CN111712057B - PCB inner layer processing method - Google Patents
PCB inner layer processing method Download PDFInfo
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- CN111712057B CN111712057B CN202010634010.6A CN202010634010A CN111712057B CN 111712057 B CN111712057 B CN 111712057B CN 202010634010 A CN202010634010 A CN 202010634010A CN 111712057 B CN111712057 B CN 111712057B
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- ink
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- inner layer
- pcb
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention belongs to the technical field of printed circuit board production, and discloses a PCB inner layer processing method, which comprises the following steps: s1, coating high-temperature-resistant ink on the surface of a PCB copper-clad plate to form an ink layer; s2, pre-baking, and drying the ink layer; s3, exposing, and transferring an inner layer circuit image manufactured on the surface of the film to the ink layer; s4, developing, and removing the ink layer of the unexposed part by using a developing solution to obtain an inner circuit pattern; s5, etching is carried out on the PCB copper-clad plate by using etching liquid, so that an inner layer circuit is obtained; s6, pressing. Compared with the conventional inner layer processing method, the method provided by the invention has the advantages that the high-temperature-resistant printing ink and corresponding process steps are adopted, so that the film stripping and browning processes are reduced, the processing steps are simplified, the processing efficiency is improved by about 30%, the processing steps of film stripping and browning liquid medicine are reduced, the production efficiency of a printed circuit board is improved, and the method plays a positive role in environmental protection.
Description
Technical Field
The invention belongs to the technical field of printed circuit board production, and particularly relates to a PCB inner layer processing method.
Background
A printed circuit board (Printed Circuit Board, PCB), also known as a printed circuit board, is an important electronic component, being a support for the electronic component and a carrier for the electronic component to be electrically connected. According to the number of circuit layers, the circuit boards can be divided into single-panel boards, double-panel boards and multi-layer boards, and common multi-layer boards are generally 4 layers or 6 layers, and the number of complicated multi-layer boards can reach tens of layers. The multilayer board has at least three conductive layers, and its structure is generally: the double-sided wiring boards are used as inner layers (inner layers), two single-sided outer layers (outer layers) or the double-sided printed wiring boards are used as inner layers (inner layers), two single-sided outer layers (outer layers), and the conductive patterns are interconnected according to design requirements by using a positioning system and insulating bonding materials.
In the production process of the multilayer printed circuit board, the traditional production process from inner layer circuit pattern manufacture to lamination is complex and tedious, and comprises the steps of pretreatment, coating, baking, exposure, development, etching, film stripping, browning lamination and the like, so that the production efficiency is low, and the problem of environmental damage exists in the process of removing the coated ink by using water later in the process.
Disclosure of Invention
Therefore, the invention aims to solve the technical problems, and provides a PCB inner layer processing method which has few processing steps, high efficiency and environmental friendliness.
In order to solve the technical problems, the technical scheme of the invention is as follows:
the invention provides a PCB inner layer processing method, which comprises the following steps:
s1, coating high-temperature-resistant ink on the surface of a PCB copper-clad plate to form an ink layer;
s2, pre-baking, and drying the ink layer;
s3, exposing, and transferring an inner layer circuit image manufactured on the surface of the film to the ink layer;
s4, developing, and removing the ink layer of the unexposed part by using a developing solution to obtain an inner circuit pattern;
s5, etching is carried out on the PCB copper-clad plate by using etching liquid, so that an inner layer circuit is obtained;
s6, pressing.
Preferably, the high temperature resistant ink comprises, by weight, 50-60 parts of resin, 10-20 parts of high temperature resistant synthetic powder, 5-15 parts of photoinitiator and 15-25 parts of solvent.
Preferably, the high temperature resistant ink is composed of 55 parts of resin, 15 parts of high temperature resistant synthetic powder, 10 parts of photoinitiator and 20 parts of solvent in parts by weight.
Preferably, the ink layer has a thickness of 8-12 μm.
Preferably, in the step S2, the baking temperature is 85-95 ℃ and the baking time is 5min.
Preferably, in the step S3, the exposure energy is 30mj.
Compared with the prior art, the technical scheme of the invention has the following advantages:
the PCB inner layer processing method provided by the invention comprises the following steps: s1, coating high-temperature-resistant ink on the surface of a PCB copper-clad plate to form an ink layer; s2, pre-baking, and drying the ink layer; s3, exposing, and transferring an inner layer circuit image manufactured on the surface of the film to the ink layer; s4, developing, and removing the ink layer of the unexposed part by using a developing solution to obtain an inner circuit pattern; s5, etching is carried out on the PCB copper-clad plate by using etching liquid, so that an inner layer circuit is obtained; s6, pressing. Compared with the conventional inner layer processing method, the method provided by the invention has the advantages that the high-temperature-resistant printing ink and corresponding process steps are adopted, so that the film stripping and browning processes are reduced, the processing steps are simplified, the processing efficiency is improved by about 30%, the processing steps of film stripping and browning liquid medicine are reduced, the production efficiency of a printed circuit board is improved, and the method plays a positive role in environmental protection.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings, in which
Fig. 1 is a flowchart of a method for processing an inner layer of a PCB according to an embodiment of the present invention.
Detailed Description
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof.
Examples
The embodiment provides a method for processing an inner layer of a PCB, as shown in fig. 1, including the following steps:
s1, coating high-temperature-resistant ink on the surface of the PCB copper-clad plate to form an ink layer.
S2, pre-baking, and drying the ink layer;
s3, exposing, and transferring an inner layer circuit image manufactured on the surface of the film to the ink layer;
s4, developing, and removing the ink layer of the unexposed part by using a developing solution to obtain an inner circuit pattern;
s5, etching is carried out on the PCB copper-clad plate by using etching liquid, so that an inner layer circuit is obtained;
s6, pressing.
In the step S1, novel high-temperature-resistant ink is adopted for coating, the high-temperature-resistant ink comprises, by weight, 5 parts of resin, 10 parts of high-temperature-resistant synthetic powder, 5 parts of photoinitiator and 15 parts of solvent, wherein the resin is UV (ultraviolet) light-cured resin, the high-temperature-resistant synthetic powder is conventional high-temperature-resistant mica powder, and the solvent is water or an organic solvent. The coating process is carried out on a coating production line, and the thickness of the ink layer prepared by coating is 8 mu m.
After the ink layer is coated, the PCB is transported to a baking section for pre-baking, moisture in the ink is evaporated, the ink layer is solidified, the temperature is 85 ℃ and the baking time is 5min in the baking process, and compared with the conventional inner layer manufacturing process, the baking time of the manufacturing method adopting the high-temperature-resistant ink and the specific processing process in the embodiment can be reduced by nearly half.
Before the exposure step, the method further comprises the step of manufacturing a film pattern, wherein a conventional photo-painting process is adopted to paint an inner layer circuit pattern on the surface of the film, then the inner layer circuit pattern is transferred to the surface of the ink layer through the exposure step, and the exposure energy is 30mj in the exposure process.
And developing the ink layer by using a developing solution, removing the ink except the circuit patterns to obtain an inner-layer circuit pattern, and reserving the ink layer on the circuit to protect the circuit.
Etching the developed PCB copper-clad plate by adopting etching liquid, and removing the copper layer outside the circuit pattern by etching to obtain an inner layer circuit, wherein the ink layer protects the inner layer circuit from being etched.
And finally, pressing by adopting a conventional process to obtain the multilayer board.
Compared with the traditional PCB inner layer processing method, the processing method has the advantages that by adopting specific high-temperature-resistant printing ink, processing steps and parameters, the film stripping and browning processes are saved, the processing efficiency is improved, and the processing steps of corresponding film stripping and browning liquid medicine are reduced, so that the processing method is an environment-friendly processing method.
Example 2
The present embodiment provides a method for processing an inner layer of a PCB, which has substantially the same steps as those of embodiment 1, except that in the step S1, a novel high temperature resistant ink is used for coating, and the high temperature resistant ink comprises, by weight, 60 parts of resin, 20 parts of high temperature resistant synthetic powder, 15 parts of photoinitiator, and 25 parts of solvent. The coating process is carried out on a coating production line, and the thickness of the ink layer prepared by coating is 12 mu m.
After the ink layer is coated, the PCB is transported to a baking section for baking, moisture in the ink is evaporated, the ink layer is solidified, the temperature is 95 ℃ and the baking time is 5min in the baking process, and compared with the conventional inner layer manufacturing process, the baking time of the manufacturing method adopting the high-temperature-resistant ink and the specific processing process in the embodiment can be reduced by nearly half.
Example 3
The present embodiment provides a method for processing an inner layer of a PCB, which has substantially the same steps as those of embodiment 1, except that in the step S1, a novel high temperature resistant ink is used for coating, and the high temperature resistant ink is composed of, by weight, 55 parts of resin, 15 parts of high temperature resistant synthetic powder, 10 parts of photoinitiator, and 20 parts of solvent. The coating process is carried out on a coating production line, and the thickness of the ink layer prepared by coating is 10 mu m.
After the ink layer is coated, the PCB is transported to a baking section for baking, moisture in the ink is evaporated, the ink layer is solidified, the temperature is 90 ℃ in the baking process, and the baking time is 5min.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (3)
1. The PCB inner layer processing method is characterized by comprising the following steps:
s1, coating high-temperature-resistant ink on the surface of a PCB copper-clad plate to form an ink layer;
s2, pre-baking, and drying the ink layer;
s3, exposing, and transferring an inner layer circuit image manufactured on the surface of the film to the ink layer;
s4, developing, and removing the ink layer of the unexposed part by using a developing solution to obtain an inner circuit pattern;
s5, etching is carried out on the PCB copper-clad plate by using etching liquid, so that an inner layer circuit is obtained;
s6, pressing;
the high-temperature resistant ink consists of 50-60 parts of resin, 10-20 parts of high-temperature resistant synthetic powder, 5-15 parts of photoinitiator and 15-25 parts of solvent in parts by weight;
the resin is UV light curing resin, the high-temperature resistant synthetic powder is conventional high-temperature resistant mica powder, and the solvent is water or an organic solvent;
the thickness of the ink layer is 8-12 mu m;
in the step S2, the baking temperature is 85-95 ℃ and the baking time is 5min.
2. The method for processing the inner layer of the PCB according to claim 1, wherein the high temperature resistant ink is composed of 55 parts by weight of resin, 15 parts by weight of high temperature resistant synthetic powder, 10 parts by weight of photoinitiator and 20 parts by weight of solvent.
3. The method according to claim 2, wherein the exposure energy is 30mj in the step S3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010634010.6A CN111712057B (en) | 2020-07-02 | 2020-07-02 | PCB inner layer processing method |
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| CN202010634010.6A CN111712057B (en) | 2020-07-02 | 2020-07-02 | PCB inner layer processing method |
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| CN111712057A CN111712057A (en) | 2020-09-25 |
| CN111712057B true CN111712057B (en) | 2023-05-30 |
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| CN202010634010.6A Active CN111712057B (en) | 2020-07-02 | 2020-07-02 | PCB inner layer processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113556877B (en) * | 2021-07-20 | 2023-01-17 | 全成信电子（深圳）股份有限公司 | Process for rapidly treating small holes after etching of inner layer circuit |
| CN114938578B (en) * | 2022-05-09 | 2023-09-01 | 龙南骏亚精密电路有限公司 | Circuit board inlayer coating device |
Citations (3)
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| CN101315520A (en) * | 2008-07-25 | 2008-12-03 | 深圳市容大电子材料有限公司 | PCB ink composition, its production method, application and printed wiring board |
| CN103666029A (en) * | 2013-11-23 | 2014-03-26 | 铜陵方正塑业科技有限公司 | High temperature and ultraviolet light resistant curing solder resist ink and preparation method thereof |
| CN107177231A (en) * | 2017-06-02 | 2017-09-19 | 湖南松井新材料有限公司 | Photosensitive-ink and its preparation method and application |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2222911B (en) * | 1988-09-16 | 1992-07-01 | Stc Plc | Hybrid circuits |
| CN101336047B (en) * | 2008-08-06 | 2010-09-22 | 深圳市容大电子材料有限公司 | Method for printing circuit board and combination thereof |
| CN108541142B (en) * | 2018-06-01 | 2021-07-20 | 河源诚展科技有限公司 | PCB inner layer circuit pattern transfer process |
| CN109836885B (en) * | 2019-01-18 | 2021-10-29 | 广州市红太电子科技有限公司 | Liquid photosensitive ink, PCB and preparation method of PCB inner layer plate |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101315520A (en) * | 2008-07-25 | 2008-12-03 | 深圳市容大电子材料有限公司 | PCB ink composition, its production method, application and printed wiring board |
| CN103666029A (en) * | 2013-11-23 | 2014-03-26 | 铜陵方正塑业科技有限公司 | High temperature and ultraviolet light resistant curing solder resist ink and preparation method thereof |
| CN107177231A (en) * | 2017-06-02 | 2017-09-19 | 湖南松井新材料有限公司 | Photosensitive-ink and its preparation method and application |
Non-Patent Citations (1)
| Title |
|---|
| 紫外光固化封底涂料的研制;王小红;;涂料工业(第09期);全文 * |
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