CN117561477A

CN117561477A - Display device and optical machine assembly thereof

Info

Publication number: CN117561477A
Application number: CN202180092676.6A
Authority: CN
Inventors: 于卫勇; 任国扬; 张明龙; 胡海石; 叶阳; 郭松涛; 陈许; 刘晨
Original assignee: Hisense Visual Technology Co Ltd
Current assignee: Hisense Visual Technology Co Ltd
Priority date: 2021-02-09
Filing date: 2021-11-24
Publication date: 2024-02-13
Also published as: WO2022170814A1; CN214174810U; CN214067558U; CN214278597U

Abstract

A display device and an optical-mechanical assembly (b) thereof, wherein the optical-mechanical assembly (b) comprises a DMD chip (100), a socket (300) and an adapter plate (200); one surface of the socket (300) is connected with the DMD chip (100), and the other surface is convexly provided with a positioning column (320) and a conductive spring needle (330); the adapter plate (200) is provided with a positioning hole (210) matched with the positioning column (320) and a contact (220) abutted against the conductive spring needle (330); the positioning hole (210) and the positioning column (320) are in clearance fit, so that the conductive spring needle (330) deflects on the contact (220) to form a movable circumference (390), and the movable circumference (390) is positioned in the enclosing range of the contact (220); one surface of the adapter plate (200) provided with the contact (220) is also provided with a blind hole corresponding to the contact (220). The blind holes are located in whole or in part within the enclosure of the contacts (220) to ensure connection between the contacts (220) on the outer layer and the inner layer of the interposer (200). The blind hole is positioned outside the movable circumference (390) of the conductive spring needle (330), so that the contact (220) is prevented from deforming in the movable range of the conductive spring needle (330), and the effective contact between the conductive spring needle (330) and the contact (220) is effectively ensured.

Description

Display device and optical machine assembly thereof

The application claims 202120367083.3 filed on day 2021, 2 and 9; application number 202120368614.0 filed on day 2 and 9 of 2021; application number 202120368735.5 filed on day 2 and 9 of 2021; application number 202120380307.4 filed on 19/2/2021; application number 202120380310.6 filed on 19/2/2021; priority of chinese patent application No. 202120379729.X filed on month 19 of 2021, the entire contents of which are incorporated herein by reference.

Technical Field

The present disclosure relates to the field of projection technologies, and in particular, to a display device and an optical-mechanical assembly thereof.

Background

The DLP (Digtal Light Procession, digital light processing) projector has the characteristics of high native contrast, miniaturization of the machine, closed optical path, etc., so that the DLP projector is increasingly popular with users, wherein the DLP projector adopts a projection technology of using a digital micromirror device (Digital Micromirror Device, DMD) chip as an imaging device and realizing projection of an image by adjusting reflected light. In the technical field of projection equipment, a DMD chip is a core component in a projector, and a light beam emitted by a laser and passing through a series of optical lenses reaches the DMD chip, and the DMD chip processes an optical signal to finally form an image.

In the related art, a DMD chip is generally connected to an interposer (PCB board) through a socket, and the interposer receives a corresponding signal and transmits the signal to the DMD chip through the socket. The socket is provided with corresponding spring pins, the adapter plate is usually provided with a large-area bonding pad structure to form contacts on the adapter plate, and the spring pins on the socket are pressed on the contacts of the adapter plate, so that the adapter plate and the DMD chip are conducted. The adapter plate is generally of a multilayer printed structure, and the outer layer of the adapter plate is provided with a through hole or a blind hole for connecting the outer layer and the inner layer of the adapter plate. The through holes or blind holes are arranged at the contact points of the adapter plate so as to connect the inner layer and the outer layer of the adapter plate. However, vias or blind holes are opened at the contacts. The contact is easy to concave under the action of the pressure of the spring pin, so that the spring pin on the socket is in poor contact with the contact, and the quality of signal transmission between the DMD chip and the adapter plate and the reliability of the projector are affected.

Disclosure of Invention

Some embodiments of the present application provide a display device and an optical-mechanical assembly thereof, wherein the optical-mechanical assembly includes a DMD chip, a socket, and an adapter plate; one surface of the socket is connected with the DMD chip, and the other surface of the socket is convexly provided with a positioning column and a conductive spring needle; the adapter plate is provided with a positioning hole matched with the positioning column and a contact point abutted against the conductive spring needle; the positioning holes are in clearance fit with the positioning columns, so that the conductive spring pins are offset on the contacts to form movable circumferences, and the movable circumferences are located in the enclosing range of the contacts; the one side of keysets that is provided with the contact corresponds the contact still is provided with the blind hole, the blind hole is whole or partly be located the contact enclose the within range for connect keysets's skin and inlayer, the blind hole is located electrically conductive bullet needle the activity circumference is outside.

In some embodiments, the contact is a square structure, and the blind hole is located within the enclosure of the contact.

In some embodiments, the aperture of the blind hole is circular, and the center of the blind hole is located on the diagonal line of the contact point.

In some embodiments, an edge of the blind hole is tangential to an edge of the active circumference of the conductive pin.

In some embodiments, a plurality of blind holes are correspondingly arranged in the enclosing range of each contact.

In some embodiments, the blind holes are provided in four for each of the contacts and in diagonal for each of the contacts.

In some embodiments, the movable circumference of the conductive spring pin and the blind hole are both located within the enclosed range of the contact.

In some embodiments, the socket further includes a housing, the positioning posts and the conductive pins are disposed on the housing, two ends of the conductive pins respectively exceed two sides of the housing, and two ends of the conductive pins respectively abut against the contacts on the adapter plate and the DMD chip.

In some embodiments, the conductive latch needle comprises a limiting part arranged in the shell and two abutting parts connected with two ends of the limiting part in a bending way, and the abutting parts are connected with the limiting part in a bending way, so that the conductive latch needle has elasticity; the abutment protrudes from the housing.

In some embodiments, the optical-mechanical assembly further includes a lens unit, and the lens unit is electrically connected to the DMD chip, and is configured to receive the digital optical signal delivered by the DMD chip, amplify the digital optical signal, and then project the amplified digital optical signal.

Some embodiments of the present application provide a display device, including a display screen and the optical-mechanical assembly described above.

Some embodiments of the present application provide an optomechanical assembly including a DMD chip, a socket, and an interposer; one surface of the socket is connected with the DMD chip, and the other surface of the socket is convexly provided with a positioning column and a conductive spring needle; the adapter plate is provided with a positioning hole matched with the positioning column and a plurality of contacts abutted against the conductive spring needle; a gap is formed between the contacts; the positioning holes are in clearance fit with the positioning columns, so that the conductive spring pins are offset on the contacts to form movable circumferences, and the movable circumferences are located in the enclosing range of the contacts; the surface of the adapter plate, which is provided with the contacts, is provided with connecting holes corresponding to the contacts, so as to be used for connecting the outer layer and the inner layer of the adapter plate, and the connecting holes are positioned in gaps between the contacts.

In some embodiments, the contacts are of regular polygon configuration, the number of sides of the contacts being greater than four.

In some embodiments, a plurality of the contacts are distributed in a rectangular array; the connecting holes are through holes and are positioned in gaps between diagonally arranged contacts.

In some embodiments, the hole diameter of the via hole is circular, and the circle center of the via hole is located on a connecting line of centers of the contacts or an extension line of the connecting line of centers which are diagonally arranged.

In some embodiments, the via is tangential to an edge of at least one of the contacts.

In some embodiments, the contacts are in a regular octagon configuration, the inscribed circles of the contacts have a diameter of 0.75mm, and the vias have a diameter of greater than or equal to 0.2mm.

In some embodiments, the optomechanical assembly further includes a heat sink disposed on a side of the interposer opposite the DMD chip.

Some embodiments of the present application provide an opto-mechanical assembly including a DMD chip, a socket, and an interposer; one surface of the socket is connected with the DMD chip, and the other surface of the socket is convexly provided with a positioning column and a conductive spring needle; the adapter plate is provided with a positioning hole matched with the positioning column and a contact point abutted against the conductive spring needle; the positioning holes are in clearance fit with the positioning columns, so that the conductive spring pins are offset on the contacts to form movable circumferences, and the movable circumferences are located in the enclosing range of the contacts; the surface of the adapter plate, which is provided with the contact, is provided with a connecting hole corresponding to the contact, so as to be used for connecting the outer layer and the inner layer of the adapter plate, and the connecting hole is positioned outside the movable circumference.

In some embodiments, the contact is circular, and the diameter of the contact is greater than or equal to the diameter of the active circumference of the conductive pin.

In some embodiments, a plurality of the contacts are distributed in a rectangular array; the connection holes are located wholly or partly in the gaps between diagonally arranged contacts.

In some embodiments, the hole diameter of the connecting hole is circular, and the circle center of the connecting hole is positioned on a connecting line of centers of the contacts or an extension line of the connecting line of centers which are diagonally arranged.

In some embodiments, the connection hole is a via hole, the via hole being located outside the contact.

In some embodiments, the connection hole is a blind hole, an edge of the blind hole being tangential to an edge of the movable circumference of the conductive pin.

In some embodiments, the edge of the contact and the edge of the movable circumference coincide.

Drawings

Fig. 1 is a schematic structural view of a display device according to some embodiments of the present application;

fig. 2 is a schematic structural view of a display device according to other embodiments of the present application;

FIG. 3 is a block diagram of connections of an opto-mechanical assembly according to some embodiments of the present application;

FIG. 4 is a schematic diagram of a DMD chip structure according to some embodiments of the present application;

FIG. 5 is a schematic diagram of a receptacle according to some embodiments of the present application;

FIG. 6 is a partial schematic view of a cross-sectional structure of a socket according to some embodiments of the present application;

fig. 7-9 are schematic structural views of an interposer according to some embodiments of the present application;

fig. 10 to 11 are schematic structural views of an interposer according to other embodiments of the present application;

fig. 12-14 are schematic structural views of an interposer according to further embodiments of the present application.

The reference numerals are explained as follows:

a. a display screen; b. an opto-mechanical assembly; 100. a DMD chip; 110. a contact; 200. an adapter plate; 210. positioning holes; 220. a contact; 230. a connection hole; 300. a socket; 310. a housing; 320. positioning columns; 330. a conductive spring needle; 331. A limit part; 332. an abutting portion; 390. a movable circumference; 400. a heat sink.

Detailed Description

For purposes of clarity, embodiments and advantages of the present application, the following description will make clear and complete the exemplary embodiments of the present application, with reference to the accompanying drawings in the exemplary embodiments of the present application, it being apparent that the exemplary embodiments described are only some, but not all, of the examples of the present application.

Fig. 1 is a schematic structural diagram of a display device according to some embodiments of the present application. Referring to fig. 1, the present embodiment provides a display device including a display screen a and an optical-mechanical assembly b. In this embodiment, the optical-mechanical assembly b is configured to project an image outwards, so that the display device can directly display the image information, and can also project the image information outwards.

In some embodiments, the opto-mechanical assembly b is embedded within the display screen a; in some embodiments, opto-mechanical assembly b is mounted on display screen a and extends outwardly beyond display screen a such that opto-mechanical assembly b projects onto display screen a. In some embodiments, the optomechanical component b is mounted below the display screen, in a left-right direction, and the like, and the mounting position of the optomechanical component is not limited in this application.

In some embodiments, the display screen may be a component with display functionality, such as a television. In other embodiments, the display screen is a projection screen, which is a curtain structure, and the display screen is projected to display a picture.

Fig. 2 is a schematic structural view of a display device according to other embodiments of the present application. Referring to fig. 1 and fig. 2, in some embodiments, the display screen and the optical-mechanical assembly may be integrally installed, or may be a separate structure, and the combination of the display screen and the optical-mechanical assembly is not limited in this application. The optical-mechanical component can be arranged on the display screen a or can be used independently.

Fig. 3 is a block diagram of connections of an opto-mechanical assembly according to some embodiments of the present application. Referring to fig. 3, the present embodiment provides an optical-mechanical assembly b, which includes a DMD unit, a display driving unit, an audio-video unit, a light source unit, and a lens unit. The display driving unit outputs video electric signals and video time sequence control electric signals, the light source unit outputs optical signals, and the DMD chip receives the electric signals output by the display driving unit and the optical signals conveyed by the light source unit and outputs digital optical signals. The lens unit is electrically connected with the DMD chip and is used for receiving the digital light signals output by the DMD chip, amplifying the digital light signals and projecting the digital light signals outwards so as to display image information on the projection screen. The audio-video unit is electrically connected with the display driving unit and used for sending a video VB1 signal to the display driving unit and transmitting audio information outwards.

The audio-video unit comprises an audio-video module and a storage module. The audio-video module is used for receiving and decoding various video format signals such as radio frequency input, HDMI, USB, RJ and the like and outputting the signals to the display driving unit in a VB1 signal format. The audio-video module can also process various externally input audio signals and video signals, such as touch key input, infrared remote control and light sense input, far-field pickup signal input, U disk signal input and the like.

The audio-video unit also comprises a power amplification module, the audio-video module outputs audio signals and audio control signals to the power amplification module, and the power amplification module drives the loudspeaker to output sound.

The light source unit comprises a light source driving module and a light source module connected with the light source driving module; the light source driving module receives a light source driving signal sent by the display driving unit, drives the laser in the light source unit, and adjusts the brightness of the laser in the light source unit to be turned on and off so as to send out a white light source on the light source unit. In one embodiment, red, green, and blue three primary color solid state lasers are used as the Light source modules, or solid state lasers excite fluorescent substances are used as the Light source modules, or solid state lasers in combination with LED (Light-Emitting Diode) Light sources are used as the Light source modules, or the like.

In this embodiment, the display driving unit includes a display driving module, an MCU control module, and a storage module; the display driving module is connected with the MCU control module and the storage module, receives VB1 signals output by the audio-video module, converts the VB1 signals into corresponding video electric signals and video time sequence control electric signals, and controls the MCU control module to send out audio control signals and light source driving signals.

The video electrical signal and the video timing control electrical signal are supplied to the DMD unit and converted into digital optical signals in the DMD unit. The audio control signal is transmitted to the audio-video module to control the audio signal sent to the power amplifier module by the video module.

In this embodiment, the optical machine assembly b further includes an eye protection board unit, and the eye protection board unit captures a thermal infrared signal of the moving person and converts the thermal infrared signal into an analog electrical signal. The internal part of the circuit consists of an amplifying circuit, a comparing circuit and a trigger circuit. By detecting the moving person, the operation of the opto-mechanical assembly is controlled.

In the use process of the optical machine component b, the light source unit emits three primary color light beams, the three primary color light beams are irradiated to the surface of the DMD chip after being integrated through lenses in the light source unit, and the integrated light beams are rotationally reflected to the lens unit through the DMD chip so as to be emitted to an external curtain or curtain wall after being diffused through the lens unit, so that the display of colorful pictures on the curtain or curtain wall is realized.

In some embodiments, the DMD unit includes a DMD chip 100, an interposer 200, and a socket 300 connecting the DMD chip 100 and the interposer 200. The patch panel 200 receives the video electrical signal, the video timing control electrical signal, and the optical signal, and transmits the corresponding electrical signal and optical signal to the DMD chip 100 through the transmission of the socket 300. After the DMD chip 100 receives the optical signal and the electrical signal, the input optical signal and electrical signal are converted into digital electrical signals, and the digital electrical signals are output to the lens unit, which amplifies the digital electrical signals and projects the amplified digital electrical signals.

Fig. 4 is a schematic diagram of a DMD chip structure according to some embodiments of the present application. Referring to fig. 4, the DMD chip 100 has a plate-like structure, and a plurality of contacts 110 for connecting with the socket 300 are disposed on the DMD chip 100 at intervals. The plurality of contacts 110 are spaced apart. In this embodiment, the plurality of contacts 110 are distributed in a rectangular array.

Fig. 5 is a schematic structural view of a socket according to some embodiments of the present application. Fig. 6 is a partial schematic view of a cross-sectional structure of a socket according to some embodiments of the present application. Referring to fig. 3 to 6, in the present embodiment, the socket 300 further includes a housing 310, a positioning post 320 disposed on the housing 310, and a conductive pin 330. The housing 310 has a plate-shaped structure, and two ends of the conductive pin 330 respectively extend beyond two sides of the housing 310. One end of the conductive pin 330 is connected to the contact 110 on the DMD chip 100, so that one surface of the socket 300 is connected to the DMD chip 100, and the other end of the conductive pin 330 is connected to a corresponding structure on the interposer 200, so as to conduct the interposer 200 and the DMD chip 100.

The positioning post 320 is protruding on one surface of the housing 310 facing the adapter plate 200, and the positioning post 320 is adapted to a corresponding structure on the adapter plate 200, so as to limit the socket 300 on the adapter plate 200.

In this embodiment, the conductive pin 330 includes a limiting portion 331 disposed in the housing 310 and two abutting portions 332 connected to two ends of the limiting portion 331 in a bending manner, wherein the abutting portions 332 are connected to the limiting portion 331 in a bending manner, so that the conductive pin 330 has elasticity and can be elastically pressed onto the interposer 200 and the DMD chip 100. The socket 300 is clamped between the interposer 200 and the DMD chip 100, and the abutting portion 332 protrudes out of the housing 310, so that both ends of the conductive pins 330 abut against the interposer 200 and the DMD, respectively. The conductive pins 330 are made of a metal material so that the conductive pins 330 can perform transmission of an electrical signal.

In this embodiment, the conductive pins 330 are integrally formed. In some embodiments, the two abutting portions 332 of the conductive pins 330 can slide relative to the limiting portion 331, and an elastic member is disposed between the abutting portions 332 and the limiting portion 331, so that the abutting portions 332 can be pressed onto the interposer 200 and the DMD chip 100.

Fig. 7-9 are schematic structural views of an interposer according to some embodiments of the present application. Referring to fig. 7 and 8, in the present embodiment, the adapter plate 200 is provided with a positioning hole 210 adapted to the positioning post 320 of the socket 300, and a contact 220 abutting against the conductive spring pin 330.

The positioning hole 210 and the positioning post 320 are in clearance fit, so that the conductive spring pin 330 is offset on the contact 220 to form a movable circumference 390, and the movable circumference 390 is located in the enclosing range of the contact 220, so that the conductive spring pin 330 can be always in contact with the contact 220, and the connection between the socket 300 and the adapter plate 200 is ensured.

In some embodiments, the diameter of the positioning post 320 is 1.92+ -0.03 mm, the diameter of the positioning hole 210 is 2.00+ -0.05 mm, and the maximum offset of the conductive pin 330 on the contact 220 is (2-1.92) +0.03+0.05=0.16 mm. The outer circumference of the conductive pin 330 is offset 0.16m in all directions, namely the movable circumference 390 of the conductive pin 330.

The radius of conductive pin 330 is D and the maximum deflection of conductive pin 330 is D, resulting in a movable circumference 390 of conductive pin 330 of 2 (d+h). For example, the conductive pin 330 has a movable circumference of 0.6mm, the contact 220 has a square shape, and a side length of 0.75mm.

The adapter plate 200 is of a multilayer printed structure, and one surface of the adapter plate 200 provided with the contact 220 is provided with a connecting hole 230 corresponding to the contact 220, so that the connecting hole 230 is used for connecting the outer layer and the inner layer of the adapter plate 200, the connecting hole 230 is positioned outside the movable circumference 390 of the contact 220, and the contact 220 is prevented from deforming in the movable range of the conductive spring needle 330, so that the effective contact between the conductive spring needle 330 and the contact 220 is effectively ensured, and the quality of signal transmission between the DMD chip 100 and the adapter plate 200 and the reliability of an optical-mechanical assembly are effectively ensured.

In this embodiment, the connection hole 230 is a blind hole, the blind hole is located outside the movable circumference 390 of the conductive spring pin 330, and the blind hole is located in the surrounding range of the contact 220 entirely or partially, so as to ensure contact and connection between the blind hole and the contact 220, so as to ensure connection between the contact 220 and the inner layer of the outer layer of the interposer 200.

In this embodiment, the movable circumference 390 of the conductive pin 330 and the blind hole are located within the enclosed range of the contact 220.

The contacts 220 are square structures, and the blind holes are all located within the enclosing range of the contacts 220, so that mutual interference between corresponding blind holes of adjacent contacts 220 can be avoided.

When the contact 220 is square in configuration, there is a greater gap between the diagonally oriented edge of the contact 220 and the movable circumference 390. The aperture of the blind hole is circular, and the circle center of the blind hole is positioned on the diagonal line of the contact 220, so that the blind hole is positioned on the contact 220 and outside the movable circumference 390, and can be arranged larger to ensure that larger current passes through.

In this embodiment, the edges of the blind hole are tangential to the edges of the movable circumference 390 of the conductive pin 330. When the blind holes are disposed within the enclosed range of the square contacts 220, the blind holes are larger. When the blind hole portions are located outside the enclosed extent of the square contacts 220, the blind holes between adjacent contacts 220 are disposed larger.

A plurality of blind holes are correspondingly arranged in the enclosing range of each contact 220, so that larger current can be transmitted between the blind holes. The blind holes are provided four for each contact 220 and diagonally for each contact 220.

In some embodiments, one contact 220 is provided every 1mm in one direction. The contact 220 has a square structure, the side length of the contact 220 is 0.75mm, and the edge of the contact 220 is tangential to the movable circumference 390. The blind holes are positioned in the contacts 220 and outside the movable circumference 390, the circle centers of the blind holes are positioned on the diagonal lines of the contacts 220, the blind holes are four and correspond to each diagonal line of the contacts 220, the diameter of the blind holes is 0.1mm, and the maximum current of the blind holes with the aperture of 0.1mm and the wall thickness of 10 mu m is calculated to be 180.7 milliamperes. 4, 180.7×4= 722.8 milliamps are used. And one via hole with the common aperture of 0.2-0.3mm can pass through a maximum current of 710.4 milliamperes and is relatively close. Thus, the stability and reliability of the connection using the blind holes are ensured.

Fig. 9 is a schematic diagram of a portion of another embodiment of the interposer 200 shown in fig. 7. Referring to fig. 7 and 9, in the present embodiment, the connection hole 230 is a blind hole, the blind hole is located outside the movable circumference 390 of the conductive pin 330, and the blind hole is partially located within the surrounding range of the contact 220 to connect the contact 220, so as to ensure contact and connection between the blind hole and the contact 220, and ensure connection between the contact 220 and the inner layer of the outer layer of the interposer 200. And the blind hole portion is located outside the enclosed range of the contacts 220 so that a blind hole of larger aperture can be provided between the contacts 220.

When the aperture of the blind hole is larger, fewer blind holes can be formed, and connection between the inner layer and the outer layer of the adapter plate can be met. In this embodiment, when the blind holes are partially located within the contact 220 and partially located outside the contact 220, two blind holes are provided. In some embodiments, the blind holes may be provided in one, three, or other numbers.

When the blind hole is partially located within the contact 220 and partially located outside the contact 220, the shape of the contact may be various shapes, such as square, round, polygonal, and the like.

Fig. 10 to 11 are schematic structural views of an interposer according to other embodiments of the present application. Referring to fig. 10 and 11, in the present embodiment, the adapter board 200 is provided with a positioning hole 210 adapted to the positioning post 320 of the socket 300, and a plurality of contacts 220 abutting against the conductive pins 330, and a gap is formed between adjacent contacts 220.

In this embodiment, the connection holes 230 are located in the gaps between the contacts 220, so that the connection holes 230 are located outside the movable circumference 390 of the conductive pin 330, and the contacts 220 are prevented from being deformed in the movable circumference 390 of the conductive pin 330.

The contacts 220 are of a regular polygon structure, and the number of sides of the contacts 220 is greater than four; so that there is a larger gap between the contacts 220, the connection holes 230 in the gap between the contacts 220 can be set larger to facilitate larger current passing.

In this embodiment, the plurality of contacts 220 are distributed in a rectangular array; the connection holes 230 are vias and are located in gaps between diagonally disposed contacts 220, with larger gaps between diagonally disposed contacts 220, so that the placement of the vias is more convenient and the vias can be placed larger.

The aperture of the via hole is circular, and the center of the via hole is positioned on the connecting line of the centers of the diagonally arranged contacts 220 or the extension line of the central connecting line.

In this embodiment, the via is tangential to the edge of at least one contact 220, thereby allowing the via to connect with the contact 220 and ensuring that the via can be placed larger in the gap between adjacent contacts 220.

In some embodiments, the vias and contacts 220 are connected by wires, solder, and other connection structures.

In some embodiments, the edge of the contact 220 is tangential to the active circumference 390 of the conductive pin 330. The contacts 220 are in a regular octagonal configuration and the diameter of the vias is greater than or equal to 0.2mm. Specifically, the diameter of the via hole is 0.4mm-0.47mm.

Fig. 12-14 are schematic structural views of an interposer according to further embodiments of the present application. Referring to fig. 12, in the present embodiment, a positioning hole 210 adapted to a positioning post 320 of a socket 300 and a plurality of contacts 220 abutting against a conductive spring pin 330 are provided on the adapter board 200, and a gap is provided between adjacent contacts 220.

In this embodiment, the contact 220 is circular, and the diameter of the contact 220 is greater than or equal to the diameter of the movable circumference 390 of the conductive pin 330, such that the movable circumference 390 is within the envelope of the contact 220.

In this embodiment, the plurality of contacts 220 are distributed in a rectangular array; the connection holes 230 are located wholly or partially in the gaps between the diagonally disposed contacts 220.

Referring to fig. 12 and 13, in the present embodiment, the connection hole 230 is a blind hole, and the edge of the blind hole is tangential to the edge of the movable circumference 390. When the diameter of the contact 220 is equal to the diameter of the movable circumference 390, i.e., the edges of the contact 220 and the movable circumference 390 overlap, the edges of the blind holes are tangential to both the edges of the movable circumference 390 and the edges of the contact 220. When the diameter of the contact 220 is greater than the diameter of the movable circumference 390, the edges of the blind holes are tangential to the edges of the movable circumference 390 and the blind holes are located entirely or partially within the envelope of the contact 220.

When the connection hole 230 is a blind hole, the blind hole is provided four for each contact 220. And the center of the blind hole is located on the line of the centers of the diagonally arranged contacts 220 or the extension of the center line.

Referring to fig. 12 and 14, in the present embodiment, the connection hole 230 is a via hole, and the via hole is located outside the contact 220. The center of the blind hole is located on the line of the centers of the diagonally disposed contacts 220 or on the extension of the center line.

In some embodiments, the DMD unit further includes a heat sink 400, where the heat sink 400 is disposed on a surface of the interposer 200 facing away from the DMD chip 100, so as to dissipate heat from the interposer 200.

In this application, the movable circumference 290 is located within the enclosure of the contacts 220 to ensure connection between the contacts 220 on the outer layer and the inner layer of the interposer 200. The connection hole 230 is located outside the movable circumference 390, so that the contact 220 is prevented from deforming in the movable range of the conductive spring pin 330, and the flatness of the contact 220 is ensured, thereby effectively ensuring the effective contact between the conductive spring pin 330 and the contact 220, and effectively ensuring the quality of signal transmission between the DMD chip 100 and the adapter plate 200 and the reliability of the optical-mechanical assembly.

When the connection holes 230 are disposed on the diagonal of the contacts 220, or on the diagonal line or the extension line of the diagonally disposed contacts 220, the connection holes are disposed with a sufficient gap on the movable circumference 390 of the adapter plate 200.

When the connection holes 230 are arranged in a polygonal shape or a circular shape, there is sufficient gap between the diagonally arranged contacts 220 for arranging the via holes. The current-carrying capacity of the via hole is large, and the connection between the outer layer and the inner layer of the adapter plate 200 is ensured. The larger the gap, the larger the via can be placed to ensure that a sufficiently large current can flow between the outer and inner layers of the interposer 200.

While the present application has been described with reference to several exemplary embodiments, it is understood that the terminology used is intended to be in the nature of words of description and illustration rather than of limitation. As the present application may be embodied in several forms without departing from the spirit or essential attributes thereof, it should be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the metes and bounds of the claims, or equivalence of such metes and bounds are therefore intended to be embraced by the appended claims.

The foregoing description, for purposes of explanation, has been presented in conjunction with specific embodiments. However, the above discussion in some examples is not intended to be exhaustive or to limit the embodiments to the precise forms disclosed above. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles and the practical application, to thereby enable others skilled in the art to best utilize the embodiments and various embodiments with various modifications as are suited to the particular use contemplated.

Claims

An opto-mechanical assembly, comprising:

a DMD chip;

one surface of the socket is connected with the DMD chip, and the other surface of the socket is convexly provided with a positioning column and a conductive spring needle;

the adapter plate is provided with a positioning hole matched with the positioning column and a plurality of contacts propped against the conductive spring needle; a gap is formed between the contacts; the positioning holes are in clearance fit with the positioning columns, so that the conductive spring pins are offset on the contacts to form movable circumferences, and the movable circumferences are located in the enclosing range of the contacts; the surface of the adapter plate, which is provided with the contacts, is provided with connecting holes corresponding to the contacts, so as to be used for connecting the outer layer and the inner layer of the adapter plate, and the connecting holes are positioned in gaps between the contacts.
The opto-mechanical assembly of claim 1, the contacts being of regular polygonal configuration, the contacts having a number of sides greater than four.
The opto-mechanical assembly of claim 2, a plurality of the contacts being distributed in a rectangular array; the connecting holes are through holes and are positioned in gaps between diagonally arranged contacts.
A light engine assembly according to claim 3, wherein the aperture of the via is circular, and the center of the via is located on a line connecting the centers of the diagonally arranged contacts or an extension of the center line.
The opto-mechanical assembly of claim 3, the via being tangential to an edge of at least one of the contacts.
A opto-mechanical assembly according to claim 3, the contacts being of regular octagonal configuration, the inscribed circles of the contacts having a diameter of 0.75mm, the vias having a diameter of greater than or equal to 0.2mm.
The opto-mechanical assembly of claim 1, the socket further comprising a housing, the positioning posts and the conductive pins are disposed on the housing, two ends of the conductive pins respectively extend beyond two sides of the housing, and two ends of the conductive pins respectively abut against contacts on the adapter plate and the DMD chip.
The opto-mechanical assembly of claim 7, the conductive spring pin comprising a limiting portion disposed within the housing and two abutting portions bent at two ends of the limiting portion, the abutting portions being bent and connected to the limiting portion such that the conductive spring pin has elasticity; the abutment protrudes from the housing.
The optomechanical assembly of claim 1, further comprising a heat sink disposed on a side of the interposer facing away from the DMD chip.
The optomechanical assembly of claim 1, further comprising a lens unit electrically connected to the DMD chip for receiving the digital light signal transmitted by the DMD chip and projecting the digital light signal outward after amplifying the digital light signal.
A display device comprising a display screen, and the opto-mechanical assembly of any one of claims 1-10.