CN117805118A - Chip appearance detection device and method based on motion time association control - Google Patents
Chip appearance detection device and method based on motion time association control Download PDFInfo
- Publication number
- CN117805118A CN117805118A CN202410021268.7A CN202410021268A CN117805118A CN 117805118 A CN117805118 A CN 117805118A CN 202410021268 A CN202410021268 A CN 202410021268A CN 117805118 A CN117805118 A CN 117805118A
- Authority
- CN
- China
- Prior art keywords
- module
- motion
- chip
- image
- imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000033001 locomotion Effects 0.000 title claims abstract description 77
- 238000001514 detection method Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000003384 imaging method Methods 0.000 claims abstract description 98
- 238000004458 analytical method Methods 0.000 claims abstract description 53
- 230000001360 synchronised effect Effects 0.000 claims abstract description 51
- 230000010365 information processing Effects 0.000 claims abstract description 46
- 238000004364 calculation method Methods 0.000 claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- 230000003321 amplification Effects 0.000 claims abstract description 5
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 5
- 238000006073 displacement reaction Methods 0.000 claims description 33
- 238000012545 processing Methods 0.000 claims description 17
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000523 sample Substances 0.000 description 38
- 230000002159 abnormal effect Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000007689 inspection Methods 0.000 description 5
- 230000000630 rising effect Effects 0.000 description 5
- 230000005856 abnormality Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012472 biological sample Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011496 digital image analysis Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
Landscapes
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Microscoopes, Condenser (AREA)
Abstract
The invention discloses a chip appearance detection device and method based on motion time association control, which relate to the technical field of defect detection in chip appearance optical detection and comprise a precision adjusting table, a microscopic imaging system, a micro-motion module, an imaging and image acquisition module, a motion control module, a synchronous time sequence trigger generation module and an information processing analysis module, wherein the imaging and image acquisition module is integrated in the micro-motion module, and the micro-motion module is arranged on the microscopic imaging system; the device structure of the invention carries out optical microscopic amplification on a chip sample through a microscopic imaging system with lower magnification and lower configuration, carries out data acquisition on a sample image amplified by the microscopic imaging system in cooperation with the accurate coding motion of an image acquisition module, carries out association calculation on the acquired image combined with coding information, carries out interpolation and pixel value redistribution on the image, and realizes the high-resolution imaging effect through a calculation imaging mode.
Description
Technical Field
The invention relates to the technical field of chip appearance optical detection, in particular to a chip appearance detection device and method based on motion time association control.
Background
With the continuous development of chip manufacturing technology, the chip scale is smaller and smaller, and the detection of the chip is becoming more and more important. The chip appearance detection is used as an optical visual detection technology, has the advantage of non-contact rapidness, and is widely applied to the fields of semiconductor chips, integrated circuits and electronic elements. In chip appearance inspection, system hardware is an important factor affecting inspection results. The parameter performance of the system hardware directly influences the quality of the chip appearance image and the accuracy of the detection result. Although the existing chip appearance detection system has great development in terms of resolution and detection speed, the problems of large field of view, difficult hardware manufacture of a high resolution system and high cost exist, and the development and the application of the chip appearance detection system are limited to a certain extent.
Disclosure of Invention
The invention aims to provide a chip appearance detection device and method based on motion time association control, which aim to solve the limitation of the existing chip appearance detection system hardware on imaging resolution and view field parameters, and realize high-resolution and large-view field imaging detection which can only be realized by high-price hardware configuration with lower hardware configuration. According to the invention, high-precision coding micro-motion is introduced into the image acquisition part, a preliminary detected sample surface image is obtained through synchronous time sequence triggering, interpolation and pixel point value redistribution are carried out on the image after the preliminary detected sample surface image is subjected to associated calculation with coding motion information, a higher-resolution image is obtained under the condition of keeping the original view field, and more detail information of the sample is displayed, so that the image effect which can be realized only by a high-magnification system is realized.
In order to achieve the above purpose, the present invention provides the following technical solutions: a chip appearance detection method based on motion time association control comprises the following steps:
step one: placing the chip to be tested on a precise adjustment table, and adjusting the position and the height of the precise adjustment table to precisely and three-dimensionally adjust the position of the chip to be tested;
step two: the chip to be detected is adjusted to enable the microscopic imaging system and the imaging and image acquisition module to clearly image the chip, so that the chip is located at the focal plane of the microscopic imaging system, namely, the sensor plane of the imaging and image acquisition module, and the microscopic imaging system performs optical microscopic amplification on the chip to be detected;
step three: the information processing analysis module is used for setting the coding control mode of the motion control module and realizing the motion control of the micro-motion module by using the subsequent trigger output;
step four: setting exposure time parameters of an imaging and image acquisition module by using the information processing analysis module for subsequent triggering image acquisition;
step five: the information processing analysis module is used for sending a starting instruction to the synchronous time sequence trigger generation module, and the synchronous time sequence trigger generation module generates a single synchronous pulse trigger signal to respectively trigger the motion control module and the imaging and image acquisition module at the same time;
step six: inputting the image acquired by the imaging and image acquisition module into an information processing analysis module, performing association calculation on the acquired image and the coding information of the motion control module in the third step to acquire a higher-precision image, and simultaneously performing image processing based on a preset algorithm to extract sample characteristic information;
step seven: and outputting a corresponding detection result according to the processing analysis result of the information processing analysis module, and making a corresponding alarm prompt based on the detection result so as to realize the detection and analysis of the appearance of the chip.
Preferably, the method of setting the coding control mode in the third step is to set the displacement sequence of the motion control module on the X-Y plane in the period of the exposure period of the image sensor, and set the distance of each step displacement and the time kept at the current position.
Preferably, the method for setting the exposure time parameter in the fourth step is that the exposure period of the image sensor is set to be consistent with the total time of the coding control displacement in the third step, and other parameters are kept unchanged in the period.
Preferably, the method for extracting the characteristic information of the sample in the sixth step comprises the following steps:
acquiring data of a sample image amplified by a microscopic imaging system to obtain an appearance image sample I0 of the detection chip;
performing association calculation on the original image I0 and a matrix M corresponding to the coding control mode of the motion control module in the third step, so as to realize reassignment and interpolation of values of I0 pixels of the original image and obtain an image with higher degree of update;
and extracting the characteristic information of the chip to be detected according to the image sample obtained after the association calculation to obtain the appearance characteristic information of the detection chip.
Compared with the prior art, the invention has the beneficial effects that:
1. the device structure of the invention carries out optical microscopic amplification on a chip sample through a microscopic imaging system with lower magnification and lower configuration, carries out data acquisition on a sample image amplified by the microscopic imaging system in cooperation with the accurate coding motion of an image acquisition module, carries out association calculation on the acquired image combined with coding information, carries out interpolation and pixel value redistribution on the image, and realizes the high-resolution imaging effect through a calculation imaging mode. The motion time coding information is introduced, the effect of high resolution is realized through an algorithm, the dependence of imaging resolution on system hardware configuration is reduced, and the method has simpler hardware requirements and lower system cost
2. The invention introduces motion time coding information, realizes the effect of high resolution through an algorithm, keeps the original field angle while realizing high resolution, and has smaller magnification and higher field angle compared with a system with the same level resolution, thereby enabling the system to detect a larger chip surface range more quickly.
3. According to the invention, by introducing motion time coding information and associated imaging, the acquired chip sample characteristics are compared and judged, whether the chip is abnormal or not is determined, the abnormal chip sample characteristics of the chip with the abnormality are matched, the abnormality category is determined based on the matched parameters, and the corresponding abnormality alarm prompt is carried out, so that a manager can conveniently and timely make a response scheme, the abnormal chip is timely processed, the processing efficiency is improved, and the production quality of the chip is ensured.
Drawings
FIG. 1 is a schematic diagram of a chip appearance inspection apparatus according to the present invention;
FIG. 2 is a schematic diagram of an imaging and image acquisition module of the present invention integrated on a micro-motion module;
FIG. 3 is a flow chart of a method for detecting the appearance of a chip based on motion time correlation control according to the present invention;
FIG. 4 is an original graph of test results according to an embodiment of the present invention;
FIG. 5 is a graph of the test results after processing according to an embodiment of the present invention.
In the figure: 1. a precise adjusting table; 2. a microscopic imaging system; 3. a micro-motion module; 4. an imaging and image acquisition module; 5. a motion control module; 6. a synchronous time sequence trigger generation module; 7. and the information processing and analyzing module.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-4, the present invention provides a technical solution: a chip appearance detection device based on motion time association control comprises a precision adjusting table, a microscopic imaging system, a micro-motion module, an imaging and image acquisition module, a motion control module, a synchronous time sequence trigger generation module and an information processing analysis module. The imaging and image acquisition module is integrated in the micro-motion module, the micro-motion module is installed on the micro-imaging system, the micro-motion module, the imaging and image acquisition module and the micro-imaging system are coaxially arranged, the micro-motion module is electrically connected with the motion control module, the motion control module is electrically connected with the synchronous time sequence trigger generation module and the information processing analysis module respectively, the imaging and image acquisition module is electrically connected with the synchronous time sequence trigger generation module and the information processing analysis module respectively, and the synchronous time sequence trigger generation module is electrically connected with the information processing analysis module.
In the present invention, the precision adjusting table: for supporting and precisely adjusting the position of the chip to ensure that an accurate image is obtained during the inspection process.
Microscopic imaging system: providing a high resolution microscopic imaging function for viewing microscopic details of the chip, wherein the microscopic imaging system comprises an Objective lens, an eyepiece, a light source, a focusing system, a sample stage, a detector, a filter, an image processing unit, and software, an Objective lens (Objective): the objective lens is one of the core optical elements of a microscopic imaging system, responsible for focusing the light to form a magnified image. Different objectives have different magnifications and working distances for achieving different degrees of microstructure observation. Eyepiece (Eyepiece): eyepiece is used for direct observation of the sample by an observer, although in modern microscopic imaging systems digital cameras and displays are also often used for image display. Light source: the light source provides illumination to illuminate the sample so that it is visible under the microscope. Common light sources include white LEDs, halogen lamps or mercury arc sources, the particular choice depending on the application requirements. Focusing system: the focusing system is used for adjusting the focal length between the objective lens and the sample so as to obtain a clear image. This may be achieved by means of manual knobs, auto-focusing or electric focusing, etc. Sample Stage (Stage): the sample stage supports and positions a sample to be observed. It has an adjustment of the X, Y, Z axis allowing the user to locate and view the sample at different positions. The detector comprises: the detector captures the optical signal after passing through the objective lens and the sample, converting it into an electrical signal. Digital cameras are often used as detectors in modern microscopy imaging systems. An optical filter: the filters are used to select light of a particular wavelength to aid in enhancing the view of a particular feature of the sample, such as a fluorescence filter in a fluorescence microscope. An image processing unit: the image processing unit is used for processing, storing and displaying the image captured by the imaging system. This includes adjusting contrast, brightness, color balance, etc. and performing digital image analysis and processing. Digital camera and computer: modern microscopic imaging systems use digital cameras to capture images and process and display them in real time by a computer. The system allows for digitizing the images for convenient storage, sharing and further analysis. Software: the microscopic imaging system is accompanied by specific software for controlling the system, acquiring and processing the images, and contains some image analysis tools.
And the micro-motion module is used for: coaxially placed with the microscopic imaging system for tiny motion control. Which may be a micro-motion stage or other device capable of achieving micro-motion.
Imaging and image acquisition module: the micro-motion module is integrated in the micro-motion module and is responsible for acquiring images in real time in the motion process. This helps to capture minute details in motion.
A motion control module: and controlling the movement of the micro-movement module to ensure accurate positioning and movement of the chip. Including motion control of the XYZ axes.
A synchronous time sequence trigger generation module: and generating a synchronous time sequence trigger signal to ensure that the micro-motion module, the motion control module and the imaging and image acquisition module have synchronous time sequences when in cooperative work.
And the information processing and analyzing module is used for: the images acquired from the imaging and image acquisition modules are processed and analyzed. This includes algorithms such as image recognition, feature extraction, defect detection, etc., to enable efficient detection and analysis of chip appearance.
The operation method of the device comprises the following steps: placing a chip to be tested: the chip to be tested is placed on the precision adjustment stage in the field of view of the microscopic imaging system, i.e. the chip area to be tested. Adjusting the distance between the precise adjusting table and the microscopic imaging system: by adjusting the distance between the precise adjusting table and the microscopic imaging system, the imaging system is ensured to obtain clear and high-resolution images. Presetting motion control and imaging parameters: the information processing and analyzing module presets the coding control mode of the motion control module and the parameters of the imaging and image acquisition module. This includes parameters such as displacement step size, imaging frequency, etc. Transmitting a synchronous trigger signal instruction: the information processing analysis module sends an instruction to the synchronous time sequence trigger generation module, and the synchronous time sequence trigger generation module is triggered to generate a synchronous trigger signal. Synchronous trigger signal transmission: the synchronous trigger signal generated by the synchronous time sequence trigger generation module is transmitted to the motion control module and the imaging and image acquisition module. Displacement control and image acquisition begin: after receiving the synchronous trigger signal, the motion control module starts to execute preset displacement control work. Meanwhile, the imaging and image acquisition module starts to acquire a single image under the triggering of the synchronous signal. Image acquisition and motion control information association calculation: the information processing and analyzing module acquires the images acquired by the imaging and image acquisition module. And carrying out association calculation by combining coding control information of the motion control module so as to ensure that images of each step are associated with corresponding displacement information. Generating a high resolution image: the information processing analysis module generates a sample appearance image with higher resolution by combining all the acquired images. This helps to improve the accuracy and clarity of detection. Image recognition and analysis: and carrying out image recognition and analysis on the generated high-resolution image. This includes operations such as defect detection, feature extraction, shape analysis, etc. Outputting a detection report: and generating a detection report by the information processing analysis module according to the identification and analysis results. The report contains detailed information about the appearance of the chip, such as defect location, shape, size, etc.
Fig. 2 illustrates the manner in which the imaging and image acquisition modules of the present invention are integrated on a micro-motion module.
In order to better embody the detection flow of a chip appearance detection device based on motion time association control, as shown in fig. 3, the invention provides a chip appearance detection method based on motion time association control, which comprises the following steps:
step one: placing the processed chip to be tested on an upper surface area to be tested of a precise adjustment table, and adjusting the position and the height of the precise adjustment table to realize precise three-dimensional adjustment of the position of the chip to be tested;
in the above steps of the present invention, the chip to be measured is carefully placed on the upper surface of the precise adjustment table to ensure that the chip is located in the area to be measured, and the adjustment device is used, and the adjustment mode may be a manual knob, an electric device or other adjustment mechanisms to fine-adjust the position of the precise adjustment table so as to ensure that the chip to be measured is located in the desired observation position. The fine adjustment is carried out on the X, Y, Z shaft so as to ensure that the chip is in the center of the visual field, and the height of the precise adjustment table is adjusted so as to ensure that the focal plane is on the surface of the chip to be measured, thereby conveniently obtaining clear and well-focused images.
Step two: this step requires the realization of a clear amplified imaging of the chip to be tested. The method comprises the specific operation that a chip to be detected is adjusted to enable a microscopic imaging system and an imaging and image acquisition module to clearly image the chip, so that the chip is ensured to be positioned at a focal plane of the microscopic imaging system, namely a sensor plane of the imaging and image acquisition module, and the microscopic imaging system carries out optical microscopic amplification on the chip to be detected;
it should be noted that in the above steps of the present invention, the focal length adjusting function of the microscope system is used to ensure that the chip to be tested is located on the focal plane. By manually or automatically adjusting the focal length of the microscope. The definition change of the image can be observed in the process of adjusting the focal length so as to find the optimal focal point; the light source is ensured to fully illuminate the chip to be tested so as to obtain a clear image. The brightness and the direction of illumination can be adjusted, so that the light can be ensured to uniformly and brightly irradiate on the surface of the chip; during the adjustment, the image under the microscope is observed in real time. Ensuring that the microstructure of the chip is clearly visible so as to meet the requirements of subsequent analysis or detection; and adjusting parameters of the imaging and image acquisition module, including exposure time, gain and the like, according to the characteristics of the chip to be tested and imaging requirements.
Step three: and setting a coding control mode of the motion control module by using the information processing analysis module, and realizing motion control of the micro-motion module by using the subsequent trigger output. Specifically, the displacement order of the motion control module on the X-Y plane, the distance of each step displacement, and the holding time at the current position can be controlled by setting the exposure period of the image sensor.
In the above steps of the present invention, the information processing analysis module is used to set the exposure period of the image sensor. The exposure period determines the length of time the image sensor receives the light signal at each imaging. The distance of each step displacement, i.e. the step size of the minute displacement, is determined. This step size may be adjusted according to the specific application requirements. The smaller step size can improve the accuracy of position control; the length of time that is maintained at each location is determined. This is the time that remains stable at the current position after the fine displacement is performed to ensure adequate exposure and image acquisition; transmitting a setting instruction of coding control to a motion control module by utilizing an information processing analysis module; the motion control module starts to execute micro displacement on the X-Y plane according to the setting provided by the information processing analysis module, and keeps the set time at each position; after the micro displacement is executed at each position and kept for a certain time, the imaging and image acquisition module acquires images according to the set exposure period.
Step four: and setting exposure time parameters of the imaging and image acquisition module by utilizing the information processing analysis module for subsequent triggering of image acquisition. Specifically, the exposure period of the image sensor is set to be consistent with the total time of the code control displacement in the third step, and other parameters are kept unchanged in the period.
In the step of the present invention, the total time of the code control displacement is calculated according to the step length, the displacement sequence and the time kept at each position of the code control displacement in the step three; and setting the exposure period of the image sensor as the calculated total time of the coding control displacement by using an information processing analysis module. Ensuring that the exposure period can cover the whole process of tiny displacement so as to obtain a clear image; when setting the exposure period, it is ensured that other parameters related to the image acquisition remain unchanged. Including gain, frame rate, etc.; and sending a setting instruction to the imaging and image acquisition module through the information processing and analysis module, and transmitting the new exposure period parameter to the image sensor. After the exposure period parameter is set, the information processing analysis module can trigger the imaging and image acquisition module to execute image acquisition operation. At this time, the image sensor will perform image acquisition in accordance with the set exposure period.
Step five: and the information processing analysis module is used for sending a starting instruction to the synchronous time sequence trigger generation module, generating a single synchronous pulse trigger signal by the synchronous time sequence trigger generation module after receiving the instruction, respectively and simultaneously transmitting the single synchronous pulse trigger signal to the motion control module and the imaging and image acquisition module, and starting to operate corresponding preset working contents by each module after detecting a pulse rising edge.
In the above steps, parameters of the synchronous time sequence trigger generation module are set in the information processing analysis module, including the frequency, the starting time and the like of the trigger signal; ensuring that these parameters match the requirements of the system; when the information processing analysis module determines to start synchronous operation, a starting instruction is sent to the synchronous time sequence trigger generation module; after receiving the starting instruction, the synchronous time sequence trigger generation module starts to generate a synchronous pulse trigger signal; this signal will be used to synchronize the operation of the motion control module and the imaging and image acquisition module; the synchronous pulse trigger signal generated by the synchronous time sequence trigger generation module is transmitted to the motion control module and the imaging and image acquisition module at the same time; ensuring that signals can accurately reach each module; the motion control module and the imaging and image acquisition module respectively detect the rising edge of the synchronous pulse trigger signal; this rising edge is typically used as a point in time to begin executing the preset work content; the motion control module starts to execute preset working contents after detecting the rising edge of the synchronous pulse trigger signal, wherein the preset working contents comprise motion control of tiny displacement, and the imaging and image acquisition module starts to execute the preset working contents, such as image acquisition, after detecting the rising edge of the synchronous pulse trigger signal; after each module completes the preset work content, a corresponding completion signal or state information may be generated, so that the information processing analysis module or other modules can further process the work content.
Step six: the method mainly comprises the steps of firstly collecting a chip surface image, then obtaining a high-resolution image through association calculation, and finally processing and analyzing the high-resolution image. The method comprises the steps of inputting an image acquired by an imaging and image acquisition module into an information processing and analyzing module, and performing association calculation on coding information of a motion control module in the third step so as to acquire a higher-precision image, and simultaneously performing image processing based on a preset algorithm to extract sample characteristic information. The specific method comprises the following steps: and acquiring data of the image of the sample to be detected amplified by the microscopic imaging system to obtain an appearance image sample I0 of the chip to be detected. And then, carrying out association calculation on the obtained original image I0 and a matrix M corresponding to the coding control mode of the motion control module in the step three, so as to realize the redistribution and interpolation of the values of the I0 pixel points of the original image and obtain a higher-precision image. And extracting the characteristic information of the chip to be detected according to the high-precision image sample obtained after the correlation calculation to obtain the appearance characteristic information of the chip to be detected. And determining the abnormal category of the chip sample characteristics based on the matching parameters, determining the corresponding abnormal alarm prompt according to the abnormal category of the chip sample characteristics, and carrying out abnormal alarm.
It should be noted that, in the above steps of the present invention, an imaging and image acquisition module is used to acquire an image of a surface of a chip to be tested, so as to obtain an original image sample I0. The image sample may be magnified by a microscopic imaging system. And (3) performing association calculation on the original image I0 and a matrix M corresponding to the coding control mode of the motion control module in the step three. The purpose of the correlation calculation is to reassign and interpolate pixel values in the original image to obtain a higher precision image. And generating a high-precision image through a result obtained by the correlation calculation. The image has higher resolution and precision, and is helpful for improving the capturing capability of the chip details to be tested. And extracting characteristic information of the high-precision image by utilizing an information processing and analyzing module. Which is used to identify and quantify the appearance characteristics of the chip to be inspected, such as shape, color, texture, etc. Based on the extracted feature information, the matching parameters are used to determine an anomaly class of the chip sample feature for comparing the extracted feature with the desired feature of the normal sample. Once the anomaly category of the chip sample feature is determined, the system may generate a corresponding anomaly alert prompt. Including displaying the abnormal region, providing a description of the type of abnormality, etc.
Step seven: this step is used to enable detection and analysis of the chip appearance. And outputting a corresponding detection result according to the processing analysis result of the information processing analysis module, and judging whether the chip sample to be detected has an out-of-standard flaw or not based on the detection result and the set flaw standard. If yes, marking the defect area, making a corresponding alarm prompt and outputting a detection report; if no out-of-standard flaw exists, the detection report is directly output.
It should be noted that, in the above steps of the present invention, the information processing and analyzing module outputs the detection result according to the previous image processing and analyzing steps. The results include various quantitative and qualitative analyses of chip appearance characteristics, such as shape, color, texture, and the like. Based on the information processing analysis result, the system judges whether the chip sample to be tested has an exceeding flaw. This can be achieved by comparison with a preset flaw criterion. And if the detection result meets the standard exceeding condition defined in the flaw standard, judging that the standard exceeding flaw exists. If there is an out-of-limit flaw, the system may mark the corresponding defect area for display in the final inspection report. The display mode includes indicating the positions of flaws on the image by marks or bounding boxes. For the case of an out-of-limit flaw, the system may generate a corresponding alert prompt. The prompts may include textual descriptions, graphical indicia, or other forms that alert the operator to a particular area or take further action. The system outputs a final detection report which comprises detection results, whether out-of-standard flaws exist, marked defect areas and the like. Reports may be used to record the detection process, provide visual feedback, and serve as a reference for quality control. If the chip sample to be tested does not detect out-of-standard flaws, the system directly outputs a detection report without marking the flaw area or generating additional alarms. In this case, the report reflects the result that the sample to be tested meets the expected standard in appearance.
According to the above embodiments, the final experimental system obtained the target detection results as shown in fig. 4 and 5. The embodiment result shows that the method and the device can conveniently and rapidly realize the reconstruction of the high-resolution image with lower hardware configuration, simultaneously keep a higher field angle, finally realize better and faster measurement results, can be widely applied to optical imaging and detection, can be applied to biological sample detection and object type identification scenes, and provide a simple, feasible and low-cost detection method and device for improving the accuracy of detection results. The method is convenient for a manager to process the abnormal chips in time, improves the processing efficiency and ensures the production quality of the chips.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (9)
1. The utility model provides a chip outward appearance detection device based on motion time association control, includes accurate adjustment platform (1), microscopic imaging system (2), micro-motion module (3), formation of image and image acquisition module (4), motion control module (5), synchronous time sequence trigger generation module (6) and information processing analysis module (7), its characterized in that: the imaging and image acquisition module (4) is integrated in the micro-motion module (3), the micro-motion module (3) is installed on the micro-imaging system (2), the micro-motion module (3), the imaging and image acquisition module (4) and the micro-imaging system (2) are coaxially arranged, the motion control module (5) is electrically connected with the synchronous time sequence trigger generation module (6) and the information processing analysis module (7) respectively, the imaging and image acquisition module (4) is electrically connected with the synchronous time sequence trigger generation module (6) and the information processing analysis module (7) respectively, and the synchronous time sequence trigger generation module (6) is electrically connected with the information processing analysis module (7);
the micro-motion module (3) is used for providing high-precision displacement;
the imaging and image acquisition module (4) is used for acquiring single images;
the motion control module (5) is used for completing the coded displacement in a specified period;
the synchronous time sequence trigger generation module (6) is used for generating a synchronous trigger signal;
the information processing analysis module (7) is used for extracting and analyzing data.
2. The chip appearance detection device based on motion time correlation control of claim 1, wherein: the micro-motion module (3) consists of a high-precision piezoelectric ceramic displacement table, wherein the displacement precision of the piezoelectric ceramic displacement table is nano-scale and the displacement range is micro-scale.
3. The chip appearance detection device based on motion time correlation control according to claim 2, wherein: the micro-motion module (3) is electrically connected with the motion control module (5), the displacement of the micro-motion module (3) is controlled by the motion control module (5) in a coding mode, the coding control mode of the motion control module (5) is set in advance by the information processing analysis module (7), and the coded displacement is completed in a specified period after triggering.
4. A chip appearance detection device based on motion time correlation control as claimed in claim 3, wherein: the imaging and image acquisition module (4) and the motion control module (5) are controlled by the synchronous trigger signal generated by the synchronous time sequence trigger generation module (6), and displacement control and single image acquisition work are started when the synchronous pulse signal is received.
5. The motion time correlation control-based chip appearance detection device according to claim 4, wherein: the synchronous time sequence trigger generation module (6) only generates one synchronous trigger signal at a time, and the synchronous trigger signal is generated each time and is started by an instruction sent by the information processing analysis module (7).
6. The method for detecting the appearance of the chip based on the motion time correlation control according to claim 5, wherein the method comprises the following steps: the method comprises the following steps:
step one: placing a chip to be tested on a precise adjustment table (1), and adjusting the position and the height of the precise adjustment table (1) to precisely and three-dimensionally adjust the position of the chip to be tested;
step two: the chip to be detected is adjusted to enable the microscopic imaging system (2) and the imaging and image acquisition module (4) to clearly image the chip, so that the chip is located at the focal plane of the microscopic imaging system (2), namely on the sensor plane of the imaging and image acquisition module (4), and the microscopic imaging system (2) performs optical microscopic amplification on the chip to be detected;
step three: the information processing analysis module (7) is utilized to set the coding control mode of the motion control module (5) and is used for realizing the motion control of the micro-motion module (3) through subsequent trigger output;
step four: the information processing analysis module (7) is utilized to set exposure time parameters of the imaging and image acquisition module (4) for subsequent triggering of image acquisition;
step five: transmitting a starting instruction to a synchronous time sequence trigger generation module (6) by utilizing the information processing analysis module (7), wherein the synchronous time sequence trigger generation module (6) generates a single synchronous pulse trigger signal to trigger a motion control module (5) and an imaging and image acquisition module (4) respectively and simultaneously;
step six: inputting the image acquired by the imaging and image acquisition module (4) into an information processing analysis module (7), performing association calculation on the acquired image and the coding information of the motion control module (5) in the third step to acquire a higher-precision image, and simultaneously performing image processing based on a preset algorithm to extract sample characteristic information;
step seven: and outputting a corresponding detection result according to the processing analysis result of the information processing analysis module (7), and making a corresponding alarm prompt based on the detection result so as to realize the detection and analysis of the appearance of the chip.
7. The method for detecting the appearance of the chip based on the motion time correlation control according to claim 6, wherein the method comprises the following steps: the method for setting the coding control mode in the third step is to set the displacement sequence of the motion control module (5) on the X-Y plane in the time period of the exposure period of the image sensor, and set the distance of each step of displacement and the time kept at the current position.
8. The method for detecting the appearance of the chip based on the motion time correlation control according to claim 6, wherein the method comprises the following steps:
the method for setting the exposure time parameter in the fourth step is that the exposure period of the image sensor is consistent with the total time of the coding control displacement in the third step, and other parameters are kept unchanged in the period.
9. The method for detecting the appearance of the chip based on the motion time correlation control according to claim 6, wherein the method comprises the following steps: the method for extracting the sample characteristic information in the step six is as follows:
carrying out data acquisition on the sample image amplified by the microscopic imaging system (2) to obtain an appearance image sample I0 of the detection chip;
performing association calculation on the original image I0 and a matrix M corresponding to the coding control mode of the motion control module (5) in the third step, so as to realize the reassignment and interpolation of the values of the I0 pixel points of the original image and obtain an image with higher degree of update;
and extracting the characteristic information of the chip to be detected according to the image sample obtained after the association calculation to obtain the appearance characteristic information of the detection chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410021268.7A CN117805118B (en) | 2024-01-05 | 2024-01-05 | Detection method of chip appearance detection device based on motion time association control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410021268.7A CN117805118B (en) | 2024-01-05 | 2024-01-05 | Detection method of chip appearance detection device based on motion time association control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117805118A true CN117805118A (en) | 2024-04-02 |
| CN117805118B CN117805118B (en) | 2024-09-10 |
Family
ID=90433664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410021268.7A Active CN117805118B (en) | 2024-01-05 | 2024-01-05 | Detection method of chip appearance detection device based on motion time association control |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117805118B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000011981A (en) * | 1998-07-28 | 2000-02-25 | 가나이 쓰토무 | Apparatus for inspecting defects and method thereof |
| CN108769530A (en) * | 2018-06-19 | 2018-11-06 | 朱炳强 | Image acquisition and processing equipment and image acquisition and processing method |
| CN110006905A (en) * | 2019-01-25 | 2019-07-12 | 杭州晶耐科光电技术有限公司 | A kind of ultra-clean smooth surface defect detecting device of heavy caliber that line area array cameras combines |
| CN219016680U (en) * | 2022-12-15 | 2023-05-12 | 苏州博众半导体有限公司 | Chip appearance imaging detection system |
| CN116448780A (en) * | 2023-03-06 | 2023-07-18 | 武汉光谷卓越科技股份有限公司 | Chip defect detection device, method and equipment |
-
2024
- 2024-01-05 CN CN202410021268.7A patent/CN117805118B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000011981A (en) * | 1998-07-28 | 2000-02-25 | 가나이 쓰토무 | Apparatus for inspecting defects and method thereof |
| CN108769530A (en) * | 2018-06-19 | 2018-11-06 | 朱炳强 | Image acquisition and processing equipment and image acquisition and processing method |
| CN110006905A (en) * | 2019-01-25 | 2019-07-12 | 杭州晶耐科光电技术有限公司 | A kind of ultra-clean smooth surface defect detecting device of heavy caliber that line area array cameras combines |
| CN219016680U (en) * | 2022-12-15 | 2023-05-12 | 苏州博众半导体有限公司 | Chip appearance imaging detection system |
| CN116448780A (en) * | 2023-03-06 | 2023-07-18 | 武汉光谷卓越科技股份有限公司 | Chip defect detection device, method and equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117805118B (en) | 2024-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11386542B2 (en) | Training data creation method and device, and defect inspection method and device | |
| JP6975474B2 (en) | Systems and methods for performing automated analysis of air samples | |
| US9329024B2 (en) | Dimension measuring apparatus, dimension measuring method, and program for dimension measuring apparatus | |
| KR101202527B1 (en) | Defect observation device and defect observation method | |
| KR101386358B1 (en) | Inspection method and device therefor | |
| US20210215923A1 (en) | Microscope system | |
| JP2007163723A (en) | Endoscope system | |
| US7205531B2 (en) | Sample information measuring method and scanning confocal microscope | |
| JP2014521978A (en) | Method for presenting and evaluating images of microtiter plate characteristics | |
| JP2000180330A (en) | Durometer | |
| JP2012037257A (en) | Measurement setting data creation device, measurement setting data creation method, and program for measurement setting data creation device | |
| JP2012189399A (en) | X-ray analysis apparatus | |
| JP2012032341A (en) | Measurement setting data preparation device, measurement setting data preparation method, program for measurement setting data preparation device, and dimension measurement device | |
| JP2010080144A (en) | Compound microscope device and method of observing sample | |
| CN117805118B (en) | Detection method of chip appearance detection device based on motion time association control | |
| WO2017033591A1 (en) | Charged particle beam device and sample stage alignment adjustment method | |
| JP4650107B2 (en) | Measuring device with confocal optical system | |
| JP2000146794A (en) | Rockwell hardness tester | |
| JP5191265B2 (en) | Optical microscope apparatus and data processing apparatus for optical microscope | |
| CN109298519B (en) | Industrial on-line optical microscopic imaging system | |
| KR102602005B1 (en) | charged particle beam device | |
| JP2010121955A (en) | Height information acquisition device, height information acquisition method, and program | |
| JP3137634U (en) | Macro micro navigation system | |
| WO2023053540A1 (en) | Imaging method, focus position adjustment method, and microscope system | |
| CN118464799A (en) | Confocal-based rapid and accurate automatic focusing chip appearance detection device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: Room 102, 1st Floor, Block A, Building 10, No. 611 Dongguan Road, Puyan Street, Binjiang District, Hangzhou City, Zhejiang Province, 310000 Applicant after: Nanoscience Instrument Equipment (Hangzhou) Co.,Ltd. Address before: 201206, 1st to 2nd floors, Building 48, No. 1000 Jinhai Road, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai Applicant before: Nano Science Instrument Equipment (Shanghai) Co.,Ltd. Country or region before: China |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |