CN117747582A - Substrate bonding pad for preventing solder ball from shifting - Google Patents
Substrate bonding pad for preventing solder ball from shifting Download PDFInfo
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- CN117747582A CN117747582A CN202311484449.5A CN202311484449A CN117747582A CN 117747582 A CN117747582 A CN 117747582A CN 202311484449 A CN202311484449 A CN 202311484449A CN 117747582 A CN117747582 A CN 117747582A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 199
- 239000000758 substrate Substances 0.000 title claims abstract description 52
- 230000005484 gravity Effects 0.000 claims abstract description 15
- 230000009471 action Effects 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 230000005012 migration Effects 0.000 claims description 4
- 238000013508 migration Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000012797 qualification Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000002513 implantation Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 3
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a substrate bonding pad for preventing solder ball from being deviated, and relates to the technical field of semiconductor packaging. The invention sets an arc concave surface facing to the side of the PCB on the bonding pad; when the solder balls displace in the grooves, the solder balls roll back to the lowest position of the arc-shaped concave surfaces along the arc-shaped concave surfaces of the bonding pads based on the action of gravity; thereby achieving the effect of effectively preventing the solder ball from shifting, being beneficial to ensuring the normal operation of ball-planting operation of the BGA substrate and achieving the technical effect of improving the qualification rate of finished products.
Description
Technical Field
The present invention relates to the field of semiconductor packaging technology, and more particularly, to a substrate pad for preventing solder ball offset.
Background
With the increasing demands of the electronics industry for miniaturization and portability of products, packaging technology is directly related to the functionality and portability of products. Ball grid array packaging technology (i.e., ball grid array, BGA) has become the best choice for high density, high performance, multi-functional and high I/O pin packaging of VLSI chips such as CPU, north-south bridge, etc.
Specifically, the ball placement is to place the solder balls on the bonding pads of the substrate through a ball placement machine, and then complete welding through a reflow oven; however, in practical application, the existing BGA ball mounting process has the following problems: before soldering by a reflow oven, if the solder balls are deviated from the substrate bonding pads, defects such as solder ball missing, solder ball position deviation, solder ball diameter deviation or solder ball bridging can be caused.
Accordingly, there is a need for a substrate pad that can prevent solder ball migration.
Disclosure of Invention
In view of the foregoing, it is an object of the present invention to provide a substrate pad for preventing solder ball offset, which solves at least one of the problems of the prior art.
According to one aspect of the present invention, there is provided a substrate pad for preventing a solder ball from being displaced, for placing a solder ball to be soldered, comprising,
the bonding pad is positioned on the PCB;
a solder mask layer which is arranged on the PCB board around the bonding pad and forms a groove for accommodating the solder ball to be soldered;
the bonding pad is provided with an arc-shaped concave surface facing the side where the PCB is located.
Further, it is preferable that the distance between the highest point and the lowest point of the arc-shaped concave surface is less than or equal to 15 μm.
Further, in the preferred structure, a chamfer is provided on one side of the solder mask layer, which is close to the end face of the bonding pad and is far away from the PCB board.
Further, it is preferable that the chamfer angle is 30 to 60 °.
Further, it is preferable that the highest point of the vertical portion of the contact surface of the solder resist layer and the pad is connected to the highest point of the upper surface of the pad.
Further, the preferred structure is that the solder ball is made of one of tin, gold, copper or an alloy of tin and copper.
According to another aspect of the present invention, there is provided a solder ball shift prevention method based on a substrate pad, the substrate pad being the above-mentioned solder ball shift prevention substrate pad, the method comprising,
placing a solder ball to be soldered in a groove formed by a solder mask layer and a bonding pad and used for accommodating the solder ball to be soldered; wherein, the bonding pad is positioned on the PCB; the solder mask layer is arranged on the PCB;
when the solder balls displace in the grooves, the solder balls roll back to the lowest position of the arc-shaped concave surfaces along the arc-shaped concave surfaces of the bonding pads based on the action of gravity; wherein, the arc concave surface is towards the side that the PCB board is located.
Further, preferably, when the solder ball is displaced in the groove, the solder ball is abutted against a chamfer of the solder resist layer; based on the supporting force and the gravity of the solder mask layer, the solder balls roll back to the lowest position of the arc concave surface along the arc concave surface of the welding disc, which faces the side of the PCB; the chamfer is arranged on one side, far away from the PCB, of the end face, close to the bonding pad, of the solder mask layer.
Further, it is preferable that the distance between the highest point and the lowest point of the arc-shaped concave surface is 15 μm or less.
Further, it is preferable that the chamfering angle is 30 to 60 °.
In order to solve the problems of the prior art that before soldering by a reflow oven, solder balls are lost due to the fact that the solder balls are deviated from a substrate bonding pad, the positions of the solder balls are deviated, the diameters of the solder balls are larger, the diameters of the solder balls are smaller, or the solder balls are bridged; the invention relates to a substrate bonding pad for preventing solder ball from shifting and a method for preventing solder ball from shifting by arranging an arc concave surface facing to the side of a PCB on the bonding pad; when the solder balls displace in the grooves, the solder balls roll back to the lowest position of the arc-shaped concave surfaces along the arc-shaped concave surfaces of the bonding pads based on the action of gravity; thereby achieving the effect of effectively preventing the solder ball from shifting, being beneficial to ensuring the normal operation of ball-planting operation of the BGA substrate and achieving the technical effect of improving the qualification rate of finished products.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Furthermore, the invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and readily appreciated by reference to the following description and claims in conjunction with the accompanying drawings and a more complete understanding of the invention. In the drawings:
fig. 1 shows a schematic structure of a substrate pad in the prior art; and
fig. 2 shows a schematic structural view of a substrate pad preventing solder ball offset according to an embodiment of the present invention.
FIG. 3 illustrates yet another structural schematic of a substrate pad that prevents solder ball migration in accordance with an embodiment of the present invention;
fig. 4 shows a flow chart of a method for preventing solder ball offset based on a substrate pad according to the present invention.
The same reference numerals will be used throughout the drawings to refer to similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Example 1
At present, the distance between the solder balls on the BGA substrate is smaller and smaller, so that the difficulty of a ball implantation process is greatly increased, and the consistency of the heights of the solder balls after ball implantation cannot be effectively ensured by the current ball implantation process. If the consistency of the solder balls is good, the ball implanting efficiency is high after the solder balls are fused with the BGA substrate in batches through the chip mounter. Fig. 1 shows a schematic structure of a substrate pad in the prior art; as shown in fig. 1, in the prior art, a substrate pad for placing a solder ball 1 to be soldered includes a pad 3 on a PCB board 2; and a solder resist layer 4, the solder resist layer 4 being disposed on the PCB board 2 around the pad 3 and forming a recess for accommodating the solder ball 1 to be soldered; when the solder ball offset of the traditional solder pad design is 1/2 of the solder ball diameter (namely radius r), the solder ball is theoretically supported by a solder mask supporting force facing directly above and the gravity of the solder ball facing directly below at an interface, and the solder ball is balanced in vertical stress, but in practice, the risk of moving the solder ball out of the solder pad (pad) is high in consideration of actual substrate movement; the solder balls are easy to deviate from the substrate bonding pads, so that defects such as solder ball missing, solder ball position deviation, solder ball diameter deviation or solder ball bridging and the like can be caused, the normal operation of ball mounting operation of the BGA substrate is finally affected, and the yield of finished products is lowered.
A Solder Mask (Solder Mask), also known as a green layer, is a non-wiring layer of a PCB, used to make a screen stencil, where soldering is not required, is coated with a layer of Solder resist material to prevent Solder flow at high temperatures during soldering of the PCB. The size of the reserved bonding pad on the solder mask is larger than that of the actual bonding pad, the difference is generally 10-20 mil, when the PCB is manufactured, the solder mask is used for manufacturing a trickle board, and then the trickle board is used for printing solder resist (green, yellow, red and the like) on the PCB, so that the solder resist is printed on the PCB except the bonding pad and the via hole.
In order to ensure ball placement efficiency, the invention provides a substrate bonding pad for preventing solder balls from being shifted, which is used for placing the solder balls to be soldered, and comprises a bonding pad, wherein the bonding pad is positioned on a PCB; and a solder mask surrounding the solder pads on the PCB and forming a recess for receiving a solder ball to be soldered; the bonding pad is provided with an arc-shaped concave surface facing the side where the PCB is located. In this embodiment, the solder balls are copper balls.
In a specific implementation process, in order to further improve the effect of preventing the solder ball from being shifted, the arc-shaped concave surface is of a symmetrical structure, and the lowest point of the arc-shaped concave surface is located on the center line of the bonding pad. That is, when the solder ball is displaced in the recess, the solder ball rolls back along the arcuate concave surface of the solder pad to the lowest position of the arcuate concave surface based on the action of gravity; wherein, the arc concave surface is towards the side that the PCB board is located. After optimization, the probability of shifting the solder balls out of the pad is reduced, and the reject ratio in the ball implantation is reduced.
As an improvement of the embodiment, the thickness of the bonding pad design in the traditional industry is 10-25 um, so the maximum height difference between the highest position and the lowest position in the structure with the arc-shaped concave surface is less than or equal to 15um; specifically, in order to ensure the effect of preventing the solder ball from shifting, the height difference between the highest position and the lowest position in the arc-shaped concave surface structure is 5-15 um; the greater the difference between the highest and lowest positions in the structure of the arc-shaped concave surface, the greater the included angle between the moment of the supporting force given to the solder ball by the concave surface and the moment of the gravity of the solder ball, and the greater the rolling force of the solder ball. For example, in the present embodiment, the design thickness of the bonding pad is 25um, and the height difference between the highest and lowest positions in the structure of the arc-shaped concave surface is 15um. Furthermore, for example, the design thickness of the bonding pad is 10um, and the height difference between the highest position and the lowest position in the arc-shaped concave surface structure is only 2um. The specific height difference is set according to the design thickness of the bonding pad in the practical application scene, and is not specifically limited herein.
Example 2
Fig. 2 and 3 generally describe the structure of a solder ball-shift preventing substrate pad according to an embodiment of the present invention; fig. 2 is a schematic diagram showing a structure of a substrate pad for preventing solder ball offset according to an embodiment of the present invention. Fig. 3 shows still another structural schematic of a substrate pad preventing solder ball offset according to an embodiment of the present invention.
As shown in fig. 2, the present invention provides a substrate pad for preventing solder ball offset, for placing a solder ball 1 to be soldered, comprising a pad 3 on a PCB board 2; and a solder resist layer 4, the solder resist layer 4 being disposed on the PCB board 2 around the pad 3 and forming a recess for accommodating the solder ball 1 to be soldered; the bonding pad 3 is provided with an arc concave surface facing the side of the PCB 2; a chamfer is provided on the side of the solder mask layer 4, which is close to the end face of the solder pad 3, away from the PCB board 2. In this embodiment, the solder balls are solder balls.
When the solder ball 1 generates displacement in the groove, the solder ball 1 is abutted with the chamfer of the solder mask layer 4; based on the supporting force of the solder mask layer 4 and the gravity of the solder balls, the solder balls 1 roll back to the lowest position of the arc concave along the arc concave of the side of the solder pad 3 facing the PCB 2.
Specifically, the right-angle structure of the boundary between the bonding pad and the solder mask layer (green oil) is optimized into a chamfer structure; when the solder ball 1 is on the green side of the chamfer, the stress is unbalanced and tends to move toward the center of the pad 3. As shown in fig. 3, when the solder ball 1 is located at a solder ball offset of 1/2 of the solder ball diameter (i.e. radius r), the risk of the solder ball 1 moving out of the solder pad 3 is low because of the included angle between the moment of the supporting force given to the solder ball by the concave surface and the moment of the gravity of the solder ball itself, and the resultant force applied to the solder ball 1 is directed toward the center of the solder pad. In order to ensure the effect of preventing the solder ball from being deviated, the chamfer angle is set to be 30-60 degrees; when the solder ball is positioned in the welding pad and the side of the solder mask, the larger the included angle between the moment of the supporting force given to the solder ball by the chamfer of the solder mask and the moment of the gravity of the solder ball is, the larger the rolling force of the solder ball is pushed. However, in a specific implementation process, the range of action of the structure is reduced if the angle is too large, and the solder balls cannot roll to the bonding pads along the oblique sides if the angle is too small. For example, in the present embodiment, the setting angle of the chamfer is 45 °. The specific chamfer angle is set according to the design thickness of the bonding pad, the thickness of the solder mask and the thickness difference between the solder mask and the bonding pad in the practical application scene, and is not particularly limited herein.
As a modification of this embodiment, the highest point of the vertical portion of the contact surface of the solder resist layer with the pad is connected with the highest point of the upper surface of the pad. That is, the edges of the chamfer engage the arcuate concave structure, thereby making it easier for the solder balls to roll along the chamfer toward the bonding pad.
Example 3
The substrate bonding pad is used for placing a solder ball 1 to be soldered and comprises a bonding pad 3, wherein the bonding pad is positioned on a PCB 2; and a solder resist layer 4, the solder resist layer 4 being disposed on the PCB board 2 around the pad 3 and forming a recess for accommodating the solder ball 1 to be soldered. A chamfer is provided on the side of the solder mask layer 4, which is close to the end face of the solder pad 3, away from the PCB board 2.
When the solder ball 1 generates displacement in the groove, the solder ball 1 is abutted with the chamfer of the solder mask layer 4; based on the supporting force of the solder resist layer 4 and the weight of the solder ball itself, the solder ball 1 rolls back into the recess. In the present embodiment, the rollback of the solder ball 1 into the recess is achieved by merely providing the chamfer without bonding the arc-shaped concave surface of the solder pad, and by merely relying on the angular difference of the moment based on the supporting force of the solder resist layer 4 and the gravity of the solder ball itself.
Example 4
FIG. 4 illustrates a flow chart of the present invention providing a method for preventing solder ball offset based on substrate pads in accordance with the present invention; as shown in fig. 4: the method of preventing solder ball offset based on the substrate pad includes steps S110 and S120.
S110, placing a solder ball to be welded in a groove formed by a solder mask layer and a bonding pad and used for accommodating the solder ball to be welded; wherein, the bonding pad is positioned on the PCB; the solder resist layer is disposed on the PCB board 2 around the pads.
S120, when the solder balls generate displacement in the grooves, the solder balls roll back to the lowest position of the arc-shaped concave surfaces along the arc-shaped concave surfaces of the bonding pads based on the action of gravity; wherein, the arc concave surface is towards the side that the PCB board is located. As an improvement of the embodiment, when the solder ball is displaced in the groove, the solder ball is abutted against the chamfer of the solder resist layer; based on the supporting force and the gravity of the solder mask layer, the solder balls roll back to the lowest position of the arc concave surface along the arc concave surface of the welding disc, which faces the side of the PCB; the chamfer is arranged on one side, far away from the PCB, of the end face, close to the bonding pad, of the solder mask layer. The distance between the highest point and the lowest point of the arc-shaped concave surface is less than or equal to 15 mu m. The chamfer angle is 30-60 degrees. The above method steps are achieved by the solder ball-shift preventing substrate pads described in embodiments 1-3. Technical details of the specific implementation are described with reference to embodiments 1 to 3, and are not repeated here.
The substrate pad for preventing solder ball offset, the method for preventing solder ball offset based on the substrate pad according to the present invention are described above by way of example with reference to fig. 1 to 4. However, it will be appreciated by those skilled in the art that various modifications may be made to the substrate pad for preventing solder ball offset and the method for preventing solder ball offset based on the substrate pad as set forth in the above-described invention without departing from the scope of the invention. Accordingly, the scope of the invention should be determined from the following claims.
Claims (10)
1. A substrate pad for preventing solder ball offset for placing solder balls to be soldered, comprising,
the bonding pad is positioned on the PCB;
a solder mask layer which is arranged on the PCB board around the bonding pad and forms a groove for accommodating the solder ball to be soldered;
the bonding pad is provided with an arc-shaped concave surface facing the side where the PCB is located.
2. The solder ball deflection preventing substrate pad according to claim 1, wherein a distance between a highest point and a lowest point of the arc-shaped concave surface is 15 μm or less.
3. The solder ball deflection preventing substrate pad according to claim 2, wherein a chamfer is provided on a side of the solder resist layer, which is away from the PCB, near the end face of the pad.
4. The solder ball deflection preventing substrate pad according to claim 3, wherein the chamfer angle is 30 to 60 °.
5. The solder ball deflection preventing substrate pad according to claim 3, wherein a highest point of a vertical portion of a contact surface of the solder resist layer with the pad is in contact with a highest point of an upper surface of the pad.
6. The solder ball deflection preventing substrate pad of claim 1, wherein the solder ball is one of tin, gold, copper, or an alloy of tin and copper.
7. A method for preventing solder ball offset based on a substrate pad, wherein the substrate pad is the solder ball offset preventing substrate pad according to any one of claims 1 to 6, the method comprising,
placing a solder ball to be soldered in a groove formed by a solder mask layer and a bonding pad and used for accommodating the solder ball to be soldered; wherein, the bonding pad is positioned on the PCB; the solder mask layer is arranged on the PCB around the bonding pad;
when the solder balls displace in the grooves, the solder balls roll back to the lowest position of the arc-shaped concave surfaces along the arc-shaped concave surfaces of the bonding pads based on the action of gravity; wherein, the arc concave surface is towards the side that the PCB board is located.
8. The method of preventing solder ball migration based on substrate pads of claim 6, wherein the solder balls abut a chamfer of the solder resist layer when the solder balls are displaced in the recess; based on the supporting force and the gravity of the solder mask layer, the solder balls roll back to the lowest position of the arc concave surface along the arc concave surface of the welding disc, which faces the side of the PCB; the chamfer is arranged on one side, far away from the PCB, of the end face, close to the bonding pad, of the solder mask layer.
9. The method for preventing solder ball migration based on substrate pads according to claim 8, wherein a distance between a highest point and a lowest point of the arc-shaped concave surface is 15 μm or less.
10. The method for preventing solder ball offset based on a substrate pad according to claim 8, wherein the chamfer angle is 30 to 60 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311484449.5A CN117747582A (en) | 2023-11-08 | 2023-11-08 | Substrate bonding pad for preventing solder ball from shifting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311484449.5A CN117747582A (en) | 2023-11-08 | 2023-11-08 | Substrate bonding pad for preventing solder ball from shifting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117747582A true CN117747582A (en) | 2024-03-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311484449.5A Pending CN117747582A (en) | 2023-11-08 | 2023-11-08 | Substrate bonding pad for preventing solder ball from shifting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117747582A (en) |
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2023
- 2023-11-08 CN CN202311484449.5A patent/CN117747582A/en active Pending
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