CN117790393A - Magnetic force swager frock mechanism - Google Patents
Magnetic force swager frock mechanism Download PDFInfo
- Publication number
- CN117790393A CN117790393A CN202311750233.9A CN202311750233A CN117790393A CN 117790393 A CN117790393 A CN 117790393A CN 202311750233 A CN202311750233 A CN 202311750233A CN 117790393 A CN117790393 A CN 117790393A
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- magnet
- magnetic
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- component
- carrier
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Links
- 238000003825 pressing Methods 0.000 claims abstract description 46
- 230000008093 supporting effect Effects 0.000 claims abstract description 20
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000000741 silica gel Substances 0.000 claims description 14
- 229910002027 silica gel Inorganic materials 0.000 claims description 14
- 230000005389 magnetism Effects 0.000 claims description 12
- 229910052742 iron Inorganic materials 0.000 claims description 10
- 239000000969 carrier Substances 0.000 claims description 2
- 238000005056 compaction Methods 0.000 abstract description 7
- 230000006835 compression Effects 0.000 abstract description 7
- 238000007906 compression Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- 239000000696 magnetic material Substances 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 26
- 238000000034 method Methods 0.000 description 15
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the technical field of wafer compaction and discloses a magnetic material pressing tool mechanism, which comprises a working platen, wherein two sides of the working platen are respectively provided with a support component, a carrier for placing a wafer is arranged between the two support components, a magnetic compaction component is arranged on the support component, an elastic piece is arranged between the magnetic compaction component and the support component, a sliding component is arranged on the working platen, an electromagnet is arranged on the sliding component and is used for being matched with the magnetic compaction component, the carrier is fixed, and the electromagnet is electrically connected with a control system; the magnetic force between the magnetic compression assembly and the supporting assembly is utilized to attract each other, the fixation of the carrier and the wafer is realized, the mode of utilizing the magnetic force to compress is compared with the mode of directly utilizing the air cylinder to drive the material pressing assembly, the impact is effectively reduced, meanwhile, the separation of the power device and the material pressing module can be realized, the air pipe and the circuit do not move along with the material pressing mechanism, and the arrangement difficulty is avoided.
Description
Technical Field
The application relates to the technical field of wafer compaction, in particular to a magnetic material pressing tool mechanism.
Background
Wafers, also known as semiconductor wafers or silicon wafers, refer to wafers of semiconductor material (typically silicon) having a specified size, shape and flatness. Since wafers may have defects or defective areas during the production process, such as bubbles, cracks, impurities, etc., these defects may affect the performance and reliability of the integrated circuit. By detecting the wafer, the defective wafer can be found and removed in an early stage, and the quality and reliability of the product are ensured.
However, in the existing wafer inspection apparatus, the wafer is fixed by directly using the cylinder to drive the platen and other components to compress and fix the surface of the wafer carrier, and by adopting such compressing mode, a large impact force is easily generated, so that when the carrier for placing the wafer is compressed, the carrier easily swings left and right or tilts, and the inspection accuracy of the wafer is affected.
Therefore, a technical problem to be solved by the magnetic material pressing tool mechanism is needed.
The foregoing is merely provided to facilitate an understanding of the principles of the present application and is not admitted to be prior art.
Disclosure of Invention
The utility model provides a main aim at provides a magnetic force swager frock mechanism, aims at solving current fixed mode to the wafer carrier, has the impact force too big, leads to the carrier to deviate from easily to influence the problem of wafer testing result.
In order to achieve the above-mentioned purpose, the application provides a magnetic force swager frock mechanism, including the work platen, the both sides of work platen are provided with supporting component respectively, two be provided with the carrier that is used for placing the wafer between the supporting component, be provided with magnetism on the supporting component and compress tightly the subassembly, magnetism compress tightly the subassembly with be provided with the elastic component between the supporting component, be located be provided with sliding component on the work platen, be provided with the electro-magnet on the sliding component, the electro-magnet be used for with magnetism compress tightly the cooperation of subassembly, realize the fixed to the carrier, just electro-magnet and control system electric connection.
As a preferred scheme of this application, still include a plurality of locating hole and a plurality of screw hole, a plurality of the locating hole, a plurality of the screw hole with the center point of work platen is symmetry center symmetry sets up the both sides of work platen, a plurality of the locating hole, a plurality of the screw hole is used for the not unidimensional carrier of adaptation to place.
As a preferred scheme of this application, supporting component is including placing board, fixed plate, first magnet, second magnet, it is provided with two on the board to place the fixed plate, two it is provided with to slide between the fixed plate magnetism compresses tightly the subassembly, just magnetism compress tightly the subassembly with be provided with between the fixed plate elastic component, it has to place the board is built-in first magnet, it has to place on the fixed plate the second magnet.
As a preferred scheme of this application, magnetism compresses tightly subassembly includes clamp plate, third magnet, fourth magnet and iron plate, be provided with on the clamp plate the iron plate, the clamp plate embeds have the third magnet with fourth magnet, the third magnet with first magnet cooperatees, fourth magnet with second magnet cooperatees.
As a preferred scheme of this application, still include slip subassembly, lifting unit with be connected with between the electro-magnet slip subassembly, slip subassembly includes mounting bracket, cylinder, connecting block, the mounting bracket is located the top setting of work platen, be provided with on the mounting bracket the cylinder, be provided with on the cylinder output the connecting block, be provided with on the connecting block the electro-magnet.
As a preferred scheme of this application, lifting unit includes motor, lead screw, leading truck, the leading truck embeds the motor reaches the lead screw, the motor output with the lead screw is connected, be provided with on the lead screw the mount pad, the mount pad can be in relative slip on the leading truck.
As a preferred solution of the present application, the elastic member specifically adopts a spring.
As a preferred scheme of the application, the device further comprises a silica gel rod, and the silica gel rod is arranged on the pressing plate.
As a preferred scheme of the application, the device further comprises a tension spring, one end of the tension spring is connected with the mounting frame, and the other end of the tension spring is connected with the connecting block.
The utility model provides a pair of magnetic force swage frock mechanism, lifting unit drives the circular telegram electro-magnet and moves to being close to the carrier direction, utilize the electro-magnet to be close to magnetism and compress tightly the subassembly and adsorb with it, under lifting unit's continuous transmission, magnetism between magnetism compress tightly subassembly and the supporting component attracts each other, realize fixing to carrier and wafer, this kind of mode that utilizes magnetic force to compress tightly compares with directly utilizing cylinder drive swager subassembly, it is soft relatively on the whole, effectively reduce the impact, reduce the lower carrier in-process, the off-normal phenomenon appears in the carrier, can improve the wafer detection precision, simultaneously, also can realize the separation of power device and swager module when needs to rotate the carrier, make trachea, the circuit do not follow swager and construct the motion, avoid arranging difficulty and interference scheduling problem.
Drawings
Fig. 1 is a schematic perspective view of a magnetic pressing tool mechanism according to an embodiment of the present application;
FIG. 2 is an enlarged view of part A of a magnetic pressing tool mechanism according to an embodiment of the present application;
fig. 3 is a schematic perspective view of a sliding assembly in a magnetic pressing tool mechanism according to an embodiment of the present application;
fig. 4 is a schematic view of a first structure of a support assembly in a magnetic pressing tool mechanism according to an embodiment of the present application;
FIG. 5 is a cross-sectional view of part A-A of a magnetic swage tooling mechanism according to one embodiment of the present application;
FIG. 6 is a schematic view of a portion of the structure of FIG. 5;
fig. 7 is a schematic diagram of a second structure of a support assembly in a magnetic pressing tool mechanism according to an embodiment of the present application.
Reference numerals illustrate:
1. a work platen; 2. a support assembly; 3. a carrier; 4. a magnetic compaction assembly; 5. a sliding assembly; 6. a tension spring; 7. an electromagnet; 8. positioning holes; 9. screw holes; 10. a silica gel rod; 11. an elastic member;
201. placing a plate; 202. a fixing plate; 203. a first magnet; 204. a second magnet; 401. a pressing plate; 402. a third magnet; 403. a fourth magnet; 404. an iron plate; 501. a mounting frame; 502. a cylinder; 503. and (5) connecting a block.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and intended to explain the present application and should not be construed as limiting the present application, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts based on the embodiments in the present application are within the scope of protection of the present application.
Furthermore, the description of "first," "second," and the like, when referred to in this application, is for descriptive purposes only (e.g., to distinguish between identical or similar elements) and is not to be construed as indicating or implying a relative importance or an implicit indication of the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.
Referring to fig. 1 and 5, in an embodiment, a magnetic pressing tool mechanism includes a working platen 1, support assemblies 2 are respectively disposed on two sides of the working platen 1, a carrier 3 for placing a wafer is disposed between the two support assemblies 2, a magnetic pressing assembly 4 is disposed on the support assemblies 2, an elastic member 11 is disposed between the magnetic pressing assembly 4 and the support assemblies 2, a lifting assembly (not labeled in the drawing) is disposed on the working platen 1, an electromagnet 7 is disposed on the lifting assembly, the electromagnet 7 is used for matching with the magnetic pressing assembly 4, fixing of the carrier 3 is achieved, and the electromagnet 7 is electrically connected with a control system.
Specifically, referring to fig. 1, in the above embodiment, the device further includes a plurality of positioning holes 8 and a plurality of screw holes 9, the plurality of positioning holes 8 and the plurality of screw holes 9 are symmetrically disposed on two sides of the table board 1 with a center point of the table board 1 as a symmetry center, and the plurality of positioning holes 8 and the plurality of screw holes 9 are used for accommodating carriers 3 with different sizes.
It can be understood that the supporting components 2 are provided with positioning pins and bolts, the positioning pins and bolts can be used for realizing connection between the placing plate 201 and the workbench plate 1, and the spacing between the two supporting components 2 is adjusted through the positioning holes 8 and the screw holes 9, so that the placing or detecting of wafers with different specifications and sizes can be realized.
Specifically, referring to fig. 4, 5, 6 and 7, in the above embodiment, the support assembly 2 includes a placement plate 201, a fixing plate 202, a first magnet 203 and a second magnet 204, two fixing plates 202 are disposed on the placement plate 201, a magnetic compression assembly 4 is slidably disposed between the two fixing plates 202, an elastic member 11 is disposed between the magnetic compression assembly 4 and the fixing plates 202, the placement plate 201 is provided with the first magnet 203, the fixing plates 202 are provided with the second magnet 204, and further, the elastic member 11 specifically adopts a spring or a rubber pad.
It can be understood that the placement plate 201 is provided with a step, the step is used for placing the carrier 3, and the carrier 3 is positioned and clamped by the clamping between the two placement plates 201, and the elastic member 11 adopts a spring or a rubber pad, so that the elastic member can be used for providing a supporting effect just before the placement plate 201 is in direct contact with the magnetic compression assembly 4, which is inconvenient for placing the carrier 3 and the wafer.
Specifically, referring to fig. 1, 2, 4, 5, and 6, in the above embodiment, the magnetic pressing assembly 4 includes a pressing plate 401, a third magnet 402, a fourth magnet 403, and an iron plate 404, the iron plate 404 is disposed on the pressing plate 401, the third magnet 402 and the fourth magnet 403 are disposed in the pressing plate 401, the third magnet 402 is matched with the first magnet 203, and the fourth magnet 403 is matched with the second magnet 204.
It will be appreciated that when the first magnet 203 and the third magnet 402 are attracted to each other, the pressing plate 401 moves toward the direction close to the placing plate 201 to fix the carrier 3 and the wafer, and when the second magnet 204 and the third magnet 402 are attracted to each other, the pressing plate 401 moves away from the placing plate 201 to release the carrier 3.
Specifically, please refer to fig. 1 and 3, in the above embodiment, the device further includes a sliding component 5, a lifting component and an electromagnet 7 are connected with the sliding component 5, the sliding component 5 includes a mounting frame 501, an air cylinder 502 and a connecting block 503, the mounting frame 501 is located above the working platen 1, the air cylinder 502 is provided on the mounting frame 501, the connecting block 503 is provided on an output end of the air cylinder 502, the electromagnet 7 is provided on the connecting block 503, further, the lifting component includes a motor, a screw rod and a guide frame, the guide frame is internally provided with the motor and the screw rod, an output end of the motor is connected with the screw rod, the screw rod is provided with a mounting seat, and the mounting seat can slide relatively on the guide frame.
It can be understood that the motor is connected with a control system, and the forward rotation or the reverse rotation of the motor is controlled to realize that the screw rod drives the mounting frame 501 and the electromagnet 7 to ascend or descend, and the screw rod is driven by the screw rod compared with the direct driving of the cylinder 502, so that the whole is softer; the air cylinder 502 is avoided being utilized, the mechanism further comprises a supporting frame (not labeled in the figure), the supporting frame is in contact with the ground and used for supporting the whole mechanism, and the guide frame is connected with the supporting frame to enable the electromagnet 7 to be arranged above the working table plate 1.
Specifically, referring to fig. 1 and 2, in the above embodiment, the apparatus further includes a silicone rod 10, and the silicone rod 10 is disposed on the pressing plate 401.
It can be understood that through setting up silica gel stick 10, utilize silica gel stick and carrier 3 surface contact, silica gel stick has better compliance and elasticity, the wearing and tearing between the carrier 3 can be reduced effectively to the re-compaction in-process, avoid causing the damage to carrier 3, simultaneously, the silica gel board has better shock resistance, can reduce vibrations and the impact that arouses because of carrier 3 motion or vibration effectively, further, set up flutedly on the clamp plate, be provided with silica gel stick 10 in the recess, silica gel stick 10 is interference fit with the recess, through seting up the recess on the clamp plate, can realize the fast-assembling and the quick detach of silica gel stick.
Specifically, referring to fig. 1, in the above embodiment, the device further includes a tension spring 6, one end of the tension spring 6 is connected to the mounting frame 501, and the other end of the tension spring 6 is connected to the connection block 503.
It can be appreciated that by providing the tension spring 6, the tension spring 6 can ensure that the retraction of the electromagnet 7 is achieved in the event of a power failure or air failure of the device.
In summary, a magnetic force pressing tool mechanism drives a screw rod to rotate by utilizing a motor, the electromagnet 7 is electrified, the mounting frame 501 and the electrified electromagnet 7 are driven to move towards the direction close to the carrier 3, the electromagnet 7 adsorbs an iron plate 404, the pressing plate 401 is driven to move towards the direction close to the placing plate 201, when the first magnet 203 and the third magnet 402 are attracted to each other, the control system controls the electromagnet 7 to be powered off, the silica gel rod 10 is contacted with the surface of the carrier 3, and the carrier 3 and a wafer are fixed; when the motor drives the screw rod to reversely rotate, the electromagnet 7 is electrified again, the electromagnet 7 adsorbs the iron plate 404, the iron plate 404 and the pressing plate 401 are driven to move in the direction away from the placing plate 201, at the moment, because the electrified magnetic force of the electromagnet 7 is larger than the magnetic force of the attraction of the first magnet 203 and the third magnet 402, the first magnet 203 and the third magnet 402 can be separated, when the second magnet 204 and the fourth magnet 403 are attracted mutually, the pressing plate 401 is far away from the placing plate 201, the silica gel rod 10 is not in contact with the carrier 3, the carrier 3 and a wafer can be taken off from the placing plate 201, the electromagnet 7 is close to the magnetic compression assembly 4 through utilizing the magnetic force between the magnetic compression assembly 4 and the supporting assembly 2, the carrier 3 and the wafer are fixed through utilizing the magnetic force between the magnetic compression assembly 4, and the pressing assembly is relatively soft as a whole, the impact is effectively reduced, the deviation phenomenon of the carrier 3 appears in the process of directly utilizing the cylinder 502, the wafer detection precision can be improved, and simultaneously, under the condition of realizing the magnetic clamping, the carrier 3 is not in contact with the carrier 3, the lifting and the electromagnet 7 is not in the process of being rotated, the rotating the carrier 3 is not only in the process of being required to be in the lifting, but also in the process of being in the rotating the carrier 3, the carrier 3 is not in the contact with the carrier clamping process, or the carrier 3 is prevented from being in the rotating process; the separation of the power device and the material pressing module can be realized by utilizing the magnetic force to clamp the carrier 3, so that the air pipe and the line do not move along with the material pressing mechanism, and the problems of difficult arrangement, interference and the like are avoided.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, apparatus, article, or method that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, apparatus, article, or method. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, apparatus, article or method that comprises the element.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the scope of the claims, and all equivalent structures or equivalent processes using the descriptions and drawings of the present application, or direct or indirect application in other related technical fields are included in the scope of the claims of the present application.
Claims (9)
1. The utility model provides a magnetic force swager frock mechanism, its characterized in that, includes the work platen, the both sides of work platen are provided with supporting component respectively, two be provided with between the supporting component and be used for placing the wafer, be provided with magnetism on the supporting component and compress tightly the subassembly, magnetism compress tightly the subassembly with be provided with the elastic component between the supporting component, be located be provided with lifting unit on the work platen, be provided with the electro-magnet on the lifting unit, the electro-magnet be used for with magnetism compress tightly the subassembly cooperation, realize fixing to the carrier, just electro-magnet and control system electric connection.
2. The magnetic pressing tool mechanism according to claim 1, further comprising a plurality of positioning holes and a plurality of screw holes, wherein the plurality of positioning holes and the plurality of screw holes are symmetrically arranged on two sides of the working table plate by taking a center point of the working table plate as a symmetry center, and the plurality of positioning holes and the plurality of screw holes are used for accommodating carriers with different sizes.
3. The magnetic pressing tool mechanism according to claim 1, wherein the supporting component comprises a placing plate, a fixing plate, a first magnet and a second magnet, two fixing plates are arranged on the placing plate, the magnetic pressing component is slidably arranged between the two fixing plates, the elastic piece is arranged between the magnetic pressing component and the fixing plate, the first magnet is arranged in the placing plate, and the second magnet is arranged in the fixing plate.
4. The magnetic pressing tool mechanism according to claim 3, wherein the magnetic pressing assembly comprises a pressing plate, a third magnet, a fourth magnet and an iron plate, the iron plate is arranged on the pressing plate, the third magnet and the fourth magnet are arranged in the pressing plate, the third magnet is matched with the first magnet, and the fourth magnet is matched with the second magnet.
5. The magnetic pressing tool mechanism according to claim 1, further comprising a sliding assembly, wherein the sliding assembly is connected between the lifting assembly and the electromagnet, the sliding assembly comprises a mounting frame, a cylinder and a connecting block, the mounting frame is located above the working table plate, the cylinder is arranged on the mounting frame, the connecting block is arranged on the output end of the cylinder, and the electromagnet is arranged on the connecting block.
6. The magnetic pressing tool mechanism according to claim 5, wherein the lifting assembly comprises a motor, a screw rod and a guide frame, the motor and the screw rod are arranged in the guide frame, the output end of the motor is connected with the screw rod, the screw rod is provided with the mounting seat, and the mounting seat can slide relatively on the guide frame.
7. A magnetic pressing tool mechanism according to claim 3, wherein the elastic member is a spring.
8. The magnetic pressing tool mechanism according to claim 4, further comprising a silica gel rod, wherein the silica gel rod is arranged on the pressing plate.
9. The magnetic pressing tool mechanism according to claim 5, further comprising a tension spring, wherein one end of the tension spring is connected with the mounting frame, and the other end of the tension spring is connected with the connecting block.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311750233.9A CN117790393A (en) | 2023-12-19 | 2023-12-19 | Magnetic force swager frock mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311750233.9A CN117790393A (en) | 2023-12-19 | 2023-12-19 | Magnetic force swager frock mechanism |
Publications (1)
Publication Number | Publication Date |
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CN117790393A true CN117790393A (en) | 2024-03-29 |
Family
ID=90386541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202311750233.9A Pending CN117790393A (en) | 2023-12-19 | 2023-12-19 | Magnetic force swager frock mechanism |
Country Status (1)
Country | Link |
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CN (1) | CN117790393A (en) |
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2023
- 2023-12-19 CN CN202311750233.9A patent/CN117790393A/en active Pending
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