CN117607178A - Method for characterizing and analyzing ablation of contact material of circuit breaker under action of electric arc and related equipment - Google Patents
Method for characterizing and analyzing ablation of contact material of circuit breaker under action of electric arc and related equipment Download PDFInfo
- Publication number
- CN117607178A CN117607178A CN202311570673.6A CN202311570673A CN117607178A CN 117607178 A CN117607178 A CN 117607178A CN 202311570673 A CN202311570673 A CN 202311570673A CN 117607178 A CN117607178 A CN 117607178A
- Authority
- CN
- China
- Prior art keywords
- arc
- contact material
- ablation
- circuit breaker
- analysis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 144
- 238000002679 ablation Methods 0.000 title claims abstract description 112
- 238000000034 method Methods 0.000 title claims abstract description 66
- 230000009471 action Effects 0.000 title claims abstract description 41
- 238000010891 electric arc Methods 0.000 title claims abstract description 26
- 238000004458 analytical method Methods 0.000 claims abstract description 69
- 238000012360 testing method Methods 0.000 claims abstract description 56
- 238000012512 characterization method Methods 0.000 claims abstract description 42
- 238000004364 calculation method Methods 0.000 claims abstract description 31
- 238000003745 diagnosis Methods 0.000 claims abstract description 30
- 238000004088 simulation Methods 0.000 claims abstract description 28
- 238000005259 measurement Methods 0.000 claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 210000002381 plasma Anatomy 0.000 claims description 79
- 238000004590 computer program Methods 0.000 claims description 24
- 238000009826 distribution Methods 0.000 claims description 15
- 230000003287 optical effect Effects 0.000 claims description 15
- 238000003860 storage Methods 0.000 claims description 12
- 230000007547 defect Effects 0.000 claims description 11
- 238000001228 spectrum Methods 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 7
- 238000002474 experimental method Methods 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 230000003746 surface roughness Effects 0.000 claims description 4
- 238000011160 research Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000006870 function Effects 0.000 description 7
- 230000003628 erosive effect Effects 0.000 description 6
- 238000005336 cracking Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000006399 behavior Effects 0.000 description 2
- 238000012625 in-situ measurement Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000004660 morphological change Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
- G01N23/203—Measuring back scattering
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
- G01N23/207—Diffractometry using detectors, e.g. using a probe in a central position and one or more displaceable detectors in circumferential positions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/0006—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Data Mining & Analysis (AREA)
- Algebra (AREA)
- Mathematical Optimization (AREA)
- Mathematical Analysis (AREA)
- Pure & Applied Mathematics (AREA)
- Databases & Information Systems (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Computational Mathematics (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Abstract
The invention discloses a method for analyzing ablation characterization of a contact material of a circuit breaker under the action of an electric arc and related equipment, and belongs to the field of material characterization testing; observing and obtaining a microstructure test result based on a microstructure test diagnosis method; finally, based on simulation calculation, combining the thermal load and the microstructure test result to obtain an analysis result of arc ablation characterization on the contact material of the breaker; the method combines plasma parameter measurement, multi-group microstructure test diagnosis and simulation calculation analysis methods to carry out specific microscopic and macroscopic analysis on the contact material, establishes a reliable and accurate contact arc ablation diagnosis test analysis method flow, and provides effective and reliable data support and mechanism analysis for breaker research and manufacture.
Description
Technical Field
The invention belongs to the field of material characterization test, and particularly relates to a method and related equipment for analyzing ablation characterization of a contact material of a circuit breaker under the action of an electric arc.
Background
The electric arc is a self-sustaining discharge phenomenon of gas and has the characteristics of high temperature, strong light emission, conductivity and the like. When the short-circuit current is switched on and off, after the contacts are separated, the temperature of the surfaces of the contacts is increased to generate thermionic emission due to current shrinkage, so that arc discharge is formed; the burning of the arc between the contacts causes the contact temperature to rise, melting phase transition occurs, and ablation occurs. The ablation mechanism of the contact is different under different conditions. For pure metal contact materials, it is generally believed that when the arc current is small, vapor ablation predominates, and as the current increases, the splash ablation effect is significant. After the metal vapor generated by ablation enters the arc column, the thermodynamic property and the transport property of the arc are changed, so that the breaking performance of the high-voltage circuit breaker is reduced. In addition, contact ablation can cause a change in the mass of the contact that melts to form a molten pool under the action of the high temperature arc, the mass change including evaporation of the contact material into the surrounding environment and splashing into the surrounding environment in the form of droplets. Finally, contact ablation may also cause chemical and morphological changes to the contact surface. Therefore, the service life and the reliability of the circuit breaker can be influenced by contact ablation, and research on the contact ablation characteristics has important significance for the development of the circuit breaker.
At present, the research method for contact ablation generally adopts the methods of pattern comparison before and after ablation, high-speed camera shooting, simulation calculation and the like, and can analyze the quality loss and surface damage characteristics of the contact under various voltage discharge conditions; however, these methods lack real-time in-situ measurements of the contact ablation process and assay analysis of the physical process, resulting in an inability to guarantee accuracy of the material ablation analysis, failing to meet the requirements regarding the contact ablation characteristics of the circuit breaker.
Disclosure of Invention
In order to overcome the defects of the technology, the invention provides a method for characterizing and analyzing the ablation of a contact material of a circuit breaker under the action of an electric arc and related equipment, which can solve the technical problem that the accuracy of the ablation analysis of the material cannot be ensured due to the lack of real-time in-situ measurement of the ablation process of the contact and the measurement and analysis of the physical process in the conventional method.
In order to achieve the above purpose, the invention adopts the following technical scheme:
a method for characterizing and analyzing ablation of a contact material of a circuit breaker under the action of an electric arc comprises the following steps:
s1: based on an optical diagnosis method, measuring arc plasma contacted by a contact material of a circuit breaker to obtain arc plasma parameters, and obtaining the heat load generated by the arc of the contact material based on the arc plasma parameters;
s2: observing the contact material of the circuit breaker after arc ablation based on a microstructure test diagnosis method to obtain a microstructure test result;
s3: based on a simulation calculation method, the analysis result of arc on the ablation characterization of the contact material of the breaker is obtained by combining the thermal load and the microstructure test result.
Further, in S1, the plasma parameters include a temperature, a density distribution, and a jet morphology of the arc plasma.
Further, measuring arc plasma contacted with a breaker contact material by adopting a spectrometer and an enhanced charge coupled device to obtain radiation spectrum information generated by the arc plasma, and combining a spectrum data processing method to obtain temperature and density distribution of the arc plasma; and shooting arc plasmas contacted with the contact materials of the circuit breaker by adopting a high-speed camera to obtain jet flow forms of the arc plasmas.
Further, the temperature distribution of the arc plasma is obtained based on a Doppler broadening formula; the density distribution of the arc plasma is based on the use of the schtalk broadening formula.
Further, the specific step of S2 includes:
s201: treating the surface of the contact material before and after the arc ablation experiment;
s202, carrying out surface statistical measurement analysis on the contact material after arc ablation.
S203, observing the defect after arc ablation by adopting an electron back scattering diffraction technology to obtain microscopic parameter changes, wherein the microscopic parameter changes comprise grain size, grain orientation and grain boundary angle;
s204, observing by using a transmission electron microscope to obtain dislocation and grain shape at the defect.
Further, the specific steps of S202 are as follows:
measuring the surface of the contact material after arc ablation by adopting white light interference to obtain the change of the surface roughness; and observing the contact material subjected to arc ablation by adopting an electron scanning microscope, and counting the area of a melting area, the width of a crack and the length of the crack respectively.
Further, the method further comprises the following steps:
s4: and obtaining the influence and action mechanism of the arc on the contact material ablation by using the analysis result.
The circuit breaker contact material ablation characterization analysis system under the action of the electric arc is used for realizing the circuit breaker contact material ablation characterization analysis method under the action of the electric arc, and comprises the following steps:
the plasma parameter measurement module is used for measuring arc plasma contacted with the contact material of the circuit breaker based on an optical diagnosis method to obtain arc plasma parameters, and obtaining the heat load generated by the arc of the contact material based on the arc plasma parameters;
the microstructure testing module is used for observing the contact materials of the circuit breaker after arc ablation based on a microstructure testing and diagnosing method to obtain a microstructure testing result;
and the simulation calculation module is used for obtaining an analysis result of arc on the ablation characterization of the contact material of the circuit breaker based on a simulation calculation method and combining the thermal load and the microstructure test result.
An apparatus, comprising:
a memory for storing a computer program;
and the processor is used for realizing the steps of the arc-under-breaker contact material ablation characterization analysis method when executing the computer program.
A computer readable storage medium storing a computer program which, when executed by a processor, is adapted to carry out the steps of the method for characterizing ablative analysis of a circuit breaker contact material under arcing as described above.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a method for characterizing and analyzing ablation of a contact material of a circuit breaker under the action of an electric arc, which is based on an optical diagnosis method, and is used for measuring electric arc plasma contacted with the contact material of the circuit breaker to obtain electric arc plasma parameters so as to obtain the heat load of the contact material caused by the electric arc; observing and obtaining a microstructure test result based on a microstructure test diagnosis method; finally, based on simulation calculation, combining the thermal load and the microstructure test result to obtain an analysis result of arc ablation characterization on the contact material of the breaker; the method combines plasma parameter measurement, multi-group microstructure test diagnosis and simulation calculation analysis methods to carry out specific microscopic and macroscopic analysis on the contact material, establishes a reliable and accurate contact arc ablation diagnosis test analysis method flow, and provides effective and reliable data support and mechanism analysis for breaker research and manufacture.
Preferably, in the method, the temperature, the density and the plasma form of plasma contacted with the surface of the contact material are measured based on an optical diagnosis method, the ablation behavior of the contact material is observed by a microstructure test method, the ablation influence of electric arcs on the contact material is counted and quantified, finally, the erosion damage behaviors such as melting, cracking and the like possibly occurring on the surface of the contact material are calculated and analyzed by simulation according to the plasma parameters and microstructure test results, and the arc ablation phenomenon and mechanism of the contact are clearly analyzed.
Drawings
FIG. 1 is a flow chart for characterizing erosion damage of a contact material of a circuit breaker under the action of an arc, which is provided by an embodiment of the invention;
FIG. 2 is a diagram of an experimental distribution device for arc plasma diagnosis of a circuit breaker according to an embodiment of the present invention; wherein, (a) is a spectrometer and (b) is a high-speed camera;
FIG. 3 is a graph of experimentally measured plasma temperature and density distribution data provided in an embodiment of the present invention;
FIG. 4 is a chart of a microstructure test of a contact material surface according to an embodiment of the present invention; wherein, (a) is an electron scanning microscope observation chart; (b) is an electron back-scattering diffraction technique observation; (c) a transmission electron microscope observation chart;
FIG. 5 is a simulated calculation of contact material surface damage provided by an embodiment of the present invention;
FIG. 6 is a flow chart of a method for analyzing the ablation characterization of a contact material of a circuit breaker under the action of an arc provided by the invention;
fig. 7 is a schematic structural diagram of a circuit breaker contact material ablation characterization analysis system under the action of an arc provided by the invention.
Detailed Description
The invention provides a method for characterizing and analyzing the ablation of a contact material of a circuit breaker under the action of an electric arc, which is shown in fig. 6 and comprises the following steps:
s1: and (3) measuring arc plasma contacted with the contact material of the circuit breaker based on an optical diagnosis method to obtain arc plasma parameters, and obtaining the thermal load of the contact material generated by the arc based on the arc plasma parameters.
The plasma parameters specifically include the temperature, density distribution and jet morphology of the arc plasma.
Specifically, in S1, measuring arc plasma contacted with a breaker contact material by adopting a spectrometer and an enhanced charge coupled device to obtain radiation spectrum information generated by the arc plasma, and combining a spectrum data processing method to obtain temperature and density distribution of the arc plasma; and shooting arc plasmas contacted with the contact materials of the circuit breaker by adopting a high-speed camera to obtain jet flow forms of the arc plasmas.
Wherein the temperature distribution of the arc plasma is obtained based on a Doppler broadening formula; the density profile of the arc plasma was obtained based on the use of the schotter broadening formula.
S2: based on the microstructure test diagnosis method, observing the contact material of the circuit breaker after arc ablation to obtain a microstructure test result.
The method comprises the following specific steps:
s201: treating the surface of the contact material before and after the arc ablation experiment;
s202, carrying out surface statistical measurement analysis on the contact material after arc ablation.
The method comprises the following specific steps:
measuring the surface of the contact material after arc ablation by adopting white light interference to obtain the change of the surface roughness; and observing the contact material subjected to arc ablation by adopting an electron scanning microscope, and counting the area of a melting area, the width of a crack and the length of the crack respectively.
S203, observing the defect after arc ablation by adopting an electron back scattering diffraction technology to obtain microscopic parameter changes, wherein the microscopic parameter changes comprise grain size, grain orientation and grain boundary angle;
s204, observing by using a transmission electron microscope to obtain dislocation and grain shape at the defect.
S3: based on a simulation calculation method, the analysis result of arc on the ablation characterization of the contact material of the breaker is obtained by combining the thermal load and the microstructure test result.
S4: and obtaining the influence and action mechanism of the arc on the contact material ablation by using the analysis result.
As shown in fig. 7, the present invention further provides a system for characterizing ablation of a contact material of a circuit breaker under the action of an arc, comprising: the plasma parameter measurement module is used for measuring arc plasma contacted with the contact material of the circuit breaker based on an optical diagnosis method to obtain arc plasma parameters, and obtaining the heat load generated by the arc of the contact material based on the arc plasma parameters; the microstructure testing module is used for observing the contact materials of the circuit breaker after arc ablation based on a microstructure testing and diagnosing method to obtain a microstructure testing result; and the simulation calculation module is used for obtaining an analysis result of arc on the ablation characterization of the contact material of the circuit breaker based on a simulation calculation method and combining the thermal load and the microstructure test result.
The invention also provides an apparatus comprising: a memory for storing a computer program; and the processor is used for realizing the step of the arc-under-breaker contact material ablation characterization analysis method when executing the computer program.
The processor, when executing the computer program, performs the steps of the above-mentioned arc action breaker contact material ablation characterization analysis, for example: based on an optical diagnosis method, measuring arc plasma contacted by a contact material of a circuit breaker to obtain arc plasma parameters, and obtaining the heat load generated by the arc of the contact material based on the arc plasma parameters; observing the contact material of the circuit breaker after arc ablation based on a microstructure test diagnosis method to obtain a microstructure test result; based on a simulation calculation method, the analysis result of arc on the ablation characterization of the contact material of the breaker is obtained by combining the thermal load and the microstructure test result.
Alternatively, the processor may implement functions of each module in the above system when executing the computer program, for example: the plasma parameter measurement module is used for measuring arc plasma contacted with the contact material of the circuit breaker based on an optical diagnosis method to obtain arc plasma parameters, and obtaining the heat load generated by the arc of the contact material based on the arc plasma parameters; the microstructure testing module is used for observing the contact materials of the circuit breaker after arc ablation based on a microstructure testing and diagnosing method to obtain a microstructure testing result; and the simulation calculation module is used for obtaining an analysis result of arc on the ablation characterization of the contact material of the circuit breaker based on a simulation calculation method and combining the thermal load and the microstructure test result.
The computer program may be divided into one or more modules/units, which are stored in the memory and executed by the processor to accomplish the present invention, for example. The one or more modules/units may be a series of computer program instruction segments capable of performing a predetermined function, the instruction segments describing the execution of the computer program in the circuit breaker contact material ablation characterization analysis apparatus under the action of the arc. For example, the computer program may be partitioned into a plasma parameter determination module, a microstructure test module, and a simulation calculation module; the specific functions of each module are as follows: the plasma parameter measurement module is used for measuring arc plasma contacted with the contact material of the circuit breaker based on an optical diagnosis method to obtain arc plasma parameters, and obtaining the heat load generated by the arc of the contact material based on the arc plasma parameters; the microstructure testing module is used for observing the contact materials of the circuit breaker after arc ablation based on a microstructure testing and diagnosing method to obtain a microstructure testing result; and the simulation calculation module is used for obtaining an analysis result of arc on the ablation characterization of the contact material of the circuit breaker based on a simulation calculation method and combining the thermal load and the microstructure test result.
The circuit breaker contact material ablation characterization analysis equipment under the action of the electric arc can be computing equipment such as a desktop computer, a notebook computer, a palm computer and a cloud server. The arc-operated breaker contact material ablation characterization analysis device may include, but is not limited to, a processor, a memory. It will be appreciated by those skilled in the art that the above is an example of an under-arc breaker contact material ablation characterization analysis device and is not intended to limit the under-arc breaker contact material ablation characterization analysis device, and may include more components than those described above, or may be combined with certain components, or different components, such as the under-arc breaker contact material ablation characterization analysis device may also include input-output devices, network access devices, buses, and the like.
The processor may be a central processing unit (Central Processing Unit, CPU), other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), off-the-shelf programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. The general processor can be a microprocessor or the processor can also be any conventional processor and the like, and the processor is a control center for the analysis of the ablation characterization of the breaker contact material under the action of the electric arc, and various interfaces and lines are used for connecting various parts of the analysis equipment of the ablation characterization of the breaker contact material under the action of the whole electric arc.
The memory may be used to store the computer program and/or module, and the processor may implement the various functions of the circuit breaker contact material ablation characterization analysis apparatus under the action of the arc by running or executing the computer program and/or module stored in the memory and invoking data stored in the memory.
The memory may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program (such as a sound playing function, an image playing function, etc.) required for at least one function, and the like; the storage data area may store data (such as audio data, phonebook, etc.) created according to the use of the handset, etc. In addition, the memory may include high-speed random access memory, and may also include non-volatile memory, such as a hard disk, memory, plug-in hard disk, smart Media Card (SMC), secure Digital (SD) Card, flash Card (Flash Card), at least one disk storage device, flash memory device, or other volatile solid-state storage device.
The invention also provides a computer readable storage medium storing a computer program which when executed by a processor implements the steps of the method for characterizing and analyzing the ablation of a contact material of a circuit breaker under the action of an arc.
The modules/units integrated into the circuit breaker contact material ablation characterization analysis system under the action of the arc, if implemented as software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium.
Based on such understanding, the present invention implements all or part of the above-described arc-operated circuit breaker contact material ablation characterization analysis method, or may be implemented by instructing the relevant hardware by a computer program, which may be stored in a computer-readable storage medium, and the computer program, when executed by a processor, may implement the steps of the arc-operated circuit breaker contact material ablation characterization analysis method. The computer program comprises computer program code, and the computer program code can be in a source code form, an object code form, an executable file or a preset intermediate form and the like.
The computer readable storage medium may include: any entity or device capable of carrying the computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), an electrical carrier signal, a telecommunications signal, a software distribution medium, and so forth.
It should be noted that the computer readable storage medium may include content that is subject to appropriate increases and decreases as required by jurisdictions and by jurisdictions in which such computer readable storage medium does not include electrical carrier signals and telecommunications signals.
The invention is further illustrated by the following examples in conjunction with the accompanying drawings:
examples
In order to solve the problems mentioned in the background art: the characterization analysis method aiming at contact ablation is less, and the existing analysis method is low in data accuracy, so that the arc can not accurately and effectively characterize the contact material of the circuit breaker, and the problem that the requirements on the ablation characteristics of the contact of the circuit breaker can not be met is caused.
Therefore, the embodiment provides a method for characterizing and analyzing erosion damage of a circuit breaker contact material under the action of an arc, and aims to definitely characterize erosion damage of the arc of the circuit breaker to the contact material and conduct deep mechanism analysis, conduct microscopic and macroscopic analysis on the contact material, and further provide effective and reliable data support and mechanism analysis for research and manufacture of the circuit breaker.
As shown in fig. 1, the method for characterizing and analyzing erosion damage of a contact material of a circuit breaker under the action of an arc, which is provided by the embodiment, comprises the following specific steps of performing microscopic and macroscopic analysis on the contact material by using a plasma parameter measurement, a plurality of groups of microstructure test diagnosis and simulation calculation analysis methods:
first, as shown in fig. 2, specifically referring to fig. 2 (a), in this embodiment, based on a spectrometer and an enhanced charge coupled device, radiation spectrum information generated by arc plasma in contact with a breaker contact can be obtained, and by combining a spectrum data processing method, information such as temperature and density distribution of the arc plasma can be calculated and obtained, wherein the adopted spectrometer is SR-750, a slit of which is set to 10 μm, and spectrum resolution is 0.04nm; the plasma density is calculated by adopting a Schtak broadening, and the calculation formula is w L ＝2×10 -18 ωn e ，w L To measure the half-width of spectral lines, n e Is electron density; the plasma temperature is calculated by Doppler broadening, and the calculation formula is thatm ion Is particle mass, c is light velocity, w D Doppler spread for gaussian line type; referring specifically to fig. 2 (b), the high-speed camera employed takes a picture at a frame rate set to200,000fps, shutter speed 500ns, optical path center at arc plasma center, and experimentally measured plasma temperature and density distribution data shown in FIG. 3.
Secondly, as shown in fig. 4, a plurality of groups of microstructure test and diagnosis methods including an electron scanning microscope, an electron back scattering diffraction technology, a transmission electron microscope and the like are adopted, specifically, fig. 4 (a), fig. 4 (b) and fig. 4 (c), and diagnosis and analysis are carried out on the contact material subjected to experimental arc ablation to obtain a microstructure test result. And (3) quantitatively analyzing the surface morphology and mechanical property change of the contact material after arc erosion, and evaluating the phase structure change rule and failure mechanism of the material by combining thermal load measurement. Specifically observing the defect after arc ablation by adopting an electron back scattering diffraction technology to obtain microscopic parameter changes, including grain size, grain orientation and grain boundary angle; and by adopting transmission electron microscope observation, dislocation and grain shape at the defect part are analyzed, and the action mechanism of contact material cracking after arc ablation can be analyzed by combining a simulation calculation method.
The specific steps of the method are as follows:
s201, sample treatment, including surface treatment of contact materials before and after experiments. Before experimental arc ablation, selecting a contact material such as typical copper metal, firstly polishing to enable the surface to be basically flat, and polishing by using silica sol (1-5 nm); after experimental arc ablation, ultrasonic waves are adopted to clean the surface of an experimental sample, the surface is respectively cleaned in methanol, ethanol and propanol solutions for 2min, and then Ar-O plasma is utilized to clean for 5-10 min, so that impurities are removed.
S202, carrying out statistical measurement analysis on the ablated surface of the contact material, wherein the statistical measurement analysis comprises a white light interference test method, an electron scanning microscope test method and the like. White light interference is adopted to measure the surface of the contact material, so that the change of the surface roughness can be obtained. In addition, an electron scanning microscope is adopted to observe the contact material, and as the surface of the contact material is ablated by the electric arc, the surface can observe the melting and cracking phenomena, and the area of a melting area, the width of a crack, the length of the crack and the like are counted respectively, so that the influence of the electric arc on the ablation of the contact material is quantitatively represented.
S203, further performing microstructure analysis on the crack of the contact surface, and performing specific observation on the defect after arc ablation by adopting an electron back scattering diffraction technology to obtain microscopic parameter changes including grain size, grain orientation and grain boundary angle.
S204, adopting a transmission electron microscope for observation, analyzing dislocation and grain shape at the defect, and combining a simulation calculation method to analyze the action mechanism of cracking of the contact material after arc ablation.
Third, as shown in fig. 5, three rows are crack diagrams corresponding to 5ms, 10ms and 20ms of contact materials under the action of arc ablation heat load respectively; wherein, a crack path is arranged in a white frame in the figure; by adopting a simulation calculation method, the energy density or the thermal load influence of the arc generated by the arc on the contact material is calculated by the arc plasma parameters measured by optical diagnosis, the direct influence of the thermal load on the contact material is simplified in the simulation calculation, and the calculation is performed by utilizing finite element analysis software. According to the conditions, after the contact material is acted by the thermal load, the stress, strain and cracking process in the contact material can be calculated in simulation software, and the influence and action mechanism of the electric arc on the contact material ablation can be clarified by combining the microstructure test result.
In summary, the embodiment provides a method for analyzing ablation characterization of a contact material of a circuit breaker under the action of an electric arc, and compared with the existing analysis method, the method has the following advantages:
the method is based on an optical diagnosis method, and arc plasmas contacted by a contact material of a circuit breaker are measured to obtain arc plasma parameters, so that the thermal load generated by the arc of the contact material is obtained; observing and obtaining a microstructure test result based on a microstructure test diagnosis method; finally, based on simulation calculation, combining the thermal load and the microstructure test result to obtain an analysis result of arc ablation characterization on the contact material of the breaker; the method combines plasma parameter measurement, multi-group microstructure test diagnosis and simulation calculation analysis methods to carry out specific microscopic and macroscopic analysis on the contact material, establishes a reliable and accurate contact arc ablation diagnosis test analysis method flow, and provides effective and reliable data support and mechanism analysis for breaker research and manufacture.
The above embodiment is only one of the implementation manners capable of implementing the technical solution of the present invention, and the scope of the claimed invention is not limited to the embodiment, but also includes any changes, substitutions and other implementation manners easily recognized by those skilled in the art within the technical scope of the present invention.
Claims (10)
1. A method for characterizing and analyzing the ablation of a contact material of a circuit breaker under the action of an arc, which is characterized by comprising the following steps:
s1: based on an optical diagnosis method, measuring arc plasma contacted by a contact material of a circuit breaker to obtain arc plasma parameters, and obtaining the heat load generated by the arc of the contact material based on the arc plasma parameters;
s2: observing the contact material of the circuit breaker after arc ablation based on a microstructure test diagnosis method to obtain a microstructure test result;
s3: based on a simulation calculation method, the analysis result of arc on the ablation characterization of the contact material of the breaker is obtained by combining the thermal load and the microstructure test result.
2. The method of claim 1, wherein in S1, the plasma parameters include temperature, density distribution, and jet morphology of the arc plasma.
3. The method for analyzing ablation characteristics of a breaker contact material under the action of an electric arc according to claim 2, wherein a spectrometer and an enhanced charge coupled device are adopted to measure arc plasmas contacted with the breaker contact material to obtain radiation spectrum information generated by the arc plasmas, and a spectrum data processing method is combined to obtain temperature and density distribution of the arc plasmas; and shooting arc plasmas contacted with the contact materials of the circuit breaker by adopting a high-speed camera to obtain jet flow forms of the arc plasmas.
4. The method for analyzing the ablation characterization of the contact material of the circuit breaker under the action of the electric arc according to claim 2, wherein the temperature distribution of the electric arc plasma is obtained based on a Doppler broadening formula; the density distribution of the arc plasma is based on the use of the schtalk broadening formula.
5. The method for analyzing the ablation characterization of the contact material of the circuit breaker under the action of the electric arc according to claim 1, wherein the specific step of S2 comprises the following steps:
s201: treating the surface of the contact material before and after the arc ablation experiment;
s202, carrying out surface statistical measurement analysis on the contact material subjected to arc ablation;
s203, observing the defect after arc ablation by adopting an electron back scattering diffraction technology to obtain microscopic parameter changes, wherein the microscopic parameter changes comprise grain size, grain orientation and grain boundary angle;
s204, observing by using a transmission electron microscope to obtain dislocation and grain shape at the defect.
6. The method for characterizing ablation analysis of a circuit breaker contact material under arc action as recited in claim 5, wherein the specific step of S202 is:
measuring the surface of the contact material after arc ablation by adopting white light interference to obtain the change of the surface roughness; and observing the contact material subjected to arc ablation by adopting an electron scanning microscope, and counting the area of a melting area, the width of a crack and the length of the crack respectively.
7. The method of claim 1, further comprising:
s4: and obtaining the influence and action mechanism of the arc on the contact material ablation by using the analysis result.
8. A circuit breaker contact material ablation characterization analysis system under arc action for implementing the steps of the circuit breaker contact material ablation characterization analysis method under arc action of any one of claims 1-7, comprising:
the plasma parameter measurement module is used for measuring arc plasma contacted with the contact material of the circuit breaker based on an optical diagnosis method to obtain arc plasma parameters, and obtaining the heat load generated by the arc of the contact material based on the arc plasma parameters;
the microstructure testing module is used for observing the contact materials of the circuit breaker after arc ablation based on a microstructure testing and diagnosing method to obtain a microstructure testing result;
and the simulation calculation module is used for obtaining an analysis result of arc on the ablation characterization of the contact material of the circuit breaker based on a simulation calculation method and combining the thermal load and the microstructure test result.
9. An apparatus, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the arc-under-breaker contact material ablation characterization analysis method of any one of claims 1-7 when executing the computer program.
10. A computer readable storage medium storing a computer program, characterized in that the computer program is executed by a processor for implementing the steps of the method for characterizing the ablation of circuit breaker contact material under arc action according to any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311570673.6A CN117607178A (en) | 2023-11-22 | 2023-11-22 | Method for characterizing and analyzing ablation of contact material of circuit breaker under action of electric arc and related equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311570673.6A CN117607178A (en) | 2023-11-22 | 2023-11-22 | Method for characterizing and analyzing ablation of contact material of circuit breaker under action of electric arc and related equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117607178A true CN117607178A (en) | 2024-02-27 |
Family
ID=89957314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311570673.6A Pending CN117607178A (en) | 2023-11-22 | 2023-11-22 | Method for characterizing and analyzing ablation of contact material of circuit breaker under action of electric arc and related equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117607178A (en) |
-
2023
- 2023-11-22 CN CN202311570673.6A patent/CN117607178A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Merryweather et al. | Operando optical tracking of single-particle ion dynamics in batteries | |
| CN109686675B (en) | Failure positioning method | |
| CN114916116B (en) | Plasma diagnostic method and system | |
| CN104376878B (en) | A kind of method of semiconductor device failure analysis | |
| KR20130026424A (en) | Electron radiation monitoring system to prevent gold spitting and resist cross-linking during evaporation | |
| KR101810436B1 (en) | Method and device for line pattern shape evaluation | |
| TW201415013A (en) | Charged particle beam device | |
| CN117607178A (en) | Method for characterizing and analyzing ablation of contact material of circuit breaker under action of electric arc and related equipment | |
| Xia et al. | Enhancement of XeF2-assisted gallium ion beam etching of silicon layer and endpoint detection from backside in circuit editing | |
| Langner et al. | A phenomenological and quantitative view on the degradation of positive electrodes from spent lithium-ion batteries in humid atmosphere | |
| Liu et al. | Investigation of laser induced damage threshold measurement with single-shot on thin films | |
| CN109946589B (en) | Method and device for detecting bad electricity of display panel | |
| Tancin et al. | Characterization of ultrafast-laser ablation of micro-structures in Li-ion battery anode and cathode materials: Morphology, rate, and efficiency | |
| Rosypal et al. | Inhibition by dications of in vitro growth of Leishmania major and Leishmania tropica: causative agents of old world cutaneous leishmaniasis | |
| CN116798897A (en) | Method and device for detecting layering of Low-K process chips | |
| Vreugdenhil et al. | A highly automated apparatus for ultra-fast laser ablation studies | |
| CN110174596B (en) | Intrinsic safety type circuit low-voltage discharge mechanism experimental research method | |
| Arif et al. | In situ assessment of the roughness of a uniformly eroded cylindrical magnetron target | |
| JP2021077756A (en) | Semiconductor process analyzer and semiconductor process analysis program | |
| JP2007333745A (en) | Method of evaluating pattern shape, evaluating device, and method of manufacturing semiconductor device | |
| CN106409708B (en) | Circuit tracking using focused ion beam | |
| WO2017018148A1 (en) | Dynamic response analysis prober | |
| US10411646B2 (en) | Inspection method and inspection system of solar cell | |
| WO2024127586A1 (en) | Charged particle beam device and method for estimating sample characteristics | |
| CN102053169B (en) | Method for manufacturing failure analysis sample in interconnection structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |