CN117613178A - Light emitting device package frame and package method - Google Patents
Light emitting device package frame and package method Download PDFInfo
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- CN117613178A CN117613178A CN202311508460.0A CN202311508460A CN117613178A CN 117613178 A CN117613178 A CN 117613178A CN 202311508460 A CN202311508460 A CN 202311508460A CN 117613178 A CN117613178 A CN 117613178A
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- emitting device
- patch
- pins
- light emitting
- plastic package
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000009713 electroplating Methods 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000011324 bead Substances 0.000 claims description 15
- 239000004593 Epoxy Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 32
- 238000007747 plating Methods 0.000 description 10
- 238000000465 moulding Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The application discloses a light emitting device package frame. The packaging frame comprises a lead frame, a control chip, a plastic package body, an electroplating circuit layer and a plurality of light-emitting devices; wherein the lead frame comprises a base island and a plurality of bonding wire pins arranged on at least one side of the base island; the control chip is attached to the base island and positioned on one side of the front surface of the lead frame, and is electrically connected with each bonding wire pin respectively; the plastic package body encapsulates the control chip on the lead frame, part of bonding wire pins are exposed from the plastic package body from the front surface to form first patch pins, and part of the base island is exposed from the plastic package body from the front surface to form second patch pins; the electroplating circuit layer is formed on the plastic package body and is electrically connected with the second patch pin; one end of the light-emitting device is attached to the corresponding first patch pin, and the other end of the light-emitting device is attached to the electroplating circuit layer. The packaging frame has a simple structure, and can realize high-density integrated packaging of the light emitting device so as to reduce the volume of the packaged light emitting device. The application also discloses a light emitting device packaging method.
Description
Technical Field
The present disclosure relates to the field of light emitting device packaging technology, and in particular, to a light emitting device packaging frame and method.
Background
A light emitting diode, abbreviated as LED, is a commonly used light emitting device that emits light by energy released by recombination of electrons and holes, and is widely used in the field of illumination.
In the traditional LED lamp bead packaging products, most of the traditional LED lamp bead packaging products are packaged correspondingly on a plane by adopting one driving chip and one LED lamp bead, the process is simple, certain production and use function requirements can be met, but when multiple lamp beads are required to be installed and used, the traditional LED lamp bead packaging products are large in size, defects with low integration level can be exposed, and further customer requirements cannot be met.
Therefore, it is necessary to improve and perfect the packaging structure of the existing LED lamp beads.
Disclosure of Invention
The application provides a light emitting device packaging frame and a packaging method, and aims to solve the problems of large volume and low integration level in the prior art when a plurality of LED lamp beads are packaged.
To achieve the above object, the present application proposes a light emitting device package frame comprising:
a lead frame including a base island and a plurality of wire bond pins arranged on at least one side of the base island;
the control chip is attached to the base island and positioned on one side of the front surface of the lead frame, and is electrically connected with each bonding wire pin respectively;
the control chip is packaged on the lead frame, part of the bonding wire pins are exposed from the plastic package body to form first patch pins, and part of the base islands are exposed from the plastic package body to form second patch pins; the plastic package body comprises one of epoxy thermosetting resin, silica gel and organic glass;
the electroplating circuit layer is formed on the plastic package body and is electrically connected with the second patch pin;
one end of each light-emitting device is attached to the corresponding first patch pin, and the other end of each light-emitting device is attached to the electroplating circuit layer;
the first patch pins are arranged on one side of the electroplating circuit layer and are arranged at equal intervals with the electroplating circuit layer.
In some embodiments, a plurality of bonding wire pins exposed from the plastic package body are arranged on two opposite sides of the base island, the number of the electroplating circuit layers is two, and a plurality of first patch pins are arranged on one side of each electroplating circuit layer.
In some embodiments, the electroplated wiring layer is a solder layer.
In some embodiments, the bonding wire pin includes a bonding wire portion and a patch portion of an integral structure, the patch portion is formed on the bonding wire portion, a top surface of the patch portion is exposed from the plastic package body to form the first patch pin, and a top surface of the patch portion is higher than the control chip.
In some embodiments, the control chip is bonded to the bonding wire portion through a metal wire, and the top surface of the patch portion is further higher than the metal wire.
In some embodiments, the metal wire is one of gold wire, copper wire, and aluminum wire.
In some embodiments, a die bond is disposed between the control chip and the island.
In some embodiments, the plurality of light emitting devices includes LED beads that emit red, green, and blue light, respectively.
In some embodiments, the wire bond pins and the islands are also exposed from the plastic package from the opposite side of the leadframe for use as signal input pins.
The present application also provides a light emitting device packaging method for preparing the light emitting device packaging frame as described above, the packaging method comprising:
etching the front surface of the lead frame to form a base island and a plurality of bonding wire pins arranged on at least one side of the base island;
attaching a control chip to the base island and positioned on one side of the front surface of the lead frame;
the control chip and the bonding wire pins are respectively connected by adopting metal wire bonding;
the control chip and the metal wire are subjected to plastic package on the lead frame through a plastic package body to form a frame plastic package body; the plastic package body comprises one of epoxy thermosetting resin, silica gel and organic glass;
grinding the front surface of the frame plastic package body to expose part of the bonding wire pins from the plastic package body to form first patch pins, and exposing part of the base island from the plastic package body to form second patch pins;
setting an electroplating circuit layer electrically connected with the second patch pins, and enabling a plurality of first patch pins to be arranged on one side of the electroplating circuit layer and arranged at equal intervals with the electroplating circuit layer;
and mounting the light emitting device between the electroplating circuit layer and the first patch pin.
The technical scheme of the application provides a light-emitting device packaging frame, which comprises a lead frame, a control chip, a plastic package body, an electroplating circuit layer and a plurality of light-emitting devices; the control chip is electrically connected with each bonding wire pin, part of the bonding wire pins are exposed from the plastic package body from the front surface to form first patch pins, and part of the base island is exposed from the plastic package body from the front surface to form second patch pins; and forming an electroplating circuit layer electrically connected with the second patch pin on the plastic package body, and further packaging a plurality of light emitting devices on the front surface of the frame based on the electroplating circuit layer and the first patch pin. The structure is simple, the control chip controls the operation of the corresponding light emitting device after receiving the electric signal, the high-density integrated packaging is realized, and the volume of the integrated packaging of the light emitting device is reduced. The application also provides a light emitting device packaging method.
Drawings
For a clearer description of embodiments of the present application or of the solutions of the prior art, the drawings that are required to be used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only some embodiments of the present application, and that other drawings may be obtained, without inventive effort, by a person skilled in the art from these drawings, in which:
fig. 1 is a schematic structural view of a light emitting device package frame according to an embodiment of the present application;
FIG. 2 is a flow chart of a method of packaging a light emitting device according to an embodiment of the present application;
FIG. 3 is a process diagram of a method of packaging a light emitting device according to an embodiment of the present application;
FIG. 4 is a schematic top view of the leadframe of FIG. 1 after etching;
FIG. 5 is a schematic top view of the package frame of FIG. 1 after mounting a light emitting device;
fig. 6 is a top view of a light emitting device integrated package according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is correspondingly changed.
It will also be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Furthermore, the descriptions of "first," "second," and the like, herein are for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.
Referring to fig. 1, fig. 4 and fig. 5, the present application proposes a light emitting device package frame, which includes a lead frame, a control chip 30, a plastic package body 60, an electroplated circuit layer 70 and a plurality of light emitting devices 80; wherein the leadframe includes a base island 10 and a plurality of wire bond pins 20 arranged on at least one side of the base island 10; the control chip 30 is mounted on the base island 10 and positioned on one side of the front surface of the lead frame, and is electrically connected with each bonding wire pin 20 respectively; the plastic package body 60 encapsulates the control chip 30 on the lead frame, and part of the bonding wire pins 20 are exposed from the plastic package body 60 from the front surface to form first patch pins 210, part of the base island 10 is exposed from the plastic package body 60 from the front surface to form second patch pins 220, the electroplating circuit layer 70 is formed on the plastic package body 60, and is electrically connected with the second patch pins 220; one end of the light emitting device 80 is attached to the corresponding first patch pin 210, and the other end is attached to the plating circuit layer 70.
Among them, a lead frame is a connector material for use in electric and electronic devices, which has high conductivity and good heat resistance. The control chip 30 can be fixed on the base island 10 through the adhesive, and the control chip 30 is attached to the base island 10 to establish electrical connection.
The light emitting device 80 may be an LED lamp bead emitting red light, green light and blue light, the control chip 30 is an LED chip, and is disposed on the base island 10 in the middle area of the lead frame, and then packaged by the plastic package body 60, where the plastic package body 60 includes one of epoxy thermosetting resin, silica gel and organic glass. Furthermore, the technical scheme of the application can realize the encapsulation of a plurality of LED lamp beads, and after external signals are received through the bonding wire pins 20, the corresponding LED lamp beads are controlled to emit light by the control chip 30. It is understood that the light emitting device 80 includes, but is not limited to, an LED light bead.
The control chip 30 and each bonding wire pin 20 are electrically connected, part of the bonding wire pins 20 are exposed from the plastic package body 60 from the front surface to form a first patch pin 210, and part of the base island 10 is exposed from the plastic package body 60 from the front surface to form a second patch pin 220; to form the plating circuit layer 70 electrically connected to the second chip pins 220 on the plastic package body 60, and to package the plurality of light emitting devices 80 on the front surface of the frame based on the plating circuit layer 70 and the first chip pins 210. The structure is simple, the control chip 30 controls the corresponding light emitting device 80 to operate after receiving the electric signal, high-density integrated packaging is realized, and the volume of the integrated packaging of the light emitting device 80 is reduced.
It will be appreciated that some of the wire bond pins 20 are not exposed from the front side of the plastic package 60, but are still electrically connected to the control chip 30, and that these wire bond pins 20 that are not exposed from the front side of the plastic package 60 are typically exposed from the back side of the frame from the plastic package 60 for connection to an external circuit board as signal input pins for transmitting input signals.
Further, other wire bonding pins 20 and islands 10 are also exposed from the plastic package 60 from the opposite side of the lead frame, and are also connected to an external circuit board as signal input pins for inputting signals. Further, the control chip 30 controls the corresponding light emitting device 80 to emit light after receiving the input signals transmitted from the bonding wire pins 20 and the island 10.
Referring to fig. 1 and 3, in some embodiments, a heat-dissipating glue 40 is disposed between the control chip 30 and the base island 10 to provide good heat dissipation through the heat-dissipating glue 40.
Referring to fig. 1, fig. 4, and fig. 5, in some embodiments, the plurality of first patch pins 210 are disposed on one side of the plating circuit layer 70 and are disposed at equal intervals from the plating circuit layer 70.
The plating circuit layer 70 is a long tin soldering layer based on a plating trunk formed by connecting with the second patch pins 220, and when a plurality of first patch pins 210 are arranged at one side of the plating trunk at equal intervals, the other end of the light emitting device 80 arranged based on each first patch pin 210 can be conveniently connected with the plating trunk, and the structural complexity is reduced.
A solder layer may be disposed on the top of the first chip pin 210 corresponding to the first chip pin 210 to form an electroplating point 710, as shown in fig. 5, and then one end of the light emitting device 80 is connected to the electroplating point 710, and the other end is connected to the electroplating trunk.
Referring to fig. 1, 4 and 5, in some embodiments, a plurality of bonding wires 20 exposed from the plastic package 60 are arranged on two opposite sides of the base island 10, the number of the plated circuit layers 70 is two, and a plurality of first bonding pads 210 are disposed on one side of each plated circuit layer 70. In this way, the plurality of groups of corresponding electroplating circuit layers 70 and the first patch pins 210 are arranged, which is favorable for improving the mounting position of the light emitting devices 80 and mounting more light emitting devices 80 in a limited space.
Referring to fig. 1, in some embodiments, the bonding wire pin 20 includes a bonding wire portion 21 and a patch portion 22 integrally formed, the patch portion 22 is formed on the bonding wire portion 21, and a top surface of the patch portion 22 is exposed from the plastic package 60 to form a first patch pin 210, and a top surface of the patch portion is higher than the control chip 30.
It can be appreciated that the bonding portion 22 is formed by etching the bonding wire pin 20, for example, the bonding wire pin 20 is etched to form a "convex" structure, wherein the bonding portion 22 is located at the upper half, and the bonding wire portion 21 is located at the lower half, and in part of the bonding wire pin 20, the bonding portion 22 is exposed from the plastic package 60 from the front, and the exposed bonding wire pin 20 is used for mounting the light emitting device 80. In the case where the bonding wire leads 20 are not exposed from the front surface, the bonding wire leads 20 are not exposed from the plastic package 60 to the external circuit board, and the bonding wire leads 22 are not etched to protrude from the front surface, and thus the bonding wire leads 22 and the bonding wire leads 21 are not layered in steps. The specific placement of wire bond pins 20 is divided based on their use.
Referring to fig. 1, in some embodiments, the control chip 30 is bonded to the bonding wire portion 21 through the metal wire 50, and the top surface of the patch portion 22 is further higher than the metal wire 50. In this way, the control chip 30 and the metal wire 50 can be prevented from being damaged when the plastic package 60 is ground.
Wherein the metal wire 50 is one of gold wire, copper wire and aluminum wire.
Referring to fig. 1, in some embodiments, the light emitting device 80 is covered with a pressing film 90, and the light emitting device 80 emits light outwards through the pressing film 90. Thus, the lamp bead covered with the pressed film 90 is hard, the temperature resistance is improved, and the lamp bead has the characteristics of UV resistance and no deformation.
The present application also provides a light emitting device packaging method for preparing the light emitting device 80 package frame as described above, the packaging method comprising the flow as shown in fig. 2:
step S110, etching the front surface of the lead frame to form a base island 10 and a plurality of bonding wire pins 20 arranged on at least one side of the base island 10;
step S210, attaching the control chip 30 to the base island 10 and located at one side of the front surface of the lead frame;
step S310, bonding the control chip 30 and the plurality of bonding wire pins 20 by using the metal wire 50;
step S410, plastic packaging the control chip 30 and the metal wire 50 on the lead frame through the plastic package body 60 to form a frame plastic package body; the plastic package body comprises one of epoxy thermosetting resin, silica gel and organic glass;
step S510, grinding the front surface of the frame molding body to expose a portion of the bonding wire pins 20 from the molding body 60 to form the first chip pins 210, and exposing a portion of the base island 10 from the molding body 60 to form the second chip pins 220;
step S610, an electroplating circuit layer 70 electrically connected to the second patch pins 220 is provided, and a plurality of first patch pins 210 are all disposed on one side of the electroplating circuit layer 70 and are disposed at equal intervals with the electroplating circuit layer 70;
in step S710, the light emitting device 80 is mounted between the plating circuit layer 70 and the first chip pins 210.
The packaging method can prepare the light emitting device packaging frame, so that the control chip 30 and each bonding wire pin 20 are electrically connected, part of the bonding wire pins 20 are exposed from the plastic package body 60 from the front to form the first patch pins 210, part of the base island 10 is exposed from the plastic package body 60 from the front to form the second patch pins 220, the electroplating circuit layer 70 electrically connected with the second patch pins 220 is formed on the plastic package body 60, and then the plurality of light emitting devices 80 are packaged on the front of the frame based on the electroplating circuit layer 70 and the first patch pins 210. The structure is simple, the control chip 30 controls the corresponding light emitting device 80 to operate after receiving the electric signal, high-density integrated packaging is realized, and the volume of the integrated packaging of the light emitting device 80 is reduced. See in particular the process diagram shown in fig. 5.
In some embodiments, the light emitting device packaging method further includes: step S810, coating the light emitting device 80 with the pressing film 90.
The wire bond pins 20 and the islands 10 are exposed from the back surface of the molding body 60 by one step during molding, or by grinding the back surface of the frame molding body 60 after molding.
As shown in fig. 6, a top view of a multi-group light emitting device integrated package implemented by the packaging method of the present application is shown.
The foregoing description of the preferred embodiments and examples of the present application should not be construed as limiting the scope of the present application, but rather as utilizing equivalent structural changes made in the description and drawings of the present application or directly/indirectly applied to other related technical fields under the concept of being integral with the present application.
Claims (10)
1. A light emitting device package frame, comprising:
a lead frame including a base island and a plurality of wire bond pins arranged on at least one side of the base island;
the control chip is attached to the base island and positioned on one side of the front surface of the lead frame, and is electrically connected with each bonding wire pin respectively;
the control chip is packaged on the lead frame, part of the bonding wire pins are exposed from the plastic package body to form first patch pins, and part of the base islands are exposed from the plastic package body to form second patch pins; the plastic package body comprises one of epoxy thermosetting resin, silica gel and organic glass;
the electroplating circuit layer is formed on the plastic package body and is electrically connected with the second patch pin;
one end of each light-emitting device is attached to the corresponding first patch pin, and the other end of each light-emitting device is attached to the electroplating circuit layer;
the first patch pins are arranged on one side of the electroplating circuit layer and are arranged at equal intervals with the electroplating circuit layer.
2. The light-emitting device package frame according to claim 1, wherein a plurality of bonding wire pins exposed from the plastic package body are arranged on two opposite sides of the base island, the number of the electroplating circuit layers is two, and a plurality of the first patch pins are arranged on one side of each electroplating circuit layer.
3. The light emitting device package frame of claim 2, wherein the plated wire layer is a solder layer.
4. A light emitting device package frame as recited in any one of claims 1-3, wherein the wire bond leads include a wire bond portion and a patch portion of unitary construction, the patch portion being formed on the wire bond portion, a top surface of the patch portion being exposed from the plastic package body to form the first patch lead, the top surface of the patch portion being higher than the control chip.
5. The light-emitting device package frame according to claim 4, wherein the control chip is bonded to the bonding wire portion via a metal wire, and the top surface of the chip portion is further higher than the metal wire.
6. The light emitting device package frame of claim 5, wherein the metal wire is one of gold wire, copper wire, and aluminum wire.
7. The light emitting device package frame of claim 1, wherein a die attach adhesive is disposed between the control chip and the submount.
8. The light emitting device package frame of claim 1, wherein the plurality of light emitting devices comprise LED beads that emit red, green, and blue light, respectively.
9. The light emitting device package frame of claim 1, wherein the wire bond leads and the submount are further exposed from the plastic package body from a reverse side of the leadframe for use as signal input leads.
10. A light emitting device encapsulation method for preparing the light emitting device encapsulation frame according to any one of claims 1 to 8, characterized in that the encapsulation method comprises:
etching the front surface of the lead frame to form a base island and a plurality of bonding wire pins arranged on at least one side of the base island;
attaching a control chip to the base island and positioned on one side of the front surface of the lead frame;
the control chip and the bonding wire pins are respectively connected by adopting metal wire bonding;
the control chip and the metal wire are subjected to plastic package on the lead frame through a plastic package body to form a frame plastic package body; the plastic package body comprises one of epoxy thermosetting resin, silica gel and organic glass;
grinding the front surface of the frame plastic package body to expose part of the bonding wire pins from the plastic package body to form first patch pins, and exposing part of the base island from the plastic package body to form second patch pins;
setting an electroplating circuit layer electrically connected with the second patch pins, and enabling a plurality of first patch pins to be arranged on one side of the electroplating circuit layer and arranged at equal intervals with the electroplating circuit layer;
and mounting the light emitting device between the electroplating circuit layer and the first patch pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311508460.0A CN117613178A (en) | 2023-11-13 | 2023-11-13 | Light emitting device package frame and package method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311508460.0A CN117613178A (en) | 2023-11-13 | 2023-11-13 | Light emitting device package frame and package method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117613178A true CN117613178A (en) | 2024-02-27 |
Family
ID=89958915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311508460.0A Pending CN117613178A (en) | 2023-11-13 | 2023-11-13 | Light emitting device package frame and package method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117613178A (en) |
-
2023
- 2023-11-13 CN CN202311508460.0A patent/CN117613178A/en active Pending
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