CN117586003A - 一种温度系数可调的ZnO/C复合陶瓷电阻及其制备方法 - Google Patents

一种温度系数可调的ZnO/C复合陶瓷电阻及其制备方法 Download PDF

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CN117586003A
CN117586003A CN202311573528.3A CN202311573528A CN117586003A CN 117586003 A CN117586003 A CN 117586003A CN 202311573528 A CN202311573528 A CN 202311573528A CN 117586003 A CN117586003 A CN 117586003A
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陈勇刚
王海珍
廖汉卿
张翼
谢庆坚
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Hunan Fullde Electric Co Ltd
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Abstract

本发明涉及陶瓷电阻技术领域,具体涉及一种温度系数可调的ZnO/C复合陶瓷电阻及其制备方法,本申请提供复合陶瓷电阻,包括ZnO内核和分布于内核表面的导电碳颗粒,其存在两种导电路径,一种为氧化锌导电路径,其阻值随温度的变化呈现标志性的半导体特征,随温度的升高电阻下降,呈现NTC效应,第二种导电碳颗粒导电路径,导电碳颗粒的接触位点随着温度的升高及陶瓷体的膨胀而减少,因此产生正温度系数的PTC效应,在两种效应的综合下达成电阻及温度系数可调的效果,以更好地满足应用需求;本申请提供的制备方法,其工艺流程简单,操作容易,满足大批量生产制造需求,制成的ZnO/C复合陶瓷材料阻值低,温度系数高,适用于高精度温度传感器,应用前景广阔。

Description

一种温度系数可调的ZnO/C复合陶瓷电阻及其制备方法
技术领域
本发明涉及陶瓷电阻技术领域,特别是涉及一种温度系数可调的ZnO/C复合陶瓷电阻及其制备方法。
背景技术
电子电路中通常需要不同温度系数的电阻元件来实现特定的传感器功能,这其中常用的主要有尖晶石NTC材料,钌酸盐PTC材料。其中的NTC材料由于其原材料成本较低,被大规模应用在温度传感器电路中,但由于其温度系数B值与配方关系密切,因此目前行业中基本还是一个B值一个配方的方式在进行技术管理和生产管理,这样极大的增加了技术和生产管理难度。
本申请旨在提供一种温度系数可调的ZnO/C复合陶瓷电阻及其制备方法,基于ZnO半导体陶瓷体系并以导电碳元素进行掺杂,形成可以在1000-4500范围内对B值进行调整的ZnO/C复合陶瓷材料,以更好的满足应用需求。
发明内容
为解决上述问题,本发明提供一种温度系数可调的ZnO/C复合陶瓷电阻及其制备方法,其可以实现温度系数的灵活调整。
本发明采用的技术方案是:
一种温度系数可调的ZnO/C复合陶瓷电阻,包括ZnO内核和分布于所述ZnO内核表面的导电碳颗粒。
进一步地,该复合电阻包括组分ZnO、Al2O3、氧化硅和乙炔黑。
进一步地,所述的ZnO、Al2O3、氧化硅和乙炔黑的摩尔比为100:(0.1-5):(0.1-3):(0.5-5)。
进一步地,该复合电阻的温度特性B值可在1000-4500范围内调整,阻值可在1kΩ-10kΩ范围内调整。
基于同一发明构思,本申请还提供上述的温度系数可调的ZnO/C复合陶瓷电阻的方法,包括如下步骤:
配料;
将配好的原料置于水介质中充分研磨,之后充分干燥,形成混合粉体;
将混合粉体造粒、成型后,放入气氛炉中烧结,制得ZnO/C复合陶瓷材料。
进一步地,在水介质中的研磨的转速为200-500rpm,研磨时间为6-8h。
进一步地,干燥的温度为120℃左右。
进一步地,需要在氮气、氩气或真空条件下,在气氛炉中烧结。
进一步地,烧结温度为1300-1500℃,烧结时间为6h。
本发明的有益效果如下:
1、本申请提供的温度系数可调的ZnO/C复合陶瓷电阻,包括ZnO内核和分布于所述ZnO内核表面的导电碳颗粒,其存在两种导电路径,一种为氧化锌半导体陶瓷导电路径,其阻值随温度的变化呈现标志性的半导体特征,随温度的升高电阻下降,呈现NTC效应,第二种导电路径为晶界的导电碳颗粒导电路径,导电碳颗粒的接触位点随着温度的升高及陶瓷体的膨胀而减少,因此产生正温度系数的PTC效应,在两种效应的综合下达成电阻及温度系数可调的效果,以更好地满足应用需求;
2、本申请提供的制备方法,其工艺流程简单,操作容易,满足大批量生产制造需求,制成的ZnO/C复合陶瓷材料阻值低,温度系数高,适用于高精度温度传感器,应用前景广阔。
附图说明
图1为本发明的复合陶瓷电阻的结构示意图;
图2为本发明的实施例中的制备流程框图。
具体实施方式
为了便于理解本发明,下面将通过实施例对本发明进行更全面的描述,以下给出了本发明的较佳实施例。但本发明可以以多种不同形式来实现,并不只限于本文所描述的实施例。凡是对本发明技术方案进行修改或同等替换,而没有创造性的成果所得到的的其他实施方案,均在本发明的保护范围之中。
除非另有定义,本文所使用的所有技术和科学术语与本发明的技术领域的技术人员通常理解的含义相同。在本发明的说明书中所使用的的术语只是为了描述具体的实施例,不是旨在于限制本发明。
本发明实施例中揭露的数值是近似值,并非确定值。在误差或实验条件允许的情况下,可以包括在误差范围内的所有值而不限于本发明实施例中公开的具体数值。
除非另有特别说明,本发明中用到的各种原材料、试剂、仪器和设备等均可通过市场购买得到或者可通过现有方法制备得到。
实施例1
按照摩尔比ZnO、Al2O3、氧化硅、乙炔黑为100:4.5:2.8:0.8的比例进行称量,之后置于水介质中以400rpm的转速充分研磨8h,此处,氧化锆球:配料粉:去离子水的质量比为4:1:1,之后于120℃充分干燥;
将混合好的粉体造粒、成型后,放入气氛炉中,在氮气条件下1400℃烧结6h,制得ZnO/C复合陶瓷材料。
将制作的样品放在恒温油槽HT-1060内测量1=25℃和T2=50℃的电阻值R1和R2,通过公式计算复合陶瓷材料B值,B值的调整范围为2000,20℃阻值的调整范围为8000Ω。
实施例2
按照摩尔比ZnO、Al2O3、氧化硅、乙炔黑为100:3:2.1:1.5的比例进行称量,之后置于水介质中以400rpm的转速充分研磨8h,此处,氧化锆球:配料粉:去离子水的质量比为4:1:1,之后于120℃充分干燥;
将混合好的粉体造粒、成型后,放入气氛炉中,在氮气条件下1400℃烧结6h,制得ZnO/C复合陶瓷材料。
将制作的样品放在恒温油槽HT-1060内测量1=25℃和T2=50℃的电阻值R1和R2,通过公式计算复合陶瓷材料B值,B值的调整范围为3000,20℃阻值的调整范围为5000Ω。
实施例3
按照摩尔比ZnO、Al2O3、氧化硅、乙炔黑为100:2:1.4:2.6的比例进行称量,之后置于水介质中以400rpm的转速充分研磨8h,此处,氧化锆球:配料粉:去离子水的质量比为4:1:1,之后于120℃充分干燥;
将混合好的粉体造粒、成型后,放入气氛炉中,在氮气条件下1400℃烧结6h,制得ZnO/C复合陶瓷材料。
将制作的样品放在恒温油槽HT-1060内测量1=25℃和T2=50℃的电阻值R1和R2,通过公式计算复合陶瓷材料B值,B值的调整范围为3500,20℃阻值的调整范围为2800Ω。
实施例4
按照摩尔比ZnO、Al2O3、氧化硅、乙炔黑为100:1:0.5:4.5的比例进行称量,之后置于水介质中以400rpm的转速充分研磨8h,此处,氧化锆球:配料粉:去离子水的质量比为4:1:1,之后于120℃充分干燥;
将混合好的粉体造粒、成型后,放入气氛炉中,在氮气条件下1400℃烧结6h,制得ZnO/C复合陶瓷材料。
将制作的样品放在恒温油槽HT-1060内测量1=25℃和T2=50℃的电阻值R1和R2,通过公式计算复合陶瓷材料B值,B值的调整范围为4300,20℃阻值的调整范围为1000Ω。
具体地,上述实施例1-4中,其中的B值通过测量在T1=25℃和T2=50℃时的电阻值后,通过如下公式计算:
B=[Ln(R1)-Ln(R2)]/[1/T1-1/T2]
式中:R1:温度T1时零功率电阻值;R2:温度T2时零功率电阻值;
T1=273.15+(T1℃);T2=273.15+(T2℃)。
参见上述,本申请的实施例提供的ZnO/C复合陶瓷材料可以在1000-4500范围内对B值进行调整,该复合陶瓷材料是基于ZnO半导体陶瓷体系并以导电碳元素进行掺杂,形成ZnO内核和分布于ZnO内核表面的导电碳颗粒结构,其中碳属于低阻相,主要存在于晶界,通过碳颗粒之间的接触形成导电链,该导电链在不同温度下通过陶瓷体的热胀冷缩效应显示正温度系数PTC效应,半导化的ZnO属于复合陶瓷材料中的高阻相,主要存在于晶粒,其电阻呈现标志性的半导体特征--随着温度升高而降低,呈现NTC效应。当碳含量不同时,其对电阻及温度特性B值也带来趋势性的变化,可以形成B值在1000-4500范围内的ZnO/C复合陶瓷材料。
进一步地,参见图1所示,本申请提供的ZnO/C复合陶瓷材料,存在两种导电路径,一种为氧化锌半导体陶瓷导电路径,其阻值随温度的变化呈现标志性的半导体特征--随温度的升高电阻下降,呈现NTC效应;第二种导电路径为晶界的导电碳颗粒导电路径,导电碳颗粒的接触位点随着温度的升高及陶瓷体的膨胀而减少,因此产生正温度系数的PTC效应;在两种效应的综合下达成电阻及温度系数可调的作用。
本申请采用陶瓷晶界形成碳导电链的方式使得ZnO半导体陶瓷电阻可调,同时达到其温度系数可调的目的。
本申请提供的制备方法,其工艺流程简单,制备容易,合成的ZnO/C复合陶瓷材料阻值低,温度系数高,适用于高精度温度传感器。
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。

Claims (9)

1.一种温度系数可调的ZnO/C复合陶瓷电阻,其特征在于,包括ZnO内核和分布于所述ZnO内核表面的导电碳颗粒。
2.根据权利要求1所述的温度系数可调的ZnO/C复合陶瓷电阻,其特征在于,该复合电阻包括组分ZnO、Al2O3、氧化硅和乙炔黑。
3.根据权利要求2所述的温度系数可调的ZnO/C复合陶瓷电阻,其特征在于,所述的ZnO、Al2O3、氧化硅和乙炔黑的摩尔比为100:(0.1-5):(0.1-3):(0.5-5)。
4.根据权利要求3所述的温度系数可调的ZnO/C复合陶瓷电阻,其特征在于,该复合电阻的温度特性B值可在1000-4500范围内调整,阻值可在1kΩ-10kΩ范围内调整。
5.一种制备如权利要求1-4任一项所述的温度系数可调的ZnO/C复合陶瓷电阻的方法,其特征在于,包括如下步骤:
配料;
将配好的原料置于水介质中充分研磨,之后充分干燥,形成混合粉体;
将混合粉体造粒、成型后,放入气氛炉中烧结,制得ZnO/C复合陶瓷材料。
6.根据权利要求5所述的制备温度系数可调的ZnO/C复合陶瓷电阻的方法,其特征在于,在水介质中的研磨的转速为200-500rpm,研磨时间为6-8h。
7.根据权利要求5所述的制备温度系数可调的ZnO/C复合陶瓷电阻的方法,其特征在于,干燥的温度为120℃左右。
8.根据权利要求5所述的制备温度系数可调的ZnO/C复合陶瓷电阻的方法,其特征在于,需要在氮气、氩气或真空条件下,在气氛炉中烧结。
9.根据权利要求5所述的制备温度系数可调的ZnO/C复合陶瓷电阻的方法,其特征在于,烧结温度为1300-1500℃,烧结时间为6h。
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