CN117766441B - Deviation detection method and dicing saw - Google Patents
Deviation detection method and dicing saw Download PDFInfo
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Abstract
The invention discloses a deviation detection method and a dicing saw, wherein the deviation detection method is characterized in that a standard sample is placed on a wafer carrying table during detection, and then a main shaft is replaced by a special detection device for detection, and the detection mode does not need repeated cutting of the sample when the detection is needed repeatedly, so that the waste of the sample is avoided, the time consumption corresponding to cutting does not exist, and the efficiency is high; furthermore, as cutting is not needed, and boiled water cooling is not needed, the detection is performed in an environment without a large amount of water vapor, and the detection is not affected by the water vapor, thereby being beneficial to improving the detection precision; meanwhile, the observation is not needed after one-time cutting, so that the wafer carrying table does not need to be repeatedly moved to be matched with the observation, the influence of the movement of the wafer carrying table is small, and the precision is high.
Description
Technical Field
The invention relates to the field of semiconductor device processing, in particular to a deviation detection method and a dicing saw.
Background
The dicing saw is a special device for dicing wafers, and the patent of the utility model with the issued publication number of CN218691720U discloses a usable structure, which is provided with a CCD vision alignment system at the side of the spindle, and the CCD vision alignment system can identify the dicing position of the first blade and set the coordinates of the reference line during dicing.
However, in the actual cutting, it was found that when the cutting is performed by controlling the blade on the spindle according to the set program after the reference line coordinates are recognized and determined by the CCD vision alignment system, there is an error between each cutting position to which the blade is actually moved and the reference line coordinates, and therefore it is necessary to detect and compensate such an error in the cutting.
The existing detection method is as follows: the method comprises the steps of placing a sample on a wafer carrying table of a dicing saw, controlling a blade on a main shaft to cut the sample for the first time according to a set program, after the first time cutting, enabling a CCD visual alignment system to observe a cutting mark after the first time cutting and determine a datum line coordinate through X-axis direction movement of the wafer carrying table and Y-axis direction movement of the CCD visual alignment system, then controlling the blade to cut the sample continuously according to the set program, and after the preset times of cutting, enabling the CCD visual alignment system to observe the cutting mark after the preset times of cutting again and determining deviation conditions between actual cutting positions and the datum line coordinate through X-axis direction movement of the wafer carrying table and Y-axis direction movement of the CCD visual alignment system. And according to the deviation condition, after position compensation is carried out and the reference line coordinates are reset when cutting is continued, cutting is carried out for a preset number of times again, and then observation is carried out again through the CCD vision alignment system until all cutting and detection are completed.
The detection method needs to be observed after the sample is actually cut, and has low efficiency. And when detecting, can exist water smoke because of the cutting in the cutting machine, this precision that can influence image detection to a certain extent, in the detection process simultaneously, need frequent removal to hold the piece platform, this certain extent also can influence the detection precision.
Disclosure of Invention
The present invention is directed to solving the above-mentioned problems of the prior art, and provides a deviation detecting method and a dicing saw.
The aim of the invention is achieved by the following technical scheme:
The deviation detection method is based on a dicing saw, the dicing saw comprises a moving module, a main shaft which is driven by the moving module to move along the vertical direction and the Y-axis direction, and a first image acquisition assembly which is positioned at the side part of the main shaft and moves synchronously with the main shaft, and the axial direction of the main shaft is defined as the Y-axis direction, and the method comprises the following steps:
S1, providing a detection device and replacing a main shaft on the mobile module with the detection device, wherein the installation positions of the detection device and the main shaft on the mobile module are consistent, and the weight and the gravity center of the detection device are consistent with those of the main shaft and the whole structure formed by the main shaft and the main shaft; an optical axis of a second image acquisition component of the detection device on the moving module extends along the vertical direction, and the optical axis corresponds to the cutting edge position of the blade on the main shaft fixed on the moving module and intersects with the axis of the blade;
S2, concentrically placing a standard sample on a wafer carrying table of a dicing saw for fixing, wherein the standard sample is provided with a marking line corresponding to a theoretical cutting position of each cutting of the blade on the wafer;
S3, enabling the center of the table top of the wafer carrying table to move to the moving path of the optical axis or the vicinity of the moving path;
S4, the moving module drives the first image acquisition assembly to move to the identification line position corresponding to the theoretical cutting position of the first cutting on the standard sample for observation so as to determine the reference line coordinate;
S5, after the datum line coordinates are determined, the moving module drives the detection device to reversely move a first preset distance along the Y-axis direction so that the second image acquisition assembly moves to the position of the identification line corresponding to the theoretical cutting position of the first cutting to acquire an image; determining the deviation condition of the Y-axis coordinate of any point on the optical axis and the Y-axis coordinate of the datum line coordinate in the image acquisition according to the acquired image; the first preset distance is a Y-direction distance between the lens optical axis of the first image acquisition component and the optical axis of the second image acquisition component;
S6, the mobile module drives the second image acquisition assembly to step forward for n steps according to the stepping distance set by the cutting machine, acquires images and executes S7;
S7, determining the deviation condition of the Y-axis coordinate of any point on the optical axis during image acquisition according to the acquired image;
S8, determining whether all detection is completed, and if so, stopping detection; if not, executing S9;
S9, the moving module drives the first image acquisition assembly to move forwards so as to observe the identification line corresponding to the theoretical cutting position of the xn+x times of cutting and redetermine the coordinate of the reference line; the x is the execution times of the S7;
s10, the moving module drives the detecting device to reversely move by a second preset distance, and then S6 is executed, wherein the second preset distance is the difference value between the first preset distance and the stepping distance.
Preferably, the detection device comprises a counterweight seat, wherein a mounting block is arranged on the counterweight seat, and the mounting block is provided with a second image acquisition assembly positioned at the end part of the counterweight seat.
Preferably, the mounting block includes a base block and a connection block provided on the base block to be adjustable in height.
Preferably, a group of strip-shaped holes extending along the Y-axis direction are formed in the base block, and the base block is arranged on the counterweight seat in a position-adjustable manner along the Y-axis direction.
Preferably, the height of the connecting block is adjusted so that the focus of the second image acquisition assembly is positioned on the surface of the standard sample on the wafer bearing table during detection.
Preferably, the S4 includes:
s41, driving the first image acquisition assembly to move to a mark line corresponding to a theoretical cutting position of the first cutting on the standard sample by the moving module;
s42, the first image acquisition component acquires images and determines whether the identification lines on the acquired images coincide with the identification lines on the standard images;
s43, if so, taking the coordinate of any point on the lens optical axis of the first image acquisition assembly as the datum line coordinate when the image is acquired;
And S44, if not, determining the deviation direction and the deviation distance of the identification line on the acquired image relative to the identification line on the standard image, and executing S42 after the first image acquisition assembly moves the deviation distance towards the direction opposite to the deviation direction.
Preferably, in S7, the deviation of the Y-axis coordinate of any point on the optical axis during the image acquisition is determined by comparing the identification line on the acquired image with the identification line on the standard image or by determining the positional relationship between the identification line on the acquired image and the center of the image.
Preferably, in S6, n is an integer between 1 and 20.
Preferably, when it is determined in S7 that there is a deviation in the Y-axis coordinate of any point on the optical axis during the image acquisition and the reference line coordinate is redetermined in S9, it is determined whether the deviation distance determined in S7 is the same as a predetermined difference value, and if not, a deviation between the deviation distance and the predetermined difference value is determined; the predetermined difference is a difference between the moving distance of the first image capturing component and the first predetermined distance when the reference line coordinate is redetermined in S9.
The scribing machine comprises a moving module, a main shaft driven by the moving module to move along the vertical direction and the Y-axis direction, a first image acquisition assembly positioned at the side part of the main shaft and synchronously moving with the main shaft, and a detection device capable of replacing the main shaft, wherein the detection device comprises a counterweight seat, a mounting block is arranged on the counterweight seat, a second image acquisition assembly positioned at the end part of the counterweight seat is arranged on the mounting block, and the weight and the gravity center of the detection device are consistent with those of the main shaft and the whole structure formed by the main shaft and the upper structure of the main shaft.
The technical scheme of the invention has the advantages that:
In the method, during detection, the standard sample is placed on the wafer carrying table, and then the main shaft is replaced by a special detection device for detection, so that the detection mode does not need repeated cutting of the sample, the waste of the sample is avoided, the time consumption corresponding to cutting does not exist, and the efficiency is high; furthermore, as cutting is not needed, and boiled water cooling is not needed, the detection is performed in an environment without a large amount of water vapor, and the detection is not affected by the water vapor, thereby being beneficial to improving the detection precision; meanwhile, the observation is not needed after one-time cutting, so that the wafer carrying table does not need to be repeatedly moved to be matched with the observation, the influence of the movement of the wafer carrying table is small, and the precision is high.
The method can control the detection flow according to the main shaft movement control flow during actual cutting, so that the detection flow can effectively simulate the actual cutting flow, the method is beneficial to improving the degree of fit between the detection result and the actual cutting condition, and meanwhile, the development and realization of the detection program can be facilitated.
The invention can detect when the equipment is not assembled, and can optimize the assembly of the equipment according to the detection condition, thereby facilitating the assembly and debugging of the equipment.
Drawings
FIG. 1 is a partial perspective view of a dicing saw of the invention;
FIG. 2 is a perspective view of a dicing saw of the present invention with a detection device replacing the spindle;
FIG. 3 is a perspective view of the detection device of the present invention;
FIG. 4 is a process schematic of the method of the present invention;
fig. 5 is a schematic diagram of a first time a reference line coordinate is determined in the method of the present invention.
Detailed Description
The objects, advantages and features of the present invention are illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are only typical examples of the technical scheme of the invention, and all technical schemes formed by adopting equivalent substitution or equivalent transformation fall within the scope of the invention.
In the description of the embodiments, it should be noted that the positional or positional relationship indicated by the terms such as "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in the specific orientation, and thus are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The deviation detecting method disclosed by the invention is described below with reference to the accompanying drawings, and is based on the existing dicing saw, as shown in fig. 1 and fig. 2, the dicing saw comprises a moving module 100, a main shaft 200 driven to move by the moving module 100, and a first image acquisition assembly 300 positioned at the side of the main shaft 200 and moving synchronously with the main shaft 200. For convenience of description, the axial direction of the spindle 200 is defined as a Y-axis direction, the moving direction of the wafer carrier 500 of the dicing saw is defined as an X-axis direction, the vertical direction is defined as a Z-axis direction, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other, and a coordinate system is constructed by using the X-axis direction, the Y-axis direction, and the Z-axis direction. The moving module 100 drives the spindle 200 and the first image capturing module 300 to move along the Y-axis direction and the Z-axis direction.
The dicing saw is different from the prior art in that the dicing saw further comprises a detection device 400 capable of replacing the spindle 200, the detection device 400 comprises a counterweight base 410, a mounting block 420 is arranged on the counterweight base 410, a second image acquisition assembly 430 positioned at the end part of the counterweight base 410 is arranged on the mounting block 420, and the weight and the gravity center of the detection device 400 are consistent with those of the whole body formed by the spindle 200 and the upper structure thereof (the structure on the spindle comprises a blade, a water spraying cover and the like as in the prior art).
In order to conveniently adjust the center of gravity of the detection device 400, the mounting block 420 includes a base block 421, a group of strip-shaped holes 422 extending along the Y-axis direction are formed on the base block 421, a first screw hole 411 corresponding to the strip-shaped holes 422 is provided on the weight seat 410, and the base block 421 and the weight seat 410 are fixed by bolts, so that the base block 421 is disposed on the weight seat 410 in a position adjustable along the Y-axis direction. The base block 421 is further provided with a set of first connecting holes 423 for connecting to the mobile module 100. In order to facilitate adjusting the height of the second image capturing assembly 430 for accurate detection, the mounting block 420 further includes a connection block 424 with an adjustable height disposed on the base block 421, that is, a group of kidney-shaped counter bores 425 extending along the Z-axis direction are disposed on the connection block 424, a second screw hole 426 corresponding to the kidney-shaped counter bores is disposed on an end surface of the base block 421, and the base block 421 is fixed to the connection block 424 by a bolt. Meanwhile, the connection block 424 is further provided with a set of third screw holes 427, the second image acquisition assembly 430 is provided with second connection holes 431 corresponding to the third screw holes 427, the second image acquisition assembly 430 is connected with the connection block 424 through bolts, and the second image acquisition assembly 430 comprises a microscope camera, a lens and a light source.
For convenience of explanation, taking dicing saw cutting from left to right as an example, as shown in fig. 4, the deviation detecting method includes the following steps:
S1, replacing the main shaft 200 on the mobile module 100 with the detection device 400, wherein the installation positions of the detection device 400 and the main shaft 200 on the mobile module 100 are consistent, and the optical axis of the second image acquisition component 430 of the detection device 400 on the mobile module 100 extends along the vertical direction, and the optical axis corresponds to the cutting edge position of the blade on the main shaft 200 fixed on the mobile module 100 and intersects with the axis of the blade. Meanwhile, by adjusting the height of the connection block 424 so that the focus of the second image acquisition unit 430 is located on the surface of the standard sample on the slide table 500 during the inspection, more accurate images can be obtained to facilitate the subsequent analysis.
S2, a standard sample is concentrically arranged on a wafer carrying table of the dicing saw to be fixed, the standard sample is provided with a marking line corresponding to the theoretical cutting position of each cutting of the blade on the wafer, the marking line comprises a group of first marking lines which are distributed at equal intervals and longitudinally extend and a group of second marking lines which are distributed at equal intervals and transversely extend, the first marking lines and the second marking lines are mutually perpendicular and interweaved to form a plurality of small squares which are distributed in a matrix, and when the standard sample is fixed on the wafer carrying table, the first marking lines or the second marking lines are parallel to the X-axis direction.
And S3, enabling the center of the table top of the wafer carrying platform 500 to move to be on or near the moving path of the optical axis, so that the observation through the first image acquisition assembly 300 and the second image acquisition assembly 430 is facilitated.
S4, the moving module drives the first image acquisition component to move to a mark line position corresponding to a theoretical cutting position of the first cutting on the standard sample for observation to determine a datum line coordinate, and when an image is acquired, the moving module enables the control detection device to move downwards to the position of the main shaft when the main shaft is cut according to a normal cutting flow; of course, this is not necessary, i.e. the mobile module may not lower the detection device and the first image acquisition assembly for detection.
As shown in fig. 5, the step S4 includes:
S41, driving the first image acquisition assembly to move to a mark line corresponding to a theoretical cutting position of the first cutting on the standard sample by the moving module; specifically, the moving module makes the first image acquisition component move rightwards by a certain distance from the initial position according to a normal cutting program, after moving the distance, the first image acquisition component moves to the identification line corresponding to the theoretical position of the first cutting, and theoretically, the lens optical axis of the first image acquisition component should be located at the identification line corresponding to the theoretical position of the first cutting, at this time, when the first image acquisition component acquires an image, the identification line on the acquired image should be located at the median position of the image and coincides with the identification line on the standard image, and the identification line on the standard image is located at the median position of the image.
S42, the first image acquisition component acquires images and determines whether the identification lines on the acquired images coincide with the identification lines on the standard images;
And S43, if so, taking the coordinate of any point on the lens optical axis of the first image acquisition assembly as the datum line coordinate when the image is acquired. In the initial state, the X-axis coordinate and the Y-axis coordinate of any point on the optical axis of the lens of the first image acquisition component are determined, and correspondingly, the Y-axis coordinate of any point on the optical axis of the second image acquisition component is determined, namely, the Y-axis coordinate of any point on the optical axis of the lens is added with a first preset distance.
And S44, if not, determining the deviation direction and the deviation distance of the identification line on the acquired image relative to the identification line on the standard image, and executing S42 after the first image acquisition assembly moves the deviation distance towards the direction opposite to the deviation direction. The specific method for determining the deviation direction and the deviation distance through image comparison is known technology and will not be described here.
Of course, in S42, the collected image may not be compared with the standard image, but it may be directly determined whether the identification line on the collected image is at the center of the image, and if so, the reference line coordinate may be determined according to S43. If not, the deviation direction can be determined according to the positions of the identification line and the center of the image on the image, and the deviation distance can be determined according to the distance between the identification line and the center of the image and the corresponding scale.
And S5, after the datum line coordinate is determined, the moving module drives the detection device to reversely move (leftwards move) along the Y-axis direction by a first preset distance so that the second image acquisition assembly moves to the identification line corresponding to the theoretical cutting position of the first cutting to acquire an image, and the deviation condition of the Y-axis coordinate of any point on the optical axis and the Y-axis coordinate of the datum line coordinate during image acquisition is determined according to the acquired image.
Specifically, the first predetermined distance is a Y-direction distance between the lens optical axis of the first image acquisition assembly and the optical axis of the second image acquisition assembly, and the first predetermined distance is a distance between the lens optical axis of the first image acquisition assembly and the cutting edge of the blade on the spindle. Since the distance between the lens optical axis of the first image capturing element and the optical axis of the second image capturing element is fixed, theoretically, after the second image capturing element is reversely moved by the first predetermined distance on the basis of the above-determined reference line coordinate (the coordinate of any point on the optical axis of the first image capturing element), the optical axis of the second image capturing element should be located at the identification line corresponding to the theoretical position of the first cutting, and the Y-axis coordinate of any point on the optical axis should be the Y-axis coordinate of the reference line coordinate. If the identification line on the image acquired by the second image acquisition component is located at the center of the image or coincides with the identification line on the standard image, the deviation between the Y-axis coordinate of any point on the optical axis and the Y-axis coordinate of the reference line coordinate is considered to be 0, that is, no deviation exists, the position moved by the second image acquisition component is accurate and unbiased, and correspondingly, the cutting position actually moved by the cutter is accurate. On the contrary, if the marking line on the image collected by the second image collecting component is deviated to one side of the center of the image or is not overlapped with the marking line on the standard image, it can be considered that there is a deviation between the Y-axis coordinate of any point on the optical axis and the Y-axis coordinate of the reference line coordinate, and correspondingly, the position where the second image collecting component moves is deviated, that is, the cutting position where the blade actually moves is deviated, so that the deviation condition of the Y-axis coordinate of any point on the optical axis and the Y-axis coordinate of the reference line coordinate can be determined to compensate when actually cutting, and the specific method for determining the deviation condition according to the image is a known method, which is not described herein.
S6, the mobile module drives the second image acquisition assembly to forward step by n steps according to the stepping distance set by the cutting machine, acquires images and executes S7, wherein the stepping distance is the same as the distance between two adjacent parallel identification lines on the standard sample, and the distance can be determined according to actual needs without limitation. The number n is an integer between 1 and 20, for example, the detection can be further performed once per step, but in the practical use of the cutting machine, observation after each cutting is impossible, which greatly influences the cutting efficiency. In order to ensure the overall processing efficiency, and avoid the fact that actual cutting is not in line with the requirements due to untimely detection, n is an integer between 14 and 20, and when actual cutting is performed, the deviation situation is observed and correction is performed after n+1 times of cutting.
S7, determining the deviation condition of the Y-axis coordinate of any point on the optical axis during image acquisition according to the acquired image. The deviation condition of the Y-axis coordinate of any point on the optical axis during image acquisition can be determined by comparing the identification line on the acquired image with the identification line on the standard image or by determining the position relationship between the identification line on the acquired image and the center of the image. For example, if the identification line on the acquired image coincides with the identification line of the standard image, it indicates that the position of the second image acquisition component is unbiased, that is, the Y-axis coordinate of any point on the optical axis is unbiased when the image is acquired; otherwise, it indicates that the position of the second image acquisition component is deviated, that is, the Y-axis coordinate of any point on the optical axis is deviated during the image acquisition. And the direction of deviation and the distance of deviation of the second image acquisition assembly may be determined with reference to the method in S4. The deviation direction reflects whether an actual distance between a Y coordinate of any point on the optical axis and a reference line coordinate in the Y axis direction is larger than a theoretical distance or smaller than the theoretical distance when the image is acquired, the deviation distance reflects a difference value between the actual distance and the theoretical distance, and the theoretical distance is a theoretical stepping stroke of the second image acquisition assembly stepping n steps according to a set stepping distance.
S8, determining whether all detection is completed, if so, stopping detection, and driving the first image acquisition assembly and the second image acquisition assembly to reset by the mobile module; if not, that is, if the detection needs to be continued, S9 is executed.
S9, the moving module drives the first image acquisition assembly to move forwards (move rightwards) so as to observe a marking line corresponding to a theoretical cutting position of the xn+x times of cutting and redetermine a datum line coordinate; and x is the execution times of the S7, namely, each time S7 is executed in a program, the value of the x is added with 1, and after detection is completed, the x is cleared. The process of redefining the reference line coordinates is equivalent to the process of S4 above, except that the first image capturing assembly may be moved rightward by the first predetermined distance before being observed.
Further, when it is determined in S7 that there is a deviation in the Y-axis coordinate of any point on the optical axis at the time of image acquisition and the reference line coordinate is newly determined in S9, it is determined whether the deviation distance determined in S7 is the same as a predetermined difference value, and if not, a deviation between the deviation distance and the predetermined difference value is determined. The predetermined difference is a difference between the moving distance of the first image capturing component and the first predetermined distance when the reference line coordinate is redetermined in S9.
For example, in the step S7, it is determined that there is a deviation in the Y-axis coordinate of any point on the optical axis during the image acquisition, and the deviation distance is positive Y 1, if the theoretical Y-axis coordinate of any point on the optical axis during the image acquisition is Y Management device , the Y-axis coordinate of any point on the optical axis during the image acquisition is Y Management device +Y1, and if the first predetermined distance is S, the actual Y-axis coordinate of any point on the lens optical axis of the first image acquisition component is Y Management device +Y1 -S. Correspondingly, in the step S9, after the first image capturing component moves to the right by S-Y 1, theoretically, the Y-axis coordinate of any point on the optical axis of the lens of the first image capturing component is Y Management device , and the obtained reference line coordinate is determined again. However, due to the movement deviation, when the first image capturing component redetermines the obtained reference line coordinates, the first image capturing component may move rightward by S-Y 2, and Y 2 is not equal to Y 1, the difference between the first predetermined distance and the movement distance is S-s+y 2=Y2, and at this time, the deviations of Y 2 and Y 1 are calculated. Therefore, the deviation condition of the observed position of the first image acquisition assembly and the position to which the blade is actually moved can be accurately reflected, and compensation can be performed when the first preset distance is moved subsequently.
S10, the moving module drives the detecting device to reversely move (leftwards move) by a second preset distance, and then S6 is executed, wherein the second preset distance is the difference value between the first preset distance and the stepping distance, and at the moment, the optical axis of the second image acquisition assembly is theoretically located at the identification line corresponding to the theoretical cutting position of the xn+x+1 times of cutting.
The invention has various embodiments, and all technical schemes formed by equivalent transformation or equivalent transformation fall within the protection scope of the invention.
Claims (10)
1. The deviation detection method is based on a dicing saw, the dicing saw comprises a moving module, a main shaft which is driven by the moving module to move along the vertical direction and the Y-axis direction, and a first image acquisition assembly which is positioned at the side part of the main shaft and moves synchronously with the main shaft, and the axial direction of the main shaft is defined as the Y-axis direction, and the method is characterized by comprising the following steps:
S1, providing a detection device and replacing a main shaft on the mobile module with the detection device, wherein the installation positions of the detection device and the main shaft on the mobile module are consistent, and the weight and the gravity center of the detection device are consistent with those of the main shaft and the whole structure formed by the main shaft and the main shaft; an optical axis of a second image acquisition component of the detection device on the moving module extends along the vertical direction, and the optical axis corresponds to the cutting edge position of the blade on the main shaft fixed on the moving module and intersects with the axis of the blade;
S2, concentrically placing a standard sample on a wafer carrying table of a dicing saw for fixing, wherein the standard sample is provided with a marking line corresponding to a theoretical cutting position of each cutting of the blade on the wafer;
S3, enabling the center of the table top of the wafer carrying table to move to the moving path of the optical axis or the vicinity of the moving path;
S4, the moving module drives the first image acquisition assembly to move to the identification line position corresponding to the theoretical cutting position of the first cutting on the standard sample for observation so as to determine the reference line coordinate;
S5, after the datum line coordinates are determined, the moving module drives the detection device to reversely move a first preset distance along the Y-axis direction so that the second image acquisition assembly moves to the position of the identification line corresponding to the theoretical cutting position of the first cutting to acquire an image; determining the deviation condition of the Y-axis coordinate of any point on the optical axis and the Y-axis coordinate of the datum line coordinate in the image acquisition according to the acquired image; the first preset distance is a Y-direction distance between the lens optical axis of the first image acquisition component and the optical axis of the second image acquisition component;
S6, the mobile module drives the second image acquisition assembly to step forward for n steps according to the stepping distance set by the cutting machine, acquires images and executes S7;
S7, determining the deviation condition of the Y-axis coordinate of any point on the optical axis during image acquisition according to the acquired image;
S8, determining whether all detection is completed, and if so, stopping detection; if not, executing S9;
S9, the moving module drives the first image acquisition assembly to move forwards so as to observe the identification line corresponding to the theoretical cutting position of the xn+x times of cutting and redetermine the coordinate of the reference line; the x is the execution times of the S7;
s10, the moving module drives the detecting device to reversely move by a second preset distance, and then S6 is executed, wherein the second preset distance is the difference value between the first preset distance and the stepping distance.
2. The deviation detecting method according to claim 1, characterized in that: the detection device comprises a counterweight seat, wherein a mounting block is arranged on the counterweight seat, and a second image acquisition assembly positioned at the end part of the counterweight seat is arranged on the mounting block.
3. The deviation detecting method according to claim 2, characterized in that: the mounting block comprises a base block and a connecting block with adjustable height arranged on the base block.
4. A deviation detecting method according to claim 3, wherein: the base block is provided with a group of strip-shaped holes extending along the Y-axis direction, and the base block is arranged on the counterweight seat in a position-adjustable manner along the Y-axis direction.
5. A deviation detecting method according to claim 3, wherein: and the height of the connecting block is adjusted so that the focus of the second image acquisition assembly is positioned on the surface of the standard sample on the wafer bearing table during detection.
6. The deviation detecting method according to claim 1, wherein the S4 includes:
s41, driving the first image acquisition assembly to move to a mark line corresponding to a theoretical cutting position of the first cutting on the standard sample by the moving module;
s42, the first image acquisition component acquires images and determines whether the identification lines on the acquired images coincide with the identification lines on the standard images;
s43, if so, taking the coordinate of any point on the lens optical axis of the first image acquisition assembly as the datum line coordinate when the image is acquired;
And S44, if not, determining the deviation direction and the deviation distance of the identification line on the acquired image relative to the identification line on the standard image, and executing S42 after the first image acquisition assembly moves the deviation distance towards the direction opposite to the deviation direction.
7. The deviation detecting method according to claim 1, characterized in that: in S7, the deviation of the Y-axis coordinate of any point on the optical axis during the image acquisition is determined by comparing the identification line on the acquired image with the identification line on the standard image or by determining the positional relationship between the identification line on the acquired image and the center of the image.
8. The deviation detecting method according to claim 1, characterized in that: in the step S6, n is an integer between 1 and 20.
9. The deviation detecting method according to any one of claims 1 to 8, characterized in that: determining whether the deviation distance determined in the S7 is the same as a preset difference value or not when determining that the Y-axis coordinate of any point on the optical axis has deviation during the image acquisition in the S7 and determining that the reference line coordinate is obtained again in the S9, and if so, determining the deviation between the deviation distance and the preset difference value; the predetermined difference is a difference between the moving distance of the first image capturing component and the first predetermined distance when the reference line coordinate is redetermined in S9.
10. The scribing machine comprises a moving module, a main shaft driven to move along the vertical direction and the Y-axis direction by the moving module and a first image acquisition assembly which is positioned on the side part of the main shaft and synchronously moves with the main shaft, and is characterized in that: the detection device comprises a counterweight seat, wherein a mounting block is arranged on the counterweight seat, a second image acquisition assembly positioned at the end part of the counterweight seat is arranged on the mounting block, and the weight and the gravity center of the detection device are consistent with those of the main shaft and the whole structure formed by the main shaft and the main shaft.
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| CN118129650A (en) * | 2024-05-09 | 2024-06-04 | 沈阳和研科技股份有限公司 | Visual detection system and method for X-axis straightness of chip mounter movement assembly |
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