CN117620437A

CN117620437A - Automatic marking method, automatic marking equipment and chip set

Info

Publication number: CN117620437A
Application number: CN202210994090.5A
Authority: CN
Inventors: 请求不公布姓名
Original assignee: Hangzhou Chipjet Technology Co Ltd
Current assignee: Hangzhou Chipjet Technology Co Ltd
Priority date: 2022-08-18
Filing date: 2022-08-18
Publication date: 2024-03-01

Abstract

The application discloses an automatic marking method, equipment and a chipset, and relates to the field of printing. An automated marking method comprising: inputting parameters, feeding, conveying, marking and blanking. An automated marking apparatus comprising: the feeding device, the marking machine, the conveying device and the discharging device are respectively and electrically connected with the control device; the marking table is used for bearing the chip, the marking machine is arranged above the marking table, the marking machine is an ultraviolet laser marking machine, and the ultraviolet laser marking machine prints the identification information on a gold surface contact of the chip; the feeding device and the discharging device are respectively arranged at the upstream and the downstream of the marking table, and the conveying device is used for conveying the chip to be printed from the feeding device to the marking table or conveying the chip with the printed chip from the marking table to the discharging device. The embodiment of the application can solve the problems that the materials are mixed, the marks are easy to erase, the marks cannot be formed, and the like.

Description

Automatic marking method, automatic marking equipment and chip set

Technical Field

The application belongs to the technical field of printing, and particularly relates to an automatic marking method, automatic marking equipment and a chip set.

Background

The printer is one of the common devices in daily life and work, and can print colorful pictures, and in order to present colorful colors on a printing medium, the printer is provided with ink boxes/selenium drums with different colors in a matching way, and the required colors are obtained through the combination of the ink boxes/toner powder with different colors.

In general, a printer mainly includes a host computer and printing consumables, as shown in fig. 1, where the host computer is responsible for communication, signal processing, printing arrangement, and the like, and the printing consumables are used for storing ink/toner to implement printing. The printing consumable mainly comprises an ink box/selenium drum and a consumable chip, wherein the ink box/selenium drum is used for storing ink/toner, and the consumable chip is used for communicating with a printer, storing ink quantity/toner information and the like as shown in fig. 2.

In order to realize the distinction of chip information, the chip manufacturers can identify the chips, and the common realization modes of the identification are as follows:

1. labeling: labeling on the packaging box of the chip, but the label needs to be discarded after unpacking, can not exist for a long time along with the chip, and is easy to cause mixing and has a process risk.

2. Code spraying: the body on the contact surface of the chip is sprayed with the code, namely, the quick-drying ink is sprayed on the chip body by using a code spraying machine, but the ink belongs to liquid, so that the ink is easy to be stained on the chip body to cause poor appearance, liquid solvents such as chemical ink exist in the production of the ink box in the subsequent process, and when the solvents are stained on the code spraying mark carelessly, the code spraying mark is easy to be cleared or unclear, and the manufacturing process risk also exists.

3. Carving: the marking content is engraved on the chip body by using a laser marking machine, and when the laser marking machine emits high energy of laser beams to irradiate on the chip body, the surface of the chip body is heated to generate chemical change, so that the marking is formed, as shown in fig. 3.

Along with the continuous increase of the printing quantity, the ink/toner in the consumable cartridge is continuously increased, and meanwhile, the installation space of the consumable chip is continuously extruded, and the size of the consumable chip is continuously reduced. When a carbon dioxide laser printer is used for marking, the image-text mark cannot be formed after marking on a chip; when the optical fiber laser marking machine is replaced, the chip can be cut by the laser beam of the optical fiber laser marking machine or deeper pits or channels are formed on the surface of the chip, so that defective products are caused.

Therefore, it is important to find a new method for identifying the gold contacts of the chip to distinguish different chips.

Disclosure of Invention

The embodiment of the application aims to provide an automatic marking method, automatic marking equipment and a chip set, which can solve at least one of the problems that the current marking mode is mixed, the mark is easy to erase, the mark cannot be formed and the quality of the chip is affected.

In order to solve the technical problems, the application is realized as follows:

the embodiment of the application provides an automatic marking method, which is used for printing identification information to a chip, wherein a gold surface contact is laid on one side of the chip, and the automatic marking method comprises the following steps:

inputting parameters: acquiring characteristic information of a chip, and transmitting the characteristic information to a control device;

and (3) feeding: placing the chip in a feeding device;

and a material conveying step: transferring the chip from the feeding device to a marking table by using a conveying device;

marking: controlling an ultraviolet laser marking machine to perform ultraviolet laser marking on the gold surface contact of the chip on the marking table;

and (3) blanking: and transferring the chip with the printing mark from the marking table to a blanking device by using the conveying device, and conveying the chip to the next station by using the blanking device.

The embodiment of the application also provides an automatic marking device for print identification information to the chip, gold surface contact has been laid to chip one side, and this automatic marking device includes: the automatic marking device comprises a feeding device, a marking machine, a marking table, a conveying device, a discharging device and a control device, wherein the feeding device, the marking machine, the conveying device and the discharging device are respectively and electrically connected with the control device;

The marking table is configured to bear a chip, the working end of the marking machine is arranged opposite to the marking table, the marking machine is an ultraviolet laser marking machine, and the ultraviolet laser marking machine prints identification information on a gold surface contact of the chip through an ultraviolet laser beam;

the feeding device and the discharging device are respectively arranged at the upstream and the downstream of the marking table, and the conveying device is configured to convey the chip with the mark to be printed from the feeding device to the marking table or convey the chip with the mark to the discharging device from the marking table.

The embodiment of the application also provides a chip set, which comprises a plurality of chips, wherein the chips are arranged in an array, and a gold surface contact is laid on one side of each chip;

the gold surface contact is subjected to ultraviolet laser marking through the automatic marking method or the automatic marking equipment.

In the embodiment of the application, the ultraviolet laser marking machine is adopted to mark the gold surface contact of the chip, so that the gold surface contact is processed in a non-thermal process, the inner layer of the processed area and the nearby area are not heated or thermally deformed, the marked chip has smooth edges and extremely low carbonization, and the fineness and the thermal influence of the marking process are reduced to the minimum; meanwhile, the problems of mixing and manufacturing process risks caused by a labeling mode are solved, and the problems that a code spraying mode is easy to cause that a code spraying mark is easy to be removed or unclear are solved; in addition, compared with the hot processing mode adopted by carbon dioxide laser marking and optical fiber laser marking, the ultraviolet laser marking mode adopts a cold processing technology, so that clear polar surface marks can be left, the touch feeling is noninductive, the gold surface contact cannot be damaged, for example, a groove or a channel is cut, the quality of a chip subjected to marking is good, and the chip yield can be improved.

Drawings

FIG. 1 is a schematic diagram of a printer disclosed in the related art;

FIG. 2 is a schematic diagram of a printing-consumable disclosed in the related art;

FIG. 3 is a schematic diagram of a logo formed on a PCB plate outside of gold-faced contacts as disclosed in the related art;

FIG. 4 is a schematic diagram illustrating steps of an automated marking method according to an embodiment of the present disclosure;

FIG. 5 is a simplified flow chart of an automated marking method disclosed in an embodiment of the present application;

FIG. 6 is a schematic structural diagram of an automated marking apparatus disclosed in an embodiment of the present application;

FIG. 7 is a schematic diagram of a marking machine and chip according to an embodiment of the present disclosure;

FIG. 8 is a schematic diagram of electrical connection of electrical components of an automated marking apparatus disclosed in an embodiment of the present application;

FIG. 9 is a schematic diagram of an electrical connection between a printer probe and a printing consumable chip according to an embodiment of the present disclosure;

fig. 10 is a schematic diagram of marking a gold surface of an entire chip by using an ultraviolet laser marking method to form a mark according to the embodiment of the application;

FIG. 11 is a schematic diagram of a chipset according to an embodiment of the present disclosure;

FIG. 12 is a schematic diagram of an on-chip marking location arrangement as disclosed in an embodiment of the present application;

FIG. 13 is a schematic diagram of FIG. 12 with identification information removed;

FIG. 14 is a schematic diagram of a marking location arrangement of individual chips on a chipset according to an embodiment of the present application;

FIG. 15 is a schematic diagram of a chipset position offset as disclosed in embodiments of the present application;

FIG. 16 is a schematic diagram of angular deflection of a chip as disclosed in an embodiment of the present application;

FIG. 17 is a schematic diagram of a re-labeling location setup on a chip as disclosed in an embodiment of the present application;

FIG. 18 is a schematic diagram of a re-marking location arrangement for each chip on a chipset according to an embodiment of the present application;

FIG. 19 is a schematic diagram of a chip set positional offset in a re-labeling mode as disclosed in an embodiment of the present application;

FIG. 20 is a schematic diagram of angular deflection of a chip in a re-marking mode as disclosed in an embodiment of the present application;

FIG. 21 is a schematic diagram of deleting original marking content on a chip as disclosed in an embodiment of the present application;

FIG. 22 is a schematic diagram of deleting original marking content and adding remarked content on a chip as disclosed in embodiments of the present application;

fig. 23 is a simplified flow chart of a remanufacturing operation as disclosed in an embodiment of the present application.

Reference numerals illustrate:

100-feeding device; 110-a bearing table;

200-marking machine; 210-a laser power supply; 220-a processor; 230-a laser generator; 240-galvanometer mechanism; a 241-X direction mirror; 242-Y direction mirrors; 243-a lens; 250-cooling means;

300-marking table;

400-conveying device; 410-a mechanical arm; 420-a manipulator;

500-blanking device; 510-a conveyor belt; 520-a drive member;

600-control means;

700-rack;

800-a display device;

900-visual inspection device; 910-an imaging unit; 920-a driving unit;

1000-chip set; 1010-chip; 1011—chip body; 1012-gold surface contact; 1013-identification information.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

The wearable device provided by the embodiment of the application is described in detail below through specific embodiments and application scenes thereof with reference to the accompanying drawings.

In the actual consumable box production process, the consumable chip needs to be mounted on the consumable box, after the consumable chip is mounted on the consumable box, the electrical components are placed inside the consumable box, and only the gold-face contact face is exposed for communication and contact with the probe of the printer, as shown in fig. 9.

The gold-plated contact of the consumable chip is realized by chemically etching copper coating on a PCB substrate in the process of producing the PCB, and in order to improve the solderability and the conductivity, a chemical gold-plating process is usually carried out, so the contact is often called a gold finger or a gold-plated contact.

The most basic requirements for marking on the gold contact are as follows:

the mark is not easy to erase; the gold contacts cannot be broken after the mark is made, such as being cut or having serious pits, grooves, etc.

In order to meet the requirements, the embodiment of the application discloses an automatic marking method for printing identification information to a chip, wherein a gold surface contact is laid on one side of the chip, the area of the gold surface contact is at least 85% of the area on one side of the chip, and marks which can be easily identified visually in appearance can be left on the gold surface contact through the automatic marking method without damaging the structure of the gold surface contact.

Referring to fig. 4-23, the disclosed automated marking method includes the steps of:

inputting parameters: acquiring characteristic information of the chip 1010, and transmitting the characteristic information to the control device 600;

and (3) feeding: placing the chip 1010 on the feeding device 100;

and a material conveying step: transferring the chip 1010 from the feeding device 100 to the marking table 300 by using the conveying device 400;

marking: controlling an ultraviolet laser marking machine to perform ultraviolet laser printing on the gold surface contact of the chip 1010 on the marking table 300;

and (3) blanking: the chip with the print mark is transferred from the print table to the blanking device 500 by the transfer device 400, and transferred to the next station by the blanking device 500.

The parameter input step is to complete the production of the production program in automatic marking equipment. The characteristic information of the chip 1010 to be marked may be specifically included, so that the information of the chip 1010 is recorded in the control device 600, so as to facilitate subsequent marking, comparing parameter information, and the like. Specifically, the feature information may include a production work order, a product name, a production number, a marking position, marking information, and the like of the chip 1010 to be marked, so as to generate marking parameters, and implement an automatic marking process. Here, the control principle of the control device 600 may refer to the related art. In some embodiments, the "production mode" may be selected in the automatic marking device through the man-machine interface of the display device 800, so as to complete the production of the production program, that is, the input of the original information, including the production work order, the product name, the production quantity, the marking position, the marking information, and so on.

The loading step aims to feed the chip 1010 to be marked to a loading station so as to facilitate subsequent material taking from the loading station and improve the material taking efficiency. Alternatively, the chip 1010 may be loaded into a tray in a predetermined direction, and then the tray is placed at a loading station of the loading device 100, so as to facilitate subsequent material taking, and then a start key of the automated marking apparatus is pressed to start the automated marking apparatus.

The feeding step aims to transfer the chips 1010 on the feeding device 100 to the marking table 300 so as to improve the feeding efficiency. Optionally, the material conveying device may include a mechanical arm 410 and a mechanical arm 420, where the mechanical arm 410 may adopt a multi-axis mechanical arm 410 to implement rotation at different angles, so that a material conveying range may be enlarged, and the mechanical arm 420 may grab the chip 1010 to ensure stability and efficiency of chip 1010 transmission. Specifically, the manipulator 420 moves to the feeding device 100 under the driving of the manipulator 410, and grabs the chip 1010 at the feeding device 100, and then the manipulator 410 drives the manipulator 420 to move above the marking table 300, and places the chip 1010 on the marking table 300.

The marking operation is carried out by adopting an ultraviolet laser printer, wherein the ultraviolet laser printer adopts a cold processing technology, the fineness and the heat influence are reduced to the minimum, compared with the traditional hot processing, the ultraviolet laser processing process is called a 'photo-etching' effect, has very high-load ultraviolet photons, can break chemical bonds in materials or surrounding media, causes the surfaces of the materials to be damaged by non-thermal processes, and does not generate heating or thermal deformation and the like in inner layers and nearby areas, so that the processed materials have smooth edges and very low carbonization, and have obvious advantages.

After the printing of the mark is completed, the chip with the printing mark is transferred from the marking table 300 to the blanking device 500 by the transfer device 400, and the blanking is performed by the blanking device 500. Alternatively, the blanking device 500 may employ a belt conveyor or the like.

In the embodiment of the application, the ultraviolet laser marking machine is used for marking the gold surface contact of the chip, so that the gold surface contact is subjected to non-thermal processing, the inner layer of the processed area and the nearby area are not heated or thermally deformed, the marked chip has smooth edges and extremely low carbonization, and the marking process is reduced to the minimum in fineness and thermal influence. The working principle is as follows: the reaction mechanism in ultraviolet laser processing is realized through photochemical ablation, namely, atoms or intermolecular bonding is broken by means of laser energy, so that small molecules are gasified and evaporated, a focusing light spot is extremely small, and a processing heat affected zone is extremely small. After the consumable is marked by using an ultraviolet laser marking machine, clear polar surface marks can be left on the gold surface contact of the chip, and the gold surface contact cannot be damaged completely due to no sense when the consumable is touched. In this embodiment, the gold contact of the chip is printed by using an ultraviolet laser marking manner, so as to form a mark (black) on the gold contact, as shown in fig. 10.

Therefore, the automatic marking method in the embodiment of the application has no problems of mixing and manufacturing process risks caused by a labeling mode, and has no problems that a code spraying mode is easy to cause that a code spraying mark is easy to be removed or unclear; in addition, compared with the hot processing mode adopted by carbon dioxide laser marking and optical fiber laser marking, the ultraviolet laser marking mode adopts a cold processing technology, so that clear polar surface marks can be left, the touch feeling is noninductive, the gold surface contact cannot be damaged, for example, a groove or a channel is cut, the quality of a chip subjected to marking is good, and the chip yield can be improved.

In the embodiment of the application, the marking step includes:

the control device 600 acquires the target image information of the chip 1010 acquired by the visual detection device 900, and analyzes and processes the target image information;

the ultraviolet laser marking machine performs ultraviolet laser marking on the gold-surface contact of the chip 1010 based on the analysis processing result of the target image information by the control device 600.

The target image information of the chip 1010 may include information such as the overall size, the marking position, and the offset of the chip 1010.

Based on this, the specific situation of the chip 1010 can be collected by the visual detection device 900, so as to lay a data foundation for the subsequent adjustment of the working end of the marking machine 200, thereby ensuring the marking precision. Alternatively, the visual detection device 900 may be a camera device, such as a camera or the like.

Further, the analyzing and processing the target image information includes:

the control device 600 analyzes the size, the marking position and the offset of the chip 1010 to obtain marking position information of the chip 1010 on the marking table 300;

based on the marking position information, the ultraviolet laser marking machine performs azimuth adjustment of the marking position, confirms the operation parameters of the ultraviolet laser marking machine, and performs laser marking on the chip 1010 according to the adjusted marking position information and the operation parameters.

It can be appreciated that the ultraviolet laser marking machine can adjust the position of the working end according to the target image information of the chip 1010 acquired by the visual detection device 900, for example, adjust the position of the working end in the X direction, adjust the position of the working end in the Y direction, adjust the offset degree, and the like, so that the update of the position of the working end can be realized, so that the relative position between the working end and the chip 1010 meets the preset requirement.

Here, in fig. 12, the square frame position is the gold surface marking position of the product, assuming that the marking content of the product is 1234, the square frame position area is composed of the length and width of the gold surface contact, that is, A1B 1, and the center point of the area is set to be position 1.

As shown in fig. 13, the appearance of the 4 gold-faced contacts in the whole frame area is a typical feature of the product, and the typical feature is the basic direction and feature value identified by the visual detection device 900, and the typical feature can also be the whole appearance of the chip or other feature values.

Further, the control device 600 analyzes the offset of the chip 1010, including:

comparing the actual position of the chip 1010 acquired by the visual inspection device 900 with the inputted reference position of the chip 1010;

movement parameter information of the chip 1010 from the actual position to the reference position is calculated.

Based on the above steps, the information acquired by the visual inspection device 900 is analyzed by the control device 600, so that the relative position distance between the actual position of the chip 1010 and the reference position can be calculated, and the position deviation, such as the distance difference in the X direction and the distance difference in the Y direction, can be calculated, thereby determining the position difference between the actual position and the reference position. Based on the position difference, a foundation can be laid for the ultraviolet laser marking machine to carry out the azimuth adjustment of the marking position, and the accuracy of the marking position can be further ensured.

As shown in fig. 14, the chipset may include a plurality of chips arranged in an array, and for example, the chipset may include five rows and five columns of chips. Setting the lower left corner as the origin of the coordinate axis, setting the coordinate as (0, 0), setting the horizontal direction as the X axis of the coordinate axis, setting the vertical direction as the Y axis of the coordinate axis, and marking the 25 chip products on the whole chip set at the positions corresponding to the two positions: 1-25, the coordinates corresponding to the marking positions are respectively as follows: 1 (X1, Y1), 2 (X2, Y2), 3 (X3, Y3) … (X25, Y25), the respective corresponding marking areas are respectively: a1×b1, a2×b2, a3×b3 … a25×b25. Of course, the chipset may further include other numbers of chip products, and the number of the chip products is adjusted to be different according to the actual product characteristics, so that the setting method of the coordinates is the same, which is not described herein. In addition, the marking content may be distributed according to the actual order requirement and number, for example, the marking content of the chips 1-20 is 1234, the marking content of the chips 21-25 is 5678, etc.

As shown in fig. 15, when the position of the chipset is shifted, taking the marking position 1 as an example, the coordinates corresponding to the reference position are 1 (X1, Y1), the coordinates corresponding to the actual position are 1a (X1 a, Y1 a), the shift distance calculated by the control device 600 is 1a-1 (X1 a-X1, Y1 a-Y1), and the moving distance of the marking position 1 of the chip at the time of actual marking is shown as follows: it is necessary to move the distance X1a-X1 in the X direction and the distance Y1a-Y1 in the Y direction. Of course, taking the origin of coordinates as an example, that is, the coordinate point of the reference position is O, the coordinate point of the actual position is O1, the offset distance may be determined by calculating the distances between the O point and the O1 point, which are respectively moved in the X direction and the Y direction.

In addition to the positional deviation described above, the control device 600 analyzes the degree of deviation of the chip 1010, including:

comparing the actual center line of the local area of the chip 1010 (e.g., the first marked area in the chip 1010) acquired by the visual inspection apparatus 900 with the reference center line of the local area of the chip 1010;

rotation parameter information of the partial area of the chip 1010 rotated from the actual center line to the reference center line is calculated.

Based on the above steps, the information collected by the visual inspection device 900 is analyzed by the control device 600, so that the deflection angle of the chip 1010, for example, the deflection angle of the chip 1010 with respect to the Y axis or the deflection angle with respect to the X axis, can be calculated. Based on the deflection angle, a foundation can be laid for the ultraviolet laser marking machine to carry out the azimuth adjustment of the marking position, and the accuracy of the marking position can be further ensured.

As shown in fig. 16, taking the center line deflection of the marking area a1×b1 as an example, the deflection angle is θ, which is a specific angle that needs to be rotated during marking.

Based on the above-mentioned situation, the position deviation and the angle deviation of the chip or the whole chip set can be collected by the visual detection device 900, and the corresponding position moving distance and the corresponding angle of deflection can be calculated accordingly, so that the calculated position moving distance and the calculated angle of deflection can be sent to the ultraviolet laser marking machine during marking, and accurate marking operation can be realized.

When the original marking content needs to be updated or modified for some other reason or in need of upgrading the printing consumable chip, the chip needs to be re-marked, and the original marking content needs to be deleted, so that the customer can distinguish the printing consumable chip conveniently, and the mode is called a 'reproducing mode'. Of course, when the "reproducing mode" is needed, the "reproducing mode" can be selected in the automatic marking device through the man-machine interface of the display device 800, so as to complete the manufacture of the reproducing program, that is, the input of the original information, including the reproducing work order, the product name, the original marking information, the reproducing quantity, etc.

Based on the above, the automated marking method in the embodiment of the present application may further include a remarking step disposed after the marking step, where the remarking step includes:

deleting the original identification information on the gold contact of the chip 1010;

the new identification information is printed within a reprint area of chip 1010 where the reprint area is different from the location of the gold contact where the original identification information is located.

Further, the positions of the gold-surface contacts where the reprinting areas and the original identification information are located may be adjacent to each other so as to conform to the principle of nearby, and facilitate reprinting and site selection.

As shown in fig. 17, the left frame position is the original marking position of the product (i.e., the position of the gold contact where the original identification information is located), and the original marking content of the product (i.e., the original marking information) is: 1234, the area is made up of the length and width of the gold contact, i.e. A1B 1, i.e. the original marking area is A1B 1, the center point of the original marking position is set as position 1.

The right frame position is the product's remark position (i.e., the remark printing area), and the product's remark marking content (i.e., new identification information) is: 5678, the area is composed of the length and width of the gold contact, i.e. A1' B1', i.e. the remarked area is A1' B1', the center point of the remarked location is set as location 1'.

It should be noted that, the remarking position may be set manually, or the visual inspection apparatus 900 may be used to automatically address, and the automatic addressing principle of the visual inspection apparatus 900 is the nearest principle, that is, the region closest to the original marking position is preferably selected.

As shown in fig. 18, the chip set may include a plurality of chips arranged in an array, and for example, the chip set may include five rows and five columns of chips. Setting the lower left corner as the origin of the coordinate axis, setting the coordinate as (0, 0), setting the horizontal direction as the X axis of the coordinate axis, setting the vertical direction as the Y axis of the coordinate axis, and marking the 25 chip products on the whole chip set at the positions corresponding to the two positions: 1-25, wherein the marking positions of the marking positions are respectively as follows: 1', 2', 3' … ', 25'; the coordinates corresponding to the remarking positions are respectively as follows: 1 '(X1', Y1 '), 2' (X2 ', Y2'), 3 '(X3', Y3 ') …' (X25 ', Y25'); the corresponding marking areas are respectively as follows: a1'×b1', A2'×b2', A3'×b3' … a25'×b25'. Of course, the chipset may further include other numbers of chip products, and the number of the chip products is adjusted to be different according to the actual product characteristics, so that the setting method of the coordinates is the same, which is not described herein.

As shown in fig. 19, when the position of the chip set is shifted, taking the marking position 1 'as an example, the coordinates corresponding to the reference position are 1' (X1 ', Y1') and the coordinates corresponding to the actual position are 1a '(X1 a', Y1a '), the shift distance calculated by the control device 600 is 1a' -1 '(X1 a' -X1', Y1a' -Y1 '), and the moving distance of the marking position 1' of the chip at the time of actual marking is represented as: it is necessary to move the distance X1a '-X1' in the X direction and Y1a '-Y1' in the Y direction. Of course, taking the origin of coordinates as an example, that is, the coordinate point of the reference position is O ', the coordinate point of the actual position is O1', the offset distance may be determined by calculating the distances respectively moved in the X direction and the Y direction between the O 'point and the O1' point.

As shown in fig. 20, taking the center line deflection of the marking area A1' and B1' as an example, the deflection angle is θ ', which is a specific angle that needs to be rotated during marking.

Based on the above-mentioned situation, the position deviation and the angle deviation of the chip or the whole chip set can be collected by the visual detection device 900, and the corresponding position moving distance and the corresponding angle of deflection are calculated accordingly, so that when the re-marking step is performed, the calculated position moving distance and the calculated angle of deflection can be sent to the ultraviolet laser marking machine, and accurate marking operation can be realized.

Optionally, deleting the original identification information on the gold contacts of chip 1010 includes:

a deletion mark is printed on the original identification information, the deletion mark covering at least part of the original identification information.

The deletion mark may include at least one deletion line, a deletion pattern, a deletion symbol, and the like, and the form of the deletion mark is not particularly limited in the embodiment of the present application.

As shown in fig. 21, two deletion lines may be printed on the marking content 1234 of the original marking area a1×b1, and a new marking may be performed in the remarked area A1'×b1': 5678. based on this, it may be indicated that the original identification information 1234 is disabled and new identification information 5678 is used to reflect the chip characteristics with the new identification information.

In order to further verify whether the marking position is accurate or not so as to judge the qualification condition of the chip, the marking step comprises the following steps:

after the chip 1010 is subjected to ultraviolet laser marking, the visual detection device 900 is utilized to acquire image information of the chip with the printing mark, and the image information is transmitted to the control device 600;

and analyzing and comparing the image information with the characteristic information in the step of inputting the parameters to judge whether the chip with the printing mark is qualified or not.

Based on this step, various parameters of the chip after the marking is completed can be compared with the characteristic information of the chip 1010 input in the control device 600, and whether the information is within the error range or not is judged, if yes, the marking is qualified, and if not, the marking is not qualified, and the obtained chip is not qualified.

Further, when the identification information in the image information is clear, the azimuth of the identification information is correct, and the identification information is positioned in a preset gold surface contact, outputting the information of normal marking step;

outputting abnormal information of the marking step when the identification information in the image information is unclear, the azimuth of the identification information is incorrect, and at least one item of the identification information is at least partially positioned outside the preset gold surface contact point and meets at least one item.

Specifically, the control device 600 may identify the image information of the chip with the print identifier collected by the visual detection device 900, and analyze and compare the image information with the feature information in the step of inputting the parameters, so as to output OK when the image information is qualified, and output NG when the image information is unqualified.

Illustratively, the marking content 1234 can be clearly identified, and the marking content is within the area of a1×b1, and the marking content is in the correct direction, then OK is output; marking content 1234 can be clearly identified, but the marking content exceeds the area of A1 x B1, NG is output; if the marking content cannot be identified, outputting NG; the marking content 1234 can be clearly identified and is in the region of A1B 1, but the marking direction is opposite, NG is output, etc.

After the chip 1010 is subjected to remanufacturing and marking, the visual detection device 900 is used for acquiring the image information of the chip with the new identification information, the image information is transmitted to the control device 600, and the control device 600 is used for analyzing and comparing the image information with the characteristic information in the input parameters in the remanufacturing process so as to judge whether the chip with the new identification information is qualified or not.

Further, when the visual inspection apparatus 900 collects that the clear deletion mark covers at least part of the original mark information, clear new identification information located in the reproduction print area, and the new identification information is the same as the reproduction reference identification information, outputting the information of normal reproduction marking step;

outputting information of abnormality of the reproducing marking step when the deletion mark acquired by the visual inspection apparatus 900 is unclear, the deletion mark does not cover the original mark information, the new identification information is at least partially located outside the reproducing printing area, and at least one item is satisfied among the new identification information and the reproducing reference identification information. It should be noted that, the foregoing reproduction reference identification information may be understood as preset reproduction identification information, and the new identification information may be understood as actually printed reproduction identification information, and whether the reproduction printing process is normal or not, that is, whether the required identification information is printed on the gold contact according to the preset requirement is determined by comparing the new identification information with the reproduction reference identification information. In addition, the remanufactured reference identification information is different from the original identification information, so that the identification information on the gold surface contact is subjected to remanufacturing update, and the actual requirements are met.

Specifically, the control device 600 may identify the image information of the chip with the new identification information collected by the visual detection device 900, and analyze and compare the image information with the feature information in the input parameter step in the reproducing process, so as to output OK when the image information is qualified, and output NG when the image information is unqualified.

Illustratively, a delete mark (e.g., a delete line, etc.) on the original marking content (i.e., original identification information) 1234 can be clearly identified, and a remark marking content (i.e., new identification information) 5678 can be clearly identified, and the remark marking content is in the area of A1'×b1' and in the correct direction, then OK is output; the deletion mark on the original marking content 1234 can be clearly identified, the remarking content 5678 can be clearly identified, but the remarking content exceeds the area of A1 'and B1', and the direction is correct, and then NG is output; the deletion mark on the original marking content 1234 can not be clearly identified, the remarking content 5678 can be clearly identified, the remarking content exceeds the area of A1 'and B1', and the direction is correct, and then NG is output; the deletion mark on the original marking content 1234 can be identified, the remarking content 5678 can not be identified, and then the NG is output; the deletion mark on the original marking content 1234 can be clearly identified, and the remark marking content 5678 can be clearly identified, but the remark marking content exceeds the area of A1 'B1', and the direction is correct, NG is output, etc.

As shown in fig. 5, the specific process of the automated marking method in the embodiment of the present application is:

starting: and preparing for production.

Inputting parameters and making a program: the production procedure is completed in automatic marking equipment, namely: the input of the original information comprises a production work order, a product name, a production quantity, a marking position, marking information and the like.

And (3) feeding: chips 1010 to be marked are loaded into a tray in a preset direction, the tray is placed on the carrying table 110 of the automatic marking device, and then the start key of the automatic marking device is pressed by both hands.

Grabbing a first workpiece: the pallet is grasped by the robot 420 and transferred from the loading apparatus 100 to the marking table 300.

Shooting an image: the visual inspection apparatus 900 moves from the initial position to just above the marking table 300, and takes a picture of the chip 1010, transfers the picture to the control apparatus 600, and then the visual inspection apparatus 900 returns to the initial position.

First image operation: the control device 600 performs data analysis on the photo transmitted from the visual inspection device 900, including the overall size of the chip 1010, the size of the marking position, the degree of offset, and the like.

Azimuth adjustment: the ultraviolet laser marking machine performs azimuth adjustment of the marking position, including X-direction adjustment, Y-direction adjustment, offset adjustment, and the like, with respect to the analysis and calculation result of the control device 600.

Marking operation: marking is started.

Image inspection: the visual inspection apparatus 900 moves from the initial position to just above the marking table 300, and takes a picture of the ultraviolet-marked chip, transfers the picture to the control apparatus 600, and then the visual inspection apparatus 900 returns to the initial position again.

And (3) carrying out secondary image operation: the control device 600 recognizes the photo transmitted from the visual inspection device 900, compares it with the feature information in the input parameter step, and outputs an OK result and an NG result.

Grabbing a second time of workpiece: the pallet is grasped by the robot 420 and transferred from the marking station 300 to the blanking apparatus 500.

And (3) blanking: the tray is transferred out by the discharging device 500 so as to transfer the chips to the next station.

Ending: and (5) completing production.

As shown in fig. 23, the specific procedure of the remarking in the embodiment of the application is:

starting: and preparing for remanufacturing.

And (3) manufacturing a remanufacturing program: the manufacture of the remanufacturing program, i.e., the input of the original remanufacturing information, including the remanufacturing work order, the product name, the remanufacturing quantity, the original marking information, the remanufacturing marking information, and the like, is completed in an automated marking device.

And (3) feeding: the re-labeled chip 1010 is loaded into a tray in a predetermined direction, the tray is placed on the carrier 110 of the automated labeling apparatus, and then the start key of the automated labeling apparatus is pressed with both hands.

Grabbing a first workpiece: the trays are grasped by a robot and transferred from the loading device 100 to the marking station 300.

Shooting an image: the visual inspection apparatus 900 moves from the initial position to just above the marking table 300, and takes a picture of the chip 1010, and transmits the picture to the control apparatus 600, and then the visual inspection apparatus 900 returns to the initial position.

First image operation: the control device 600 performs data analysis on the photo transmitted by the visual inspection device 900, including the overall size of the chip 1010, addressing of the original marking information, addressing of the new marking area, offset, etc.

And (5) remanufacturing marking operation: the deletion of the original marking content (i.e., original identification information) is started and the remanufacturing marking content (i.e., new identification content) is added.

Image inspection: the visual inspection apparatus 900 moves from the initial position to the position right above the marking table 300, and takes a photograph of the ultraviolet remarked chip, transfers the photograph to the control apparatus 600, and then the visual inspection apparatus 900 returns to the initial position again.

And (3) carrying out secondary image operation: the control device 600 recognizes the photograph transferred from the visual inspection device 900, compares the recognized photograph with the feature information input in the reproducing step, and outputs an OK result and an NG result.

Ending: and (5) completing production.

Based on the automatic marking method, the embodiment of the application also discloses automatic marking equipment which is used for printing the identification information to the chip, wherein a gold surface contact is laid on one side of the chip, and the area of the gold surface contact at least accounts for 85% of the area on one side of the chip. Referring to fig. 6 to 10, the disclosed automated marking apparatus includes: feeding device 100, marking machine 200, marking table 300, conveyer 400, unloader 500 and controlling means 600.

The feeding device 100 is configured to receive and carry a chip 1010 to be marked, where the feeding device 100 is disposed upstream of the marking table 300, so as to provide the chip 1010 for marking operation. Optionally, the feeding device 100 may include a carrying table 110, where the carrying table 110 is used to carry the chip 1010 so as to provide a placing space for the chip 1010.

The blanking device 500 is used for blanking the chip after the marking is completed, wherein the blanking device 500 is arranged at the downstream of the marking table 300, so that the chip after the marking is completed on the marking table 300 is transmitted to other stations, and other working procedures are performed.

Optionally, the blanking device 500 may adopt a belt conveyor, including a transmission belt 510 and a driving component 520 for driving the transmission belt 510, where the driving component 520 includes a motor, a driving roller and a driven roller, the driving roller is parallel to the driven roller and is arranged at intervals, the transmission belt 510 is sleeved outside the driving roller and the driven roller, and a rotating shaft of the motor is in transmission connection with the driving roller, so that the driving roller can drive the transmission belt 510 to move under the driving of the motor, so that chips with printing marks thereon can be transmitted to other stations through the transmission belt 510 to realize blanking.

Of course, in other embodiments, the blanking device 500 may take other forms, which are not specifically limited in the embodiments of the present application.

The conveying device 400 is used for conveying chips between stations, and specifically includes that the conveying device 400 can convey chips with marks to be printed from the feeding device 100 to the marking table 300, or convey chips with marks to be printed from the marking table 300 to the discharging device 500. Therefore, the chip can be ensured to be transferred before each station, so that the marking efficiency of the chip is improved.

Alternatively, the transfer device 400 may include a robot arm 410, and one end of the robot arm 410 is provided with a robot arm 420 for gripping the chip. Wherein, the mechanical arm 410 can adopt a multi-axis mechanical arm to realize swinging of different angles, thereby expanding the transmission range; in addition, the robot 420 may employ cylinder jaws, hydraulic jaws, etc. to facilitate control of clamping or releasing the chip.

The marking table 300 is used for carrying chips so that the chips can be marked on the marking table 300.

The working end of the marking machine 200 is opposite to the marking table 300, and the marking machine 200 is an ultraviolet laser marking machine, and the marking information is printed onto the gold surface contact of the chip through the emitted ultraviolet laser beam, so that the cold processing of the chip can be realized through the ultraviolet laser marking machine, the marked chip can not generate thermal deformation and carbonization phenomena, and the contact can not be damaged, and the yield of the marked chip is improved. Alternatively, the working end of the marking machine 200 may be located directly above the marking table 300, or obliquely above the marking table, etc., and the relative position between the working end and the marking table is not particularly limited.

In addition, the feeding device 100, the marking machine 200, the conveying device 400 and the blanking device 500 are respectively electrically connected with the control device 600, so as to be respectively controlled by the control device 600, and realize the normal operation of marking operation.

In some embodiments, the ultraviolet laser marking machine may include a laser power supply 210, a processor 220, a laser generator 230, a galvanometer mechanism 240, and a cooling mechanism 250, wherein the laser generator 230 and the galvanometer mechanism 240 are respectively electrically connected to the processor 220, the laser power supply 210 and the cooling mechanism 250 are respectively connected to the laser generator 230, the laser power supply 210 is used for supplying electric power to the laser generator 230, and the cooling mechanism 250 is used for cooling the laser generator 230.

The processor 220 may employ a computer, which is used to control and coordinate the operations of the various parts of the ultraviolet laser marking machine, control the laser generator 230 to be turned on or off, control the galvanometer mechanism 240 to reflect the ultraviolet laser to different positions, and be used for cooperation and debugging of marking procedures, and other external information interaction and data processing. It should be noted that, the specific structure and the working principle of the processor 220 may refer to the related art.

The laser power supply 210 is configured to provide a continuous and stable power input to the laser generator 230 to ensure normal and stable operation of the laser generator 230; the laser generator 230 is used for emitting ultraviolet laser according to the requirement; the galvanometer mechanism 240 is used for reflecting the ultraviolet laser and finally transmitting the ultraviolet laser to the marked chip; the cooling mechanism 250 provides the temperature conditions required for proper operation of the laser generator 230, ensuring that the laser generator 230 operates within the desired temperature range.

Further, as shown in fig. 7, the galvanometer mechanism 240 may include an X-direction mirror 241, a Y-direction mirror 242, and a lens 243, wherein the X-direction mirror 241 is configured to rotate about an X-axis to reflect the ultraviolet laser light emitted from the laser generator 230 to the Y-direction mirror 242; the Y-direction mirror 242 is configured to rotate around the Y-axis to reflect the ultraviolet laser light reflected by the X-direction mirror 241 to the lens 243; the lens 243 is configured to conduct the ultraviolet laser light reflected by the Y-direction mirror 242 onto the chip.

Based on the above arrangement, by the combined action of the X-direction mirror 241 and the Y-direction mirror 242, the ultraviolet laser light can be reflected to different positions, so that the ultraviolet laser light can be propagated along a predetermined path, and finally transmitted to the chip through the lens 243.

Optionally, the X-direction mirror 241 and the Y-direction mirror 242 may each be provided with a power component, and the power component drives the mirror to rotate along the X-axis or rotate along the Y-axis, so as to automatically adjust the angle of the mirror by the power component, so as to meet the angle requirement.

Referring to fig. 6, in some embodiments, the automated marking apparatus may further include a chassis 700, a display device 800, and a visual inspection device 900, wherein the display device 800 and the visual inspection device 900 are electrically connected to the control device 600, respectively, so that signal transmission between the two and the control device 600 may be performed, respectively.

The display device 800 is disposed at an upper portion of the rack 700, and is configured to display a current state of the automatic marking apparatus, including displaying current production information, order information, product information, etc., and to implement man-machine interaction operation.

The control device 600 is disposed at the lower part of the frame 700, and a working table is disposed above the control device 600, and the marking table 300, the feeding device 100, the conveying device 400, the discharging device 500 and the visual detection device 900 are all disposed on the working table. Based on this, the marking table 300, the feeding device 100, the conveying device 400, the discharging device 500 and the visual inspection device 900 can be carried and installed through the working table, so that the stability of installation of each component is ensured, and meanwhile, the working table also separates the control device 600 from the marking table 300, the feeding device 100, the conveying device 400, the discharging device 500 and the visual inspection device 900, so that damage to the control device 600 in the whole marking process can be effectively prevented, and the integrity of the control device 600 is ensured.

In some embodiments, the visual inspection apparatus 900 may include an image capturing unit 910 and a driving unit 920, wherein the driving unit 920 is connected to the image capturing unit 910 to drive the image capturing unit 910 to move, and the image capturing unit 910 is used to capture images of the chip so as to obtain characteristic information of the chip. Alternatively, the image capturing unit 910 may be a high-definition camera, so as to improve the quality of the captured image, and make the feature information of the chip more accurate, thereby being beneficial to improving the marking accuracy.

Referring to fig. 11, the present embodiment also discloses a chipset 1000, the chipset 1000 being for being labeled. The disclosed chip set 1000 includes a plurality of chips 1010, the plurality of chips 1010 are arranged in an array, and gold contacts are laid on one side of each chip 1010, the area of the gold contacts is at least 85% of the area of one side of the chip 1010.

Alternatively, the chips 1010 may be connected in a column in the longitudinal direction, the chips 1010 in the columns may be arranged at intervals in the transverse direction, and the edges may be provided at the two ends in the longitudinal direction, so that the two ends in the longitudinal direction of each of the chips 1010 in the columns are connected to the edges at the two ends. Therefore, the chips 1010 form a whole plate together, so that the marking process of the whole plate chips 1010 can be realized, and the marking efficiency is greatly improved.

Here, the entire chip 1010 may have the X-axis direction in the lateral direction and the Y-axis direction in the longitudinal direction, and thus, coordinates may be given to each chip 1010 in the entire board, for example, the first chip 1010 in the first row of the first column, and coordinates (X ₁ ，Y ₁ ) The chips 1010 in the second column and the third row are assigned coordinates (X ₂ ，Y ₃ ) The chip 1010 in the third row of the fifth column is assigned a coordinate (X ₅ ，Y ₃ ) Etc. Based on this, the location of each chip 1010 may be determined based on the coordinates of that chip 1010 to facilitate selection of a particular chip 1010 for marking.

In some embodiments, each chip 1010 may include a chip body 1011, gold contacts 1012, and identification information, wherein the gold contacts 1012 are laid on one side surface of the chip 1010 so as to make electrical connection between electrical components through the gold contacts 1012. Further, to resolve specific information of the chip 1010, identification information may be printed on the surface of the gold contact 1012, so that specific information of the chip 1010 can be known through the identification information.

In this embodiment, the above automatic marking method or the above automatic marking device is used to perform ultraviolet laser marking on the gold contact 1012, so that non-thermal processing occurs on the surface of the gold contact 1012, thereby forming the identification information 1013 on the surface of the gold contact 1012, and thermal deformation of the processing area caused by heat generated in the printing process is avoided, so that the marked chip 1010 has smooth edges and extremely low carbonization, and the marking process is reduced to the minimum in fineness and thermal influence. Compared with a conventional marking mode, the embodiment of the application adopts a cold processing technology, can leave clear polar surface marks, is noninductive when touching, and can not damage the gold contact 1012, such as cutting, forming grooves or channels, and the like, so that the quality of a chip subjected to marking is better, and the yield of the chip can be improved.

The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.

Claims

1. An automated marking method for printing identification information (1013) to a chip (1010), wherein a gold contact (1012) is laid on one side of the chip (1010), the automated marking method comprising the steps of:

inputting parameters: inputting characteristic information of the chip (1010), and transmitting the characteristic information to the control device (600);

and (3) feeding: placing the chip (1010) in a loading device (100);

and a material conveying step: transferring the chip (1010) from the feeding device (100) to a marking table (300) by using a conveying device (400);

marking: controlling an ultraviolet laser marking machine to perform ultraviolet laser marking on a gold surface contact (1012) of the chip (1010) on the marking table (300);

and (3) blanking: and transferring the chip (1010) with the printing mark from the marking table (300) to a blanking device (500) by using the conveying device (400), and conveying the chip to the next station by the blanking device (500).

2. The automated marking method of claim 1, wherein the marking step comprises:

the control device (600) acquires target image information of the chip (1010) acquired by the visual detection device (900), and analyzes and processes the target image information;

the ultraviolet laser marking machine performs ultraviolet laser marking on the Jin Mian contact (1012) of the chip (1010) based on the analysis processing result of the control device (600) on the target image information.

3. The automated marking method of claim 2, wherein analyzing the target image information comprises:

the control device (600) analyzes the size, the marking position and the offset of the chip (1010) to obtain marking position information of the chip (1010) on the marking table (300);

based on the marking position information, the ultraviolet laser marking machine performs azimuth adjustment of the marking position, confirms operation parameters of the ultraviolet laser marking machine, and performs laser marking on the chip (1010) according to the adjusted marking position information and the operation parameters.

4. An automated marking method according to claim 3, wherein the control device (600) analyses the degree of offset of the chip (1010), comprising:

Comparing the actual position of the chip (1010) acquired by the visual detection device (900) with the input reference position of the chip (1010);

movement parameter information of the chip (1010) from the actual position to the reference position is calculated.

5. An automated marking method according to claim 3, wherein the control device (600) analyses the degree of offset of the chip (1010), comprising:

comparing the actual center line of the local area of the chip (1010) acquired by the visual detection device (900) with a reference center line of the local area of the chip (1010);

and calculating rotation parameter information of a local area of the chip (1010) rotating from the actual central line to the reference central line.

6. An automated marking method according to claim 3, further comprising a re-marking step, the re-marking step comprising:

deleting original identification information on a gold contact (1012) of the chip (1010);

printing new identification information within a reprint area of the chip (1010), wherein the reprint area is different from the location of the Jin Mian contact (1012) where the original identification information is located and the reprint area is adjacent to or spaced from the location of the Jin Mian contact (1012) where the original identification information is located.

7. The automated marking method of claim 6, wherein deleting the original identification information on the gold contacts (1012) of the chip (1010), comprises:

and printing a deletion mark on the original identification information, wherein the deletion mark covers at least part of the original identification information.

8. The automated marking method of claim 7, wherein when the visual inspection device (900) collects clear delete markers covering at least a portion of the original marker information, clear new identification information within the reprint area, and the new identification information is the same as the reprint reference identification information, outputting information that the reprint step is normal;

outputting information of abnormality of the reproducing marking step when the deletion mark acquired by the visual detection device (900) is unclear, the deletion mark does not cover the original mark information, the new identification information is at least partially located outside the reproducing printing area, and at least one item is satisfied in the difference between the new identification information and the reproducing reference identification information.

9. The automated marking method of claim 2, wherein the marking step comprises:

After the ultraviolet laser marking of the chip (1010) is finished, the visual detection device (900) is utilized to acquire the image information of the chip with the printing mark, and the image information is transmitted to the control device (600);

and analyzing and comparing the image information with the characteristic information in the step of inputting parameters, and judging the qualification condition of the chip with the printing mark.

10. The automated marking method of claim 9, wherein the information that the marking step is normal is output when the identification information (1013) in the image information is clear, the orientation of the identification information (1013) is correct, and the identification information (1013) is located within the preset gold contact (1012);

outputting information of abnormal marking step when the identification information (1013) in the image information is unclear, the azimuth of the identification information (1013) is incorrect, and at least one item of the identification information (1013) is at least partially positioned outside the preset gold surface contact (1012) to be met.

11. The automated marking method of claim 1, wherein the inputting parameters step comprises:

inputting a marking position to be printed on the chip (1010);

and inputting marking content.

12. The automated marking method of claim 1, wherein the automated marking method is used for marking a chip set (1000) comprising a plurality of the chips, and wherein a plurality of the chips of the chip set (1000) are arranged in an array;

inputting position coordinates of the chip (1010) in the chipset (1000);

and inputting marking content.

13. An automated marking apparatus for printing identification information (1013) to a chip, wherein a gold contact (1012) is laid on one side of the chip, the automated marking apparatus comprising: the automatic marking device comprises a feeding device (100), a marking machine (200), a marking table (300), a conveying device (400), a blanking device (500) and a control device (600), wherein the feeding device (100), the marking machine (200), the conveying device (400) and the blanking device (500) are respectively and electrically connected with the control device (600);

the marking table (300) is configured to bear a chip, the working end of the marking machine (200) is arranged opposite to the marking table (300), the marking machine (200) is an ultraviolet laser marking machine, and the ultraviolet laser marking machine prints identification information (1013) onto a gold contact (1012) of the chip through an ultraviolet laser beam;

The feeding device (100) and the discharging device (500) are respectively arranged at the upstream and the downstream of the marking table (300), and the conveying device (400) is configured to convey the chip with the mark to be printed from the feeding device (100) to the marking table (300) or convey the chip with the mark to be printed from the marking table (300) to the discharging device (500).

14. The automated marking apparatus of claim 13, wherein the marking machine (200) comprises a laser power supply (210), a processor (220), a laser generator (230), a galvanometer mechanism (240), and a cooling mechanism (250);

the laser generator (230) and the galvanometer mechanism (240) are respectively and electrically connected with the processor (220);

the laser power supply (210) and the cooling mechanism (250) are respectively connected with the laser generator (230), the laser power supply (210) is configured to supply electric energy to the laser generator (230), and the cooling mechanism (250) is configured to cool the laser generator (230).

15. The automated marking apparatus of claim 14, wherein the galvanometer mechanism (240) includes an X-direction mirror (241), a Y-direction mirror (242), and a lens (243);

The X-direction mirror (241) is configured for rotational movement about an X-axis to reflect the ultraviolet laser light emitted by the laser generator (230) to the Y-direction mirror (242);

the Y-direction mirror (242) is configured for rotational movement about a Y-axis to reflect the ultraviolet laser light reflected by the X-direction mirror (241) to the lens (243);

the lens (243) is configured to conduct ultraviolet laser light reflected by the Y-direction mirror (242) onto a chip.

16. The automated marking apparatus of claim 13, wherein the automated marking apparatus further comprises: a housing (700), a display device (800) and a visual inspection device (900);

the display device (800) and the visual detection device (900) are respectively electrically connected with the control device (600);

the display device (800) is arranged on the upper portion of the stand (700), the control device (600) is arranged on the lower portion of the stand (700), a working table plate is arranged above the control device (600), and the marking table (300), the feeding device (100), the conveying device (400), the discharging device (500) and the visual detection device (900) are all arranged on the working table plate.

17. The automated marking apparatus of claim 16, wherein the visual detection device (900) comprises a camera unit (910) and a drive unit (920);

The driving unit (920) is connected with the image capturing unit (910) to drive the image capturing unit (910) to move, and the image capturing unit (910) is used for capturing images of the chip.

18. The automated marking apparatus of any of claims 13 to 17, wherein the loading device (100) comprises a carrier table (110) carrying chips;

and/or, the blanking device (500) comprises a conveying belt (510) and a driving component (520) for driving the conveying belt (510) to move;

and/or the conveying device (400) comprises a mechanical arm (410), and one end of the mechanical arm (410) is provided with a mechanical arm (420) for grabbing chips.

19. A chipset, wherein the chipset (1000) comprises a plurality of chips, the plurality of chips are arranged in an array, and a gold surface contact (1012) is laid on one side of each chip;

the Jin Mian contact (1012) is uv laser marked by an automated marking method according to any one of claims 1 to 12 or an automated marking device according to any one of claims 13 to 18.