CN117672089A - 具有降低的接缝可见性的显示拼接 - Google Patents
具有降低的接缝可见性的显示拼接 Download PDFInfo
- Publication number
- CN117672089A CN117672089A CN202311158245.2A CN202311158245A CN117672089A CN 117672089 A CN117672089 A CN 117672089A CN 202311158245 A CN202311158245 A CN 202311158245A CN 117672089 A CN117672089 A CN 117672089A
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- CN
- China
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- 239000011248 coating agent Substances 0.000 claims abstract description 141
- 239000000463 material Substances 0.000 claims abstract description 130
- 238000002310 reflectometry Methods 0.000 claims abstract description 101
- 230000003287 optical effect Effects 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims description 76
- 239000011521 glass Substances 0.000 claims description 12
- 230000003746 surface roughness Effects 0.000 claims description 10
- 230000007423 decrease Effects 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 5
- 238000012937 correction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011835 investigation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 241001423959 Merlia Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000005407 aluminoborosilicate glass Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011093 chipboard Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000000985 reflectance spectrum Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- WJCNZQLZVWNLKY-UHFFFAOYSA-N thiabendazole Chemical compound S1C=NC(C=2NC3=CC=CC=C3N=2)=C1 WJCNZQLZVWNLKY-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202263374956P | 2022-09-08 | 2022-09-08 | |
| US63/374,956 | 2022-09-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117672089A true CN117672089A (zh) | 2024-03-08 |
Family
ID=90077734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311158245.2A Pending CN117672089A (zh) | 2022-09-08 | 2023-09-08 | 具有降低的接缝可见性的显示拼接 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117672089A (fr) |
| WO (1) | WO2024054357A1 (fr) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6567138B1 (en) * | 1999-02-15 | 2003-05-20 | Rainbow Displays, Inc. | Method for assembling a tiled, flat-panel microdisplay array having imperceptible seams |
| WO2019083285A1 (fr) * | 2017-10-25 | 2019-05-02 | Samsung Electronics Co., Ltd. | Panneau à del et appareil d'affichage ayant ce dernier |
| US11164934B2 (en) * | 2019-03-12 | 2021-11-02 | X Display Company Technology Limited | Tiled displays with black-matrix support screens |
| KR20230003212A (ko) * | 2020-04-29 | 2023-01-05 | 코닝 인코포레이티드 | 타일링된 구성요소들을 갖는 디스플레이 장치 |
| KR20210141146A (ko) * | 2020-05-15 | 2021-11-23 | 삼성전자주식회사 | 디스플레이 모듈을 포함하는 디스플레이 장치 및 그 제조 방법 |
-
2023
- 2023-08-24 WO PCT/US2023/031007 patent/WO2024054357A1/fr unknown
- 2023-09-08 CN CN202311158245.2A patent/CN117672089A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024054357A1 (fr) | 2024-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |