CN117622874A - Substrate processing system, transfer apparatus, transfer arm, and transfer method - Google Patents

Abstract

The present disclosure relates to a substrate processing system, a transfer apparatus, a transfer arm, and a transfer method, the transfer arm including a body, an electrostatic chuck assembly, and a grounding assembly. The electrostatic adsorption component is used for adsorbing and fixing the substrate on the bearing surface through electrostatic adsorption force. The grounding component is used for electrically contacting with a part of the substrate corresponding to the electrostatic adsorption component so as to release charges generated when electrostatic induction is carried out on the surface of the substrate, and is also used for electrically connecting with a current testing instrument. The electric charge can be grounded through the grounding component, current is generated in the process of diversion and grounding through the grounding component, the current is obtained through the current testing instrument, whether the substrate is placed on the bearing surface or not can be correspondingly judged according to the magnitude of the current, and electrons can be guaranteed to be rapidly conducted away after static electricity is released, so that sticking is prevented. The device has the advantages that the device not only can play a role in adsorbing and fixing the substrate, but also can be used for judging whether the substrate exists on the bearing surface, and meanwhile, the structure of the device is not too complex, and the cost is low.

Description

Substrate processing system, transfer apparatus, transfer arm, and transfer method

Technical Field

The present disclosure relates to the field of semiconductor devices, and more particularly, to a substrate processing system, a transfer apparatus, a transfer arm, and a transfer method.

Background

In the fabrication process of semiconductor integrated circuits, the transfer of substrates is a step that must be performed during the switching operation between different process steps. A stable substrate transfer process is essential for the stability and improvement of the yield of the production line. Currently, the transfer of the substrate is generally performed by a robot arm, i.e., the substrate is placed on the robot arm and transferred from one position to another.

In the conventional technology, not only is the substrate ensured to be fixed on the mechanical arm so as to realize stable conveying, namely a fixing mechanism for fixing the substrate is usually arranged on the mechanical arm; in addition, it is also necessary to be able to sense the position of the substrate on the robot arm, i.e. a sensing device is usually also mounted on the robot arm. The sensing device generally comprises the following modes:

first, infrared sensing mode: the substrate blocks the transmission of infrared rays by utilizing the light-shielding property of the substrate, so as to judge whether the substrate exists or not. Although this method can determine whether the substrate exists on the mechanical arm, it cannot determine the actual situation of the substrate, for example, the substrate still blocks the light after being partially broken.

In addition, a clamping groove is arranged at the front part of the substrate, a pushing device is arranged at the rear part of the substrate, and the existence of the substrate is judged by utilizing the infrared light-shielding performance of the traveling distance of the pushing device. However, the substrate may be scratched when the pusher is displaced during the operation, and the pusher is controlled by the cylinder, so that the ejection force is high, internal injury is easily formed, and the subsequent process is affected.

Second, vacuum pressure sensing: the substrate conveying device is provided with a vacuum pipeline, and whether the substrate exists or not is judged through pressure change in the pipeline. However, when the vacuum adsorption particles of the substrate are too large, the adsorption is not tight, or the adsorption is not judged to be present.

Third, light sensitive induction: the simplest electronic device in the photosensitive sensor is a photosensitive resistor, which can sense the brightness change of light rays, output weak electric signals and amplify the signals through a simple electronic circuit. However, the cost of the device is increased, and the cost of the device is relatively high.

Disclosure of Invention

The application provides a substrate processing system, a conveying device, a conveying arm and a conveying method, which are used for solving one or more technical problems in the prior art.

A transfer arm, the transfer arm comprising:

the substrate placing device comprises a body, a substrate and a substrate, wherein the body is provided with a bearing surface for placing the substrate;

the electrostatic adsorption assembly is connected with the body and used for adsorbing and fixing the substrate on the bearing surface through electrostatic adsorption force;

the grounding component is connected with the body, the grounding component is arranged adjacent to the electrostatic adsorption component, the grounding component is used for electrically contacting with a part, corresponding to the electrostatic adsorption component, on the substrate so as to release charges generated during electrostatic induction on the surface of the substrate, and the grounding component is further used for electrically connecting with a current testing instrument.

In one embodiment, the electrostatic adsorption components are a plurality of, and the electrostatic adsorption components are arranged on the body at intervals; the grounding components are arranged in a plurality, and the grounding components and the electrostatic adsorption components are arranged in a one-to-one correspondence.

In one embodiment, the body comprises a base and two supporting parts connected with the base and arranged at intervals;

the static electricity adsorption components are arranged in three, one static electricity adsorption component is arranged on the base, and the other two static electricity adsorption components are respectively and correspondingly arranged at one ends of the two supporting parts far away from the base.

In one embodiment, the electrostatic chuck assembly is embedded within the body; the body is provided with an insulating part corresponding to the electrostatic adsorption component in position, and the electrostatic adsorption component is connected with the substrate through the insulating part; alternatively, the whole body of the body is provided with an insulating material.

In one embodiment, the electrostatic adsorption assembly includes at least one set of electrodes, one set of electrodes including a positive electrode and a negative electrode, the positive electrode being insulated from the negative electrode.

In one embodiment, the positive electrode and the negative electrode are both electrostatic diaphragms.

In one embodiment, the electrostatic adsorption assembly further comprises a first wire correspondingly connected to the positive electrode and a second wire correspondingly connected to the negative electrode; the first lead is used for being connected with the positive electrode of the power supply, and the second lead is used for being connected with the negative electrode of the power supply.

In one embodiment, the grounding assembly includes at least one set of grounding pins; the group of grounding pins comprises a first grounding pin arranged adjacent to the positive electrode and a second grounding pin arranged adjacent to the negative electrode; the first grounding pin is electrically connected with a first grounding wire, and also protrudes above the bearing surface and is used for contacting with the surface of the substrate; the second grounding pin is electrically connected with the second grounding wire, and also protrudes above the bearing surface and is used for being in contact with the surface of the substrate.

In one embodiment, the length of the area, protruding above the bearing surface, of the first grounding pin is 0mm-1mm; the length of the area, protruding above the bearing surface, of the second grounding pin is 0mm-1mm.

In one embodiment, the transfer arm further includes a clamping assembly, the clamping assembly being connected to the body, the clamping assembly being configured to clamp the substrate to secure the substrate to the body; the clamping assembly is further provided with an induction device, and the induction device is used for inducing whether the substrate is clamped by the clamping assembly or not.

The substrate conveying device comprises the conveying arm, the substrate conveying device further comprises a current testing instrument and a controller, the current testing instrument is electrically connected with the grounding assembly, and the current testing instrument is further electrically connected with the controller.

In one embodiment, the substrate transfer apparatus further includes a current signal amplifier disposed between the current test device and the controller, and the current test device is electrically connected to the controller through the current signal amplifier.

In one embodiment, the substrate transfer apparatus further comprises a result output device; the controller is electrically connected with the result output device.

In one embodiment, the substrate transfer apparatus further includes a power source electrically connected to the electrostatic chuck assembly.

In one embodiment, the substrate transfer apparatus further includes a first control switch electrically connected to the controller; the first control switch is used for controlling the power supply and the electrostatic adsorption component to be mutually connected or disconnected.

In one embodiment, the substrate transfer apparatus further includes a second control switch electrically connected to the controller; the second control switch is used for controlling whether the grounding component is grounded or not.

A substrate processing system comprising the substrate transfer apparatus.

A substrate transfer method using the substrate transfer apparatus, the substrate transfer method comprising:

a substrate conveying step, when the substrate is conveyed, controlling an electrostatic adsorption assembly to be connected with a power supply, wherein the electrostatic adsorption assembly is used for adsorbing and fixing the substrate on the bearing surface through electrostatic adsorption force, and simultaneously controlling the grounding assembly to be disconnected with the ground;

and a substrate state identification step, wherein the grounding component is controlled to be grounded, a current signal generated in the grounding process of the grounding component is obtained through a current testing instrument, and the state information of the substrate is judged according to the current signal.

In one embodiment, in the substrate state identifying step, determining the state information of the substrate according to the current signal includes:

acquiring current signals of a plurality of grounding components;

when the current signals of the grounding components are the same or are in a preset range, judging that the substrate is in a normal state;

when the grounding components do not generate current signals, judging that the substrate is in a slipping state;

and when at least one of the grounding components generates a current signal and at least one of the grounding components does not generate the current signal or the generated current signal is smaller than a preset range, judging that the substrate is in an offset state or a fragmentation state.

In one embodiment, the substrate transfer method further includes the steps of:

a display step of displaying the state information of the substrate; and/or the number of the groups of groups,

and a warning step, when the state information of the substrate is abnormal, warning action is carried out.

According to the substrate processing system, the conveying device, the conveying arm and the conveying method, on one hand, in the process of conveying the substrate, the substrate placed on the bearing surface is adsorbed by the electrostatic adsorption force of the electrostatic adsorption assembly, so that the substrate is fixed on the bearing surface, the problems of sliding sheets and the like of the substrate in the conveying process can be avoided, the breaking risk can be reduced, and the product yield can be improved; on the other hand, the static adsorption component is grounded through the grounding component through static induction to generate electric charges on the surface of the substrate, the electric charges are conducted to the ground through the grounding component, the electric currents are obtained through the current testing instrument, whether the substrate is placed on the bearing surface or not can be judged according to the electric currents, and electrons can be guaranteed to be conducted away rapidly after static electricity is released, so that sticking is prevented. Therefore, the device not only can play a role in adsorbing and fixing the substrate, but also can be used for judging whether the substrate exists on the bearing surface, and meanwhile, the structure of the device is not too complex, and the cost is low.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate and explain the disclosure and are not to be construed as limiting the disclosure.

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a schematic diagram of a transfer arm according to an embodiment of the disclosure;

FIG. 2 is an enlarged schematic view of FIG. 1 at A;

FIG. 3 is a schematic perspective view of a transfer arm according to an embodiment of the present disclosure;

FIG. 4 is a schematic view of a transfer arm according to another embodiment of the present disclosure;

FIG. 5 is a schematic view of an electrostatic chuck assembly according to an embodiment of the disclosure when the substrate is attracted by electrostatic chuck force;

FIG. 6 is a schematic electrical diagram of a conveyor according to an embodiment of the disclosure;

FIG. 7 is a schematic view of a substrate in a normal state according to an embodiment of the disclosure;

FIG. 8 is a schematic view of a substrate in a sliding state according to an embodiment of the disclosure;

FIG. 9 is a schematic diagram of a substrate in an offset state according to an embodiment of the disclosure;

FIG. 10 is a schematic view of a substrate in a slightly offset state according to an embodiment of the disclosure;

FIG. 11 is a schematic view of a substrate in a broken state according to an embodiment of the disclosure;

fig. 12 is a schematic structural view of a substrate in a broken state according to another embodiment of the present disclosure.

10. A body; 11. a base; 12. a support part; 13. a limiting block; 20. an electrostatic adsorption assembly; 21. a positive electrode; 22. a negative electrode; 23. a first wire; 24. a second wire; 30. a grounding assembly; 31. a first ground pin; 32. a second ground pin; 33. a first ground line; 34. a second ground line; 40. a substrate; 50. a current testing instrument; 60. a power supply; 70. a controller; 80. a current signal amplifier; 90. a result output device; 100. and a clamping assembly.

Detailed Description

In order that the above-recited objects, features and advantages of the present disclosure will become more readily apparent, a more particular description of the disclosure will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure. The present disclosure may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the disclosure, and therefore the disclosure is not to be limited to the specific embodiments disclosed below.

As described above, the present invention provides a substrate processing system, a substrate transfer apparatus, a method, and a control apparatus thereof, which can stably transfer a substrate while sensing the presence or absence of the substrate, and which has low cost, because a fixing device for fixing the substrate on a robot arm in the related art is separately disposed from a sensing device for sensing the substrate, resulting in a problem of high cost.

Referring to fig. 1, 2 and 5, fig. 1 illustrates a schematic structure of a transfer arm according to an embodiment of the present disclosure, fig. 2 illustrates an enlarged schematic structure at a of fig. 1, and fig. 5 illustrates a schematic structure of an electrostatic chuck assembly 20 according to an embodiment of the present disclosure when a substrate 40 is adsorbed by electrostatic chuck force. A transfer arm provided in an embodiment of the present disclosure includes: the electrostatic chuck comprises a body 10, an electrostatic chuck assembly 20 and a grounding assembly 30. The body 10 is provided with a bearing surface for placing the substrate 40. The electrostatic adsorption assembly 20 is connected to the main body 10, and the electrostatic adsorption assembly 20 is used for adsorbing and fixing the substrate 40 on the bearing surface by electrostatic adsorption force. The grounding assembly 30 is connected to the body 10, the grounding assembly 30 is disposed adjacent to the electrostatic adsorption assembly 20, the grounding assembly 30 is configured to electrically contact a portion of the substrate 40 corresponding to the electrostatic adsorption assembly 20, so as to release charges generated during electrostatic induction on the surface of the substrate 40, and the grounding assembly 30 is further configured to electrically connect to a current testing apparatus 50 (shown in fig. 6).

On the one hand, in the process of conveying the substrate 40, the substrate 40 placed on the carrying surface is adsorbed by the electrostatic adsorption force of the electrostatic adsorption assembly 20, so that the substrate 40 is fixed on the carrying surface, and the problems of sliding sheets and the like of the substrate 40 in the process of conveying can be avoided, thereby reducing the risk of breaking sheets and improving the yield of products; on the other hand, referring to fig. 5 and 6, the electric charge generated on the surface of the substrate 40 by the electrostatic attraction component 20 through electrostatic induction can be grounded through the grounding component 30, and the electric charge is generated in the process of guiding and grounding through the grounding component 30, and the electric current is obtained through the current testing instrument 50, and it can be correspondingly determined whether the substrate 40 is placed on the bearing surface according to the magnitude of the electric current, and it can be ensured that electrons can be rapidly conducted away after the electrostatic is released, thereby preventing sticking. Therefore, the device not only can play a role of adsorbing and fixing the substrate 40, but also can be used for judging whether the substrate 40 exists on the bearing surface, and meanwhile, the structure of the device is not too complex, and the cost is low.

It should be noted that, the portion of the substrate 40 corresponding to the electrostatic chuck 20 refers to a surface of the substrate 40 close to the electrostatic chuck 20 when the substrate 40 is placed on the supporting surface, in other words, a surface of the substrate 40 opposite to the electrostatic chuck 20, and not refers to the entire surface of the substrate 40. In addition, when the electrostatic chuck 20 is powered on, an electric charge is generated on the substrate 40 corresponding to the electrostatic chuck 20 by means of electrostatic induction, and the polarity of the generated electric charge is opposite to that of the electrostatic chuck 20, so that an electrostatic chuck force exists between the electrostatic chuck 20 and the substrate 40.

It should be further noted that the substrate 40 in this embodiment may be a semiconductor wafer at any stage in the process of forming semiconductor devices, such as integrated circuits or discrete devices, on a substrate. In one embodiment, the substrate 40 comprises an extremely low dielectric constant dielectric layer and a metal layer on a semiconductor substrate. The substrate 40 may be a photomask, a semiconductor wafer, or other workpiece known to those of ordinary skill in the art of electronic device manufacturing. In at least some embodiments, the substrate 40 comprises any material used to fabricate any integrated circuit, passive (e.g., capacitor, inductor), and active (e.g., transistor, photodetector, laser, diode) microelectronic elements. The substrate 40 may comprise an insulating material (e.g., a dielectric material) separating such active and passive microelectronic elements from one or more conductive layers formed atop them. In one embodiment, the substrate 40 is a semiconductor substrate comprising one or more dielectric layers, such as silicon, gallium arsenide, gallium nitride, silicon dioxide, silicon nitride, sapphire, and other dielectric materials. In one embodiment, the substrate 40 is a wafer stack including one or more layers. The wafer of one or more layers may include a conductive layer, a semiconductor layer, an insulating layer, or any combination of the preceding.

Referring to fig. 1 and 2, in one embodiment, the electrostatic chuck assembly 20 is a plurality of electrostatic chucks 20, and the electrostatic chucks 20 are disposed on the body 10 at intervals. The grounding assemblies 30 are plural, and the plural grounding assemblies 30 are disposed in one-to-one correspondence with the plural electrostatic adsorbing assemblies 20. Thus, on the one hand, when the number of the electrostatic chuck assemblies 20 is larger, it is advantageous to provide a sufficiently large suction force to the substrate 40, so that stable conveyance of the substrate 40 is achieved; on the other hand, when the number of the electrostatic adsorbing assemblies 20 is greater, the number of the grounding assemblies 30 is correspondingly greater, and the grounding assemblies 30 at different positions can generate currents respectively, so that whether the electrostatic adsorbing assemblies 20 corresponding to the current are completely covered, completely uncovered or not completely covered by the substrate 40 can be respectively judged according to the magnitude of the currents, and state information about whether the substrate 40 on the bearing surface is slipped, broken, offset or the like can be obtained.

As an alternative, the electrostatic adsorption component 20 and the grounding component 30 may be provided in one or two, and are mainly used for judging whether the substrate 40 on the bearing surface slips, that is, whether there is a substrate 40.

Of course, the electrostatic adsorbing assembly 20 and the grounding assembly 30 may be respectively provided in three, four, five, six or other numbers, and specific numbers and arrangement positions may be flexibly adjusted and set according to actual requirements, which is not limited herein.

It should be further noted that the specific shape of the bearing surface may be, for example, a regular shape or an irregular shape such as a circle, an ellipse, a triangle, a quadrilateral, a pentagon, a fork, etc., and may be flexibly adjusted and set according to actual needs, which is not limited herein.

Referring to fig. 1, in one embodiment, the body 10 includes a base 11 and two supporting portions 12 connected to the base 11 and spaced apart from each other. In this way, the overall shape of the body 10 is fork-shaped, adapted to the transport of different types of substrates 40.

Referring to fig. 1, in one embodiment, three electrostatic chuck assemblies 20 are provided, wherein one electrostatic chuck assembly 20 is disposed on the base 11, and the other two electrostatic chuck assemblies 20 are respectively disposed at one ends of the two supporting portions 12 away from the base 11. So set up, not only can realize adsorbing the fixed respectively with three positions of base plate 40, the fixed effect of base plate 40 on the holding surface is better, can also be favorable to judging whether the state information such as slippage, fracture, skew appear in base plate 40 on the loading surface in addition, the state identification information judgement result of base plate 40 is comparatively accurate, and the quantity of electrostatic absorption subassembly 20 is unlikely too much and leads to the device cost to increase simultaneously.

The electrostatic adsorbing assembly 20 is disposed on the main body 10 in a plurality of ways, as long as the electrostatic adsorbing assembly 20 does not protrude above the bearing surface, the electrostatic adsorbing assembly may be flush with the bearing surface, or may be disposed on the main body 10 at a position further away from the substrate 40 relative to the bearing surface. Specifically, for example, when the thickness of the body 10 is sufficiently thin, the electrostatic adsorbing assembly 20 may be disposed, for example, on a surface of the body 10 facing away from the bearing surface; for another specific example, a window is provided on the body 10 at a position corresponding to the electrostatic adsorbing assembly 20, and the electrostatic adsorbing assembly 20 is provided in the window.

Referring to fig. 2, in one embodiment, the electrostatic chuck assembly 20 is embedded within the body 10, as shown in phantom in fig. 2. Thus, the electrostatic adsorption component 20 is embedded in the body 10, so that the cleaning operation can be facilitated, and the electrostatic adsorption component 20 is protected.

After the electrostatic adsorption component 20 is embedded in the body 10, the thickness of the body 10 is increased or the hardness of the material is increased, so that the overall strength of the body 10 is ensured to be sufficient, and the weight of the substrate 40 can be borne in the process of supporting the substrate 40, so that the substrate is not easy to bend and deform and is not easy to damage.

Optionally, the body 10 is provided with an insulating portion corresponding to the position of the electrostatic chuck assembly 20, and the electrostatic chuck assembly 20 is connected to the substrate 40 through the insulating portion. In this way, when the electrostatic chuck 20 is energized, a polarization charge is generated on the insulating portion, and the polarization charge generates an induced charge on the surface of the substrate 40, so that the substrate 40 is fixed on the carrying surface by the electrostatic chuck.

Of course, as some alternatives, it is also possible to provide the whole body 10 with an insulating material. Wherein the insulating material includes, but is not limited to, ceramic, teflon, and the like.

Referring to fig. 4, fig. 4 is a schematic structural view of a transfer arm according to another embodiment of the present disclosure. In one embodiment, a stopper 13 is further provided on an end of the support portion 12 remote from the base portion 11. The limiting block 13 is used for abutting against the edge of the substrate 40, so that a limiting effect is achieved on the substrate 40, and the substrate 40 is stably placed on the bearing surface. Specifically, the portions of the stopper 13 contacting the substrate 40 are adapted to the edge shape of the substrate 40, for example, arc shapes, so that a good stopper effect is achieved.

Referring to fig. 2 and 5, in one embodiment, the electrostatic chuck assembly 20 includes at least one set of electrodes. The set of electrodes includes a positive electrode 21 and a negative electrode 22, with the positive electrode 21 and the negative electrode 22 being isolated in insulation. In this way, the positive electrode 21 can realize negative charge generation at the portion opposite thereto on the surface of the substrate 40, and the negative electrode 22 can realize positive charge generation at the portion corresponding thereto on the surface of the substrate 40, so that the positive electrode 21 can adsorb the substrate 40 by electrostatic adsorption force, and the negative electrode 22 can also adsorb the substrate 40 by electrostatic adsorption force.

For the same group of electrodes, on one hand, when the voltages of the positive electrode 21 and the negative electrode 22 are larger, the electrostatic adsorption force is more beneficial to be increased, and of course, the substrate 40 is damaged when the electrostatic adsorption force is too large due to the fact that the voltages cannot be too large, and the specific setting of the voltages can be flexibly adjusted and set according to actual requirements; on the other hand, it has been found that when the distance between the positive electrode 21 and the negative electrode 22 is relatively short, electric charges are easily generated on the plate surface of the substrate 40, which can be advantageous for increasing the electrostatic attraction force, but it is necessary to avoid short-circuiting caused by too small a distance between the positive electrode 21 and the negative electrode 22.

Note that, the insulating separation between the positive electrode 21 and the negative electrode 22 means that both the positive electrode 21 and the negative electrode 22 do not directly and indirectly electrically contact, so that the short circuit phenomenon is avoided. Specifically, a space is provided between the positive electrode 21 and the negative electrode 22 so that the two are insulated from each other, or the positive electrode 21 and the negative electrode 22 are insulated from each other by filling an insulating material, which may be either the body 10 or a separately provided insulating material.

In one embodiment, positive electrode 21, negative electrode 22 each include, but are not limited to, an electrostatic diaphragm. Thus, the electrostatic membrane can achieve a better adsorption effect, and in addition, the volume size is smaller, so that the electrostatic membrane is convenient to integrate in the body 10, and the purpose of reducing the volume of the conveying arm is achieved.

The shape of the electrostatic membrane includes, but is not limited to, various shapes such as square, circle, ellipse, pentagon, triangle, etc., and is not limited herein.

Referring to fig. 5, in one embodiment, the electrostatic chuck assembly 20 further includes a first wire 23 correspondingly connected to the positive electrode 21, and a second wire 24 correspondingly connected to the negative electrode 22. The first wire 23 is used for connection to the positive pole of the power supply 60 and the second wire 24 is used for connection to the negative pole of the power supply 60.

Wherein the power supply 60 is for example provided outside the body 10, in particular on a support seat connected to the base 11 or at another position of the substrate transfer device. Accordingly, the first conductive wire 23 and the second conductive wire 24 are embedded in the body 10, and extend outwards from the portion of the base 11 connected to the supporting seat to be connected to the power source 60.

Of course, as an example, the power source 60 is provided, for example, as a button cell, and is integrated on the body 10, specifically embedded within the body 10, for example.

Referring to fig. 5, in one embodiment, the grounding assembly 30 includes at least one set of grounding pins. The set of ground pins includes a first ground pin 31 disposed adjacent to the positive electrode 21 and a second ground pin 32 disposed adjacent to the negative electrode 22. The first grounding pin 31 is electrically connected to the first grounding wire 33, and the first grounding pin 31 also protrudes above the carrying surface and is used for contacting with the surface of the substrate 40. The second ground pin 32 is electrically connected to the second ground wire 34, and the second ground pin 32 also protrudes above the bearing surface and is used to contact the surface of the substrate 40. Thus, the negative charge generated on the surface of the substrate 40 by the positive electrode 21 through electrostatic induction can be conducted to ground through the first ground pin 31 and the first ground line 33; the positive charges generated on the surface of the substrate 40 by the negative electrode 22 through electrostatic induction can be conducted to ground through the second ground pin 32 and the second ground line 34.

In one embodiment, the length of the area of the first ground pin 31 protruding above the bearing surface is 0mm-1mm; the length of the area of the second ground pin 32 protruding above the carrying surface is 0mm-1mm. In this way, the lengths of the first grounding pin 31 and the second grounding pin 32 protruding above the bearing surface are not too long, so that the substrate 40 is damaged.

Specifically, the length of the area where the first and second ground pins 31, 32 protrude above the bearing surface is 0.1mm, 0.2mm, 0.3mm, 0.7mm, 0.9mm, 1mm, but may be a value greater than 1mm. In the present embodiment, the length of the area where the first grounding pin 31 and the second grounding pin 32 protrude above the carrying surface is 0.1mm. It has been studied that, when the thickness is set to 0.1mm, good electrical contact between the first and second ground pins 31, 32 and the surface of the substrate 40 can be satisfied without damaging the substrate 40 when the first and second ground pins are brought into contact with the surface of the substrate 40.

As an alternative, the electrostatic adsorbing assembly 20 may also include only one positive electrode 21 or one negative electrode 22, and may also be in the form of a combination of the positive electrode 21 or the negative electrode 22 and one or more groups of electrodes. Accordingly, the grounding assembly 30 is designed as a first grounding pin 31 corresponding to one positive electrode 21 or a second grounding pin 32 corresponding to one negative electrode 22, and may also be in the form of a combination of the first grounding pin 31 or the second grounding pin 32 with one or more sets of grounding pins.

Referring to fig. 1, 5 and 6, in one embodiment, a substrate transfer apparatus includes a transfer arm according to any of the above embodiments, the substrate transfer apparatus further includes a current testing device 50 and a controller 70, the current testing device 50 is electrically connected to the grounding assembly 30, and the current testing device 50 is further electrically connected to the controller 70.

In the above-mentioned substrate conveying device, on the one hand, in the process of conveying the substrate 40, the substrate 40 placed on the carrying surface is adsorbed by the electrostatic adsorption force of the electrostatic adsorption assembly 20, so that the substrate 40 is fixed on the carrying surface, and the problems of sliding sheets and the like of the substrate 40 in the process of conveying can be avoided, thereby reducing the risk of breaking sheets and improving the product yield; on the other hand, the electric charge generated on the surface of the substrate 40 by the electrostatic attraction component 20 through electrostatic induction can be grounded through the grounding component 30, and current is generated in the process of conducting and grounding through the grounding component 30, the current is obtained through the current testing instrument 50, whether the substrate 40 is placed on the bearing surface can be judged according to the current, and the electrons can be guaranteed to be conducted away rapidly after the static electricity is released, so that sticking is prevented. Therefore, the device not only can play a role of adsorbing and fixing the substrate 40, but also can be used for judging whether the substrate 40 exists on the bearing surface, and meanwhile, the structure of the device is not too complex, and the cost is low.

Referring to fig. 5 and 6, in one embodiment, the substrate transfer apparatus further includes a current signal amplifier 80 disposed between the current test instrument 50 and the controller 70. The current testing instrument 50 is electrically connected to the controller 70 through a current signal amplifier 80. In this way, since the current generated in the process of guiding and grounding the electric charges through the grounding component 30 is smaller, the current obtained by the current testing instrument 50 is smaller, the current signal amplifier 80 amplifies the current of the current testing instrument 50, and the amplified current signal is sent to the controller 70, and the controller 70 is used for comparing the amplified current signal with a preset value, and obtaining state information such as whether the substrate 40 slips, breaks, deflects, and the like according to the comparison result.

The current test apparatus 50 may be disposed on the first ground line 33 and the second ground line 34 in series, so as to obtain currents on the first ground line 33 and the second ground line 34; the current on the first grounding wire 33 and the second grounding wire 34 can be obtained by induction in a mutual inductance mode; the current on the first ground line 33, the second ground line 34 may be obtained by other means.

Referring to fig. 5 and 6, in one embodiment, the substrate transfer apparatus further includes a result output device 90. The controller 70 is electrically connected to the result output device 90. Specifically, the result output device 90 includes, but is not limited to, a display, a voice player, a vibrator, etc., and displays the status information output of the substrate 40 by display, voice playing, vibration, etc. In addition, when the substrate 40 is in a state of slipping, breaking, shifting, or the like, a voice prompt action or a light alarm action is performed.

In addition, the controller 70 may also be connected to a PC for transmitting status information of the substrate 40 to the PC.

Referring to fig. 5 and 6, in one embodiment, the substrate transfer apparatus further includes a power source 60. The power supply 60 is electrically connected to the electrostatic chuck assembly 20. Specifically, each electrostatic chuck assembly 20 is connected in parallel to a power supply 60. Alternatively, the first wire 23 is connected to the positive pole of the power supply 60 and the second wire 24 is connected to the negative pole of the power supply 60.

In one embodiment, the substrate transfer apparatus further includes a first control switch (not shown) electrically connected to the controller 70. The first control switch is used for controlling the power supply 60 and the electrostatic adsorption component 20 to be mutually connected or disconnected. Thus, when the substrate conveying device is conveying the substrate 40, the controller 70 controls the first control switch to operate, so that the control power supply 60 and the electrostatic adsorption component 20 are mutually connected; when the substrate transport apparatus stops transporting the substrate 40, i.e., the substrate 40 is not placed on the carrying surface, the controller 70 controls the first control switch to operate, so that the control power supply 60 and the electrostatic chuck assembly 20 are disconnected from each other, and thus particles (particles) generated by static electricity can be prevented from being accumulated.

In one embodiment, the substrate transfer apparatus further includes a second control switch (not shown) electrically connected to the controller 70. The second control switch is used to control whether the grounding assembly 30 is grounded. Thus, the second control switch is normally closed, and is disconnected from ground only when the substrate 40 is conveyed; and in a normal condition, the second control switch is normally closed, that is, the grounding assembly 30 is grounded, so that the electronic accumulation on the transfer arm can be prevented.

Referring to fig. 4, in one embodiment, the transfer arm further includes a clamping assembly 100. The clamping assembly 100 is connected to the body 10, and the clamping assembly 100 is used for clamping the substrate 40 to fix the substrate 40 on the body 10. So, the conveying arm adsorbs the base plate 40 placed on the bearing surface through the electrostatic adsorption force of the electrostatic adsorption component 20 in the process of conveying the base plate 40, so that the base plate 40 is fixed on the bearing surface, and the base plate 40 is clamped and fixed through the clamping component 100, so that the base plate 40 is placed on the bearing surface more firmly, the problems of sliding sheets and the like of the base plate 40 in the transmission process can be avoided, the breaking risk can be reduced, and the product yield is improved.

Further, optionally, an induction device (not shown) is further provided on the clamping assembly 100. The sensing device is used to sense whether the clamping assembly 100 clamps the substrate 40. Specifically, the sensing device is electrically connected to the controller 70. The sensing device, including but not limited to, a light sensor, magnetic sensor, proximity switch, gravity sensor, ultrasonic sensor, etc., is primarily used to sense whether a substrate is present at the clamping location of the clamping assembly 100, and when no substrate is sensed, the sensing device generates an electrical signal to the controller 70, and the controller 70 will alert and/or generate an indication that the substrate 40 is present on the load-bearing surface.

Referring again to fig. 4, the clamping assembly 100 shown in phantom in fig. 4 is shown in a position prior to clamping the substrate 40, and the clamping assembly 100 shown in solid is shown in a position to clamp the substrate 40. Specifically, the clamping assembly 100 is movably disposed on the body 10, specifically, for example, on the base 11, and when the substrate 40 on the carrying surface needs to be clamped, the clamping assembly 100 is moved to the clamping position (as the solid line position in fig. 4), and when the substrate 40 on the carrying surface needs to be unclamped, the clamping assembly 100 is moved to the position away from the substrate (as the broken line position in fig. 4), so that the substrate 40 on the carrying surface can be clamped stably, and the substrate 40 on the carrying surface can be unclamped conveniently. In addition, in the process of moving the clamping assembly 100 to the clamping position to clamp the substrate 40 on the carrying surface, in order to prevent the clamping assembly 100 from driving the substrate 40 to move, the clamping assembly 100 is designed as two clamping plates which can be opened and closed, for example, the two clamping plates are connected through an elastic device, the two clamping plates are opened by pressing the elastic device, so that the substrate 40 on the carrying surface is avoided before the substrate 40 is clamped, the elastic device is released after the substrate 40 is moved in place, and the elastic device provides an elastic force to drive the two clamping plates to stably clamp and fix the substrate 40 on the carrying surface.

In one embodiment, a substrate processing system includes the substrate transfer apparatus of any of the embodiments described above.

In the above substrate processing system, on one hand, in the process of conveying the substrate 40, the substrate 40 placed on the carrying surface is adsorbed by the electrostatic adsorption force of the electrostatic adsorption assembly 20, so that the substrate 40 is fixed on the carrying surface, and the problems of sliding sheets and the like of the substrate 40 in the process of conveying can be avoided, thereby reducing the risk of breaking sheets and improving the product yield; on the other hand, the electric charge generated on the surface of the substrate 40 by the electrostatic attraction component 20 through electrostatic induction can be grounded through the grounding component 30, and current is generated in the process of conducting and grounding through the grounding component 30, the current is obtained through the current testing instrument 50, whether the substrate 40 is placed on the bearing surface can be judged according to the current, and the electrons can be guaranteed to be conducted away rapidly after the static electricity is released, so that sticking is prevented. Therefore, the device not only can play a role of adsorbing and fixing the substrate 40, but also can be used for judging whether the substrate 40 exists on the bearing surface, and meanwhile, the structure of the device is not too complex, and the cost is low.

Referring to fig. 1, 5 and 6, in one embodiment, a substrate transfer method, using the substrate transfer apparatus of any of the above embodiments, includes:

A substrate transferring step of controlling the electrostatic adsorbing assembly 20 to be powered on 60 when transferring the substrate 40, the electrostatic adsorbing assembly 20 adsorbing and fixing the substrate 40 on the carrying surface by electrostatic adsorbing force, and controlling the grounding assembly 30 to be disconnected from the ground;

wherein, the grounding assembly 30 is disconnected from the ground means that the grounding assembly 30 is not grounded. In the substrate transfer step, the ground assembly 30 is controlled to be disconnected, so that the electric charges on the substrate 40 are prevented from being guided to the ground by the ground assembly 30, and the electrostatic attraction force between the substrate 40 and the electrostatic attraction assembly 20 is reduced, thereby causing the substrate 40 to slip from the transfer arm.

And a step of recognizing the state of the substrate 40, wherein the grounding assembly 30 is controlled to be grounded, a current signal generated in the grounding process of the grounding assembly 30 is obtained through the current testing instrument 50, and the state information of the substrate 40 is judged according to the current signal.

In the above substrate conveying method, on one hand, in the process of conveying the substrate 40, the substrate 40 placed on the carrying surface is adsorbed by the electrostatic adsorption force of the electrostatic adsorption assembly 20, so that the substrate 40 is fixed on the carrying surface, and the problems of sliding sheets and the like of the substrate 40 in the conveying process can be avoided, thereby reducing the breaking risk and improving the product yield; on the other hand, the electric charge generated on the surface of the substrate 40 by the electrostatic attraction component 20 through electrostatic induction can be grounded through the grounding component 30, and current is generated in the process of conducting and grounding through the grounding component 30, the current is obtained through the current testing instrument 50, whether the substrate 40 is placed on the bearing surface can be judged according to the current, and the electrons can be guaranteed to be conducted away rapidly after the static electricity is released, so that sticking is prevented. Therefore, the device not only can play a role of adsorbing and fixing the substrate 40, but also can be used for judging whether the substrate 40 exists on the bearing surface, and meanwhile, the structure of the device is not too complex, and the cost is low.

Referring to fig. 7 to 12, in an embodiment, in the step of identifying the state of the substrate 40, determining the state information of the substrate 40 according to the current signal includes:

acquiring current signals of a plurality of grounding assemblies 30;

the grounding assemblies 30 illustrated in fig. 7 to 12 are specifically but not limited to three, but may also be one, two, four, five, six, etc., and three grounding assemblies 30 will be described herein as an example.

When the current signals of the plurality of grounding assemblies 30 are the same or all within a preset range, judging that the substrate 40 is in a normal state;

referring to fig. 7, fig. 7 is a schematic structural diagram of a substrate 40 in a normal state according to an embodiment of the disclosure, wherein the substrate 40 completely covers three grounding assemblies 30 and three electrostatic adsorbing assemblies 20.

The preset range is set according to the magnitude of the current generated by the grounding device 30 when the substrate 40 completely covers the electrostatic adsorbing device 20 and the grounding device 30, so that the comparison between the current signal of the grounding device 30 and the preset range can be used to determine whether each grounding device 30 is completely covered by the substrate 40. Specifically, the substrate 40 is made to cover the electrostatic chuck assembly 20 and the grounding assembly 30 completely, and the current generated by the grounding assembly 30 is obtained by the current testing apparatus 50 to be I, for example, the preset range is set to be 0.9I-1.1I, or set to be 0.95I-1.05I.

When none of the plurality of grounding assemblies 30 generates a current signal, the substrate 40 is judged to be in a slipping state;

referring to fig. 8, fig. 8 is a schematic diagram illustrating a structure of the substrate 40 in a sliding state according to an embodiment of the disclosure, that is, the substrate 40 is not located above the body 10. Since the substrate 40 is not disposed above the body 10, no current signal is generated on each grounding assembly 30, and the current signal cannot be detected by the current testing apparatus 50, so that the substrate 40 can be determined to be in a slip state.

When at least one of the plurality of grounding members 30 generates a current signal and at least one of the plurality of grounding members does not generate a current signal or generates a current signal smaller than a predetermined range, it is determined that the substrate 40 is in an offset state or a broken state.

Fig. 9 is a schematic structural diagram of a substrate 40 in an offset state according to an embodiment of the present disclosure, in which the substrate 40 in fig. 9 completely covers two electrostatic chuck assemblies 20 and two grounding assemblies 30, and the other electrostatic chuck assembly 20 and the other grounding assembly 30 are completely exposed, so that two grounding assemblies 30 generate current signals, the generated current signals are in a preset range, and one grounding assembly 30 does not generate current signals.

Fig. 10 is a schematic structural diagram of a substrate 40 in a slightly offset state according to an embodiment of the present disclosure, where the substrate 40 in fig. 10 completely covers one of the electrostatic chuck assemblies 20 and one of the grounding assemblies 30, and both of the other two electrostatic chuck assemblies 20 and the other two grounding assemblies 30 are partially exposed to the outside of the substrate 40, so that one grounding assembly 30 generates a current signal, and the generated current signal is in a preset range, and the other two grounding assemblies 30 also generate a current signal, but the current signal is smaller than the preset range.

It should be noted that, the specific forms of the substrate 40 that are shifted on the main body 10 relative to the normal position are not limited to the two specific shifting forms shown in fig. 9 and 10, and other shifting forms are also possible, and are not described herein.

Fig. 11 is a schematic structural diagram of a substrate 40 in a broken state according to an embodiment of the present disclosure, where the substrate 40 in fig. 11 is broken, for example, a D-shaped plate, but is not limited to the D-shaped plate, and may be regular, for example, triangular, square, etc. and irregular. The D-shaped plate completely covers one of the electrostatic chuck assemblies 20 and the other one of the grounding assemblies 30, but completely exposes the other two electrostatic chuck assemblies 20 and the other two grounding assemblies 30, so that only one of the grounding assemblies 30 generates a current signal, the generated current signal is within a predetermined range, and the other two grounding assemblies 30 do not generate a current signal.

Fig. 12 is a schematic structural diagram showing a substrate 40 in a broken state according to another embodiment of the present disclosure, where the substrate 40 in fig. 12 is broken, for example, two semicircular plates, and one semicircular plate on the right completely covers the electrostatic adsorbing component 20 and the grounding component 30 on the base 11, and the other semicircular plate on the left completely covers the electrostatic adsorbing component 20 and the grounding component 30 on one support 12 and partially exposes the electrostatic adsorbing component 20 and the grounding component 30 on the other support 12, so that there are two grounding components 30 to generate current signals, and the generated current signals are in a preset range, and the other grounding component 30 also generates current signals, but the current signals are smaller than the preset range.

It should be noted that the specific forms of the substrate 40 in the broken state are not limited to the two specific broken forms shown in fig. 11 and 12, and other broken forms are also possible, and are not described herein.

In one embodiment, the substrate transfer method further comprises the steps of: and a display step of displaying the state information of the substrate 40.

In one embodiment, the substrate transfer method further comprises the steps of: and a warning step, when the state information of the substrate 40 is abnormal, warning operation is performed.

In one embodiment, in the substrate 40 state recognition step, the speed at which the transfer arm moves the substrate 40 is reduced or in a stationary state. Thus, the ground assembly 30 guides the charges on the substrate 40 to the ground, and the substrate 40 is not electrically attracted to the transfer arm, so that the substrate is prevented from slipping off the transfer arm.

In one embodiment, a substrate transfer method includes: after the transfer arm conveys the substrate 40 to the preset position, the electrostatic chuck assembly 20 is controlled to disconnect the power supply 60, and the grounding assembly 30 is controlled to be grounded.

Thus, the electrostatic chuck 20 is controlled to turn off the power supply 60, so that the electrostatic chuck 20 does not generate electrostatic chuck force with the substrate 40, the phenomenon of sticking is avoided, and the substrate 40 on the transfer arm is easily unloaded. In addition, since the grounding assembly 30 is grounded, the grounding assembly 30 can guide the residual electrons on the substrate 40 to the ground, so that particle defects on the substrate 40 can be avoided.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples represent only a few embodiments of the present disclosure, which are described in more detail and detail, but are not to be construed as limiting the scope of the disclosure. It should be noted that variations and modifications can be made by those skilled in the art without departing from the spirit of the disclosure, which are within the scope of the disclosure. Accordingly, the scope of protection of the present disclosure should be determined by the following claims.

In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present disclosure.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.

In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.

In this disclosure, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Claims (20)

1. A transfer arm, the transfer arm comprising:

the substrate placing device comprises a body, a substrate and a substrate, wherein the body is provided with a bearing surface for placing the substrate;

the electrostatic adsorption assembly is connected with the body and used for adsorbing and fixing the substrate on the bearing surface through electrostatic adsorption force;

the grounding component is connected with the body, the grounding component is arranged adjacent to the electrostatic adsorption component, the grounding component is used for electrically contacting with a part, corresponding to the electrostatic adsorption component, on the substrate so as to release charges generated during electrostatic induction on the surface of the substrate, and the grounding component is further used for electrically connecting with a current testing instrument.

2. The transfer arm of claim 1, wherein the electrostatic chuck assembly is a plurality of the electrostatic chuck assemblies, the plurality of the electrostatic chuck assemblies being spaced apart on the body; the grounding components are arranged in a plurality, and the grounding components and the electrostatic adsorption components are arranged in a one-to-one correspondence.

3. The transfer arm of claim 2, wherein the body comprises a base portion and two support portions connected to and spaced apart from the base portion;

the static electricity adsorption components are arranged in three, one static electricity adsorption component is arranged on the base, and the other two static electricity adsorption components are respectively and correspondingly arranged at one ends of the two supporting parts far away from the base.

4. The transfer arm of claim 1, wherein the electrostatic chuck assembly is embedded within the body; the body is provided with an insulating part corresponding to the electrostatic adsorption component in position, and the electrostatic adsorption component is connected with the substrate through the insulating part; alternatively, the whole body of the body is provided with an insulating material.

5. The transfer arm of claim 1, wherein the electrostatic adsorption assembly comprises at least one set of electrodes, a set of electrodes comprising a positive electrode and a negative electrode, the positive electrode being insulated from the negative electrode.

6. The transfer arm of claim 5 wherein said positive electrode and said negative electrode are electrostatic diaphragms.

7. The transfer arm of claim 5, wherein the electrostatic chuck assembly further comprises a first wire correspondingly connected to the positive electrode and a second wire correspondingly connected to the negative electrode; the first lead is used for being connected with the positive electrode of the power supply, and the second lead is used for being connected with the negative electrode of the power supply.

8. The transfer arm of claim 5, wherein the grounding assembly comprises at least one set of grounding pins; the group of grounding pins comprises a first grounding pin arranged adjacent to the positive electrode and a second grounding pin arranged adjacent to the negative electrode; the first grounding pin is electrically connected with a first grounding wire, and also protrudes above the bearing surface and is used for contacting with the surface of the substrate; the second grounding pin is electrically connected with the second grounding wire, and also protrudes above the bearing surface and is used for being in contact with the surface of the substrate.

9. The transfer arm of claim 8, wherein the length of the first ground pin protruding above the bearing surface is 0mm-1mm; the length of the area, protruding above the bearing surface, of the second grounding pin is 0mm-1mm.

10. The transfer arm of claim 1, further comprising a clamping assembly coupled to the body, the clamping assembly configured to clamp the substrate to secure the substrate to the body; the clamping assembly is further provided with an induction device, and the induction device is used for inducing whether the substrate is clamped by the clamping assembly or not.

11. A substrate transfer apparatus, comprising a transfer arm according to any one of claims 1 to 10, further comprising a current testing device and a controller, wherein the current testing device is electrically connected to the grounding assembly, and wherein the current testing device is further electrically connected to the controller.

12. The substrate transfer apparatus of claim 11, further comprising a current signal amplifier disposed between the current test device and the controller, the current test device being electrically connected to the controller through the current signal amplifier.

13. The substrate transfer apparatus of claim 11, further comprising a result output device; the controller is electrically connected with the result output device.

14. The substrate transfer apparatus of claim 11, further comprising a power source electrically connected to the electrostatic chuck assembly.

15. The substrate transfer apparatus of claim 11, further comprising a first control switch electrically connected to the controller; the first control switch is used for controlling the power supply and the electrostatic adsorption component to be mutually connected or disconnected.

16. The substrate transfer apparatus of claim 11, further comprising a second control switch electrically connected to the controller; the second control switch is used for controlling whether the grounding component is grounded or not.

17. A substrate processing system, characterized in that the substrate processing system comprises the substrate transfer apparatus according to any one of claims 11 to 16.

18. A substrate transfer method, characterized in that the substrate transfer apparatus according to any one of claims 11 to 16 is employed, comprising:

a substrate conveying step, when the substrate is conveyed, controlling an electrostatic adsorption assembly to be connected with a power supply, wherein the electrostatic adsorption assembly is used for adsorbing and fixing the substrate on the bearing surface through electrostatic adsorption force, and simultaneously controlling the grounding assembly to be disconnected with the ground;

And a substrate state identification step, wherein the grounding component is controlled to be grounded, a current signal generated in the grounding process of the grounding component is obtained through a current testing instrument, and the state information of the substrate is judged according to the current signal.

19. The substrate transfer method according to claim 18, wherein in the substrate state recognition step, judging the state information of the substrate based on the current signal includes:

acquiring current signals of a plurality of grounding components;

when the current signals of the grounding components are the same or are in a preset range, judging that the substrate is in a normal state;

when the grounding components do not generate current signals, judging that the substrate is in a slipping state;

and when at least one of the grounding components generates a current signal and at least one of the grounding components does not generate the current signal or the generated current signal is smaller than a preset range, judging that the substrate is in an offset state or a fragmentation state.

20. The substrate transfer method according to claim 18, further comprising the step of:

a display step of displaying the state information of the substrate; and/or the number of the groups of groups,

And a warning step, when the state information of the substrate is abnormal, warning action is carried out.