CN117628992A - PCB explosion bridge wire chip and preparation method thereof - Google Patents
PCB explosion bridge wire chip and preparation method thereof Download PDFInfo
- Publication number
- CN117628992A CN117628992A CN202311655214.8A CN202311655214A CN117628992A CN 117628992 A CN117628992 A CN 117628992A CN 202311655214 A CN202311655214 A CN 202311655214A CN 117628992 A CN117628992 A CN 117628992A
- Authority
- CN
- China
- Prior art keywords
- substrate
- bridge wire
- bonding
- layer
- pattern layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004880 explosion Methods 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 238000000034 method Methods 0.000 claims abstract description 30
- 230000008569 process Effects 0.000 claims abstract description 27
- 230000007704 transition Effects 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 239000002360 explosive Substances 0.000 claims abstract description 11
- 239000003814 drug Substances 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 3
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 239000010949 copper Substances 0.000 claims description 34
- 238000005553 drilling Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 239000002861 polymer material Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000005474 detonation Methods 0.000 abstract description 6
- 230000000977 initiatory effect Effects 0.000 description 10
- 230000035939 shock Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
Abstract
The invention belongs to the field of explosive detonation, and particularly relates to a PCB explosion bridge wire chip and a preparation method thereof. Comprising the following steps: a substrate: a carrier and a reflective back plate as the remaining components; and (3) bonding pads: the bottom layer is positioned on the substrate; and (3) through hole: the connection of the circuit is realized by penetrating the bonding pad and the graph layer; cu pattern layer: the bridge wires are located at the top layer of the substrate and consist of bridge wires located at the center and having the smallest cross section area and a residual Cu pattern layer area, namely a transition area, wherein the bridge wires are distributed in an S shape as a whole, and the transition area is semicircular; and (3) an adhesive sheet: the upper layer substrate is arranged between the base plate and the upper layer substrate and used for bonding the base plate and the upper layer substrate, and a through hole matched with the shape of the grain chamber is arranged in the middle of the upper layer substrate; an upper substrate: placing on the bonding sheet for preparing a grain chamber; a grain chamber: is positioned at the center of the upper substrate and is used for containing the medicine. The process has mature and reliable production, good product consistency and extremely low cost, and can provide a new ignition piece for explosive detonation in the military/civil field.
Description
Technical Field
The invention belongs to the field of explosive detonation, and particularly relates to a PCB explosion bridge wire chip and a preparation method thereof.
Background
The explosive bridge wire (Exploding Bridge Wire, EBW) consists of a base plate, bridge wire, grain chamber and charge, and is a safe insensitive explosive initiation device since there is no initiating explosive in the firing train and the bridge wire requires hundreds of amperes of pulsed current to fire. The ignition part is specifically characterized in that in a capacitor discharge unit consisting of a pulse high-voltage capacitor, a switch and an EBW, the switch receives an ignition instruction and controls a discharge loop to be conducted so as to release pulse current; the current flows through the bridge wire, so that the bridge wire is subjected to electric explosion and generates high-temperature plasma and shock waves; under the heat conduction of high-temperature plasma and the adiabatic compression of shock waves to the charge, the ignition or detonation function of the charge is realized. Gold wires are the most favorable for plasma initiation in all metal materials, copper wires are also used, but the initiation power of the copper wires is lower than that of gold wires, so that most of EBWs on the market adopt gold wires as electric explosion plasma sources and are prepared by manually installing discrete components, and the defects of poor consistency and high cost limit the productivity of the EBWs. Although the detonation output power of the copper wire is slightly lower than that of the gold wire, the output energy can be improved by increasing the detonation voltage, and the copper wire has absolute advantages in terms of price. It is therefore feasible to consider comprehensively the use of EBW based PCB processes for mass production of copper wires.
PCB (printed circuit board), a printed wiring board, is one of the important components of the electronics industry. Almost every electronic device, as small as an electronic watch, as large as a military weapon system, has electronic components such as integrated circuits, and printed circuit board technology is used to electrically interconnect the various components. The printed circuit board consists of an insulating base plate, connecting wires and bonding pads for assembling and welding electronic elements, and has the dual functions of a conductive circuit and the insulating base plate. The electronic device can replace complex wiring, realizes electric connection among elements in a circuit, simplifies assembly and welding work of electronic products, reduces wiring workload in a traditional mode, reduces the whole volume, lowers the product cost, and improves the quality and reliability of electronic equipment. In recent years, with the maturation of the multi-layer circuit board lamination process, the PCB process is used for developing various bridge wires/bridge films/bridge foils type electric initiating explosive devices, which forcefully promotes the intelligent and integrated development of the electric initiating explosive devices.
Disclosure of Invention
The invention aims to provide an explosion bridge wire chip based on a PCB process and a preparation method thereof.
The technical solution for realizing the purpose of the invention is as follows: a PCB explosion bridge wire chip comprising:
a substrate: a carrier and a reflective back plate as the remaining components;
and (3) bonding pads: the bottom layer is positioned on the substrate;
and (3) through hole: the connection of the circuit is realized by penetrating the bonding pad and the graph layer;
cu pattern layer: the bridge wires are located at the top layer of the substrate and consist of bridge wires located at the center and having the smallest cross section area and a residual Cu pattern layer area, namely a transition area, wherein the bridge wires are distributed in an S shape as a whole, and the transition area is semicircular;
and (3) an adhesive sheet: the upper layer substrate is arranged between the base plate and the upper layer substrate and used for bonding the base plate and the upper layer substrate, and a through hole matched with the shape of the grain chamber is arranged in the middle of the upper layer substrate;
an upper substrate: placing on the bonding sheet for preparing a grain chamber;
a grain chamber: is positioned at the center of the base material and is used for containing the medicine.
Further, the substrate is a copper-clad plate substrate, and the thickness is 0.5mm-2mm.
Further, the bonding pad is made of Cu and has a length of 0.5mm-10mm×width of 1mm-5mm.
Further, the cross section of the bridge wire is rectangular or cylindrical and the serial and parallel connection forms thereof, the equivalent side length is 0.1mm-1mm, the length is 0.1mm-2mm, the thickness is 5 μm-35 μm, the transition zone can be regarded as semicircle, the radius is 0.5mm-2.5mm, the thickness is the same as the thickness of the bridge wire, and the thickness is 5 μm-35 μm.
Further, the bonding sheet is made of polymer material and has a thickness of 10-100 μm.
Further, the upper substrate is a copper-clad plate substrate, and the thickness is 1mm-5mm.
Further, the grain chamber is positioned in the upper substrate and is a hollow cylinder, the bottom of the grain chamber is tightly attached to the pattern layer, and the dimension of the hollow cylinder is 1mm-3mm in diameter and 1mm-5mm in height.
The preparation method of the explosion bridge wire chip comprises the following specific steps:
(1) Discharging, and chemically cleaning a substrate, wherein the substrate is an EBW substrate;
(2) Preparing a bonding pad and a Cu pattern layer: patterning a substrate circuit by adopting film pasting, exposing, developing, etching and film removing processes, and preparing a bonding pad and a Cu pattern layer;
(3) And (3) through hole: the method is prepared by adopting a PCB process of drilling and copper deposition, so that conduction between the pattern layer and the bonding pad is realized;
(4) And (3) patterning an adhesive sheet: cutting a part of the bonding sheet right above the Cu pattern layer by a laser cutting process, wherein the cut part is larger than the aperture of the medicine column chamber, so that resin components in the bonding sheet are prevented from overflowing into the medicine column chamber to affect the medicine filling;
(5) Preparing a grain chamber: preparing a grain chamber in the upper substrate by a drilling process, wherein the height of the grain chamber is equal to that of the upper substrate;
(6) Pressing: the substrate and the upper substrate are bonded together by the adhesive sheet.
Compared with the prior art, the invention has the remarkable advantages that:
the explosion bridge wire (Exploding Bridge Wire, EBW) is prepared by adopting the printed circuit board (Printed Circuit Board, PCB) process, the process is mature and reliable, the product consistency is good, the price is low, and the market of bridge wire type initiating explosive devices in the military/civil field can be enriched.
The bridge wires are integrally distributed in an S shape, and current flows in from a semicircular transition area, enters the bridge wires and flows out from the semicircular transition area; due to the abrupt narrowing of the cross section, the current density increases sharply at the bridgewire, thereby generating a large amount of joule heat, so that the Cu bridgewire rapidly undergoes several forms of transformation of solid-liquid-vapor plasma, thereby initiating an electric explosion, and further generating plasma and shock waves.
Drawings
Fig. 1 is a perspective view of an EBW of the present invention prepared based on a PCB process.
Fig. 2 is a top view of an EBW of the present invention prepared based on a PCB process.
Fig. 3 is a flow chart of a preparation process based on a PCB process according to the present invention, wherein fig. (a) is a front view of a pad and a Cu pattern layer prepared by chemically etching a substrate, and fig. (b) is a top view of the pad and the Cu pattern layer prepared by chemically etching the substrate; wherein, the graph (c) is a front view of a through hole manufactured after deep hole drilling and copper deposition, the graph (d) is a front view of a through hole manufactured after deep hole drilling and copper deposition, the graph (e) is a front view of a grain chamber manufactured after deep hole drilling of an upper substrate, the graph (f) is a top view of a grain chamber manufactured after deep hole drilling of an upper substrate, the graph (g) is a front view after lamination of a substrate and a core plate by using a bonding sheet, and the graph (h) is a top view after lamination of a substrate, a flyer layer and an upper substrate by using a bonding sheet.
Reference numerals illustrate:
1-substrate, 2-bonding pad, 3-through hole, 4-Cu pattern layer, 41-Cu bridge wire, 42-Cu transition region, 5-bonding sheet, 6-upper substrate and 7-grain chamber.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings.
The explosion bridge wire chip (Exploding Bridge Wire, EBW) is prepared based on the PCB process, and as shown in fig. 1-2, the EBW based on the PCB process mainly comprises a substrate 1, a bonding pad 2, a via hole 3, a Cu pattern layer 4, an adhesive sheet 5, an upper substrate 6 and a grain chamber 7.
The substrate 1 is used as a carrier of the rest parts in the EBW, the carrier is made of FR-4 material, and the FR-4 refers to an epoxy resin glass fiber laminated board. Strictly speaking, FR-4 refers to the grade designation of a flame resistant material, but for ease of description is used herein to refer to the substrate of choice. To confine the upward movement of the plasma and shock waves generated by the electric explosion of the bridgewire 41 to initiate the charge.
The Cu pattern layer 4 is prepared by PCB processes such as film pasting, exposure, development, etching, film removing and the like, the bridge wire is overall S-shaped, and current flows in from the semicircular transition area 42, enters the bridge wire 41, and flows out from the semicircular transition area 42. Due to the abrupt narrowing of the cross section, the current density increases sharply at the bridgewire, thereby generating a large amount of joule heat, so that the Cu bridgewire rapidly undergoes several forms of transformation of solid-liquid-vapor plasma, thereby initiating an electric explosion, and further generating plasma and shock waves.
The adhesive sheet 5 is a sheet of polymer material of a certain thickness and is sheared by a laser.
The grain chamber 7 is at the midpoint of the upper substrate 6. The EBW may be used in the field of insensitive explosive initiation.
Referring to fig. 1 to 3, the EBW based on the PCB process mainly includes a substrate 1, a pad 2, a via 3, a Cu pattern layer 4, an adhesive sheet 5, an upper substrate 6, and a grain chamber 7. The preparation process of the EBW comprises the following steps:
firstly, blanking and chemically cleaning a substrate 1;
second, preparing a bonding pad 2 and a Cu pattern layer 4: patterning of the circuit of the substrate 1 is realized by adopting PCB processes such as film sticking, exposure, development, etching, film removal and the like, and a bonding pad 2 and a Cu pattern layer 4 are prepared;
and thirdly, preparing the via hole 3 by adopting a drilling and copper deposition process, and realizing electric conduction between the bonding pad and the Cu pattern layer.
Fourth, drilling treatment of the bonding sheet 5: cutting a part of the bonding sheet right above the bridge wire area 41 (right below the grain chamber) by a laser cutting process, wherein the bonding sheet consists of a reinforcing material (commonly used glass fiber cloth) and resin;
fifth step, preparing a grain chamber 7: preparing a grain chamber 7 in the core plate 6 through a depth-controlled drilling process;
sixth step: the substrate 1 and the upper substrate 6 are laminated via the adhesive sheet 5.
Example 1
The embodiment combines with fig. 3, and comprises the following steps (note: the left and right diagrams in fig. 3 are front view and top view of the preparation process respectively):
first, see fig. 3 (a) and (b), blanking, chemically cleaning the substrate 1, and then patterning the circuit of the substrate 1 by using PCB processes such as film sticking, exposure, development, etching, film removal, etc., to prepare the pad 2 and Cu pattern layer 4. The relevant dimensions are: the materials of the substrate and the upper substrate are FR-4, the size of the substrate 1 is 5mm long by 5mm wide by 1mm high, and the Cu thickness is 1 oz (35 mu m); the bonding pad 2 is 1.2mm long by 5mm wide; bridge wire 41 is 0.2mm long by 0.035mm wide by 0.035mm high; the transition zone 42 has a radius of 2.4mm.
In the second step, see fig. 3 (c) and (d), vias 3 were prepared by a controlled depth drilling and copper deposition process, 10 total, and 0.4mm diameter.
Third, see fig. 3 (e) and (f), a grain chamber 7 is prepared in the upper substrate 6 by a depth-controlled drilling process. The relevant dimensions are: the grain chamber (7) has a diameter of 2.4mm by 2mm.
Fourth, see fig. 3 (g) and (h), the substrate 1 and the upper substrate 6 are laminated by the adhesive sheet 5. The relevant dimensions are: the bonding sheet 5 is made of polymer material, the thickness is 50um, and the dimension of the laser cut part is phi 2.5mm; the substrate 6 is made of FR-4 and has dimensions of 5mm by 5mm wide by 2mm high.
Claims (8)
1. A PCB explosion bridge wire chip, comprising:
substrate (1): a carrier and a reflective back plate as the remaining components;
bonding pad (2): the bottom layer is positioned on the substrate (1);
via (3): the connection of the circuit is realized by penetrating the bonding pad and the graph layer;
cu pattern layer (4): the top layer positioned on the substrate (1) consists of bridge wires (41) positioned at the center and with the smallest cross section area and a residual Cu pattern layer area, namely a transition area (42), wherein the bridge wires are distributed in an S shape as a whole, and the transition area (42) is semicircular;
adhesive sheet (5): the device is arranged between the base plate (1) and the upper base plate (6) and is used for bonding the base plate and the upper base plate, and a through hole matched with the shape of the grain chamber is arranged in the middle of the device;
upper substrate (6): is arranged on the bonding sheet (5) for preparing a grain chamber;
cartridge chamber (7): is positioned at the right center of the upper base material (6) and is used for containing the medicine.
2. The explosion bridge wire chip according to claim 1, wherein the substrate (1) is a copper-clad plate substrate with a thickness of 0.5mm-2mm.
3. An explosion bridge wire chip according to claim 2, characterized in that the material of the bonding pad (2) is Cu, the dimensions being 0.5mm-10mm long x 1mm-5mm wide.
4. An explosive bridge wire chip according to claim 3, characterized in that the bridge wire (41) is rectangular or cylindrical in cross section and in the form of a string or parallel connection thereof, the equivalent side length is 0.1mm-1mm, the length is 0.1mm-2mm, the thickness is 5 μm-35 μm, the transition zone (42) can be regarded as a semicircle, the radius thereof is 0.5mm-2.5mm, the thickness is the same as the bridge wire thickness, and the thickness is 5 μm-35 μm.
5. An explosion bridge wire chip according to claim 4, characterized in that the material of the bonding sheet (5) is a polymer material with a thickness of 10 μm-100 μm.
6. The explosion bridge wire chip according to claim 5, wherein the upper substrate (6) is a copper-clad plate substrate with a thickness of 1mm-5mm.
7. The device according to claim 6, characterized in that the cartridge chamber (7) is located inside the upper substrate (6) and is a hollow cylinder with its bottom in close contact with the graphics layer, the dimensions of the hollow cylinder being 1mm-3mm in diameter x 1mm-5mm in height.
8. A method for manufacturing an explosion bridge wire chip according to any one of claims 1 to 7, comprising the specific steps of:
(1) Discharging, and chemically cleaning a substrate, wherein the substrate is an EBW substrate (1);
(2) Preparing a bonding pad (2) and a Cu pattern layer (4): patterning of a circuit of the substrate (1) is realized by adopting the processes of film pasting, exposure, development, etching and film removal, and a bonding pad (2) and a Cu pattern layer (4) are prepared;
(3) And (3) through hole: the method is prepared by adopting a PCB process of drilling and copper deposition, so that conduction between the pattern layer and the bonding pad is realized;
(4) And (3) patterning the bonding sheet (5): cutting a part of the bonding sheet right above the Cu pattern layer (4) by a laser cutting process, wherein the cut part is larger than the aperture of the medicine column chamber, so as to prevent resin components in the bonding sheet from overflowing into the medicine column chamber to affect the medicine filling;
(5) Preparation of the cartridge chamber (7): preparing a grain chamber (7) in the upper substrate (6) by a drilling process, wherein the height of the grain chamber is equal to the height of the upper substrate (6);
(6) Pressing: the substrate (1) and the upper substrate (6) are bonded together by an adhesive sheet (5) to form a single body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311655214.8A CN117628992A (en) | 2023-12-05 | 2023-12-05 | PCB explosion bridge wire chip and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311655214.8A CN117628992A (en) | 2023-12-05 | 2023-12-05 | PCB explosion bridge wire chip and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117628992A true CN117628992A (en) | 2024-03-01 |
Family
ID=90026810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311655214.8A Pending CN117628992A (en) | 2023-12-05 | 2023-12-05 | PCB explosion bridge wire chip and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117628992A (en) |
-
2023
- 2023-12-05 CN CN202311655214.8A patent/CN117628992A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5588207A (en) | Method of manufacturing two-sided and multi-layered printed circuit boards | |
| US6300576B1 (en) | Printed-circuit board having projection electrodes and method for producing the same | |
| US7929316B2 (en) | Composite electronic component | |
| US4430690A (en) | Low inductance MLC capacitor with metal impregnation and solder bar contact | |
| US5479703A (en) | Method of making a printed circuit board or card | |
| US3950844A (en) | Method of making L.E.D. arrays | |
| US20020179324A1 (en) | Method and structure for repairing or modifying surface connections on circuit boards | |
| KR20030005054A (en) | Multilayer circuit board and method for manufacturing multilayer circuit board | |
| JP2007073866A (en) | Wiring board with built-in component | |
| US5442143A (en) | Core for electrical connecting substrates and electrical connecting substrates with core, as well as process for the production thereof | |
| JP2002335082A (en) | Multilayer printed wiring board and manufacturing method thereof | |
| EP1278404B1 (en) | Circuit board and production method thereof | |
| CN117628992A (en) | PCB explosion bridge wire chip and preparation method thereof | |
| JP2009147026A (en) | Circuit board and manufacturing method thereof | |
| US8536459B2 (en) | Coreless layer buildup structure with LGA | |
| US9351408B2 (en) | Coreless layer buildup structure with LGA and joining layer | |
| CN112923801B (en) | Microchip exploding foil initiator prepared by PCB process and preparation method thereof | |
| KR20070000644A (en) | Chip embedded pcb and method of the same | |
| US20150319863A1 (en) | Structure and method for preparing a housing to accept a component for an embedded component printed circuit board | |
| JP2000277916A (en) | Substrate and split substrate | |
| WO1995013901A1 (en) | Metallurgically bonded polymer vias | |
| JP2008010616A (en) | Wiring board having built-in component | |
| CN113224645B (en) | Sealed parallel plane trigger spark gap switch and manufacturing method thereof | |
| JPH05327169A (en) | Metal base multilayer circuit board | |
| JPH08236001A (en) | Chip type current protecting element and its manufacture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |