CN117804171A - Steam generating device, drying equipment and semiconductor cleaning system - Google Patents

Abstract

The embodiment of the application provides a steam generating device, drying equipment and semiconductor cleaning system, wherein, steam generating device includes: the steam generator comprises a steam generating cavity, a first input part, an evaporator and a circulating part; the first input part is used for inputting a medium to be evaporated into the steam generation cavity, the evaporator is arranged in the steam generation cavity and comprises at least one containing structure for containing the medium to be evaporated, and an opening part is arranged above the containing structure and is used for outputting gas generated by the medium to be evaporated from the evaporator; the circulating part is used for conveying the medium to be evaporated at the bottom of the steam generation cavity to the containing structure. The steam generating device is used for enabling the medium to be evaporated to evaporate to generate steam.

Description

Steam generating device, drying equipment and semiconductor cleaning system

Technical Field

The application relates to the technical field of semiconductor processes, in particular to a steam generating device, drying equipment and a semiconductor cleaning system.

Background

During production, it is sometimes necessary to evaporate the medium to be evaporated so that the medium to be evaporated evaporates to produce a gas. For example, in the semiconductor process technology, it is sometimes necessary to clean a workpiece such as a wafer. After cleaning the workpiece, the workpiece is dried. In the related art, a workpiece to be processed is generally dried by using steam of a volatile solvent such as isopropyl alcohol (IPA, isopropyl alcohol). One skilled in the art would be highly required to provide a steam generator that performs an evaporation process on isopropyl alcohol awaiting an evaporation medium.

Disclosure of Invention

The embodiment of the application provides a steam generating device, drying equipment and a semiconductor cleaning system, so as to solve the problem of how to perform evaporation treatment on a medium to be evaporated (such as isopropanol).

In a first aspect, embodiments of the present application provide a steam generating device.

The steam generating device provided by the embodiment of the application can be applied to semiconductor process equipment, and comprises: the steam generator comprises a steam generating cavity, a first input part, an evaporator and a circulating part;

the first input part is used for inputting a medium to be evaporated into the steam generation cavity,

the evaporator is arranged in the steam generation cavity and comprises at least one containing structure for containing the medium to be evaporated, and an opening part is arranged above the containing structure and is used for outputting gas generated by the medium to be evaporated from the evaporator;

the circulating part is used for conveying the medium to be evaporated at the bottom of the steam generation cavity to the containing structure.

Optionally, the steam generating device further comprises a first heater, and the first heater is used for heating the medium to be evaporated at the bottom of the steam generating cavity.

Optionally, the steam generating device further includes a first temperature sensor, where the first temperature sensor is configured to detect a temperature of the medium to be evaporated at the bottom of the steam generating cavity, and the first temperature sensor is in control connection with the first heater, where the first heater stops heating when the temperature detected by the first temperature sensor is greater than or equal to a first preset temperature.

Optionally, the steam generating device further comprises a second temperature sensor, wherein the second temperature sensor is used for detecting the temperature of the first heater, the second temperature sensor is in control connection with the first heater, and the first heater stops heating under the condition that the temperature detected by the second temperature sensor is greater than a second preset temperature.

Optionally, the steam generating device further comprises a liquid level sensor, wherein the liquid level sensor is used for detecting the liquid level of the medium to be evaporated at the bottom of the steam generating cavity, the liquid level sensor is in control connection with the first heater, and the first heater stops heating under the condition that the liquid level detected by the liquid level sensor is smaller than a preset liquid level.

Optionally, the Cheng Jiejie structure includes a bottom plate and a fence, the fence is disposed on the bottom plate, the Cheng Jiejie structure includes a receiving space, and the receiving space is disposed in an area surrounded by the fence and the bottom plate; the side part of the enclosure, which is far away from the bottom plate, is provided with an overflow part, and the medium to be evaporated overflowed through the overflow part can be converged to the bottom of the steam generation cavity.

Optionally, the overflow part has a height-fluctuation structure.

Optionally, the plurality of holding structures is a plurality of Cheng Jiejie structures are stacked in the steam generating cavity along the vertical direction of the steam generating device.

Optionally, the steam generating device includes a cover body and a bracket, the cover body is covered above the steam generating cavity, each Cheng Jiejie structure is respectively connected with the bracket, and the bracket is connected with a part of the cover body facing the steam generating cavity.

Optionally, the support is provided with overflow holes at the positions opposite to the Cheng Jiejie structures, and the overflow holes are used for allowing the medium to be evaporated overflowed from the Cheng Jiejie structures to flow to the bottom of the steam generating cavity.

Optionally, the evaporator further includes a plurality of nozzles, the nozzles are provided with a nozzle inlet and a nozzle outlet, the circulation portion is provided with a circulation portion inlet and a circulation portion outlet, the circulation portion inlet is used for sucking the medium to be evaporated from the bottom of the steam generating cavity, the circulation portion outlet is connected with the nozzle inlet, the nozzles are arranged in the containing structure in a one-to-one correspondence manner, and the nozzle outlets face the corresponding containing structure respectively.

In a second aspect, embodiments of the present application provide a drying apparatus.

The drying equipment that this application embodiment provided includes: any one of the steam generating devices provided in the embodiments of the present application, the medium to be evaporated is a liquid medium for generating a gas with a drying function.

Optionally, the steam generating device further comprises: and a second input for delivering a carrier gas to the steam generation chamber toward the vaporizer.

Optionally, the evaporator further includes at least one shielding member, the shielding member is disposed opposite to the second input portion, and the shielding member is disposed on a side of the containing structure near the second input portion, and the shielding member is configured to enable the carrier gas to bypass the shielding member and be conveyed to the containing structure.

Optionally, the drying apparatus further comprises a second heater provided with a second inlet for connection with a carrier gas supply and a second outlet for connection with the second input.

Optionally, the drying device further includes a third temperature sensor, the third temperature sensor is connected with the second outlet, the third temperature sensor is used for detecting the temperature of the second outlet, the third temperature sensor is in control connection with the second heater, and the second heater stops heating under the condition that the temperature detected by the third temperature sensor is greater than or equal to a third preset temperature.

Optionally, the drying device further includes a fourth temperature sensor, the fourth temperature sensor is connected with the second heater, the fourth temperature sensor is used for detecting the temperature of the second heater, the fourth temperature sensor is connected with the second heater in a control manner, and the second heater stops heating under the condition that the temperature detected by the fourth temperature sensor is greater than a fourth preset temperature.

Optionally, the medium to be evaporated comprises liquid isopropanol, and the carrier gas comprises nitrogen.

Optionally, the drying apparatus further comprises a third heater, and the steam generating device further comprises a gas output part, and the third heater is connected with the gas output part.

Optionally, the third heater is provided with a third inlet, and the third inlet is connected with the gas output part; the drying device further comprises a fifth temperature sensor, wherein the fifth temperature sensor is connected with the third inlet and is used for detecting the temperature of the third inlet, the fifth temperature sensor is in control connection with the third heater, and the third heater stops heating under the condition that the temperature detected by the fifth temperature sensor is greater than a fifth preset temperature.

Optionally, the third heater is provided with a third outlet; the drying device further comprises a sixth temperature sensor connected with the third outlet, wherein the sixth temperature sensor is used for detecting the temperature of the third outlet, the sixth temperature sensor is in control connection with the third heater, and the third heater stops heating under the condition that the temperature detected by the sixth temperature sensor is greater than a sixth preset temperature.

Optionally, the drying device further includes a seventh temperature sensor, the seventh temperature sensor is connected to the third heater, the seventh temperature sensor is used for detecting the temperature of the third heater, the seventh temperature sensor is connected to the third heater in a control manner, and the third heater stops heating when the temperature detected by the seventh temperature sensor is greater than a seventh preset temperature.

In a third aspect, embodiments of the present application provide a semiconductor cleaning system.

The semiconductor cleaning system provided by the embodiment of the application comprises: the process tank body is used for loading wafers to be dried; and any one of the drying devices provided by the embodiments of the present application is configured to supply a gas having a drying function to the process tank.

Optionally, the process tank body is provided with a plurality of spray parts, the drying equipment is provided with a plurality of dry gas delivery outlets, the dry gas delivery outlet is used for exporting the gas with the drying function, the dry gas delivery outlet one-to-one with spray parts are connected.

The above-mentioned at least one technical scheme that this application embodiment adopted can reach following beneficial effect:

In an embodiment of the present application, isopropanol may be awaiting delivery of the evaporating medium to the steam generating chamber via the first input. The medium to be evaporated in the steam generation cavity can be conveyed to the containing structure of the evaporator by the circulating part, so that the medium to be evaporated can generate steam by the evaporator.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.

Fig. 1 is a schematic structural diagram of a steam generating device according to an embodiment of the present application;

fig. 2 is a schematic view of an evaporator and a connection plate according to an embodiment of the present application;

FIG. 3 is a schematic view of an evaporator according to an embodiment of the present disclosure;

fig. 4 is a rear view of the steam generating device shown in fig. 1;

fig. 5 is a schematic diagram of an operating principle of a drying apparatus according to an embodiment of the present application;

Fig. 6 is a schematic diagram of a process tank according to an embodiment of the present application.

Reference numerals illustrate:

10-a drying device;

100-a steam generating device; 110-a container; 110 a-a cover; 110 b-a housing; 111-a steam generation chamber; 112-a first input; 113-a second input; 114-a gas output; 115-a first outlet; 116-first inlet; 120-evaporator; 121-a receiving structure; 1211-a bottom plate; 1212-enclosure; 1213-overflow; 1214-side baffles; 122-blinder; 123-nozzles; 130-a circulation section; 140-a first heater; 151-a first temperature sensor; 152-a second temperature sensor; 153-level sensor; 160-a bracket; 161-overflow aperture;

200-a second heater;

310-a third temperature sensor; 320-fourth temperature sensor; 330-a fifth temperature sensor; 340-a sixth temperature sensor; 350-seventh temperature sensor;

400-a third heater;

510-a first valve; 520-second valve; 530-a third valve; 540-fourth valve;

600-dry gas outlet;

20-a medium supply device to be evaporated; 30-a carrier gas supply means; 40-process groove body; 41-spraying part; 42-a temperature detecting element; 50-wafer.

Detailed Description

For the purposes, technical solutions and advantages of the present application, the technical solutions of the present application will be clearly and completely described below with reference to specific embodiments of the present application and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

Furthermore, although terms used in the present application are selected from publicly known and commonly used terms, some terms mentioned in the specification of the present application may be selected by the applicant at his or her discretion, the detailed meanings of which are described in relevant parts of the description herein.

Furthermore, it is required that the present application be understood, not simply by the actual terms used but by the meaning of each term lying within.

The following describes in detail the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.

The embodiment of the application provides a steam generating device which can be applied to semiconductor process equipment. Referring to fig. 1 to 4, a steam generating apparatus 100 provided in an embodiment of the present application may include: a steam generation chamber 111, a first input 112, an evaporator 120, and a circulation 130.

The first input 112 is for inputting a medium to be evaporated into the steam generating chamber 111. The evaporator 120 is disposed in the steam generating chamber 111, and the evaporator 120 may include at least one Cheng Jiejie structure 121 for receiving a medium to be evaporated. An opening portion is provided above the receiving structure 121, and the opening portion is used for outputting the gas generated by the medium to be evaporated from the evaporator 120. The circulation part 130 is used for conveying the medium to be evaporated at the bottom of the steam generation cavity 111 to the Cheng Jiejie mechanism 121.

Illustratively, in an embodiment of the present application, the circulation portion 130 may be a transfer pump. An inlet of the circulation part 130 may be connected to the bottom of the steam generation chamber 111, and an outlet of the circulation part 130 may be connected to the evaporator 120, so that the medium to be evaporated at the bottom of the steam generation chamber 111 is conveniently transferred to the evaporator 120 by the circulation part 130.

In this way, in the embodiment of the present application, isopropanol can be conveyed to the steam generation chamber 111 waiting for the evaporation medium via the first input 112. The medium to be evaporated in the steam generation chamber 111 may be transferred to the receiving structure 121 of the evaporator 120 by the circulation part 130, so that the medium to be evaporated may be generated into steam by the evaporator 120.

In the embodiment of the present application, the medium to be evaporated, which is input through the first input part 112, may be directly transferred to the bottom of the steam generation chamber 111, and thus, the medium to be evaporated, which is positioned at the bottom of the steam generation chamber 111, is transferred to the evaporator 120 by the circulation part 130. Wherein, the medium to be evaporated, which is not evaporated and is conveyed into the evaporator 120, can overflow from the evaporator 120 to the bottom of the steam generation cavity 111, so that the medium to be evaporated can be conveyed into the evaporator 120 more conveniently for evaporation.

In other embodiments of the present application, the medium to be evaporated, which is input through the first input part 112, may be directly transferred to the evaporator 120, and the medium to be evaporated, which is not evaporated, transferred to the evaporator 120 may overflow from the evaporator 120 to the bottom of the steam generation chamber 111. The circulation part 130 may serve to convey the medium to be evaporated located at the bottom of the steam generation chamber 111 to the evaporator 120. In this way, the medium to be evaporated can be conveniently conveyed to the evaporator 120 for evaporation.

Referring to fig. 1, in an embodiment of the present application, the steam generating device 100 may further include a first heater 140. The first heater 140 is used to heat the medium to be evaporated at the bottom of the steam generation chamber 111. Thus, the heated medium to be evaporated can be delivered to the evaporator 120 by the circulation part 130.

Illustratively, in embodiments of the present application, the first heater 140 may be disposed at the bottom of the steam generating chamber 111, or the first heater 140 may be thermally conductively connected with the bottom of the steam generating chamber 111. The heat-conducting connection between the first heater 140 and the bottom of the steam generating chamber 111 may mean that heat of the first heater 140 may be transferred to the bottom of the steam generating chamber 111, so that the medium to be evaporated at the bottom of the steam generating chamber 111 may be heated by the first heater 140.

Illustratively, in an embodiment of the present application, the first heater 140 may be a silicon rubber heater, the first heater 140 may be disposed at the bottom of the steam generating chamber 111, and the medium to be evaporated at the bottom of the steam generating chamber 111 may be heated by the first heater 140.

In the embodiment of the present application, the temperature of the medium to be evaporated may be increased by heating the medium to be evaporated by the first heater 140, so as to increase the evaporation efficiency of the steam generating device 100 for evaporating the medium to be evaporated.

In an embodiment of the present application, the steam generating device 100 may further include a first temperature sensor 151. The first temperature sensor 151 is used to detect the temperature of the medium to be evaporated at the bottom of the steam generation chamber 111. The first temperature sensor 151 may be in control connection with the first heater 140, and the first heater 140 stops heating in case that the temperature measured by the first temperature sensor 151 is greater than or equal to a first preset temperature.

For example, when the temperature of the medium to be evaporated exceeds the first preset temperature, the first heater 140 may be stopped from heating. Further, in the case where the temperature measured by the first temperature sensor 151 is less than or equal to the first target temperature, the first heater 140 may be brought into a heating state, or in the case where the temperature measured by the first temperature sensor 151 is less than or equal to the second target temperature, the heating power of the first heater 140 may be increased. In this way, the operating state of the first heater 140 can be controlled based on the temperature measured by the first temperature sensor 151.

Alternatively, in an embodiment of the present application, the number of the first temperature sensors 151 may be one or more. In the case where there are a plurality of first temperature sensors 151, each of the first temperature sensors 151 may be a "standby" sensor with respect to each other, so that when one of the first temperature sensors 151 fails to operate normally, the other first temperature sensors 151 that can operate normally may be activated.

In an embodiment of the present application, the steam generating device 100 may further include a second temperature sensor 152. The second temperature sensor 152 is configured to detect a temperature of the first heater 140, where the second temperature sensor 152 is in control connection with the first heater 140, and the first heater 140 stops heating when the temperature detected by the second temperature sensor 152 is greater than a second preset temperature. In this way, the operating state of the first heater 140 can be controlled based on the temperature measured by the second temperature sensor 152, and the first heater 140 can be prevented from being damaged due to the excessively high temperature of the first heater 140 itself.

Alternatively, in embodiments of the present application, the number of second temperature sensors 152 may be one or more. In the case of multiple second temperature sensors 152, each of the second temperature sensors 152 may be "back-up" sensors with respect to each other, such that when one of the second temperature sensors 152 fails to function properly, the other second temperature sensors 152 that are capable of functioning properly may be activated.

In an embodiment of the present application, the steam generating device 100 may further include a liquid level sensor 153, where the liquid level sensor 153 is configured to detect a liquid level of the medium to be evaporated at the bottom of the steam generating cavity 111, and the liquid level sensor 153 is in control connection with the first heater 140, and where the first heater 140 stops heating when the liquid level detected by the liquid level sensor 153 is less than a preset liquid level. In this way, the operating state of the first heater 140 can be controlled based on the liquid level measured by the liquid level sensor 153, and the phenomenon of "empty burning" of the first heater 140 due to the too low liquid level of the medium to be evaporated in the steam generating chamber 111 can be prevented.

Alternatively, in embodiments of the present application, the number of liquid level sensors 153 may be one or more. In the case of multiple liquid level sensors 153, each liquid level sensor 153 may be a "stand-by" sensor with respect to each other, such that when one of the liquid level sensors 153 fails to function properly, the other liquid level sensors 153 can be activated to function properly.

In addition, in other embodiments of the present application, the Cheng Jiejie structure 121 may also be provided with a heater, and the medium to be evaporated contained in the containing structure 121 may be heated by the heater, so that the evaporation efficiency of the medium to be evaporated may also be improved.

Referring to fig. 2-3, in an embodiment of the present application, cheng Jiejie structure 121 can include a bottom plate 1211 and a rail 1212. The enclosure 1212 may be disposed on the bottom plate 1211, and the holding structure 121 may be provided with a holding space, where the holding space is disposed in an area surrounded by the enclosure 1212 and the bottom plate 1211.

In the embodiment of the application, the side of the enclosure 1212 facing away from the bottom plate 1211 is provided with an overflow 1213, and the medium to be evaporated, which overflows through the overflow 1213, can collect to the bottom of the steam generating chamber 111.

More colloquially, the receiving space can be disposed in a trough-like region surrounded by the enclosure 1212 and the bottom plate 1211. The top of the enclosure 1212 may be provided with an overflow 1213. In case that the medium to be evaporated supplied to the holding structure 121 is excessively supplied, the excessive medium to be evaporated may flow out through the overflow portion 1213 to be collected to the bottom of the steam generation chamber 111.

In this way, the area surrounded by the surrounding blocks 1212 in the containing structure 121 can be used as an evaporation area, so that the evaporator 120 can have a larger evaporation area, and the evaporation effect of the steam generating device 100 can be improved.

Illustratively, the overflow 1213 is a contoured structure. For example, the overflow 1213 may have a zigzag structure, a wavy structure, or the like. Illustratively, in the embodiment of the present application, the plurality of Cheng Jiejie structures 121 are plural, and the plurality of receiving structures 121 are stacked in the vertical direction of the steam generating device 100 within the steam generating chamber 111. In this way, the evaporation effect of the steam generating device 100 can be further improved.

Referring to fig. 1 and 2, in an embodiment of the present application, the steam generating device 100 may include a cover 110a and a bracket 160. The cover 110a is disposed above the steam generating chamber 111, each of the holding structures 121 is connected to a bracket 160, and the bracket 160 is connected to a portion of the cover 110a facing the steam generating chamber 111. In other words, the plurality of holding structures 121 may be stacked on the bracket 160, and the bracket 160 may be lifted from the cover 110a. In this way, each receiving structure 121 may be lifted into the steam generating cavity 111 by the brackets 160.

Referring to fig. 2, in the embodiment of the present application, the portions of the support 160 opposite to the respective holding structures 121 are respectively provided with overflow holes 161, and the overflow holes 161 are used for allowing the medium to be evaporated overflowed from the holding structures 121 to flow therethrough to the bottom of the steam generating cavity 111. Where the Cheng Jiejie structure 121 includes a bottom plate 1211 and a rail 1212, the receiving structure 121 may further include side guards 1214, the side guards 1214 may be disposed outside of the rail 1212, and the side guards 1214 and the rack 160 are disposed around the outside of the rail 1212. In this way, it is more convenient to make the medium to be evaporated overflowed through the overflow portion 1213 flow to the bottom of the steam generation chamber 111 through the overflow hole 161.

In the embodiment of the present application, the evaporator 120 may further include a plurality of nozzles 123, the nozzles 123 are provided with a nozzle inlet and a nozzle outlet, the circulation portion 130 is provided with a circulation portion inlet and a circulation portion outlet, the circulation portion inlet is used for sucking the medium to be evaporated from the bottom of the steam generating cavity, the circulation portion outlet is connected with the nozzle inlet, each nozzle 123 is disposed in the containing structure 121 in a one-to-one correspondence, and each nozzle outlet faces the corresponding containing structure 121 respectively.

For example, a nozzle 123 may be disposed at a middle portion of each of the holding structures 121, and each of the nozzles 123 may be connected to the outlet of the circulation portion, respectively. In this way, the medium to be evaporated can be sucked from the bottom of the steam generating chamber by the circulation part 130, and the medium to be evaporated can be conveyed to the nozzle 123 by the circulation part 130, and can be sprayed on the Cheng Jiejie structure 121 by the nozzle 123. Illustratively, the nozzle 123 may be an atomizing nozzle, such that the evaporation effect of the steam generating device 100 may be further enhanced.

Referring to fig. 1, in the embodiment of the present application, in the case where the number of nozzles 123 is plural, each nozzle 123 may be connected in series end to end with a connecting line.

Referring to fig. 1, illustratively, in an embodiment of the present application, a steam generating device 100 may include a container 110, and the container 110 may include a cover 110a and a housing 110b. The cover 110a may cover the housing 110b. The cover and housing 110b enclose a cavity. The steam generation chamber 111 is provided in a cavity surrounded by the cover and the housing 110b. The first input portion 112 may be disposed on the container 110.

Illustratively, the vessel 110 may also be provided with a first outlet 115 and a first inlet 116. The inlet of the circulation part 130 may be connected to the first outlet 115, and the outlet of the circulation part 130 may be connected to the first inlet 116. For example, the first outlet 115 may communicate with the bottom of the steam generation cavity 111. In this way, the medium to be evaporated at the bottom of the steam generation chamber 111 can be fed by the circulation part 130 to the evaporator 120 inside the steam generation chamber 111 via the first inlet 116. The vessel 110 may also be provided with a gas outlet 114, the gas outlet 114 being operable for outputting gas from within the steam generating chamber 111.

The embodiment of the application provides drying equipment. Referring to fig. 5, the drying apparatus 10 provided in the embodiments of the present application may include any one of the steam generating devices 100 provided in the embodiments of the present application. The medium to be evaporated is a liquid medium for generating a gas having a drying function.

Referring to fig. 4, in an embodiment of the present application, the steam generating apparatus 100 may further include: a second input portion 113, the second input portion 113 being for supplying a carrier gas to the steam generation chamber 111 toward the vaporizer 120.

Illustratively, the medium to be vaporized may include liquid isopropyl alcohol and the carrier gas may include nitrogen. Of course, with the development of technology, there are other mediums to be evaporated instead of isopropanol, and other carrier gases instead of nitrogen. In embodiments of the present application, the medium to be evaporated may also include other mediums than isopropanol. The carrier gas may also include other gases in addition to nitrogen. It should be noted that, the surface tension of the isopropyl alcohol is low, and in the process of blowing the mixed gas including the isopropyl alcohol and the nitrogen gas to the wafer, the isopropyl alcohol can replace the residual moisture on the surface of the wafer, and the isopropyl alcohol has better volatility, so that the mixed gas including the isopropyl alcohol can be utilized to dry the wafer.

Referring to fig. 4, in case that the receiving structure 121 is provided in plurality, the second input portion 113 may be provided in plurality, and the second input portion 113 may be provided opposite to the receiving structure 121 in one-to-one correspondence.

In embodiments of the present application, as shown in fig. 1-3, the evaporator 120 can further include at least one shield 122. The shielding member 122 may be disposed opposite to the second input portion 113, and the shielding member 122 is disposed at a side of the containing structure 121 near the second input portion 113, and the shielding member 122 is used to allow the carrier gas to be transferred to the containing structure 121 by bypassing the shielding member 122. In this way, the shield 122 can be used to prevent the carrier gas from blowing directly onto the Cheng Jiejie structure 121, so that a large fluctuation in the liquid level of the medium to be evaporated in the containing structure 121 occurs. In addition, the flow rate of the carrier gas blown to the medium to be evaporated in the Cheng Jiejie mechanism 121 can be prevented from being excessively large.

In the embodiment of the present application, when the second input portion 113 is provided in plurality, and the containing structure 121 is provided in plurality, the shielding members 122 may be provided in plurality, and the shielding members 122 may be provided in the Cheng Jiejie structure 121 in a one-to-one correspondence. Alternatively, the plurality of second input portions 113 may be disposed offset in the horizontal direction. In other words, in the embodiment of the present application, the carrier gas may be blown toward each shutter 122 through the plurality of second input portions 113, respectively.

In the embodiment of the present application, the second input portion 113 may be connected to the carrier gas supply device 30. Furthermore, the first input 112 may be used for connection with the medium supply device 20 to be evaporated.

Illustratively, the drying apparatus 10 may further include a first valve 510, and the medium supply device 20 to be evaporated may be connected to the first input 112 via the first valve 510. In this way, the first valve 510 can be used to control the connection between the medium supply device 20 to be evaporated and the first input 112. The first valve 510 may be a solenoid valve, for example.

In an embodiment of the present application, the drying apparatus 10 may further include a second heater 200. The second heater 200 is provided with a second inlet for connection with the carrier gas supply device 30 and a second outlet for connection with the second input portion 113. In other words, the carrier gas supply device 30 may be connected to the second input portion 113 via the second heater 200.

In this way, the carrier gas supplied from the carrier gas supply device 30 can be heated by the second heater 200. Accordingly, in case that the carrier gas having a certain temperature is blown to the evaporator 120, heat of the carrier gas can be transferred to the medium to be evaporated, and thus the temperature of the medium to be evaporated can be raised, and the evaporation efficiency of the vapor generating device 100 for evaporating the medium to be evaporated can be further improved.

Optionally, the drying apparatus 10 may further include a second valve 520, and the carrier gas supply device 30 may be connected to the second input portion 113 via the second valve 520. In this way, the second valve 520 can be used to control the on-off of the carrier gas supply device 30 to the second input 113. The second valve 520 may be, for example, a solenoid valve.

In an embodiment of the present application, the drying apparatus 10 may further include a third temperature sensor 310, the third temperature sensor 310 is connected to the second outlet, the third temperature sensor 310 is configured to detect a temperature of the second outlet, the third temperature sensor 310 is in control connection with the second heater 200, and the second heater 200 stops heating when the temperature measured by the third temperature sensor 310 is greater than or equal to a third preset temperature.

For example, when the temperature of the carrier gas exceeds the third preset temperature, the second heater 200 may be stopped from heating. Further, in the case where the temperature measured by the third temperature sensor 310 is less than or equal to the third target temperature, the second heater 200 may be brought into a heating state, or in the case where the temperature measured by the third temperature sensor 310 is less than or equal to the fourth target temperature, the heating power of the second heater 200 may be increased. In this way, the operating state of the second heater 200 can be controlled based on the temperature measured by the third temperature sensor 310.

Alternatively, in embodiments of the present application, the number of third temperature sensors 310 may be one or more. In the case where there are a plurality of third temperature sensors 310, each of the third temperature sensors 310 may be "standby" sensors with respect to each other, such that when one of the third temperature sensors 310 fails to operate properly, the other third temperature sensors 310 that are capable of operating properly may be activated.

In an embodiment of the present application, the drying apparatus 10 may further include a fourth temperature sensor 320, the fourth temperature sensor 320 being connected to the second heater 200, the fourth temperature sensor 320 being configured to detect a temperature of the second heater 200, the fourth temperature sensor 320 being in control connection with the second heater 200, wherein the second heater 200 stops heating in case that the temperature measured by the fourth temperature sensor 320 is greater than a fourth preset temperature. In this way, the operating state of the second heater 200 can be controlled based on the temperature measured by the fourth temperature sensor 320, and the second heater 200 can be prevented from being damaged due to the excessively high temperature of the second heater 200 itself.

Alternatively, in embodiments of the present application, the number of fourth temperature sensors 320 may be one or more. In the case of multiple fourth temperature sensors 320, each of the fourth temperature sensors 320 may be "redundant" sensors with respect to each other, such that when one of the fourth temperature sensors 320 fails to function properly, the other fourth temperature sensors 320 that are capable of functioning properly may be activated.

In the embodiment of the present application, the drying apparatus 10 may further include a third heater 400, and the steam generating device 100 may further include a gas output 114, the third heater 400 being connected to the gas output 114. In the case where the steam generating device 100 includes the second input portion 113, the second input portion 113 is for supplying the carrier gas to the steam generating chamber 111 toward the evaporator 120, the gas output portion 114 may output the mixed gas including the steam of the medium to be evaporated and the carrier gas. Of course, in the case where the carrier gas is not input to the vapor generating device 100, the gas output part 114 may output the vapor of the medium to be evaporated. In the embodiment of the present application, the gas output from the gas output part 114 may be heated by the third heater 400, and the drying effect of the gas output from the drying apparatus 10 may be improved.

In the embodiment of the present application, the third heater 400 is provided with a third inlet, which may be connected to the gas output 114. The drying apparatus 10 may further include a fifth temperature sensor 330, the fifth temperature sensor 330 being connected to the third inlet, the fifth temperature sensor 330 being configured to detect a temperature of the third inlet, the fifth temperature sensor 330 being in control connection with the third heater 400, wherein the third heater 400 stops heating in case the temperature measured by the fifth temperature sensor 330 is greater than a fifth preset temperature.

For example, when the temperature of the gas inputted into the third heater 400 exceeds the fifth preset temperature, the third heater 400 may be stopped from heating. Further, in the case where the temperature measured by the fifth temperature sensor 330 is less than or equal to the fifth target temperature, the third heater 400 may be brought into a heating state, or in the case where the temperature measured by the fifth temperature sensor 330 is less than or equal to the sixth target temperature, the heating power of the third heater 400 may be increased. In this way, the operating state of the third heater 400 can be controlled based on the temperature measured by the fifth temperature sensor 330.

In an embodiment of the present application, the drying apparatus 10 may further include a third valve 530, and the gas output 114 may be connected to a third inlet of the third heater 400 via the third valve 530. The third valve 530 may be a solenoid valve, for example.

In an embodiment of the present application, the steam generating device 100 may further include a fourth valve 540, and the fourth valve 540 may be connected to the third outlet of the third heater 400. The fourth valve 540 may be a solenoid valve, for example.

In an embodiment of the present application, the third heater 400 is provided with a third outlet. The drying apparatus 10 may further include a sixth temperature sensor 340, the sixth temperature sensor 340 being connected to the third outlet, the sixth temperature sensor 340 being configured to detect a temperature of the third outlet, the sixth temperature sensor 340 being in control connection with the third heater 400, wherein the third heater 400 stops heating in case the temperature measured by the sixth temperature sensor 340 is greater than a sixth preset temperature.

For example, when the temperature of the gas output from the third heater 400 exceeds the sixth preset temperature, the third heater 400 may be stopped from heating. Further, in the case where the temperature measured by the sixth temperature sensor 340 is less than or equal to the seventh target temperature, the third heater 400 may be brought into a heating state, or in the case where the temperature measured by the sixth temperature sensor 340 is less than or equal to the eighth target temperature, the heating power of the third heater 400 may be increased. In this way, the operating state of the third heater 400 may be controlled based on the temperature measured by the sixth temperature sensor 340.

In an embodiment of the present application, the drying apparatus 10 may further include a seventh temperature sensor 350, the seventh temperature sensor 350 being connected to the third heater 400, the seventh temperature sensor 350 being configured to detect a temperature of the third heater 400, the seventh temperature sensor 350 being in control connection with the third heater 400, wherein the third heater 400 stops heating in case that the temperature measured by the seventh temperature sensor 350 is greater than a seventh preset temperature. In this way, the operating state of the third heater 400 can be controlled based on the temperature measured by the seventh temperature sensor 350, and the third heater 400 can be prevented from being damaged due to the excessively high temperature of the third heater 400 itself.

The embodiment of the application provides a semiconductor cleaning system. Referring to fig. 6, a semiconductor cleaning system may include: a process tank 40. The process tank 40 may be used to load wafers 50 to be dried. The semiconductor cleaning system further includes any of the drying apparatuses 10 provided in the embodiments of the present application. The drying apparatus 10 is used to supply a gas having a drying function to the process tank 40.

In embodiments of the present application, the process tank 40 may be provided with a plurality of showers 41. Referring to fig. 5, the drying apparatus 10 may be provided with a plurality of drying gas output ports 600, the drying gas output ports 600 being for outputting a gas having a drying function, the drying gas output ports 600 being connected to the shower part 41 in one-to-one correspondence. In this way, the gas having the drying function can be blown to the wafer 50 relatively uniformly by providing the plurality of shower portions 41.

Illustratively, the process tank 40 may be provided with a temperature detecting element 42, and the temperature of the process tank 40 may be detected using the temperature detecting element, thereby controlling the operation state of the third heater 400 in the steam generating device 100 based on the detection result of the temperature detecting element 42.

Illustratively, each temperature sensor included in the drying apparatus 10 may be a thermocouple or any other sensor capable of detecting temperature.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the embodiments of the application, the scope of which is defined in the appended claims and their equivalents.

Claims (24)

1. A steam generating apparatus for use in semiconductor processing equipment, comprising: a steam generation chamber (111), a first input section (112), an evaporator (120), and a circulation section (130);

The first input part (112) is used for inputting the medium to be evaporated into the steam generation cavity (111),

the evaporator (120) is arranged in the steam generation cavity (111), the evaporator (120) comprises at least one containing structure (121) for containing the medium to be evaporated, an opening part is arranged above the containing structure (121), and the opening part is used for outputting gas generated by the medium to be evaporated from the evaporator (120);

the circulating part (130) is used for conveying the medium to be evaporated at the bottom of the steam generation cavity (111) to the containing structure (121).

2. The steam generating device according to claim 1, further comprising a first heater (140), the first heater (140) being adapted to heat the medium to be evaporated at the bottom of the steam generating chamber (111).

3. The steam generating device according to claim 2, further comprising a first temperature sensor (151), the first temperature sensor (151) being adapted to detect a temperature of the medium to be evaporated at the bottom of the steam generating chamber (111), the first temperature sensor (151) being in control connection with the first heater (140), wherein the first heater (140) stops heating in case the temperature measured by the first temperature sensor (151) is greater than or equal to a first preset temperature.

4. The steam generating device according to claim 2, further comprising a second temperature sensor (152), the second temperature sensor (152) being adapted to detect the temperature of the first heater (140), the second temperature sensor (152) being in control connection with the first heater (140), wherein the first heater (140) stops heating in case the temperature measured by the second temperature sensor (152) is greater than a second preset temperature.

5. The steam generating device according to claim 2, characterized in that the steam generating device further comprises a liquid level sensor (153), the liquid level sensor (153) being adapted to detect the liquid level of the medium to be evaporated at the bottom of the steam generating chamber (111), the liquid level sensor (153) being in control connection with the first heater (140), wherein the first heater (140) stops heating in case the liquid level measured by the liquid level sensor (153) is smaller than a preset liquid level.

6. The steam generator according to claim 1, wherein the receiving structure (121) comprises a bottom plate (1211) and a surrounding board (1212), the surrounding board (1212) is arranged on the bottom plate (1211), the receiving structure (121) is provided with a receiving space, and the receiving space is arranged in an area surrounded by the surrounding board (1212) and the bottom plate (1211);

The side of the enclosure (1212) facing away from the bottom plate (1211) is provided with an overflow (1213), and the medium to be evaporated, which overflows through the overflow (1213), can collect to the bottom of the steam generation chamber (111).

7. The steam generator according to claim 6, wherein the overflow portion (1213) has a stepped structure.

8. The steam generator according to claim 1, wherein the plurality of receiving structures (121) are stacked in the steam generating chamber (111) along the vertical direction of the steam generator.

9. The steam generating device according to claim 8, wherein the steam generating device comprises a cover body (110 a) and a bracket (160), the cover body (110 a) is covered above the steam generating cavity (111), each holding structure (121) is respectively connected with the bracket (160), and the bracket (160) is connected with a part of the cover body (110 a) facing the steam generating cavity (111).

10. The steam generator according to claim 9, wherein the support (160) is provided with overflow holes (161) at positions opposite to each Cheng Jiejie structure (121), and the overflow holes (161) are used for allowing the medium to be evaporated overflowed from the Cheng Jiejie structures (121) to flow through to the bottom of the steam generating cavity (111).

11. The steam generator according to claim 8, wherein the evaporator (120) further comprises a plurality of nozzles (123), the nozzles (123) are provided with nozzle inlets and nozzle outlets, the circulation portion (130) is provided with a circulation portion inlet and a circulation portion outlet, the circulation portion inlet is used for sucking the medium to be evaporated from the bottom of the steam generating chamber, the circulation portion outlet is connected with the nozzle inlets, each nozzle (123) is disposed in the containing structure (121) in a one-to-one correspondence, and each nozzle outlet is directed to the corresponding Cheng Jiejie structure (121), respectively.

12. A drying apparatus, comprising: the steam generating device according to any one of claims 1 to 11, wherein the medium to be evaporated is a liquid medium for generating a gas having a drying function.

13. Drying apparatus according to claim 12, wherein the steam generating means further comprises: -a second input (113), the second input (113) being for delivering a carrier gas to the steam generating chamber (111) towards the evaporator (120).

14. The drying apparatus according to claim 13, wherein the evaporator (120) further comprises at least one shutter (122), the shutter (122) being arranged opposite the second input (113), and the shutter (122) being arranged at a side of the receiving structure (121) close to the second input (113), the shutter (122) being adapted such that the carrier gas is transported to the receiving structure (121) bypassing the shutter (122).

15. Drying apparatus according to claim 13, further comprising a second heater (200), the second heater (200) being provided with a second inlet for connection with a carrier gas supply means and a second outlet for connection with the second input (113).

16. The drying apparatus according to claim 15, further comprising a third temperature sensor (310), the third temperature sensor (310) being connected to the second outlet, the third temperature sensor (310) being adapted to detect the temperature of the second outlet, the third temperature sensor (310) being in control connection with the second heater (200), wherein the second heater (200) stops heating in case the temperature measured by the third temperature sensor (310) is greater than or equal to a third preset temperature.

17. The drying apparatus according to claim 15, further comprising a fourth temperature sensor (320), the fourth temperature sensor (320) being connected to the second heater (200), the fourth temperature sensor (320) being adapted to detect the temperature of the second heater (200), the fourth temperature sensor (320) being in control connection with the second heater (200), wherein the second heater (200) stops heating in case the temperature measured by the fourth temperature sensor (320) is greater than a fourth preset temperature.

18. Drying apparatus according to claim 13 wherein the medium to be evaporated comprises liquid isopropanol and the carrier gas comprises nitrogen.

19. Drying apparatus according to claim 12, further comprising a third heater (400), the steam generating device further comprising a gas output (114), the third heater (400) being connected to the gas output (114).

20. Drying apparatus according to claim 19, wherein the third heater (400) is provided with a third inlet, which is connected to the gas output (114);

the drying device further comprises a fifth temperature sensor (330), wherein the fifth temperature sensor (330) is connected with the third inlet, the fifth temperature sensor (330) is used for detecting the temperature of the third inlet, the fifth temperature sensor (330) is in control connection with the third heater (400), and the third heater (400) stops heating under the condition that the temperature measured by the fifth temperature sensor (330) is larger than a fifth preset temperature.

21. Drying apparatus according to claim 19, wherein the third heater (400) is provided with a third outlet;

The drying device further comprises a sixth temperature sensor (340), wherein the sixth temperature sensor (340) is connected with the third outlet, the sixth temperature sensor (340) is used for detecting the temperature of the third outlet, the sixth temperature sensor (340) is in control connection with the third heater (400), and the third heater (400) stops heating under the condition that the temperature measured by the sixth temperature sensor (340) is larger than a sixth preset temperature.

22. The drying apparatus according to claim 19, further comprising a seventh temperature sensor (350), the seventh temperature sensor (350) being connected to the third heater (400), the seventh temperature sensor (350) being adapted to detect the temperature of the third heater (400), the seventh temperature sensor (350) being in control connection with the third heater (400), wherein the third heater (400) stops heating in case the temperature measured by the seventh temperature sensor (350) is greater than a seventh preset temperature.

23. A semiconductor cleaning system, the semiconductor cleaning system comprising:

a process tank (40) for loading a wafer (50) to be dried; the method comprises the steps of,

Drying apparatus according to any one of claims 12 to 22, for supplying a gas having a drying function to the process tank (40).

24. The semiconductor cleaning system of claim 23, wherein,

the process tank body (40) is provided with a plurality of spraying parts (41), the drying equipment is provided with a plurality of drying gas output ports (600), the drying gas output ports (600) are used for outputting the gas with the drying function, and the drying gas output ports (600) are connected with the spraying parts (41) in a one-to-one correspondence.