CN117696786A - Diamond wire bonding equipment and bonding method - Google Patents

Abstract

The invention provides diamond wire bonding equipment and a bonding method, belongs to the technical field of wire bonding, and solves the problem that the quality of a finished product of a diamond wire bonding wire in the prior art is poor. The invention includes a substrate; the clamping assembly, clamping assembly set up in base plate top and be 2 at least groups for centre gripping buddha's warrior attendant line, every group clamping assembly includes: the clamping bodies are at least 2; the clamping driving mechanism drives the clamping bodies to be close to or far away from each other; the cutting assembly is provided with a cutting area, and the cutting area is arranged between at least 2 groups of clamping assemblies so as to cut the diamond wire clamped by the clamping assemblies; the detection assembly is arranged at the outer side of the clamping assembly and is used for acquiring the section information of the diamond wire; and the centering assembly is arranged below the clamping assembly and can drive at least 1 group of clamping assemblies to move and center with the rest clamping assemblies according to the tangent plane information of the diamond wire.

Description

Diamond wire bonding equipment and bonding method

Technical Field

The invention belongs to the technical field of wire welding, and particularly relates to diamond wire welding equipment and a wire welding method.

Background

The diamond wire is widely applied to the photovoltaic field, and particularly applied to cutting of hard and brittle materials such as crystalline silicon and the like. The diamond wire is easy to break in the process of cutting the hard and brittle material, and the broken diamond wire needs to be re-welded by using a wire welding device after the wire breaking, so that the cutting operation can be continuously finished.

At present, a diamond wire welding machine generally adopts a welding mode of resistance butt welding, two diamond wires are clamped in the mode, meanwhile, a clamping material is used as an electrode material, the end parts of the two diamond wires are mutually butted through a driving mechanism, the two diamond wires are electrified and an upsetting force is applied, and the two diamond wires are melted and welded by utilizing heat generated by a large resistance at the contact position of the diamond wires.

The welding wire flow in the prior art is as follows: firstly, cutting the end parts of two diamond wires to enable the end surfaces to be flat, then manually placing the two diamond wires in the clamping grooves respectively, observing the positions of the diamond wires on the display screen, rotating down the handle after adjusting the positions to enable the pressing blocks on the upper sides to press the diamond wires, and manually adjusting the positions of the clamping mechanisms on the two sides through the movable platform to enable the end parts of the two diamond wires to be in butt joint. Then, in the working flow, the diamond wire is manually placed, the length of the section extending out of the clamping block is not well controlled, if the section extending out is too long, the section is easily influenced by upsetting force during welding to generate bending, the probability of welding failure is higher, and even if the welding is successful, the tensile strength of the welded diamond wire is greatly reduced; if the protrusion is too short, it is difficult to butt the two diamond wires or a proper welding space cannot be provided.

Based on the above, the technical problem to be solved in the present application is: how to improve the quality of the finished product of the diamond wire bonding wire.

Disclosure of Invention

The invention aims to solve the problems in the prior art, provides diamond wire bonding equipment and a bonding method, and solves the problem that the quality of a finished product of a diamond wire bonding wire in the prior art is poor. The technical effect of this application scheme is: the quality of the finished product of the diamond wire bonding wire can be improved.

The aim of the invention can be achieved by the following technical scheme: a diamond wire bonding apparatus includes a substrate; the clamping assembly, the clamping assembly set up in base plate top just is 2 at least groups for centre gripping buddha's warrior attendant line, every group clamping assembly includes: the clamping bodies are at least 2; the clamping driving mechanism drives the clamping bodies to be close to or far away from each other; the cutting assembly is provided with a cutting area, and the cutting area is arranged between at least 2 groups of clamping assemblies so as to cut the diamond wire clamped by the clamping assemblies; the detection assembly is arranged at the outer side of the clamping assembly and is used for acquiring the section information of the diamond wire; and the centering component is arranged below the clamping component and can drive at least 1 group of clamping components to movably center with the rest clamping components according to the tangent plane information of the diamond wire.

It is understood that the base plate is used to mount clamping assemblies, centering assemblies, and the like. The clamping assembly is used as a fixing structure before the diamond wire is welded, an operator manually or automatically places the diamond wire on one of the clamping bodies by a mechanical arm, and then the clamping driving mechanism drives one of the clamping bodies to approach the other clamping body in the same group of clamping assemblies until the two clamping bodies abut against each other to finish clamping and fixing the diamond wire. After the clamping assembly clamps and fixes the diamond wire, the clamping and fixing diamond wire is cut off through the wire cutting assembly. It should be noted that the cut diamond wire end surface should be ensured to be flat, so that subsequent butt welding is facilitated. After the tangent line of the tangent line assembly is finished, the detection assembly detects the diamond wire to obtain tangent plane information, and the tangent plane information at least comprises the position and the gradient of the tangent plane. It is understood that the centering component and the detecting component are electrically connected or in communication, or the information processing and the exchange are realized through the processor in the middle, and the centering operation is performed after the centering component obtains the section information. It should be noted that, after the diamond wire is cut, a part of the diamond wire still extends out of the clamping body, and the extending part of the diamond wire is offset to a certain direction due to the cutting action, so that the centering component has at least 2 degrees of freedom of movement, in some embodiments, 3 degrees of freedom of movement in directions, so as to adjust the position of the clamping component, namely, the position of one of the diamond wires, thereby ensuring that the tangential surfaces of two diamond wires to be welded are aligned, improving the parallelism of the two diamond wires during welding, and the welded diamond wire has stronger tensile strength. In some embodiments, the tangent assembly is a contact cut, such as a hard cut, and in other embodiments, the tangent assembly is a non-contact cut, such as a laser cut.

In the above-mentioned wire bonding equipment for diamond wire, each group of clamping assemblies has at least 2 wire grooves, at least 2 wire grooves are arranged independently of each other, and the extending direction of the wire grooves faces the adjacent clamping assemblies.

It will be appreciated that the meaning of having 2 wire grooves per set of clamping assemblies is that a single wire groove can be used to hold one diamond wire, 2 diamond wires per set of clamping assemblies, and 2 sets of clamping assemblies can simultaneously clamp two portions of 2 diamond wires.

In the above-mentioned buddha's warrior attendant line bonding wire equipment, every group the clamping component be equipped with the centre gripping groove between the clamping body, be equipped with the locating piece in the centre gripping groove, be equipped with on the locating piece the wire casing, the locating piece protrusion in the clamping groove, just the width of wire casing is the trend of shrink gradually or expansion in the centre gripping direction of clamping body, the bottom of wire casing with the clamping face of clamping body is basically flush.

It is understood that the wire groove mainly plays a role in positioning the radial position of the diamond wire, and prevents the diamond wire from moving along the radial direction of the diamond wire when the clamping body clamps the diamond wire. The wire grooves are preferably configured to be V-shaped, the V-shaped wire grooves can guide the diamond wires, the diamond wires are more convenient to place and position, a plurality of parallel wire grooves can be formed in each positioning block, and the number of the wire grooves is specifically determined by the number of the welding wires. In some embodiments, the trunking may also be adaptively configured to be U-shaped, Y-shaped, etc. The top of the positioning block is arranged to be protruded from the clamping surface of the clamping body, so that paying-off and positioning are facilitated, and the bottom of the wire slot is flush with the clamping surface, so that the clamped diamond wire part in the clamping body is prevented from being bent. In addition, through setting up the grip slot in the centre gripping body to with locating piece embedding grip slot in, conveniently separate independent processing uneven locating piece and the centre gripping body, guarantee machining precision, avoid influencing the form under the diamond wire clamping state.

In the above-mentioned diamond wire bonding equipment, the tangent line subassembly includes: a tool apron; the cutter is hinged to the cutter holder, and the cutting area is formed between the cutter holder and the cutter; the knife moving mechanism acts on the knife holder to drive the knife holder to be close to or far away from the clamping assembly.

It will be appreciated that the blade holder is adapted to support the cutter and at the same time provide a stable cutting platform for the cutter, the cutter being hinged to the blade holder, so that the cutting path of the cutter is ensured to be stable, and the cutting zone formed between the blade holder and the cutter is substantially controllable. The cutter moving mechanism is used for driving the cutter holder to move, so that in the tangent stage, a cutting area between the cutter and the cutter holder is ensured to be positioned between the two clamping assemblies, when tangent is completed, the two clamping assemblies are required to be mutually close to drive the two diamond wires to butt against each other for welding wires, and the cutter moving mechanism can drive the cutter holder and the cutter to move to give way so as to provide a space for welding wires.

In the above-mentioned buddha's warrior attendant line bonding wire equipment, the blade holder with be equipped with cooperation structure between the clamping body, cooperation structure includes: the first matching part is arranged on the clamping body; the second matching part is arranged on the tool apron; the tool apron can move to enable the second matching part to be matched and abutted with the first matching part.

It can be appreciated that by providing a mating structure between the tool holder and the clamping body, the tool holder can be mated with the clamping body when moved to a certain position. Specifically, the shapes of the first matching part and the second matching part are matched with each other, and the connection relationship between the first matching part and the second matching part can be coupling, meshing or fitting. In some embodiments, the first mating portion and the second mating portion are provided with a guiding arcuate surface or plane. When the first matching part is matched and abutted with the second matching part, the spacing between the adjacent clamping bodies of the adjacent clamping assemblies can be ensured to be stable and controllable, and the positioning accuracy of the tangential position is further improved.

In the above-mentioned diamond wire bonding apparatus, the two side surfaces of the cutter have a first action portion and a second action portion, respectively, and the first action portion and the second action portion may be simultaneously ground with the respective adjacent clamping bodies to cut off the diamond wire. It will be appreciated that by providing the first and second action portions on both sides of the cutter, at least 2 end faces can be cut out simultaneously by 1 revolution of the cutter, and the length of the cut diamond wire segment is substantially equivalent to the spacing of the first and second action portions. In some embodiments, the first and second active portions are integrally connected, and in some embodiments, there is a gap between the first and second active portions.

In the above-mentioned buddha's warrior attendant line bonding wire equipment, the detection component includes: a first photographing unit aligned with the diamond wire photographing in a first direction; a second photographing unit aligned with the diamond wire photographing in a second direction; the first direction is basically vertical to the clamping surface of the clamping body, and the second direction is basically parallel to the clamping surface of the clamping body.

It can be understood that the first shooting unit and the second shooting unit respectively shoot the diamond wire at different positions, and the position and the inclination information of the section can be analyzed through the images obtained through shooting. The first direction and the second direction both point to the radial direction of the diamond wire, and the images shot by the first shooting unit and the second shooting unit are images in the length direction of the diamond wire. The precision of the first shooting unit and the second shooting unit is in the micron level.

In the above-mentioned diamond wire bonding equipment, the centering assembly includes: the first driving mechanism is arranged on the substrate, and the action direction of the first driving mechanism is parallel to the substrate; the second driving mechanism is arranged on the first driving mechanism, and the action direction of the second driving mechanism is parallel to the substrate and is mutually perpendicular to the action direction of the first driving mechanism; the third driving mechanism is arranged on the second driving mechanism, and the action direction of the third driving mechanism is perpendicular to the substrate; wherein, at least 1 group of clamping components are arranged on the third driving mechanism.

It will be appreciated that the first, second and third drive mechanisms are all linear drive mechanisms, preferably air or electric cylinders.

Another object of the present invention is to provide a wire bonding method, which is applied to the wire bonding apparatus, and includes the following steps: the clamping component clamps and fixes at least 2 diamond wires; cutting off the diamond wire in a clamping and fixing state by the wire cutting assembly; the detection component detects and acquires the section information of the diamond wire after cutting; the centering component adjusts the position of the clamping component so as to enable the tangential surfaces of at least 2 diamond wires to be in butt joint; at least 2 cutting faces are welded together to form a diamond wire.

It should be noted that the diamond wire bonding method of the present invention is clearly different from the prior art diamond wire bonding method in terms of flow. In the prior art, a mode of cutting first and then clamping and centering is adopted, the stretching length of the diamond wire placing clamping is difficult to control stably by naked eyes of operators, if the stretching length is too large, the diamond wire is easy to bend under the influence of the power-on top section force, and if the stretching length is too short, the welding difficulty is increased. According to the invention, through the processes of clamping, cutting and centering, the adopted tangent line assembly maintains a standard set gap with the clamping assembly in advance, so that the length of the diamond wire extending out of the clamping assembly after cutting is ensured to be within 0.3mm, when the tangent planes of the two diamond wires are in butt welding, bending cannot be generated due to the influence of the electrified upsetting force, and the welding success rate and the strength of a welded finished product can be effectively improved.

In the above diamond wire welding method, in the step of clamping and fixing at least 2 diamond wires by the clamping assembly, the at least 2 diamond wires are arranged in parallel, and both ends of the at least 2 diamond wires are clamped by the 2 groups of clamping assemblies.

It can be appreciated that in some embodiments, the number of diamond wires is 2, 2 diamond wires are placed in parallel and clamped, and each diamond wire passes through 2 clamping assemblies in the length direction, so that when the tangent assembly is cut, 2 diamond wires can be cut off simultaneously, and as the clamping fixing force provided by the 2 clamping assemblies for clamping simultaneously is more stable, the diamond wires are cut off more easily, and compared with the clamping of a single clamping mechanism, the situation similar to the situation of broken wire of a lotus root is difficult to occur.

Compared with the prior art, the invention has the following beneficial effects:

1. the cutting line assembly is adopted to maintain a standard set gap with the clamping assembly in advance by executing the processes of clamping, cutting and centering, so that the length of the diamond line extending out of the clamping assembly after cutting is ensured to be within 0.3mm, bending cannot be generated due to the influence of electrified upsetting force when the tangential surfaces of the two diamond lines are in butt welding, and the welding success rate and the strength of a welded finished product can be effectively improved;

2. the first matching part and the second matching part which can be matched and abutted are arranged, so that the stable and controllable distance between adjacent clamping bodies of adjacent clamping assemblies is ensured, and the positioning accuracy of the tangential position is further improved;

3. the top of the positioning block is arranged to be protruded from the clamping surface of the clamping body so as to facilitate paying-off and positioning, and the bottom of the wire slot is flush with the clamping surface so as to prevent the clamped diamond wire part in the clamping body from bending and reducing the tensile strength;

4. and the automatic operation of the whole welding wire process is realized through the cooperation of each module, so that the welding wire efficiency is improved.

Drawings

Fig. 1 is a schematic perspective view of a diamond wire bonding apparatus according to the present invention;

fig. 2 is a schematic diagram showing a three-dimensional structure of a wire bonding apparatus according to the present invention;

FIG. 3 is a schematic perspective view of a centering assembly of the present invention;

FIG. 4 is a schematic perspective view of a clamping assembly of the present invention;

FIG. 5 is a schematic perspective view of the hidden portion of FIG. 4;

FIG. 6 is a schematic perspective view of a tangential component of the present invention;

FIG. 7 is a schematic perspective view of a cutter and a holder according to the present invention;

fig. 8 is a schematic view of a three-dimensional structure of the diamond wire bonding apparatus of the present invention when cutting wires;

FIG. 9 is a schematic perspective view of the hidden portion of FIG. 8;

FIG. 10 is a schematic view of an image of a tangent line captured by the detection assembly of the present invention;

FIG. 11 is a flow chart of a bonding wire method of the present invention;

in the figure, 100, a substrate; 200. a clamping assembly; 210. a clamping body; 211. a clamping surface; 220. a clamping driving mechanism; 230. a clamping groove; 240. a positioning block; 241. a wire slot; 300. a thread cutting assembly; 310. a cutting zone; 320. a tool apron; 330. a cutter; 331. a first action part; 332. a second action part; 340. a knife moving mechanism; 400. a detection assembly; 410. a first photographing unit; 420. a second photographing unit; 500. centering components; 510. a first driving mechanism; 520. a second driving mechanism; 530. a third driving mechanism; 600. a mating structure; 610. a first mating portion; 620. and a second mating portion.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Referring to fig. 1 and 2 of the drawings, the diamond wire bonding apparatus of the present application specifically includes a substrate 100, a clamping assembly 200, a detecting assembly 400, and a centering assembly 500. The clamping assemblies 200 are disposed above the substrate 100 and are at least 2 groups for clamping diamond wires, each group of clamping assemblies 200 comprises at least 2 clamping bodies 210 and at least 1 clamping driving mechanism 220, and the clamping driving mechanisms 220 drive the clamping bodies 210 to be close to or far from each other; the wire cutting assembly 300 has a cutting area 310, and the cutting area 310 is disposed between at least 2 groups of clamping assemblies 200 to cut the diamond wire clamped by the clamping assemblies 200; the detecting assembly 400 is arranged outside the clamping assembly 200 and is used for acquiring the section information of the diamond wire; the centering component 500 is disposed below the clamping component 200, and can drive at least 1 group of clamping components 200 to movably center with the rest of clamping components 200 according to the cutting plane information of the diamond wire.

It is understood that the base plate 100 is used to mount the clamping assembly 200, centering assembly 500, and the like. The clamping assembly 200 is used as a fixing structure before diamond wire welding, an operator manually or automatically places the diamond wire on one of the clamping bodies 210 by a mechanical arm, and then the clamping driving mechanism 220 drives one of the clamping bodies 210 to approach the other clamping body 210 in the same group of clamping assemblies 200 until the two clamping bodies 210 abut against each other to finish clamping and fixing the diamond wire. After the clamping assembly 200 clamps and fixes the diamond wire, the clamped and fixed diamond wire is cut off by the wire cutting assembly 300. It should be noted that the cut diamond wire end surface should be ensured to be flat, so that subsequent butt welding is facilitated. After the cutting of the cutting assembly 300 is completed, the detecting assembly 400 detects the diamond wire to obtain the cutting plane information, and the cutting plane information at least comprises the position and the inclination of the cutting plane. It will be appreciated that the centering component 500 is electrically or communicatively connected to the detecting component 400, or the information processing and exchanging are realized by a processor in the middle, and the centering component 500 performs centering operation after obtaining the section information. It should be noted that, after the diamond wire is cut, a part of the diamond wire still extends out of the clamping body 210, and the extending part of the diamond wire is offset to a certain direction due to the cutting action, so the centering assembly 500 has at least 2 degrees of freedom of movement, in some embodiments, 3 degrees of freedom of movement, so as to adjust the position of the clamping assembly 200, i.e. adjust the position of one of the diamond wires, thereby ensuring that the tangential planes of two diamond wires to be welded are aligned, improving the parallelism of the two diamond wires during welding, and the welded diamond wire has stronger tensile strength. In some embodiments, the wire cutting assembly 300 is a contact cut, such as a hard cut, and in other embodiments, the wire cutting assembly 300 is a non-contact cut, such as a laser cut.

With continued reference to fig. 1 and 2, the detection assembly 400 includes: a first photographing unit 410 and a second photographing unit 420, the first photographing unit 410 aligned with the diamond wire photographing in a first direction, and the second photographing unit 420 aligned with the diamond wire photographing in a second direction; wherein the first direction is substantially perpendicular to the clamping surface 211 of the clamping body 210, and the second direction is substantially parallel to the clamping surface 211 of the clamping body 210. It can be understood that the first photographing unit 410 and the second photographing unit 420 photograph the diamond wire at different positions, respectively, and the position and inclination information of the cutting plane can be analyzed through the photographed images. The first direction and the second direction both point to the radial direction of the diamond wire, and the images obtained by the first shooting unit 410 and the second shooting unit 420 are images in the length direction of the diamond wire. The accuracy of the first photographing unit 410 and the second photographing unit 420 is in the order of micrometers.

Referring to fig. 3, the centering assembly 500 includes: the first driving mechanism 510, the first driving mechanism 510 is disposed on the substrate 100, and the acting direction of the first driving mechanism 510 is parallel to the substrate 100; the second driving mechanism 520, the second driving mechanism 520 is disposed on the first driving mechanism 510, and the acting direction of the second driving mechanism 520 is parallel to the substrate 100 and is perpendicular to the acting direction of the first driving mechanism 510; and a third driving mechanism 530, wherein the third driving mechanism 530 is disposed on the second driving mechanism 520, and the acting direction of the third driving mechanism 530 is perpendicular to the substrate 100; wherein at least 1 set of clamping assemblies 200 is disposed on the third drive mechanism 530. It is understood that the first driving mechanism 510, the second driving mechanism 520, and the third driving mechanism 530 are all linear driving mechanisms, preferably air cylinders or electric cylinders.

Referring to fig. 4 and 5, in the diamond wire bonding apparatus of the present application, each group of clamping assemblies 200 has at least 2 wire grooves 241, at least 2 wire grooves 241 are disposed independently of each other, and the extending direction of the wire grooves 241 faces the adjacent clamping assemblies 200. It will be appreciated that the meaning of providing 2 wire slots 241 per set of clamping assemblies 200 is that a single wire slot 241 can receive one diamond wire, 2 diamond wires per set of clamping assemblies 200, and 2 sets of clamping assemblies 200 can simultaneously clamp two portions of 2 diamond wires.

With continued reference to fig. 5, in some embodiments, a clamping groove 230 is disposed between the clamping bodies 210 of each set of clamping assemblies 200, a positioning block 240 is disposed in the clamping groove 230, a wire groove 241 is disposed on the positioning block 240, the positioning block 240 protrudes from the clamping groove 230, and the width of the wire groove 241 is gradually contracted or expanded in the clamping direction of the clamping body 210, and the bottom of the wire groove 241 is substantially flush with the clamping surface 211 of the clamping body 210.

It will be appreciated that the wire groove 241 serves primarily to locate the radial position of the wire and prevent the wire from bouncing along its radial direction when the clamping body 210 clamps the wire. The wire grooves 241 are preferably configured in a V shape, the V-shaped wire grooves 241 can guide and position the diamond wires more conveniently, and a plurality of parallel wire grooves 241 can be arranged on each positioning block 240, and the number of the wire grooves 241 is specifically determined by the number of the welding wires. In some embodiments, the wire chase 241 may also be adaptively configured in a U-shape, Y-shape, or the like. The top of the positioning block 240 is configured to be protruded from the clamping surface 211 of the clamping body 210, so that paying-off positioning is facilitated, and the bottom of the wire groove 241 is flush with the clamping surface 211, so that the clamped diamond wire part in the clamping body 210 is prevented from bending. In addition, by arranging the clamping groove 230 in the clamping body 210 to embed the positioning block 240 into the clamping groove 230, the positioning block 240 and the clamping body 210 with uneven height can be conveniently and independently processed, the processing precision is ensured, and the influence on the state of clamping the diamond wire is avoided.

Referring to fig. 6, the tangent line assembly 300 includes: a knife holder 320, a knife 330, and a knife shifting mechanism 340. The cutter 330 is hinged to the cutter holder 320, a cutting area 310 is formed between the cutter holder 320 and the cutter 330, and the cutter moving mechanism 340 acts on the cutter holder 320 to drive the cutter holder 320 to approach or separate from the clamping assembly 200. It will be appreciated that the blade holder 320 is configured to support the cutting blade 330 while providing a stable cutting platform for the cutting blade 330, and that hinging the cutting blade 330 to the blade holder 320 ensures that the cutting path of the cutting blade 330 is stable and that the cutting zone 310 formed between the blade holder 320 and the cutting blade 330 is substantially controllable. The knife moving mechanism 340 is used for driving the knife holder 320 to move, so that in the wire cutting stage, the cutting area 310 between the knife holder 320 and the knife holder 330 is ensured to be positioned between the two clamping assemblies 200, when the wire cutting is completed, the two clamping assemblies 200 need to be mutually close to drive the two diamond wires to butt against each other for welding wires, and the knife moving mechanism 340 can drive the knife holder 320 and the knife 330 to move to yield to provide a space for welding wires.

Referring to fig. 7, the cutter 330 has first and second operating parts 331 and 332 at both side surfaces thereof, respectively, and the first and second operating parts 331 and 332 may be simultaneously ground with the respective adjacent clamping bodies 210 to cut off the diamond wire. It will be appreciated that by providing the first and second action portions 331 and 332 on both sides of the cutter 330, at least 2 end faces can be cut simultaneously by rotating the cutter 330 1 time, and the length of the cut diamond wire is substantially equal to the distance between the first and second action portions 331 and 332. In some embodiments, the first and second active portions 331 and 332 are integrally connected, and in some embodiments, there is a gap between the first and second active portions 331 and 332.

Referring to fig. 8 and 9, a mating structure 600 is provided between the tool holder 320 and the clamping body 210, and the mating structure 600 includes: the first engaging portion 610 and the second engaging portion 620, wherein the first engaging portion 610 is disposed on the clamping body 210, and the second engaging portion 620 is disposed on the tool holder 320; the tool holder 320 is movable such that the second engaging portion 620 engages with the first engaging portion 610. It is understood that the engagement structure 600 is disposed between the tool holder 320 and the clamping body 210, so that the tool holder 320 can be engaged with the clamping body 210 when moved to a certain position. Specifically, the shapes of the first mating portion 610 and the second mating portion 620 are matched with each other, and the connection relationship between the two may be coupling, meshing or fitting. In some embodiments, the first mating portion 610 and the second mating portion 620 are provided with a guided arcuate surface or plane. When the first matching portion 610 and the second matching portion 620 are matched and abutted, the spacing between the adjacent clamping bodies 210 of the adjacent clamping assemblies 200 can be ensured to be stable and controllable, so that the positioning accuracy of the tangential position is improved.

Referring to fig. 11, the diamond wire bonding method of the present invention specifically includes the following steps: the clamping assembly 200 clamps and fixes at least 2 diamond wires; the wire cutting assembly 300 cuts off the diamond wire in the clamped and fixed state; the detection component 400 detects and acquires the section information of the diamond wire after cutting; centering assembly 500 adjusts the position of clamping assembly 200 to dock the cut surfaces of at least 2 diamond wires; at least 2 cutting faces are welded together to form a diamond wire.

It should be noted that the diamond wire bonding method of the present invention is clearly different from the prior art diamond wire bonding method in terms of flow. In the prior art, a mode of cutting first and then clamping and centering is adopted, the stretching length of the diamond wire placing clamping is difficult to control stably by naked eyes of operators, if the stretching length is too large, the diamond wire is easy to bend under the influence of the power-on top section force, and if the stretching length is too short, the welding difficulty is increased. In the invention, through the processes of clamping, cutting and centering, the adopted tangent line assembly 300 maintains a standard set gap with the clamping assembly 200 in advance, so that the length of the diamond wire extending out of the clamping assembly 200 after cutting is ensured to be within 0.3mm, and when the tangential surfaces of the two diamond wires are in butt welding, bending can not be generated due to the influence of the electrified upsetting force, and the welding success rate and the strength of the welded finished product can be effectively improved.

In the diamond wire bonding method of the present invention, in the step of clamping and fixing at least 2 diamond wires by the clamping assembly 200, at least 2 diamond wires are arranged in parallel with each other, and both ends of at least 2 diamond wires are clamped by the 2 groups of clamping assemblies 200. It will be appreciated that in some embodiments, the number of diamond wires is 2, 2 diamond wires are placed and clamped in parallel, and each diamond wire passes through 2 clamping assemblies 200 in the length direction, so that when the tangent assembly 300 cuts, 2 diamond wires can be cut simultaneously, and the clamping fixing force provided by the simultaneous clamping of 2 clamping assemblies 200 is more stable and is easier to cut, compared with the clamping of a single clamping mechanism, the situation similar to the situation of broken wires of a lotus root is less likely to occur.

The beneficial effects are that: according to the invention, through the processes of clamping, cutting and centering, the adopted tangent line assembly 300 maintains a standard set gap with the clamping assembly 200 in advance, so that the length of a diamond wire extending out of the clamping assembly 200 after cutting is ensured to be within 0.3mm, when the tangential surfaces of two diamond wires are in butt welding, bending is not generated due to the influence of electrified upsetting force, and the welding success rate and the strength of a welded finished product can be effectively improved; by arranging the first matching part 610 and the second matching part 620 which can be matched and abutted, the stable and controllable spacing between the adjacent clamping bodies 210 of the adjacent clamping assemblies 200 is ensured, and the positioning precision of the tangential position is further improved; the top of the positioning block 240 is configured to be protruded from the clamping surface 211 of the clamping body 210, so that paying-off positioning is facilitated, and the bottom of the wire groove 241 is flush with the clamping surface 211, so that the clamped diamond wire part in the clamping body 210 is prevented from bending to reduce the tensile strength.

The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims (10)

1. A wire bonding apparatus comprising:

a substrate (100);

clamping assembly (200), clamping assembly (200) set up in base plate (100) top and be 2 at least groups for centre gripping buddha's warrior attendant line, every group clamping assembly (200) include:

-a clamping body (210), said clamping body (210) being at least 2;

a clamping driving mechanism (220), wherein the clamping driving mechanism (220) drives the clamping bodies (210) to be close to or far away from each other;

-a wire cutting assembly (300), said wire cutting assembly (300) having a cutting zone (310), said cutting zone (310) being arranged between at least 2 sets of said clamping assemblies (200) for cutting a diamond wire clamped by said clamping assemblies (200);

the detection assembly (400) is arranged at the outer side of the clamping assembly (200) and used for acquiring the section information of the diamond wire; and

and the centering component (500) is arranged below the clamping component (200), and can drive at least 1 group of the clamping components (200) to movably center with the rest clamping components (200) according to the tangent plane information of the diamond wire.

2. The wire bonding apparatus according to claim 1, characterized in that each set of clamping assemblies (200) has at least 2 wire grooves (241), at least 2 wire grooves (241) being arranged independently of each other, and the wire grooves (241) extend in a direction towards adjacent clamping assemblies (200).

3. The wire bonding apparatus as claimed in claim 2, wherein a clamping groove (230) is provided between the clamping bodies (210) of each group of the clamping assemblies (200), a positioning block (240) is provided in the clamping groove (230), the positioning block (240) is provided with the wire groove (241), the positioning block (240) protrudes from the clamping groove (230), and the width of the wire groove (241) is gradually contracted or expanded in the clamping direction of the clamping bodies (210), and the bottom of the wire groove (241) is substantially flush with the clamping surface (211) of the clamping bodies (210).

4. The wire-bonding apparatus of claim 1 wherein the wire-cutting assembly (300) comprises:

a tool holder (320);

a cutter (330), wherein the cutter (330) is hinged to the cutter holder (320), and the cutting area (310) is formed between the cutter holder (320) and the cutter (330); and

and the knife moving mechanism (340) acts on the knife holder (320) to drive the knife holder (320) to be close to or far away from the clamping assembly (200).

5. The wire bonding apparatus of claim 4 wherein a mating structure (600) is provided between the tool holder (320) and the clamping body (210), the mating structure (600) comprising:

a first engagement portion (610), the first engagement portion (610) being provided on the clamping body (210);

a second mating portion (620), the second mating portion (620) being disposed on the tool holder (320);

wherein the tool holder (320) is movable such that the second mating portion (620) mates with and abuts the first mating portion (610).

6. The wire bonding apparatus according to claim 4, characterized in that both sides of the cutter (330) have a first action portion (331) and a second action portion (332), respectively, the first action portion (331) and the second action portion (332) being simultaneously grindable with the respective adjacent clamping bodies (210) to sever the wire.

7. The wire-bonding apparatus of claim 1 wherein the detection assembly (400) comprises:

a first photographing unit (410), the first photographing unit (410) aligning the diamond wire photographing in a first direction;

a second photographing unit (420), the second photographing unit (420) aligning the diamond wire photographing in a second direction;

wherein the first direction is substantially perpendicular to the clamping surface (211) of the clamping body (210) and the second direction is substantially parallel to the clamping surface (211) of the clamping body (210).

8. The wire-bonding apparatus of claim 1 wherein the centering assembly (500) comprises:

a first driving mechanism (510), wherein the first driving mechanism (510) is arranged on the substrate (100), and the action direction of the first driving mechanism (510) is parallel to the substrate (100);

a second driving mechanism (520), wherein the second driving mechanism (520) is arranged on the first driving mechanism (510), and the action direction of the second driving mechanism (520) is parallel to the substrate (100) and is mutually perpendicular to the action direction of the first driving mechanism (510); and

a third driving mechanism (530), wherein the third driving mechanism (530) is arranged on the second driving mechanism (520), and the action direction of the third driving mechanism (530) is perpendicular to the substrate (100);

wherein at least 1 group of clamping assemblies (200) are arranged on the third driving mechanism (530).

9. A wire bonding method, characterized by applying a wire bonding apparatus according to any one of claims 1 to 8, comprising the steps of:

the clamping component (200) clamps and fixes at least 2 diamond wires;

the wire cutting assembly (300) cuts off the diamond wire in a clamping and fixing state;

the detection component (400) detects and acquires the section information of the diamond wire after cutting;

the centering component (500) adjusts the position of the clamping component (200) so as to enable the tangential planes of at least 2 diamond wires to be in butt joint;

at least 2 cutting faces are welded together to form a diamond wire.

10. The wire bonding method according to claim 9, wherein in the step of clamping and fixing at least 2 wires by the clamping assembly (200), at least 2 wires are disposed parallel to each other, and both ends of at least 2 wires are clamped by 2 groups of clamping assemblies (200).