CN117769235B - Metal pattern functional layer structure for realizing electromagnetic wave attenuation - Google Patents
Metal pattern functional layer structure for realizing electromagnetic wave attenuation Download PDFInfo
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- CN117769235B CN117769235B CN202311857900.3A CN202311857900A CN117769235B CN 117769235 B CN117769235 B CN 117769235B CN 202311857900 A CN202311857900 A CN 202311857900A CN 117769235 B CN117769235 B CN 117769235B
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Abstract
The invention discloses a metal pattern functional layer structure for realizing electromagnetic wave attenuation, which can regulate and control the equivalent dielectric constant and the equivalent magnetic permeability of a wave-transmitting material by attaching periodically arranged metal patterns on the wave-transmitting material, and generates specific response to the incident electromagnetic wave, thereby effectively reducing the electromagnetic wave transmission performance of the specific electromagnetic wave in the specific frequency band in the incoming wave direction and realizing the electromagnetic shielding function of the wave-transmitting material.
Description
Technical Field
The invention belongs to the technical field of electromagnetic communication and the field of novel artificial electromagnetic materials, and particularly relates to a metal pattern functional layer structure for realizing electromagnetic wave attenuation.
Background
Electromagnetic communication technology is an information transmission technology based on electromagnetic wave propagation. It covers a wide range of applications including wireless communication, satellite communication, radar systems, optical communication, etc., and artificial electromagnetic materials are a class of materials that exhibit electromagnetic properties that are not present in natural materials by designing and manufacturing artificial structures. These materials are designed to manipulate the propagation of electromagnetic waves, thereby performing functions that are not possible in conventional materials.
The new generation of mobile communication technology has greatly improved speed, time delay, connection number and mobility. However, since the increase of the frequency causes the reduction of the wavelength, many influences which are not considered in the prior-generation mobile communication cannot be simply ignored, such as reflection characteristics and transmission loss when electromagnetic waves penetrate through dielectric layers of walls, windows and the like, and interference problems of various electromagnetic signals existing in space.
In order to effectively alleviate the problems of co-channel interference and the like in a communication system, novel electromagnetic shielding has been attracting attention of researchers in recent years. With the development of the metamaterial and the super-surface field, the equivalent dielectric constant and the equivalent magnetic permeability of the wave-transparent material can be regulated and controlled by attaching the periodically arranged metal patterns on the wave-transparent material, so that the problem of co-channel interference is solved, electromagnetic shielding of electromagnetic waves is possible under the condition that the wave-transparent material is obliquely incident at a large angle, and therefore, the technical problem to be solved is how to effectively reduce the transmission performance of the electromagnetic waves of the wave-transparent material.
Disclosure of Invention
Aiming at the defects, the invention provides a metal pattern functional layer structure for realizing electromagnetic wave attenuation, which comprises two metal pattern functional layers and a medium substrate layer positioned in the middle of the metal pattern functional layers, wherein the metal pattern functional layers are composed of a plurality of metal pattern functional layer units which are periodically and equally arranged at intervals, and the medium substrate layer is composed of a plurality of medium substrate layer units which are matched with the metal pattern functional layer units;
each dielectric substrate layer unit comprises two layers of dielectric substrates and an air dielectric layer positioned between the two layers of dielectric substrates;
Each metal pattern functional layer unit comprises a metal pattern layer, a transparent flexible material layer and an OCA adhesive layer, wherein the metal pattern layer is positioned between the transparent flexible material layer and the OCA adhesive layer and printed on the surface of the transparent flexible material layer, and the OCA adhesive layer is adhered on the surface of the medium substrate adjacent to the upper side and the lower side.
Further, the arrangement period of the metal pattern functional layer unit is T, and the formula is satisfied:
0.12λ0≤T≤0.5λ0( c is the speed of light in vacuum, f 0 is the center frequency),
In the formula, er is the dielectric constant of a dielectric substrate material, h is the thickness of the dielectric substrate material, beta is a correction factor, and the dielectric substrate material is regulated according to actual conditions such as different material thicknesses, namely-0.1λ 0≤β≤0.1λ0, and all parameter units are mm.
Further, the metal pattern at the metal pattern layer is in a square structure, the metal pattern is formed by symmetrically arranging cross metal strips with central symmetry and a series of metal branches which are equidistantly distributed and are perpendicular to the metal strips in a rotation symmetry way by taking the center of a unit as an origin 90 degrees.
Further, the metal branches are sampled at equal intervals, and the sampling interval d is more than or equal to 0.03T and less than or equal to 0.08T;
The number of samples is n (wherein N takes the maximum value),
Length of metal strip l=nd (n is the number of samples, whereN takes the maximum value),
The width of the metal strip is equal to that of the metal branch, and the width of the line is more than or equal to 0.02T and less than or equal to 0.04T.
Further, the metal pattern functional layer is arranged on the surface of the dielectric substrate layer through a process.
Further, the dielectric substrate layer is made of electromagnetic wave transmission materials.
Further, the transparent flexible material layer is a PET material.
Compared with the prior art, the invention has the following beneficial effects:
1. The invention is applied to building structures adopting wave-transmitting materials on building outer walls, glass windows, plastics, wood boards and the like, and the transmission amplitude of electromagnetic waves in the wave-transmitting materials is greatly reduced in the wave-coming direction of specific electromagnetic waves in specific frequency bands by sticking metal pattern functional layers on the surfaces of the structures.
2. The invention has wide application range, and can flexibly change the size of the metal pattern functional layer according to the specific size of the dielectric substrate layer so as to realize the optimal performance.
3. The invention can ensure the integral structural strength if adopting the etching process of the printed circuit board; the invention can ensure the high light transmittance of the glass if adopting the ITO process of the conductive glass; according to the invention, if the CuMesh technology is adopted to print the metal pattern functional layer on the transparent flexible material and then paste the metal pattern functional layer on the dielectric substrate, the high visibility of the surface of the dielectric substrate and the high light transmittance of the transparent material dielectric substrate (such as glass, acrylic material and the like) can be realized.
4. The mounting mode of the invention can be a post-mounting process, namely, the mounting can be completed under the condition of not replacing the original dielectric substrate, and the designed metal pattern functional layer is adhered to the surface of the dielectric substrate through an adhesion process.
5. The metal pattern functional layer can be printed by adopting a flexible material and is adhered to the dielectric substrate, so that the conformal requirement is greatly facilitated, and the application is wider.
Drawings
Fig. 1 is a schematic structural diagram of a metal pattern functional layer and a dielectric substrate layer in the present invention.
Fig. 2 is a schematic structural diagram of a metal pattern functional layer unit and a dielectric substrate layer unit in the present invention.
Fig. 3 is a plan view of a metal pattern in the present invention.
Fig. 4 is a diagram showing a process of metal pattern formation according to the present invention.
Fig. 5 is a schematic diagram of a top view of an actual test scenario in the present invention.
Fig. 6 is a graph showing electromagnetic wave transmission performance of a wave-transparent material before implementation in the present invention.
Fig. 7 is a graph showing electromagnetic wave transmission performance of the wave-transmitting material after the implementation of the present invention.
Fig. 8 is a graph showing the transmission performance of electromagnetic waves on a wave-transparent material after the invention is implemented in the present invention.
In the figure: 1. a dielectric substrate layer; 2. a dielectric substrate; 3. an air dielectric layer; 4. a metal pattern functional layer; 5. an OCA glue layer; 6. a metal pattern layer; 7. a transparent flexible material layer.
Detailed Description
In order to facilitate an understanding of the invention, the device of the invention will be described more fully below with reference to the accompanying drawings. Examples of the apparatus are given in the accompanying drawings. The apparatus may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
In the description of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be fixedly connected, disposed, or detachably connected, disposed, or integrally connected, disposed, for example. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Examples
As shown in fig. 1-2, the present embodiment provides a metal pattern functional layer structure for realizing electromagnetic wave attenuation, which includes two metal pattern functional layers 4 and a dielectric substrate layer 1 located in the middle of the metal pattern functional layers, wherein the metal pattern functional layers 4 are composed of a plurality of metal pattern functional layer units which are periodically arranged at equal intervals with specific units, and the dielectric substrate layer 1 is composed of a plurality of dielectric substrate layer units which are matched with the metal pattern functional layer units;
wherein, the arrangement period of the metal pattern functional layer unit is T, and the formula is satisfied:
0.12λ0≤T≤0.5λ0( c is the speed of light in vacuum, f 0 is the center frequency),
In the formula, er is the dielectric constant of a dielectric substrate material, h is the thickness of the dielectric substrate material, beta is a correction factor, and the dielectric substrate material is regulated according to actual conditions such as different material thicknesses, namely-0.1λ 0≤β≤0.1λ0, and all parameter units are mm.
The metal pattern functional layer 4 is arranged on the surface of the dielectric substrate layer 1 through a process, if the dielectric substrate 2 is a PCB substrate, the metal pattern functional layer 4 is etched on the surface of the PCB substrate by adopting an etching process of a printed circuit board; if the dielectric substrate 2 is conductive glass, etching a metal pattern functional layer 4 on the conductive film by adopting an ITO process; if the dielectric substrate 2 is made of conventional materials such as toughened glass, acrylic material, plastic and wood board, the CuMesh process is adopted to print the metal pattern functional layer 4 on the transparent flexible material such as PET material, and then the metal pattern functional layer 4 is bonded on the surface of the dielectric substrate 2 through the bonding process, it should be noted that the dielectric substrate 2 in this embodiment is made of toughened glass, and has a thickness of 10mm, and the thickness of the air dielectric layer 1 is 14mm.
It should be noted that, the metal pattern functional layer 4 may be printed on any side of the transparent flexible material layer 7, in this embodiment, the metal pattern functional layer 4 is printed on the side of the transparent flexible material layer 7, which is close to the dielectric substrate layer 1, and the transparent flexible material layer 7 may play a role in protection, so as to prolong the service life of the structure.
Each dielectric substrate layer unit comprises two layers of dielectric substrates 2 and an air dielectric layer 3 positioned between the two layers of dielectric substrates 2, and it should be noted that the dielectric substrate layer 2 can be of a single-layer or multi-layer structure, the thickness of each layer and the interval between the layers are actual scene sizes, and the structural sizes of the metal pattern functional layer units are adjusted according to the specific sizes of the dielectric substrate layers 2, meanwhile, the central frequency point in the embodiment is 2.595GHz, the design frequency band is 2.515GHz-2.675GHz, and the electromagnetic wave incident angle is 50 ° -80 °.
Each metal pattern functional layer unit comprises a metal pattern layer 6, a transparent flexible material layer 7 and an OCA adhesive layer 5, as shown in fig. 3, the metal pattern at the metal pattern layer 6 is in a square structure, and in this embodiment, the construction process is as shown in fig. 4, and is specifically as follows:
As shown in fig. 4- ①, (a) represents cross metal bars perpendicular to each other centered on the square cell period as the origin; as shown in fig. 4- ②, with the center of the cell as the origin, the cross-shaped metal bar is used as the coordinate axis, as shown in fig. 4- ① - (a) as a specific function:
(wherein )；
As a specific function in fig. 4- ② - (b):
(wherein )；
As shown in fig. 4- ③, sampling is performed at equal intervals on specific functions (a) f 1 (x) and (b) f 2 (x), wherein the sampling interval is 0.03 t.ltoreq.d.ltoreq.0.08T (taking d=0.04T);
the sampling number is:
n (wherein N takes the maximum value),
Wherein n=12;
The width of the metal strip is equal to that of the metal branch, the width of the line is more than or equal to 0.02T and less than or equal to 0.04T,
(Cross metal strip length is taken to be 0.48T x2, i.e. l=0.96T, line width is taken to be 0.04T, i.e. w=1 mm);
The sampling points are made into a series of perpendicular lines perpendicular to the cross metal strip;
As shown in fig. 4- ④, a series of perpendicular lines form a series of metal branches (a) on the cross metal strip, which have the same width as the metal strip;
As shown in fig. 4- ⑤, a series of metal branches take cross metal strip crossing points as axes, and rotate 90 degrees to form a series of metal branches with rotational symmetry, so that a complete metal pattern (a) is formed, wherein the cross metal strips with the metal patterns as centers are symmetrical, and a series of metal branches which are equidistantly distributed and perpendicular to the metal strips are rotationally symmetrical every 90 degrees by taking the unit center as an origin;
In the above steps, since the thicknesses of the two toughened glass layers of the dielectric substrate layer 1 are the same, the sizes of the two metal pattern functional layers 4 are the same, and the two metal pattern functional layers 4 are of a concentric structure;
Through simulation optimization, the determination functions are respectively as follows:
The metal pattern layer 6 is positioned between the transparent flexible material layer 7 and the OCA adhesive layer 5 and is printed on the surface of the transparent flexible material layer 7 through CuMesh technology, and the OCA adhesive layer 5 is adhered on the surface of the medium substrate 2 adjacent to the upper part and the lower part.
An electromagnetic wave transmission performance graph (shown in fig. 6) of the medium base material before the implementation and an electromagnetic wave transmission performance graph (shown in fig. 7) of the medium base material after the implementation are obtained.
In order to intuitively embody the change of the transmission amplitude of electromagnetic waves of the medium substrate bonded with the electromagnetic shielding structure compared with that of the medium substrate not bonded with the electromagnetic shielding structure, the transmission performance is defined as: transmission performance (dB) =transmission amplitude (dB) of electromagnetic waves of the dielectric substrate to which the electromagnetic shielding structure is bonded at a specific incident angle—transmission amplitude (dB) of electromagnetic waves of the dielectric substrate to which the electromagnetic shielding structure is not bonded at a specific incident angle;
As shown in fig. 8, the graph shows that the transmission performance of the electromagnetic wave before and after the treatment of the dielectric substrate bonded with the electromagnetic shielding structure is substantially reduced in the frequency range of 2.515GHz-2.675GHz within the incidence angle of the electromagnetic wave of 50 ° -80 °, compared with the transmission amplitude of the electromagnetic wave of the dielectric substrate not bonded with the electromagnetic shielding structure, especially in the vicinity of the center frequency point of 2.595GHz, the transmission amplitude of the electromagnetic wave of the dielectric substrate bonded with the electromagnetic shielding structure is reduced by more than 15dB, and the attenuation of the electromagnetic wave is more obvious, so that the dielectric substrate bonded with the electromagnetic shielding structure has a good electromagnetic wave shielding effect in the designed frequency band.
According to the metal pattern functional layer structure for realizing electromagnetic wave attenuation, the equivalent dielectric constant and the equivalent magnetic permeability of the wave-transparent material can be regulated and controlled by attaching the periodically arranged metal patterns on the wave-transparent material, and specific response is generated on the incident electromagnetic wave, so that the transmission performance of the electromagnetic wave in the incoming wave direction of the specific electromagnetic wave in the specific frequency band is effectively reduced, the electromagnetic shielding function of the wave-transparent material is realized, and an actual test scene schematic diagram is shown in fig. 5.
It should be noted that the structure of the present invention may be implemented in many different forms, and is not limited to the embodiments, and any equivalent transformation made by those skilled in the art using the present specification and the accompanying drawings, or direct or indirect application in other related technical fields, such as loading and unloading of other articles, are included in the protection scope of the present invention.
Claims (4)
1. A metal pattern functional layer structure for realizing electromagnetic wave attenuation, includes two metal pattern functional layers and is located its middle part's medium substrate layer, its characterized in that: the metal pattern functional layer consists of a plurality of metal pattern functional layer units which are periodically distributed at equal intervals, the distribution period of the metal pattern functional layer units is T, and the formula is satisfied:
，
，
in the formula, er is the dielectric constant of the dielectric substrate material, h is the thickness of the dielectric substrate material, and beta is a correction factor;
the position of the metal branch is determined by a specific function on an xy coordinate system with the square unit period as the origin center AndTo determine:
，
，
metal branches at specific functions AndSampling the mixture at equal intervals to obtain the product,
The sampling interval d satisfies，
The sampling number is,
Length of metal strip,
The sampling point is made a series of vertical lines mutually perpendicular to the metal strip, the series of vertical lines form a series of metal branches on the metal strip, the line widths of the metal strip and the metal branches are equal, and the line widths meet the requirement,
The metal pattern at the metal pattern layer is a square structure formed by a cross metal strip with symmetrical center and a series of metal branches which are distributed at equal intervals and are perpendicular to the metal strip, wherein each 90-degree rotation symmetry is performed by taking the center of a unit as an origin;
the dielectric substrate layer consists of a plurality of dielectric substrate layer units which are matched with the metal pattern functional layer units;
Each dielectric substrate layer unit comprises two layers of dielectric substrates and an air dielectric layer positioned between the two layers of dielectric substrates;
each metal pattern functional layer unit comprises a metal pattern layer, a transparent flexible material layer and an OCA adhesive layer, wherein the metal pattern layer is positioned between the transparent flexible material layer and the OCA adhesive layer and printed on the surface of the transparent flexible material layer, and the OCA adhesive layer is adhered on the surface of the upper or lower adjacent medium substrate.
2. A metal pattern functional layer structure for realizing electromagnetic wave attenuation as set forth in claim 1, wherein: the metal pattern functional layer is arranged on the surface of the dielectric substrate layer through a process.
3. A metal pattern functional layer structure for realizing electromagnetic wave attenuation as set forth in claim 1, wherein: the medium substrate layer is made of electromagnetic wave transmission materials.
4. A metal pattern functional layer structure for realizing electromagnetic wave attenuation as set forth in claim 1, wherein: the transparent flexible material layer is made of PET material.
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| CN202311857900.3A CN117769235B (en) | 2023-12-29 | Metal pattern functional layer structure for realizing electromagnetic wave attenuation |
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| CN202311857900.3A CN117769235B (en) | 2023-12-29 | Metal pattern functional layer structure for realizing electromagnetic wave attenuation |
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| CN117769235A CN117769235A (en) | 2024-03-26 |
| CN117769235B true CN117769235B (en) | 2024-07-05 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8106850B1 (en) * | 2006-12-21 | 2012-01-31 | Hrl Laboratories, Llc | Adaptive spectral surface |
| CN111565554A (en) * | 2020-06-10 | 2020-08-21 | 北京环境特性研究所 | Multispectral transparent microwave absorbing material and preparation method thereof |
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8106850B1 (en) * | 2006-12-21 | 2012-01-31 | Hrl Laboratories, Llc | Adaptive spectral surface |
| CN111565554A (en) * | 2020-06-10 | 2020-08-21 | 北京环境特性研究所 | Multispectral transparent microwave absorbing material and preparation method thereof |
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