CN117564394A

CN117564394A - Automatic soldering equipment and method for power adapter PCB

Info

Publication number: CN117564394A
Application number: CN202311654400.XA
Authority: CN
Inventors: 黄少成
Original assignee: Dongguan Fuyuan Electronic Co ltd
Current assignee: Dongguan Fuyuan Electronic Co ltd
Priority date: 2023-12-04
Filing date: 2023-12-04
Publication date: 2024-02-20
Anticipated expiration: 2043-12-04
Also published as: CN117564394B

Abstract

The invention relates to the technical field of new energy power supply adaptation, in particular to automatic soldering equipment and method for a power supply adapter PCB, which comprises a conveying device, a soldering positioning device, a soldering driving device, a driving installation frame, a pin bending device and a soldering device, wherein the pin bending device comprises a pin bending rotating assembly arranged on a rotating shaft seat, a pin bending pushing assembly connected with the pin bending rotating assembly and a pin bending pressing pin connected with the pin bending pushing assembly, and the pin bending pushing assembly is used for driving the pin bending pressing to press and bend pins of electronic elements to be welded on a PCB towards one side; the soldering device comprises a soldering tin rotating assembly arranged on the rotating shaft seat, a soldering tin pushing assembly connected with the soldering tin rotating assembly and a soldering tin assembly connected with the soldering tin pushing assembly. The invention realizes automatic soldering tin of pins, especially for some specific electronic element pins in the power adapter, and solves the problems of low efficiency and difficult control of precision of the existing manual soldering tin.

Description

Automatic soldering equipment and method for power adapter PCB

Technical Field

The invention relates to the technical field of new energy power supply adaptation, in particular to automatic soldering equipment and method for a power supply adapter PCB.

Background

The power adapter is a power supply conversion device of an electronic appliance, and generally consists of components such as a shell, a transformer, an inductor, a capacitor, an integrated circuit chip, a printed circuit board and the like. With the popularization of new energy automobiles and the increase of market demands, the power adapter industry is also continuously developing. At present, the technology of the power adapter of the new energy automobile has been improved to a great extent, and the functions are continuously improved and increased.

In the power adapter, various electronic components need to be soldered on a circuit board, the existing soldering process is manual soldering, and pins of the electronic components cannot be stably connected with the circuit board in the soldering process, so that the phenomenon of falling easily occurs in the using process.

Disclosure of Invention

In order to solve the problems, the invention realizes automatic soldering tin of pins, particularly soldering tin for specific electronic element pins in a power adapter, and the pins are bent and then soldered to each other, so that the connection stability is ensured, and the automatic soldering tin equipment and method for the power adapter PCB, which are better in stability and free from falling-off phenomenon, are particularly used in new energy automobiles.

The technical scheme adopted by the invention is as follows: the automatic soldering equipment for the power adapter PCB comprises a conveying device, a soldering positioning device, a soldering driving device, a driving installation frame, a pin bending device and a soldering device, wherein the conveying device is used for conveying a PCB; the soldering tin positioning device is used for fixing the PCB on the conveying device; the soldering tin driving device is positioned at the lower side of the conveying device; the driving installation frame comprises a connecting substrate obliquely arranged on the soldering tin driving device and a rotating shaft seat arranged on the connecting substrate; the pin bending device comprises a pin bending rotating assembly arranged on the rotating shaft seat, a pin bending pushing assembly connected with the pin bending rotating assembly and a pin bending pressing pin connected with the pin bending pushing assembly, wherein the pin bending pushing assembly is used for driving the pin bending to press and bend pins of electronic elements to be welded on the PCB towards one side; the soldering device comprises a soldering tin rotating assembly arranged on the rotating shaft seat, a soldering tin pushing assembly connected to the soldering tin rotating assembly and a soldering tin assembly connected to the soldering tin pushing assembly, wherein the soldering tin pushing assembly is used for driving the soldering tin assembly to solder pins of electronic elements on a PCB (printed circuit board).

The conveying device comprises a fixed conveying support, a first conveying component arranged on the fixed conveying support, a movable conveying support, a second conveying component arranged on the movable conveying support and an adjusting component, wherein the adjusting component is used for adjusting the distance between the movable conveying support and the fixed conveying support.

A further improvement of the scheme is that the first conveying component is provided with a first conveying driving element, a first conveying roller connected with the first conveying driving element and a first conveying chain transmitted to the first conveying roller; one end of the first conveying chain is provided with a first bracket, and the first bracket is used for supporting the side edge of the PCB.

A further improvement of the scheme is that the second conveying assembly is provided with a second conveying driving element, a second conveying roller connected with the second conveying driving element and a second conveying chain transmitted to the second conveying roller; one end of the second conveying chain is provided with a second bracket, and the second bracket is used for supporting the side edge of the PCB; the first bracket and the second bracket are arranged opposite to each other to form a conveying bracket for conveying the PCB.

According to the technical scheme, the fixed conveying support is provided with the first conveying guide block and the first conveying cover plate, a first conveying guide groove is formed between the first conveying guide block and the first conveying cover plate, the first conveying chain is conveyed on the first conveying guide groove, and one end of the first bracket extends to the side edge of the first conveying guide groove.

According to the technical scheme, the movable conveying support is provided with the second conveying guide block and the second conveying cover plate, a second conveying guide groove is formed between the second conveying guide block and the second conveying cover plate, the second conveying chain is conveyed on the second conveying guide groove, and one end of the second bracket extends to the side edge of the second conveying guide groove.

The further improvement to above-mentioned scheme does, soldering tin positioner includes first location subassembly and the second location subassembly that compresses tightly, first location subassembly is including installing at the first locating support piece of first transport guide block, rotatable setting at the first briquetting of first transport apron, connect in the first connecting rod of first briquetting and connect in the first location cylinder that compresses tightly of first connecting rod, first locating support piece and first briquetting set up relatively, first location cylinder that compresses tightly is used for driving first connecting rod drive first briquetting and fixes PCB board press fastening on first locating support piece.

The second compacting and positioning assembly comprises a second positioning support block arranged on the second conveying guide block, a second pressing block rotatably arranged on the second conveying cover plate, a second connecting rod connected to the second pressing block and a second compacting and positioning cylinder connected to the second connecting rod, wherein the second positioning support block and the second pressing block are oppositely arranged, and the second compacting and positioning cylinder is used for driving the second connecting rod to drive the second pressing block to press and fix the PCB on the second positioning support block.

The further improvement of the scheme is that the first pressing block, the first positioning supporting block, the second pressing block and the second positioning supporting block are all provided with a plurality of pressing blocks.

The further improvement of above-mentioned scheme is, soldering tin drive arrangement includes horizontal transmission module and installs the lift transmission module at horizontal transmission module, horizontal transmission module is located conveyor's below, the connection base plate is connected with the lift transmission module, horizontal transmission module is screw drive module with the lift transmission module.

The lifting transmission module is provided with a vertical panel, the connecting substrate comprises a connecting plate connected to the vertical panel and a connecting side plate vertically connected to the connecting plate, the connecting side plate inclines along the vertical plane of the vertical panel, and one end of the rotating shaft seat is fixedly arranged on the connecting side plate.

The further improvement of the scheme is that the rotating shaft seat is provided with a first rotating shaft groove and a second rotating shaft groove, the bent pin rotating assembly is arranged on the first rotating shaft groove, the soldering tin rotating assembly is arranged on the second rotating shaft groove, and the first rotating shaft groove and the second rotating shaft groove are located at the same axle center, so that the bent pin rotating assembly and the soldering tin rotating assembly are located at the same axle center.

The further improvement of the scheme is that the bent leg rotating assembly comprises a first rotating shaft arranged on the rotating shaft seat, a first rotating bracket connected with the first rotating shaft and a first rotating driving motor for driving the first rotating shaft to drive the first rotating bracket to rotate; the bent leg pushing assembly is mounted on the first rotary support.

The bending pushing assembly comprises a bending sliding element and a bending driving element for driving the bending sliding element to move, wherein the bending driving element is used for driving the bending sliding element to slide linearly, a bending fixing block is arranged on the bending sliding element, a bending pressing needle is arranged on the bending fixing block, and the distance between the bending pressing needle and a PCB (printed circuit board) can be adjusted along the bending fixing block; one end of the bent pin pressing needle is provided with a bent groove, and the other end of the bent pin pressing needle is connected with a bent pin motor which is used for driving the bent pin pressing needle so as to adjust the orientation angle of the bent groove; the pin bending press pin is characterized in that a bending inclined plane is arranged at one end of the bending groove, the bending groove is arranged on the bending inclined plane, and the bending inclined plane is used for guiding pins towards the bending groove when bending the pins of the electronic element.

The further improvement of the scheme is that the soldering tin rotating assembly comprises a second rotating shaft arranged on the rotating shaft seat, a second rotating bracket connected with the second rotating shaft and a second rotating driving motor for driving the second rotating shaft to drive the second rotating bracket to rotate; the soldering tin pushing component is arranged on the second rotary support.

The further improvement to above-mentioned scheme is, the soldering tin pushing component includes soldering tin sliding element and is used for driving the soldering tin driving element that soldering tin sliding element removed, soldering tin driving element is used for driving the straight line slip of bent foot sliding element, install the soldering tin fixed block on the soldering tin sliding element, the soldering tin component is installed on the soldering tin fixed block, the interval between its and the PCB board can be adjusted on the soldering tin fixed block along the soldering tin component.

The further improvement of above-mentioned scheme is, tin subassembly includes spot welding head and is located tin feeding element and the blowpipe of spot welding head one side, tin feeding element and blowpipe all face the soldering tin end of spot welding head, one side of spot welding head is provided with the regulation support, tin feeding element and blowpipe all install on the regulation support, the regulation support is used for adjusting tin feeding element and blowpipe and corresponds the direction and the position of spot welding head.

A power adapter PCB soldering method comprises the following steps of automatically soldering equipment of the power adapter PCB;

the electronic component is provided with pins which are inserted from one end of the jack and extend out from the other end, and a pin bending groove is formed in the outlet end of the jack and used for guiding pin bending;

the power adapter PCB soldering method comprises the following steps:

step S1, pins of an electronic element are inserted into jacks of a PCB;

s2, conveying the PCB on a conveying device, and positioning and compacting the PCB through a soldering tin positioning device when the PCB is conveyed to a specified position;

step S3, the soldering tin driving device drives the pin bending device to correspond to the jack;

s4, the bent pin pushing assembly drives the bent pin pressing needle to move towards the pin, and the bent pin pressing needle is abutted against the pin;

s5, the pin bending rotating assembly drives the pin bending press pin to rotate so as to bend the pin towards the direction of the pin bending groove, a soldering tin groove is formed in the reverse direction of the pin bending groove, and the pin bending rotating assembly drives the pin bending press pin to reset after pin bending is completed;

step S6, the soldering tin driving device drives the soldering tin device to correspond to the jack;

step S7, the soldering tin rotating component drives the soldering tin component to adjust the direction to correspond to the soldering tin groove;

step S8, the soldering tin pushing component drives the soldering tin component to solder towards the soldering tin groove so as to connect the pins with the soldering tin groove in a soldering manner.

The invention has the beneficial effects that:

compared with the existing power adapter PCB soldering tin, the invention adopts a full-automatic mode to convey the PCB, conveys the PCB to a designated position through the conveying device, positions the PCB through the soldering tin positioning device, then drives the pin bending device and the soldering tin device to solder pins of electronic elements on the PCB through the soldering tin driving device, realizes automatic soldering tin of pins, and especially aims at soldering tin of certain specific electronic elements pins in the power adapter, thereby solving the problems of low efficiency and difficult control of the existing manual soldering tin. Particularly, the special electronic element pins in the power adapter are soldered, and are connected through soldering after bending, so that the connection stability is guaranteed, and the power adapter is better in stability and free from falling off particularly in the use of new energy automobiles.

The use of the conveying device effectively ensures the stable transportation of the PCB, so that the soldering tin equipment can accurately operate aiming at each electronic element needing to be soldered. Secondly, the use of the soldering tin positioning device ensures the accurate position of the PCB in the conveying process, and the precision of soldering tin is further improved.

The solder driving device is positioned at the lower side of the conveying device and provides accurate control and guide for solder. The power source of the device is realized through the driving installation frame, and the inclination installation of the driving installation frame enables the soldering tin driving device to be better suitable for the PCB boards with various angles and shapes, so that the universality of equipment is improved.

The installation of pivot seat in the drive mounting bracket for soldering tin rotating assembly, bent foot rotating assembly and bent foot promote the subassembly and can rotate in a flexible way, adapt to different soldering tin demands. This greatly enhances the adaptability and flexibility of the device.

The pin bending rotary assembly, the pin bending pushing assembly and the pin bending press pin in the pin bending device are matched for use, so that pins of electronic elements can be effectively bent towards one side, and soldering tin can be more conveniently attached to the pins. This design significantly improves the efficiency and accuracy of the solder.

The soldering tin rotating component, the soldering tin pushing component and the soldering tin component in the soldering tin device work cooperatively, so that accurate soldering tin of pins of electronic elements on the PCB is realized. The application of the soldering tin pushing component enables the soldering tin component to be accurately attached to the pins, and the precision and efficiency of soldering tin are further improved.

The automatic soldering equipment for the power adapter PCB obviously improves the soldering precision and efficiency through reasonable layout and matched use of the components. Not only the automation degree is high, but also the operation is simple, the labor cost is greatly reduced, and the production efficiency is improved.

The power adapter PCB soldering method is performed by an automatic soldering device, and the soldering precision and efficiency can be improved through the operation of each step.

In step S1, pins of the electronic component are inserted into the jack of the PCB, and the design of the jack enables the solder device to accurately find the position of the electronic component. This step helps to improve the accuracy of the solder.

In the steps S2 and S3, the PCB is conveyed on the conveying device, and when the PCB is conveyed to a specified position, the PCB is positioned and pressed by the soldering tin positioning device, and the soldering tin driving device drives the pin bending device to correspond to the jack. The step ensures the stability of the PCB and the electronic element and improves the reliability of soldering tin.

In step S4, the pin bending pushing assembly drives the pin bending press pin to move towards the pin, and enables the pin bending press pin to be abutted against the pin. In this step, the pin can be ensured to be in close contact with the soldering tin groove by the pressing operation of the pin bending press on the pin, so that the stability of soldering tin is improved.

In step S5, the pin bending rotating assembly drives the pin bending press pin to rotate, so as to bend the pins towards the direction of the pin bending groove, and form a soldering tin groove in the reverse direction of the pin bending groove. In the step, the bending of the pins and the formation of the soldering tin grooves are completed under automatic control, so that the soldering tin efficiency is greatly improved.

In steps S6 to S8, the solder driving device drives the solder device to correspond to the jack, the solder rotating assembly drives the solder assembly to adjust the direction to correspond to the solder slot, and the solder pushing assembly drives the solder assembly to solder towards the solder slot. This series of steps ensures the accuracy and efficiency of the solder. The soldering tin promotes the subassembly drive soldering tin subassembly and welds towards the soldering tin groove to make the solder fill the soldering tin groove, make the area that solder and pin are connected bigger, the connection effect is better.

Drawings

FIG. 1 is a perspective view of a power adapter PCB solder device of the present invention;

FIG. 2 is a perspective view of the power adapter PCB solder device of FIG. 1 from another perspective;

FIG. 3 is a perspective view of a conveyor of the power adapter PCB solder device of FIG. 1;

FIG. 4 is a perspective view of the power adapter PCB solder device of FIG. 1 from another perspective;

FIG. 5 is a perspective view of a hidden transport device of the power adapter PCB solder device of FIG. 1;

fig. 6 is a perspective view of a pin bending device and a soldering device of the power adapter PCB soldering apparatus of fig. 1;

FIG. 7 is a perspective view of the leg bending device and the soldering device of the power adapter PCB soldering apparatus of FIG. 1 from another perspective;

FIG. 8 is a schematic diagram of the connection of a PCB board to an electronic component according to the present invention;

fig. 9 is a flow chart of the power adapter PCB soldering method of the present invention.

Reference numerals illustrate: conveyor 1, stationary conveyor frame 11, first conveyor guide block 111, first conveyor cover 112, first conveyor assembly 12, first conveyor drive element 121, first conveyor roller 122, first conveyor chain 123, first carriage 124, movable conveyor frame 13, second conveyor guide block 131, second conveyor cover 132, second conveyor assembly 14, second conveyor drive element 141, second conveyor roller 142, second conveyor chain 143, second carriage 144, and adjustment assembly 15;

the device comprises a soldering tin positioning device 2, a first compression positioning assembly 21, a first positioning supporting block 211, a first pressing block 212, a first connecting rod 213, a first compression positioning cylinder 214, a second compression positioning assembly 22, a second positioning supporting block 221, a second pressing block 222, a second connecting rod 223 and a second compression positioning cylinder 224;

a soldering tin driving device 3, a transverse transmission module 31, a lifting transmission module 32 and a vertical panel 321;

the drive mounting frame 4, the connection base plate 41, the connection plate 411, the connection side plate 412, the rotation shaft seat 42, the first rotation shaft groove 421, the second rotation shaft groove 422;

the bending device 5, the bending rotation assembly 51, the first rotation shaft 511, the first rotation bracket 512, the first rotation driving motor 513, the bending pushing assembly 52, the bending sliding element 521, the bending driving element 522, the bending fixing block 523, the bending needle 53, the bending groove 531, the bending motor 532, and the bending inclined plane 533;

a soldering device 6, a soldering rotating assembly 61, a second rotating shaft 611, a second rotating bracket 612, a second rotating driving motor 613, a soldering pushing assembly 62, a soldering sliding element 621, a soldering driving element 622, a soldering fixing block 623, a soldering assembly 63, a spot welding head 631, a soldering feeding element 632, a blowing pipe 633 and an adjusting bracket 634;

PCB 7, jack 71, pin bend 72, electronic component 8, pins 81.

Detailed Description

In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

As shown in fig. 1 to 9, in one embodiment of the present invention, an automatic soldering apparatus for a power adapter PCB is provided, which includes a conveying device 1, a soldering positioning device 2, a soldering driving device 3, a driving mounting frame 4, a pin bending device 5 and a soldering device 6, wherein the conveying device 1 is used for transporting a PCB 7; the soldering tin positioning device 2 is used for fixing the PCB 7 on the conveying device 1; the soldering tin driving device 3 is positioned at the lower side of the conveying device 1; the driving mounting frame 4 comprises a connecting base plate 41 obliquely arranged on the soldering tin driving device 3 and a rotating shaft seat 42 arranged on the connecting base plate 41; the pin bending device 5 comprises a pin bending rotating assembly 51 arranged on the rotating shaft seat 42, a pin bending pushing assembly 52 connected with the pin bending rotating assembly 51 and a pin bending pressing needle 53 connected with the pin bending pushing assembly 52, wherein the pin bending pushing assembly 52 is used for driving the pin bending pressing needle 53 to press and bend pins of electronic elements to be welded on the PCB 7 towards one side; the soldering device 6 comprises a soldering rotating component 61 installed on the rotating shaft seat 42, a soldering pushing component 62 connected to the soldering rotating component 61 and a soldering component 63 connected to the soldering pushing component 62, wherein the soldering pushing component 62 is used for driving the soldering component 63 to solder pins of electronic elements on the PCB 7. According to the embodiment, the PCB 7 is conveyed in a full-automatic mode, the PCB 7 is conveyed to a designated position through the conveying device 1, the PCB is positioned through the soldering tin positioning device 2, then the pin bending device 5 and the soldering tin device 6 are driven by the soldering tin driving device 3 to solder pins of electronic components on the PCB 7, automatic soldering tin of the pins is achieved, and particularly, the soldering tin is aimed at pins of some specific electronic components in a power adapter, so that the problems that the existing manual soldering tin is low in efficiency and difficult to control in precision are solved.

In the above embodiment, the use of the conveying device 1 effectively ensures stable transportation of the PCB board 7, so that the soldering apparatus can accurately operate for each electronic component to be soldered. Secondly, the use of the solder positioning device 2 ensures the accurate position of the PCB 7 in the conveying process, and further improves the precision of solder.

In the above embodiment, the solder driving device 3 is located at the lower side of the conveying device 1, so as to provide precise control and guiding for the solder. The power source of the device is realized through the driving installation frame 4, and the inclination installation of the driving installation frame 4 enables the soldering tin driving device 3 to be better suitable for the PCB 7 with various angles and shapes, so that the universality of the equipment is improved.

In the above embodiment, the pivot seat 42 is mounted in the driving mounting frame 4, so that the solder rotating assembly 61, the pin rotating assembly 51 and the pin pushing assembly 52 can flexibly rotate to adapt to different solder requirements. This greatly enhances the adaptability and flexibility of the device.

In the above embodiment, the pin bending rotation assembly 51, the pin bending pushing assembly 52 and the pin bending press 53 in the pin bending device 5 are matched to effectively bend the pins of the electronic component towards one side, so that the solder can be more conveniently attached to the pins. This design significantly improves the efficiency and accuracy of the solder.

In the above embodiment, the solder rotating assembly 61, the solder pushing assembly 62 and the solder assembly 63 in the solder device 6 cooperate to realize accurate soldering of the pins of the electronic component on the PCB 7. The application of the soldering tin pushing component 62 enables the soldering tin component 63 to be accurately attached to the pins, and the precision and efficiency of soldering tin are further improved.

Referring to fig. 3 to 4, the conveying device 1 includes a fixed conveying bracket 11, a first conveying component 12 arranged on the fixed conveying bracket 11, a movable conveying bracket 13, a second conveying component 14 arranged on the movable conveying bracket 13, and an adjusting component 15, wherein the adjusting component 15 is used for adjusting the distance between the movable conveying bracket 13 and the fixed conveying bracket 11; in this embodiment, the adjusting assembly 15 is designed to adjust the distance between the two conveying brackets, so as to convey and use the PCB 7 with different sizes. The specific adjusting structure is adjusted through screw transmission and is more common in the conveying structure, so that the description is omitted.

The first conveying assembly 12 is provided with a first conveying driving element 121, a first conveying roller 122 connected to the first conveying driving element 121, and a first conveying chain 123 transferred to the first conveying roller 122; a first bracket 124 is disposed at one end of the first conveying chain 123, the first bracket 124 is used for supporting a side edge of the PCB 7, and specifically, the second conveying assembly 14 is provided with a second conveying driving element 141, a second conveying roller 142 connected to the second conveying driving element 141, and a second conveying chain 143 transmitted to the second conveying roller 142; one end of the second conveying chain 143 is provided with a second bracket 144, and the second bracket 144 is used for supporting the side edge of the PCB 7; the first bracket 124 is disposed opposite to the second bracket 144 to form a conveying bracket for conveying the PCB 7; in this embodiment, the conveying driving element is a motor, and drives the conveying chain to drive through driving the conveying roller, so as to drive the PCB 7 on the conveying bracket to convey. The first conveying driving element 121 and the second conveying driving element 141 are synchronously driven, and the first bracket 124 and the second bracket 144 are columnar brackets.

A first conveying guide block 111 and a first conveying cover plate 112 are arranged on the fixed conveying support 11, a first conveying guide groove is formed between the first conveying guide block 111 and the first conveying cover plate 112, the first conveying chain 123 is conveyed on the first conveying guide groove, and one end of the first bracket 124 extends to the side edge of the first conveying guide groove; specifically, the movable conveying support 13 is provided with a second conveying guide block 131 and a second conveying cover plate 132, a second conveying guide groove is formed between the second conveying guide block 131 and the second conveying cover plate 132, the second conveying chain 143 is conveyed on the second conveying guide groove, and one end of the second bracket 144 extends to the side edge of the conveying guide groove; in this embodiment, be used for carrying the transmission of chain to lead through carrying the guide way, the transmission is stable, and the precision is high, also can not appear shifting the phenomenon in soldering tin in-process.

The solder positioning device 2 comprises a first compression positioning assembly 21 and a second compression positioning assembly 22, the first compression positioning assembly 21 comprises a first positioning support block 211 arranged on the first conveying guide block 111, a first pressing block 212 rotatably arranged on the first conveying cover plate 112, a first connecting rod 213 connected with the first pressing block 212 and a first compression positioning cylinder 214 connected with the first connecting rod 213, the first positioning support block 211 and the first pressing block 212 are oppositely arranged, and the first compression positioning cylinder 214 is used for driving the first connecting rod 213 to drive the first pressing block 212 to press and fix the PCB 7 on the first positioning support block 211; specifically, the second compressing and positioning assembly 22 includes a second positioning support block 221 installed on the second conveying guide block 131, a second pressing block 222 rotatably disposed on the second conveying cover 132, a second connecting rod 223 connected to the second pressing block 222, and a second compressing and positioning cylinder 224 connected to the second connecting rod 223, where the second positioning support block 221 and the second pressing block 222 are oppositely disposed, and the second compressing and positioning cylinder 224 is used to drive the second connecting rod 223 to drive the second pressing block 222 to compress and fix the PCB 7 on the second positioning support block 221; in this embodiment, the two pressing blocks on two sides are matched with the positioning support blocks to compress and fix the side edges of the PCB 7, so as to ensure the stability of the PCB 7 in the bending and soldering processes.

In the above embodiment, the first pressing block 212, the first positioning support block 211, the second pressing block 222, and the second positioning support block 221 are each provided with a plurality of; through a plurality of briquetting and location supporting shoe designs, compress tightly fixedly to a plurality of positions simultaneously, further guarantee the precision and the stability of bent foot and soldering tin.

Referring to fig. 5, the solder driving device 3 includes a transverse transmission module 31 and a lifting transmission module 32 mounted on the transverse transmission module 31, wherein the transverse transmission module 31 is located below the conveying device 1, the connection substrate 41 is connected with the lifting transmission module 32, and the transverse transmission module 31 and the lifting transmission module 32 are both screw transmission modules; in the present embodiment, not limited to only the transverse transmission and the lifting transmission, but also the longitudinal transmission can be added for realizing the XYZ three-axis transmission. In different embodiments, the conveying device 1 can be used as a longitudinal transmission direction, and the longitudinal automatic transmission of soldering tin can also be realized.

The lifting transmission module 32 is provided with a vertical panel 321, the connection substrate 41 comprises a connection plate 411 connected to the vertical panel 321 and a connection side plate 412 vertically connected to the connection plate 411, the connection side plate 412 is inclined along the vertical plane of the vertical panel 321, and one end of the rotating shaft seat 42 is fixedly arranged on the connection side plate 412; in this embodiment, through perpendicular panel 321 and connecting plate 411 and connecting curb plate 412 combination formation T font connection structure, connecting curb plate 412 can be according to the direction of bending installation of inclining, conveniently adjusts to the direction of bending and uses, and the practicality is strong, and the commonality is good.

Referring to fig. 6 to fig. 7, the rotating shaft seat 42 is provided with a first rotating shaft groove 421 and a second rotating shaft groove 422, the bent pin rotating assembly 51 is arranged on the first rotating shaft groove 421, the soldering tin rotating assembly 61 is arranged on the second rotating shaft groove 422, and the first rotating shaft groove 421 and the second rotating shaft groove 422 are in the same axis so that the bent pin rotating assembly 51 and the soldering tin rotating assembly 61 are in the same axis; the bent leg rotating assembly 51 includes a first rotating shaft 511 installed at the rotating shaft seat, a first rotating bracket 512 connected to the first rotating shaft 511, and a first rotating driving motor 513 for driving the first rotating shaft 511 to rotate the first rotating bracket 512; the toe push assembly is mounted on a first swivel bracket 512. Specifically, the pin pushing assembly 52 includes a pin sliding element 521 and a pin driving element 522 for driving the pin sliding element 521 to move, the pin driving element 522 is used for driving the pin sliding element 521 to slide linearly, the pin sliding element 521 is provided with a pin fixing block 523, the pin 53 is mounted on the pin fixing block 523, and the pin 53 can adjust the distance between the pin and the PCB 7 along the pin fixing block 523; one end of the bending pin 53 is provided with a bending groove 531, the other end is connected with a bending motor 532, and the bending motor 532 is used for driving the bending pin 53 to adjust the orientation angle of the bending groove 531; the bent pin press pin 53 is provided with a bent inclined plane 533 at one end of the bent groove 531, the bent groove 531 is disposed on the bent inclined plane 533, and the bent inclined plane 533 is used for guiding the pins toward the bent groove 531 when the pins of the electronic component are bent. In this embodiment, by matching the bending inclined plane 533 with the bending groove 531, a guiding effect is achieved in the bending process of the pin, so as to ensure the consistent bending direction.

The solder rotating assembly 61 comprises a second rotating shaft 611 installed on the rotating shaft seat 42, a second rotating bracket 612 connected to the second rotating shaft 611, and a second rotating driving motor 613 for driving the second rotating shaft 611 to drive the second rotating bracket 612 to rotate; the solder pushing component 62 is mounted on the second rotating bracket 612, specifically, the solder pushing component 62 includes a solder sliding element 621 and a solder driving element 622 for driving the solder sliding element 621 to move, the solder driving element 622 is used for driving the bent pin sliding element 521 to slide linearly, the solder sliding element 621 is mounted with a solder fixing block 623, the solder component 63 is mounted on the solder fixing block 623, and the solder component 63 can adjust the distance between the solder fixing block 623 and the PCB 7.

The soldering tin assembly 63 comprises a spot welding head 631, and a tin feeding element 632 and a blowing pipe 633 which are arranged on one side of the spot welding head 631, wherein the tin feeding element 632 and the blowing pipe 633 face the soldering tin end of the spot welding head 631, an adjusting bracket 634 is arranged on one side of the spot welding head 631, the tin feeding element 632 and the blowing pipe 633 are arranged on the adjusting bracket 634, and the adjusting bracket 634 is used for adjusting the direction and the position of the tin feeding element 632 and the blowing pipe 633 corresponding to the spot welding head 631.

Referring to fig. 1 to 9, a power adapter PCB soldering method includes the automatic power adapter PCB soldering apparatus;

the PCB 7 is provided with a jack 71, the electronic element 8 is provided with a pin 81, the pin 81 is inserted from one end of the jack 71 and extends out from the other end, the outlet end of the jack 71 is provided with a pin bending groove 72, and the pin bending groove 72 is used for bending and guiding the pin 81;

the power adapter PCB soldering method comprises the following steps:

step S1, pins 81 of an electronic component 8 are inserted into jacks 71 of a PCB 7;

step S2, conveying the PCB 7 on the conveying device 1, and positioning and compacting the PCB 7 through the soldering tin positioning device 2 when the PCB 7 is conveyed to a specified position;

step S3, the soldering tin driving device 3 drives the pin bending device 5 to correspond to the jack 71;

step S4, the bent pin pushing component 52 drives the bent pin press needle 53 to move towards the pin 81, and enables the bent pin press needle 53 to be abutted against the pin 81;

step S5, the pin bending rotating assembly 51 drives the pin bending press needle 53 to rotate so as to bend the pin 81 towards the direction of the pin bending groove 72, and a soldering tin groove is formed in the reverse direction of the pin bending groove 72, and after the pin bending is completed, the pin bending rotating assembly 51 drives the pin bending press needle 53 to reset;

step S6, the soldering tin driving device 3 drives the soldering tin device 6 to correspond to the jack 71;

step S7, the soldering tin rotating assembly 61 drives the soldering tin assembly 63 to adjust the direction to correspond to the soldering tin groove;

in step S8, the solder pushing assembly 62 drives the solder assembly 63 to solder towards the solder bath so as to solder the pins 81 with the solder bath.

In step S1 of the above embodiment, the pins 81 of the electronic component 8 are inserted into the sockets 71 of the PCB 7, and the design of the sockets 71 enables the solder device to accurately find the position of the electronic component 8. This step helps to improve the accuracy of the solder.

In steps S2 and S3 of the above embodiment, the PCB 7 is transported on the transporting device 1, and when transported to the designated position, the PCB 7 is positioned and pressed by the solder positioning device 2, and the solder driving device 3 drives the pin bending device 5 to correspond to the insertion hole 71. This step ensures the stability of the PCB 7 and the electronic component 8 and improves the reliability of the solder.

In step S4 of the above embodiment, the pin pushing assembly 52 drives the pin 53 to move toward the pin 81, and makes the pin 53 abut against the pin 81. In this step, the pin 81 is tightly contacted with the solder slot by the pin pressing pin 53, so that the stability of the solder is improved.

In step S5 of the above embodiment, the pin rotating assembly 51 drives the pin presser 53 to rotate, so as to bend the pins 81 toward the pin bending groove 72, and form the solder grooves in the opposite direction of the pin bending groove 72. In this step, the bending of the pins 81 and the formation of the solder grooves are performed under automatic control, thereby greatly improving the efficiency of soldering.

In steps S6 to S8 of the above embodiment, the solder driving device 3 drives the solder device 6 to correspond to the jack 71, the solder rotating assembly 61 drives the solder assembly 63 to adjust to correspond to the solder slot, and the solder pushing assembly 62 drives the solder assembly 63 to solder toward the solder slot. This series of steps ensures the accuracy and efficiency of the solder. The soldering tin pushing component 62 drives the soldering tin component 63 to solder towards the soldering tin groove, so that the soldering tin is filled in the soldering tin groove, the area of the connection between the soldering tin and the pins 81 is larger, and the connection effect is better.

The foregoing examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims

1. Automatic soldering tin equipment of power adapter PCB, its characterized in that: comprising

The conveying device is used for conveying the PCB;

the soldering tin positioning device is used for fixing the PCB on the conveying device;

the soldering tin driving device is positioned at the lower side of the conveying device;

the driving installation frame comprises a connecting substrate obliquely arranged on the soldering tin driving device and a rotating shaft seat arranged on the connecting substrate;

the pin bending device comprises a pin bending rotating assembly arranged on the rotating shaft seat, a pin bending pushing assembly connected with the pin bending rotating assembly and a pin bending pressing needle connected with the pin bending pushing assembly, and the pin bending pushing assembly is used for driving the pin bending to press and bend pins of electronic elements to be welded on the PCB towards one side; and

the soldering device comprises a soldering tin rotating assembly arranged on the rotating shaft seat, a soldering tin pushing assembly connected with the soldering tin rotating assembly and a soldering tin assembly connected with the soldering tin pushing assembly, wherein the soldering tin pushing assembly is used for driving the soldering tin assembly to solder pins of electronic elements on a PCB (printed circuit board).

2. The power adapter PCB automatic solder device of claim 1, wherein: the conveying device comprises a fixed conveying support, a first conveying assembly, a movable conveying support, a second conveying assembly and an adjusting assembly, wherein the first conveying assembly is arranged on the fixed conveying support, the second conveying assembly is arranged on the movable conveying support, and the adjusting assembly is used for adjusting the distance between the movable conveying support and the fixed conveying support;

the first conveying assembly is provided with a first conveying driving element, a first conveying roller connected with the first conveying driving element and a first conveying chain transmitted to the first conveying roller; one end of the first conveying chain is provided with a first bracket, and the first bracket is used for supporting the side edge of the PCB;

the second conveying assembly is provided with a second conveying driving element, a second conveying roller connected with the second conveying driving element and a second conveying chain transmitted to the second conveying roller; one end of the second conveying chain is provided with a second bracket, and the second bracket is used for supporting the side edge of the PCB; the first bracket and the second bracket are arranged opposite to each other to form a conveying bracket for conveying the PCB.

3. The power adapter PCB automatic solder device of claim 2, wherein: the fixed conveying support is provided with a first conveying guide block and a first conveying cover plate, a first conveying guide groove is formed between the first conveying guide block and the first conveying cover plate, the first conveying chain is conveyed on the first conveying guide groove, and one end of the first bracket extends to the side edge of the first conveying guide groove;

the movable conveying support is provided with a second conveying guide block and a second conveying cover plate, a second conveying guide groove is formed between the second conveying guide block and the second conveying cover plate, the second conveying chain is conveyed on the second conveying guide groove, and one end of the second bracket extends to the side edge of the second conveying guide groove.

4. The power adapter PCB automatic solder device of claim 3, wherein: the soldering tin positioning device comprises a first compression positioning assembly and a second compression positioning assembly, wherein the first compression positioning assembly comprises a first positioning supporting block, a first pressing block, a first connecting rod and a first compression positioning cylinder, the first positioning supporting block is installed on a first conveying guide block, the first pressing block is rotatably arranged on a first conveying cover plate, the first connecting rod is connected with the first pressing block, the first compression positioning cylinder is connected with the first connecting rod, the first positioning supporting block and the first pressing block are oppositely arranged, and the first compression positioning cylinder is used for driving the first connecting rod to drive the first pressing block to fasten a PCB (printed circuit board) on the first positioning supporting block in a compression mode;

the second compressing and positioning assembly comprises a second positioning support block arranged on the second conveying guide block, a second pressing block rotatably arranged on the second conveying cover plate, a second connecting rod connected with the second pressing block and a second compressing and positioning cylinder connected with the second connecting rod, the second positioning support block and the second pressing block are oppositely arranged, and the second compressing and positioning cylinder is used for driving the second connecting rod to drive the second pressing block to compress and fix the PCB on the second positioning support block;

the first pressing block, the first positioning supporting block, the second pressing block and the second positioning supporting block are all provided with a plurality of pressing blocks.

5. The power adapter PCB automatic solder device of claim 1, wherein: the soldering tin drive device comprises a transverse transmission module and a lifting transmission module arranged on the transverse transmission module, wherein the transverse transmission module is positioned below the conveying device, the connecting substrate is connected with the lifting transmission module, and the transverse transmission module and the lifting transmission module are both screw rod transmission modules.

6. The power adapter PCB automatic solder device of claim 5, wherein: the lifting transmission module is provided with a vertical panel, the connecting substrate comprises a connecting plate connected with the vertical panel and a connecting side plate vertically connected with the connecting plate, the connecting side plate inclines along the vertical plane of the vertical panel, and one end of the rotating shaft seat is fixedly arranged on the connecting side plate;

the rotating shaft seat is provided with a first rotating shaft groove and a second rotating shaft groove, the bent pin rotating assembly is arranged on the first rotating shaft groove, the soldering tin rotating assembly is arranged on the second rotating shaft groove, and the first rotating shaft groove and the second rotating shaft groove are located at the same axis, so that the bent pin rotating assembly and the soldering tin rotating assembly are located at the same axis.

7. The power adapter PCB automatic solder device of claim 6, wherein: the bent pin rotating assembly comprises a first rotating shaft arranged on the rotating shaft seat, a first rotating bracket connected to the first rotating shaft and a first rotating driving motor used for driving the first rotating shaft to drive the first rotating bracket to rotate; the bent foot pushing assembly is arranged on the first rotary bracket;

the bending pushing assembly comprises a bending sliding element and a bending driving element for driving the bending sliding element to move, the bending driving element is used for driving the bending sliding element to slide linearly, a bending fixing block is arranged on the bending sliding element, a bending needle is arranged on the bending fixing block, and the distance between the bending needle and the PCB can be adjusted along the bending fixing block; one end of the bent pin pressing needle is provided with a bent groove, and the other end of the bent pin pressing needle is connected with a bent pin motor which is used for driving the bent pin pressing needle so as to adjust the orientation angle of the bent groove; the pin bending press pin is characterized in that a bending inclined plane is arranged at one end of the bending groove, the bending groove is arranged on the bending inclined plane, and the bending inclined plane is used for guiding pins towards the bending groove when bending the pins of the electronic element.

8. The power adapter PCB automatic solder device of claim 7, wherein: the soldering tin rotating assembly comprises a second rotating shaft arranged on the rotating shaft seat, a second rotating bracket connected to the second rotating shaft and a second rotating driving motor used for driving the second rotating shaft to drive the second rotating bracket to rotate; the soldering tin pushing component is arranged on the second rotary bracket;

the soldering tin pushing assembly comprises a soldering tin sliding element and a soldering tin driving element used for driving the soldering tin sliding element to move, the soldering tin driving element is used for driving the bent pin sliding element to slide linearly, a soldering tin fixing block is arranged on the soldering tin sliding element, the soldering tin assembly is arranged on the soldering tin fixing block, and the distance between the soldering tin assembly and a PCB (printed circuit board) can be adjusted along the soldering tin fixing block.

9. The power adapter PCB automatic solder device of claim 8, wherein: the soldering tin assembly comprises a spot welding head, and a tin feeding element and a blowing pipe which are positioned on one side of the spot welding head, wherein the tin feeding element and the blowing pipe face the soldering tin end of the spot welding head, an adjusting bracket is arranged on one side of the spot welding head, the tin feeding element and the blowing pipe are all arranged on the adjusting bracket, and the adjusting bracket is used for adjusting the direction and the position of the tin feeding element and the blowing pipe corresponding to the spot welding head.

10. A power adapter PCB soldering method is characterized in that: an automatic soldering apparatus comprising the power adapter PCB of any one of claims 1 to 9;

the pin bending guide device comprises a PCB and an electronic element, wherein a jack is formed in the PCB, the electronic element is provided with a pin, the pin is inserted from one end of the jack and extends out from the other end of the jack, a pin bending groove is formed in the outlet end of the jack, and the pin bending groove is used for pin bending guide;

the power adapter PCB soldering method comprises the following steps:

step S1, pins of an electronic element are inserted into jacks of a PCB;