CN117693129A - Preparation method of ceramic copper-clad plate for high-power device - Google Patents
Preparation method of ceramic copper-clad plate for high-power device Download PDFInfo
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- CN117693129A CN117693129A CN202311434124.6A CN202311434124A CN117693129A CN 117693129 A CN117693129 A CN 117693129A CN 202311434124 A CN202311434124 A CN 202311434124A CN 117693129 A CN117693129 A CN 117693129A
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- Prior art keywords
- solder
- clad plate
- ceramic
- printing
- copper
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- 239000000919 ceramic Substances 0.000 title claims abstract description 91
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 238000007639 printing Methods 0.000 claims abstract description 60
- 229910000679 solder Inorganic materials 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000005530 etching Methods 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000005219 brazing Methods 0.000 claims abstract description 13
- 238000003892 spreading Methods 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims description 26
- 238000007650 screen-printing Methods 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 238000005245 sintering Methods 0.000 claims description 12
- 238000004321 preservation Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 238000001039 wet etching Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 description 15
- 239000007788 liquid Substances 0.000 description 9
- 238000004334 fluoridation Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
Abstract
A preparation method of a ceramic copper-clad plate for a high-power device comprises the following steps: step one, printing solder on the double sides of ceramic through a screen, and reserving circuit lines when printing the solder; step two, after the solder on the ceramic substrate is dried, the ceramic substrate and the copper foil are put on a rack, and are put into a vacuum furnace for brazing; thirdly, printing ink on the surface of the copper foil of the brazed ceramic copper-clad plate; step four, etching after the ink is dried; step five, placing the etched sample into a resin dissolvent for removing the film of the printing ink; the method for preparing the ceramic copper-clad plate is limited, a printing mode of reserving circuit lines is adopted when solder is printed, and only the microscopic spreading part of the solder is needed to be etched in the later etching process, so that the etching time can be greatly shortened; the whole process is simple, the cost of raw materials is low, the equipment cost is low, the requirements on the field are low, no special light source is needed, and the production cost and the period are greatly shortened.
Description
Technical Field
The invention belongs to the field of preparation of ceramic copper-clad plates, and particularly relates to a preparation method of a ceramic copper-clad plate for a high-power device.
Background
In order to realize the circuit function, the ceramic copper-clad plate needs to etch the circuit pattern of the metal layer, but the current modes such as photoetching and the like are adopted, and the processes such as spin coating, exposure, development, etching, photoresist removal and the like are involved, so that the process is complex; the cost of raw materials such as photoresist, developing solution, mask and the like is high, the requirement on equipment precision is high, a special light source is required in an operating environment, and operators are required to have higher technical level and the like; in addition, since the solder is printed on the whole surface in the screen printing stage, it takes several hours to etch the solder reaction layer after the copper layer is etched when the wiring is etched. Therefore, the mode greatly increases the production cost and the period for some ceramic copper-clad plates for high-power devices without high-precision circuits, and needs to be further improved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a preparation method of a ceramic copper-clad plate for a high-power device.
The invention adopts the following technical scheme:
a preparation method of a ceramic copper-clad plate for a high-power device comprises the following steps:
printing solder on the bottom surface of a ceramic substrate and printing the same solder on the top surface of the ceramic substrate in a screen printing mode, wherein a circuit line pattern reserved on the surface of the ceramic substrate is opposite to a blank of a screen frame during screen printing;
step two, placing the ceramic substrate printed with the solder into a drying box to dry the solder, and placing the ceramic substrate dried by the solder and a copper foil rack into a vacuum furnace for sintering and brazing;
printing ink on the surface of the brazed ceramic copper-clad plate, wherein the coverage area of the ink is consistent with that of the solder;
step four, placing the ceramic copper-clad plate printed with the printing ink into a drying box to dry the printing ink, performing wet etching after the printing ink is dried, firstly etching a copper layer, and then etching solder spreading at the microcosmic part of the circuit line to form a required circuit line pattern;
and fifthly, placing the ceramic copper-clad plate subjected to etching treatment into a resin solvent for ink stripping to obtain the ceramic copper-clad plate with the circuit lines.
Further, in the second step, the temperature of the solder is 125-200 ℃ and the drying time is 20-40min.
Further, in the second step, the brazing sintering temperature is 830-930 ℃, and the heat preservation time is 5-30min.
Further, in the third step, the drying temperature of the ink is 200-250 ℃ and the drying time is 40-60min.
Further, in the first step, the pressure of solder screen printing is 0.15-0.25MPa, and the speed of screen printing is 90-110mm/s.
Further, in the third step, the pressure of the screen printing of the ink is 0.15-0.25MPa, and the speed of the screen printing is 90-110mm/s.
As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following beneficial effects: the method for preparing the ceramic copper-clad plate is limited, a printing mode of reserving circuit lines is adopted when solder is printed, and only the microscopic spreading part of the solder is needed to be etched in the later etching process, so that the etching time can be greatly shortened; the mask adopts a screen printing ink mode, the ink can resist subsequent copper etching liquid and solder etching liquid, the function of protecting circuit patterns is achieved, the mask mode is simple to operate, and a mode of reserving circuit lines is adopted during screen printing of the ink, and processes such as development are not needed; the whole process is simple, the raw material cost is low, the equipment cost is low, the requirements on the field are low, no special light source is needed, and the production cost and the period are greatly shortened;
the ceramic copper-clad plate prepared by the technical scheme defined by the application is subjected to insulation resistance and withstand voltage test, wherein the insulation resistance is more than 100 mu m omega, and the insulation voltage is more than 4kV (in electronic fluoride liquid, the copper layer spacing is 1 mm); the preparation method is applicable to the preparation of a plurality of high-power devices without high-precision circuits, and the preparation method of the ceramic copper-clad plate provided by the patent is proved to have practical application feasibility.
Drawings
FIG. 1 is a front view of a ceramic copper clad laminate prepared;
fig. 2 is a back view of the prepared ceramic copper clad laminate.
Detailed Description
The invention is further described below by means of specific embodiments.
A preparation method of a ceramic copper-clad plate for a high-power device comprises the following steps:
printing solder on the bottom surface of a ceramic substrate and printing the same solder on the top surface of the ceramic substrate in a screen printing mode, wherein a circuit line pattern reserved on the surface of the ceramic substrate is opposite to a blank of a screen frame during screen printing, the printing pressure is controlled to be 0.15-0.25MPa, and the printing speed is controlled to be 90-110mm/s;
step two, placing the ceramic substrate printed with the solder into a drying box, drying for 20-40min at the temperature of 125-200 ℃ to dry the solder, placing the ceramic substrate dried by the solder and a copper foil rack into a vacuum furnace for sintering and brazing, wherein the brazing sintering temperature is 830-930 ℃, and the heat preservation time is 5-30min;
printing ink on the surface of the brazed ceramic copper-clad plate, wherein the coverage area of the ink is consistent with that of the solder, the printing pressure is controlled to be 0.15-0.25MPa, and the printing speed is controlled to be 90-110mm/s;
step four, placing the ceramic copper-clad plate printed with the printing ink into a drying box, drying at 200-250 ℃ for 40-60min to dry the printing ink, performing wet etching after the printing ink is dried, firstly etching a copper layer, and then etching solder spreading at the circuit line part in a microcosmic manner to form a required circuit line pattern;
and fifthly, placing the ceramic copper-clad plate subjected to etching treatment into a resin solvent for ink stripping to obtain the ceramic copper-clad plate with the circuit lines.
Example 1
A preparation method of a ceramic copper-clad plate for a high-power device comprises the following steps:
printing solder on the bottom surface of a ceramic substrate and printing the same solder on the top surface of the ceramic substrate in a screen printing mode, wherein a circuit line pattern reserved on the surface of the ceramic substrate is opposite to a blank of a screen frame during screen printing, the printing pressure is controlled at 0.15MPa, and the printing speed is controlled at 110mm/s;
step two, placing the ceramic substrate printed with the solder into a drying box and drying for 40min at the temperature of 125 ℃ to dry the solder, and placing the ceramic substrate dried by the solder and a copper foil rack into a vacuum furnace for sintering and brazing, wherein the brazing and sintering temperature is 930 ℃, and the heat preservation time is 5min;
printing ink on the surface of the brazed ceramic copper-clad plate, wherein the coverage area of the ink is consistent with that of the solder, the printing pressure is controlled to be 0.25MPa, and the printing speed is controlled to be 90mm/s;
step four, placing the ceramic copper-clad plate printed with the printing ink into a drying box, drying at the temperature of 250 ℃ for 40min to dry the printing ink, performing wet etching after the printing ink is dried, firstly etching a copper layer, and then etching solder spreading at the microcosmic positions of circuit lines to form a required circuit line pattern;
and fifthly, placing the ceramic copper-clad plate subjected to etching treatment into a resin solvent for ink stripping to obtain the ceramic copper-clad plate with the circuit lines.
The insulation resistance and withstand voltage test of the obtained ceramic copper-clad plate show that the insulation resistance of the ceramic copper-clad plate is more than 100 mu m omega, and the insulation voltage is more than 4kV (the distance between copper layers in the electronic fluoridation liquid is 1 mm).
Example 2
A preparation method of a ceramic copper-clad plate for a high-power device comprises the following steps:
printing solder on the bottom surface of a ceramic substrate and printing the same solder on the top surface of the ceramic substrate in a screen printing mode, wherein a circuit line pattern reserved on the surface of the ceramic substrate is opposite to a blank of a screen frame during screen printing, the printing pressure is controlled at 0.25MPa, and the printing speed is controlled at 90mm/s;
step two, placing the ceramic substrate printed with the solder into a drying box and drying at 200 ℃ for 20min to dry the solder, and placing the ceramic substrate dried by the solder and a copper foil into a vacuum furnace for sintering and brazing, wherein the brazing and sintering temperature is 830 ℃, and the heat preservation time is 30min;
printing ink on the surface of the brazed ceramic copper-clad plate, wherein the coverage area of the ink is consistent with that of the solder, the printing pressure is controlled to be 0.15MPa, and the printing speed is controlled to be 110mm/s;
step four, placing the ceramic copper-clad plate printed with the printing ink into a drying box, drying at 200 ℃ for 60min to dry the printing ink, performing wet etching after the printing ink is dried, firstly etching a copper layer, and then etching solder spreading at the microcosmic part of the circuit line to form a required circuit line pattern;
and fifthly, placing the ceramic copper-clad plate subjected to etching treatment into a resin solvent for ink stripping to obtain the ceramic copper-clad plate with the circuit lines.
The insulation resistance and withstand voltage test of the obtained ceramic copper-clad plate show that the insulation resistance of the ceramic copper-clad plate is more than 100 mu m omega, and the insulation voltage is more than 4kV (the distance between copper layers in the electronic fluoridation liquid is 1 mm).
Example 3
A preparation method of a ceramic copper-clad plate for a high-power device comprises the following steps:
printing solder on the bottom surface of a ceramic substrate and printing the same solder on the top surface of the ceramic substrate in a screen printing mode, wherein a circuit line pattern reserved on the surface of the ceramic substrate is opposite to a blank of a screen frame during screen printing, the printing pressure is controlled at 0.2MPa, and the printing speed is controlled at 100mm/s;
step two, placing the ceramic substrate printed with the solder into a drying box and drying for 30min at the temperature of 165 ℃ to dry the solder, and placing the ceramic substrate dried by the solder and a copper foil rack into a vacuum furnace for sintering and brazing, wherein the brazing and sintering temperature is 870 ℃, and the heat preservation time is 15min;
printing ink on the surface of the brazed ceramic copper-clad plate, wherein the coverage area of the ink is consistent with that of the solder, the printing pressure is controlled to be 0.2MPa, and the printing speed is controlled to be 100mm/s;
step four, placing the ceramic copper-clad plate printed with the printing ink into a drying box, drying at 225 ℃ for 50min to dry the printing ink, performing wet etching after the printing ink is dried, firstly etching a copper layer, and then etching solder spreading at the microcosmic part of the circuit line to form a required circuit line pattern;
and fifthly, placing the ceramic copper-clad plate subjected to etching treatment into a resin solvent for ink stripping to obtain the ceramic copper-clad plate with the circuit lines.
The insulation resistance and withstand voltage test of the obtained ceramic copper-clad plate show that the insulation resistance of the ceramic copper-clad plate is more than 100 mu m omega, and the insulation voltage is more than 4kV (the distance between copper layers in the electronic fluoridation liquid is 1 mm).
The method for preparing the ceramic copper-clad plate is limited, a printing mode of reserving circuit lines is adopted when solder is printed, and only the microscopic spreading part of the solder is needed to be etched in the later etching process, so that the etching time can be greatly shortened; in addition, the mask adopts a screen printing ink mode, the ink can resist subsequent copper etching liquid and solder etching liquid, the function of protecting circuit patterns is achieved, the mask mode is simple to operate, and a mode of reserving circuit lines is adopted during the screen printing of the ink, so that processes such as development and the like are not needed; the whole process is simple, the raw material cost is low, the equipment cost is low, the requirements on the field are low, no special light source is needed, and the production cost and the period are greatly shortened; the prepared ceramic copper-clad plate is subjected to insulation resistance and withstand voltage tests, wherein the insulation resistance is more than 100 mu m omega, and the insulation voltage is more than 4kV (the distance between copper layers in electronic fluoridation liquid is 1 mm); can be used for preparing high-power devices without high-precision circuits.
The foregoing description is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, i.e., the invention is not to be limited to the details of the claims and the description, but rather is to cover all modifications which are within the scope of the invention.
Claims (6)
1. A preparation method of a ceramic copper-clad plate for a high-power device is characterized by comprising the following steps: the method comprises the following steps:
printing solder on the bottom surface of a ceramic substrate and printing the same solder on the top surface of the ceramic substrate in a screen printing mode, wherein a circuit line pattern reserved on the surface of the ceramic substrate is opposite to a blank of a screen frame during screen printing;
step two, placing the ceramic substrate printed with the solder into a drying box to dry the solder, and placing the ceramic substrate dried by the solder and a copper foil rack into a vacuum furnace for sintering and brazing;
printing ink on the surface of the brazed ceramic copper-clad plate, wherein the coverage area of the ink is consistent with that of the solder;
step four, placing the ceramic copper-clad plate printed with the printing ink into a drying box to dry the printing ink, performing wet etching after the printing ink is dried, firstly etching a copper layer, and then etching solder spreading at the microcosmic part of the circuit line to form a required circuit line pattern;
and fifthly, placing the ceramic copper-clad plate subjected to etching treatment into a resin solvent for ink stripping to obtain the ceramic copper-clad plate with the circuit lines.
2. The method for preparing the ceramic copper-clad plate for the high-power device, which is disclosed in claim 1, is characterized in that: in the second step, the temperature of the solder is 125-200 ℃ and the drying time is 20-40min.
3. The method for preparing the ceramic copper-clad plate for the high-power device, which is disclosed in claim 1, is characterized in that: in the second step, the brazing sintering temperature is 830-930 ℃, and the heat preservation time is 5-30min.
4. The method for preparing the ceramic copper-clad plate for the high-power device, which is disclosed in claim 1, is characterized in that: in the third step, the drying temperature of the printing ink is 200-250 ℃ and the drying time is 40-60min.
5. The method for preparing the ceramic copper-clad plate for the high-power device, which is disclosed in claim 1, is characterized in that: in the first step, the pressure of solder screen printing is 0.15-0.25MPa, and the speed of screen printing is 90-110mm/s.
6. The method for preparing the ceramic copper-clad plate for the high-power device, which is disclosed in claim 1, is characterized in that: in the third step, the pressure of the screen printing of the ink is 0.15-0.25MPa, and the speed of the screen printing is 90-110mm/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311434124.6A CN117693129A (en) | 2023-10-31 | 2023-10-31 | Preparation method of ceramic copper-clad plate for high-power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311434124.6A CN117693129A (en) | 2023-10-31 | 2023-10-31 | Preparation method of ceramic copper-clad plate for high-power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117693129A true CN117693129A (en) | 2024-03-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311434124.6A Pending CN117693129A (en) | 2023-10-31 | 2023-10-31 | Preparation method of ceramic copper-clad plate for high-power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117693129A (en) |
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2023
- 2023-10-31 CN CN202311434124.6A patent/CN117693129A/en active Pending
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