CN117650088A - Positioning system and positioning method for material batch of memory chip - Google Patents
Positioning system and positioning method for material batch of memory chip Download PDFInfo
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- 239000002245 particle Substances 0.000 claims abstract description 113
- 229910000679 solder Inorganic materials 0.000 claims abstract description 48
- 238000004806 packaging method and process Methods 0.000 claims abstract description 26
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- 238000011990 functional testing Methods 0.000 claims description 52
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention provides a positioning system and a positioning method for a storage chip material batch, wherein the positioning system comprises a packaging module, a storage chip material batch processing module and a storage chip material batch processing module, wherein the packaging module is used for recording packaging information of a wafer after the wafer is cut into a particle module; the tag module is used for recording tag information of tag data added to different particle modules; the aging test module is used for recording the aging test information of different particle modules under the high-temperature test; the solder ball testing module is used for recording solder ball testing information of different particle modules under solder ball testing; the function test module is used for recording function test information of different particle modules; and the computer service module is used for writing the product data into the flash memory of the memory chip, and the product data reflects the test module information and the test result of the memory chip. The method and the device can monitor the production site of the memory chip and the production data of each link, and prevent the memory chip from jumping from the site, discharging, mixing and the like.
Description
Technical Field
The invention relates to the technical field of static storage, in particular to a positioning system and a positioning method for a storage chip material batch.
Background
With the wide application of the memory chip in the terminal products such as televisions, set top boxes, tablet computers or mobile phones, the requirements on the performance and the reliability of the memory chip are higher and higher, wherein the most important is to ensure the stability and the reliability of the data in the memory chip. The memory chip is applied to terminal product equipment in various industries in a large number, and various problems can be encountered due to the complexity of application scenes. For example, environmental problems, application scenarios, hardware circuit boards, software version changes, and thus the whole production process of the problematic batch needs to be queried in time. In the prior art, the material batch cannot be positioned rapidly and accurately. Therefore, there is a need for improvement.
Disclosure of Invention
The invention provides a positioning system and a positioning method for material batches of a storage chip, which are used for solving the technical problem that the material batches of a problem chip cannot be traced quickly and accurately in the prior art.
The invention provides a positioning system for a storage chip material batch, which comprises the following components:
the packaging module is used for recording packaging information of the wafer after being cut into the particle modules;
the label module is used for recording label information of label data added to different particle modules, wherein the label data comprises test work order information and serial number information corresponding to different particle modules;
the aging test module is used for recording the aging test information of different particle modules under the high-temperature test;
the solder ball testing module is used for recording solder ball testing information of different particle modules under solder ball testing;
the function test module is used for recording function test information of different particle modules; and
and the computer service module is used for receiving the packaging information, the label information, the functional test information, the aging test information and the solder ball test information, recording the packaging information, the label information, the functional test information, the aging test information and the solder ball test information as product data of a memory chip, writing the product data into the memory chip, and reflecting the test module information and the test result of the memory chip.
In one embodiment of the present invention, the number of the functional test modules is plural, and the tag module, the burn-in test module, and the solder ball test module are respectively connected with one functional test module, so as to record functional test information of different particle modules under different test environments.
In one embodiment of the present invention, the client at least scans the tag data of the memory chip to obtain corresponding test work order information and serial number information, and the host reads the product data of the memory chip to obtain information of a plurality of test modules corresponding to the memory chip.
In one embodiment of the present invention, when the client determines that the tag data is the same as the product data, the action performed is to confirm that the lot of the memory chip material is normal, and when the client determines that the tag data is different from the product data, the action performed is to confirm that the lot of the memory chip material is mixed.
In one embodiment of the present invention, when the computer service module determines that a problem occurs in the particle module at the test module, the action performed is to reject the particle module, and after the computer service module determines that the particle module passes through the test module, the action performed is to record the test module and the test result corresponding to the particle module.
The invention also provides a method for positioning the material batch of the memory chip, which comprises the following steps:
recording packaging information of the wafer after being cut into the particle modules;
recording label information of different particle module added label data, wherein the label data comprises test work order information and serial number information of different particle modules;
recording aging test information of different particle modules under a high-temperature test;
under the solder ball test, recording solder ball test information of different particle modules;
recording functional test information of different particle modules; and
and receiving the packaging information, the label information, the functional test information, the aging test information and the solder ball test information, marking the packaging information, the label information, the functional test information, the aging test information and the solder ball test information as product data of a memory chip, writing the product data into the memory chip, and reflecting a test module and a test result of the memory chip.
In one embodiment of the present invention, after the step of recording the label information of the label data added to the different particle modules, or the step of recording the aging test information of the different particle modules under the high temperature test, the method includes:
and recording the functional test information of different particle modules under different test environments.
In one embodiment of the present invention, after the step of writing the product data into the flash memory of the memory chip, the method comprises:
at least scanning label data positioned on the storage chip to obtain corresponding test work order information and serial number information;
and reading the product data of the memory chip, and obtaining the information of a plurality of test modules corresponding to the memory chip.
In one embodiment of the present invention, after the step of reading the product data of the memory chip and obtaining a plurality of test modules corresponding to the memory chip, the method includes:
judging whether the test tag data is the same as the product data;
when the label data is the same as the product data, confirming that the material batch of the memory chip is normal;
and when the label data is different from the product data, confirming the batch mixing of the material of the storage chip.
In one embodiment of the present invention, the step of receiving the package information, the tag information, the functional test information, the burn-in test information, and the solder ball test information, denoted as product data of a memory chip, includes:
when the problem of the particle module at the test module is determined, eliminating the particle module;
after the particle module passes through the test module, the test module and the test result corresponding to the particle module are recorded.
The invention has the beneficial effects that: the positioning system and the positioning method for the material batch of the storage chip can monitor the production data of the production site and each link of the storage chip and prevent the storage chip from jumping, discharging, mixing and the like.
Drawings
Fig. 1 is a schematic structural diagram of a positioning system for material lot of a memory chip according to an embodiment of the invention.
Fig. 2 is a schematic structural diagram of a memory chip according to an embodiment of the invention.
Fig. 3 is a schematic diagram of a production site management interface at a host side according to an embodiment of the invention.
Fig. 4 is a schematic diagram illustrating steps of a method for positioning a lot of memory chip materials according to an embodiment of the invention.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.
It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In the following description, numerous details are set forth in order to provide a more thorough explanation of embodiments of the present invention, it will be apparent, however, to one skilled in the art that embodiments of the present invention may be practiced without these specific details, in other embodiments, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring the embodiments of the present invention.
Referring to fig. 1 to 4, the present invention provides a positioning system and a positioning method for a batch of materials of a memory chip, which can be applied to the field of automatic detection of the memory chip. The invention can be compatible with a plurality of storage products, such as an embedded multimedia controller (eMMC, embedded Multi Media Card), a Solid State Disk (SSD) or Solid State Drive, a universal flash memory storage (UFS, universal Flash Storage), and the like. The method and the device can be used for improving the quick response analysis problem when the abnormal problem occurs in the client terminal product, and quickly checking the production batch of the shipment product, and the tested important information such as the station, the work order number, the test version, the parameter configuration and the like. The following is a detailed description of specific embodiments.
Referring to fig. 1, in an embodiment of the present invention, a positioning system for a lot of memory chips is provided, which may include a computer service module 10, a packaging module 20, a tag module 30, a first functional test module 40, a burn-in test module 50, a second functional test module 60, a solder ball test module 70, and a third functional test module 80. The packaging module 20, the tag module 30, the first functional test module 40, the burn-in test module 50, the second functional test module 60, and the solder ball test module 70 are electrically connected to the same computer service module 10, so that the computer service module 10 (PC Server) can collect test data of the stored particles from each of the above test modules. The Package module 20 (Package) may record Package information of the plurality of particle modules after the Wafer (Wafer) is cut into the plurality of particle modules. The tag module 30 (2D Mark) may record tag information that adds tag data to a particular particle module. The label data can be a two-dimensional code (2D Barcode) which is used for carrying out laser on a certain particle module, and the two-dimensional code can relate to test work order information and serial number information corresponding to the certain particle module. The tag information may include specific test site information of the tag module, such as information of a job number, a location, etc. corresponding to the tag module. The Burn-In module 50 (Burn In) may be used to perform Burn-In on a particle module and record Burn-In information of whether a bad block exists In the particle module under high temperature test. The solder Ball test module 70 (Ball Scan) may be configured to perform a solder Ball test on a particle module, and record whether the particle module has solder Ball test information with acceptable quality under the solder Ball test. For the first functional test module 40 (FT 1), the second functional test module 60 (FT 2), and the third functional test module 80 (FT 3), functional test information about whether a particle module can work normally can be recorded under different functional tests.
Referring to fig. 1, in one embodiment of the present invention, the computer service module 10 may receive package information, label information, functional test information, burn-in test information, and solder ball test information, which are recorded as product data of the memory chip. The computer service module 10 may write product data into the memory chip, where the product data reflects information of a plurality of test modules corresponding to the memory chip and test results thereof. By reading the product data in the memory chip, the site information for actually testing the particle modules, such as the module information, the work order serial number, the testing version, the parameter configuration and other important information corresponding to a certain particle module, can be queried. By scanning the label data, the product batch, the product Serial Number (SN code), the test work order information and the Serial Number information corresponding to a certain particle module which is originally planned can be inquired. When the product data and the label data are the same, the mixing condition of the material batch of the memory chip is not shown, namely the actual production flow of the memory chip is consistent with the planned production flow. When the product data and the label data are different, the mixing condition of the material batch of the memory chip is indicated, namely the actual production flow of the memory chip is inconsistent with the planned production flow. Therefore, when a batch of memory chips have a fault problem, whether the material batch of the memory chips is mixed or not needs to be judged, and the medicine can be delivered in a certain direction and according to symptoms. If the judgment on the material batch mixing condition of the storage chip is lacking, important information such as production batch, test site, work order serial number, test version, parameter configuration and the like, which cannot be rapidly checked out, can appear only by means of the label data on the two-dimensional code of the storage chip.
Referring to fig. 1, in one embodiment of the present invention, a particle module may enter the production process of the first functional test module 40 (FT 1) after being processed by the packaging module 20 (Package). The first functional test module 40 (FT 1) can burn FT1 test program into the particle module to mark bad blocks of the flash memory in the memory chip. After passing through the Burn-In module 50 (Burn In), a particle module may enter the process of the second functional test module 60 (FT 2). The second functional test module 60 can burn the FT2MP firmware program into the particle module for performing a read-write test to determine whether the particle module can work normally. After passing through the Ball test module 70 (Ball Scan), a particle module may enter the process of the third functional test module 80 (FT 3). The second functional test module 60 can burn the FT3MP firmware program into the particle module, and perform a read-write test to confirm whether the particle module can work normally.
Referring to fig. 1, in one embodiment of the present invention, a computer service module 10 may reject a particle module when a problem occurs at a test module. After a certain particle module passes through the test module, the computer service module 10 records the test module and the test result corresponding to the particle module. For example, when a particle module is processed by the Burn-In module 50 (Burn In), it is found that a bad block exists In the particle module, the particle module can be removed, and when a bad block does not exist In a particle module, the particle module can be put into the next generation process.
Referring to fig. 1, in an embodiment of the present invention, a client may obtain test job ticket information and serial number information at least by scanning tag data on a memory chip. The host end can read the product data of the memory chip, obtain a plurality of test modules corresponding to the memory chip, and is the use end of the current user. When the client determines that the label data is the same as the product data, the executed action is to confirm that the material batch of the memory chip is normal, and when the client determines that the label data is different from the product data, the executed action is to confirm that the material batch of the memory chip is mixed.
Referring to fig. 2, in one embodiment of the present invention, the memory chip may be an embedded multimedia controller 90 (eMMC, embedded Multi Media Card), and the memory chip may include a microprocessor 91, a flash memory 92, a cyclic redundancy check 93 and a buffer 94. The transmission of bi-directional data is possible between the micro-processing unit 91 (MCU, microcontroller Unit) and the cyclic redundancy check unit 93 (CRC, cyclic Redundancy Check). The crc unit 93 may transmit data to the flash memory unit 92 and the cache unit 94, and the cache unit 94 may transmit data to the flash memory unit 92. Flash unit 92 may be a flash memory (NAND flash) and cache unit 94 may be a cache memory (cache). The computer service module 10 receives the package information, the label information, the functional test information, the burn-in test information, and the solder ball test information, and records the received package information, label information, functional test information, burn-in test information, and solder ball test information as product data of the embedded multimedia controller 90. The computer service module 10 may write product data into the flash memory unit 92 of the embedded multimedia controller 90, where the product data reflects a plurality of test modules and test results thereof corresponding to the embedded multimedia controller 90. The embedded multimedia controller 90 divides a specific flash unit 92 (NAND flash) area for storing production flow information, so that the generation flow is convenient, the automation is accurate when the mixing management and the later client encounter problems, and the material sources can be traced rapidly. The system can be quickly traced back when the problem of faults occurs at the user side, and the cause of the problem can be accurately positioned.
Referring to fig. 2 and 3, in one embodiment of the present invention, information of a memory chip production site is classified as follows in table 1. Because of the limitation of the internal space of the memory chip, only key information is currently stored inside a single particle module, such as package information, tag information, functional test information, burn-in test information, and solder ball test information, stored in the flash unit 92 of the memory chip. The specific test information generated for the whole is placed in a server, for example, stored in the computer service module 10. For the host side of the user using the single particle module, the information of the flash unit 92 is verified with the information of the computer service module 10, and finally whether the information has consistency is confirmed. As shown in FIG. 3, the computer service module 10 may be configured with a production site management interface schematic to facilitate distinguishing between different customer needs, and generating different work orders and products. In the production site management interface schematic diagram, for example, a sealing and testing factory, a testing work order, a testing site, testing software, testing data, testing summary, an operation menu and the like are arranged, the testing information summary of each site and the like can be displayed in the interface, and meanwhile, a database can be generated, so that the follow-up automatic tracing and the prevention of delivery and mixing are facilitated.
Table 1, schematic diagram of information summarizing format of memory chip production site
Referring to fig. 4, the present invention further provides a method for positioning a batch of memory chip materials, which may include the following steps.
And S10, recording packaging information of the wafer after being cut into the particle modules.
And S20, recording label information of different particle modules added with label data, wherein the label data comprises test work order information and serial number information of different particle modules.
And step S30, recording the aging test information of different particle modules under the high-temperature test.
And S40, under the solder ball test, recording solder ball test information of different particle modules.
And S50, recording functional test information of different particle modules.
And step S60, receiving packaging information, label information, functional test information, aging test information and solder ball test information, marking the packaging information, the label information, the functional test information, the aging test information and the solder ball test information as product data of the memory chip, writing the product data into the memory chip, and enabling the product data to reflect a test module and a test result of the memory chip.
The above steps are described in detail below by way of specific examples.
And S10, recording packaging information of the wafer after being cut into the particle modules.
In one embodiment of the present invention, the Package module 20 (Package) may record Package information of the plurality of particle modules after the Wafer (Wafer) is cut into the plurality of particle modules.
And S20, recording label information of different particle modules added with label data, wherein the label data comprises test work order information and serial number information of different particle modules.
In one embodiment of the present invention, the tag data may be a two-dimensional code (2D Barcode) that is laser to a single particle module, and the two-dimensional code may relate to test worksheet information and serial number information corresponding to the single particle module. The tag information may include specific test site information of the tag module, such as information of a job number, a location, etc. corresponding to the tag module.
And step S30, recording the aging test information of different particle modules under the high-temperature test.
In one embodiment of the present invention, the Burn-In module 50 (Burn In) may be used to perform a Burn-In test on a particle module, and record the Burn-In information of whether there is a bad block In the particle module under a high temperature test.
And S40, under the solder ball test, recording solder ball test information of different particle modules.
In one embodiment of the present invention, the solder Ball test module 70 (Ball Scan) may be used to perform solder Ball test on a particle module, and record whether the particle module has solder Ball test information with acceptable quality under the solder Ball test.
And S50, recording functional test information of different particle modules.
In one embodiment of the present invention, the first functional test module 40 (FT 1), the second functional test module 60 (FT 2), and the third functional test module 80 (FT 3) may be used to record functional test information about whether a particle module can work normally under different functional tests.
And step S60, receiving packaging information, label information, functional test information, aging test information and solder ball test information, marking the packaging information, the label information, the functional test information, the aging test information and the solder ball test information as product data of the memory chip, writing the product data into the memory chip, and enabling the product data to reflect a test module and a test result of the memory chip.
In one embodiment of the present invention, the computer service module 10 may receive package information, tag information, functional test information, burn-in test information, and solder ball test information, which are recorded as product data of the memory chip. The computer service module 10 may write product data into the memory chip, where the product data reflects a plurality of test module information corresponding to the memory chip and test results thereof. By reading the product data in the memory chip, the information of the test site for actually testing a certain particle module, such as the information of the test module, the work order number, the test version, the parameter configuration and other important information corresponding to a certain particle module, can be queried. By scanning the label data, the product batch, the product Serial Number (SN code), the test work order information and the Serial Number information corresponding to a certain particle module which is originally planned can be inquired. In addition, when a problem occurs in a certain particle module at the test module, the particle module can be removed, and after the certain particle module passes through the test module, the test module information and the test result corresponding to the particle module can be recorded.
Referring to fig. 4, in an embodiment of the invention, after step S60, the method for positioning a lot of memory chip materials may further include step S70. Step S70 may include steps S710, S720, S730, S740, S750, where step S710 may be represented as scanning tag data of a memory chip to obtain test work order information and serial number information. Step S720 may be represented as reading product data of the memory chip, and obtaining information of a plurality of test modules corresponding to the memory chip. Step S730 may be represented as determining whether the label data is identical to the product data. Step S740 may be indicated as confirming that the lot of memory chip materials is normal and no mixing occurs when the tag data is the same as the product data. Step S750 may be expressed as identifying a batch mix of memory chip materials when the tag data is different from the product data.
In summary, the invention provides a system and a method for positioning a batch of materials of a storage chip, which can monitor production data of production sites and links of the storage chip, prevent the storage chip from jumping, discharging, mixing and the like, collect test data of the production sites, and realize correspondence between the test data and the storage chip.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. A system for locating a batch of memory chip material, comprising:
the packaging module is used for recording packaging information of the wafer after being cut into the particle modules;
the label module is used for recording label information of label data added to different particle modules, wherein the label data comprises test work order information and serial number information corresponding to different particle modules;
the aging test module is used for recording the aging test information of different particle modules under the high-temperature test;
the solder ball testing module is used for recording solder ball testing information of different particle modules under solder ball testing;
the function test module is used for recording function test information of different particle modules; and
and the computer service module is used for receiving the packaging information, the label information, the functional test information, the aging test information and the solder ball test information, recording the packaging information, the label information, the functional test information, the aging test information and the solder ball test information as product data of a memory chip, writing the product data into the memory chip, and reflecting the test module information and the test result of the memory chip.
2. The system of claim 1, wherein the number of functional test modules is a plurality, and the tag module, the burn-in test module, and the solder ball test module are each connected to one functional test module to record functional test information of different particle modules under different test environments.
3. The system according to claim 1, wherein the client side at least scans the tag data of the memory chip to obtain corresponding test work order information and serial number information, and the host side reads the product data of the memory chip to obtain information of a plurality of test modules corresponding to the memory chip.
4. The system of claim 3, wherein the client determines that the tag data is the same as the product data, the action performed is to confirm that the batch of memory chip material is normal, and the client determines that the tag data is not the same as the product data, and the action performed is to confirm that the batch of memory chip material is mixed.
5. The system of claim 1, wherein the computer service module determines that a particle module is defective at the test module, the action performed is to reject the particle module, and the computer service module determines that the particle module passes at the test module, and the action performed is to record the test module and the test result corresponding to the particle module.
6. A method for locating a batch of memory chip materials, comprising:
recording packaging information of the wafer after being cut into the particle modules;
recording label information of different particle module added label data, wherein the label data comprises test work order information and serial number information of different particle modules;
recording aging test information of different particle modules under a high-temperature test;
under the solder ball test, recording solder ball test information of different particle modules;
recording functional test information of different particle modules; and
and receiving the packaging information, the label information, the functional test information, the aging test information and the solder ball test information, marking the packaging information, the label information, the functional test information, the aging test information and the solder ball test information as product data of a memory chip, writing the product data into the memory chip, and enabling the product data to reflect test module information and test results of the memory chip.
7. The method according to claim 6, wherein after the step of recording the tag information of the tag data added to the different particle modules or the step of recording the burn-in test information of the different particle modules under the high temperature test, the method further comprises:
and recording the functional test information of different particle modules under different test environments.
8. The method of claim 6, wherein after the step of writing the product data into the flash memory of the memory chip, the method further comprises:
at least scanning label data positioned on the storage chip to obtain corresponding test work order information and serial number information;
and reading the product data of the memory chip, and obtaining the information of a plurality of test modules corresponding to the memory chip.
9. The method for positioning a batch of memory chip materials according to claim 8, wherein after the step of reading the product data of the memory chip and obtaining a plurality of test modules corresponding to the memory chip, the method comprises:
judging whether the test tag data is the same as the product data;
when the label data is the same as the product data, confirming that the material batch of the memory chip is normal;
and when the label data is different from the product data, confirming the batch mixing of the material of the storage chip.
10. The method of claim 6, wherein the step of receiving the package information, the tag information, the functional test information, the burn-in test information, and the solder ball test information, as product data of the memory chip, comprises:
when the problem of the particle module at the test module is determined, eliminating the particle module;
after the particle module passes through the test module, the test module and the test result corresponding to the particle module are recorded.
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