CN117681064A - Diamond rapid polishing method and device based on ultraviolet light - Google Patents
Diamond rapid polishing method and device based on ultraviolet light Download PDFInfo
- Publication number
- CN117681064A CN117681064A CN202410156192.9A CN202410156192A CN117681064A CN 117681064 A CN117681064 A CN 117681064A CN 202410156192 A CN202410156192 A CN 202410156192A CN 117681064 A CN117681064 A CN 117681064A
- Authority
- CN
- China
- Prior art keywords
- polishing
- diamond
- oxygen
- chamber
- ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 197
- 239000010432 diamond Substances 0.000 title claims abstract description 99
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 99
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000001301 oxygen Substances 0.000 claims abstract description 86
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 86
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 83
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 22
- 230000003647 oxidation Effects 0.000 claims abstract description 20
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 210000001503 joint Anatomy 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 230000006978 adaptation Effects 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 238000012840 feeding operation Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000004048 modification Effects 0.000 abstract description 6
- 238000012986 modification Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 6
- 239000011159 matrix material Substances 0.000 abstract description 5
- 238000000227 grinding Methods 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 3
- 238000007517 polishing process Methods 0.000 abstract 1
- 230000008569 process Effects 0.000 description 7
- -1 Oxygen radicals Chemical class 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000010865 sewage Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 235000010333 potassium nitrate Nutrition 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
Abstract
The invention discloses a method and a device for quickly polishing diamond based on ultraviolet light, and relates to the technical field of diamond polishing. The invention can sequentially generate oxygen free radicals and ozone molecules in the polishing process by combining the ultraviolet generating unit and the oxygen supplying unit, and can oxidize and modify the wafer with high efficiency. And then the oxidation modification layer is removed through the mechanical grinding action between the polishing disc and the diamond sheet, and the mechanical polishing and chemical oxidation polishing are combined, so that the oxidation speed of the diamond matrix is enhanced, and the removal rate and polishing quality are improved.
Description
Technical Field
The invention relates to the technical field of diamond polishing, in particular to a method and a device for rapidly polishing diamond based on ultraviolet light.
Background
With the development of high-power and high-speed electronic devices, silicon materials have been difficult to adapt to high-frequency, high-power and high-temperature working environments. Diamond has many characteristics such as the lowest dielectric constant, ultra-wide band gap, excellent electron and hole mobility, good thermal conductivity and high breakdown voltage, and has a wide application prospect in the fields of semiconductor devices, optical windows and the like.
Diamond is considered one of the most difficult materials to process due to its excellent physical properties such as high hardness, high chemical inertness, wide band gap and high thermal conductivity. Currently, diamond polishing generally uses mechanical polishing, and uses diamond abrasive particles or diamond grinding wheels for polishing. However, since this removal mechanism involves mechanical and thermochemical reactions, there are still many scratches and subsurface damage on the mechanically polished diamond substrate. In order to reduce the damage, ion beam forming, laser processing, plasma etching and the like are mostly adopted to eliminate scratches and subsurface damage on the diamond substrate, but the processing range of non-contact polishing such as laser, ion beam and the like is limited, and the method is not suitable for large-size single crystal diamond. In particular, polishing techniques combine chemical reactions using oxidizing agent solutions, such as NaOH and KOH, naNO3 or KNO3, KMnO4, H2SO4, and the like. Chemical mechanical polishing relies on abrasive slurry and a soft polymer-based polishing pad, and is an effective method for obtaining a diamond surface with no damage and smooth atoms, but the material removal rate is extremely low and the environmental pollution is large.
In order to produce a higher quality diamond surface with greater efficiency, the prior art provides an ultraviolet excited polishing technique for diamond substrates in the atmosphere. In this method, ultraviolet rays are transmitted through a quartz (SiO 2) plate and directly irradiated on a diamond sample, and ultraviolet radiation enhances oxidation of a diamond matrix, improving removal rate and surface quality. However, the method can only throw one sample at a time, has low polishing efficiency and is not suitable for large-scale industrial production.
Disclosure of Invention
The application aims to provide a diamond rapid polishing method and device based on ultraviolet light.
In order to achieve the above purpose, the present application provides the following technical solutions: a diamond rapid polishing method based on ultraviolet light comprises the following steps:
the diamond and polishing solution feeding operation is carried out in the polishing chamber, a plurality of clamps for accommodating the placement of the diamond sheets are arranged in the polishing chamber, the clamps and the diamond sheets can synchronously reciprocate, a polishing disc is arranged below the clamps, and the polishing solution is uniformly mixed and then smeared on the surface of the polishing disc.
The polishing disc is driven to run, a driving motor matched with the polishing disc in model is arranged below the polishing disc, the polishing disc rotates at high speed to polish the surface of the diamond, and at the moment, the clamp and the diamond sheet are located above the polishing disc and are in a reciprocating motion state.
The method comprises the steps of starting an oxygen supply unit and an ultraviolet generation unit, wherein oxygen is input into a polishing chamber by the oxygen supply unit and is output to a clamp position, and the ultraviolet generation unit irradiates an ultraviolet light source on the surface of a polishing disk and the periphery of the polishing disk and is in contact with the oxygen input by the oxygen supply unit to generate ozone molecules, so that the formation of an oxidation modified layer on the surface of the diamond is accelerated, and the oxidation of the surface of the diamond is promoted.
And after polishing, taking the diamond sheet off the clamp, and ultrasonically cleaning to obtain the clean diamond sheet.
Further, the flow rate of the oxygen input into the polishing chamber by the oxygen supply unit is 0-100 mL/min.
Further, the wavelength of the ultraviolet light emitted by the ultraviolet generating unit is 10 nm-400 nm.
Furthermore, the ultraviolet generating unit can be operated for 0-60 min before polishing the diamond sheet, so that the conversion of oxygen into ozone is promoted, and the oxidizing capability is improved.
The utility model provides a diamond quick polishing device based on ultraviolet light, includes the polishing chamber, with the oxygen supply unit that the polishing chamber is linked together, set up in the inner chamber of polishing chamber and near the ultraviolet generating unit of top and be located the work piece positioning unit under the ultraviolet generating unit, oxygen supply unit can carry oxygen to the polishing chamber inside until oxygen reaches the position of work piece positioning unit.
The inner cavity of the polishing chamber is provided with a carrier plate, a polishing disc capable of rotationally rubbing the surface of the diamond sheet is arranged above the carrier plate, the lower surface of the carrier plate is provided with a driving motor matched with the polishing disc, the ultraviolet generating unit can emit ultraviolet light sources to the surface of the polishing disc and the periphery of the polishing disc, and the ultraviolet light sources can promote the oxidation of the surface of the diamond by contacting with oxygen.
Further, the oxygen supply unit comprises an oxygen bottle arranged on the outer side of the polishing chamber, a conveying pipeline, a first control valve and a flowmeter are installed at the gas outlet end of the oxygen bottle in a combined mode, and the conveying pipeline penetrates through the side wall of the polishing chamber and extends to the inner cavity of the polishing chamber.
An extension joint is arranged at one end of the conveying pipeline, which is positioned in the inner cavity of the polishing chamber, and a second butt joint pipeline and a second control valve are arranged at a plurality of interfaces of the extension joint in a combined mode.
Further, the ultraviolet generating unit comprises a plurality of ultraviolet lamp tubes which are transversely arranged, the ultraviolet lamp tubes are arranged on a frame body which is arranged in the inner cavity of the polishing chamber and is close to the upper side of the inner cavity of the polishing chamber, the ultraviolet lamp tubes are connected with the same controller through lines, and the controller is arranged on the outer side wall of the polishing chamber.
Furthermore, the workpiece positioning unit comprises a plurality of clamps capable of clamping the diamond sheet, a plurality of shields are arranged above the clamps, a plurality of butt joint pipelines II are respectively and penetratingly arranged on the upper surfaces of the shields, and when the control valve I and the control valve II are opened, oxygen in the oxygen cylinder can flow through the conveying pipelines and the butt joint pipelines and then reach the positions of the clamps.
The upper surface of guard shield all installs the load weight, and a plurality of the same linking arm is all installed to load weight upper surface, the top of linking arm is provided with rather than the servo motor of looks adaptation, servo motor installs in the support body surface of polishing room inner chamber, linking arm, anchor clamps and diamond piece can be located the top of polishing dish along polishing dish's circumferencial direction reciprocating motion.
Furthermore, the outside of the polishing chamber is also provided with a wind collecting cover, the wind collecting cover is communicated with the polishing chamber and can be used for discharging gas and dust in the polishing chamber, and the end part of the wind collecting cover is provided with a communicating pipeline communicated with the wind collecting cover.
In summary, the invention has the technical effects and advantages that:
1. according to the invention, oxygen is input into the polishing chamber through the oxygen supply unit, and is output to the position of the clamp connected with the diamond sheet, and the ultraviolet generating unit irradiates an ultraviolet light source on the surface of the polishing disk and the periphery of the polishing disk and is contacted with the oxygen input by the oxygen supply unit. Oxygen radicals and ozone molecules are sequentially generated, and the modified wafer can be efficiently oxidized. And then the oxidation modification layer is removed through the mechanical grinding action between the polishing disk and the diamond sheet, and the mechanical polishing and the chemical oxidation polishing are combined, so that the oxidation speed of the diamond matrix is enhanced, and the removal rate and the polishing quality are improved.
2. Compared with the traditional laser auxiliary polishing, the polishing device is provided with the plurality of clamps which can be connected with the diamond sheet, so that a plurality of samples can be polished on one polishing disc at the same time, the polishing efficiency is improved, and the polishing device is more suitable for polishing the diamond sheet on a large scale in industry.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of the first view of the inner chamber of the polishing chamber according to the present invention.
FIG. 2 is a schematic view of the structure of the polishing chamber according to the second aspect of the present invention.
Fig. 3 is a schematic view showing the position structure of the oxygen supply unit, the ultraviolet generating unit, the workpiece positioning unit and the polishing disk according to the present invention.
Fig. 4 is a schematic view showing the position structure of the ultraviolet generating unit, the workpiece positioning unit and the polishing disk according to the present invention.
FIG. 5 is a schematic view of the position structure of the ultraviolet generating unit and the workpiece positioning unit according to the present invention.
Fig. 6 is a schematic view of a structure of a shield in a workpiece positioning unit of the present invention, shown in a broken away.
FIG. 7 is a schematic view showing the overall structure of the polishing chamber of the present invention in an operating state.
FIG. 8 is a schematic flow chart of the operation of the invention.
In the figure: 1. a polishing chamber; 2. an oxygen supply unit; 21. an oxygen cylinder; 22. a first control valve; 23. a flow meter; 24. a delivery conduit; 25. an extension joint; 26. docking the pipeline; 27. a second control valve; 3. an ultraviolet generating unit; 31. an ultraviolet lamp tube; 32. a controller; 4. a workpiece positioning unit; 41. a clamp; 42. a shield; 43. a load weight; 44. a linking arm; 45. a servo motor; 6. polishing disk; 7. a driving motor; 8. a carrier plate; 9. a wind collecting hood; 10. and (3) circulating the pipeline.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The following is an example of a rapid diamond polishing method based on ultraviolet light:
example 1: the method comprises the following steps:
the diamond and polishing solution feeding operation is carried out in the polishing chamber, a plurality of clamps for accommodating the placement of the diamond sheets are arranged in the polishing chamber, the specification of the diamond sheets is 7mm multiplied by 7mm, and the clamps and the diamond sheets can synchronously reciprocate. A polishing disk is arranged below the clamp, polishing liquid is uniformly mixed and then smeared on the surface of the polishing disk, the polishing liquid is a mixture produced by stirring diamond micro powder with the particle size of W15 and diamond oil for 30min under a mechanical stirrer according to the volume ratio of 1:2, and abrasive particles in the polishing liquid are uniformly dispersed.
The polishing disc is driven to run, a driving motor matched with the polishing disc in model is arranged below the polishing disc, the polishing disc rotates at a high speed to polish the surface of the diamond, at the moment, the clamp and the diamond sheet are located above the polishing disc and are in a reciprocating motion state, and the polishing disc rubs and removes the oxidized diamond sheet to realize the polishing operation of the diamond.
The oxygen supply unit is started to input oxygen into the polishing chamber and output the oxygen to the position of the clamp, and the ultraviolet generation unit irradiates an ultraviolet light source on the surface of the polishing disk and the periphery of the polishing disk and contacts with the oxygen input by the oxygen supply unit. The introduced oxygen is decomposed under the irradiation of ultraviolet light to generate two oxygen free radicals, and each oxygen free radical is reacted with more oxygen molecules to generate ozone molecules, so that the modified wafer can be efficiently oxidized. And then the oxidation modification layer is removed through the mechanical grinding action between the polishing disc and the diamond sheet, the mechanical polishing and the chemical oxidation polishing are combined, the ultraviolet radiation enhances the oxidation of the diamond matrix, and the removal rate and the polishing quality are improved.
And after polishing, taking the diamond sheet off the fixture, and putting the fixture into a muffle furnace for baking, so that paraffin is melted, and the diamond sheet falls off from the fixture. Washing with acetone, and wiping to obtain polished diamond sheet.
The flow rate of the oxygen input into the polishing chamber by the oxygen supply unit is 20 mL/min, and a continuous oxygen input mode is adopted.
The wavelength of ultraviolet rays emitted by the ultraviolet generating unit is 200nm, and ultraviolet lamps with different powers can be selected according to different conditions, so that the ozone generating rate is influenced.
The ultraviolet generating unit can be operated for 30min before polishing the diamond sheet, so that oxygen in the polishing chamber is promoted to be converted into ozone, and the oxidizing capability is improved.
The following is an example of a UV-based diamond rapid polishing apparatus:
example 2: as shown in fig. 1 and 2, the oxygen supplying device comprises a polishing chamber 1, an oxygen supplying unit 2 communicated with the polishing chamber 1, an ultraviolet generating unit 3 arranged in the inner cavity of the polishing chamber 1 and above the polishing chamber, and a workpiece positioning unit 4 positioned right below the ultraviolet generating unit 3, wherein the oxygen supplying unit 2 can convey oxygen into the polishing chamber 1 until the oxygen reaches the position of the workpiece positioning unit 4.
The inner cavity of the polishing chamber 1 is provided with a carrier plate 8, a polishing disk 6 capable of rotationally rubbing the surface of the diamond sheet is arranged above the carrier plate 8, the lower surface of the carrier plate 8 is provided with a driving motor 7 matched with the polishing disk 6, the ultraviolet generating unit 3 can emit an ultraviolet light source to the surface of the polishing disk 6 and the periphery thereof, and the ultraviolet light source contacts with oxygen to promote the oxidation of the diamond surface. The concentration of ozone generated depends on the concentration of the introduced oxygen, and too low oxygen concentration can lead to low ozone concentration, thereby affecting the polishing rate of the diamond; therefore, the flow rate of the oxygen for ensuring the ozone concentration is 0-100 mL/min; the oxygen supply means 2 may be continuous or intermittent.
In the process, two oxygen free radicals can be generated through the decomposition reaction generated by ultraviolet light and oxygen, each oxygen free radical then reacts with more oxygen molecules to generate ozone molecules, so that the modified wafer can be oxidized efficiently, and the oxidization speed of the diamond matrix is improved. The oxidation modification layer on the surface of the diamond can be removed by combining the operation of the polishing disk 6, and the mechanical polishing and the chemical oxidation polishing are combined, so that the removal rate and the quality of the surface of the diamond after polishing are improved.
In the process, the gas is adopted as the oxidant to replace the traditional liquid oxidant, so that the formation of sewage in the polishing chamber is avoided, the problem of sewage treatment is effectively avoided, and the method has the advantages of energy conservation and environmental protection.
As shown in fig. 3, the oxygen supply unit 2 includes an oxygen bottle 21 disposed outside the polishing chamber 1, a conveying pipe 24, a first control valve 22 and a flow meter 23 are assembled at a gas outlet end of the oxygen bottle 21, the conveying pipe 24 extends to an inner cavity of the polishing chamber 1 through a sidewall of the polishing chamber 1, when the oxygen supply unit 2 operates, the first control valve 22 is opened, oxygen in the oxygen bottle 21 flows to the inner cavity of the polishing chamber 1 through the conveying pipe 24, and in the process, the opening and closing of the first control valve 22 can be adjusted, and the indication of the flow meter 23 is observed to adjust the flow rate of the oxygen.
An extension joint 25 is arranged at one end of the conveying pipeline 24, which is positioned in the inner cavity of the polishing chamber 1, a second butt joint pipeline 26 and a second control valve 27 are arranged at a plurality of interfaces of the extension joint 25 in a combined mode, the second control valve 27 is in an open state, and oxygen can flow to the position of the workpiece positioning unit 4 through the second butt joint pipeline 26.
As shown in fig. 4, the ultraviolet generating unit 3 includes a plurality of ultraviolet lamp tubes 31 disposed transversely, the plurality of ultraviolet lamp tubes 31 are mounted on a frame body above the inner cavity of the polishing chamber 1, and the plurality of ultraviolet lamp tubes 31 are connected with the same controller 32 through lines, and the controller 32 is mounted on the outer side wall of the polishing chamber 1. The controller 32 can control the operation state of the ultraviolet lamp 31 to make the wavelength of the ultraviolet light irradiated above the polishing disk be 10 nm-400 nm, and promote the oxidation of the diamond surface. Different power ultraviolet lamps can be selected according to different conditions, so that the ozone generation rate is influenced.
As shown in fig. 5 and 6, the workpiece positioning unit 4 includes a plurality of clamps 41 capable of clamping the diamond sheet, a shield 42 is disposed above each of the plurality of clamps 41, and a plurality of second butt joint pipes 26 are respectively installed on the upper surfaces of the plurality of shields 42 in a penetrating manner, and are used as the first control valves 22. When the second control valve 27 is opened, oxygen in the oxygen bottle 21 can flow through the conveying pipeline 24 and the butt joint pipeline 26 to reach the position of the clamp 41. In this process, the diffusion of oxygen can be reduced, and the ozone forming speed at the position of the clamp 41 can be increased, so as to achieve the purpose of accelerating the formation of an oxide layer on the surface of diamond.
The upper surface of guard shield 42 all installs load weight 43, and the same linking arm 44 is all installed to a plurality of load weight 43 upper surfaces, and the top of linking arm 44 is provided with rather than the servo motor 45 of looks adaptation, and servo motor 45 installs in the support body surface of polishing room 1 inner chamber. In the process of polishing the diamond surface by rotating the polishing disk 6 to a high degree, the servo motor 45 is operated, the engagement arm 44, the clamp 41 and the diamond sheet can be positioned above the polishing disk 6 to reciprocate along the circumferential direction of the polishing disk 6, in the process, oxygen can be driven to fully flow to be in optical contact with the ultraviolet lamp to form ozone molecules, and meanwhile, the diamond sheet in the clamp 41 can be fully contacted with the ozone molecules, so that the efficiency of forming the oxidation modified layer on the diamond surface is ensured.
Compared with the traditional laser auxiliary polishing, the polishing mode is provided with a plurality of clamps capable of being connected with the diamond sheet, so that a plurality of samples are polished on one polishing disc 6 at the same time, the polishing efficiency is improved, and the polishing mode is more suitable for industrial large-scale diamond sheet polishing.
As shown in fig. 7, the outside of the polishing chamber 1 is further provided with a wind collecting cover 9, the wind collecting cover 9 is communicated with the polishing chamber 1, so that gas and dust in the polishing chamber 1 can be discharged, a flow pipeline 10 communicated with the wind collecting cover 9 is installed at the end part of the wind collecting cover 9, and the flow pipeline 10 can be externally connected with waste gas washing equipment and a motor to operate the inside of the polishing chamber 1.
Finally, it should be noted that: the foregoing description of the preferred embodiments of the present invention is not intended to be limiting, but rather, although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present invention.
Claims (9)
1. The diamond rapid polishing method based on ultraviolet light is characterized by comprising the following steps of:
the method comprises the steps of carrying out feeding operation of diamond and polishing liquid in a polishing chamber, wherein a plurality of clamps for accommodating diamond sheets are arranged in the polishing chamber, the clamps and the diamond sheets can synchronously reciprocate, a polishing disc is arranged below the clamps, and the polishing liquid is uniformly mixed and then smeared on the surface of the polishing disc;
the polishing device comprises a polishing disc, a clamp, a diamond sheet, a polishing motor, a polishing disc, a driving motor, a polishing disc, a clamp and a diamond sheet, wherein the polishing disc is driven to rotate;
the method comprises the steps of starting an oxygen supply unit and an ultraviolet generation unit, wherein the oxygen supply unit inputs oxygen into a polishing chamber and outputs the oxygen to a clamp position, and the ultraviolet generation unit irradiates an ultraviolet light source on the surface of a polishing disk and the periphery of the polishing disk and contacts with the oxygen input by the oxygen supply unit to generate ozone molecules so as to accelerate the formation of an oxidation modified layer on the surface of the diamond and promote the oxidation of the surface of the diamond;
and after polishing, taking the diamond sheet off the clamp, and ultrasonically cleaning to obtain the clean diamond sheet.
2. The rapid diamond polishing method based on ultraviolet light according to claim 1, wherein: the flow rate of the oxygen input into the polishing chamber by the oxygen supply unit is 0-100 mL/min.
3. The rapid diamond polishing method based on ultraviolet light according to claim 1, wherein: the wavelength of the ultraviolet rays emitted by the ultraviolet generating unit is 10 nm-400 nm.
4. The rapid diamond polishing method based on ultraviolet light according to claim 1, wherein: the ultraviolet generating unit can be operated for 0-60 min before the diamond sheet is polished, so that the conversion of oxygen into ozone is promoted, and the oxidizing capability is improved.
5. A diamond rapid polishing device based on ultraviolet light is characterized in that: the device comprises a polishing chamber (1), an oxygen supply unit (2) communicated with the polishing chamber (1), an ultraviolet generating unit (3) arranged in the inner cavity of the polishing chamber (1) and above the polishing chamber, and a workpiece positioning unit (4) positioned right below the ultraviolet generating unit (3), wherein the oxygen supply unit (2) can convey oxygen into the polishing chamber (1) until the oxygen reaches the position of the workpiece positioning unit (4);
the inner cavity of the polishing chamber (1) is provided with a carrier plate (8), a polishing disc (6) capable of rotationally rubbing the surface of the diamond sheet is arranged above the carrier plate (8), the lower surface of the carrier plate (8) is provided with a driving motor (7) matched with the polishing disc (6), the ultraviolet generating unit (3) can emit ultraviolet light sources to the surface of the polishing disc (6) and the surrounding area, and the ultraviolet light sources can promote the oxidization of the diamond surface through contact with oxygen.
6. The rapid diamond polishing device based on ultraviolet light according to claim 5, wherein: the oxygen supply unit (2) comprises an oxygen bottle (21) arranged at the outer side of the polishing chamber (1), a conveying pipeline (24), a first control valve (22) and a flowmeter (23) are assembled at the gas outlet end of the oxygen bottle (21), and the conveying pipeline (24) penetrates through the side wall of the polishing chamber (1) and extends to the inner cavity of the polishing chamber;
one end of the conveying pipeline (24) positioned in the inner cavity of the polishing chamber (1) is provided with an extension joint (25), and a plurality of interfaces of the extension joint (25) are respectively provided with a butt joint pipeline II (26) and a control valve II (27) in a combined mode.
7. The rapid diamond polishing device based on ultraviolet light according to claim 5, wherein: the ultraviolet generating unit (3) comprises a plurality of ultraviolet lamp tubes (31) which are transversely arranged, the plurality of ultraviolet lamp tubes (31) are arranged on a frame body which is arranged in the inner cavity of the polishing chamber (1) and is close to the upper side, the plurality of ultraviolet lamp tubes (31) are connected with the same controller (32) through circuits, and the controller (32) is arranged on the outer side wall of the polishing chamber (1).
8. The rapid diamond polishing device based on ultraviolet light according to claim 6, wherein: the workpiece positioning unit (4) comprises a plurality of clamps (41) capable of clamping diamond sheets, a shield (42) is arranged above each clamp (41), a plurality of butt joint pipelines II (26) are respectively arranged on the upper surfaces of the shields (42) in a penetrating mode, and when the control valve I (22) and the control valve II (27) are opened, oxygen in the oxygen cylinder (21) can flow through the conveying pipeline (24) and the butt joint pipelines (26) and then reach the positions of the clamps (41);
the utility model discloses a polishing disc, including polishing disc (6), including support, anchor clamps (41), support weight (43) are all installed to the upper surface of guard shield (42), a plurality of same linking arm (44) are all installed to support weight (43) upper surface, the top of linking arm (44) is provided with servo motor (45) rather than looks adaptation, servo motor (45) are installed in the support surface of polishing chamber (1) inner chamber, linking arm (44), anchor clamps (41) and diamond piece can be located the top of polishing disc (6) along the circumferencial direction reciprocating motion of polishing disc (6).
9. The rapid diamond polishing device based on ultraviolet light according to claim 5, wherein: the polishing device is characterized in that a wind collecting cover (9) is further arranged on the outer side of the polishing chamber (1), the wind collecting cover (9) is communicated with the polishing chamber (1) and can discharge gas and dust in the polishing chamber (1), and a flow pipeline (10) communicated with the wind collecting cover (9) is arranged at the end of the wind collecting cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410156192.9A CN117681064B (en) | 2024-02-04 | Diamond rapid polishing method and device based on ultraviolet light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410156192.9A CN117681064B (en) | 2024-02-04 | Diamond rapid polishing method and device based on ultraviolet light |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117681064A true CN117681064A (en) | 2024-03-12 |
| CN117681064B CN117681064B (en) | 2024-04-30 |
Family
ID=
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224168A (en) * | 1992-11-27 | 1994-08-12 | Hitachi Ltd | Organic substance removing method and device |
| JP2003334502A (en) * | 2002-03-13 | 2003-11-25 | National Institute Of Advanced Industrial & Technology | Surface treatment method for substrate by irradiation with light and apparatus therefor |
| JP2004203465A (en) * | 2002-12-26 | 2004-07-22 | Shin Etsu Polymer Co Ltd | Molding for use in miniature electronic component holding/conveying jig etc., miniature electronic component holding/conveying jig using the same, and manufacturing method therefor |
| WO2007063873A1 (en) * | 2005-11-30 | 2007-06-07 | National University Corporation Saitama University | Polishing method and polishing apparatus |
| US20090068934A1 (en) * | 2007-09-04 | 2009-03-12 | Samsung Electronics Co., Ltd. | Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same |
| JP2010023119A (en) * | 2008-07-15 | 2010-02-04 | Okamoto Machine Tool Works Ltd | Flattening device and flattening method for semiconductor substrate |
| JP2015226951A (en) * | 2014-05-30 | 2015-12-17 | パナソニックＩｐマネジメント株式会社 | Polishing apparatus |
| US20160217998A1 (en) * | 2013-09-11 | 2016-07-28 | Shin-Etsu Handotai Co., Ltd. | Method for producing mirror-polished wafer |
| CN209491637U (en) * | 2018-12-11 | 2019-10-15 | 德淮半导体有限公司 | Grinding head and chemical mechanical polishing device |
| CN114932500A (en) * | 2022-06-24 | 2022-08-23 | 南京航空航天大学 | Grinding and polishing integrated device and operation method thereof |
| WO2022261998A1 (en) * | 2021-06-17 | 2022-12-22 | 广东工业大学 | Ultra-smooth planarization polishing method and apparatus |
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224168A (en) * | 1992-11-27 | 1994-08-12 | Hitachi Ltd | Organic substance removing method and device |
| JP2003334502A (en) * | 2002-03-13 | 2003-11-25 | National Institute Of Advanced Industrial & Technology | Surface treatment method for substrate by irradiation with light and apparatus therefor |
| JP2004203465A (en) * | 2002-12-26 | 2004-07-22 | Shin Etsu Polymer Co Ltd | Molding for use in miniature electronic component holding/conveying jig etc., miniature electronic component holding/conveying jig using the same, and manufacturing method therefor |
| WO2007063873A1 (en) * | 2005-11-30 | 2007-06-07 | National University Corporation Saitama University | Polishing method and polishing apparatus |
| US20090068934A1 (en) * | 2007-09-04 | 2009-03-12 | Samsung Electronics Co., Ltd. | Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same |
| JP2010023119A (en) * | 2008-07-15 | 2010-02-04 | Okamoto Machine Tool Works Ltd | Flattening device and flattening method for semiconductor substrate |
| US20160217998A1 (en) * | 2013-09-11 | 2016-07-28 | Shin-Etsu Handotai Co., Ltd. | Method for producing mirror-polished wafer |
| JP2015226951A (en) * | 2014-05-30 | 2015-12-17 | パナソニックＩｐマネジメント株式会社 | Polishing apparatus |
| CN209491637U (en) * | 2018-12-11 | 2019-10-15 | 德淮半导体有限公司 | Grinding head and chemical mechanical polishing device |
| WO2022261998A1 (en) * | 2021-06-17 | 2022-12-22 | 广东工业大学 | Ultra-smooth planarization polishing method and apparatus |
| CN114932500A (en) * | 2022-06-24 | 2022-08-23 | 南京航空航天大学 | Grinding and polishing integrated device and operation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100377095B1 (en) | Semiconductor fabrication apparatus using low energy plasma | |
| TWI271214B (en) | Apparatus and method of irradiating ultraviolet light | |
| CN100338976C (en) | Plasma-assisted process in production line | |
| KR100348701B1 (en) | Apparatus for dry surface-cleaning of materials | |
| US20090258159A1 (en) | Novel treatment for mask surface chemical reduction | |
| CN109866084A (en) | A kind of UV photocatalysis assistant chemical mechanical polishing apparatus and polishing method | |
| JP2001015472A (en) | Method and device for projecting ultraviolet ray | |
| CN1653595A (en) | Resist film removing apparatus, method of removing resist film, organic matter removing apparatus and method of removing organic matter | |
| CN117681064B (en) | Diamond rapid polishing method and device based on ultraviolet light | |
| WO2008097462A1 (en) | Plenum reactor system | |
| CN117681064A (en) | Diamond rapid polishing method and device based on ultraviolet light | |
| TW508285B (en) | Dry chemical-mechanical polishing method | |
| CN113103076A (en) | Wafer polishing device based on inductively coupled plasma | |
| JP6145761B2 (en) | Processing method and processing apparatus | |
| CN115527830B (en) | Semiconductor etching device for optimizing plasma distribution | |
| Shi et al. | Polishing of diamond, SiC, GaN based on the oxidation modification of hydroxyl radical: status, challenges and strategies | |
| JP2007098357A (en) | Apparatus and method for photochemistry treatment | |
| JP2011120989A (en) | Surface processing method | |
| US7714248B2 (en) | Microwave plasma generator | |
| CN113544820A (en) | Substrate processing method and substrate processing apparatus | |
| JP3085128B2 (en) | Light cleaning method | |
| JPH01175231A (en) | Ashing | |
| CN1658369A (en) | Treatment apparatus | |
| CN117238752A (en) | Device and method for eliminating surface color spots of semiconductor polishing sheet | |
| WO2007055124A1 (en) | Method of polishing work and apparatus therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |