CN117672081A

CN117672081A - Screen supporting structure, manufacturing method thereof, display assembly and electronic equipment

Info

Publication number: CN117672081A
Application number: CN202211064817.6A
Authority: CN
Inventors: 李洋洋; 秦圆; 苏兆梁
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-08-31
Filing date: 2022-08-31
Publication date: 2024-03-08
Also published as: WO2024046338A1

Abstract

The application provides a screen support structure, a manufacturing method thereof, a display assembly and electronic equipment. The screen support structure includes a substrate layer, an electrically conductive layer, and a thermally conductive layer. The base material is a fiber composite material. The substrate layer, the heat conduction layer and the conducting layer are arranged in a stacked mode, and the conducting layer is arranged on the outer layer of the screen supporting structure. The screen supporting structure is used for being fixedly connected with the display screen, and the conducting layer is located on one side, back to the display screen. The screen supporting structure further comprises a first bending part, the first bending part is provided with an opening, and the screen supporting structure can be bent along the first bending part. The screen bearing structure that this application provided can solve the technical problem that the screen bearing structure among the prior art heat conductivility is poor, heat dispersion is poor.

Description

Screen supporting structure, manufacturing method thereof, display assembly and electronic equipment

Technical Field

The application relates to the technical field of flexible display screens, in particular to a screen supporting structure, a manufacturing method thereof, a display assembly and electronic equipment.

Background

Electronic equipment such as folding mobile phones adopting the flexible display screen can realize changes of modes such as bending, folding, even winding and the like. In order to maintain flatness and rigidity of the flexible display screen, a support structure is provided under the screen. The existing screen supporting structure is mainly made of metal, however, the density and the weight of the metal are large, and the weight reduction of the electronic equipment is not facilitated. The screen support structure prepared from the fiber composite material can meet the requirement of light weight, however, the fiber composite material in the prior art has poor heat conduction performance and cannot meet the heat dissipation requirement of electronic equipment.

Disclosure of Invention

The application provides a screen supporting structure, a manufacturing method thereof, a display assembly and electronic equipment, and aims to solve the technical problems that the screen supporting structure in the prior art is poor in heat conducting performance and poor in heat radiating performance.

To solve the above problems, in a first aspect, the present application provides a screen support structure. The screen support structure includes a substrate layer, an electrically conductive layer, and a thermally conductive layer. The substrate is a fiber composite material. The substrate layer, the heat conducting layer and the electric conducting layer are arranged in a stacked mode, and the electric conducting layer is located on the outer layer of the screen supporting structure. The screen supporting structure is used for being fixedly connected with the display screen, and the conducting layer is located on one side, back to the display screen, of the conducting layer. The screen supporting structure further comprises a first bending part, an opening is formed in the first bending part, and the screen supporting structure can be bent along the first bending part.

In this embodiment, the fiber composite material is used as the substrate layer of the screen support structure, so that the strength requirement of the screen support structure can be met, and meanwhile, the light and thin screen support structure can be realized. In addition, the heat conduction layer and the electric conduction layer are arranged, so that the screen supporting structure has a heat conduction function and an electric conduction function, the heat dissipation requirement of the display screen can be met, the service life of the display screen is prolonged, and the electric conduction requirement can be met. Simultaneously, through set up the trompil at screen bearing structure's first kink for first kink can take place to buckle, thereby can realize the buckling of screen bearing structure and display module, and then make display module can be applied to in the collapsible electronic equipment.

In one possible embodiment, the substrate layers are multiple layers, and the heat conducting layer is arranged between the multiple substrate layers, or the heat conducting layer is laminated on the outer side of the multiple substrate layers. In this embodiment, the strength of the screen support structure may be further improved by providing a plurality of substrate layers and disposing the plurality of substrate layers on each other.

In one possible implementation manner, the substrate layers are at least two layers, the heat conducting layer is arranged between the at least two layers of the substrate layers and is laminated with the at least two layers of the substrate layers, and the electric conducting layer is arranged on the outermost side of the substrate layers and is opposite to the heat conducting layer.

In this embodiment, by providing at least two substrate layers, the strength of the screen support structure may be improved. And meanwhile, the heat conducting layer is arranged between at least two base material layers, so that the heat conducting layer can be protected, and the distance from the heat conducting layer to the opposite sides of the thickness direction of the screen supporting structure is equivalent, so that the heat conducting layer can conduct heat to the structures on the opposite sides of the thickness direction of the screen supporting structure at the same time.

In one possible implementation manner, the substrate layer has n layers, the heat conducting layer has m layers, n layers of the substrate layer and m layers of the heat conducting layer are alternately stacked, and two sides of each heat conducting layer are respectively provided with the substrate layer, wherein n is a positive integer greater than or equal to 2, m is a positive integer, and the value of n is greater than m.

In this embodiment, through setting up the multilayer heat conduction layer to with multilayer heat conduction layer and multilayer substrate layer alternate lamination setting, thereby can further promote screen bearing structure's heat dispersion, and then can further promote display module's heat dispersion.

In one possible implementation manner, the screen supporting structure further comprises a film layer and an adhesive layer, the film layer comprises a first surface and a second surface which are oppositely arranged, the conductive layer is laminated on the first surface and fixedly connected with the film layer, the adhesive layer is arranged on the second surface and is adhered to the film layer, and one side of the adhesive layer, which is opposite to the film layer, is fixedly connected with the substrate layer.

In this embodiment, the conductive layer is disposed on the surface of the thin film layer and then is fixedly connected with the substrate layer, so that the uniformity of the conductive layer can be improved, and the conductivity of the conductive layer can be improved. And under the condition that the resistance of the conductive layer meets the condition, the thickness of the conductive layer can be reduced by arranging the conductive layer on the surface of the film layer, so that the effects of saving raw materials and cost are achieved.

In one possible implementation manner, the heat conducting layer comprises a first heat conducting surface and a second heat conducting surface which are oppositely arranged, the electric conducting layer is arranged on the first heat conducting surface and fixedly connected with the heat conducting layer, and the second heat conducting surface is fixedly connected with the outermost substrate layer.

In this embodiment, the conductive layer is disposed on the surface of the heat conductive layer and then is fixedly connected with the substrate layer, so that the uniformity of the distribution of the conductive layer can be improved, and the conductivity of the conductive layer is further improved. In addition, in the embodiment, the conductive layer is deposited on the surface of the heat conducting layer and then is fixedly connected with the substrate layer, so that the process can be simplified, and the cost can be saved.

In one possible implementation manner, the screen supporting structure further includes an adhesive layer, the adhesive layer is disposed on the second heat conducting surface, and a side of the adhesive layer facing away from the heat conducting layer is fixedly connected with the outermost substrate layer.

In this embodiment, through setting up the adhesive linkage at the surface of heat conduction layer to with adhesive linkage and substrate layer bonding fixed, thereby realize the fixed connection of heat conduction layer and conducting layer and substrate layer, promoted the connection stability between heat conduction layer and conducting layer and the substrate layer, and simplified screen bearing structure's preparation technology, played the effect of saving the cost.

In a possible implementation manner, the heat conducting layer is provided with a plurality of through holes, and the through holes are arranged at intervals and penetrate through the first heat conducting surface and the second heat conducting surface; the conductive layer comprises a first body and a plurality of extending bodies, wherein the extending bodies are fixedly connected with the first body and are arranged on the surface of the first body at intervals. The first body is fixed on the first heat conduction surface, and one extension body is positioned in one through hole and fixedly connected with the inner wall of the corresponding through hole.

In this embodiment, through setting up the through-hole at the heat conduction layer to the conducting layer part is located the surface of heat conduction layer, and part is located the inner wall of through-hole, thereby can promote the stability that the conducting layer is connected with the heat conduction layer. And the conductive layer plays a role in riveting the heat conduction layer, and the conductive layer positioned in the through hole can improve the stability of the internal structure of the heat conduction layer. When the heat conduction layer is a graphene film, the interlayer strength of graphene can be enhanced by the conductive layer, and the problem of layering caused by insufficient interlayer strength is avoided.

In a possible implementation manner, the conductive layer further includes a second body, the first body is spaced from and parallel to the second body, and a plurality of the extension bodies are connected between the first body and the second body. The second body is fixed on the second heat conduction surface and is fixedly connected with the substrate layer.

In this embodiment, through setting up the through-hole at the heat conduction layer to the conductive layer is located the relative two surfaces of heat conduction layer, and runs through the through-hole of heat conduction layer, thereby can further promote the stability that the conductive layer is connected with the heat conduction layer. And, the conducting layer plays the through riveting effect to the heat conduction layer, can further promote heat conduction layer inner structure's stability. When the heat conduction layer is a graphene film, the interlayer strength of graphene can be enhanced by the conductive layer, and the problem of layering caused by insufficient interlayer strength is avoided.

In a possible implementation manner, the heat conducting layer comprises a first heat conducting surface and a second heat conducting surface which are oppositely arranged, and the heat conducting layer is provided with a plurality of through holes, and a plurality of through holes are distributed at intervals and penetrate through the first heat conducting surface and the second heat conducting surface. The screen supporting structure further comprises a plurality of connecting bodies, one connecting body is arranged in one through hole, and two opposite ends of the connecting body are fixedly connected with the substrate layers positioned on two sides of the heat conducting layer respectively.

In this embodiment, through setting up the through-hole at the heat conduction layer to set up the connector of being connected with first substrate layer and second substrate layer fixed connection in the through-hole, thereby can promote conducting layer and substrate layer connection stability. And the connector plays riveted effect to the heat conduction layer, can promote the stability of the inner structure of heat conduction layer. When the heat conduction layer is a graphene film, the connector can strengthen interlayer strength of graphene, and the problem of layering caused by insufficient interlayer strength is avoided.

In one possible embodiment, the fiber composite material includes fibers and a resin, the fibers being one or more of glass fibers, carbon fibers, aramid fibers, aluminum oxide fibers, and ultra-high molecular weight polyethylene fibers. The resin is one or more of epoxy resin, phenolic resin, amino resin, unsaturated polyester, silicone resin, polyolefin, polyamide, polyformaldehyde, polycarbonate, polyphenyl ether and polysulfone.

In this embodiment, the fiber composite material is used as the substrate layer of the screen support structure, so that the strength requirement of the screen support structure can be met, and meanwhile, the light and thin structure of the screen support structure can be realized, which is beneficial to realizing the light and thin structure of the electronic equipment.

In one possible embodiment, the fibers comprise 10% to 80% of the mass of the fiber composite material. In the embodiment, the weight fraction of the fiber is set to be 10% -80%, so that the mildness and toughness of the substrate layer are improved.

In one possible embodiment, one of the substrate layers has a thickness of 10 μm to 800 μm.

In this embodiment, the thickness of one substrate layer is set to be 10 μm-800 μm, so that the strength requirement of the screen support structure can be ensured, and the light and thin structure of the screen support structure can be realized.

In one possible embodiment, the thermal conductivity of the thermal conductive layer is greater than or equal to 500W/m x K.

In this embodiment, the thermal conductivity of the thermal conductive layer is set to be equal to or greater than 500W/m×k, so that the thermal conductive layer meets the thermal conductivity requirement, and the heat dissipation performance of the screen support structure is improved.

In one possible implementation manner, the material of the heat conducting layer is one or more of graphene, graphite, graphene oxide and redox graphene.

In this embodiment, graphene, graphite, graphene oxide or graphene oxide is used as the heat conducting layer, so that the heat conducting performance of the heat conducting layer is met, and meanwhile, the cost and the raw materials are saved.

In one possible embodiment, the thickness of the heat conducting layer is 1 μm to 200 μm.

In this embodiment, by setting the thickness of the heat conductive layer to 1 μm to 200 μm, on the one hand, the heat conductive performance of the screen support structure can be satisfied, and at the same time, the thickness of the screen support structure can be reduced as much as possible.

In one possible embodiment, the conductive layer is made of one or more of nickel, copper, silver, gold and tin.

In this embodiment, metals such as nickel, copper, silver, gold, tin, etc. are used as the conductive layer, so that the conductive performance of the screen support structure can be realized.

In a possible embodiment, the resistance of the conductive layer is less than 0.5 Ω. In this embodiment, the resistance of the conductive layer is set to be less than 0.5 Ω, so that the conductive layer has good conductivity, and can meet the conductive requirement of the screen support structure.

In one possible embodiment, the conductive layer has a thickness of 0.1 μm to 10 μm. In this embodiment, by setting the thickness of the conductive layer to 0.1 μm to 10 μm, on the one hand, the conductive performance of the screen support structure can be satisfied, while the thickness of the screen support structure can be reduced as much as possible.

In a second aspect, the present application provides a display assembly, including a display screen and the above-mentioned screen supporting structure, the screen supporting structure install in the back of display screen, and with display screen fixed connection, just the conducting layer is located and keeps away from one side of display screen.

In this embodiment, the screen supporting structure plays the supporting role to the display screen, can guarantee the good demonstration of display screen. Simultaneously, screen bearing structure has heat conduction and electric conduction performance, can dispel the heat to the display screen, avoids the display screen high temperature to cause the damage, can also satisfy the electrostatic shielding demand of display screen simultaneously.

In a third aspect, the present application provides an electronic device, including a middle frame and the display assembly described above, where the display assembly is mounted on the middle frame and is fixedly connected with the middle frame, and the conductive layer faces the middle frame.

In this embodiment, the display component with heat conduction and electric conduction properties is disposed in the electronic device, so that on one hand, the heat dissipation requirement of the display component can be met, and on the other hand, the radio frequency and electrostatic shielding requirements of the electronic device can be met.

In a fourth aspect, the present application provides a method for preparing a screen support structure, for preparing the screen support structure, where the method includes:

Providing a substrate layer of fibrous composite material;

providing a heat conduction layer and a conductive layer, wherein the heat conduction layer and the conductive layer are arranged on the substrate layer in a laminated mode, and are fixedly connected with the substrate layer to obtain the screen supporting structure, the screen supporting structure comprises a first bending part, and a plurality of openings are formed in the first bending part.

In this embodiment, through setting up heat conduction layer and conducting layer, make the screen bearing structure of preparation have heat conduction function and electrically conductive function simultaneously, both can satisfy the heat dissipation demand of display screen, can satisfy the electricity connection demand again. In addition, in this embodiment, the opening is formed in the first bending portion, so that the first bending portion can bend, and therefore, bending of the screen supporting structure and the display assembly can be achieved, and the display assembly can be applied to foldable electronic equipment.

In one possible embodiment, the step of providing a heat conducting layer and an electrically conducting layer, disposing the heat conducting layer and the electrically conducting layer on the substrate layer, and fixedly connecting the heat conducting layer and the electrically conducting layer to the substrate layer, to obtain the screen supporting structure includes:

arranging the heat conduction layer and the base material layer in a layer-by-layer manner, and fixedly connecting the heat conduction layer and the base material layer to obtain a first support structure, wherein the first support structure comprises a first sub-bending part;

Opening holes in the first sub-bending parts to obtain a plurality of holes so as to obtain a second supporting structure;

and stacking and fixedly connecting the conductive layer and the second supporting structure to obtain the screen supporting structure.

The first sub-bend is here part of the first bend. In this embodiment, the conductive layer is fixedly connected with the substrate layer, and then the conductive layer is fixedly connected, so that the process for forming the conductive layer and the conductive layer can be simplified.

In a possible embodiment, the second support structure includes a first face and a second face that are disposed opposite to each other, and the step of laminating and fixedly connecting the conductive layer and the second support structure to obtain the screen support structure includes:

masking the second surface, and carrying out acid washing or alkali washing on the first surface;

depositing a catalyst on the first side;

immersing the second support structure subjected to acid washing or alkali washing and catalyst deposition in electroplating liquid to enable the first surface to deposit the conductive layer, so as to obtain the screen support structure.

In this embodiment, the conductive layer is formed by adopting a chemical plating manner, so that the uniformity of distribution of the conductive layer can be improved, and the uniformity of heat dissipation of the screen support structure can be improved.

In one possible embodiment, the substrate layer is at least two layers, and the step of providing a heat conducting layer and laminating the heat conducting layer and the substrate layer includes providing the heat conducting layer between at least two layers of the substrate layers.

In one possible embodiment, the substrate layer has n layers, the heat conducting layer has m layers, n is a positive integer greater than or equal to 2, m is a positive integer, and the value of n is greater than m; the step of providing a heat conducting layer and laminating the heat conducting layer and the substrate layer comprises the step of alternately laminating n layers of the substrate layer and m layers of the heat conducting layer.

In a possible embodiment, the step of laminating and fixedly connecting the conductive layer and the second support structure to obtain the screen support structure includes:

providing a film layer and a conductive substrate, wherein the film layer comprises a first surface and a second surface which are oppositely arranged, the conductive substrate is deposited on the first surface to form the conductive layer, and the film layer and the conductive layer jointly form a first conductive structure;

providing an adhesive layer, and adhering the adhesive layer to the second surface of the first conductive structure to obtain a second conductive structure;

and bonding the second conductive structure on the surface of the second supporting structure to obtain the screen supporting structure.

Providing an electric conduction substrate, wherein the heat conduction layer comprises a first heat conduction surface and a second heat conduction surface, the electric conduction substrate is deposited on the first heat conduction surface to form the electric conduction layer, and the heat conduction layer and the electric conduction layer jointly form the heat conduction and electric conduction layer;

the second heat conduction surface of the heat conduction and electric conduction layer faces the substrate layer and is fixedly connected with the substrate layer to obtain a third support structure, and the third support structure comprises a second sub-bending part;

and opening holes in the second sub-bending parts to obtain a plurality of holes so as to obtain the screen supporting structure.

The second sub-bending part is the first bending part of the screen supporting structure. In this embodiment, the conductive layer is disposed on the surface of the heat conductive layer and then is fixedly connected with the substrate layer, so that the uniformity of the distribution of the conductive layer can be improved, and the conductivity of the conductive layer is further improved. In addition, in the embodiment, the conductive layer is deposited on the surface of the heat conducting layer and then is fixedly connected with the substrate layer, so that the process can be simplified, and the cost can be saved.

In a possible embodiment, the step of "directing the second heat-conducting surface of the heat-conducting and electrically-conducting layer towards the substrate layer, and fixedly connecting the second heat-conducting surface of the heat-conducting and electrically-conducting layer to the substrate layer, to obtain the third support structure" further includes: and providing an adhesive layer, and adhering one surface of the adhesive layer to the second heat conduction surface and the other surface to the surface of the substrate layer to obtain the screen supporting structure.

In one possible embodiment, the step of providing an electrically conductive substrate, the thermally conductive layer including a first thermally conductive surface and a second thermally conductive surface, depositing the electrically conductive substrate on the first thermally conductive surface to form the electrically conductive layer, the thermally conductive layer and the electrically conductive layer together comprising a thermally conductive electrically conductive layer includes:

forming a plurality of through holes which are arranged at intervals on the surface of the heat conducting layer, wherein the through holes penetrate through the first heat conducting surface and the second heat conducting surface;

and depositing the conductive substrate on the first heat conduction surface and the inner wall of the through hole to form the conductive layer.

the heat conduction layer comprises a first heat conduction surface and a second heat conduction surface, holes are formed in the surface of the heat conduction layer, a plurality of through holes are formed in the surface of the heat conduction layer at intervals, and the through holes penetrate through the first heat conduction surface and the second heat conduction surface;

and depositing the conductive substrate on the first heat conduction surface, the second heat conduction surface and the inner wall of the through hole to form the conductive layer.

In one possible implementation manner, the substrate layer is at least two layers, and the step of disposing the heat conducting layer on the substrate layer and fixedly connecting the heat conducting layer and the substrate layer to obtain the first support structure includes:

and arranging the heat conduction layer with the through holes between at least two substrate layers, and heating, pressurizing and solidifying the heat conduction layer so that part of the substrate layers enter the through holes to obtain the first supporting structure.

In conclusion, the fiber composite material is adopted as the substrate layer of the screen supporting structure, so that the strength requirement of the screen supporting structure can be met, and meanwhile, the light and thin structure of the screen supporting structure can be realized. In addition, the heat conduction layer and the electric conduction layer are arranged, so that the screen supporting structure has a heat conduction function and an electric conduction function, the heat dissipation requirement of the display screen can be met, the service life of the display screen is prolonged, and the electric conduction requirement can be met. Simultaneously, set up the trompil through the kink at screen bearing structure for the kink can take place to buckle, thereby can realize the buckling of screen bearing structure and display module, and then make display module can be applied to in the collapsible electronic equipment.

Drawings

In order to more clearly describe the technical solutions in the embodiments or the background of the present application, the following description will describe the drawings that are required to be used in the embodiments or the background of the present application.

Fig. 1 is a schematic structural diagram of an electronic device provided in the present application;

FIG. 2 is an exploded view of the electronic device of FIG. 1;

FIG. 3 is an exploded view of the display assembly of the electronic device of FIG. 2;

FIG. 4 is a schematic view of a portion of a screen support structure according to a first embodiment of the present application;

FIG. 5 is a schematic view of a portion of a screen support structure according to a second embodiment of the present application;

FIG. 6 is a schematic view of a portion of a screen support structure according to a third embodiment of the present application;

FIG. 7 is a schematic view of a portion of a screen support structure according to a fourth embodiment of the present application;

FIG. 8 is a schematic view of a portion of a screen support structure according to a fifth embodiment of the present application;

FIG. 9 is a schematic view of a portion of a screen support structure according to a sixth embodiment of the present application;

fig. 10 is a schematic view of a part of a structure of a screen support structure according to a seventh embodiment of the present application;

FIG. 11 is a schematic view of a portion of a screen support structure according to an eighth embodiment of the present application;

FIG. 12 is a first embodiment of a method of making a screen support structure provided herein;

FIG. 13 is a second embodiment of a method of making a screen support structure provided herein;

FIG. 14 is a third embodiment of a method of making a screen support structure provided herein;

FIG. 15 is a fourth embodiment of a method of making a screen support structure provided herein;

FIG. 16 is a fifth embodiment of a method of making a screen support structure provided herein;

FIG. 17 is a sixth embodiment of a method of making a screen support structure provided herein;

FIG. 18 is a seventh embodiment of a method of making a screen support structure provided herein;

fig. 19 is an eighth embodiment of a method of making a screen support structure provided herein.

Detailed Description

Embodiments of the present application are described below with reference to the accompanying drawings in the embodiments of the present application.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an electronic device 500 provided in the present application, and fig. 2 is an exploded structural diagram of the electronic device 500 shown in fig. 1.

For convenience of description, the width direction of the electronic apparatus 500 is defined as a direction, the length direction is defined as a Y direction, and the thickness direction is defined as a Z direction. The X direction, the Y direction and the Z direction are perpendicular to each other.

Electronic device 500 includes, but is not limited to, a foldable electronic product such as a cell phone, tablet computer, personal computer, notebook computer, wearable device, and the like. In the embodiment of the present application, the electronic device 500 is taken as an example of a folding mobile phone.

The electronic device 500 includes a folding apparatus 300 and a display assembly 200. The display assembly 200 is mounted to the folding device 300. The display assembly 200 includes a display surface 210 and a mounting surface 220, the display surface 210 and the mounting surface 220 being disposed opposite. The display surface 210 is used for displaying text, images, videos, and the like. The display assembly 200 includes a first portion 201, a second portion 202, and a foldable portion 203. The foldable portion 203 is located between the first portion 201 and the second portion 202, and the foldable portion 203 may be bent in the Y direction. The first portion 201, the second portion 202, and the foldable portion 203 together comprise the display assembly 200.

The folding device 300 includes a first housing 310, a second housing 320, and a rotation mechanism (not shown) disposed between the first housing 310 and the second housing 320. The rotation of the rotation mechanism can drive the first housing 310 and the second housing 320 to rotate, so as to realize the relative rotation of the first housing 310 and the second housing 320. The display assembly 200 is mounted on the folding device 300, and the mounting surface 220 is fixedly connected with the folding device 300. The first portion 201 is mounted to the first housing 310 and the second portion 202 is mounted to the second housing 320. The rotation mechanism is disposed opposite the foldable portion 203. The first housing 310 and the second housing 320 are relatively rotatable by a rotation mechanism, so that the folding device 300 is switched between a folded state and a unfolded state, and the foldable portion 203 of the display assembly 200 is folded and unfolded.

Referring to fig. 3, fig. 3 is an exploded view of the display assembly 200 in the electronic device 500 shown in fig. 2.

The display assembly 200 includes a display screen 230 and a screen support structure 100. The display 230 is a flexible display. Flexible display screens include, but are not limited to, organic light-emitting diode (OLED) display screens, active-matrix organic light-emitting diode (OLED) or active-matrix organic light-emitting diode (AMOLED) display screens, and the like. The display 230 includes a first display portion 2301, a second display portion 2302, and a second bending portion 2303. The first display portion 2301, the second bending portion 2303, and the second display portion 2302 are arranged side by side in the X direction, and the second bending portion 2303 is connected between the first display portion 2301 and the second display portion 2302.

The screen support structure 100 includes a first support portion 101, a second support portion 102, and a first bending portion 103. The first supporting portion 101, the first bending portion 103, and the second supporting portion 102 are disposed side by side along the X direction, and the first bending portion 103 is connected between the first supporting portion 101 and the second supporting portion 102. The first bending portion 103 is provided with an opening 104. The openings 104 are plural, the openings 104 are arranged at intervals at the first bending portion 103, and each opening 104 penetrates through the screen support structure 100 in the thickness direction. Of course, the openings 104 may extend through one of the surfaces of the screen support structure 100, or the openings 104 may be located within the screen support structure 100 and not extend through the surface of the screen support structure 100. The aperture 104 has a diameter of 0.01mm to 2mm. The gap between two adjacent openings 104 is 0.01 mm-2.0 mm. In this embodiment, the openings 104 are machined by a computer numerical control machine (Computer numerical control, CNC). In other embodiments, the openings 104 may be laser cut, punched, etched, etc.

The screen support structure 100 is mounted on the back of the display screen 230 and is fixedly connected to the display screen 230 for supporting the display screen 230. The first supporting portion 101 is disposed opposite to the first display portion 2301, the second supporting portion 102 is disposed opposite to the second display portion 2302, and the first bending portion 103 is disposed opposite to the second bending portion 2303. It will be appreciated that the first support 101 and the first display 2301 together comprise the first portion 201 of the display assembly 200, the second support 102 and the second display 2302 together comprise the second portion 202, and the first bend 103 and the second bend 2303 together comprise the foldable portion 203. The rotation mechanism drives the first housing 310 and the second housing 320 to rotate relatively, so as to drive the foldable portion 203 of the display assembly 200 to bend, thereby bending the second bending portion 2303 and the first bending portion 103 simultaneously.

In this embodiment, the opening 104 is provided in the first bending portion 103, so that the first bending portion 103 can be bent when receiving an external force, thereby bending the screen supporting structure 100, and further bending the display assembly 200, so that the electronic device 500 can be switched between the folded state and the flattened state.

The screen support structure 100 is described in more detail below.

Referring to fig. 4, fig. 4 is a schematic view of a portion of a screen support structure 100 according to a first embodiment of the present application.

The screen support structure 100 includes a substrate layer 10, a thermally conductive layer 20, and an electrically conductive layer 30. The heat conducting layer 20 and the electric conducting layer 30 are both stacked with the substrate layer 10 and fixedly connected with the substrate layer 10. The screen support structure 100 is mounted on the back surface of the display screen 230, and one side of the screen support structure 100, which is close to the substrate layer 10, faces the back surface of the display screen 230, is fixedly connected with the display screen 230, and one side of the screen support structure 100, which is close to the conductive layer 30, faces the middle frame of the electronic device 500, is fixedly connected with the middle frame, and is used for grounding, so that the radio frequency and electrostatic shielding requirements of the electronic device 500 can be met.

The substrate layer 10 is a fibrous composite material. The fiber composite refers to a composite of a fiber material and a resin. In this embodiment, the base material layer 10 is obtained from a fiber prepreg resin by hot press molding. The fibers include, but are not limited to, glass fibers, carbon fibers, aramid fibers, aluminum oxide fibers, ultra high molecular weight polyethylene fibers, and the like. The fiber may be any one of glass fiber, carbon fiber, aramid fiber, aluminum oxide fiber and ultra-high molecular weight polyethylene fiber, or may be a combination of two or more of glass fiber, carbon fiber, aramid fiber, aluminum oxide fiber and ultra-high molecular weight polyethylene fiber. For example, the fibers may be a mixture of glass fibers and carbon fibers, or a mixture of aramid fibers, aluminum oxide fibers, and ultra-high molecular weight polyethylene fibers. The starting material for the prepreg resin may be a thermosetting resin including, but not limited to, epoxy resins, phenolic resins, amino resins, unsaturated polyesters, silicone resins, and the like. The starting material for the prepreg resin may also be a thermoplastic resin including, but not limited to, polyolefin, polyamide, polyoxymethylene, polycarbonate, polyphenylene oxide, polysulfone, and the like. The resin may be any one of epoxy resin, phenolic resin, amino resin, unsaturated polyester, silicone resin, polyolefin, polyamide, polyoxymethylene, polycarbonate, polyphenylene oxide and polysulfone, or may be a combination of two or more. For example, the resin may be a mixture of epoxy resin, phenolic resin and amino resin, or a mixture of polyoxymethylene, polycarbonate, polyphenylene oxide and polysulfone. Wherein, the fiber accounts for 10 to 80 percent of the total mass of the substrate layer 10. That is, the fiber content is 10wt% to 80wt%. The fibers in the substrate layer 10 may be woven from one or more fibers in various forms such as plain, twill, or satin.

The number of the base material layers 10 is plural. Wherein the thickness of each substrate layer 10 is 10 μm to 800 μm. In this embodiment, the substrate layer 10 includes four substrate layers 10. In other embodiments, the substrate layer 10 may be two, three, or more than five. The number of substrate layers 10 is not limited herein, and the specific number of substrate layers 10 may be adjusted according to the total thickness of the screen support structure 100 and the thickness of one substrate layer 10.

In the present embodiment, the four substrate layers 10 are a first substrate layer 11, a second substrate layer 12, a third substrate layer 13, and a fourth substrate layer 14, respectively. The thicknesses of the first substrate layer 11, the second substrate layer 12, the third substrate layer 13 and the fourth substrate layer 14 were all 40 μm. In other embodiments, the thickness of the first substrate layer 11 may also be greater than 10 μm and less than 40 μm, or greater than 40 μm and less than 800 μm. The thickness of the second substrate layer 12 may also be greater than 10 μm and less than 40 μm, or greater than 40 μm and less than 800 μm. The thickness of the third substrate layer 13 may also be greater than 10 μm and less than 40 μm, or greater than 40 μm and less than 800 μm. The fourth substrate layer 14 may be greater than 10 μm and less than 40 μm, or greater than 40 μm and less than 800 μm.

The first substrate layer 11 and the second substrate layer 12 are stacked, and the layering angle of the first substrate layer 11 is 90 ° and the layering angle of the second substrate layer 12 is 0 °. The third substrate layer 13 and the fourth substrate layer 14 are stacked, and the layering angle of the third substrate layer 13 is 0 °, and the layering angle of the fourth substrate layer 14 is 90 °. In other embodiments, the layering angles of the first substrate layer 11, the second substrate layer 12, the third substrate layer 13, and the fourth substrate layer 14 may be other angles, as long as the layering angle of each substrate layer 10 is 0 ° to 90 °. The layering angles of the first substrate layer 11, the second substrate layer 12, the third substrate layer 13, and the fourth substrate layer 14 may be identical, may be partially identical, or may be completely different. As used herein, "ply angle" refers to the angle between the fiber orientation direction and the X direction.

In this embodiment, the heat conducting layer 20 is a graphene film. The thermal conductivity of the thermal conductive layer 20 was 1500W/m x K. In other embodiments, the material of the heat conducting layer 20 may be graphite, graphene oxide or graphene oxide. The heat conductive layer 20 may be a combination of two or more of graphene, graphite, graphene oxide, and graphene oxide. For example, the heat conductive layer 20 may be a mixture of graphene and graphite, or a mixture of graphene and graphene oxide. Of course, the material of the heat conductive layer 20 may be other heat conductive materials, as long as the heat conductive coefficient of the heat conductive layer 20 is greater than or equal to 500W/m×k, or greater than or equal to 800W/m×k.

In this embodiment, the thickness of the heat conductive layer 20 is 10 μm. In other embodiments, the thickness of the thermally conductive layer 20 may be greater than 1 μm and less than 10 μm, or the thickness of the thermally conductive layer 20 may be greater than 10 μm and less than 200 μm. That is, the thickness of the heat conductive layer 20 ranges from 1 μm to 200 μm.

The heat conducting layer 20 is located between the second substrate layer 12 and the third substrate layer 13, and is fixedly connected with the second substrate layer 12 and the third substrate layer 13. That is, the first substrate layer 11, the second substrate layer 12, the heat conductive layer 20, the third substrate layer 13, and the fourth substrate layer 14 are sequentially stacked in the thickness direction (Z direction) of the screen support structure 100 and are fixedly connected to each other. In this embodiment, the first substrate layer 11, the second substrate layer 12, the heat conductive layer 20, the third substrate layer 13 and the fourth substrate layer 14 are fixedly connected by heating, pressurizing and curing. In other embodiments, the fixed connection may be achieved in other ways.

In this embodiment, the material of the conductive layer 30 is nickel, and the conductive layer 30 is a layer. In other embodiments, the conductive layer 30 may be made of copper, silver, gold, tin, or other metals. The conductive layer 30 may also be a combination of two or more of nickel, copper, silver, gold, and tin. For example, the conductive layer 30 may be a mixture of nickel and copper, or a mixture of silver, gold, and tin. The conductive layer 30 may have a two-layer or three-layer structure. In this embodiment, the thickness of the conductive layer 30 is 5 μm, and the resistance of the conductive layer 30 is less than 0.5Ω. In other embodiments, the thickness of the conductive layer 30 may also be less than 5 μm and greater than 0.1 μm, or greater than 5 μm and less than 10 μm. That is, the thickness of the conductive layer 30 ranges from 0.1 μm to 10 μm. Alternatively, the thickness of the conductive layer 30 may be in the range of 1 μm to 10 μm. In this embodiment, by setting the thickness of the conductive layer 30 to 1 μm to 10 μm, on the one hand, the conductivity of the conductive layer 30 can be ensured, thereby ensuring the conductivity of the screen support structure 100, and on the other hand, the effect of saving cost can be achieved.

In this embodiment, the conductive layer 30 is formed on the surface of the fourth substrate layer 14 facing away from the third substrate layer 13 by electroless plating. In other embodiments, the conductive layer 30 may also be formed by vacuum plating, coating, or thermal compression.

In the present embodiment, the plurality of openings 104 are provided, and the plurality of openings 104 are disposed at the first bending portion 103 of the screen support structure 100 and penetrate through the first substrate layer 11, the second substrate layer 12, the heat conducting layer 20, the third substrate layer 13 and the fourth substrate layer 14. In this embodiment, the aperture of each opening 104 is 0.12mm, and the gap between two adjacent openings 104 is 0.25mm. In other embodiments, the aperture diameter of each aperture 104 may be greater than or equal to 0.01mm and less than 0.12mm, or greater than or equal to 0.12mm and less than or equal to 2mm. The gap between two adjacent openings 104 may be greater than or equal to 0.01mm and less than 0.25mm, or greater than or equal to 0.25mm and less than or equal to 2.0mm. In this embodiment, the openings 104 are obtained using an ultraviolet laser device. In other embodiments, the openings 104 may be punched, etched, or the like.

In this embodiment, the fiber composite material is used as the substrate layer 10 of the screen support structure 100, so as to meet the strength requirement of the screen support structure 100, and at the same time, realize the light and thin structure of the screen support structure 100. In addition, in this embodiment, by setting the heat conducting layer 20 and the conductive layer 30, the screen supporting structure 100 has both a heat conducting function and a conductive function, which can meet the heat dissipation requirement of the display screen 230, improve the service life of the display screen 230, and meet the conductive requirement. Meanwhile, by providing the opening 104 at the first bending portion 103 of the screen supporting structure 100, the first bending portion 103 may be bent, so that bending of the screen supporting structure 100 and the display assembly 200 may be achieved, and the display assembly 200 may be applied to the foldable electronic device 500. In addition, the openings 104 are formed in the substrate layer 10 and the heat conductive layer 20, so that the bending performance of the screen support structure 100 can be achieved, and meanwhile, the electric conductivity of the electric conductive layer 30 can be ensured.

In another implementation of this embodiment, the heat conducting layer 20 is graphite, and the heat conductivity coefficient is 1000W/m×k. In this embodiment, the thickness of the heat conductive layer 20 is 17 μm. In this embodiment, graphite is used as the heat conductive layer 20, so that the heat conductive performance of the heat conductive layer 20 is ensured, and the effect of saving cost is achieved.

Referring to fig. 5, fig. 5 is a schematic view of a portion of a screen support structure 100 according to a second embodiment of the present application.

This embodiment differs from the embodiment shown in fig. 4 in that in this embodiment, the heat conductive layer 20 has three layers. The three heat conductive layers 20 are a first heat conductive layer 21, a second heat conductive layer 22, and a third heat conductive layer 23, respectively. The first heat conduction layer 21, the second heat conduction layer 22 and the third heat conduction layer 23 are all graphene films, and the thicknesses are all 10 μm. The thermal conductivity of the thermal conductive layer 20 is greater than or equal to 1000W/mK. In this embodiment, the thermal conductivity of the thermal conductive layer 20 is 1500W/mK.

Wherein the layering angle of the first substrate layer 11 is 90 ° and the layering angle of the second substrate layer 12 is 0 °. The third substrate layer 13 was laid at an angle of 0 ° and the fourth substrate layer 14 was laid at an angle of 90 °. The thicknesses of the first substrate layer 11, the second substrate layer 12, the third substrate layer 13 and the fourth substrate layer 14 were all 30 μm. The first heat conductive layer 21 is located between the first substrate layer 11 and the second substrate layer 12, the second heat conductive layer 22 is located between the second substrate layer 12 and the third substrate layer 13, and the third heat conductive layer 23 is located between the third substrate layer 13 and the fourth substrate layer 14.

In this embodiment, the conductive layer 30 is made of nickel. The conductive layer 30 is formed on the surface of the fourth substrate layer 14 facing away from the third heat conductive layer 23 by an electroless plating method, and is fixedly connected with the fourth substrate layer 14. In this embodiment, the thickness of the conductive layer 30 is 5 μm and the resistance is less than 0.5Ω.

In this embodiment, the plurality of openings 104 are provided, and the plurality of openings 104 are disposed at the first bending portion 103 of the screen support structure 100 and penetrate through the first substrate layer 11, the first heat conductive layer 21, the second substrate layer 12, the second heat conductive layer 22, the third substrate layer 13, the third heat conductive layer 23 and the fourth substrate layer 14.

In this embodiment, by providing the heat conducting layer 20 and the electric conducting layer 30, the screen supporting structure 100 has both a heat conducting function and an electric conducting function, which can satisfy both the heat dissipation requirement of the display screen 230 and the electric connection requirement. In addition, in this embodiment, by arranging three heat conducting layers 20 and arranging three heat conducting layers 20 between two adjacent substrate layers 10, the heat dissipation performance of the screen supporting structure 100 can be further improved, and the heat dissipation performance of the display assembly 200 can be further improved.

Referring to fig. 6, fig. 6 is a schematic view of a portion of a screen support structure 100 according to a third embodiment of the present application.

This embodiment differs from the embodiment shown in fig. 4 in that in this embodiment, the screen support structure 100 further comprises an adhesive layer 40 and a film layer 50. The conductive layer 30 is disposed on the surface of the film layer 50, and the adhesive layer 40 is adhered to the surface of the film layer 50 facing away from the conductive layer 30 and fixedly connected to the substrate layer 10.

The first substrate layer 11 and the second substrate layer 12 are stacked, and the third substrate layer 13 and the fourth substrate layer 14 are stacked. The heat conducting layer 20 is a graphene film, and the heat conducting layer 20 is disposed between the second substrate layer 12 and the third substrate layer 13 and is fixedly connected with the second substrate layer 12 and the third substrate layer 13.

The film layer 50 includes a first surface 51 and a second surface 52. The first surface 51 and the second surface 52 are disposed opposite to each other and located on opposite sides of the thickness direction of the thin film layer 50. In this embodiment, the material of the film layer 50 is polyethylene terephthalate (Polyethylene terephthalate, PET). In other embodiments, the material of the film layer 50 may be any one or more of Polyimide (PI), polyethylene naphthalate (Polyethylene naphthalate two formic acid glycol ester, PEN), polyaramid (Aramid), polyamide (PA) and Polycarbonate (PC). In this embodiment, the thickness of the thin film layer 50 is 15 μm. In other embodiments, the thickness of the thin film layer 50 may be less than 15 μm and equal to or greater than 5 μm, or the thickness of the thin film layer 50 may be greater than 15 μm and equal to or less than 200 μm. That is, the thickness of the thin film layer 50 ranges from 5 μm to 200 μm. In this embodiment, the thickness of the thin film layer 50 is set to be 5 μm-200 μm, so that the strength requirement of the thin film layer 50 can be ensured, the damage to the thin film layer 50 is avoided, and meanwhile, the thickness of the screen supporting structure 100 can be reduced, which is beneficial to realizing the light and thin electronic device 500.

Wherein the modulus of the thin film layer 50 is 1GPa to 12GPa. In this embodiment, by using a material with a modulus of 1 GPa-12 GPa as the thin film layer 50, the rigidity and elasticity of the thin film layer 50 can meet the requirements, so as to avoid the thin film layer 50 from being broken or damaged during the preparation or use of the screen support structure 100, and improve the durability of the screen support structure 100.

In this embodiment, the conductive layer 30 is made of copper. In other embodiments, the conductive layer 30 may be made of a metal material such as silver, gold, nickel, tin, etc. In this embodiment, the thickness of the conductive layer 30 is 1 μm. In other embodiments, the thickness of the conductive layer 30 may be less than 1 μm and equal to or greater than 0.1 μm, or the thickness of the conductive layer 30 may be greater than 1 μm and equal to or less than 10 μm. That is, the thickness of the thin film layer 50 ranges from 0.1 μm to 10 μm. In this embodiment, by setting the thickness of the conductive layer 30 to 0.1 μm to 10 μm, the conductive performance of the conductive layer 30 can be ensured, and at the same time, the thickness of the screen support structure 100 can be reduced, which is advantageous for realizing the light and thin electronic device 500.

The conductive layer 30 is disposed on the first surface 51 of the thin film layer 50 and is fixedly connected to the thin film layer 50. In this embodiment, the conductive layer 30 is formed on the first surface 51 of the thin film layer 50 by physical vapor deposition (Physical Vapor Deposition, PVD).

In this embodiment, the adhesive layer 40 is OCA (Optically Clear Adhesive) optical cement. In other embodiments, the adhesive layer 40 may be other double sided adhesive, or glue. In this embodiment, the thickness of the adhesive layer 40 is 10. Mu.m. In other embodiments, the thickness of the adhesive layer 40 may also be less than 10 μm, or greater than 10 μm. The adhesive layer 40 is adhered to the second surface 52 of the film layer 50. The surface of the adhesive layer 40 facing away from the film layer 50 is adhered to the surface of the fourth substrate layer 14 facing away from the third substrate layer 13 and is fixedly connected with the fourth substrate layer 14, so that the adhesive layer 40, the film layer 50 and the conductive layer 30 are fixedly connected with the substrate layer 10. In this embodiment, the first substrate layer 11, the second substrate layer 12, the heat conductive layer 20, the third substrate layer 13, the fourth substrate layer 14, the adhesive layer 40, the thin film layer 50 and the conductive layer 30 are sequentially stacked and fixedly connected.

In the present embodiment, the plurality of openings 104 are provided, and the plurality of openings 104 are disposed at the first bending portion 103 of the screen support structure 100 and penetrate through the first substrate layer 11, the second substrate layer 12, the heat conducting layer 20, the third substrate layer 13 and the fourth substrate layer 14.

It will be appreciated that the surface of the thin film layer 50 has a higher flatness relative to the surface of the substrate layer 10, and that the conductive layer 30 has better conductivity when it is positioned on the surface of the thin film layer 50 with a uniform thickness of the conductive layer 30. In this embodiment, the conductive layer 30 is disposed on the surface of the thin film layer 50 and then is fixedly connected with the substrate layer 10, so that the uniformity of the conductive layer 30 can be improved, and the conductivity of the conductive layer 30 can be improved. In addition, when the resistance of the conductive layer 30 satisfies the condition, the thickness of the conductive layer 30 can be reduced by providing the conductive layer 30 on the surface of the thin film layer 50, thereby saving raw materials and cost.

Referring to fig. 7, fig. 7 is a schematic view of a portion of a screen support structure 100 according to a fourth embodiment of the present disclosure.

The difference between this embodiment and the embodiment shown in fig. 4 is that the heat conducting layer 20 and the conductive layer 30 are stacked, and the surface of the heat conducting layer 20 facing away from the conductive layer 30 is fixedly connected with the substrate layer 10.

In this embodiment, the angle of layering of the first substrate layer 11 is 90 °, the angle of layering of the second substrate layer 12 is 0 °, the angle of layering of the third substrate layer 13 is 0 °, and the angle of layering of the fourth substrate layer 14 is 90 °. The thicknesses of the first substrate layer 11, the second substrate layer 12, the third substrate layer 13 and the fourth substrate layer 14 were all 40 μm. The first base material layer 11, the second base material layer 12, the third base material layer 13, and the fourth base material layer 14 are stacked in this order.

In this embodiment, the heat conducting layer 20 is a graphene film, and the thickness is 10 μm. The thermal conductivity of the thermal conductive layer 20 is greater than or equal to 800W/mK. In this embodiment, the thermal conductivity of the thermal conductive layer 20 is 1500W/mK. The heat conducting layer 20 includes a first heat conducting surface 201 and a second heat conducting surface 202, and the first heat conducting surface 201 and the second heat conducting surface 202 are disposed opposite to each other and are located on opposite sides of the thickness direction of the heat conducting layer 20.

The conductive layer 30 is disposed on the first heat conductive surface 201 of the heat conductive layer 20 and is fixedly connected to the heat conductive layer 20. In this embodiment, the conductive layer 30 is formed on the first heat conductive surface 201 by physical vapor deposition (Physical Vapor Deposition, PVD).

The second heat conducting surface 202 of the heat conducting layer 20 faces the fourth substrate layer 14 and is fixedly connected with the fourth substrate layer 14. In this embodiment, the heat conducting layer 20 is fixedly connected to the fourth substrate layer 14 by heating, pressurizing and curing. The first substrate layer 11, the second substrate layer 12, the third substrate layer 13, the fourth substrate layer 14, the heat conductive layer 20, and the conductive layer 30 are sequentially stacked.

In the present embodiment, the plurality of openings 104 are provided, and the plurality of openings 104 are disposed at the first bending portion 103 of the screen support structure 100 and penetrate through the first substrate layer 11, the second substrate layer 12, the third substrate layer 13, the fourth substrate layer 14, the heat conductive layer 20 and the conductive layer 30.

In this embodiment, the conductive layer 30 is disposed on the surface of the conductive layer 20 and then is fixedly connected with the substrate layer 10, so that the screen support structure 100 has both the functions of heat conduction and electrical conduction, and the uniformity of the distribution of the conductive layer 30 can be improved, so that the electrical conductivity of the conductive layer 30 is improved. In addition, in the present embodiment, the conductive layer 30 is deposited on the surface of the heat conductive layer 20 and then is fixedly connected with the substrate layer 10, so that the process can be simplified and the cost can be saved.

Referring to fig. 8, fig. 8 is a schematic view of a portion of a screen support structure 100 according to a fifth embodiment of the present disclosure.

This embodiment differs from the embodiment shown in fig. 7 in that in this embodiment, the screen support structure 100 further comprises an adhesive layer 40. The bonding layer 40 is bonded to the second heat conducting surface 202 of the heat conducting layer 20, and the surface of the bonding layer 40 facing away from the heat conducting layer 20 is bonded to the surface of the fourth substrate layer 14 facing away from the third substrate layer 13 and is fixedly connected with the fourth substrate layer 14, so that the fixed connection of the bonding layer 40, the heat conducting layer 20 and the electric conducting layer 30 with the substrate layer 10 is realized. That is, the first base material layer 11, the second base material layer 12, the third base material layer 13, the fourth base material layer 14, the adhesive layer 40, the heat conductive layer 20, and the conductive layer 30 are stacked in this order.

In this embodiment, the adhesive layer 40 is OCA optical adhesive. In other embodiments, the adhesive layer 40 may be other double sided adhesive, or glue. In this embodiment, the thickness of the adhesive layer 40 is 10. Mu.m. In other embodiments, the thickness of the adhesive layer 40 may also be less than 10 μm, or greater than 10 μm.

In this embodiment, the plurality of openings 104 are provided, and the plurality of openings 104 are disposed at the first bending portion 103 of the screen support structure 100 and penetrate through the first substrate layer 11, the second substrate layer 12, the third substrate layer 13, the fourth substrate layer 14, the adhesive layer 40, the heat conductive layer 20 and the conductive layer 30.

In this embodiment, the bonding layer 40 is disposed on the surface of the heat conducting layer 20, and the bonding layer 40 and the fourth substrate layer 14 are bonded and fixed, so that the heat conducting layer 20 and the conductive layer 30 are fixedly connected with the substrate layer 10, the connection stability between the heat conducting layer 20 and the conductive layer 30 and the substrate layer 10 is improved, the preparation process of the screen supporting structure 100 is simplified, and the effect of saving cost is achieved.

Referring to fig. 9, fig. 9 is a schematic view of a portion of a screen support structure 100 according to a sixth embodiment of the present disclosure.

The difference between this embodiment and the embodiment shown in fig. 7 is that in this embodiment, the heat conducting layer 20 is provided with a through hole 24, and the conductive layer 30 is partially located on the surface of the heat conducting layer 20 and partially located in the through hole 24.

In this embodiment, the heat conducting layer 20 is a graphene film, and the thickness is 10 μm. The thermal conductivity of the thermal conductive layer 20 is greater than or equal to 800W/mK. In this embodiment, the thermal conductivity of the thermal conductive layer 20 is 1500W/mK. The heat conducting layer 20 includes a first heat conducting surface 201 and a second heat conducting surface 202, and the first heat conducting surface 201 and the second heat conducting surface 202 are disposed opposite to each other and are located on opposite sides of the thickness direction of the heat conducting layer 20. The plurality of through holes 24 are arranged at intervals in the heat conducting layer 20, and penetrate through the first heat conducting surface 201 and the second heat conducting surface 202. The aperture of the through hole 24 is in the range of 0.1mm to 10mm. In this embodiment, the through-hole 24 is formed by a laser process. In other embodiments, the through holes 24 may also be formed by a die cutting process.

In this embodiment, the conductive layer 30 is made of copper. In other embodiments, the conductive layer 30 may be made of a metal material such as silver, gold, nickel, tin, etc. The conductive layer 30 includes a first body 31 and an extension 32. Wherein the thickness of the first body 31 is 1 μm. Of course, the thickness of the first body 31 may be less than 1 μm and equal to or greater than 0.1 μm, or the thickness of the first body 31 may be greater than 1 μm and equal to or less than 10 μm. The plurality of extension bodies 32 are arranged, and the plurality of extension bodies 32 are fixedly connected with the first body 31 and are arranged on the surface of the first body 31 at intervals. The conductive layer 30 is fixedly connected with the heat conductive layer 20, the first body 31 is fixed on the first heat conductive surface 201, and the extension body 32 is located in the through hole 24 of the heat conductive layer 20 and is fixedly connected with the inner wall of the through hole 24.

In this embodiment, the conductive layer 30 is formed in the first heat conductive surface 201 and the through hole 24 by physical vapor deposition. The second heat conducting surface 202 of the heat conducting layer 20 faces the fourth substrate layer 14 and is fixedly connected with the fourth substrate layer 14. That is, in this embodiment, the first base material layer 11, the second base material layer 12, the third base material layer 13, the fourth base material layer 14, the heat conductive layer 20, and the conductive layer 30 are stacked in this order. In this embodiment, the heat conducting layer 20 is fixedly connected to the fourth substrate layer 14 by heating, pressurizing and curing.

In this embodiment, the through holes 24 are formed in the heat conducting layer 20, and the conductive layer 30 is partially located on the surface of the heat conducting layer 20 and partially located on the inner wall of the through holes 24, so that the connection stability between the conductive layer 30 and the heat conducting layer 20 can be improved. In addition, the conductive layer 30 plays a role in riveting the heat conducting layer 20, and the conductive layer 30 positioned in the through hole 24 can improve the stability of the internal structure of the heat conducting layer 20. When the heat conductive layer 20 is a graphene film, the conductive layer 30 can enhance the interlayer strength of graphene, and avoid delamination due to insufficient interlayer strength.

Referring to fig. 10, fig. 10 is a schematic view of a portion of a screen support structure 100 according to a seventh embodiment of the present application.

This embodiment differs from the embodiment shown in fig. 9 in that the electrically conductive layer 30 is located within the first heat conductive surface 201, the second heat conductive surface 202 and the through hole 24 of the heat conductive layer 20.

In this embodiment, the conductive layer 30 is made of copper. In other embodiments, the conductive layer 30 may be made of a metal material such as silver, gold, nickel, tin, etc. The conductive layer 30 includes a first body 31, a second body 33, and an extension body 32. Wherein the thickness of the first body 31 and the second body 33 is 1 μm. Of course, the thickness of the first body 31 and the second body 33 may be less than 1 μm and equal to or greater than 0.1 μm, or the thickness of the first body 31 and the second body 33 may be greater than 1 μm and equal to or less than 10 μm. The plurality of extension bodies 32 are arranged, and the plurality of extension bodies 32 are connected between the first body 31 and the second body 33 and are arranged at intervals between the first body 31 and the second body 33. The conductive layer 30 is fixedly connected with the heat conductive layer 20, the first body 31 is fixed on the first heat conductive surface 201, the second body 33 is fixed on the second heat conductive surface 202, and the extension body 32 is located in the through hole 24 of the heat conductive layer 20 and is fixedly connected with the inner wall of the through hole 24.

In this embodiment, the conductive layer 30 is formed in the first conductive surface 201, the second conductive surface 202 and the through hole 24 by physical vapor deposition. The surface of the second body 33 facing away from the heat conducting layer 20 faces the fourth substrate layer 14 and is fixedly connected with the fourth substrate layer 14. That is, in the present embodiment, the first substrate layer 11, the second substrate layer 12, the third substrate layer 13, the fourth substrate layer 14, the second body 33 of the conductive layer 30, the heat conductive layer 20, and the first body 31 of the conductive layer 30 are sequentially stacked, and the extension body 32 is located in the through hole 24. In this embodiment, the heat conducting layer 20 is fixedly connected to the fourth substrate layer 14 by heating, pressurizing and curing.

In this embodiment, the through holes 24 are formed in the heat conducting layer 20, and the conductive layer 30 is located on two opposite surfaces of the heat conducting layer 20 and penetrates through the through holes 24 of the heat conducting layer 20, so that the stability of the connection between the conductive layer 30 and the heat conducting layer 20 can be further improved. In addition, the conductive layer 30 plays a role of penetrating riveting the heat conductive layer 20, and can further improve the stability of the internal structure of the heat conductive layer 20. When the heat conductive layer 20 is a graphene film, the conductive layer 30 can enhance the interlayer strength of graphene, and avoid delamination due to insufficient interlayer strength.

Referring to fig. 11, fig. 11 is a schematic view of a portion of a screen support structure 100 according to an eighth embodiment of the present application.

This embodiment differs from the embodiment shown in fig. 4 in that in this embodiment the heat conductive layer 20 is provided with through holes 24. The screen support structure 100 further includes a connector 15. The connecting body 15 is located in the through hole 24 and fixedly connected with the second substrate layer 12 and the third substrate layer 13.

In this embodiment, the first substrate layer 11 and the second substrate layer 12 are stacked, and the third substrate layer 13 and the fourth substrate layer 14 are stacked in this order. The heat conducting layer 20 is disposed between the second substrate layer 12 and the third substrate layer 13, and is fixedly connected to the second substrate layer 12 and the third substrate layer 13. Wherein the first heat conductive surface 201 faces the third substrate layer 13, and the second heat conductive surface 202 faces the second substrate layer 12.

The connecting body 15 is located in the through hole 24 and fixedly connected with the inner wall of the through hole 24. In this embodiment, a connector 15 is disposed in each through hole 24. In other embodiments, the connector 15 may be disposed in a portion of the through hole 24. The connecting body 15 penetrates through the through hole 24, one end of the connecting body 15 is fixedly connected with the second substrate layer 12, and the other end of the connecting body 15 is fixedly connected with the third substrate layer 13. In this embodiment, the connector 15 is formed by penetrating the resin in the fiber prepreg in the second substrate layer 12 and the third substrate layer 13 into the through hole 24 and curing.

In this embodiment, the material of the conductive layer 30 is nickel, and the thickness of the conductive layer 30 is 5 μm. In other embodiments, the conductive layer 30 may be made of a metal material such as copper, silver, gold, tin, etc. The thickness of the conductive layer 30 may also be 1 μm. The conductive layer 30 is disposed on a surface of the fourth substrate layer 14 facing away from the third substrate layer 13, and is fixedly connected to the fourth substrate layer 14. In this embodiment, the conductive layer 30 is formed on the surface of the fourth substrate layer 14 by electroless plating. In other embodiments, the conductive layer 30 may also be vapor deposited or otherwise formed on the surface of the fourth substrate layer 14.

In this embodiment, the through holes 24 are formed in the heat conducting layer 20, and the connectors 15 fixedly connected to the third substrate layer 13 and the fourth substrate layer 14 are disposed in the through holes 24, so that the connection stability between the conductive layer 30 and the substrate layer 10 can be improved. The connector 15 plays a role of caulking the heat conductive layer 20, and can improve stability of the internal structure of the heat conductive layer 20. When the heat conductive layer 20 is a graphene film, the connector 15 can enhance the interlayer strength of graphene, and avoid the problem of delamination due to insufficient interlayer strength.

Referring to fig. 12, fig. 12 is a schematic diagram illustrating a first embodiment of a method for manufacturing the screen support structure 100 according to the present application, which is used to manufacture the screen support structure 100 shown in fig. 4.

The preparation method comprises the following steps:

s11: providing at least two base material layers 10, wherein the base material layers 10 are made of fiber composite materials;

s21: providing a heat conduction layer 20, wherein the heat conduction layer 20 is arranged between at least two substrate layers 10 and is overlapped with the substrate layers 10 to obtain a first support structure, and the first support structure comprises a first sub-bending part;

s31: a plurality of openings 104 are formed in the first sub-bending part at intervals, so that a second supporting structure is obtained;

s41: providing a conductive substrate, forming the conductive substrate on the surface of the second support structure to obtain the conductive layer 30, thereby obtaining the screen support structure 100.

The screen support structure 100 includes a first bending portion 103, and the opening 104 is located in the first bending portion 103.

In S11, the number of substrate layers 10 is four, and the four substrate layers are the first substrate layer 11, the second substrate layer 12, the third substrate layer 13, and the fourth substrate layer 14, respectively. The first substrate layer 11, the second substrate layer 12, the third substrate layer 13 and the fourth substrate layer 14 are all fiber prepreg resins. The fibers in the fiber prepreg resin include, but are not limited to, glass fibers, carbon fibers, aramid fibers, aluminum oxide fibers, ultra-high molecular weight polyethylene fibers, and the like. The resin may be a thermosetting resin including, but not limited to, epoxy, phenolic, amino, unsaturated polyester, silicone, etc., or a thermoplastic resin including, but not limited to, polyolefin, polyamide, polyoxymethylene, polycarbonate, polyphenylene oxide, polysulfone, etc. Wherein the fiber content is 10-80 wt%. The fibers in the fiber prepreg resin may be formed from one or more fibers in various forms such as plain, twill, or satin weave.

In this embodiment, the thicknesses of the first substrate layer 11, the second substrate layer 12, the third substrate layer 13 and the fourth substrate layer 14 are all 40 μm. In other embodiments, the thickness of each substrate layer 10 may also be greater than 10 μm and less than 40 μm, or greater than 40 μm and less than 800 μm. That is, the thickness of one substrate layer 10 is in the range of 10 μm to 800 μm.

S11 comprises the following steps: the first substrate layer 11 and the second substrate layer 12 are laminated, and the third substrate layer 13 and the fourth substrate layer 14 are laminated. Wherein the angle of layering of the first substrate layer 11 is 90 °, the angle of layering of the second substrate layer 12 is 0 °, the angle of layering of the third substrate layer 13 is 0 °, and the angle of layering of the fourth substrate layer 14 is 90 °.

In S21, the heat conductive layer 20 is a graphene film. The thermal conductivity of the thermal conductive layer 20 was 1500W/m K and the thickness was 10 μm. S21 includes: the heat conducting layer 20 is placed between the second substrate layer 12 and the third substrate layer 13, and then the first substrate layer 11, the second substrate layer 12, the heat conducting layer 20, the third substrate layer 13 and the fourth substrate layer 14 which are sequentially stacked are placed in a mold, heated, pressurized and cured, so that a first supporting structure is obtained. The first support structure is a fibrous composite material with a thermally conductive layer 20.

S31 includes: and opening holes in the first sub-bending parts by using ultraviolet laser equipment. The openings 104 are plural. The plurality of openings 104 are spaced apart. In this embodiment, the aperture diameter of the openings 104 is 0.12mm, and the distance between two adjacent openings 104 is 0.25mm. Wherein the first sub-bending portion is a part of the first bending portion 103.

In this embodiment, the opening 104 is disposed in the first bending portion 103, so that the first bending portion 103 can be bent, and thus the bending of the screen support structure 100 can be achieved, and further the bending of the display assembly 200 can be achieved. In addition, in the present embodiment, the openings 104 are disposed on the substrate layer 10 and the heat conductive layer 20, so that the bending performance of the screen support structure 100 can be achieved, and at the same time, the electrical conductivity of the conductive layer 30 can be ensured.

In S31, the second support structure includes a first face and a second face. The first face and the second face are disposed opposite each other. The surface of the fourth substrate layer 14 facing away from the third substrate layer 13 is a first surface, and the surface of the first substrate layer 11 facing away from the second substrate layer 12 is a second surface.

S41 includes:

(1) Masking the second surface, and performing acid washing or alkali washing on the first surface.

(2) A layer of palladium catalyst is deposited on the first side.

(3) The second support structure is immersed in the conductive substrate and the conductive substrate is deposited on the first side to provide the conductive layer 30 to provide the screen support structure 100.

In step (1), a mixture of one or more acids selected from sulfuric acid, nitric acid and hydrofluoric acid may be used for pickling to remove the oil stains attached to the first side. Alternatively, the alkaline washing may be performed using a mixture of one or more bases selected from sodium hydroxide, sodium carbonate and trisodium phosphate.

In the step (2), the term "palladium catalyst" means a catalyst comprising palladium as a main active component, and palladium black or a catalyst comprising palladium supported on a carrier such as alumina or zeolite is used.

In the step (3), the conductive substrate is the plating solution. In this embodiment, the plating solution is a nickel-containing plating solution. In other embodiments, the plating solution may be a plating solution containing metals such as copper, silver, gold, and tin. The second support structure is immersed in the plating solution for a period of 4 to 12 hours. After the conductive layer 30 is deposited on the first surface, water washing is performed to remove the plating solution and the catalyst remained on the surface, and then drying is performed to obtain the screen support structure 100. Wherein the thickness of the conductive layer 30 in the screen support structure 100 is 1 μm to 10 μm. In this embodiment, the thickness of the conductive layer 30 is 5 μm, and the resistance of the conductive layer 30 is less than 5Ω.

In this embodiment, by providing the heat conducting layer 20 and the electric conducting layer 30, the screen supporting structure 100 has both a heat conducting function and an electric conducting function, which can satisfy both the heat dissipation requirement of the display screen 230 and the electric connection requirement. In addition, in the present embodiment, by providing the opening 104 at the first bending portion 103, the bending portion may bend, so that bending of the screen supporting structure 100 and the display assembly 200 may be achieved, and the display assembly 200 may be further applied to the foldable electronic device 500.

Referring to fig. 13, fig. 13 is a schematic diagram illustrating a second embodiment of a method for manufacturing the screen support structure 100 according to the present application, which is used to manufacture the screen support structure 100 shown in fig. 5.

The difference between this embodiment and the embodiment shown in fig. 12 is that the preparation method provided in this embodiment includes:

s12: providing four base material layers 10, wherein the base material layers 10 are made of fiber composite materials;

s22: providing three heat conducting layers 20, alternately stacking the three heat conducting layers 20 and four substrate layers 10, wherein each heat conducting layer 20 is positioned between two adjacent substrate layers 10 to obtain a first supporting structure, and the first supporting structure comprises a first sub-bending part;

s32: a plurality of openings 104 are formed in the first sub-bending part at intervals, so that a second supporting structure is obtained;

s42: providing a conductive substrate, forming the conductive substrate on the surface of the second support structure to obtain the conductive layer 30, thereby obtaining the screen support structure 100.

The four substrate layers are a first substrate layer 11, a second substrate layer 12, a third substrate layer 13 and a fourth substrate layer 14, respectively. The three heat conductive layers 20 are a first heat conductive layer 21, a second heat conductive layer 22, and a third heat conductive layer 23, respectively. In this embodiment, the thicknesses of the first substrate layer 11, the second substrate layer 12, the third substrate layer 13 and the fourth substrate layer 14 are all 30 μm. The thicknesses of the first heat conductive layer 21, the second heat conductive layer 22 and the third heat conductive layer 23 were 10 μm.

S12 is the same as S11, S32 is the same as S31, and S42 is the same as S41.

S22 includes: the first heat conductive layer 21 is placed between the first substrate layer 11 and the second substrate layer 12, the second heat conductive layer 22 is placed between the second substrate layer 12 and the third substrate layer 13, and the third heat conductive layer 23 is placed between the third substrate layer 13 and the fourth substrate layer 14. That is, the first substrate layer 11, the first heat conductive layer 21, the second substrate layer 12, the second heat conductive layer 22, the third substrate layer 13, the third heat conductive layer 23, and the fourth substrate layer 14 are stacked in this order.

S22 further includes: the first substrate layer 11, the first heat conduction layer 21, the second substrate layer 12, the second heat conduction layer 22, the third substrate layer 13, the third heat conduction layer 23 and the fourth substrate layer 14 which are sequentially stacked are placed in a mold, heated, pressurized and cured, and a first support structure is obtained. The first support structure is a fibrous composite material with a thermally conductive layer 20.

In this embodiment, by providing the heat conducting layer 20 and the electric conducting layer 30, the screen supporting structure 100 has both a heat conducting function and an electric conducting function, which can satisfy both the heat dissipation requirement of the display screen 230 and the electric connection requirement. In addition, in this embodiment, by providing three heat conducting layers 20 and disposing three heat conducting layers 20 between two adjacent substrate layers 10, the heat dissipation performance of the screen support structure 100 can be further improved.

Referring to fig. 14, fig. 14 is a schematic diagram illustrating a third embodiment of a method for manufacturing a screen support structure 100 according to the present application, which is used to manufacture the screen support structure 100 shown in fig. 6.

The difference between this embodiment and the embodiment shown in fig. 12 is that the preparation method of this embodiment includes:

s13: providing at least two base material layers 10, wherein the base material layers 10 are made of fiber composite materials;

s23: providing a heat conduction layer 20, wherein the heat conduction layer 20 is arranged between at least two substrate layers 10 and is overlapped with the substrate layers 10 to obtain a first support structure, and the first support structure comprises a first sub-bending part;

s33: a plurality of openings 104 are formed in the first sub-bending part at intervals, so that a second supporting structure is obtained;

s43: providing a thin film layer 50 and a conductive substrate, wherein the thin film layer 50 comprises a first surface 51 and a second surface 52 which are oppositely arranged, the conductive substrate is deposited on the first surface 51 to form a conductive layer 30, and the thin film layer 50 and the conductive layer 30 together form a first conductive structure;

s53: providing an adhesive layer 40, and adhering the adhesive layer 40 to the second surface 52 of the first conductive structure to obtain a second conductive structure;

s63: the second conductive structure is bonded to the surface of the second support structure to provide the screen support structure 100.

S13 is the same as S11, S23 is the same as S21, and S33 is the same as S31.

In S43, the film layer 50 is made of polyethylene terephthalate (Polyethylene terephthalate, PET). In other embodiments, the material of the film layer 50 may be polyimide, polyethylene naphthalate, or a combination of one or more of polyamide and polycarbonate, and the film layer 50 has a thickness of 15 μm.

S43 includes: an electrically conductive substrate is deposited on the first surface 51 of the thin film layer 50 by physical vapor deposition (Physical Vapor Deposition, PVD) to provide the electrically conductive layer 30. In this embodiment, the conductive layer 30 is made of copper and has a thickness of 1 μm.

In S53, the adhesive layer 40 is OCA (Optically Clear Adhesive) optical cement, and the thickness of the adhesive layer 40 is 10 μm. In other embodiments, the adhesive layer 40 may be other double sided adhesive, or glue. The thickness of the adhesive layer 40 may also be less than 10 μm, or greater than 10 μm.

In S63, the surface of the adhesive layer 40 facing away from the film layer 50 is adhered to the first surface of the second support structure, so that the adhesive layer 40, the film layer 50 and the conductive layer 30 are all fixedly connected to the second support structure, thereby obtaining the screen support structure 100.

In this embodiment, the conductive layer 30 is disposed on the surface of the thin film layer 50 and then is fixedly connected to the second supporting structure, so as to improve the conductive performance of the conductive layer 30. In addition, when the resistance of the conductive layer 30 satisfies the condition, the thickness of the conductive layer 30 can be reduced by providing the conductive layer 30 on the surface of the thin film layer 50, thereby saving raw materials and cost. Meanwhile, in this embodiment, the adhesive layer 40 is used to realize the fixed connection between the thin film layer 50 and the conductive layer 30 and the substrate layer 10, which has the effect of simplifying the preparation process.

Referring to fig. 15, fig. 15 is a schematic diagram of a fourth embodiment of a method for manufacturing a screen support structure 100 according to the present application, which is used to manufacture the screen support structure 100 shown in fig. 7.

s14: providing a substrate layer 10, wherein the substrate layer 10 is made of a fiber composite material;

s24: providing a heat conducting layer 20 and a conductive substrate, wherein the heat conducting layer 20 comprises a first heat conducting surface 201 and a second heat conducting surface 202, the conductive substrate is deposited on the first heat conducting surface 201 to form a conductive layer 30, and the heat conducting layer 20 and the conductive layer 30 together form a heat conducting and conductive layer;

S34: the second heat conduction surface 202 of the heat conduction and electric conduction layer faces the substrate layer 10 and is fixedly connected with the substrate layer 10 to obtain a third support structure, wherein the third support structure comprises a second sub-bending part;

s44: a plurality of openings 104 are disposed at intervals in the second sub-bending portion, so as to obtain the screen supporting structure 100.

The difference between S14 and S11 is that the substrate layer 10 in S14 has four layers, the four substrate layers 10 are the first substrate layer 11, the second substrate layer 12, the third substrate layer 13 and the fourth substrate layer 14, and the first substrate layer 11, the second substrate layer 12, the third substrate layer 13 and the fourth substrate layer 14 are sequentially stacked.

In S24, the heat conductive layer 20 is a graphene film. The thermal conductivity of the thermal conductive layer 20 was 1500W/m K and the thickness was 10 μm. S24 includes: masking the second heat conducting surface 202, performing acid washing treatment on the first heat conducting surface 201, and then depositing an electric conducting substrate on the first heat conducting surface 201 in a physical vapor deposition mode to form an electric conducting layer 30, thereby obtaining the heat conducting and electric conducting layer. In this embodiment, the conductive layer 30 is copper, and has a thickness of 1 μm.

S34 includes: the heat and electricity conducting layers and the substrate layer 10 are stacked, the second heat conducting surface 202 faces the surface of the fourth substrate layer 14, which faces away from the third substrate layer 13, and then the first substrate layer 11, the second substrate layer 12, the third substrate layer 13, the fourth substrate layer 14 and the heat and electricity conducting layers which are stacked in sequence are placed in a mold, heated, pressurized and cured, so that the third supporting structure is obtained. The third support structure includes a base fold. The "basic bending portion" is the first bending portion 103 in the embodiment shown in fig. 3.

In S44, the second sub-bending portion is the first bending portion 103 of the screen supporting structure 100. S44 in the present embodiment is different from S31 in the embodiment shown in fig. 12 in that the openings 104 in S44 penetrate through the first substrate layer 11, the second substrate layer 12, the third substrate layer 13, the fourth substrate layer 14, the heat conductive layer 20, and the electrically conductive layer 30.

In this embodiment, the conductive layer 30 is disposed on the surface of the conductive layer 20 and then is fixedly connected with the substrate layer 10, so that the screen support structure 100 has both the functions of heat conduction and electrical conduction, and the uniformity of the distribution of the conductive layer 30 can be improved, so that the electrical conductivity of the conductive layer 30 is improved. In addition, in the present embodiment, the conductive layer 30 is deposited on the surface of the heat conductive layer 20 and then is fixedly connected with the substrate layer 10, so that the preparation process can be simplified and the cost can be saved.

Referring to fig. 16, fig. 16 is a fifth embodiment of a method for manufacturing the screen support structure 100 provided in the present application, for manufacturing the screen support structure 100 shown in fig. 8.

The difference between this embodiment and the embodiment shown in fig. 15 is that the preparation method provided in this embodiment includes:

s15: providing a substrate layer 10, wherein the substrate layer 10 is made of a fiber composite material;

S25: providing a heat conducting layer 20 and a conductive substrate, wherein the heat conducting layer 20 comprises a first heat conducting surface 201 and a second heat conducting surface 202, the conductive substrate is deposited on the first heat conducting surface 201 to form a conductive layer 30, and the heat conducting layer 20 and the conductive layer 30 together form the heat conducting and conductive layer 30;

s35: providing an adhesive layer 40, and adhering one surface of the adhesive layer 40 to the second heat conduction surface 202 of the heat conduction and electric conduction layer, and adhering the other surface to the surface of the substrate layer 10 to obtain a third support structure, wherein the third support structure comprises a second sub-bending part;

s45: a plurality of openings 104 are disposed at intervals in the second sub-bending portion, so as to obtain the screen supporting structure 100.

Wherein S24 is the same as S25.

S15 is different from S14 in that S15 includes: the first base material layer 11, the second base material layer 12, the third base material layer 13 and the fourth base material layer 14 are laminated in this order, and then the laminated first base material layer 11, second base material layer 12, third base material layer 13 and fourth base material layer 14 are placed in a mold and heated, pressurized and cured to obtain the base material layer 10.

In S35, the adhesive layer 40 is OCA (Optically Clear Adhesive) optical cement, and the thickness of the adhesive layer 40 is 10 μm. In other embodiments, the adhesive layer 40 may be other double sided adhesive, or glue. The thickness of the adhesive layer 40 may also be less than 10 μm, or greater than 10 μm.

In S45, the openings 104 penetrate the first base material layer 11, the second base material layer 12, the third base material layer 13, the fourth base material layer 14, the adhesive layer 40, the heat conductive layer 20, and the conductive layer 30.

In this embodiment, the bonding layer 40 is disposed on the surface of the heat conducting layer 20, and the bonding layer 40 and the fourth substrate layer 14 are bonded and fixed, so that the heat conducting layer 20 and the conductive layer 30 are fixedly connected with the substrate layer 10, the connection stability between the heat conducting layer 20 and the conductive layer 30 and the substrate layer 10 is improved, the processing technology of the screen supporting structure 100 is simplified, and the effect of saving cost is achieved.

Referring to fig. 17, fig. 17 is a sixth embodiment of a method for manufacturing the screen support structure 100 provided in the present application, for manufacturing the screen support structure 100 shown in fig. 9.

s16: providing a substrate layer 10, wherein the substrate layer 10 is made of a fiber composite material;

s26: providing a heat conducting layer 20, wherein the heat conducting layer 20 comprises a first heat conducting surface 201 and a second heat conducting surface 202, and a plurality of through holes 24 are formed on the surface of the heat conducting layer 20 at intervals, and the plurality of through holes 24 penetrate through the first heat conducting surface 201 and the second heat conducting surface 202;

S36: providing an electric conduction substrate, depositing the electric conduction substrate on the first heat conduction surface 201 and the inner wall of the through hole 24 to form an electric conduction layer 30, and forming a heat conduction and electric conduction layer by the heat conduction layer 20 and the electric conduction layer 30 together;

s46: the second heat conduction surface 202 of the heat conduction and electric conduction layer faces the substrate layer 10 and is fixedly connected with the substrate layer 10 to obtain a third support structure, wherein the third support structure comprises a second sub-bending part;

s56: a plurality of openings 104 are disposed at intervals in the second sub-bending portion, so as to obtain the screen supporting structure 100.

S16 comprises the following steps: the first base material layer 11, the second base material layer 12, the third base material layer 13 and the fourth base material layer 14 are laminated in this order, and then the laminated first base material layer 11, second base material layer 12, third base material layer 13 and fourth base material layer 14 are placed in a mold and heated, pressurized and cured to obtain the base material layer 10.

In S26, the through hole 24 is formed by a laser process or a die cutting process. The aperture of the through hole 24 is in the range of 0.1mm to 10mm.

In S36, the second heat conducting surface 202 of the heat conducting layer 20 with the through hole 24 is masked, the first heat conducting surface 201 is subjected to an acid washing treatment, then the conductive substrate is deposited on the first heat conducting surface 201 by physical vapor deposition to form the conductive layer 30, part of the conductive layer 30 is located on the first heat conducting surface 201, and part of the conductive layer 30 is located on the inner wall of the through hole 24, so as to obtain the conductive layer 30.

Referring to fig. 18, fig. 18 is a seventh embodiment of a method for manufacturing the screen support structure 100 provided in the present application, for manufacturing the screen support structure 100 shown in fig. 10.

The difference between this embodiment and the embodiment shown in fig. 17 is that the preparation method provided in this embodiment includes:

s17: providing a substrate layer 10, wherein the substrate layer 10 is made of a fiber composite material;

s27: providing a heat conducting layer 20, wherein the heat conducting layer 20 comprises a first heat conducting surface 201 and a second heat conducting surface 202, and a plurality of through holes 24 are formed on the surface of the heat conducting layer 20 at intervals, and the plurality of through holes 24 penetrate through the first heat conducting surface 201 and the second heat conducting surface 202;

S37: providing an electric conduction substrate, depositing the electric conduction substrate on the first heat conduction surface 201, the second heat conduction surface 202 and the inner wall of the through hole 24 to form an electric conduction layer 30, wherein the heat conduction layer 20 and the electric conduction layer 30 together form a heat conduction electric conduction layer;

s47: the second heat conduction surface 202 of the heat conduction and electric conduction layer faces the substrate layer 10 and is fixedly connected with the substrate layer 10 to obtain a third support structure, wherein the third support structure comprises a second sub-bending part;

s57: a plurality of openings 104 are disposed at intervals in the second sub-bending portion, so as to obtain the screen supporting structure 100.

Wherein, S17 is the same as S16, S27 is the same as S26, S47 is the same as S46, and S57 is the same as S56.

S37 includes: the conductive layer 30 is formed by physical vapor deposition on the first conductive surface 201 and the second conductive surface 202 of the conductive layer 20 with the through holes 24. The conductive layer 30 is partially disposed on the first heat conductive surface 201, partially disposed on the second heat conductive surface 202, and partially disposed within the via 24.

In this embodiment, the through holes 24 are formed in the heat conducting layer 20, and the conductive layers 30 are deposited on the opposite surfaces of the heat conducting layer 20, and the conductive layers 30 penetrate through the through holes 24 of the heat conducting layer 20, so that the stability of the connection between the conductive layers 30 and the heat conducting layer 20 can be further improved. In addition, the conductive layer 30 plays a role of penetrating riveting the heat conductive layer 20, and can further improve the stability of the internal structure of the heat conductive layer 20. When the heat conductive layer 20 is a graphene film, the conductive layer 30 can enhance the interlayer strength of graphene, and avoid delamination due to insufficient interlayer strength.

Referring to fig. 19, fig. 19 is a schematic diagram illustrating an eighth embodiment of a method for manufacturing a screen support structure 100 according to the present application, for manufacturing the screen support structure 100 shown in fig. 11.

s18: providing at least two base material layers 10, wherein the base material layers 10 are made of fiber composite materials;

s28: providing a heat conducting layer 20, comprising a first heat conducting surface 201 and a second heat conducting surface 202, and forming a through hole on the surface of the heat conducting layer 20;

s38: arranging the heat conduction layer 20 with the through holes 24 between at least two substrate layers 10, and heating, pressurizing and solidifying to obtain a first support structure, wherein the first support structure comprises a first sub-bending part;

s48: a plurality of openings 104 are formed in the first sub-bending part at intervals, so that a second supporting structure is obtained;

s58: providing a conductive substrate, forming the conductive substrate on the surface of the second support structure to obtain the conductive layer 30, thereby obtaining the screen support structure 100.

S18 is the same as S11, S48 is the same as S31, and S58 is the same as S41.

In S28, the number of through holes 24 is plural, and the plural through holes 24 are disposed at intervals, and the plural through holes 24 penetrate through the first heat conduction surface 201 and the second heat conduction surface 202. The through holes 24 are formed by a laser process or a die-cutting process. The aperture of the through hole 24 is in the range of 0.1mm to 10mm.

In S38, the heat conductive layer 20 with the through holes 24 is placed between the second substrate layer 12 and the third substrate layer 13, and then the first substrate layer 11, the second substrate layer 12, the heat conductive layer 20, the third substrate layer 13 and the fourth substrate layer 14, which are sequentially stacked, are placed in a mold, heated, pressurized and cured, thereby obtaining the first support structure. Wherein, during the heat and pressure curing process, the resin in the fiber prepregs in the second substrate layer 12 and the third substrate layer 13 may penetrate into the through holes 24 and cure to form the connection body 15. The connecting body 15 is located in the through hole 24, fixedly connected with the inner wall of the through hole 24, and fixedly connected with the second substrate layer 12 and the third substrate layer 13.

The above is only a part of examples and embodiments of the present application, and the scope of the present application is not limited thereto, and any person skilled in the art who is familiar with the technical scope of the present application can easily think about the changes or substitutions, and all the changes or substitutions are covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The screen supporting structure is used for a display screen and is characterized by comprising a base material layer, a conductive layer and a heat conducting layer, wherein the base material layer is made of a fiber composite material, the base material layer, the heat conducting layer and the conductive layer are arranged in a stacked mode, and the conductive layer is positioned on the outer layer of the screen supporting structure; the screen supporting structure is used for being fixedly connected with the display screen, and the conducting layer is positioned on one side, back to the display screen;

the screen supporting structure further comprises a first bending part, an opening is formed in the first bending part, and the screen supporting structure can be bent along the first bending part.

2. The screen support structure of claim 1, wherein the substrate layers are multiple layers, the thermally conductive layer is disposed between the multiple substrate layers, or the thermally conductive layer is laminated outside the multiple substrate layers.

3. The screen support structure of claim 2, wherein the substrate layers are at least two layers, the heat conducting layer is disposed between and laminated with at least two of the substrate layers, and the conductive layer is disposed on an outermost side of the substrate layers and faces away from the heat conducting layer.

4. The screen supporting structure according to claim 2, wherein the substrate layer has n layers, the heat conductive layer has m layers, n layers of the substrate layer and m layers of the heat conductive layer are alternately stacked, and the substrate layer is disposed on two sides of each of the heat conductive layers, wherein n is a positive integer greater than or equal to 2, m is a positive integer, and the value of n is greater than m.

5. A screen support structure according to claim 3, further comprising a film layer and an adhesive layer, wherein the film layer comprises a first surface and a second surface disposed opposite to each other, the conductive layer is laminated on the first surface and fixedly connected to the film layer, the adhesive layer is disposed on the second surface and adhered to the film layer, and a side of the adhesive layer facing away from the film layer is fixedly connected to the substrate layer.

6. The screen support structure of claim 2, wherein the thermally conductive layer comprises a first thermally conductive surface and a second thermally conductive surface disposed opposite to each other, the electrically conductive layer disposed on the first thermally conductive surface and fixedly coupled to the thermally conductive layer, and the second thermally conductive surface fixedly coupled to the outermost substrate layer.

7. The screen support structure of claim 6, further comprising an adhesive layer disposed on the second thermally conductive surface, wherein a side of the adhesive layer facing away from the thermally conductive layer is fixedly connected to the outermost substrate layer.

8. The screen support structure of claim 6, wherein the thermally conductive layer is provided with a plurality of through holes, the plurality of through holes being spaced apart and extending through the first thermally conductive surface and the second thermally conductive surface; the conductive layer comprises a first body and a plurality of extension bodies, wherein the extension bodies are fixedly connected with the first body and are arranged on the surface of the first body at intervals;

the first body is fixed on the first heat conduction surface, and one extension body is positioned in one through hole and fixedly connected with the inner wall of the corresponding through hole.

9. The screen support structure of claim 8, wherein the conductive layer further comprises a second body, the first body being spaced from and disposed in parallel with the second body, a plurality of the extensions being connected between the first body and the second body; the second body is fixed on the second heat conduction surface and is fixedly connected with the substrate layer.

10. A screen support structure according to claim 3, wherein the heat conducting layer comprises a first heat conducting surface and a second heat conducting surface which are oppositely arranged, the heat conducting layer is provided with a plurality of through holes, and the through holes are arranged at intervals and penetrate through the first heat conducting surface and the second heat conducting surface;

the screen supporting structure further comprises a plurality of connecting bodies, one connecting body is arranged in one through hole, and two opposite ends of the connecting body are fixedly connected with the substrate layers positioned on two sides of the heat conducting layer respectively.

11. The screen support structure of any one of claims 1 to 10, wherein the fiber composite comprises fibers and a resin, the fibers being one or more of glass fibers, carbon fibers, aramid fibers, aluminum oxide fibers, and ultra high molecular weight polyethylene fibers, the resin being one or more of epoxy resins, phenolic resins, amino resins, unsaturated polyesters, silicone resins, polyolefins, polyamides, polyoxymethylene, polycarbonates, polyphenylene oxides, and polysulfones.

12. The screen support structure of claim 11, wherein one of the substrate layers has a thickness of 10 μm to 800 μm.

13. The screen support structure of any one of claims 1 to 10, wherein the thermal conductivity of the thermally conductive layer is 500W/m x K or more.

14. The screen support structure of claim 13, wherein the thermally conductive layer is one or more of graphene, graphite, graphene oxide, and graphene oxide-reduction.

15. The screen support structure of claim 13, wherein the thermally conductive layer has a thickness of 1 μιη to 200 μιη.

16. The screen support structure of any one of claims 1 to 10, wherein the electrical resistance of the conductive layer is less than 0.5 Ω.

17. The screen support structure of claim 16, wherein the conductive layer has a thickness of 0.1 μιη to 10 μιη.

18. A display assembly comprising a display screen and the screen support structure of claims 1 to 17, the screen support structure being mounted on the back of the display screen and fixedly connected thereto, and the conductive layer being located on a side remote from the display screen.

19. An electronic device comprising a center and the display assembly of claim 18, wherein the display assembly is mounted to the center and fixedly connected to the center with the conductive layer facing the center.

20. A method of manufacturing a screen support structure for manufacturing a screen support structure according to any one of claims 1 to 19, the method comprising:

providing a substrate layer of fibrous composite material;

21. The method of claim 20, wherein providing a heat conductive layer and a conductive layer, disposing the heat conductive layer and the conductive layer on top of the substrate layer and fixedly connecting the heat conductive layer and the conductive layer to the substrate layer, the step of obtaining the screen support structure comprises:

22. The method of claim 21, wherein the second support structure comprises a first side and a second side disposed opposite to each other, and wherein the step of laminating and fixedly connecting the conductive layer to the second support structure comprises:

depositing a catalyst on the first side;

23. The method of claim 22, wherein the substrate layer is at least two layers, and wherein the step of providing a thermally conductive layer and disposing the thermally conductive layer in a stack comprises disposing the thermally conductive layer between at least two of the substrate layers.

24. The method of claim 22, wherein the substrate layer has n layers, the thermally conductive layer has m layers, n is a positive integer greater than or equal to 2, m is a positive integer, and n has a value greater than m; the step of providing a heat conducting layer and laminating the heat conducting layer and the substrate layer comprises the step of alternately laminating n layers of the substrate layer and m layers of the heat conducting layer.

25. The method of claim 21, wherein the step of laminating and fixedly connecting the conductive layer to the second support structure to obtain the screen support structure comprises:

26. The method of claim 20, wherein providing a heat conductive layer and a conductive layer, disposing the heat conductive layer and the conductive layer on top of the substrate layer and fixedly connecting the heat conductive layer and the conductive layer to the substrate layer, the step of obtaining the screen support structure comprises:

27. The method of claim 26, wherein the step of directing the second thermally and electrically conductive surface of the thermally and electrically conductive layer toward the substrate layer and fixedly attaching the second thermally and electrically conductive surface to the substrate layer to form a third support structure further comprises: and providing an adhesive layer, and adhering one surface of the adhesive layer to the second heat conduction surface and the other surface to the surface of the substrate layer to obtain the third support structure.

28. The method of claim 26, wherein providing an electrically conductive substrate, the thermally conductive layer comprising a first thermally conductive surface and a second thermally conductive surface, depositing the electrically conductive substrate on the first thermally conductive surface to form the electrically conductive layer, the thermally conductive layer and the electrically conductive layer together comprising a thermally conductive electrically conductive layer comprises:

29. The method of claim 26, wherein providing an electrically conductive substrate, the thermally conductive layer comprising a first thermally conductive surface and a second thermally conductive surface, depositing the electrically conductive substrate on the first thermally conductive surface to form the electrically conductive layer, the thermally conductive layer and the electrically conductive layer together comprising a thermally conductive electrically conductive layer comprises:

30. The method of claim 23, wherein providing a thermally conductive layer, disposing the thermally conductive layer on top of the substrate layer and fixedly connecting the thermally conductive layer to the substrate layer, the step of obtaining a first support structure comprises: