CN117805118A - A chip appearance detection device and method based on motion time correlation control - Google Patents
A chip appearance detection device and method based on motion time correlation control Download PDFInfo
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Abstract
Description
技术领域Technical field
本发明涉及芯片外观光学检测技术领域,具体为一种基于运动时间关联控制的芯片外观检测装置及方法。The present invention relates to the technical field of chip appearance optical detection, specifically a chip appearance detection device and method based on motion time correlation control.
背景技术Background technique
随着芯片制造技术的不断发展,芯片尺度越来越小,对芯片的检测变得越来越重要。芯片外观检测作为一种光学视觉检测技术,具有非接触快速优点,被广泛应用于半导体芯片、集成电路、电子元件领域。在芯片外观检测中,系统硬件是影响检测结果的一个重要因素。系统硬件的参数性能直接影响到芯片外观图像的质量和检测结果的准确性。虽然,现有的芯片外观检测系统在分辨率和检测速度方面有很大的发展,但存在着大视场、高分辨率系统硬件制造困难,成本高昂问题,这一定程度上限制了芯片外观检测系统的发展和应用。With the continuous development of chip manufacturing technology, the size of chips is getting smaller and smaller, and the detection of chips has become more and more important. As an optical visual inspection technology, chip appearance inspection has the advantage of non-contact and rapid speed, and is widely used in the fields of semiconductor chips, integrated circuits, and electronic components. In chip appearance inspection, system hardware is an important factor affecting the inspection results. The parameter performance of the system hardware directly affects the quality of the chip appearance image and the accuracy of the detection results. Although the existing chip appearance inspection systems have made great progress in terms of resolution and inspection speed, there are still problems such as difficulty in manufacturing large field of view and high resolution system hardware and high cost, which limits chip appearance inspection to a certain extent. System development and application.
发明内容Contents of the invention
本发明的目的在于提供一种基于运动时间关联控制的芯片外观检测装置及方法,旨在解决现有芯片外观检测系统硬件对成像分辨率和视场参数的限制,并以较低的硬件配置实现高价硬件配置才能实现的高分辨和大视场成像检测。本发明通过在图像采集部分引入高精度的编码微运动,通过同步时序触发,得到初步被测样品表面图像,再将其和编码运动信息关联计算后,对图像进行插值和像素点值的重新分配,在保持原有视场的情况下得到更高分辨率的图像,显示出样品更多的细节信息,从而实现高放大倍数系统才能实现的图像效果。The purpose of the present invention is to provide a chip appearance detection device and method based on motion time correlation control, aiming to solve the limitations of the existing chip appearance detection system hardware on imaging resolution and field of view parameters, and to achieve high-resolution and large field of view imaging detection that can only be achieved with high-priced hardware configurations with low hardware configurations. The present invention introduces high-precision coded micro-motion in the image acquisition part, and obtains a preliminary surface image of the sample under test through synchronous timing triggering, and then interpolates the image and redistributes the pixel value after associating it with the coded motion information, so as to obtain a higher resolution image while maintaining the original field of view, showing more detailed information of the sample, thereby achieving an image effect that can only be achieved by a high magnification system.
为实现上述目的,本发明提供如下技术方案:一种基于运动时间关联控制的芯片外观检测方法,包括以下步骤:To achieve the above object, the present invention provides the following technical solution: a chip appearance detection method based on motion time correlation control, comprising the following steps:
步骤一:将待测芯片放置到精密调整台上,调整精密调整台的位置及高度,对待测芯片的位置进行精准三维调节;Step 1: Place the chip to be tested on the precision adjustment table, adjust the position and height of the precision adjustment table, and make precise three-dimensional adjustments to the position of the chip to be tested;
步骤二:将待测芯片调至使显微成像系统和成像及图像采集模块能对芯片清晰成像,保证芯片处在显微成像系统焦平面处,即成像及图像采集模块的传感器平面上,显微成像系统对待测芯片进行光学显微放大;Step 2: Adjust the chip to be tested so that the microscopic imaging system and the imaging and image acquisition module can clearly image the chip, ensuring that the chip is at the focal plane of the microscopic imaging system, that is, on the sensor plane of the imaging and image acquisition module. The micro-imaging system performs optical microscopic magnification on the chip under test;
步骤三:利用所述信息处理分析模块对运动控制模块的编码控制方式进行设置,用于后续触发输出实现对微运动模块的运动控制;Step 3: Use the information processing and analysis module to set the encoding control mode of the motion control module for subsequent trigger output to realize motion control of the micro-motion module;
步骤四:利用所述信息处理分析模块对成像及图像采集模块的曝光时间参数进行设置,用于后续触发图像采集;Step 4: Use the information processing and analysis module to set the exposure time parameters of the imaging and image acquisition module for subsequent triggering of image acquisition;
步骤五:利用所述信息处理分析模块对同步时序触发生成模块发送启动指令,同步时序触发生成模块生成单个同步脉冲触发信号,分别同时触发运动控制模块和成像及图像采集模块;Step 5: using the information processing and analysis module to send a start instruction to the synchronous timing trigger generation module, the synchronous timing trigger generation module generates a single synchronous pulse trigger signal, and triggers the motion control module and the imaging and image acquisition module respectively at the same time;
步骤六:将成像及图像采集模块采集到的图像输入到信息处理分析模块,将采集到的图像和步骤三中对运动控制模块的编码信息进行关联计算,获取更高精度的图像,同时基于预设算法进行图像处理,提取样品特征信息;Step six: Input the images collected by the imaging and image acquisition module to the information processing and analysis module, and perform correlation calculations between the collected images and the encoded information of the motion control module in step three to obtain higher-precision images. At the same time, based on the prediction Set up an algorithm to perform image processing and extract sample feature information;
步骤七:根据信息处理分析模块的处理分析结果输出对应的检测结果,并基于检测结果做出对应警报提示,实现对芯片外观的检测和分析。Step 7: Output the corresponding detection results according to the processing and analysis results of the information processing and analysis module, and make corresponding alarm prompts based on the detection results to realize the detection and analysis of the chip appearance.
作为优选,所述步骤三中的编码控制方式设置的方法为设置图像传感器曝光周期的时间段内运动控制模块在X-Y平面上的位移顺序,设置每一步位移的距离以及在当前位置保持的时间。Preferably, the encoding control mode setting method in step three is to set the displacement sequence of the motion control module on the X-Y plane within the time period of the image sensor exposure cycle, set the distance of each step of displacement and the time to maintain the current position.
作为优选,所述步骤四中曝光时间参数进行设置的方法为设置图像传感器曝光周期与步骤三中的编码控制位移总时间一致,其他参数在该周期内保持不变。Preferably, the method for setting the exposure time parameters in step four is to set the image sensor exposure period to be consistent with the total encoding control displacement time in step three, and other parameters remain unchanged during this period.
作为优选,所述步骤六中提取样品特征信息方法为:Preferably, the method for extracting sample characteristic information in step 6 is:
对经过显微成像系统放大后的样品图像进行数据采集,获得检测芯片的外观图像样本I0;Collect data from the sample image amplified by the microscopic imaging system to obtain the appearance image sample I0 of the detection chip;
将原始图像I0与步骤三中对运动控制模块的编码控制方式对应的矩阵M进行关联计算,从而实现对原图像I0个像素点的值进行重新分配和插值,得到更高新度的图像;Perform correlation calculations on the original image I0 and the matrix M corresponding to the encoding control method of the motion control module in step 3, thereby redistributing and interpolating the values of the pixels of the original image I0 to obtain a higher-level image;
针对所述关联计算后得到的图像样本进行待检测芯片的特征信息提取,获得所述检测芯片的外观特征信息。Extract the characteristic information of the chip to be detected from the image sample obtained after the correlation calculation, and obtain the appearance characteristic information of the detection chip.
与现有技术相比,本发明的有益效果是:Compared with the prior art, the beneficial effects of the present invention are:
1.本发明装置结构通过较低放大倍率和较低配置的显微成像系统对芯片样品进行光学显微放大,配合图像采集模块的精确编码运动,对经过显微成像系统放大后的样品图像进行数据采集,并将采集到的图像结合编码信息进行关联计算,对图像进行插值和像素值重分配,通过计算成像的方式实现了高分辨的成像效果。引入运动时间编码信息,通过算法来实现高分辨率的效果,降低了成像分辨率对系统硬件配置的依赖,具有更简单的硬件要求和、更低的系统成本1. The device structure of the present invention uses a microscopic imaging system with a lower magnification and lower configuration to perform optical microscopic magnification on chip samples, cooperates with the precise coding movement of the image acquisition module, collects data on the sample image after being magnified by the microscopic imaging system, and combines the collected image with the coding information for correlation calculation, interpolates the image and redistributes the pixel values, and achieves high-resolution imaging effects through computational imaging. The introduction of motion time coding information and the use of algorithms to achieve high-resolution effects reduce the dependence of imaging resolution on system hardware configuration, and has simpler hardware requirements and lower system costs.
2.本发明引入运动时间编码信息,通过算法来实现高分辨率的效果,在实现高分辨率的同时保持了原有的视场角,相比同级分辨率的系统,具有更小的放大倍数和更高的视场角,从而使系统能够更快的检测更大的芯片表面范围。2. The present invention introduces motion time coding information and uses algorithms to achieve high-resolution effects. While achieving high resolution, it maintains the original field of view and has smaller amplification than systems with the same level of resolution. magnification and higher field of view, allowing the system to detect a larger chip surface area faster.
3.本发明通过引入运动时间编码信息和关联成像,将获取的芯片样品特征进行比对判断,确定芯片是否异常,将存在异常的芯片进行异常芯片样品特征匹配,基于匹配的参数确定异常类别,进行对应的异常警报提示,方便管理人员及时做出应对方案,及时对异常芯片进行处理,提高了处理效率,保证了芯片的生产质量。3. The present invention introduces motion time coding information and associated imaging to compare and judge the acquired chip sample features, determine whether the chip is abnormal, match the abnormal chip sample features for the abnormal chip, determine the abnormal category based on the matching parameters, and issue corresponding abnormal alarm prompts, so as to facilitate management personnel to make response plans in time and deal with abnormal chips in time, thereby improving processing efficiency and ensuring chip production quality.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本发明的芯片外观检测装置示意图;Figure 1 is a schematic diagram of the chip appearance detection device of the present invention;
图2为本发明的成像及图像采集模块集成在微运动模块上的示意图;Figure 2 is a schematic diagram of the imaging and image acquisition module of the present invention integrated on the micro-motion module;
图3为本发明的基于运动时间关联控制的芯片外观检测方法流程图;FIG3 is a flow chart of a chip appearance detection method based on motion time correlation control of the present invention;
图4为本发明的实施例测试结果原始图;Figure 4 is an original graph of test results according to the embodiment of the present invention;
图5为本发明的实施例测试结果处理后的图。Figure 5 is a diagram of processed test results according to the embodiment of the present invention.
图中:1、精密调整台;2、显微成像系统;3、微运动模块;4、成像及图像采集模块;5、运动控制模块;6、同步时序触发生成模块;7、信息处理分析模块。In the figure: 1. Precision adjustment stage; 2. Microscopic imaging system; 3. Micro-motion module; 4. Imaging and image acquisition module; 5. Motion control module; 6. Synchronous timing trigger generation module; 7. Information processing and analysis module.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
请参阅图1-4,本发明提供一种技术方案:一种基于运动时间关联控制的芯片外观检测装置,包括精密调整台、显微成像系统、微运动模块、成像及图像采集模块、运动控制模块、同步时序触发生成模块和信息处理分析模块。其中,成像及图像采集模块集成在微运动模块中,微运动模块安装在显微成像系统上,微运动模块、成像及图像采集模块和显微成像系统同轴放置,微运动模块与运动控制模块电连接,运动控制模块分别与同步时序触发生成模块和信息处理分析模块电连接,成像及图像采集模块分别与同步时序触发生成模块和信息处理分析模块电连接,同步时序触发生成模块与信息处理分析模块电连接。Please refer to Figures 1-4. The present invention provides a technical solution: a chip appearance detection device based on motion time correlation control, including a precision adjustment table, a microscopic imaging system, a micro-motion module, an imaging and image acquisition module, and a motion control module, synchronization timing trigger generation module and information processing analysis module. Among them, the imaging and image acquisition module is integrated in the micro-motion module. The micro-motion module is installed on the microscopic imaging system. The micro-motion module, imaging and image acquisition module and microscopic imaging system are coaxially placed. The micro-motion module and the motion control module Electrically connected, the motion control module is electrically connected to the synchronous timing trigger generation module and the information processing analysis module respectively. The imaging and image acquisition module is electrically connected to the synchronous timing trigger generation module and the information processing analysis module respectively. The synchronous timing trigger generation module is electrically connected to the information processing analysis module. Module electrical connections.
需要说明的是,本发明中精密调整台:用于支撑和精确调整芯片的位置,以确保在检测过程中获取准确的图像。It should be noted that the precision adjustment stage in the present invention is used to support and accurately adjust the position of the chip to ensure that accurate images are obtained during the detection process.
显微成像系统:提供高分辨率的显微成像功能,用于观察芯片的微观细节,其中显微成像系统包括物镜、目镜、光源、调焦系统、样本台、探测器、滤光片、图像处理单元以及软件,物镜(Objective):物镜是显微成像系统的核心光学元件之一,负责聚焦光线以形成放大的图像。不同物镜具有不同的放大倍数和工作距离,用于实现不同程度的细微结构观察。目镜(Eyepiece):目镜用于观察者直接观察样本,尽管在现代显微成像系统中,数字摄像机和显示器也经常用于图像显示。光源:光源提供照明,照亮样本以使其在显微镜下可见。常见的光源包括白光LED、卤素灯或者汞弧光源,具体选择取决于应用需求。调焦系统:调焦系统用于调整物镜与样本之间的焦距,以获得清晰的图像。可以通过手动旋钮、自动聚焦或电动聚焦等方式实现。样本台(Stage):样本台支撑和定位待观察的样本。它具有X、Y、Z轴的调整,允许用户在不同位置对样本进行定位和观察。探测器:探测器捕获经过物镜和样本后的光信号,将其转换为电信号。现代显微成像系统中常使用数字摄像机作为探测器。滤光片:滤光片用于选择特定波长的光线,有助于增强对样本的特定特征的观察,比如荧光显微镜中的荧光滤光片。图像处理单元:图像处理单元用于处理、存储和显示成像系统捕获的图像。这包括调整对比度、亮度、颜色平衡等调整,以及进行数字图像分析和处理。数字摄像机和计算机:现代显微成像系统使用数字摄像机捕获图像,并通过计算机进行实时处理和显示。系统允许数字化图像,方便存储、分享和进一步分析。软件:显微成像系统附带特定的软件,用于控制系统、采集和处理图像,并包含一些图像分析工具。Microscopic imaging system: Provides high-resolution microscopic imaging function for observing the microscopic details of the chip. The microscopic imaging system includes an objective lens, an eyepiece, a light source, a focusing system, a sample stage, a detector, a filter, an image processing unit, and software. Objective lens: The objective lens is one of the core optical components of the microscopic imaging system, responsible for focusing light to form an enlarged image. Different objective lenses have different magnifications and working distances, which are used to achieve different degrees of microstructure observation. Eyepiece: The eyepiece is used for the observer to directly observe the sample, although in modern microscopic imaging systems, digital cameras and monitors are also often used for image display. Light source: The light source provides illumination, illuminating the sample to make it visible under the microscope. Common light sources include white light LEDs, halogen lamps, or mercury arc light sources, and the specific choice depends on the application requirements. Focusing system: The focusing system is used to adjust the focal length between the objective lens and the sample to obtain a clear image. This can be achieved by manual knobs, automatic focusing, or electric focusing. Sample stage: The sample stage supports and positions the sample to be observed. It has X, Y, and Z axis adjustments, allowing the user to position and observe the sample at different positions. Detector: The detector captures the light signal after it passes through the objective lens and the sample, and converts it into an electrical signal. Digital cameras are often used as detectors in modern microscopy systems. Filters: Filters are used to select specific wavelengths of light, which helps to enhance the observation of specific features of the sample, such as fluorescence filters in fluorescence microscopes. Image processing unit: The image processing unit is used to process, store, and display the images captured by the imaging system. This includes adjustments such as contrast, brightness, color balance, as well as digital image analysis and processing. Digital Cameras and Computers: Modern microscopy systems use digital cameras to capture images and use computers for real-time processing and display. The system allows digitized images for easy storage, sharing, and further analysis. Software: Microscopy systems come with specific software to control the system, acquire and process images, and include some image analysis tools.
微运动模块:与显微成像系统同轴放置,用于微小的运动控制。其可以是微动力台或其他能够实现微运动的设备。Micro-motion module: placed coaxially with the microscopic imaging system, used for tiny motion control. It can be a micro-power stage or other equipment capable of achieving micro-motion.
成像及图像采集模块:集成在微运动模块中,负责在运动过程中实时采集图像。这有助于捕捉运动中的微小细节。Imaging and image acquisition module: integrated in the micro-motion module, responsible for real-time image acquisition during motion. This helps capture tiny details in motion.
运动控制模块:控制微运动模块的运动,确保对芯片进行精确的定位和运动。包括对XYZ轴的运动控制。Motion control module: Controls the movement of the micro-motion module to ensure precise positioning and movement of the chip. Including motion control of XYZ axis.
同步时序触发生成模块:生成同步时序触发信号,确保微运动模块、运动控制模块和成像及图像采集模块在协同工作时具有同步的时序。Synchronous timing trigger generation module: generates synchronous timing trigger signals to ensure that the micro-motion module, motion control module, and imaging and image acquisition module have synchronized timing when working together.
信息处理分析模块:对从成像及图像采集模块获取的图像进行处理和分析。这包括图像识别、特征提取、缺陷检测等算法,以实现对芯片外观的有效检测和分析。Information processing and analysis module: Process and analyze images obtained from the imaging and image acquisition module. This includes image recognition, feature extraction, defect detection and other algorithms to achieve effective detection and analysis of chip appearance.
上述装置的操作方法为:待测芯片放置:待测芯片被放置在精密调整台上,位于显微成像系统的视野中,即待测芯片区域。调整精密调整台与显微成像系统的间距:通过调整精密调整台与显微成像系统的间距,确保成像系统能够获得清晰的、高分辨率的图像。预设运动控制和成像参数:信息处理分析模块预先设定了运动控制模块的编码控制方式和成像及图像采集模块的参数。这包括位移步长、成像频率等参数。发送同步触发信号指令:信息处理分析模块向同步时序触发生成模块发送指令,触发同步时序触发生成模块生成同步触发信号。同步触发信号传递:同步时序触发生成模块生成的同步触发信号被传递给运动控制模块和成像及图像采集模块。位移控制和图像采集开始:运动控制模块接收到同步触发信号后,开始执行预设的位移控制工作。同时,成像及图像采集模块也在同步信号触发下开始进行单次图像采集。图像获取和运动控制信息关联计算:信息处理分析模块获取成像及图像采集模块采集到的图像。通过结合运动控制模块的编码控制信息,进行关联计算,以确保每一步的图像都与相应的位移信息关联。生成高分辨率图像:结合所有采集到的图像,信息处理分析模块生成一张更高分辨率的样品外观图像。这有助于提高检测的精度和清晰度。图像识别和分析:对生成的高分辨率图像进行图像识别和分析。这包括缺陷检测、特征提取、形状分析等操作。输出检测报告:根据识别和分析的结果,信息处理分析模块生成检测报告。报告包含有关芯片外观的详细信息,如缺陷位置、形状、大小等。The operation method of the above device is as follows: Placement of the chip to be tested: The chip to be tested is placed on the precision adjustment table and is located in the field of view of the microscopic imaging system, that is, the chip area to be tested. Adjust the distance between the precision adjustment stage and the microscope imaging system: By adjusting the distance between the precision adjustment stage and the microscope imaging system, ensure that the imaging system can obtain clear, high-resolution images. Preset motion control and imaging parameters: The information processing and analysis module presets the encoding control method of the motion control module and the parameters of the imaging and image acquisition module. This includes parameters such as displacement step size and imaging frequency. Send a synchronization trigger signal instruction: the information processing and analysis module sends an instruction to the synchronization timing trigger generation module, which triggers the synchronization timing trigger generation module to generate a synchronization trigger signal. Synchronous trigger signal transmission: The synchronous trigger signal generated by the synchronous timing trigger generation module is transmitted to the motion control module and imaging and image acquisition module. Displacement control and image acquisition start: After the motion control module receives the synchronous trigger signal, it starts to execute the preset displacement control work. At the same time, the imaging and image acquisition module also starts a single image acquisition triggered by the synchronization signal. Image acquisition and motion control information correlation calculation: the information processing and analysis module acquires the images collected by the imaging and image acquisition module. By combining the encoded control information of the motion control module, correlation calculation is performed to ensure that the image of each step is associated with the corresponding displacement information. Generate high-resolution images: Combining all acquired images, the information processing and analysis module generates a higher-resolution image of the sample appearance. This helps improve detection accuracy and clarity. Image recognition and analysis: Perform image recognition and analysis on the generated high-resolution images. This includes operations such as defect detection, feature extraction, shape analysis, and more. Output detection report: Based on the identification and analysis results, the information processing and analysis module generates a detection report. The report contains detailed information about the chip's appearance, such as defect location, shape, size, etc.
图2展示了本发明的成像及图像采集模块集成在微运动模块上的方式。FIG. 2 shows the manner in which the imaging and image acquisition module of the present invention is integrated on the micro-motion module.
为了更好的体现一种基于运动时间关联控制的芯片外观检测装置的检测流程,如图3所示,本发明提出一种基于运动时间关联控制的芯片外观检测方法,包括以下步骤:In order to better reflect the detection process of a chip appearance detection device based on motion time correlation control, as shown in Figure 3, the present invention proposes a chip appearance detection method based on motion time correlation control, which includes the following steps:
步骤一:将处理好的待测芯片放置到精密调整台的上表面待测区域,调整精密调整台的位置及高度,以实现对待测芯片的位置进行精准三维调节;Step 1: Place the processed chip to be tested on the area to be tested on the upper surface of the precision adjustment table, and adjust the position and height of the precision adjustment table to achieve precise three-dimensional adjustment of the position of the chip to be tested;
需要说明的是,本发明上述步骤中将待测芯片小心地放置在精密调整台的上表面,确保芯片位于待测区域,使用调整装置,调整方式可以是手动旋钮、电动装置或其他调节机制,微调精密调整台的位置,以确保待测芯片处于所需的观察位置。通过在X、Y、Z轴上进行微小的调整,以保证芯片在视野中心,调整精密调整台的高度,以确保焦平面在待测芯片的表面上,以此方便获得清晰的、对焦良好的图像。It should be noted that in the above steps of the present invention, the chip to be tested is carefully placed on the upper surface of the precision adjustment table to ensure that the chip is located in the area to be tested. An adjustment device is used. The adjustment method can be a manual knob, an electric device or other adjustment mechanisms. Fine-tune the position of the precision adjustment stage to ensure that the chip under test is in the desired observation position. By making small adjustments on the X, Y, and Z axes to ensure that the chip is in the center of the field of view, and adjusting the height of the precision adjustment stage to ensure that the focal plane is on the surface of the chip under test, it is convenient to obtain clear and well-focused images. image.
步骤二:该步骤需要实现对待测芯片的清晰放大成像。具体操作为将待测芯片调至使显微成像系统和成像及图像采集模块能对芯片清晰成像,保证芯片处在显微成像系统焦平面处,即成像及图像采集模块的传感器平面上,显微成像系统对待测芯片进行光学显微放大;Step 2: This step requires clear magnified imaging of the chip under test. The specific operation is to adjust the chip to be tested so that the microscopic imaging system and the imaging and image acquisition module can clearly image the chip, ensuring that the chip is at the focal plane of the microscopic imaging system, that is, on the sensor plane of the imaging and image acquisition module. The micro-imaging system performs optical microscopic magnification on the chip under test;
需要说明的是,本发明上述步骤中使用显微镜系统的焦距调整功能,确保待测芯片处于焦平面上。通过手动或自动调整显微镜的焦距来实现。调整焦距的过程中可以观察到图像的清晰度变化,以找到最佳的焦点;确保光源充分照亮待测芯片,以获得清晰的图像。可以调整照明的亮度和方向,确保光线均匀而明亮地照射到芯片表面;在调整过程中,实时观察显微镜下的图像。确保芯片的微细结构清晰可见,以满足后续分析或检测的要求;根据待测芯片的特性和成像要求,调整成像及图像采集模块的参数,包括曝光时间、增益等。It should be noted that in the above steps of the present invention, the focus adjustment function of the microscope system is used to ensure that the chip to be tested is on the focal plane. This is achieved by manually or automatically adjusting the focus of the microscope. During the process of adjusting the focus, you can observe the change in image clarity to find the best focus; ensure that the light source fully illuminates the chip under test to obtain a clear image. The brightness and direction of the illumination can be adjusted to ensure that the light hits the chip surface evenly and brightly; during the adjustment process, the image under the microscope is observed in real time. Ensure that the microstructure of the chip is clearly visible to meet the requirements of subsequent analysis or detection; adjust the parameters of the imaging and image acquisition module according to the characteristics and imaging requirements of the chip to be tested, including exposure time, gain, etc.
步骤三:利用信息处理分析模块对运动控制模块进行编码控制方式设置,用于后续触发输出实现对微运动模块的运动控制。具体而言,可以通过设置图像传感器的曝光周期来控制运动控制模块在X-Y平面上的位移顺序,每一步位移的距离以及在当前位置的保持时间。Step 3: Use the information processing and analysis module to set the coding control mode of the motion control module, which is used for subsequent trigger output to realize motion control of the micro-motion module. Specifically, the displacement sequence of the motion control module on the X-Y plane, the distance of each step of displacement, and the holding time at the current position can be controlled by setting the exposure period of the image sensor.
需要说明的是,本发明上述步骤中利用信息处理分析模块,设定图像传感器的曝光周期。曝光周期决定了图像传感器在每次成像时所接收的光信号的时间长度。确定每一步位移的距离,即微小位移的步长。这个步长可以根据具体的应用需求进行调整。较小的步长可以提高位置控制的精度;确定在每个位置保持的时间长度。这是在进行微小位移后,在当前位置保持稳定的时间,以确保充分的曝光和图像采集;利用信息处理分析模块向运动控制模块发送编码控制的设置指令;运动控制模块根据信息处理分析模块提供的设置,开始在X-Y平面上执行微小位移,并在每个位置保持设定的时间;在每个位置上执行完微小位移并保持一定时间后,成像及图像采集模块根据设定的曝光周期进行图像采集。It should be noted that in the above steps of the present invention, the exposure cycle of the image sensor is set by using the information processing and analysis module. The exposure cycle determines the time length of the light signal received by the image sensor during each imaging. Determine the distance of each step of displacement, that is, the step length of the micro-displacement. This step length can be adjusted according to specific application requirements. A smaller step length can improve the accuracy of position control; determine the length of time to stay at each position. This is the time to remain stable at the current position after a micro-displacement to ensure sufficient exposure and image acquisition; use the information processing and analysis module to send the setting instructions of the encoding control to the motion control module; the motion control module starts to perform micro-displacements on the X-Y plane according to the settings provided by the information processing and analysis module, and maintains the set time at each position; after performing micro-displacements at each position and maintaining them for a certain time, the imaging and image acquisition module performs image acquisition according to the set exposure cycle.
步骤四:利用信息处理分析模块对成像及图像采集模块进行曝光时间参数设置,用于后续触发图像采集。具体而言,设置图像传感器曝光周期与步骤三中的编码控制位移总时间保持一致,其他参数在该周期内保持不变。Step 4: Use the information processing and analysis module to set the exposure time parameters of the imaging and image acquisition module for subsequent triggering of image acquisition. Specifically, set the image sensor exposure period to be consistent with the total encoded control displacement time in step three, and other parameters remain unchanged during this period.
需要说明的是,本发明上述步骤中根据步骤三中的编码控制位移的步长、位移顺序和在每个位置保持的时间,计算出编码控制位移总时间;利用信息处理分析模块,将图像传感器的曝光周期设置为计算得到的编码控制位移总时间。确保曝光周期能够覆盖整个微小位移的过程,以获得清晰的图像;在设置曝光周期时,确保其他与图像采集相关的参数保持不变。包括增益、帧率等;通过信息处理分析模块向成像及图像采集模块发送设置指令,将新的曝光周期参数传递给图像传感器。当曝光周期参数设置完成后,信息处理分析模块可以触发成像及图像采集模块执行图像采集操作。此时,图像传感器将按照设定的曝光周期进行图像采集。It should be noted that in the above steps of the present invention, the total coding control displacement time is calculated based on the step length of the coding control displacement in step three, the displacement sequence and the time held at each position; the information processing and analysis module is used to calculate the total time of the coding control displacement. The exposure period is set to the calculated total encoded control displacement time. Ensure that the exposure cycle can cover the entire process of small displacement to obtain a clear image; when setting the exposure cycle, ensure that other parameters related to image acquisition remain unchanged. Including gain, frame rate, etc.; send setting instructions to the imaging and image acquisition module through the information processing and analysis module, and transfer the new exposure cycle parameters to the image sensor. When the exposure cycle parameters are set, the information processing and analysis module can trigger the imaging and image acquisition module to perform image acquisition operations. At this time, the image sensor will collect images according to the set exposure cycle.
步骤五:利用信息处理分析模块对同步时序触发生成模块发送启动指令,收到指令后,同步时序触发生成模块生成单个同步脉冲触发信号,并分别同时传输到运动控制模块和成像及图像采集模块,检测到脉冲上升沿后,各模块开始运行对应的预设定的工作内容。Step 5: Use the information processing and analysis module to send a start instruction to the synchronous timing trigger generation module. After receiving the instruction, the synchronous timing trigger generation module generates a single synchronous pulse trigger signal and transmits it to the motion control module and the imaging and image acquisition module at the same time. After detecting the rising edge of the pulse, each module starts to run the corresponding preset work content.
需要说明的是,本发明上述步骤中在信息处理分析模块中,设置同步时序触发生成模块的参数,包括触发信号的频率、起始时间等;确保这些参数与系统的要求相匹配;在信息处理分析模块确定开始同步操作时,向同步时序触发生成模块发送启动指令;同步时序触发生成模块接收到启动指令后,开始生成同步脉冲触发信号;这个信号将用于同步运动控制模块和成像及图像采集模块的操作;同步时序触发生成模块生成的同步脉冲触发信号被同时传输到运动控制模块和成像及图像采集模块;确保信号能够准确到达各个模块;运动控制模块和成像及图像采集模块分别检测到同步脉冲触发信号的上升沿;这个上升沿通常被用作开始执行预设定工作内容的时间点;运动控制模块在检测到同步脉冲触发信号上升沿后开始执行预设定的工作内容,包括微小位移的运动控制,成像及图像采集模块在检测到同步脉冲触发信号上升沿后开始执行预设定的工作内容,如图像采集;各模块在完成预设定的工作内容后,可能会生成相应的完成信号或状态信息,以便信息处理分析模块或其他模块进一步处理。It should be noted that in the above steps of the present invention, the parameters of the synchronous timing trigger generation module are set in the information processing and analysis module, including the frequency and start time of the trigger signal, etc.; ensure that these parameters match the requirements of the system; when the information processing and analysis module determines to start the synchronous operation, a start instruction is sent to the synchronous timing trigger generation module; after receiving the start instruction, the synchronous timing trigger generation module starts to generate a synchronous pulse trigger signal; this signal will be used to synchronize the operation of the motion control module and the imaging and image acquisition module; the synchronous pulse trigger signal generated by the synchronous timing trigger generation module is simultaneously transmitted to the motion control module and the imaging and image acquisition module; ensure that the signal can accurately reach each module; the motion control module and the imaging and image acquisition module respectively detect the rising edge of the synchronous pulse trigger signal; this rising edge is usually used as the time point to start executing the preset work content; the motion control module starts to execute the preset work content after detecting the rising edge of the synchronous pulse trigger signal, including the motion control of small displacements, and the imaging and image acquisition module starts to execute the preset work content, such as image acquisition, after detecting the rising edge of the synchronous pulse trigger signal; each module may generate a corresponding completion signal or status information after completing the preset work content, so that the information processing and analysis module or other modules can further process it.
步骤六:该步骤主要包括首先采集芯片表面图像,然后通过关联计算得到高分辨图像,最后对高分辨率图像进行处理和分析。步骤为将成像及图像采集模块采集到的图像输入到信息处理分析模块,和步骤三中对运动控制模块的编码信息进行关联计算,以获取更高精度的图像,同时基于预设算法进行图像处理,提取样品特征信息。具体方法为:对经过显微成像系统放大后的待测样品图像进行数据采集,获得待检测芯片的外观图像样本I0。然后将得到的原始图像I0与步骤三中对运动控制模块的编码控制方式对应的矩阵M进行关联计算,从而实现对原图像I0个像素点的值进行重新分配和插值,得到更高精度的图像。针对关联计算后得到的高精度图像样本进行待检测芯片的特征信息提取,获得待检测芯片的外观特征信息。基于匹配参数确定芯片样品特征的异常类别,根据芯片样品特征的异常类别确定对应的异常警报提示,并进行异常警报。Step 6: This step mainly includes first collecting the chip surface image, then obtaining the high-resolution image through correlation calculation, and finally processing and analyzing the high-resolution image. The steps are to input the images collected by the imaging and image acquisition module into the information processing and analysis module, and perform correlation calculations on the encoded information of the motion control module in step 3 to obtain higher-precision images, and at the same time perform image processing based on the preset algorithm , extract sample characteristic information. The specific method is: collecting data from the image of the sample to be tested that has been amplified by the microscopic imaging system, and obtaining the appearance image sample I0 of the chip to be tested. Then, the obtained original image I0 is correlated with the matrix M corresponding to the encoding control method of the motion control module in step 3, so as to realize the redistribution and interpolation of the pixel values of the original image I0 and obtain a higher-precision image. . The feature information of the chip to be detected is extracted based on the high-precision image sample obtained after the correlation calculation, and the appearance feature information of the chip to be detected is obtained. Determine the abnormal category of the chip sample characteristics based on the matching parameters, determine the corresponding abnormal alarm prompt based on the abnormal category of the chip sample characteristics, and issue an abnormal alarm.
需要说明的是,本发明上述步骤中利用成像及图像采集模块采集待测芯片表面的图像,得到原始图像样本I0。图像样本可以经过显微成像系统的放大。将原始图像I0与步骤三中对运动控制模块的编码控制方式对应的矩阵M进行关联计算。关联计算的目的是重新分配和插值原图像中的像素值,以获取更高精度的图像。通过关联计算得到的结果,生成高精度的图像。该图像具有更高的分辨率和精度,有助于提高对待测芯片细节的捕捉能力。利用信息处理分析模块,对高精度图像进行特征信息提取。其用于识别和量化待检测芯片的外观特征,如形状、颜色、纹理等。基于提取的特征信息,使用匹配参数来确定芯片样品特征的异常类别,用于比较提取的特征与正常样本的期望特征。一旦确定了芯片样品特征的异常类别,系统可以生成相应的异常警报提示。其中包括显示异常区域、提供异常类型的描述等信息。It should be noted that in the above steps of the present invention, an imaging and image acquisition module is used to collect an image of the surface of the chip to be tested to obtain an original image sample I0. The image sample can be magnified by a microscopic imaging system. The original image I0 is associated with the matrix M corresponding to the coding control method of the motion control module in step three. The purpose of the association calculation is to redistribute and interpolate the pixel values in the original image to obtain a higher precision image. A high-precision image is generated by the result obtained by the association calculation. The image has higher resolution and accuracy, which helps to improve the ability to capture details of the chip to be tested. The information processing and analysis module is used to extract feature information from the high-precision image. It is used to identify and quantify the appearance features of the chip to be tested, such as shape, color, texture, etc. Based on the extracted feature information, matching parameters are used to determine the abnormal category of the chip sample feature, which is used to compare the extracted features with the expected features of the normal sample. Once the abnormal category of the chip sample feature is determined, the system can generate a corresponding abnormal alarm prompt. This includes displaying the abnormal area, providing a description of the abnormal type, and other information.
步骤七:该步骤用于实现对芯片外观的检测和分析。根据信息处理分析模块的处理分析结果输出对应的检测结果,并基于检测结果和设定的瑕疵标准判断待测芯片样品是否存在超标瑕疵。如果存在,则标记缺陷区域并做出对应警报提示、输出检测报告;如果没有超标瑕疵,则直接输出检测报告。Step 7: This step is used to detect and analyze the appearance of the chip. The corresponding detection results are output according to the processing and analysis results of the information processing and analysis module, and based on the detection results and the set defect standards, it is judged whether the chip sample to be tested has excessive defects. If it exists, the defective area will be marked, corresponding alarm prompts will be made, and the inspection report will be output; if there are no excessive defects, the inspection report will be output directly.
需要说明的是,本发明上述步骤中信息处理分析模块根据之前的图像处理和分析步骤输出检测结果。结果包括对芯片外观特征的各种定量和定性分析,例如形状、颜色、纹理等。基于信息处理分析结果,系统判断待测芯片样品是否存在超标瑕疵。可以通过与预设的瑕疵标准进行比较来实现。如果检测结果符合瑕疵标准中定义的超标条件,则判定存在超标瑕疵。如果存在超标瑕疵,系统可以标记相应的缺陷区域,以便在最终的检测报告中显示。显示方式包括在图像上用标记或边界框指示出存在瑕疵的位置。对于存在超标瑕疵的情况,系统可以生成相应的警报提示。提示可以包括文字描述、图形标记或其他形式,提醒操作者关注特定区域或采取进一步的行动。系统输出最终的检测报告,其中包括检测结果、是否存在超标瑕疵、标记的缺陷区域等信息。报告可以用于记录检测过程、提供可视化反馈,并作为质量控制的参考。如果待测芯片样品未检测到超标瑕疵,系统直接输出检测报告,无需标记缺陷区域或生成额外的警报。该情况下,报告反映了待测样品在外观上符合预期标准的结果。It should be noted that in the above steps of the present invention, the information processing and analysis module outputs the detection results based on the previous image processing and analysis steps. Results include various quantitative and qualitative analyzes of chip appearance characteristics, such as shape, color, texture, etc. Based on the information processing and analysis results, the system determines whether the chip sample to be tested contains excessive defects. This can be achieved by comparison with preset defect standards. If the test results meet the exceedance conditions defined in the defect standards, it is determined that there is an exceedance defect. If there are out-of-standard defects, the system can mark the corresponding defective areas for display in the final inspection report. Display methods include markers or bounding boxes on the image to indicate where defects exist. In the case of excessive defects, the system can generate corresponding alarm prompts. Prompts can include textual descriptions, graphical markers, or other forms that remind the operator to pay attention to a specific area or take further action. The system outputs the final inspection report, which includes inspection results, whether there are excessive defects, marked defect areas and other information. Reports can be used to record the inspection process, provide visual feedback, and serve as a reference for quality control. If no excessive defects are detected in the chip sample to be tested, the system directly outputs the inspection report without marking the defective area or generating additional alarms. In this case, the report reflects the appearance of the sample tested in compliance with the expected standards.
根据以上实施例,最终实验系统得到如图4和图5所示的目标检测结果。实施例结果表明,本发明中的方法和装置可以较低的硬件配置方便快捷地实现高分辨率的图像的重建,同时保持较高的视场角,最终实现更好更快的测量结果,本发明的装置和方法可广泛应用于光学成像和检测中,同时也可应用于生物样本检测、物品种类辨识场景,为提升检测结果精度提供了一种简单可行且低成本的检测方法和装置。方便管理人员及时对异常芯片进行处理,提高了处理效率,保证了芯片的生产质量。According to the above embodiments, the final experimental system obtains the target detection results shown in Figures 4 and 5. The results of the embodiments show that the method and device of the present invention can easily and quickly achieve high-resolution image reconstruction with a low hardware configuration, while maintaining a high field of view, and ultimately achieve better and faster measurement results. The device and method of the present invention can be widely used in optical imaging and detection, and can also be used in biological sample detection and object type identification scenarios, providing a simple, feasible and low-cost detection method and device for improving the accuracy of detection results. It is convenient for management personnel to handle abnormal chips in a timely manner, improves processing efficiency, and ensures the production quality of chips.
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其同物限定。Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art will understand that various changes, modifications, and substitutions can be made to these embodiments without departing from the principles and spirit of the invention. and modifications, the scope of the invention is defined by the appended claims and their equivalents.
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