CN117812842A - Automatic rubberizing method and device for circuit board - Google Patents
Automatic rubberizing method and device for circuit board Download PDFInfo
- Publication number
- CN117812842A CN117812842A CN202311703847.1A CN202311703847A CN117812842A CN 117812842 A CN117812842 A CN 117812842A CN 202311703847 A CN202311703847 A CN 202311703847A CN 117812842 A CN117812842 A CN 117812842A
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- CN
- China
- Prior art keywords
- circuit board
- adhesive tape
- shearing
- automatic
- constraint
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- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000002390 adhesive tape Substances 0.000 claims abstract description 94
- 238000010008 shearing Methods 0.000 claims abstract description 77
- 230000007246 mechanism Effects 0.000 claims abstract description 57
- 230000008859 change Effects 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims description 16
- 238000005452 bending Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000005253 cladding Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000000452 restraining effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Landscapes
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
The invention discloses an automatic rubberizing method of a circuit board and an automatic rubberizing device applying the automatic rubberizing method of the circuit board, wherein the automatic rubberizing method of the circuit board comprises the following steps: conveying a circuit board and preparing an adhesive tape; step two: feeding the adhesive tape and pasting the adhesive tape; step three: conveying a circuit board and shearing an adhesive tape; the constraint shearing mechanisms at two sides of the circuit board can move relatively or reversely to change the distance between the two. The constraint shearing mechanism capable of being mutually close can be suitable for circuit boards with different sizes. The adhesive tape that the supply system provided is through restraint shearing mechanism's restraint for the crooked cladding of adhesive tape is at the both sides edge of circuit board, cuts off the adhesive tape through restraint shearing mechanism is automatic at last, and the tip of adhesive tape is pasted mutually to accessible restraint shearing mechanism in addition, and the tip of adhesive tape of being convenient for is directly pasted on the new circuit board of waiting to rubberize, thereby replaces artifical frequent rubberizing, improves production efficiency.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to an automatic rubberizing method and device for a circuit board.
Background
In the PCB manufacturing process, before the circuit board nickel-plating process and before the resin plugging process, an automatic tape sticking machine is generally used to stick an adhesive tape on the circuit board to protect the circuit board. However, when the PCB is printed with solder resist, the position of the board edge is required to be manually moved, so that different widths can be reserved for not printing solder resist, and subsequent operation is convenient. Therefore, the automatic taping machine needs to switch the tape with different widths and circuit boards with different sizes.
However, at present, the adhesive tapes with different widths are generally manually cut and glued by hands, and when the sizes of the circuit boards are large, frequent manual cutting and gluing are needed, so that the production efficiency is very affected.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides an automatic rubberizing method for a circuit board, which can automatically cut off an adhesive tape and automatically rubberize the adhesive tape when the circuit boards with different sizes are replaced.
The invention also provides an automatic tape sticking device applying the automatic tape sticking method of the circuit board.
According to an embodiment of the first aspect of the present invention, the automatic circuit board rubberizing method includes:
step one: the method comprises the steps of conveying a circuit board and preparing adhesive tapes, placing the circuit board on a conveying roller, conveying the circuit board to a working area of an automatic taping machine through the conveying roller, installing adhesive tape rolls in a supply system of the automatic taping machine, and arranging the adhesive tape rolls on two sides of the circuit board along the axial direction of the conveying roller;
step two: the adhesive tape is fed and stuck, the adhesive tape is output from the feeding system and sequentially passes through a tensioning mechanism and a constraint cutting mechanism, the adhesive tape is conveyed into a working area of the automatic adhesive tape sticking machine, the constraint cutting mechanism is used for constraining and bending the adhesive tape inwards and sticking the adhesive tape on the upper side and the lower side of the side edge of the circuit board, and the tensioning mechanism and the constraint cutting mechanism are arranged on the two sides of the circuit board along the axial direction of the conveying roller;
step three: the automatic taping machine conveys the circuit board, the constraint shearing mechanism automatically cuts off the adhesive tape after the circuit board is taped, and the automatic taping machine outputs the circuit board;
the constraint shearing mechanisms on two sides of the circuit board can move relatively or reversely so as to change the distance between the constraint shearing mechanisms.
The automatic rubberizing method for the circuit board has the following advantages: the restraining and shearing mechanisms which can be mutually close can be suitable for circuit boards with different sizes. The adhesive tape provided by the supply system is restrained by the restraint shearing mechanism, so that the adhesive tape is bent and coated on two side edges of the circuit board, and finally the adhesive tape is automatically cut off by the restraint shearing mechanism, and in addition, the end part of the adhesive tape can be attached by the restraint shearing mechanism, so that the end part of the adhesive tape can be conveniently attached to a new circuit board to be glued directly, manual frequent gluing is replaced, and the production efficiency is improved.
According to some embodiments of the present invention, the method further comprises a step four of compacting the adhesive tape, wherein a plurality of press rollers are arranged in a working area of the automatic taping machine, the press rollers are respectively located at the upper side and the lower side of the circuit board and the upper side and the lower side of the adhesive tape, and the adhesive tape and the circuit board are simultaneously penetrated in a gap between the press rollers.
According to some embodiments of the invention, the method further comprises a fifth step of secondarily binding the adhesive tape, a rotatable binding wheel is further arranged in the working area of the automatic taping machine, the axis of the binding wheel is vertically arranged, a binding groove is formed in the periphery of the binding wheel, the adhesive tape and the circuit board can be arranged in the binding groove in a penetrating mode, and the binding groove secondarily binds the adhesive tape.
According to some embodiments of the invention, the constraining and shearing mechanism is provided with a mounting block, a constraining assembly and a shearing assembly, the constraining assembly and the shearing assembly being provided on the mounting block, the constraining assembly being provided upstream of the shearing assembly, the constraining assembly being for bending the adhesive tape, the shearing assembly being for severing the adhesive tape.
According to some embodiments of the invention, the restraint assembly comprises two guide blocks, wherein the two guide blocks are arranged at intervals along the vertical direction, inclined surfaces are arranged on the guide blocks, the inclined surfaces extend along the conveying direction of the circuit board, and a gap is formed between the two guide blocks.
According to some embodiments of the invention, the incline angle of the incline is in the range of 35 ° to 65 °.
According to some embodiments of the invention, the shearing assembly comprises a shearing block and a shearing seat, the shearing seat is fixedly arranged on the mounting seat, the shearing block is movably arranged above the shearing block, a cutter is arranged on one side of the shearing block, which faces to the shearing seat, an avoidance groove is arranged on one side of the shearing seat, which faces to the shearing block, the avoidance groove is used for avoiding the cutter, and the shearing block and the shearing seat are respectively provided with a platform, and the platforms are respectively arranged on the same sides of the cutter and the avoidance groove.
According to some embodiments of the invention, the shear assembly further comprises a drive mechanism that drives the shear block up and down.
According to some embodiments of the invention, the tensioning mechanisms on both sides of the circuit board may be moved relatively or away from each other to change the spacing therebetween.
According to an embodiment of the second aspect of the present invention, the automatic taping device uses the automatic taping method for a circuit board according to any one of the embodiments of the first aspect.
The automatic tape sticking device provided by the embodiment of the invention has at least the following beneficial effects: the automatic tape sticking device can replace the original complex operations of manual cutting and manual tape sticking by using the method, thereby improving the flow of the whole production process and further improving the production efficiency. In addition, the circuit board structure is also applicable to circuit boards with different sizes, and improves the applicability of products.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic illustration of a constraining shear mechanism of an embodiment of the present invention;
FIG. 2 is a schematic view of a tie down wheel according to an embodiment of the invention.
Reference numerals:
restraining the shear mechanism 10; a mounting block 11; a restraint assembly 12; a guide block 121; a shear assembly 13; a cutout 131; a shear block 132;
a tie-down wheel 20; the groove 21 is constricted.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
According to an embodiment of the first aspect of the present invention, an automatic circuit board rubberizing method includes:
step one: the method comprises the steps of conveying a circuit board and preparing adhesive tapes, placing the circuit board on a conveying roller, conveying the circuit board to a working area of an automatic tape sticking machine through the conveying roller, mounting adhesive tape rolls in a supply system of the automatic tape sticking machine, and arranging the adhesive tape rolls on two sides of the circuit board along the axial direction of the conveying roller;
step two: the method comprises the steps of feeding adhesive tapes and pasting the adhesive tapes, outputting the adhesive tapes from a feeding system, sequentially passing through a tensioning mechanism and a constraint cutting mechanism 10, conveying the adhesive tapes to a working area of an automatic taping machine, wherein the constraint cutting mechanism 10 constrains and bends the adhesive tapes inwards and pastes the adhesive tapes on the upper side and the lower side of the side edge of a circuit board, and the tensioning mechanism and the constraint cutting mechanism 10 are arranged on the two sides of the circuit board along the axial direction of a conveying roller;
step three: the circuit board is conveyed by an automatic taping machine, and after the circuit board is finished taping, the constraint shearing mechanism 10 automatically cuts off the adhesive tape and the automatic taping machine outputs the circuit board;
wherein, the restraint shearing mechanism 10 on two sides of the circuit board can move relatively or relatively so as to change the interval between the restraint shearing mechanism and the circuit board.
Specifically, the worker places the wiring board on the conveying roller, conveys the wiring board into the working area of the automatic taping machine by the conveying roller, and simultaneously the adhesive tape roll is mounted on the supply system of the automatic taping machine and positioned on both sides of the wiring board. The adhesive tape is output from the supply system, sequentially passes through the tensioning of the tensioning mechanism and the constraint bending of the constraint shearing mechanism 10, and finally is coated on two sides of the circuit board, so that the automatic rubberizing of the circuit board is realized. The continuous conveying of the circuit board and the synchronous conveying of the adhesive tape can be used for continuously pasting and wrapping the adhesive tape for the circuit board. When the rubberizing of the circuit board is finished, the constraint shearing mechanism 10 can automatically cut off the adhesive tapes on two sides of the tail end of the circuit board. It should be noted that the constraining and shearing mechanisms 10 on both sides of the circuit board can be moved relatively or relatively to change the spacing therebetween, thereby adapting to circuit boards of different sizes.
The constraint cutting mechanism 10, which may be positioned adjacent to each other, may be adapted for circuit boards of different sizes. The adhesive tape that the feed system provided is through restraint shear mechanism 10 restraint for the crooked cladding of adhesive tape is on the both sides edge of circuit board, cuts off the adhesive tape through restraint shear mechanism 10 automation at last, and the tip of adhesive tape is pasted mutually to accessible restraint shear mechanism 10 in addition, and the tip of adhesive tape of being convenient for is directly pasted on the new circuit board of waiting to rubberize, thereby replaces artifical frequent rubberizing, improves production efficiency.
In some embodiments of the invention, the automated taping method further comprises a step four, compaction of the tape. A plurality of press rollers are arranged in the working area of the automatic taping machine, the press rollers are respectively positioned on the upper side and the lower side of the circuit board and the adhesive tape, and the adhesive tape and the circuit board are simultaneously penetrated in the gap between the press rollers. After the adhesive tape is coated on the circuit board, the adhesive tape can be pressed on the circuit board through a plurality of downstream pressing rollers.
In some embodiments of the present invention, the automatic taping method further includes a fifth step, a second binding of the adhesive tape, before the fourth step. The automatic taping machine is characterized in that a rotatable binding wheel 20 is further arranged in a working area of the automatic taping machine, an axis of the binding wheel 20 is arranged vertically, a binding groove 21 is formed in the periphery of the binding wheel 20, and the adhesive tape and the circuit board can be arranged in the binding groove 21 in a penetrating mode, and the binding groove 21 is used for secondarily binding the adhesive tape. In the conveying process of the conveying roller, two sides of the circuit board respectively enter the restraint grooves 21 of the restraint wheels 20, so that the side ends directly abut against the bottoms of the restraint grooves 21, and the adhesive tapes at the side ends are pressed on the circuit board through the bottoms of the restraint grooves 21.
In some embodiments of the present invention, in particular, the constraining and shearing mechanism 10 is provided with a mounting block 11, a constraining assembly 12 and a shearing assembly 13, the constraining assembly 12 and the shearing assembly 13 being provided on the mounting block 11, the constraining assembly 12 being provided upstream of the shearing assembly 13, the constraining assembly 12 being used for bending the adhesive tape, the shearing assembly 13 being used for cutting the adhesive tape. The mounting block 11 is located between a tensioning mechanism, which may be a tensioning wheel, downstream of which is provided a restraint assembly 12, and a restraint wheel 20, downstream of which is provided a shear assembly 13. The adhesive tape is tensioned by the tensioning wheel, so that the downstream restraint assembly 12 can bend the adhesive tape inwards, and the adhesive tape is coated and attached on two sides of the circuit board. When the circuit board rubberizing is accomplished, can cut off the sticky tape automatically through drive shearing subassembly 13.
Further, in some embodiments of the present invention, the restraint assembly 12 includes two guide blocks 121, the two guide blocks 121 are disposed at intervals in the vertical direction, inclined surfaces are disposed on the guide blocks 121, the inclined surfaces extend along the conveying direction of the circuit board, and a gap is provided between the two guide blocks 121. The inclined planes on the upper side and the lower side are respectively inclined and close to each other along the conveying direction of the adhesive tape, so that the section of the constraint component 12 is of a V-shaped structure, the adhesive tape is convenient to bend inwards and close, and the U-shaped structure is formed by matching the installation blocks 11, so that the circuit board is convenient to cover on the two sides of the circuit board. It can be understood that the folding end of the oblique line can be provided with a platform which is respectively connected with one end of the oblique line, thereby being convenient for finishing the stable output of the U-shaped adhesive tape. In some embodiments, the incline angle of the incline is in the range of 35 ° to 65 °.
In some embodiments of the present invention, the shearing assembly 13 includes a shearing block 131 and a shearing seat 132, the shearing seat 132 is fixedly disposed on the mounting seat, the shearing block 131 is movably disposed above the shearing block 131, a cutter is disposed on a side of the shearing block 131 facing the shearing seat 132, an avoidance groove is disposed on a side of the shearing seat 132 facing the shearing block 131, the avoidance groove is used for avoiding the cutter, the shearing block 131 and the shearing seat 132 are both provided with a platform, and the platform respectively cuts and avoids the same side of the groove.
The platform may be connected to the platform of one side of the restraint assembly 12 to facilitate smooth transfer of the tape. In addition, when the shearing block 131 moves down, the cutter cuts off the adhesive tape and stretches into the avoidance groove, so that the platform of the lower end face of the shearing block 131 is attached to the platform of the upper end face of the shearing seat 132, and it is conceivable that the adhesive tape can be clamped and attached to the inner side of the platform due to attachment between the platform, when the next circuit board is convenient to convey, the front end of the board is directly clamped at the position attached to the inner side of the front end of the adhesive tape, at the moment, the shearing block 131 moves up, and the circuit board is conveyed, so that automatic adhesive tape attaching of the adhesive tape is realized.
If the sizes of the circuit boards are different, the automatic rubberizing of circuit boards with different sizes can be adapted by adjusting the position of the constraint shearing mechanism 10.
In some embodiments of the present invention, the shear assembly 13 further includes a driving mechanism that drives the shear block 131 up and down. The driving mechanism may be a screw structure, a cylinder structure, a compression mechanism, or the like, and may be configured to move up and down the shear block 131 relative to the shear seat 132.
In some embodiments of the present invention, it is known that the tensioning mechanisms on both sides of the circuit board can be moved relatively or away from each other to change the spacing therebetween, thereby facilitating tensioning of the tape.
According to an embodiment of the second aspect of the present invention, the automatic taping device uses the automatic taping method of the circuit board according to any one of the embodiments of the first aspect. The application method of the automatic tape sticking device can replace the original complex operations of manual cutting and manual tape sticking, thereby improving the flow of the whole production process and further improving the production efficiency. In addition, the circuit board structure is also applicable to circuit boards with different sizes, and improves the applicability of products.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.
Claims (10)
1. An automatic rubberizing method for a circuit board is characterized by comprising the following steps:
step one: the method comprises the steps of conveying a circuit board and preparing adhesive tapes, placing the circuit board on a conveying roller, conveying the circuit board into a working area of an automatic taping machine through the conveying roller, and installing adhesive tape rolls in a supply system of the automatic taping machine, wherein the adhesive tape rolls are arranged on two sides of the circuit board along the axial direction of the conveying roller;
step two: the adhesive tape is fed and stuck, the adhesive tape is output from the feeding system and sequentially passes through a tensioning mechanism and a constraint cutting mechanism, the adhesive tape is conveyed into a working area of the automatic adhesive tape sticking machine, the constraint cutting mechanism constrains and bends the adhesive tape to the inner side and sticks the adhesive tape to the upper side and the lower side of the side edge of the circuit board, and the tensioning mechanism and the constraint cutting mechanism are arranged on the two sides of the circuit board along the axial direction of the conveying roller;
step three: the automatic taping machine conveys the circuit board, and after the circuit board is taped, the constraint cutting mechanism automatically cuts off the tape, and the automatic taping machine conveys the circuit board;
the constraint shearing mechanisms on two sides of the circuit board can move relatively or reversely so as to change the distance between the constraint shearing mechanisms.
2. The automatic circuit board rubberizing method according to claim 1, further comprising the step four of compacting the adhesive tape, wherein a plurality of press rollers are arranged in a working area of the automatic rubberizing machine, the press rollers are respectively positioned on the upper side and the lower side of the circuit board and the upper side and the lower side of the adhesive tape, and the adhesive tape and the circuit board are simultaneously penetrated in a gap between the press rollers.
3. The automatic circuit board rubberizing method according to claim 2, wherein the step four is preceded by a step five, the secondary binding of the adhesive tape is further performed, a rotatable binding wheel is further arranged in a working area of the automatic taping machine, an axis of the binding wheel is vertically arranged, a binding groove is formed in the circumferential side of the binding wheel, the adhesive tape and the circuit board can be arranged in the binding groove in a penetrating mode, and the binding groove is used for secondarily binding the adhesive tape.
4. The automatic circuit board rubberizing method according to claim 1, wherein the constraint shearing mechanism is provided with a mounting block, a constraint assembly and a shearing assembly, the constraint assembly and the shearing assembly are arranged on the mounting block, the constraint assembly is arranged at the upstream of the shearing assembly, the constraint assembly is used for bending the adhesive tape, and the shearing assembly is used for cutting the adhesive tape.
5. The automatic circuit board rubberizing method according to claim 4, wherein the constraint assembly comprises two guide blocks, the two guide blocks are arranged at intervals along the vertical direction, inclined surfaces are arranged on the guide blocks, the inclined surfaces extend along the conveying direction of the circuit board, and a gap is reserved between the two guide blocks.
6. The automatic circuit board rubberizing method according to claim 5, wherein the inclined plane has an inclination angle ranging from 35 ° to 65 °.
7. The automatic circuit board rubberizing method according to claim 4, wherein the shearing assembly comprises a shearing block and a shearing seat, the shearing seat is fixedly arranged on the mounting block, the shearing block is movably arranged above the shearing block, a cutter is arranged on one side face of the shearing block, which faces the shearing seat, an avoidance groove is arranged on one side face of the shearing block, which is used for avoiding the cutter, and the shearing block and the shearing seat are respectively provided with a platform, and the platforms are respectively arranged on the same sides of the cutter and the avoidance groove.
8. The automatic circuit board rubberizing method of claim 7, wherein said shear assembly further comprises a drive mechanism, said drive mechanism driving said shear block to move up and down.
9. The automatic circuit board rubberizing method according to claim 1, wherein the tensioning mechanisms on two sides of the circuit board can move relatively or reversely to change the distance between the two.
10. An automatic taping device, characterized in that the automatic taping method of the circuit board according to any one of claims 1 to 9 is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311703847.1A CN117812842A (en) | 2023-12-12 | 2023-12-12 | Automatic rubberizing method and device for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311703847.1A CN117812842A (en) | 2023-12-12 | 2023-12-12 | Automatic rubberizing method and device for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117812842A true CN117812842A (en) | 2024-04-02 |
Family
ID=90422692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311703847.1A Pending CN117812842A (en) | 2023-12-12 | 2023-12-12 | Automatic rubberizing method and device for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117812842A (en) |
-
2023
- 2023-12-12 CN CN202311703847.1A patent/CN117812842A/en active Pending
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