CN117712265A - LED lamp bead manufacturing method, LED lamp bead manufacturing equipment and storage medium - Google Patents
LED lamp bead manufacturing method, LED lamp bead manufacturing equipment and storage medium Download PDFInfo
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- CN117712265A CN117712265A CN202410165477.9A CN202410165477A CN117712265A CN 117712265 A CN117712265 A CN 117712265A CN 202410165477 A CN202410165477 A CN 202410165477A CN 117712265 A CN117712265 A CN 117712265A
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Abstract
The embodiment of the invention provides an LED lamp bead manufacturing method, LED lamp bead manufacturing equipment and a storage medium, and the LED lamp bead required by customers can be produced efficiently and high-quality by standardizing the production flow of the LED lamp beads through the LED lamp bead manufacturing method. The LED lamp is subjected to internal and external two-time anti-vulcanization treatment, so that the problem that the LED lamp is blackened due to corrosion of sulfur to a reflecting layer can be effectively prevented, the anti-vulcanization effect of the LED lamp can be effectively improved, and the light transmittance of the LED lamp is ensured; in addition, the efficient surface mounting method is set for the surface mounting module, so that each component unit in the whole surface mounting process can continuously run as much as possible, the problem of interference among each component unit in the surface mounting process is avoided, and then the moving path of the chip extraction station is required to be determined according to the arrangement image condition of a plurality of LED chips, so that the stopping time of the component units is shortest, the efficiency of the whole surface mounting process is effectively improved, and high-quality LED lamp beads can be manufactured efficiently.
Description
Technical Field
The application relates to the technical field of data processing, in particular to an LED lamp bead manufacturing method, an LED lamp bead manufacturing device and a storage medium.
Background
At present, the LED products are widely applied to the market, the demand of the LED products in the market is very large, the service life and the light transmittance requirements of customers on the related products of the LED lamps are also higher and higher, but the quality of many LED products in the current market is uneven, and the requirements of customers on the large demand and high quality of the LED lamp products cannot be met.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides an LED lamp bead manufacturing method, an LED lamp bead manufacturing device and a storage medium, and high-quality LED lamp beads can be manufactured efficiently.
In a first aspect, an embodiment of the present application provides a method for manufacturing an LED lamp bead, which is applied to an LED lamp bead manufacturing apparatus, where the LED lamp bead manufacturing apparatus includes an electroplating module, a patch module, an edge sealing module, a welding module, a first anti-vulcanization module, a glue dripping module, a second anti-vulcanization module, and a detection module, and the patch module includes a patch station, a chip extraction station for placing a plurality of regularly arranged LED chips, a moving chip arm for moving from a first position to a second position, a glue dripping unit, and a vision unit, and the method includes:
Obtaining a conductive copper substrate;
controlling the electroplating module to carry out electroplating treatment on the first surface of the conductive copper substrate to obtain the conductive copper substrate provided with the silver plating reflecting layer;
controlling the edge sealing module to perform injection molding on the silver plating reflection layer surface of the conductive copper substrate provided with the silver plating reflection layer to obtain a substrate provided with edge sealing units, wherein the edge sealing units are of a light-transmitting structure;
transmitting the substrate provided with the edge sealing unit to a surface mounting station of the surface mounting module, and controlling the surface mounting module to carry out surface mounting treatment on all the edge sealing units in the substrate provided with the edge sealing unit based on a surface mounting treatment method to obtain a surface-mounted substrate; the chip processing method for each edge sealing unit comprises the steps of controlling the vision unit to obtain an arrangement image of a plurality of LED chips on the chip extraction station, determining a moving path of the chip extraction station according to the arrangement image, controlling the chip extraction station to move so as to enable the LED chips needing to be pasted to move to the second position, controlling the pasting station to move according to a preset path so as to enable the edge sealing unit needing to be pasted to move to the first position, simultaneously controlling the glue dripping unit to move to the first position, dripping glue into the edge sealing unit on the first position, controlling the glue dripping unit to leave the first position, and placing the LED chips into the glued edge sealing unit after the moving chip arm reaches the first position;
Controlling the welding module to weld all the LED chips in the substrate after the chip bonding to obtain a substrate after the chip bonding;
controlling the first anti-vulcanization module to perform first anti-vulcanization treatment on the inside of the edge sealing unit of the substrate after the chip is welded to obtain a substrate after the first anti-vulcanization treatment;
controlling the glue dropping module to perform glue dropping treatment on the first anti-vulcanization treated substrate to obtain a glue-dropped substrate;
controlling the second anti-vulcanization module to perform second anti-vulcanization treatment on the outside of the edge sealing unit of the substrate after the glue dropping treatment to obtain a substrate after the second anti-vulcanization treatment;
and controlling the detection module to detect and cut the substrate subjected to the second anti-vulcanization treatment to obtain the target LED lamp bead.
In some optional embodiments, the arrangement image includes a first area and/or a second area, where the first area is an area where the LED chip is disposed, and the second area is an area where the LED chip is not disposed, and determining a moving path of the chip extraction station according to the arrangement image and controlling the chip extraction station to move so that the LED chip requiring the patch moves to the second position includes:
Performing recognition processing on the arrangement images to obtain recognition results;
determining a moving path of the chip extraction station according to row and column data in the first area, row and column data of the second area and position relation information between the second area and the first area when the identification result is that the arrangement image comprises the first area and the second area;
and controlling the chip extraction station to move according to the moving path so as to enable the LED chip to be pasted to move to the second position.
In some alternative embodiments, the electroplating module includes a pretreatment unit, a first electroplating processing unit, a second electroplating processing unit, and an over-silver protection unit, where the controlling the electroplating module performs electroplating processing on the first surface of the conductive copper substrate to obtain a conductive copper substrate provided with a silver-plated reflective layer, and includes:
controlling the pretreatment unit to pretreat impurities on the surface of the first surface of the conductive copper substrate to obtain a pretreated substrate;
controlling the first electroplating processing unit to perform first electroplating processing on the pretreated substrate to obtain a substrate provided with a transition layer;
Controlling the second electroplating processing unit to perform second electroplating processing on the substrate provided with the transition layer to obtain a substrate provided with a silver-plated reflecting layer;
and controlling the silver-plating protection unit to perform silver-plating protection treatment on the substrate provided with the silver-plating reflection layer to obtain the conductive copper substrate provided with the silver-plating reflection layer.
In some alternative embodiments, the edge sealing module comprises an injection molding unit and an injection mold, the injection mold is provided with a substrate placement area, a plurality of edge sealing mold cavities corresponding to edge sealing structures and an injection port, the injection port is communicated with the plurality of edge sealing mold cavities, the injection molding unit comprises an injection nozzle and a hot runner plate connected with the injection nozzle, the injection nozzle comprises a nozzle opening and an injection valve needle arranged in the injection nozzle, the injection valve needle comprises a needle body for penetrating the nozzle opening of the injection nozzle and a needle part for sealing the nozzle opening, the needle body comprises a needle body connected with the needle part, and the orthographic projection area of the needle body to the needle part is smaller than the area of the nozzle opening;
the control of the edge sealing module is to subject a plurality of edge sealing units to injection molding on the silver plating reflection layer surface of the conductive copper substrate provided with the silver plating reflection layer to obtain a substrate provided with the edge sealing units, and the control comprises the following steps:
Placing the conductive copper substrate provided with the silver-plated reflecting layer in a substrate placing area of the injection mold;
controlling the injection nozzle to move to the injection port of the injection mold;
controlling the injection valve needle to be inserted into the edge sealing die cavity through the injection port so that the needle body is positioned at the nozzle port;
controlling the injection nozzle to flow injection solution out between the needle body and the nozzle opening and injecting the injection solution into the edge sealing die cavity of the injection die through the injection opening;
and when the injection molding solution is filled in the injection molding cavity, controlling the injection molding valve needle to reset and leave the injection port, and obtaining the substrate provided with the edge sealing unit.
In some alternative embodiments, the welding module comprises an ultrasonic welding head, a welding platform, a welding isolation unit and a visual positioning unit, wherein the ultrasonic welding head comprises a needle head part, the needle head part is provided with a through hole for penetrating out a welding line, the welding isolation unit is provided with separation areas for separating each LED chip, and the number of the separation areas is the same as that of the LED chips;
the control of the soldering module to solder all the LED chips in the substrate after the chip bonding to obtain a substrate after the chip bonding comprises:
Placing the substrate after the surface mounting on the welding platform;
placing the welding isolation unit above the substrate after the surface mounting;
acquiring the position information of the LED chip and the position information of a bonding pad corresponding to the LED chip through the visual positioning unit;
and controlling the ultrasonic welding head to weld each LED chip by using the welding wire to obtain a substrate after welding the chips, wherein the position information of the LED chips and the position information of the bonding pads corresponding to the LED chips are obtained.
In some optional embodiments, the first anti-vulcanization module includes a first transmission unit, a first positioning unit, a first anti-vulcanization unit, a first placement unit, and a position adjustment unit, where the position adjustment unit includes a limit edge block and an adjustment edge block disposed on two sides of the transmission belt, and the controlling the first anti-vulcanization module performs a first anti-vulcanization process on an inside of the edge sealing unit of the substrate after the chip is welded to obtain a first anti-vulcanization processed substrate, and includes:
the substrate after the chip is welded is moved to a workbench of the first anti-vulcanization unit through the first transmission unit;
Controlling the first positioning unit to perform positioning treatment on positioning points on the substrate after the chip is welded to obtain a positioning result;
when the positioning result is not in accordance with the requirement, controlling the transmission belt and/or the adjusting edge block according to the position information data in the positioning result so as to adjust the position of the substrate after the chip is welded until the positioning result is in accordance with the requirement;
under the condition that the positioning result meets the requirement, controlling the first anti-vulcanization unit to move according to preset positioning points and path information, and dripping acrylic ester monomers with first volume into the LED lamp beads after the first anti-vulcanization unit reaches the positioning points so as to perform first anti-vulcanization treatment on the inside of each LED lamp bead;
and under the condition that the acrylic monomer with the first volume is dripped into the LED lamp beads on the substrate after the chips are welded, controlling the conveying belt on the first vulcanization preventing unit to convey the substrate after the first vulcanization preventing treatment to the first placing unit.
In some optional embodiments, the detection module includes an image acquisition analysis unit, a moving unit, a cutting unit, a recovery unit, and a separation unit, where the separation unit is provided with a separation mechanism corresponding to positions of all the LED lamp beads on the substrate, and the control of the detection module to perform detection cutting processing on the second anti-vulcanization processed substrate to obtain a target LED lamp bead includes:
The moving unit of the detection module is controlled to move the substrate subjected to the second vulcanization prevention treatment to the image acquisition and analysis unit for shooting to obtain an image to be analyzed, and the image to be analyzed is detected to obtain a detection result;
the moving unit is controlled to move the detected substrate to the cutting unit, the cutting unit is controlled to cut the LED lamp beads which do not meet the preset detection conditions in the substrate according to the detection result to obtain a cut substrate, and the cut LED lamp beads are collected through the recovery unit;
and controlling the moving unit to move the substrate after the cutting treatment after the detection treatment to the separating unit, and controlling a separating mechanism of the separating unit to press down the substrate after the cutting treatment so as to separate the LED lamp beads from the substrate, thereby obtaining the target LED lamp beads.
In some optional embodiments, the second anti-vulcanization module includes a shielding film attaching unit, a product swinging plate, a drying oven, a second anti-vulcanization unit, and a shielding film removing unit, where the product swinging plate is in a cylindrical structure, a plurality of swinging grooves are provided on the product swinging plate, and the second anti-vulcanization module is controlled to perform a second anti-vulcanization process on the outer part of the edge sealing unit of the substrate after the glue dropping process, so as to obtain a substrate after the second anti-vulcanization process, and the method includes:
The masking film pasting unit is used for carrying out film pasting masking treatment on the substrate after the glue dripping treatment so as to protect the surface circuit of the substrate and obtain the substrate after masking treatment;
vertically placing the substrate subjected to the shielding treatment on a swinging groove of a product swinging plate;
a detection substrate for detecting the second anti-vulcanization treatment effect is provided with a plane LED lamp bead;
placing the product placing tray in a drying oven for drying treatment to obtain a substrate after the drying treatment;
and placing the substrate after the drying treatment in the second anti-vulcanization unit, and carrying out nano coating treatment on the substrate after the drying treatment through the vaporized acrylic ester monomer so as to carry out second anti-vulcanization treatment on the outside of the LED lamp beads, thereby obtaining the substrate after the second anti-vulcanization treatment.
In some optional embodiments, the shielding film removing unit includes a moving unit, a bottom plate provided with a groove corresponding to the position of the LED lamp bead on the second anti-vulcanization processed substrate, a detecting unit for detecting flatness of the second anti-vulcanization processed substrate, a pressing unit for pressing the second anti-vulcanization processed substrate, and a film removing unit for tearing the shielding film, where the shielding film removing process is performed on the second anti-vulcanization processed substrate to obtain a target substrate, and the method includes:
Controlling the moving unit for removing the shielding film unit to perform overturning treatment on the second anti-vulcanization treated substrate, and placing the overturning treated substrate on the bottom plate;
controlling the detection unit to detect the flatness of the substrate placed on the bottom plate in real time;
controlling the compressing unit to compress the first position of the substrate;
controlling the film removing unit to move to a first edge position of the substrate close to the first position, clamping the shielding film at the first edge position and controlling the film removing unit to move upwards so as to enable the shielding film at the first edge position to be separated from the substrate;
and controlling the stripping unit and the compaction unit to move to a second position at the same time so as to separate the shielding film from the substrate, thereby obtaining the target substrate.
In a second aspect, embodiments of the present application provide an anti-curing apparatus comprising at least one control processor and a memory for communicatively coupling with the at least one control processor; the memory stores instructions executable by the at least one control processor to enable the at least one control processor to perform the method of manufacturing LED light beads as described in the first aspect above.
In a third aspect, embodiments of the present application provide a computer-readable storage medium storing computer-executable instructions for performing the method for manufacturing LED light beads according to the first aspect.
According to the LED lamp bead manufacturing method, at least the following beneficial effects are achieved: the LED lamp bead manufacturing method is applied to LED lamp bead manufacturing equipment, the LED lamp bead manufacturing equipment comprises an electroplating module, a patch module, an edge sealing module, a welding module, a first anti-vulcanization module, a glue dripping module, a second anti-vulcanization module and a detection module, wherein the patch module comprises a patch station, a chip extraction station for placing a plurality of LED chips which are regularly arranged, a movable chip arm for moving from a first position to a second position, a glue dripping unit and a visual unit, and the method specifically comprises the following steps: firstly, a conductive copper substrate is obtained, then a silver reflecting layer is plated on the conductive copper substrate, then an edge sealing unit is arranged on the silver reflecting layer at a position corresponding to the position where the LED lamp beads need to be arranged, then an LED chip is pasted into the edge sealing unit through an efficient pasting method, then the LED chip and a bonding pad are subjected to welding treatment, then the inner part and the outer part of the edge sealing unit are respectively subjected to first anti-vulcanization treatment and second anti-vulcanization treatment, a substrate after the second anti-vulcanization treatment is obtained, finally the LED lamp beads on the substrate after the treatment are detected, and accordingly target LED lamp beads meeting the requirements are brushed and selected.
Through the production flow of standardized LED lamp pearl to LED lamp pearl manufacture equipment, can produce the LED lamp pearl of customer's demand with high efficiency high quality. The LED lamp is subjected to internal and external two-time vulcanization prevention treatment, so that the problem that the LED lamp is blackened due to corrosion of sulfur generated in the LED production process to a reflecting layer can be effectively prevented, the vulcanization prevention effect of the LED lamp can be effectively improved, and the light transmittance of the LED lamp is ensured; in addition, the efficient surface mounting method is set for the surface mounting module, in order to efficiently and accurately complete surface mounting processing of the LED chips, each component unit in the whole surface mounting process needs to be enabled to run continuously as much as possible for each surface mounting action, the problem of interference among each component unit in the surface mounting process is not caused, and then the moving path of the chip extraction station needs to be determined according to the arrangement image condition of a plurality of LED chips, so that the stopping time of the component units is shortest, and the efficiency of the whole surface mounting process is effectively improved. By the method for manufacturing the LED lamp beads, the high-quality LED lamp beads can be manufactured efficiently, so that the requirements of clients in the market are met.
Drawings
FIG. 1 is a schematic diagram of a system platform architecture of a method for manufacturing LED beads according to one embodiment of the present application;
FIG. 2 is a schematic diagram of an LED bead manufacturing apparatus according to one embodiment of the present application;
FIG. 3 is a schematic diagram of an electroplating module of an LED bead manufacturing apparatus according to one embodiment of the present application;
FIG. 4 is a schematic illustration of a banding module of an LED bead manufacturing apparatus according to one embodiment of the present application;
FIG. 5 is a schematic view of a needle body of a method of manufacturing LED light beads according to one embodiment of the present application;
FIG. 6 is a schematic diagram of a welding module of an LED bead manufacturing apparatus according to one embodiment of the present application;
FIG. 7 is a schematic view of a first anti-sulfidation module of an LED bead manufacturing apparatus according to one embodiment of the present application;
FIG. 8 is a schematic diagram of a detection module of an LED bead manufacturing apparatus according to one embodiment of the present application;
FIG. 9 is a schematic diagram of a second anti-sulfidation module of an LED bead manufacturing apparatus according to another embodiment of the present application;
FIG. 10 is a flow chart of a method of manufacturing LED beads according to one embodiment of the present application;
FIG. 11 is a schematic view of a resulting conductive copper substrate in a method of manufacturing LED beads according to one embodiment of the present application;
FIG. 12 is a schematic view of a resulting conductive copper substrate provided with a silver-plated reflective layer in a method of manufacturing LED lamp beads according to one embodiment of the present application;
FIG. 13 is a schematic view of a resulting substrate provided with a banding unit in a method of manufacturing LED beads according to one embodiment of the present application;
FIG. 14 is a schematic view of a substrate after bonding obtained in a method of manufacturing LED beads according to one embodiment of the present application;
fig. 15 is a schematic view of a moving path in the LED bead manufacturing method according to an embodiment of the present application being set as a path in the column direction;
fig. 16 is a schematic view of a moving path in the LED bead manufacturing method according to an embodiment of the present application being set as a path in the row direction;
fig. 17 is a schematic view of a moving path in the LED bead manufacturing method according to another embodiment of the present application being set as a path in the column direction;
fig. 18 is a schematic view of a moving path in the LED bead manufacturing method according to another embodiment of the present application being set to a path in the row direction;
FIG. 19 is a schematic view of a substrate after bonding obtained in a method of manufacturing LED beads according to one embodiment of the present application;
FIG. 20 is a schematic view of a first anti-sulfidation processed substrate obtained in a method of manufacturing LED lamp beads according to one embodiment of the present application;
FIG. 21 is a schematic view of a substrate after the LED chips are encapsulated, as obtained in the method of manufacturing LED beads according to one embodiment of the present application;
FIG. 22 is a schematic view of a second anti-sulfidation processed substrate obtained in a method of manufacturing LED lamp beads according to one embodiment of the present application;
Fig. 23 is a schematic view of a target LED lamp bead obtained in the LED lamp bead manufacturing method according to an embodiment of the present application.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It should be noted that although functional block division is performed in a device diagram and a logic sequence is shown in a flowchart, in some cases, the steps shown or described may be performed in a different order than the block division in the device, or in the flowchart. The terms first, second and the like in the description, in the claims and in the above-described figures, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.
At present, the LED products are widely applied to the market, the demand of the LED products in the market is very large, the service life and the light transmittance requirements of customers on the related products of the LED lamps are also higher and higher, but the quality of many LED products in the current market is uneven, and the requirements of customers on the large demand and high quality of the LED lamp products cannot be met.
In order to solve the above-mentioned problems, an embodiment of the present invention provides an LED lamp bead manufacturing method, an LED lamp bead manufacturing apparatus, and a storage medium, where the LED lamp bead manufacturing method is applied to the LED lamp bead manufacturing apparatus, the LED lamp bead manufacturing apparatus includes an electroplating module, a patch module, a sealing module, a welding module, a first anti-vulcanization module, a glue dripping module, a second anti-vulcanization module, and a detection module, the patch module includes a patch station, a chip extraction station for placing a plurality of regularly arranged LED chips, a moving chip arm for moving from a first position to a second position, a glue dripping unit, and a vision unit, and the method specifically includes: firstly, a conductive copper substrate is obtained, then a silver reflecting layer is plated on the conductive copper substrate, then an edge sealing unit is arranged on the silver reflecting layer at a position corresponding to the position where the LED lamp beads need to be arranged, then an LED chip is pasted into the edge sealing unit through an efficient pasting method, then the LED chip and a bonding pad are subjected to welding treatment, then the inner part and the outer part of the edge sealing unit are respectively subjected to first anti-vulcanization treatment and second anti-vulcanization treatment, a substrate after the second anti-vulcanization treatment is obtained, finally the LED lamp beads on the substrate after the treatment are detected, and accordingly target LED lamp beads meeting the requirements are brushed and selected.
Through the production flow of standardized LED lamp pearl to LED lamp pearl manufacture equipment, can produce the LED lamp pearl of customer's demand with high efficiency high quality. The LED lamp is subjected to internal and external two-time vulcanization prevention treatment, so that the problem that the LED lamp is blackened due to corrosion of sulfur generated in the LED production process to a reflecting layer can be effectively prevented, the vulcanization prevention effect of the LED lamp can be effectively improved, and the light transmittance of the LED lamp is ensured; in addition, the efficient surface mounting method is set for the surface mounting module, in order to efficiently and accurately complete surface mounting processing of the LED chips, each component unit in the whole surface mounting process needs to be enabled to run continuously as much as possible for each surface mounting action, the problem of interference among each component unit in the surface mounting process is not caused, and then the moving path of the chip extraction station needs to be determined according to the arrangement image condition of a plurality of LED chips, so that the stopping time of the component units is shortest, and the efficiency of the whole surface mounting process is effectively improved. By the method for manufacturing the LED lamp beads, the high-quality LED lamp beads can be manufactured efficiently, so that the requirements of clients in the market are met.
Embodiments of the present invention will be further described below with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic diagram of a system platform architecture for performing a method for manufacturing LED lamp beads according to an embodiment of the present invention.
In the example of fig. 1, the system platform architecture 1000 is provided with a processor 1100 and a memory 1200, wherein the processor 1100 and the memory 1200 may be connected by a bus or otherwise, in fig. 1 by way of example.
Memory 1200 acts as a non-transitory computer readable storage medium that can be used to store non-transitory software programs as well as non-transitory computer executable programs. In addition, memory 1200 may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, memory 1200 optionally includes memory remotely located relative to processor 1100, which may be connected to the adrenal functional tumor typing positioning apparatus via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
It will be appreciated by those skilled in the art that the system platform architecture 1000 may be applied to a 5G communication network system, a mobile communication network system that is evolved later, and the like, and the present embodiment is not limited thereto.
Those skilled in the art will appreciate that the system platform architecture 1000 shown in fig. 1 is not limiting of the embodiments of the invention, and may include more or fewer components than shown, or may combine certain components, or a different arrangement of components.
Referring to fig. 2, fig. 2 is a schematic diagram of an LED lamp bead manufacturing apparatus according to an embodiment of the present invention, which includes an electroplating module 110, a patch module 120, a sealing module 130, a welding module 140, a first anti-vulcanization module 150, a glue dripping module 160, a second anti-vulcanization module 170, and a detection module 180, wherein the patch module includes a patch station 121, a chip extraction station 122 for placing a plurality of regularly arranged LED chips, a moving chip arm 123 for moving from a first position to a second position, a glue dripping unit 124, and a vision unit 125.
In some alternative embodiments, referring to fig. 3, the plating module 110 includes a pretreatment unit 111, a first plating processing unit 112, a second plating processing unit 113, and an over-silver protection unit 114. The pretreatment unit 111 is used for blowing away fine impurities on the surface of the substrate, the first electroplating treatment unit 112 is used for electroplating a transition layer on one surface of the conductive copper substrate, the second electroplating treatment unit 113 is used for electroplating the silver-plated reflecting layer on the transition layer, and the silver-passing protection unit 114 is used for silver-passing protection treatment on the silver surface.
In some alternative embodiments, referring to fig. 4, the banding module includes an injection unit 131 and an injection mold 132, the injection mold 132 is provided with a substrate placement area 1321, a plurality of banding cavities 1322 corresponding to banding structures, and an injection port in communication with the plurality of banding cavities, the injection unit 131 includes an injection nozzle including a nozzle port 1311 and an injection needle 1312 disposed within the injection nozzle, and the injection needle 1312 includes a needle body 1313 for passing through the nozzle port of the injection nozzle and a needle portion 1314 for closing the nozzle port 1311, and referring to fig. 5, the needle body 1313 includes a needle body 1315 connected to the needle portion 1314, and an orthographic projection area of the needle body 1315 to the needle portion 1314 is smaller than an area of the nozzle port 1311.
In some alternative embodiments, referring to fig. 6, the soldering module 140 includes an ultrasonic soldering head 141, a soldering land 142, a soldering isolation unit 143, and a visual positioning unit 144, the ultrasonic soldering head 141 includes a needle portion 1411, the needle portion 1411 is provided with a through hole for penetrating a soldering line, the soldering isolation unit 143 is provided with a separation area 1431 for separating each LED chip, and the number of the separation areas 1431 is the same as the number of the LED chips.
In some alternative embodiments, referring to fig. 7, the first anti-vulcanization module 150 includes a first transmission unit 151, a first positioning unit 152, a first anti-vulcanization unit 153, a first placement unit 154, and a position adjustment unit 155, and the position adjustment unit 155 includes a limit edge block and an adjustment edge block disposed at both sides of the transmission belt.
It should be noted that the dispensing module 160 may be an apparatus having the same principle as the first anti-vulcanization module 150, and only a different dispensing liquid may be replaced.
In some alternative embodiments, referring to fig. 8, the detection module 180 includes an image acquisition analysis unit 181, a moving unit 182, a cutting unit 183, a recovery unit 184, and a separation unit 185, and the separation unit 185 is provided with a separation mechanism corresponding to all LED lamp bead positions on the substrate.
In some alternative embodiments, referring to fig. 9, the second anti-vulcanization module 170 includes a masking film sticking unit, a product swing plate 171, a drying oven 172, a second anti-vulcanization unit 173, and a plating film detection unit 174, the product swing plate 171 has a cylindrical structure, and a plurality of swing grooves are provided on the product swing plate 171.
It should be noted that, the product balance 171 is provided with a first balance groove and a second balance groove, the first balance groove is used for placing the substrate 200 after shielding treatment provided with the LED lamp beads, the surface of the LED lamp beads is curved, the second balance groove is used for placing the detection substrate, and the surface of the LED lamp beads arranged on the detection substrate is a plane.
It should be noted that, the second anti-vulcanizing module 170 further includes a shielding film removing unit, where the shielding film removing unit includes a moving unit, a bottom plate provided with a groove corresponding to the position of the LED lamp bead on the second anti-vulcanizing substrate, a detecting unit for detecting the flatness of the second anti-vulcanizing substrate, a pressing unit for pressing the second anti-vulcanizing substrate, and a film removing unit for tearing the shielding film.
The system platform architecture of fig. 1 is communicatively coupled to each module in the LED light bead manufacturing apparatus of fig. 2-9, through which operation of each module may be controlled.
Based on the system platform architecture and the LED lamp bead manufacturing apparatus, various embodiments of the LED lamp bead manufacturing method of the present invention are set forth below to solve the problems in the above embodiments.
Referring to fig. 10, fig. 10 is a flowchart of a method for manufacturing an LED lamp bead according to an embodiment of the present invention, where the method for manufacturing an LED lamp bead according to an embodiment of the present invention may include, but is not limited to, step S100, step S200, step S300, step S400, step S500, step S600, step S700, step S800, and step S900.
Step S100, obtaining a conductive copper substrate.
Specifically, a substrate 1100 (shown in fig. 11) having conductive copper is obtained, and a wiring may be provided on the substrate, and the wiring may include a pad, a wiring related to power connection, and the like, which is not particularly limited in this embodiment.
And step S200, controlling the electroplating module to carry out electroplating treatment on the first surface of the conductive copper substrate to obtain the conductive copper substrate provided with the silver plating reflecting layer.
Specifically, silver plating treatment is performed on the first surface provided with the conductive copper substrate to form a reflective layer in the LED lamp bead, so as to obtain a conductive copper substrate 1200 (as shown in fig. 12) provided with the silver plating reflective layer, which may be directly silver plating on the copper surface, or may be first plating a transition layer on the copper surface, and then plating a silver layer on the transition layer.
In some alternative embodiments, the electroplating module includes a pretreatment unit, a first electroplating treatment unit, a second electroplating treatment unit and an over-silver protection unit, where the pretreatment unit is controlled to pretreat impurities on a surface of a first surface of the conductive copper substrate to obtain a pretreated substrate, then the first electroplating treatment unit is controlled to perform first electroplating treatment on the pretreated substrate to obtain a substrate provided with a transition layer, then the second electroplating treatment unit is controlled to perform second electroplating treatment on the substrate provided with the transition layer to obtain a substrate provided with a silver-plated reflection layer, and then the over-silver protection unit is controlled to perform over-silver protection treatment on the substrate provided with the silver-plated reflection layer to obtain the conductive copper substrate provided with the silver-plated reflection layer. Through setting up the transition layer between silver-plated reflection coating and conductive copper layer, can prevent to appear reacting between silver layer and the copper layer and lead to the problem that silver-plated reflection coating's reflection of light ability descends, guarantee the light-emitting rate of LED lamp pearl.
The transition layer may be a nickel metal layer, or may be another metal layer that is not easily chemically reacted with copper or silver, which is not particularly limited in this embodiment.
And step S300, controlling the edge sealing module to perform injection molding on the silver plating reflection layer surface of the conductive copper substrate provided with the silver plating reflection layer to obtain a substrate provided with the edge sealing unit, wherein the edge sealing unit is of a light-transmitting structure.
Specifically, the number and the arrangement sequence of the edge sealing units are set according to the preset size of the conductive copper substrate, then a corresponding injection mold is manufactured, then the edge sealing module is controlled to perform injection molding on a plurality of edge sealing units on the silver plating reflection layer surface of the conductive copper substrate provided with the silver plating reflection layer, so that a substrate 1300 (shown in fig. 13) provided with the edge sealing units is obtained, the edge sealing units are of a light-transmitting structure, in order to improve the heat dissipation performance of original materials, the LED lamp mainly adopts high-molecular organic silicon as an outer sealing adhesive (silica gel material) of the white LED, and the silica gel material has high moisture permeability and oxygen permeability. The edge sealing unit is of a bowl-shaped structure, and can be provided with enough space for installing the LED chip, and the edge sealing unit is mainly used for protecting the LED chip and transmitting light.
In some alternative embodiments, the banding module includes injection molding unit and injection mold, the injection mold is provided with the base plate and places the region, a plurality of banding die cavities and the mouth of moulding plastics that correspond with banding structure, the mouth of moulding plastics communicates with a plurality of banding die cavities, the injection molding unit includes the mouth of moulding plastics and the hot runner board of being connected with the mouth of moulding plastics, the mouth of moulding plastics includes the nozzle mouth and sets up the needle of moulding plastics in the mouth of moulding plastics, the needle of moulding plastics is including the needle body that is used for passing the nozzle mouth of the mouth of moulding plastics and the syringe needle portion that is used for sealing the nozzle mouth, the needle body includes the needle body portion of being connected with the syringe needle portion, the area of the orthographic projection of needle body portion to the syringe needle portion is less than the area of nozzle mouth. Firstly, placing a conductive copper substrate provided with a silver-plated reflecting layer in a substrate placing area of an injection mold; then controlling the injection nozzle to move to the injection port; then controlling the injection valve needle to be inserted into the edge sealing die cavity through the injection port so as to enable the needle body to be positioned at the nozzle port; and then controlling the injection nozzle to flow out the injection solution between the needle body and the nozzle opening and flow into the edge sealing die cavity through the injection opening, and controlling the injection valve needle to reset and leave the injection opening when the injection die cavity is filled with the injection solution, so as to obtain the substrate provided with the edge sealing unit.
Step S400, transmitting the substrate provided with the edge sealing unit to a patch station of a patch module, and controlling the patch module to perform patch treatment on all edge sealing units in the substrate provided with the edge sealing unit based on a patch treatment method to obtain a patched substrate 1400 (shown in FIG. 14); the method for processing the surface mount device of each edge sealing unit comprises the steps of controlling a visual unit to obtain an arrangement image of a plurality of LED chips on a chip extraction station, determining a moving path of the chip extraction station according to the arrangement image, controlling the chip extraction station to move so that the LED chips needing to be surface mount are moved to a second position, controlling the surface mount station to move according to a preset path so that the edge sealing unit needing to be surface mount is moved to the first position, simultaneously controlling a glue dripping unit to move to the first position, dripping glue into the edge sealing unit on the first position, controlling the glue dripping unit to leave the first position, and placing the LED chips in the edge sealing unit after the moving chip arm reaches the first position.
Specifically, after the edge sealing units are arranged, moving the substrate provided with the edge sealing units to a patch station of the patch module, wherein in order to ensure efficient and accurate operation of the patch module, the movement actions of the patch station, the chip extraction station, the moving chip arm and the glue dripping unit in the patch module are single and independent, wherein the patch station moves according to a preset path preset by the arrangement condition of the edge sealing units, namely, the patch unit moves a first distance according to the preset path in each patch period, the first distance is the distance between one edge sealing unit and the next edge sealing unit on the preset path, and in general, the distances between every two edge sealing units are equal, namely, the first distances are equal, namely, the movement of the patch station is controlled, so that one edge sealing unit on the first position is converted into the next edge sealing unit on the preset path; the chip extraction station moves according to a moving path determined by the arrangement condition of all the LED chips on the wafer, namely, the chip extraction station moves a second distance according to the moving path in each patch period, wherein the second distance is the distance between two adjacent LED chips, namely, by controlling the movement of the chip extraction station, one LED chip in the second position is converted into the next LED chip of the LED chip in the moving path; the moving path of the moving chip arm in each patch cycle is from a first position to a second position and then from the second position to the first position, when the moving chip arm is at the first position, the adsorbed LED chips are placed in the edge sealing units corresponding to the first position, and when the moving chip arm is at the second position, the LED chips corresponding to the second position are adsorbed from the wafer; in each patch cycle, the glue dripping unit is arranged to move from the initial position to the first position and then from the first position to the initial position, and when the glue dripping unit is at the first position, glue is dripped into the edge sealing unit corresponding to the first position. The method for processing the patch in each patch cycle may include controlling the vision unit to obtain an arrangement image of a plurality of LED chips on the chip extraction station, determining a movement path of the chip extraction station according to the arrangement image, controlling the chip extraction station to move so as to move the LED chips to be patched to the second position, and in a process of moving the chip arm from the first position to the second position and extracting the LED chips from the first position to which the LED chips are moved, controlling the patch station to move according to a preset path so as to move the edge sealing unit to be patched to the first position, simultaneously controlling the glue dripping unit to move to the first position, dripping glue into the edge sealing unit on the first position, controlling the glue dripping unit to leave the first position, and placing the LED chips in the edge sealing unit after the moving chip arm reaches the first position. In the technical scheme of the embodiment, through the cooperation control of the chip mounting station, the chip extracting station, the movable chip arm, the glue dripping unit and the vision unit, the moving path of the chip extracting station is determined according to the arrangement image condition of a plurality of LED chips, so that each component unit can be operated quickly, the stopping time of the component is reduced, and the efficiency of the whole chip mounting process is effectively improved.
It should be noted that, the time of each chip mounting period is equal to the working time of the moving chip arm, the working time of the glue dripping unit is less than the working time of the moving chip arm from the first position to the second position, sucking the LED chip and then from the second position to the first position, the moving time of the chip extracting station is less than the working time of the moving chip arm from the second position to the first position, placing the LED chip and then from the first position to the second position, and the moving time of the chip mounting station is less than the working time of the glue dripping unit from the first position to the initial position and then from the initial position to the first position. The swing speed of the movable chip arm can be adjusted according to the working efficiency requirement, and then the moving speed of the glue dripping unit, the moving speed of the chip extraction station and the moving speed of the chip mounting station are adjusted based on the working time of the movable chip arm.
It should be noted that, the path formed by the movement of the moving chip arm between the first position and the second position is an arc path, the path formed by the movement of the glue dripping unit between the initial position and the first position may be an arc path, and the length of the moving chip arm is longer than the length of the glue dripping unit, so that the length of the path moved by the moving chip arm is longer than the length of the path moved by the glue dripping unit. The path formed by the movement of the glue dripping unit between the initial position and the first position can also be a straight path, and the path length of the movement of the chip arm is kept longer than that of the movement of the glue dripping unit.
In some alternative embodiments, the arrangement image acquired by the vision unit includes a first area and/or a second area, where the first area is an area where the LED chip is disposed, and the second area is an area where the LED chip is not disposed, determining a moving path of the chip extraction station according to the arrangement image and controlling the chip extraction station to move so that the LED chip requiring the patch moves to the second position, including: firstly, carrying out identification processing on the arrangement images to obtain an identification result; then, under the condition that the identification result is that the arrangement image comprises a first area and a second area, determining a moving path of the chip extraction station according to row and column data in the first area, row and column data of the second area and position relation information between the second area and the first area; and controlling the chip extraction station to move according to the moving path so as to enable the LED chip to be pasted to move to the second position.
For example: referring to fig. 15 to 16, the arrangement image includes a first area and a second area, the whole arrangement image is 4 rows and 5 columns, wherein the second area is an area corresponding to columns 3 to 5 in the third row, and the remaining areas are all the first area, because the moving distance of the chip extraction station in each chip mounting period is fixed for efficient operation and precise operation, and is the distance between two adjacent LED chips, if the moving path is set to be a path in the column direction, the moving chip arm needs to wait for the time of moving the chip extraction station three times during the moving path of the chip extraction station passes through the second area, and then the processing efficiency of the chip mounting operation will be affected; at this time, the moving path should be set to be a path based on the row direction, so that the extraction work of all the LED chips on the chip extraction station can be completed only by waiting for the time for which the chip extraction station moves once.
Also for example: referring to fig. 17 to 18, the arrangement image includes a first area and a second area, the whole arrangement image is 4 rows and 5 columns, wherein the second area is an area corresponding to columns 3 to 5 in the second row and the third row, and the remaining areas are all the first area, because the moving distance of the chip extraction station in each chip cycle is fixed for efficient operation and precision, and is the distance between two adjacent LED chips, if the moving path is set to be a path in the column direction, the moving chip arm needs to wait for six times of movement of the chip extraction station in the process of passing through the second area, and then the processing efficiency of the chip operation is affected; at this time, the moving path should be set to a path based on the row direction, so that the extraction work of all the LED chips on the chip extraction station can be completed without waiting.
The moving path is determined as a target moving path according to a path passing through the second area or a path repeatedly passing through the first area for the minimum number of times; the determination may be performed by a path algorithm, where the path algorithm may be calculated according to the parity condition of the number of rows and columns occupied by the second area, and the parity condition of the number of rows and columns occupied by the first area on both sides of the second area; or the determined path may be screened based on the simulated paths and then based on the condition that the path passes through the second area or the first area is repeated a minimum number of times.
And S500, controlling the welding module to weld all the LED chips in the substrate after the chip bonding to obtain the substrate after the chip bonding.
Specifically, after the surface mount processing on the LED chip is completed, the LED chip needs to be connected to the circuit on the substrate, and then the power pin of the LED chip needs to be soldered to the circuit pad on the substrate, so as to obtain a substrate 1500 (as shown in fig. 19) after the chip is soldered.
In some alternative embodiments, the welding module comprises an ultrasonic welding head, a welding platform and a visual positioning unit, the ultrasonic welding head comprises a needle head part, the needle head part is provided with a through hole for penetrating out a welding line, the welding isolation unit is provided with separation areas for separating each LED chip, and the number of the separation areas is the same as that of the LED chips; then controlling the soldering module to solder all the LED chips in the substrate after the bonding, to obtain a substrate after the bonding, including: firstly, placing the substrate after the surface mounting on a welding platform, then obtaining the position information of the LED chips and the position information of bonding pads corresponding to the LED chips through a visual positioning unit, controlling an ultrasonic welding head to weld each LED chip by using welding wires, and obtaining the substrate after the chips are welded. In the technical scheme of the embodiment, the problem that other metal residues appear in the welding process can be reduced as far as possible through the welding technology of the ultrasonic welding head, so that the manufacturing yield and quality of the LED lamp beads are improved.
In some alternative embodiments, the welding module comprises an ultrasonic welding head, a welding platform, a welding isolation unit and a visual positioning unit, wherein the ultrasonic welding head comprises a needle head part, the needle head part is provided with a through hole for penetrating out a welding line, the welding isolation unit is provided with separation areas for separating each LED chip, and the number of the separation areas is the same as that of the LED chips; then controlling the soldering module to solder all the LED chips in the substrate after the bonding, to obtain a substrate after the bonding, including: firstly, placing a substrate after the surface mounting on a welding platform, then placing a welding isolation unit above the substrate after the surface mounting, then obtaining the position information of the LED chips and the position information of bonding pads corresponding to the LED chips through a visual positioning unit, and controlling an ultrasonic welding head to weld each LED chip by using a welding wire to obtain the substrate after the chip is welded. In the technical scheme of the embodiment, the welding isolation unit is placed above the substrate after the patch in the welding process, so that residues in the welding process of the first LED chip can be prevented from affecting other LED chips around the first LED chip, and the manufacturing yield and quality of the LED lamp beads are further improved.
And step S600, controlling the first anti-vulcanization module to perform first anti-vulcanization treatment on the inside of the edge sealing unit of the substrate after the welding chip, so as to obtain the substrate after the first anti-vulcanization treatment.
Specifically, in the process of manufacturing the LED lamp beads, the substrate after the chip is disposed on an anti-vulcanizing device to perform an anti-vulcanizing process, where the substrate after the chip is disposed on the anti-vulcanizing device, the substrate after the chip includes a conductive layer 610, a reflective layer 620 disposed on a first surface of the conductive layer, an LED chip 630 disposed on the reflective layer, and an edge sealing unit 640 disposed on the reflective layer and surrounding the LED chip. The anti-vulcanizing device drops the acrylic monomer with the first volume into the edge sealing unit 640 of each LED lamp bead on the substrate after the chip is welded, so as to perform the first anti-vulcanizing treatment on the inside of each LED lamp bead, and obtain the substrate 1600 (as shown in fig. 20) after the first anti-vulcanizing treatment, and in this process, the first anti-vulcanizing treatment is mainly performed on the reflective layer inside the LED lamp bead.
In some alternative embodiments, the anti-vulcanization device includes a first anti-vulcanization module, the first anti-vulcanization module includes a first transmission unit, a first positioning unit, a first anti-vulcanization unit, and a first placement unit, and then step S100 may include: the method comprises the steps of firstly moving a substrate after welding chips to a workbench of a first anti-vulcanization unit through a first transmission unit, then controlling a first positioning unit to perform positioning treatment on positioning points on the substrate after welding chips to obtain positioning results, and as can be understood, presetting positioning points for accurate positioning on the substrate, starting the first positioning unit after the substrate moves to the first anti-vulcanization unit, respectively detecting at least two positioning points on the substrate, and when the detected positioning points are in a target positioning area range, determining that the positioning results are in accordance with requirements, controlling the first anti-vulcanization unit to move according to preset positioning points and path information under the condition that the positioning results are in accordance with the requirements, and dripping acrylic ester monomers with first volumes into the interiors of LED lamp beads after reaching the positioning points so as to perform first anti-vulcanization treatment on the interiors of each LED lamp bead; then, under the condition that acrylic monomers with a first volume are dripped into all LED lamp beads on the substrate after the chips are welded, the transmission belt on the first vulcanization preventing unit is controlled to transmit the substrate after the first vulcanization preventing treatment to the first placing unit.
It should be noted that, the substrate may be provided with X rows and Y columns, so the number of the droppers of the first anti-vulcanization unit may be set according to the X rows on the substrate, or may be set according to the Y columns on the substrate, or two rows of droppers are provided, and each row is provided with Y droppers, which is not limited specifically in this embodiment.
It should be noted that the first volume may be half of the volume of the inner cavity surrounded by the edge sealing unit, or may be one third of the volume of the inner cavity surrounded by the edge sealing unit, which is not particularly limited in this embodiment.
In some optional embodiments, the first vulcanizing preventing unit may further include a position adjusting unit, where the position adjusting unit includes a limiting edge block and an adjusting edge block disposed on two sides of the conveying belt, and if the positioning result is unsatisfactory, that is, when the detected positioning point is at least partially out of the range of the target positioning area, the conveying belt and/or the adjusting edge block may be controlled according to the position information data in the positioning result, so as to adjust the position of the substrate after the chip is welded, until the positioning result meets the requirement. It can be understood that the conveyor belt mainly adjusts the displacement of the substrate in the X direction, and the adjusting edge block is mainly used for adjusting the displacement of the substrate in the Y direction, where the X direction is the conveying direction of the substrate, and the Y direction is perpendicular to the X direction.
And step S700, controlling the substrate subjected to the first vulcanization prevention treatment by the glue dripping module to perform glue dripping treatment, so as to obtain the substrate subjected to the glue dripping treatment.
Specifically, after the first anti-vulcanization treatment is performed on each LED bead on the substrate, a fluorescent glue layer with a second volume is dripped into the edge sealing unit of each LED bead on the substrate, where the second volume is slightly larger than the volume surrounded by the edge sealing unit, so that the fluorescent glue layer on the LED bead can maintain tension on the edge sealing unit, so that the surface of the LED bead forms a curved surface shape, and the substrate 1700 (as shown in fig. 21) after the LED chip is sealed is obtained.
It should be noted that, the setting of the glue dropping device for dropping the second volume of the fluorescent glue layer to the edge sealing unit of the LED lamp bead can be the same as that of the device corresponding to the first anti-vulcanization module, and the arrangement and the number of the droppers can be set according to the curing time of the glue dropping.
Step S800, controlling the second anti-vulcanization module to perform second anti-vulcanization treatment on the outer part of the edge sealing unit of the substrate after the glue dropping treatment, and obtaining the substrate after the second anti-vulcanization treatment.
Specifically, after the masking process is completed on the second surface of the conductive layer of the substrate, the second anti-vulcanization process may be performed on the outside of each LED bead of the masked substrate, resulting in a second anti-vulcanization processed substrate 1800 (as shown in fig. 22). Through carrying out inside and outside twice to the LED lamp and preventing the vulcanization, can effectively block the sulfur that produces in the LED production process and corrode the problem that leads to the LED lamp blackening to the reflector layer, can effectively improve the anti-vulcanization effect of LED lamp to guarantee the light flux of LED lamp.
In some alternative embodiments, the second anti-vulcanization module includes a masking film sticking unit, a product tray, a drying oven, and a second anti-vulcanization unit, and then step S400 may include: firstly placing the substrate after shielding treatment on a product tray, then placing the product tray in a drying oven for drying treatment to obtain a substrate after drying treatment, then placing the substrate after drying treatment in a second anti-vulcanization unit, and carrying out nano coating treatment on the substrate after drying treatment through vaporized acrylic monomers so as to carry out second anti-vulcanization treatment on the outer parts of the LED lamp beads to obtain the substrate after second anti-vulcanization treatment. Through carrying out inside and outside twice to LED lampThe anti-vulcanization treatment can effectively prevent the problem that the LED lamp is blacked due to corrosion of sulfur generated in the LED production process to the reflecting layer, and can effectively improve the anti-vulcanization effect of the LED lamp, so that the light transmittance of the LED lamp is ensured. The product is placed in a drying cabinet to be dried, and the drying requirement is set to be 15-18、<3% RH, 20-30 ℃.
The substrate is placed in the second anti-vulcanization unit, the substrate after the drying treatment is subjected to nano coating treatment through the vaporized acrylic ester monomer, the coating is mainly carried out in a plasma enhanced chemical deposition treatment mode, the surface of the product is cleaned and activated by plasma discharge, energy is provided for opening chemical bonds of coating raw material molecules, and the polymerization reaction is pushed to continuously proceed. The excited electrons generated in the discharging process ionize monomer molecules, and the monomer molecules are split to generate free electrons, ions, excited molecules and free radicals; in a vacuum environment, free radicals are adsorbed, condensed and polymerized on the surface of the activated substrate, electrons and ions are crosslinked and generate chemical bonds with deposited molecules, so that the nano protective layer with high stroke structure strength and compactness is continuously polymerized and grown. It should be noted that the nano-plating film may be PECVD (Plasma-Enhanced Chemical Vapor Deposition), namely Plasma enhanced chemical vapor deposition; or may be LPCVD (Low Pressure Chemical Vapor Deposition), i.e., low pressure chemical vapor deposition. The present embodiment is not particularly limited thereto.
In some alternative embodiments, the product wobble plate has a cylindrical structure, and a plurality of wobble grooves are formed in the product wobble plate, and the substrate after the shielding treatment is placed on the product wobble plate, including: vertically placing the substrate subjected to shielding treatment on a swinging groove of a product swinging plate; the detection substrate for detecting the second anti-vulcanization treatment effect is provided with a plane LED lamp bead. Because the surface of the LED lamp bead of the finished product is a curved surface, if the film plating condition of the curved surface is detected, correct data can not be obtained easily, therefore, in the process of carrying out a second vulcanization test on the substrate, a detection substrate with the surface of the LED lamp bead being a plane can be placed on the product wobble plate, and because the detection substrate and the substrate after shielding treatment are in the same second vulcanization treatment environment, after the second vulcanization test, the film plating condition (such as thickness detection and contact angle detection) on the plane of the LED lamp bead on the detection substrate is only measured, and whether the film plating condition of the substrate after shielding treatment meets the requirement can be determined through the film plating condition, if the detected film plating thickness is the first thickness, and the first thickness is within the preset thickness numerical range, the first thickness can be considered to meet the requirement, namely, whether the film plating condition of the substrate after shielding treatment meets the requirement.
In some alternative embodiments, the second anti-vulcanization module further includes a plating film detection unit, and after obtaining the second anti-vulcanization processed substrate, the method further includes: detecting the thickness of the coating film of the detection substrate subjected to the second anti-vulcanization treatment through a coating film detection unit to obtain a detection result; and then, under the condition that the detection result shows that the thickness of the coating meets the requirement, carrying out de-masking treatment on the substrate subjected to the second anti-vulcanization treatment to obtain the target substrate.
In some optional embodiments, the second anti-vulcanizing module further includes a shielding film removing unit, where the shielding film removing unit includes a moving unit, a bottom plate provided with a groove corresponding to a position of the LED lamp bead on the second anti-vulcanizing substrate, a detecting unit for detecting flatness of the second anti-vulcanizing substrate, a pressing unit for pressing the second anti-vulcanizing substrate, and a film removing unit for tearing the shielding film, and the step of performing the shielding removing process on the second anti-vulcanizing substrate to obtain the target substrate includes: firstly, controlling a moving unit for removing the shielding film unit to turn over the substrate after the second anti-vulcanization treatment, and placing the substrate after the turn-over treatment on a bottom plate; then controlling the detection unit to detect the flatness of the substrate placed on the bottom plate in real time; then controlling the compressing unit to compress the first position of the substrate; then controlling the stripping unit to move to a first edge position of the substrate close to the first position, clamping the shielding film at the first edge position and controlling the stripping unit to move upwards so as to enable the shielding film at the first edge position to leave the substrate; and finally, controlling the stripping unit and the compacting unit to move to the second position at the same time so as to separate the shielding film from the substrate, thereby obtaining the target substrate. In the technical scheme of the embodiment, the shielding film unit is automatically removed to remove the shielding film stuck on the substrate, and the interaction of the detection unit, the compression unit and the film removing unit is used for keeping the flatness of the soft substrate in the process of removing the shielding film, so that the substrate cannot be transitionally deformed, and the yield of the target substrate is improved.
In some alternative embodiments, the method for manufacturing the LED lamp beads is applied to an anti-vulcanizing device, where the anti-vulcanizing device is used for performing an anti-vulcanizing treatment on the substrate after the chips are welded, and the substrate includes a conductive layer, a reflective layer disposed on a first surface of the conductive layer, an LED chip disposed on the reflective layer, and a sealing unit disposed on the reflective layer and surrounding the LED chip, and the method specifically includes: dripping a first volume of acrylic ester monomer into an edge sealing unit of each LED lamp bead on the substrate after the chip is welded by the anti-vulcanization equipment so as to perform first anti-vulcanization treatment on the inside of each LED lamp bead to obtain a first anti-vulcanization treated substrate, wherein the first volume is smaller than the volume of an inner cavity in the edge sealing unit, and the first anti-vulcanization treatment on the surface of the reflecting layer can be satisfied; then, dripping a fluorescent glue layer with a second volume determined according to the volume of the inner cavity in the edge sealing unit into the edge sealing unit of each LED lamp bead on the first anti-vulcanization treated substrate to obtain a substrate after the LED chip is sealed, and protecting the LED chip and the reflecting layer through the fluorescent glue layer; then, the second surface of the conductive layer is subjected to shielding treatment to obtain a shielded substrate so as to protect the circuit on the conductive layer and prevent the subsequent second vulcanization-proof treatment from corroding the circuit; and then carrying out second anti-vulcanization treatment on the outer part of each LED lamp bead of the substrate after shielding treatment to obtain the substrate after the second anti-vulcanization treatment, so as to carry out the second anti-vulcanization treatment on the outer layer of the LED lamp, and further prevent the reflecting layer from being influenced by sulfur. In the technical scheme of the embodiment, through carrying out inside and outside twice anti-vulcanization treatment to the LED lamp, the problem that the LED lamp blackens due to corrosion of sulfur generated in the LED production process to the reflecting layer can be effectively blocked, and the anti-vulcanization effect of the LED lamp can be effectively improved, so that the light transmittance of the LED lamp is ensured.
The target substrate after the secondary anti-vulcanization treatment obtained based on the above example was tested and compared with the substrate without the anti-vulcanization treatment, and the specific steps are as follows:
(1) Compared with the LED lamp beads which are not subjected to the vulcanization prevention, the LED lamp pearl flux of the target substrate after the secondary vulcanization prevention treatment fluctuates by +/-1%;
(2) The color temperature of the LED lamp beads of the target substrate after the secondary vulcanization prevention treatment is within the fluctuation range (6400 K+/-100K) of the color temperature of the LED lamp beads which are not subjected to vulcanization prevention;
(3) Based on vulcanization test conditions: the sulfur powder was used in an addition amount of 1.3mg/ml (in beaker)/temperature 75 ℃ + -2 ℃/high temperature storage time: 8H, the result of the vulcanization test is that the luminous flux of the LED lamp beads of the target substrate after the secondary vulcanization prevention treatment is basically identical with the luminous flux of the LED lamp beads of the substrate without the vulcanization prevention treatment.
(4) The maximum attenuation value (before-after-vulcanization) of the LED lamp beads of the target substrate after the secondary vulcanization prevention treatment is 0.93%, and the average value is 0.53%; the maximum attenuation value (before-after-vulcanization) of the LED beads of the substrate not subjected to the vulcanization-preventing treatment was 19.94%, and the average value was 15.40%. The LED lamp beads of the target substrate after the secondary vulcanization prevention treatment are free from blackening; the LED lamp beads of the substrate which are not subjected to the vulcanization prevention treatment are dark integrally.
According to the technical scheme of the embodiment, the inside and outside automatic anti-vulcanization treatment is carried out on the LED lamp through the anti-vulcanization equipment according to the test comparison result, so that the problem that the LED lamp blackens due to corrosion of sulfur generated in the LED production process to the reflecting layer can be effectively prevented, the anti-vulcanization effect of the LED lamp can be effectively improved, and the light transmittance of the LED lamp is guaranteed.
And step S900, controlling the detection module to detect and cut the substrate subjected to the second vulcanization prevention treatment to obtain the target LED lamp beads.
Specifically, after the second anti-vulcanization treatment is completed, in order to improve the quality of the final product, each LED lamp bead in the substrate after the second anti-vulcanization treatment needs to be detected by a detection module, where the detection mainly includes: and finally obtaining the target LED lamp beads 1900 (shown in fig. 23) after the detection is passed through, such as line detection of the second surface of the substrate, welding condition detection in each LED lamp bead, appearance detection of each LED lamp bead and the like.
In some optional embodiments, the detection module includes an image acquisition and analysis unit, a moving unit, a cutting unit, a recovery unit, and a separation unit, where the separation unit is provided with separation mechanisms corresponding to positions of all LED beads on the substrate, and the step of controlling the detection module to detect and cut the substrate after the second anti-vulcanization treatment to obtain the target LED beads may include: firstly controlling a moving unit of a detection module to move the substrate subjected to the second vulcanization prevention treatment to an image acquisition and analysis unit to shoot so as to obtain an image to be analyzed, and detecting the image to be analyzed so as to obtain a detection result; and then controlling the moving unit to move the detected substrate to the cutting unit, controlling the cutting unit to cut the LED lamp beads which do not meet the preset detection conditions in the substrate according to the detection result to obtain the cut substrate, collecting the cut LED lamp beads through the recovery unit, then controlling the moving unit to move the detected and processed substrate to the separating unit, and controlling the separating mechanism of the separating unit to press down the cut substrate to separate the LED lamp beads from the substrate to obtain the target LED lamp beads.
Through the method for manufacturing the LED lamp bead, the method for manufacturing the LED lamp bead is applied to LED lamp bead manufacturing equipment, the LED lamp bead manufacturing equipment comprises an electroplating module, a patch module, an edge sealing module, a welding module, a first anti-vulcanization module, a glue dripping module, a second anti-vulcanization module and a detection module, wherein the patch module comprises a patch station, a chip extraction station for placing a plurality of LED chips which are regularly arranged, a movable chip arm for moving from a first position to a second position, a glue dripping unit and a visual unit, and the method specifically comprises the following steps: firstly, a conductive copper substrate is obtained, then a silver reflecting layer is plated on the conductive copper substrate, then an edge sealing unit is arranged on the silver reflecting layer at a position corresponding to the position where the LED lamp beads need to be arranged, then an LED chip is pasted into the edge sealing unit through an efficient pasting method, then the LED chip and a bonding pad are subjected to welding treatment, then the inner part and the outer part of the edge sealing unit are respectively subjected to first anti-vulcanization treatment and second anti-vulcanization treatment, a substrate after the second anti-vulcanization treatment is obtained, finally the LED lamp beads on the substrate after the treatment are detected, and accordingly target LED lamp beads meeting the requirements are brushed and selected.
Through the production flow of standardized LED lamp pearl to LED lamp pearl manufacture equipment, can produce the LED lamp pearl of customer's demand with high efficiency high quality. The LED lamp is subjected to internal and external two-time vulcanization prevention treatment, so that the problem that the LED lamp is blackened due to corrosion of sulfur generated in the LED production process to a reflecting layer can be effectively prevented, the vulcanization prevention effect of the LED lamp can be effectively improved, and the light transmittance of the LED lamp is ensured; in addition, the efficient surface mounting method is set for the surface mounting module, in order to efficiently and accurately complete surface mounting processing of the LED chips, each component unit in the whole surface mounting process needs to be enabled to run continuously as much as possible for each surface mounting action, the problem of interference among each component unit in the surface mounting process is not caused, and then the moving path of the chip extraction station needs to be determined according to the arrangement image condition of a plurality of LED chips, so that the stopping time of the component units is shortest, and the efficiency of the whole surface mounting process is effectively improved. By the method for manufacturing the LED lamp beads, the high-quality LED lamp beads can be manufactured efficiently, so that the requirements of clients in the market are met.
In addition, an embodiment of the present invention provides an LED lamp bead manufacturing apparatus including: memory, a processor, and a computer program stored on the memory and executable on the processor.
The processor and the memory may be connected by a bus or other means.
It should be noted that, the computer in this embodiment may be correspondingly configured to include the memory and the processor in the embodiment shown in fig. 1, and may form a part of the system architecture platform in the embodiment shown in fig. 1, where the two are the same inventive concept, so that the two have the same implementation principle and beneficial effects, which are not described in detail herein.
The non-transitory software program and instructions required to implement the uplink co-channel interference cancellation method of the above embodiments are stored in the memory, which when executed by the processor, performs the LED light bead manufacturing method of the above embodiments, for example, performs the method steps S100 to S900 in fig. 10 described above.
Furthermore, an embodiment of the present invention also provides a computer-readable storage medium storing computer-executable instructions for performing the LED lamp bead manufacturing method of the above-described LED lamp bead manufacturing apparatus, for example, performing the method steps S100 to S900 in fig. 10 described above.
Those of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as known to those skilled in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Furthermore, as is well known to those of ordinary skill in the art, communication media typically include computer readable instructions, data structures, program modules, or other data in a modulated data signal, such as a carrier wave or other transport mechanism, and may include any information delivery media.
While the preferred embodiment of the present invention has been described in detail, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit and scope of the present invention, and these equivalent modifications or substitutions are included in the scope of the present invention as defined in the appended claims.
Claims (11)
1. The utility model provides a LED lamp pearl manufacture method, its characterized in that is applied to LED lamp pearl manufacture equipment, LED lamp pearl manufacture equipment includes electroplating module, paster module, banding module, welding module, first anti-vulcanization module, glue dripping module, second anti-vulcanization module and detection module, the paster module includes paster station, is used for placing the chip extraction station of a plurality of LED chips of regular arrangement, is used for removing chip arm, glue dripping unit and the vision unit of moving to the second position from first position, the method includes:
obtaining a conductive copper substrate;
controlling the electroplating module to carry out electroplating treatment on the first surface of the conductive copper substrate to obtain the conductive copper substrate provided with the silver plating reflecting layer;
controlling the edge sealing module to perform injection molding on the silver plating reflection layer surface of the conductive copper substrate provided with the silver plating reflection layer to obtain a substrate provided with edge sealing units, wherein the edge sealing units are of a light-transmitting structure;
Transmitting the substrate provided with the edge sealing unit to a surface mounting station of the surface mounting module, and controlling the surface mounting module to carry out surface mounting treatment on all the edge sealing units in the substrate provided with the edge sealing unit based on a surface mounting treatment method to obtain a surface-mounted substrate; the chip processing method for each edge sealing unit comprises the steps of controlling the vision unit to obtain an arrangement image of a plurality of LED chips on the chip extraction station, determining a moving path of the chip extraction station according to the arrangement image, controlling the chip extraction station to move so as to enable the LED chips needing to be pasted to move to the second position, controlling the pasting station to move according to a preset path so as to enable the edge sealing unit needing to be pasted to move to the first position, simultaneously controlling the glue dripping unit to move to the first position, dripping glue into the edge sealing unit on the first position, controlling the glue dripping unit to leave the first position, and placing the LED chips into the glued edge sealing unit after the moving chip arm reaches the first position;
Controlling the welding module to weld all the LED chips in the substrate after the chip bonding to obtain a substrate after the chip bonding;
controlling the first anti-vulcanization module to perform first anti-vulcanization treatment on the inside of the edge sealing unit of the substrate after the chip is welded to obtain a substrate after the first anti-vulcanization treatment;
controlling the glue dropping module to perform glue dropping treatment on the first anti-vulcanization treated substrate to obtain a glue-dropped substrate;
controlling the second anti-vulcanization module to perform second anti-vulcanization treatment on the outside of the edge sealing unit of the substrate after the glue dropping treatment to obtain a substrate after the second anti-vulcanization treatment;
and controlling the detection module to detect and cut the substrate subjected to the second anti-vulcanization treatment to obtain the target LED lamp bead.
2. The method according to claim 1, wherein the arrangement image includes a first area and/or a second area, the first area is an area where the LED chips are disposed, the second area is an area where the LED chips are not disposed, the determining a moving path of the chip extracting station according to the arrangement image and controlling the chip extracting station to move so that the LED chips requiring the die bonding are moved to the second position includes:
Performing recognition processing on the arrangement images to obtain recognition results;
determining a moving path of the chip extraction station according to row and column data in the first area, row and column data of the second area and position relation information between the second area and the first area when the identification result is that the arrangement image comprises the first area and the second area;
and controlling the chip extraction station to move according to the moving path so as to enable the LED chip to be pasted to move to the second position.
3. The method of manufacturing an LED lamp bead according to claim 1, wherein the plating module includes a pretreatment unit, a first plating unit, a second plating unit, and an over-silver protection unit, and the controlling the plating module to perform a plating process on the first surface of the conductive copper substrate to obtain the conductive copper substrate provided with the silver-plated reflective layer includes:
controlling the pretreatment unit to pretreat impurities on the surface of the first surface of the conductive copper substrate to obtain a pretreated substrate;
controlling the first electroplating processing unit to perform first electroplating processing on the pretreated substrate to obtain a substrate provided with a transition layer;
Controlling the second electroplating processing unit to perform second electroplating processing on the substrate provided with the transition layer to obtain a substrate provided with a silver-plated reflecting layer;
and controlling the silver-plating protection unit to perform silver-plating protection treatment on the substrate provided with the silver-plating reflection layer to obtain the conductive copper substrate provided with the silver-plating reflection layer.
4. The method for manufacturing the LED lamp bead according to claim 1, wherein the edge sealing module comprises an injection molding unit and an injection mold, the injection mold is provided with a substrate placement area, a plurality of edge sealing mold cavities corresponding to edge sealing structures and an injection port, the injection port is communicated with the plurality of edge sealing mold cavities, the injection molding unit comprises an injection nozzle and a hot runner plate connected with the injection nozzle, the injection nozzle comprises a nozzle opening and an injection valve needle arranged in the injection nozzle, the injection valve needle comprises a needle body for penetrating the nozzle opening of the injection nozzle and a needle head for closing the nozzle opening, the needle body comprises a needle body connected with the needle head, and the orthographic projection area of the needle body to the needle head is smaller than the area of the nozzle opening;
the control of the edge sealing module is to subject a plurality of edge sealing units to injection molding on the silver plating reflection layer surface of the conductive copper substrate provided with the silver plating reflection layer to obtain a substrate provided with the edge sealing units, and the control comprises the following steps:
Placing the conductive copper substrate provided with the silver-plated reflecting layer in a substrate placing area of the injection mold;
controlling the injection nozzle to move to the injection port;
controlling the injection valve needle to be inserted into the edge sealing die cavity through the injection port so that the needle body is positioned at the nozzle port;
controlling the injection nozzle to flow injection solution out between the needle body and the nozzle opening and into the edge sealing die cavity through the injection opening;
and when the injection molding solution is filled in the injection molding cavity, controlling the injection molding valve needle to reset and leave the injection port, and obtaining the substrate provided with the edge sealing unit.
5. The method of manufacturing an LED lamp bead according to claim 1, wherein the welding module includes an ultrasonic welding head including a needle portion provided with a through hole for penetrating a welding line, a welding platform, a welding isolation unit provided with separation areas for separating each of the LED chips, the number of the separation areas being the same as the number of the LED chips, and a visual positioning unit;
the control of the soldering module to solder all the LED chips in the substrate after the chip bonding to obtain a substrate after the chip bonding comprises:
Placing the substrate after the surface mounting on the welding platform;
placing the welding isolation unit above the substrate after the surface mounting;
acquiring the position information of the LED chip and the position information of a bonding pad corresponding to the LED chip through the visual positioning unit;
and controlling the ultrasonic welding head to weld each LED chip by using the welding wire to obtain a substrate after welding the chips, wherein the position information of the LED chips and the position information of the bonding pads corresponding to the LED chips are obtained.
6. The method according to claim 1, wherein the first anti-vulcanizing module includes a first transmission unit, a first positioning unit, a first anti-vulcanizing unit, a first placement unit, and a position adjustment unit, the position adjustment unit includes a limit edge block and an adjustment edge block disposed on two sides of the transmission belt, the first anti-vulcanizing module is controlled to perform a first anti-vulcanizing process on an inside of the edge sealing unit of the substrate after the chip is welded to obtain a first anti-vulcanizing processed substrate, and the method includes:
the substrate after the chip is welded is moved to a workbench of the first anti-vulcanization unit through the first transmission unit;
Controlling the first positioning unit to perform positioning treatment on positioning points on the substrate after the chip is welded to obtain a positioning result;
when the positioning result is not in accordance with the requirement, controlling the transmission belt and/or the adjusting edge block according to the position information data in the positioning result so as to adjust the position of the substrate after the chip is welded until the positioning result is in accordance with the requirement;
under the condition that the positioning result meets the requirement, controlling the first anti-vulcanization unit to move according to preset positioning points and path information, and dripping acrylic ester monomers with first volume into the LED lamp beads after the first anti-vulcanization unit reaches the positioning points so as to perform first anti-vulcanization treatment on the inside of each LED lamp bead;
and under the condition that the acrylic monomer with the first volume is dripped into the LED lamp beads on the substrate after the chips are welded, controlling the conveying belt on the first vulcanization preventing unit to convey the substrate after the first vulcanization preventing treatment to the first placing unit.
7. The method according to claim 1, wherein the detecting module includes an image acquisition and analysis unit, a moving unit, a cutting unit, a recovery unit, and a separation unit, the separation unit is provided with a separation mechanism corresponding to positions of all the LED beads on the substrate, and the detecting module is controlled to detect and cut the second anti-vulcanization processed substrate to obtain the target LED beads, and the method includes:
The moving unit of the detection module is controlled to move the substrate subjected to the second vulcanization prevention treatment to the image acquisition and analysis unit for shooting to obtain an image to be analyzed, and the image to be analyzed is detected to obtain a detection result;
the moving unit is controlled to move the detected substrate to the cutting unit, the cutting unit is controlled to cut the LED lamp beads which do not meet the preset detection conditions in the substrate according to the detection result to obtain a cut substrate, and the cut LED lamp beads are collected through the recovery unit;
and controlling the moving unit to move the substrate after the cutting treatment after the detection treatment to the separating unit, and controlling a separating mechanism of the separating unit to press down the substrate after the cutting treatment so as to separate the LED lamp beads from the substrate, thereby obtaining the target LED lamp beads.
8. The method for manufacturing LED lamp beads according to claim 1, wherein the second anti-vulcanization module includes a masking film attaching unit, a product swing plate, a drying oven, a second anti-vulcanization unit, and a masking film removing unit, the product swing plate has a cylindrical structure, a plurality of swing grooves are provided on the product swing plate, the second anti-vulcanization module is controlled to perform a second anti-vulcanization process on the outside of the edge sealing unit of the substrate after the glue dropping process, and the second anti-vulcanization process is performed to obtain a substrate after the second anti-vulcanization process, including:
The masking film pasting unit is used for carrying out film pasting masking treatment on the substrate after the glue dripping treatment so as to protect the surface circuit of the substrate and obtain the substrate after masking treatment;
vertically placing the substrate subjected to the shielding treatment on a swinging groove of a product swinging plate;
a detection substrate for detecting the second anti-vulcanization treatment effect is provided with a plane LED lamp bead;
placing the product placing tray in a drying oven for drying treatment to obtain a substrate after the drying treatment;
and placing the substrate after the drying treatment in the second anti-vulcanization unit, and carrying out nano coating treatment on the substrate after the drying treatment through the vaporized acrylic ester monomer so as to carry out second anti-vulcanization treatment on the outside of the LED lamp beads, thereby obtaining the substrate after the second anti-vulcanization treatment.
9. The method according to claim 8, wherein the removing the masking film unit includes a moving unit, a bottom plate provided with a groove corresponding to a position of the LED bead on the second sulfide-preventing substrate, a detecting unit for detecting flatness of the second sulfide-preventing substrate, a pressing unit for pressing the second sulfide-preventing substrate, and a film removing unit for tearing the masking film, and the removing the masking film from the second sulfide-preventing substrate to obtain a target substrate includes:
Controlling the moving unit for removing the shielding film unit to perform overturning treatment on the second anti-vulcanization treated substrate, and placing the overturning treated substrate on the bottom plate;
controlling the detection unit to detect the flatness of the substrate placed on the bottom plate in real time;
controlling the compressing unit to compress the first position of the substrate;
controlling the film removing unit to move to a first edge position of the substrate close to the first position, clamping the shielding film at the first edge position and controlling the film removing unit to move upwards so as to enable the shielding film at the first edge position to be separated from the substrate;
and controlling the stripping unit and the compaction unit to move to a second position at the same time so as to separate the shielding film from the substrate, thereby obtaining the target substrate.
10. An LED light bead manufacturing apparatus comprising at least one control processor and a memory for communication connection with the at least one control processor; the memory stores instructions executable by the at least one control processor to enable the at least one control processor to perform the LED light bead manufacturing method of any one of claims 1 to 9.
11. A computer-readable storage medium storing computer-executable instructions for causing a computer to perform the method of manufacturing an LED lamp bead according to any one of claims 1 to 9.
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