vapor flowing in the mixing mechanism, and conveying the water from the inner wall surface of the mixing mechanism toward an inner wall surface of the nozzle, thereby injecting the mixed phase fluid from an outlet of the nozzle.
In one embodiment, the mixing mechanism is barrel-shaped.
Compared with the prior art, the invention can realize condensation treatment of the waste water vapor, prevent environmental pollution caused by directly discharging the waste water vapor, fully recycle heat energy in the waste water vapor, reduce energy consumption required by heating the second raw water, particularly, after the waste water vapor is used for heating the second raw water to be higher than 40 ℃, the waste water vapor is used for forming a disperse phase in the mixed phase fluid, and the cleaning effect of the mixed phase fluid on the object can be obviously improved.
Drawings
FIG. 1 is a schematic diagram of an object cleaning system according to an embodiment of the present application;
reference numerals illustrate: 111-first delivery pipe, 112-steam generator, 121-second delivery pipe, 131-steam heating mechanism, 141-nozzle, 142-hose, 143-gas-liquid mixing portion, 150-object bearing mechanism, 160-waste water steam collecting mechanism, 161-waste water steam pipeline, 170-heat exchanging mechanism, 180-object.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below by taking a gallium nitride epitaxial wafer (hereinafter referred to as "object") with a photoresist film attached to the surface as an example with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The object cleaning system employed in the following embodiment may be modified based on the object cleaning system used in document 3.
Referring to fig. 1, in one embodiment of the present application, the object cleaning system includes a water vapor supply mechanism, a water supply mechanism, a mixing mechanism, a nozzle, a waste water vapor collection mechanism, a heat exchange mechanism, an object carrying mechanism, and the like. Wherein the mixing mechanism and the nozzle are preferably integrally provided as a miscible fluid injection mechanism.
Specifically, the water vapor supply mechanism specifically includes a first water supply pipe 111, a vapor generator 112, and the like. The pure water (i.e., the first raw water) supplied from the first water supply pipe 111 is heated by the steam generator 112 to form steam, and then supplied to the mixed-phase fluid injection mechanism through the steam delivery line. For safety and convenience in regulating the flow rate of the steam, a switch valve, a pressure gauge, a pressure regulating valve, a steam humidity regulator with heating function, a safety valve, etc. (not all shown in the figure) may be installed on the steam delivery line. And, in consideration of the possibility that the temperature or humidity change may occur after the steam travels a certain distance in the steam delivery pipe, the steam heating mechanism 131 may be additionally provided on a portion of the steam delivery pipe adjacent to the mixed phase fluid injection mechanism to adjust the temperature or humidity of the steam delivered to the mixed phase fluid injection mechanism to a more desirable state. The steam heating mechanism 131 may employ an electric heating device, a gas heating device, or the like, and is not limited thereto. Wherein the flow direction of the water vapor is shown by solid line hollow arrows.
The water supply mechanism includes a second water supply pipe 121 and the like. The heat exchange mechanism 170 may be a conventional one-stage or multi-stage condensation heat exchanger, which has a steam inlet, a pure water outlet, and a condensed water outlet, wherein the steam inlet is connected to the waste water steam pipeline 161, the pure water inlet is connected to the second water supply pipe 121, the pure water outlet is connected to the mixed phase fluid injection mechanism via the pure water delivery pipeline, and the condensed water outlet is used for discharging waste water formed after the waste water steam is condensed. The waste water vapor and the pure water in the heat exchange mechanism exchange heat fully, so that the waste water vapor can be condensed into waste water which is easy to treat rapidly in the object cleaning system, the risk of corrosion or pollution to other components caused by diffusion of the waste water vapor in the system can be avoided, the problem that the use cost is greatly increased due to direct discharge of the waste water vapor or the cooling by using peripheral cooling equipment is also avoided, and meanwhile, the pure water is heated, so that the energy required for heating the pure water by using an additionally arranged electric heating mechanism and the like is saved. In some cases, the heat exchange mechanism 170 may be provided integrally with the water supply mechanism.
The pure water (i.e., the second raw water) supplied from the second water supply pipe 121 is heated to a predetermined temperature by the heat exchange mechanism 170 and then outputted, and is supplied to the mixed-phase fluid injection mechanism via the pure water supply line. For adjusting the flow rate of pure water or the like, an on-off valve, a flow meter, an on-off valve, and the like may be provided in the pure water supply line. Wherein the flow direction of pure water is shown by solid arrows in fig. 1.
The mixed-phase fluid ejection mechanism includes a nozzle 141, a hose 142, a gas-liquid mixing section 143, and the like, which are freely movable in a three-dimensional space. Wherein, can also set up the manometer on the hose, be used for monitoring the fluid pressure that gets into gas-liquid mixing portion. And, a throttle mechanism may be provided on the pure water delivery pipe, for example, an orifice may be provided at the junction of the pure water delivery pipe and the gas-liquid mixing portion so that pure water may enter the gas-liquid mixing portion 143 so as to form a water film on the inner wall surface of the gas-liquid mixing portion 143, while water vapor is not hindered from entering the gas-liquid mixing portion 143. The gas-liquid mixing portion 143 is provided upstream of the nozzle 141, may be a cylindrical body independent of the nozzle, and may be joined upstream of the nozzle, but may be provided integrally with the nozzle, for example, directly formed from an upstream portion of the nozzle. Preferably, the inner wall surface of the gas-liquid mixing section 143 and the inner wall surface of the nozzle are substantially continuous curved surfaces. After the water film formed on the inner wall of the gas-liquid mixing part of the pure water reenters the nozzle, the pure water can continuously flow on the inner wall of the nozzle in a water film state.
The nozzle 141 is capable of accelerating the droplets above sonic velocity. The shape of the nozzle may be arbitrarily set according to actual demands, but the inner diameter of the nozzle is sharply reduced in a direction from the upstream side of the nozzle toward the nozzle outlet, and the inner diameter of the nozzle is smallest at the throat portion, and then gradually increases in a direction from the throat portion toward the nozzle outlet. The specific structural parameters of the nozzle, such as its length, its inner diameter, etc., may also be selected according to practical requirements.
The object bearing mechanism 150 is mainly used for bearing the object. In order to enable the object to be cleaned more conveniently and comprehensively, the object bearing mechanism preferably has the function of driving the object to rotate, turn over or move along a set track. For example, the object carrying mechanism may include a gantry, a motor for driving the gantry to rotate, a vertical driving mechanism for driving the gantry to move up and down, a horizontal driving mechanism for driving the gantry to move left and right, and so on. In addition, in order to enable the object to be cooled rapidly, a cooling water pipe or the like for conveying cooling water to the object may be provided.
The waste water vapor collecting mechanism 160 may be a conventional various gas collectors, such as a negative pressure fan system, and its air inlet may be disposed near the nozzle and the object to be cleaned 180, which may continuously or intermittently operate, and collect the waste water vapor generated by cleaning the object with the miscible fluid in time, so that the collected waste water vapor may be conveyed to the first heat exchanging mechanism through the waste water vapor pipeline 161. The waste water vapor line 161 may be provided with a flowmeter, a barometer, or the like. Wherein the flow direction of the wastewater vapor is shown by the dotted outline arrows in fig. 1.
In this embodiment, the various mechanisms within the object cleaning system may be integrated within a physical space, such as a cabinet, to facilitate the integration and miniaturization of the object cleaning system.
The operation of cleaning the object based on the object cleaning system will be performed as follows, and the effects of the object cleaning methods provided in examples 1 to 13 are evaluated and tested. The object is formed by coating photoresist on a gallium nitride epitaxial wafer, drying and curing. The photoresist is THMR-iP5720 HP 13cP manufactured by Tokyo industrial production, the coating temperature is 160 ℃, the drying temperature is 180 ℃, the drying time is 5min, and the thickness of the finally formed photoresist film is about 1.7 mu m. The vapor pressure used in each object cleaning method was 0.2MPa, and the scanning speed of the nozzle for cleaning the object was 15mm/s.
It should be understood that the above embodiments are merely for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the present invention and implement the same according to the present invention without limiting the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (10)
1. A method of cleaning an object, comprising:
spraying a mixed phase fluid comprising water vapor of a continuous phase and water droplets of a dispersed phase with a nozzle, wherein the water droplets leave the nozzle at a velocity above sonic velocity and the mixed phase fluid is brought into contact with an object to be cleaned and generates wastewater vapor;
at least the waste water vapor is heat exchanged with the second raw material water such that the waste water vapor is condensed and the second raw material water is heated, after which the water droplets are formed with the second raw material water.
2. The object cleaning method according to claim 1, characterized in that: the water droplets have a temperature above 35 ℃ and below 65 ℃.
3. The object cleaning method according to claim 2, characterized in that: the temperature of the water droplets is 37 to 62 ℃, preferably 37 to 57 ℃, more preferably 42 to 57 ℃, even more preferably 47 to 57 ℃, and particularly preferably 47 to 52 ℃.
4. The object cleaning method according to claim 1, characterized in that: the temperature of the miscible fluid when in contact with the object is 35 ℃ or higher.
5. The object cleaning method according to claim 1, characterized in that: the diameter of the water drop is 0.3-30 mu m.
6. The object cleaning method according to claim 1, characterized in that: the distance between the ejection outlet of the nozzle and the object is below 30 mm.
7. The object cleaning method according to claim 1, characterized in that: the pressure of the mixed phase fluid sprayed out from the nozzle is 0.05-0.5 Mpa.
8. An object cleaning system, comprising:
a water vapor supply mechanism for converting the first raw material water into water vapor;
a water supply mechanism for supplying second raw material water;
a mixing mechanism for mixing the water vapor with the second raw material water to form a mixture of water vapor and liquid water;
a nozzle for receiving the mixture of water vapor and liquid water and spraying a mixed phase fluid comprising water vapor and water droplets to contact an object to be cleaned, wherein the water droplets leave the nozzle at a speed above sonic speed;
the waste water vapor collecting mechanism is used for collecting waste water vapor generated after the object is cleaned by the miscible fluid and conveying the waste water vapor to the heat exchange mechanism;
and the heat exchange mechanism is at least used for carrying out heat exchange on the wastewater steam and the second raw material water so as to enable the wastewater steam to be condensed and enable the second raw material water to be heated and then conveyed to the mixing mechanism.
9. The object cleaning system of claim 8, wherein: the mixing mechanism has a water introduction part capable of mixing water from an inner wall surface with respect to the flowing water vapor and having a part of the inner wall surface open;
the nozzle is reduced in diameter from the upstream side of the nozzle toward the nozzle outlet, and has a terminal expansion structure that expands in diameter with a throat portion that is the smallest cross-sectional area as a boundary,
the inner wall surface of the mixing mechanism and the inner wall surface of the nozzle form a substantially continuous curved surface,
mixing water from an inner wall surface of the mixing mechanism with the water vapor flowing in the mixing mechanism, and conveying the water from the inner wall surface of the mixing mechanism toward an inner wall surface of the nozzle, thereby injecting the mixed phase fluid from an outlet of the nozzle.
10. The object cleaning system of claim 9, wherein: the mixing mechanism is cylindrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410069509.5A CN117816625A (en) | 2024-01-17 | 2024-01-17 | Object cleaning method and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410069509.5A CN117816625A (en) | 2024-01-17 | 2024-01-17 | Object cleaning method and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117816625A true CN117816625A (en) | 2024-04-05 |
Family
ID=90511604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410069509.5A Pending CN117816625A (en) | 2024-01-17 | 2024-01-17 | Object cleaning method and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117816625A (en) |
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2024
- 2024-01-17 CN CN202410069509.5A patent/CN117816625A/en active Pending
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