CN117685943A - Hemispherical resonator gyroscope flat plate electrode pin cap bonding tool and hemispherical resonator gyroscope flat plate electrode pin cap bonding method - Google Patents
Hemispherical resonator gyroscope flat plate electrode pin cap bonding tool and hemispherical resonator gyroscope flat plate electrode pin cap bonding method Download PDFInfo
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- CN117685943A CN117685943A CN202311563152.8A CN202311563152A CN117685943A CN 117685943 A CN117685943 A CN 117685943A CN 202311563152 A CN202311563152 A CN 202311563152A CN 117685943 A CN117685943 A CN 117685943A
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000009826 distribution Methods 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 30
- 239000003292 glue Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000009966 trimming Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
The invention discloses a hemispherical resonator gyroscope flat electrode pin cap bonding tool and a hemispherical resonator gyroscope flat electrode pin cap bonding method. The base is a circular cylinder and is used for installing the fixed baffle and the support column. The fixed baffle plate is arc-shaped, has an inner diameter slightly larger than the diameter of the flat plate electrode, and is divided into a left plate and a right plate which are respectively fixed on two sides of the upper end of the base. The supporting surface is positioned at the inner side of the fixed baffle, the height of the supporting surface is lower than that of the fixed baffle, the height difference between the supporting surface and the top end of the fixed baffle is slightly larger than the thickness of the flat electrode, and the width of the supporting surface is slightly smaller than the front chamfer width of the flat electrode. The support column is located on the base and consists of mutually independent cylinders, the height of the top end of each cylinder is slightly lower than that of the supporting surface, and the distribution of the cylinders is identical to that of the pin holes of the flat plate electrode. The invention can efficiently finish the pin cap bonding process on the premise of effectively protecting the surface film layer of the electrode.
Description
Technical Field
The invention relates to a hemispherical resonator gyro assembly technology, in particular to a pin cap bonding device and method for hemispherical resonator gyro component flat plate electrodes, which are applied to bonding of hemispherical resonator gyro flat plate electrode pin caps.
Background
Hemispherical resonator gyroscopes have received attention in recent years due to their remarkable advantages of high precision, small volume, low cost, etc. The flat electrode body material used by the hemispherical resonator gyroscope is quartz glass, and the surface of the flat electrode body material is plated with a metal film to form an electrode structure. In order to realize the electric signal transmission between the plate electrode and the base, n through holes are needed to be punched on the plate electrode, and as shown in fig. 1, pin caps are inserted into the through holes and are fixed in a glue connection mode. As shown in fig. 2, the pin cap has a blind hole structure at one end, the closed end is fixed on the front surface of the electrode, the open end is fixed on the back surface of the electrode, and the pin is inserted into the pin cap from the back surface of the electrode. Because the flat plate electrode is closely adjacent to the hemispherical resonator of the core sensitive component of the hemispherical resonator gyro, in order to reduce the interference on vibration signal detection, high-precision, high-strength and low-stress rigid connection must be realized between the pin cap and the pin hole of the flat plate electrode, and in order to meet the process requirements of subsequent assembly, the axial positioning precision during the pin cap bonding is required to be higher, namely the height difference between the pin cap and the front surface of the flat plate electrode cannot exceed 0.02mm, and the high requirement is provided for the precision of pin cap bonding. Besides, the pin cap is adhered by inserting the pin cap from the back face inwards, and the front face of the flat electrode is downwards and the back face of the flat electrode is upwards fixed on the tool in the adhering process, so that the metal film layer on the front face of the electrode is easily damaged in the adhering process, the adhesive used in adhering has certain fluidity before solidification, and flows towards the front face of the electrode under the influence of gravity in the adhering process, and the surface of the electrode is possibly polluted. In order to realize high-precision bonding and avoid damage to the electrode, a special fixture for bonding the pin cap is required to be designed in combination with technological requirements, and the prior art disclosed means does not have a device and a scheme for realizing the indexes.
Disclosure of Invention
Aiming at the problem that the metal film layer on the front surface of the electrode is easy to damage and the surface of the electrode is possibly polluted in the bonding process of the pin cap, the invention aims to provide a hemispherical resonator gyroscope flat-plate electrode pin cap bonding tool and a hemispherical resonator gyroscope flat-plate electrode pin cap bonding method.
In order to achieve the purpose of the invention, the invention provides a hemispherical resonator gyroscope flat electrode pin cap bonding tool, which adopts the following technical scheme:
the tool comprises a base, a fixed baffle, a supporting surface and a supporting column.
The base is a circular cylinder and is used for installing the fixed baffle and the support column.
The fixed baffle plate is arc-shaped, has an inner diameter slightly larger than the diameter of the flat plate electrode, and is divided into a left plate and a right plate which are respectively fixed on two sides of the upper end of the base.
The supporting surface is positioned at the inner side of the fixed baffle, the height of the supporting surface is lower than that of the fixed baffle, the height difference between the supporting surface and the top end of the fixed baffle is slightly larger than the thickness of the flat electrode, and the width of the supporting surface is slightly smaller than the front chamfer width of the flat electrode.
The support column is located on the base and consists of mutually independent cylinders, the height of the top end of each cylinder is slightly lower than that of the supporting surface, and the distribution of the cylinders is identical to that of the pin holes of the flat plate electrode.
Further, the utility model also comprises a flat electrode clamp, wherein the flat electrode clamp consists of two identical clamping arms, the top end of the flat electrode clamp is provided with a circular arc groove which is used for being matched with the side wall of the flat electrode, the bottom ends of the flat electrode clamp are respectively fastened on the corresponding forceps handles by means of screws, and the flat electrode is clamped by means of the resilience force of the forceps.
The metal tray is provided with a plurality of bottom plates with holes, the diameters of the holes are slightly larger than the diameters of the bases, the thickness of the bottom plates is slightly smaller than the height of the bases, and the metal tray is provided with a metal top cover, so that the metal tray can be completely sealed.
Based on the hemispherical resonator gyro flat plate electrode pin cap bonding tool, the invention provides a hemispherical resonator gyro flat plate electrode pin cap bonding method, which comprises the following steps:
step 1), clamping and placing an electrode on a base, enabling the front surface of the electrode to coincide with a supporting surface, enabling the back surface of the electrode to be upward, and enabling a pin hole on the surface of the electrode to completely coincide with a support column on the upper part of the base;
step 2), vertically inserting electrode pin holes after uniformly gluing the surface of the pin cap;
step 3), sealing and baking glue after the pin caps are completely bonded;
and 4) taking out the electrode from the tool after the adhesive is completely solidified and stabilized.
Compared with the prior art, the invention has the beneficial effects that:
by designing the flat electrode pin cap bonding device, the pin cap bonding process can be efficiently completed on the premise of effectively protecting the electrode surface film layer. Because the front surface of the electrode is only in actual contact with the tool at the edge chamfering position, and the heights of the supporting columns are lower than those of the supporting surfaces, metal film layers in other areas of the front surface of the electrode are effectively protected in the operation process, pollution, scratch and other conditions are avoided, unnecessary loss of the electrode is greatly reduced, and the yield is improved.
The structural adhesive used for bonding the pin caps has certain fluidity before solidification, and under the condition of a large adhesive amount, the structural adhesive can overflow from the hole on the front face of the electrode. In order to prevent the pin cap from sliding off from the pin hole and ensure the positioning accuracy, the old tool adopts a scheme for supporting the whole electrode plane, and the scheme has the problem that when glue in the pin hole overflows, the glue can diffuse to other areas on the surface of the electrode due to the tight contact between the surface of the electrode and the supporting surface of the tool, and the metal film layer is damaged, so that the electrode is scrapped. In the flat electrode pin cap bonding tool, the pin cap is limited by the support column, only the top end of the pin cap is in contact with the end face of the support column, and the inner glue of the pin hole can be downwards diffused to the base along the support column after overflowing and cannot damage the surface of the electrode, so that the influence of glue quantity control errors on the electrode is avoided, the electrode loss is reduced, the yield is improved, the error requirement on glue quantity control is reduced, the process flow is simplified, and the working efficiency is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a front view of a flat electrode;
FIG. 2 is a cross-sectional view of a pin cap;
fig. 3 is a schematic structural diagram of a hemispherical resonator flat-plate electrode pin cap bonding device according to an embodiment of the present invention;
FIG. 4 is a top view of a metal pallet according to an embodiment of the present invention;
wherein the above figures include the following reference numerals:
1 is a base, 2 is a fixed baffle, 3 is a supporting surface, and 4 is a supporting column.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Aiming at the actual requirement of bonding of the flat electrode pin cap of the hemispherical resonator gyroscope, the invention provides a bonding device and a bonding method of the flat electrode pin cap, which can realize the high positioning precision bonding of the pin cap, meet the process requirement of assembling the hemispherical resonator gyroscope, avoid damaging the electrode and provide powerful technical support for developing the hemispherical resonator gyroscope.
The embodiment of the invention provides a hemispherical resonator gyroscope flat electrode pin cap bonding device, which comprises a base 1, a fixed baffle plate 2, a supporting surface 3, a supporting column 4, a flat electrode clamp and a metal tray, and is particularly shown in fig. 3.
The base 1 is a circular cylinder and consists of an upper part and a lower part. The bottom area of the lower cylinder is larger, and the lower cylinder can be placed on a workbench to keep the integral gravity center of the tool stable, so that shaking and overturning are not easy to occur. The bottom area of the upper cylinder is slightly smaller, and the upper cylinder is used for installing the fixed baffle plate 2 and the support column 4, and the top end of the upper cylinder is subjected to side trimming treatment on two sides so as to be convenient for installing and taking out the flat plate electrode;
the fixed baffle plate 2 is arc-shaped, has an inner diameter slightly larger than the diameter of the flat plate electrode (shown in figure 2), and is divided into a left plate and a right plate, which are respectively fixed on two sides of the upper end of the base 1, wherein the fixed baffle plate 2 on one side is provided with a threaded hole for installing a screw to fix the flat plate electrode.
The supporting surface 3 is positioned at the inner side of the fixed baffle plate 2, the height of the supporting surface is lower than that of the fixed baffle plate 2, and the height difference between the supporting surface and the top end of the fixed baffle plate 2 is slightly larger than the thickness of the flat plate electrode. The supporting surface 3 is in a discontinuous two-section concentric ring shape, the outer diameter of the supporting surface is slightly larger than that of the flat plate electrode, the supporting surface is the same as the inner diameter of the fixed baffle plate 2, and the width of the supporting surface is slightly smaller than the front chamfer width of the flat plate electrode.
The support column 4 is located at the upper part of the base 1, and consists of n mutually independent cylinders, the height of the top end of each cylinder is slightly lower than that of the support surface 3, the diameter of each cylinder is the same as that of the pin holes of the flat electrode, and the distribution of the cylinders is the same as that of the pin holes of the flat electrode.
The flat electrode clamp consists of two identical parts, the top end of the flat electrode clamp is provided with a circular arc groove which can be matched with the side wall of the flat electrode, the bottom end of the flat electrode clamp is provided with two threaded through holes, the flat electrode clamp can be respectively fastened on corresponding forceps handles by means of screws, and the flat electrode clamp clamps the flat electrode by means of the resilience force of forceps so as to place the electrode in the flat electrode pin cap bonding device or take the flat electrode out of the device.
The hemispherical resonator gyro flat plate electrode high-precision pin cap bonding device can be placed in a metal tray according to a certain number and a certain sequence, as shown in fig. 4. The metal tray is internally provided with a plurality of bottom plates with holes, the diameters of the holes are slightly larger than the diameters of the bases, the thickness of the bottom plates is slightly smaller than the height of the bases, and the metal tray is provided with a metal top cover, so that the metal tray can be completely sealed.
The size range of the structural part is as follows:
plate electrode: the outer diameter is 20 mm-30 mm, and the thickness is 3-8 mm; the diameter of the central hole is 2 mm-5 mm; the diameter of the pin hole is 1 mm-3 mm;
in the bonding device of the flat electrode pin cap, the diameter of the base is 40-60 mm, and the height of the base is 10-30 mm; the thickness of the fixed baffle is 1-3 mm, the inner diameter is slightly larger than the outer diameter of the flat electrode, and the height is slightly larger than the thickness of the flat electrode; the number and distribution of the support columns are completely the same as those of the pin holes of the flat plate electrode, the top ends of the support columns are completely leveled, the height is 2-10 mm, and the diameter is the same as that of the pin holes; the supporting surface is annular, the width is slightly smaller than the chamfer width of the outer edge of the flat plate electrode, and the plane height is slightly higher than the plane of the top end of the supporting column.
Based on the hemispherical resonator gyro flat plate electrode pin cap bonding tool provided by the embodiment, the invention provides a hemispherical resonator gyro flat plate electrode pin cap bonding method.
The embodiment of the invention comprises the following steps:
step (1), before use, completely cleaning the bonding device of the flat electrode pin cap and other auxiliary tools;
loosening a fixing screw arranged at one end of the fixed baffle plate, clamping an electrode by using a flat electrode clamp, and placing the electrode on the base, so that the front surface of the electrode is overlapped with the supporting surface, and the back surface of the electrode is upward;
step (3) clamping the side wall of the flat electrode by using a flat electrode clamp, carefully and slowly rotating the electrode until n pin holes on the surface of the electrode are completely overlapped with n support columns on the upper part of the base, loosening the flat electrode clamp, and tightening the fixing screws on the fixing baffle plate to fasten the electrode;
step (4) using special tweezers to clamp the pin cap, vertically inserting an electrode pin hole after uniformly gluing the surface, slowly rotating for 3-5 weeks after inserting in place, and moderately pressing the bottom end of the pin cap to ensure that the pin cap is installed in place;
after the contact pin caps are all bonded, placing the base into a perforated bottom plate of a metal tray, and arranging the base in sequence;
step (6), sealing the metal tray by using a metal top cover, and putting the metal tray into an oven for baking glue;
step (7), taking out the metal tray after the glue is completely solidified and stabilized;
step (8) taking out the fixture base from the metal tray, loosening a fastening screw at one side of the fixed baffle plate, clamping the side wall of the electrode by using a flat electrode clamp, taking out the electrode from the fixture, and transferring to the next working procedure;
and (9) cleaning the bonding device of the flat electrode pin cap and other auxiliary tools, removing glue and other residues possibly remained on the surface, and putting the flat electrode pin cap and other auxiliary tools into a drying cabinet for storage.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The hemispherical resonator gyroscope flat electrode pin cap bonding tool is characterized by comprising a base (1), a fixed baffle (2), a supporting surface (3) and a supporting column (4),
the base (1) is a circular cylinder and is used for installing the fixed baffle (2) and the support column (4),
the fixed baffle (2) is arc-shaped, has an inner diameter slightly larger than the diameter of the flat electrode, and is divided into a left piece and a right piece which are respectively fixed on two sides of the upper end of the base (1);
the supporting surface (3) is positioned at the inner side of the fixed baffle (2), the height of the supporting surface is lower than that of the fixed baffle (2), the height difference between the supporting surface and the top end of the fixed baffle (2) is slightly larger than the thickness of the flat electrode, and the width of the supporting surface is slightly smaller than the front chamfer width of the flat electrode;
the support columns (4) are located on the base (1) and are composed of n mutually independent cylinders, the heights of the top ends of the cylinders are slightly lower than those of the support surfaces (3), and the distribution of the cylinders is identical to that of the pin holes of the flat plate electrodes.
2. The hemispherical resonator gyroscope flat electrode pin cap bonding tool according to claim 1, wherein the base (1) comprises an upper part and a lower part, the bottom area of a lower cylinder is larger, the bottom area of an upper cylinder is smaller, and the top end is subjected to side trimming treatment.
3. The hemispherical resonator gyroscope flat electrode pin cap bonding tool according to claim 1, wherein the supporting surface (3) is in a discontinuous two-section concentric ring shape.
4. The bonding tool for the flat electrode pin caps of the hemispherical resonator gyroscope according to claim 1, wherein the diameter of the cylinders is the same as the diameter of the flat electrode pin holes, and the top ends of the cylinders are completely leveled.
5. The bonding tool for the flat electrode pin caps of the hemispherical resonator gyroscope according to claim 1, further comprising a flat electrode clamp, wherein the flat electrode clamp consists of two identical clamping arms, the top end of the flat electrode clamp is provided with a circular arc-shaped groove for being matched with the side wall of the flat electrode, the bottom ends of the flat electrode clamp are respectively fastened on corresponding tweezers handles by means of screws, and the flat electrode is clamped by means of resilience force of the tweezers.
6. The bonding tool for the hemispherical resonator gyroscope flat electrode pin caps is characterized by further comprising a metal tray, wherein a plurality of bottom plates with holes are arranged in the metal tray, the diameters of the holes are slightly larger than those of the base (1), the thickness of the bottom plates is slightly smaller than the height of the base (1), and the metal tray is provided with a metal top cover and can be completely sealed.
7. The hemispherical resonator gyroscope flat-plate electrode pin cap bonding tool according to claim 1, wherein a threaded hole is formed in one side of the fixed baffle (2) and is used for installing a screw to fix a flat-plate electrode.
8. The bonding method based on the hemispherical resonator gyro flat plate electrode pin cap bonding tool according to any one of claims 1 to 7 is characterized by comprising the following steps:
step 1), clamping and placing an electrode on a base, enabling the front surface of the electrode to coincide with a supporting surface, enabling the back surface of the electrode to be upward, and enabling a pin hole on the surface of the electrode to completely coincide with a support column on the upper part of the base;
step 2), vertically inserting electrode pin holes after uniformly gluing the surface of the pin cap;
step 3), sealing and baking glue after the pin caps are completely bonded;
and 4) taking out the electrode from the tool after the adhesive is completely solidified and stabilized.
9. The bonding method of hemispherical resonator gyro flat electrode pin cap according to claim 8, wherein a fixing screw installed at one end of the fixing baffle is loosened, the flat electrode clamp is used to clamp and place the electrode on the base, the electrode is rotated until the pin hole on the surface of the electrode is completely overlapped with the position of the support column on the upper part of the base, and the fixing screw on the fixing baffle is screwed to fasten the electrode.
10. The bonding method of hemispherical resonator gyroscope flat electrode pin caps according to claim 8, wherein after the pin caps are bonded completely, the base is placed into a perforated bottom plate of a metal tray, the metal tray is sealed by using a metal top cover, and the metal tray is placed into an oven for baking glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311563152.8A CN117685943A (en) | 2023-11-22 | 2023-11-22 | Hemispherical resonator gyroscope flat plate electrode pin cap bonding tool and hemispherical resonator gyroscope flat plate electrode pin cap bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311563152.8A CN117685943A (en) | 2023-11-22 | 2023-11-22 | Hemispherical resonator gyroscope flat plate electrode pin cap bonding tool and hemispherical resonator gyroscope flat plate electrode pin cap bonding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117685943A true CN117685943A (en) | 2024-03-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311563152.8A Pending CN117685943A (en) | 2023-11-22 | 2023-11-22 | Hemispherical resonator gyroscope flat plate electrode pin cap bonding tool and hemispherical resonator gyroscope flat plate electrode pin cap bonding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117685943A (en) |
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2023
- 2023-11-22 CN CN202311563152.8A patent/CN117685943A/en active Pending
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