CN117712057B - Chip packaging structure and packaging method for multistage diamond radiation overload resistance - Google Patents
Chip packaging structure and packaging method for multistage diamond radiation overload resistance Download PDFInfo
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- CN117712057B CN117712057B CN202410168096.6A CN202410168096A CN117712057B CN 117712057 B CN117712057 B CN 117712057B CN 202410168096 A CN202410168096 A CN 202410168096A CN 117712057 B CN117712057 B CN 117712057B
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 72
- 239000010432 diamond Substances 0.000 title claims abstract description 72
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 71
- 230000005855 radiation Effects 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 109
- 239000003292 glue Substances 0.000 claims abstract description 49
- 230000001360 synchronised effect Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 230000003471 anti-radiation Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HJELPJZFDFLHEY-UHFFFAOYSA-N silicide(1-) Chemical compound [Si-] HJELPJZFDFLHEY-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Measurement Of Radiation (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of chip packaging, and particularly relates to a chip packaging structure and a packaging method for multistage diamond radiation overload resistance, wherein the chip packaging structure comprises a die holder component; the die holder component is of a rectangular open structure, and an anti-radiation plate is movably clamped at the top opening of the die holder component; the die holder assembly comprises a base mechanism, a lower base mechanism and an upper base mechanism; the base mechanism is of an open structure, and the lower base mechanism is movably clamped at the bottom end of the inner wall of the base mechanism. The inner wall at base unit is connected through lower basic unit mechanism and last basic unit mechanism swing joint, when pouring into encapsulation glue to last basic unit mechanism, can make the glue in the basic unit mechanism evenly flow into down in the basic unit mechanism to fix the inner wall at base unit with lower basic unit mechanism adhesion, make base unit, lower basic unit mechanism and last basic unit mechanism play synchronous encapsulation's effect when once pouring into encapsulation glue into, improved clock chip synchronous encapsulation's efficiency.
Description
Technical Field
The invention belongs to the technical field of chip packaging, and particularly relates to a chip packaging structure and a chip packaging method for multistage diamond radiation overload resistance.
Background
Currently, a common material for radiation-resistant electronic devices is a thin layer of monocrystalline silicon material on an insulator, known as SOI material. The thin-layer silicon structure on the diamond film is a developed thin-layer silicon structure on the insulating layer. The diamond film has high insulation and high heat conductivity, so that the diamond film becomes an ideal material for manufacturing high-power electronic devices and radiation-resistant electronic devices.
Through searching, in the prior art, chinese patent application number CN95119375.9 applies for the following days: 1995-12-12 discloses a thin-layer silicon structure chip material on a diamond film and a preparation method thereof. The preparation process is that a SiO2 transition layer (6), a diamond film (7) and a Si3N4 protective layer (8) are sequentially formed on the bonding monocrystalline silicon (5), and the regrown polycrystalline silicon is oxidized to form a bonding silicon dioxide layer (3). The bonding silicon dioxide layer (3) formed on the bonding monocrystalline silicon (5) and the substrate silicon dioxide layer (2) on the substrate monocrystalline silicon (1) are subjected to hydrophilic treatment, water sealing, high-temperature bonding and annealing treatment to form an SOD structure. The SOD structure thin layer silicon has complete crystal lattice, firm bonding and high yield; the manufactured electronic device has good radiation resistance, heat conduction and insulation.
The device still has the following drawbacks: although the bonding is firm, the yield is high; the electronic device has good radiation resistance, heat conduction and insulation properties, but in the process of packaging the multi-layer diamond film, the injection of packaging glue is often complicated, so that the synchronous packaging of a plurality of groups of wafers is not facilitated, and the synchronous packaging efficiency of chips is affected.
Disclosure of Invention
In order to solve the problems, the invention provides a chip packaging structure for resisting radiation overload of multi-stage diamond, which comprises a die holder component; the die holder component is of a rectangular open structure, and an anti-radiation plate is movably clamped at the top opening of the die holder component; the die holder assembly comprises a base mechanism, a lower base mechanism and an upper base mechanism; the base mechanism is of an open structure, the lower base mechanism is movably clamped at the bottom end of the inner wall of the base mechanism, the upper base mechanism is movably clamped at the top end of the inner wall of the base mechanism, and the bottom of the upper base mechanism is movably attached to the top of the lower base mechanism and communicated with the top of the lower base mechanism.
Further, the base mechanism includes a first housing; the outer wall fixedly connected with a plurality of groups of stitch of first casing, a plurality of groups the stitch distributes around the outer wall of first casing, the inner wall fixedly connected with a plurality of groups of spike post of first casing, and a plurality of groups of spike post all with a plurality of groups of stitch electric connection.
Further, the inner wall corner of the first shell is provided with a first assembly groove, the top of the first shell is close to the corner and is provided with a second assembly groove, and the second assembly groove is communicated with the first assembly groove.
Further, the inner wall bottom fixedly connected with stopper of second assembly groove, just the internal thread hole that communicates each other with first casing is seted up on the surface of stopper, a plurality of groups all movable joint has movable part in first assembly groove and the second assembly groove.
Further, the moving part comprises a linkage plate; the linkage board is fan-shaped structure, just linkage board activity joint is at the inner wall of first assembly groove, the outer wall of linkage board and be close to one side fixedly connected with linkage piece of second assembly groove, linkage piece activity laminating is connected at the inner wall of second assembly groove, it is connected with the bolt countersunk head to rotate on the linkage piece, the one end fixedly connected with lead screw of bolt countersunk head, just in the screw hole is female in threaded connection.
Further, the lower base layer mechanism comprises a first diamond diaphragm plate; the first diamond diaphragm plate is of a rectangular structure, the first diamond diaphragm plate is movably clamped on the inner wall of the first shell, the surface of the first diamond diaphragm plate is provided with a plurality of groups of third assembly grooves, the third assembly grooves are distributed at the corners of the first diamond diaphragm plate, the inner wall of the third assembly grooves is provided with a plurality of groups of first overflow grooves, the first overflow grooves are coincident with the central axis of the third assembly grooves, a first guide cylinder is embedded and installed in the central axis center of the first diamond diaphragm plate, and the top of the first guide cylinder is of an open structure.
Further, the outer wall of first draft tube is fixed and the intercommunication has a plurality of first honeycomb ducts of group, and a plurality of groups the tip of first honeycomb duct all extends to the corner of first overflow launder, the second draft tube is installed in the surface embedding of first diamond diaphragm board, just the second draft tube distributes in the corner of first diamond diaphragm board, a side wall of second draft tube is fixed and the intercommunication has the second honeycomb duct, just the one end of second honeycomb duct communicates with the corner of first overflow launder each other, another side wall of second draft tube is fixed and the intercommunication has a plurality of third honeycomb ducts of group, and a plurality of groups the third honeycomb duct all extends to the outer wall of first diamond diaphragm board.
Further, the upper base layer mechanism comprises a second diamond diaphragm plate; the second diamond diaphragm plate is of a rectangular structure, the second diamond diaphragm plate is movably clamped on the inner wall of the first shell, a plurality of groups of electric connecting grooves are formed in the outer wall of the second diamond diaphragm plate, a plurality of groups of electric connecting grooves are movably attached to the outer wall of the needle column, a plurality of groups of fourth assembling grooves are formed in the surface of the second diamond diaphragm plate, and the fourth assembling grooves are distributed at corners of the second diamond diaphragm plate.
Further, the second overflow launder has been seted up to the inner wall of fourth assembly groove, just the axis in second overflow launder coincides with the axis in fourth assembly groove, the axis center department embedding of second diamond lamina membranacea installs the third draft tube, the outer wall fixedly connected with of third draft tube a plurality of groups fourth honeycomb duct, a plurality of groups the tip of fourth honeycomb duct extends to the corner of second overflow launder, the both ends of third draft tube are open structure, just the bottom of third draft tube communicates each other with the top of first draft tube.
A chip packaging method for multi-stage diamond radiation overload resistance comprises the following steps,
The lower base layer mechanism and the upper base layer mechanism are movably attached to the inner wall of the base mechanism, and packaging glue is injected into the upper base layer mechanism, so that the packaging glue uniformly flows into the lower base layer mechanism;
The lower base layer mechanism is adhered and fixed on the inner wall of the base mechanism, so that the base mechanism, the lower base layer mechanism and the upper base layer mechanism are filled with packaging glue at one time.
The beneficial effects of the invention are as follows:
1. The lower base mechanism is movably attached to the inner wall of the base mechanism, when the packaging glue is injected into the upper base mechanism, the glue in the upper base mechanism can uniformly flow into the lower base mechanism, and the lower base mechanism is adhered and fixed on the inner wall of the base mechanism, so that the base mechanism, the lower base mechanism and the upper base mechanism play a role in synchronous packaging when the packaging glue is injected once, the synchronous packaging efficiency of the clock chip is improved, and the manufactured electronic device has good radiation resistance by using the radiation-resistant plate.
2. The top opening of the third guide cylinder is used for injecting packaging glue, so that the injected packaging glue is distributed into the second overflow groove on one side through a plurality of groups of fourth guide pipes, a chip placed in the fourth assembly groove is fixed, the bottom of the third guide cylinder is communicated with the top of the first guide cylinder, the packaging glue can be synchronously injected into the first guide cylinder, the packaging glue is synchronously injected into a plurality of groups of wafer plates, and the packaging efficiency of a group of wafers is improved.
3. The packaging glue in the first overflow groove is drained by utilizing the second guide pipe at the corner of the other end of the first overflow groove, so that the redundant packaging glue in the first overflow groove is introduced into the second guide cylinder, and the packaging glue is uniformly smeared on the surface of the linkage plate through the third guide pipe for the adhesion of the first diamond film plate and the first shell, thereby improving the packaging efficiency of a plurality of groups of wafers.
4. Through linkage board activity joint at the inner wall of first assembly groove for the effect of adhesion encapsulation glue to when rotatory through the bolt countersunk head, make the effect of lead screw synchronous rotation internal thread hole, make linkage board sliding connection in the effect of the different positions of first assembly inslot, improved the efficiency that linkage board and second draft tube separated, make the linkage board dismantle the back, conveniently with two sets of wafer boards and first casing in the quick separation.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows a schematic structural diagram of a chip package structure for multi-level diamond radiation overload protection according to an embodiment of the present invention.
Fig. 2 shows a schematic structural diagram of a die holder assembly according to an embodiment of the invention.
Fig. 3 shows a schematic structural view of a base unit according to an embodiment of the present invention.
Fig. 4 is an enlarged schematic view showing a partial structure of the base unit according to the embodiment of the present invention.
Fig. 5 shows a schematic structural view of a moving part according to an embodiment of the present invention.
FIG. 6 is a schematic diagram of the structure of the base layer mechanism according to the embodiment of the present invention.
Fig. 7 shows a schematic structural view of a first guide cylinder according to an embodiment of the present invention.
Fig. 8 shows a cross-sectional view of a second pod of an embodiment of the present invention.
FIG. 9 is a schematic diagram of a second diamond diaphragm according to an embodiment of the present invention.
Fig. 10 shows a schematic structural view of a third guide cylinder according to an embodiment of the present invention.
In the figure: 1. a die holder assembly; 11. a base mechanism; 111. a first housing; 112. a stitch; 113. a needle column; 114. a first fitting groove; 115. a second fitting groove; 116. a limiting block; 117. an internal threaded hole; 118. a moving part; 1181. a linkage plate; 1182. a linkage block; 1183. a bolt countersunk head; 1184. a screw rod; 12. a lower base layer mechanism; 121. a first diamond diaphragm plate; 122. a third fitting groove; 123. a first overflow trough; 124. a first guide cylinder; 125. a first draft tube; 126. a second guide cylinder; 127. a second flow guide pipe; 128. a third draft tube; 13. an upper base layer mechanism; 131. a second diamond diaphragm plate; 132. a power receiving groove; 133. a fourth fitting groove; 134. a second overflow trough; 135. a third guide cylinder; 136. a fourth draft tube; 2. a radiation resistant panel.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the invention provides a chip packaging structure for multistage diamond radiation overload resistance, which comprises a die holder component 1; as illustrated by way of example in fig. 1.
The die holder assembly 1 is of a rectangular open structure, a radiation-resistant plate 2 is movably clamped at the top opening of the die holder assembly 1, and the radiation-resistant plate 2 is synthesized by glycol benzoate and fiber glass.
The die holder assembly 1 comprises a base mechanism 11, a lower base mechanism 12 and an upper base mechanism 13; as illustrated by way of example in fig. 2.
The base mechanism 11 is of an open structure, the lower base mechanism 12 is movably clamped at the bottom end of the inner wall of the base mechanism 11, the upper base mechanism 13 is movably clamped at the top end of the inner wall of the base mechanism 11, and the bottom of the upper base mechanism 13 is movably attached to and communicated with the top of the lower base mechanism 12.
Specifically, the lower base mechanism 12 is movably attached to the upper base mechanism 13 and connected to the inner wall of the base mechanism 11, when the upper base mechanism 13 is filled with the packaging glue, the glue in the upper base mechanism 13 can uniformly flow into the lower base mechanism 12, and the lower base mechanism 12 is adhered and fixed to the inner wall of the base mechanism 11, so that the base mechanism 11, the lower base mechanism 12 and the upper base mechanism 13 play a role in synchronous packaging when the packaging glue is filled in one time.
The base mechanism 11 includes a first housing 111; as illustrated by way of example in fig. 3 and 4.
The outer wall fixedly connected with a plurality of groups of stitch 112 of first casing 111, a plurality of groups the stitch 112 distributes around the outer wall of first casing 111, the inner wall fixedly connected with a plurality of groups of spike 113 of first casing 111, and a plurality of groups of spike 113 all with a plurality of groups of stitch 112 electric connection, first fitting groove 114 has all been seted up to the inner wall corner of first casing 111, the second fitting groove 115 has all been seted up near the corner in the top of first casing 111, just second fitting groove 115 communicates each other with first fitting groove 114, the inner wall bottom fixedly connected with stopper 116 of second fitting groove 115 just the internal thread hole 117 that communicates each other with first casing 111 has been seted up on the surface of stopper 116, a plurality of groups all movable joint has moving part 118 in first fitting groove 114 and the second fitting groove 115.
The moving part 118 includes a linkage plate 1181; as illustrated by way of example in fig. 5.
The linkage plate 1181 is of a fan-shaped structure, the linkage plate 1181 is movably clamped on the inner wall of the first assembly groove 114, a linkage block 1182 is fixedly connected to the outer wall of the linkage plate 1181 and one side, close to the second assembly groove 115, of the linkage plate 1181, the linkage block 1182 is movably attached to the inner wall of the second assembly groove 115, a bolt countersunk head 1183 is rotatably connected to the linkage block 1182, one end of the bolt countersunk head 1183 is fixedly connected with a screw rod 1184, and the screw rod 1184 is in threaded connection with the inner threaded hole 117.
Specifically, the linkage plate 1181 is movably clamped on the inner wall of the first assembly groove 114, and is used for adhering the function of packaging glue, and the screw rod 1184 is synchronously rotated under the action of the screw rod 1183 in the internal threaded hole 117 while rotating, so that the linkage plate 1181 is slidingly connected with the functions of different positions in the first assembly groove 114.
The lower base layer mechanism 12 includes a first diamond diaphragm plate 121; as illustrated in fig. 6, 7 and 8.
The first diamond diaphragm plate 121 is of a rectangular structure, the first diamond diaphragm plate 121 is movably clamped on the inner wall of the first shell 111, the surface of the first diamond diaphragm plate 121 is provided with a plurality of groups of third assembly grooves 122, the groups of third assembly grooves 122 are distributed at the corners of the first diamond diaphragm plate 121, the inner wall of the third assembly grooves 122 is provided with a first overflow groove 123, the first overflow groove 123 coincides with the central axis of the third assembly grooves 122, a first guide tube 124 is embedded and installed at the central axis center of the first diamond diaphragm plate 121, the top of the first guide tube 124 is of an open structure, the outer wall of the first guide tube 124 is fixedly and communicated with a plurality of groups of first guide tubes 125, the end parts of the first guide tubes 125 are all extended to the corners of the first overflow groove 123, the surface of the first diamond diaphragm plate 121 is embedded and installed with a second guide tube 126, the second guide tube 126 is distributed at the corners of the first diamond diaphragm plate 121, one side wall of the second guide tube 126 is fixedly and is communicated with a plurality of second guide tubes 127, the second guide tube 128 is communicated with the other side wall of the first guide tube 121, and the first guide tube 128 is communicated with the other side wall of the first guide tube 128.
Specifically, the first guiding tube 124 is configured to store the injected packaging glue, and enable the packaging glue to flow into the first overflow groove 123 through the first guiding tube 125, fix the packaging chips of the plurality of groups of third assembling grooves 122, and drain the packaging glue in the first overflow groove 123 by using the second guiding tube 127 at the corner of the other end of the first overflow groove 123, so that the excessive packaging glue in the first overflow groove 123 is introduced into the second guiding tube 126, and uniformly spread the packaging glue on the surface of the linkage plate 1181 through the third guiding tube 128, so as to be used for the adhesion between the first diamond diaphragm plate 121 and the first casing 111.
The upper base layer mechanism 13 comprises a second diamond diaphragm plate 131; as illustrated in fig. 9 and 10.
The second diamond diaphragm plate 131 is of a rectangular structure, the second diamond diaphragm plate 131 is movably clamped on the inner wall of the first shell 111, a plurality of groups of electric connecting grooves 132 are formed in the outer wall of the second diamond diaphragm plate 131, a plurality of groups of electric connecting grooves 132 are movably and fixedly connected to the outer wall of the needle column 113, a plurality of groups of fourth assembling grooves 133 are formed in the surface of the second diamond diaphragm plate 131, a plurality of groups of fourth assembling grooves 133 are distributed at corners of the second diamond diaphragm plate 131, a second overflow groove 134 is formed in the inner wall of the fourth assembling groove 133, the central axis of the second overflow groove 134 coincides with the central axis of the fourth assembling groove 133, a third guide cylinder 135 is embedded in the central axis center of the second diamond diaphragm plate 131, a plurality of groups of fourth guide pipes 136 are fixedly connected to the outer wall of the third guide cylinder 135, the ends of the fourth guide pipes 136 extend to the corners of the second overflow groove 134, two ends of the third guide cylinder 135 are of an open structure, and the bottom of the third guide cylinder 135 is mutually communicated with the top 124 of the first guide cylinder.
Specifically, the top opening of the third guide cylinder 135 is used for injecting packaging glue, so that the injected packaging glue is distributed into the second overflow groove 134 on one side through the fourth guide pipes 136, the chip placed in the fourth assembly groove 133 is fixed, and the bottom of the third guide cylinder 135 is mutually communicated with the top of the first guide cylinder 124, so that the packaging glue can be synchronously injected into the first guide cylinder 124, and the packaging glue is used for synchronously injecting glue for multiple groups of wafer plates.
The chip packaging structure for resisting radiation overload of the multistage diamond provided by the embodiment of the invention has the following working principle:
The packaging glue is injected through the top opening of the third guide cylinder 135, so that the injected packaging glue is distributed into the second overflow groove 134 on one side through a plurality of groups of fourth guide pipes 136, the chip placed in the fourth assembly groove 133 is fixed, the bottom of the third guide cylinder 135 is communicated with the top of the first guide cylinder 124, the packaging glue can be synchronously injected into the first guide cylinder 124, and the packaging glue is used for the synchronous glue injection of a plurality of groups of wafer plates;
The first guide tube 124 is used for storing the injected packaging glue, the packaging glue flows into the first overflow groove 123 through the first guide tube 125, the packaging chips of the plurality of groups of third assembly grooves 122 are fixed, the packaging glue in the first overflow groove 123 is guided by the second guide tube 127 at the corner of the other end of the first overflow groove 123, the redundant packaging glue in the first overflow groove 123 is introduced into the second guide tube 126, and the packaging glue is uniformly smeared on the surface of the linkage plate 1181 through the third guide tube 128 for the adhesion of the first diamond diaphragm plate 121 and the first shell 111;
The linkage plate 1181 is movably clamped on the inner wall of the first assembly groove 114 and is used for adhering the function of packaging glue, and the screw rod 1184 synchronously rotates under the action of the screw rod 1183 in the internal threaded hole 117 while rotating, so that the linkage plate 1181 is in sliding connection with different positions in the first assembly groove 114.
On the basis of the multi-stage diamond radiation overload resistant chip packaging structure, the embodiment of the invention also provides a multi-stage diamond radiation overload resistant chip packaging method which comprises the following steps,
The lower base layer mechanism and the upper base layer mechanism are movably attached to the inner wall of the base mechanism, and packaging glue is injected into the upper base layer mechanism, so that the packaging glue uniformly flows into the lower base layer mechanism;
The lower base layer mechanism is adhered and fixed on the inner wall of the base mechanism, so that the base mechanism, the lower base layer mechanism and the upper base layer mechanism are filled with packaging glue at one time.
Although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (2)
1. A multistage diamond radiation overload resistant chip packaging structure is characterized in that: comprises a die holder assembly (1); the die holder assembly (1) is of a rectangular open structure, and a radiation-resistant plate (2) is movably clamped at the top opening of the die holder assembly (1); the die holder assembly (1) comprises a base mechanism (11), a lower base layer mechanism (12) and an upper base layer mechanism (13); the base mechanism (11) is of an open structure, the lower base mechanism (12) is movably clamped at the bottom end of the inner wall of the base mechanism (11), the upper base mechanism (13) is movably clamped at the top end of the inner wall of the base mechanism (11), and the bottom of the upper base mechanism (13) is movably attached to and communicated with the top of the lower base mechanism (12);
The base mechanism (11) includes a first housing (111); the outer wall of the first shell (111) is fixedly connected with a plurality of groups of pins (112), the plurality of groups of pins (112) are distributed and installed around the outer wall of the first shell (111), the inner wall of the first shell (111) is fixedly connected with a plurality of groups of needle columns (113), and the plurality of groups of needle columns (113) are electrically connected with the plurality of groups of pins (112);
a first assembly groove (114) is formed in the corner of the inner wall of the first shell (111), a second assembly groove (115) is formed in the position, close to the corner, of the top of the first shell (111), and the second assembly groove (115) is communicated with the first assembly groove (114);
a limiting block (116) is fixedly connected to the bottom end of the inner wall of the second assembly groove (115), an internal thread hole (117) communicated with the first shell (111) is formed in the surface of the limiting block (116), and a plurality of groups of the first assembly grooves (114) and the second assembly grooves (115) are movably clamped with a moving part (118);
The moving part (118) comprises a linkage plate (1181); the linkage plate (1181) is of a fan-shaped structure, the linkage plate (1181) is movably clamped on the inner wall of the first assembly groove (114), a linkage block (1182) is fixedly connected to the outer wall of the linkage plate (1181) and close to one side of the second assembly groove (115), the linkage block (1182) is movably attached to the inner wall of the second assembly groove (115), a bolt countersunk head (1183) is rotatably connected to the linkage block (1182), a screw rod (1184) is fixedly connected to one end of the bolt countersunk head (1183), and the screw rod (1184) is in threaded connection with the inner threaded hole (117);
The lower base layer mechanism (12) comprises a first diamond diaphragm plate (121); the first diamond diaphragm plate (121) is of a rectangular structure, the first diamond diaphragm plate (121) is movably clamped on the inner wall of the first shell (111), the surface of the first diamond diaphragm plate (121) is provided with a plurality of groups of third assembly grooves (122), the groups of third assembly grooves (122) are distributed at the corners of the first diamond diaphragm plate (121), the inner wall of the groups of third assembly grooves (122) is provided with a first overflow groove (123), the first overflow groove (123) coincides with the central axis of the third assembly grooves (122), a first guide cylinder (124) is embedded and installed at the central axis center of the first diamond diaphragm plate (121), and the top of the first guide cylinder (124) is of an open structure;
The outer wall of the first guide cylinder (124) is fixed and communicated with a plurality of groups of first guide pipes (125), the end parts of the plurality of groups of first guide pipes (125) are all extended to the corners of the first overflow groove (123), the surface of the first diamond diaphragm plate (121) is embedded and provided with a second guide cylinder (126), the second guide cylinder (126) is distributed at the corners of the first diamond diaphragm plate (121), one side wall of the second guide cylinder (126) is fixed and communicated with a second guide pipe (127), one end of the second guide pipe (127) is mutually communicated with the corners of the first overflow groove (123), the other side wall of the second guide cylinder (126) is fixed and communicated with a plurality of groups of third guide pipes (128), and the plurality of groups of third guide pipes (128) are all extended to the outer wall of the first diamond diaphragm plate (121);
The upper base layer mechanism (13) comprises a second diamond diaphragm plate (131); the second diamond film plate (131) is of a rectangular structure, the second diamond film plate (131) is movably clamped on the inner wall of the first shell (111), a plurality of groups of electric connecting grooves (132) are formed in the outer wall of the second diamond film plate (131), the electric connecting grooves (132) are movably attached to the outer wall of the needle column (113), a plurality of groups of fourth assembling grooves (133) are formed in the surface of the second diamond film plate (131), and the fourth assembling grooves (133) are distributed at corners of the second diamond film plate (131);
The inner wall of fourth mounting groove (133) has seted up second overflow launder (134), just the axis of second overflow launder (134) coincides with the axis of fourth mounting groove (133), third draft tube (135) are installed in the central axis center department embedding of second diamond lamina membranacea (131), the outer wall fixedly connected with of third draft tube (135) a plurality of fourth honeycomb ducts (136), a plurality of sets of the tip of fourth honeycomb duct (136) extends to the corner of second overflow launder (134), the both ends of third draft tube (135) are open structure, just the bottom of third draft tube (135) communicates each other with the top of first draft tube (124).
2. A method of packaging a chip protected from radiation overload by the multi-level diamond of claim 1, wherein: the packaging method comprises the following steps:
The lower base layer mechanism and the upper base layer mechanism are movably attached to the inner wall of the base mechanism, and packaging glue is injected into the upper base layer mechanism, so that the packaging glue uniformly flows into the lower base layer mechanism;
The lower base layer mechanism is adhered and fixed on the inner wall of the base mechanism, so that the base mechanism, the lower base layer mechanism and the upper base layer mechanism are filled with packaging glue at one time.
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