CN117558554A

CN117558554A - Bus capacitor shell of integrated water channel, integrated assembly and preparation method of integrated assembly

Info

Publication number: CN117558554A
Application number: CN202311848216.9A
Authority: CN
Inventors: 刘真兵; 赵奔奔
Original assignee: Leadrive Technology Shanghai Co Ltd
Current assignee: Leadrive Technology Shanghai Co Ltd
Priority date: 2023-12-29
Filing date: 2023-12-29
Publication date: 2024-02-13

Abstract

The invention provides a bus capacitor shell of an integrated water channel, an integrated assembly and a preparation method thereof, which relate to the technical field of capacitor heat dissipation structures and are integrally injection molded; comprises a main body and a limiting wall, wherein the main body is made of plastic materials; the limiting wall is arranged on the bottom surface of the main body and is perpendicular to the bottom surface of the main body, surrounds the bottom surface of the main body along the circumferential direction of the bottom surface of the main body and forms a limiting area with a downward opening with the bottom surface of the main body, and the limiting area is used for accommodating the capacitor core; the top surface of main part is sunk inwards and is provided with the heat dissipation water course, including the water inlet end and the play water tip that are connected in the heat dissipation water course, still includes to inlay between water inlet end and play water tip and has the metal heat-conducting plate that runs through to the bottom surface of main part, and water inlet end and play water tip communicate respectively outside the main part, and the heat dissipation water course covers in vertical direction spacing region. After the technical scheme of the invention is adopted, the integrated component can integrate all functional characteristics, reduce the volume occupation, and simultaneously remarkably improve the capacity of heat dissipation of the capacitor through integrating the metal heat conducting plate.

Description

Bus capacitor shell of integrated water channel, integrated assembly and preparation method of integrated assembly

Technical Field

The invention relates to the technical field of capacitor heat dissipation structures, in particular to a bus capacitor shell of an integrated water channel, an integrated assembly and a preparation method of the bus capacitor shell.

Background

In the motor controller, the defects of large volume, heavy weight and the like of a bus capacitor are the biggest obstacle to the miniaturization of an electric control, and good capacitor heat dissipation and packaging structures are required to be arranged, so that the volume of the capacitor can be effectively reduced, the electric control high power density is realized, and the product is designed in a platform manner and is low in cost. However, when the capacitor is designed, especially when the capacitor is matched with a power module, a radiator or a radiating water channel and the like are arranged outside the shell of the capacitor, so that the whole capacitor occupies a large volume, and the arrangement of the module is not facilitated.

Disclosure of Invention

In order to overcome the technical defects, the invention aims to provide a bus capacitor shell of an integrated water channel, an integrated assembly and a preparation method thereof, which solve the problems that the existing capacitor shell is additionally provided with a radiating water channel or a radiator, the occupied volume is large and the module arrangement is inconvenient.

The invention discloses a bus capacitor shell of an integrated water channel, which is characterized by comprising a main body and a limiting wall,

the main body and the limiting wall are made of plastic materials;

the limiting wall is arranged on the bottom surface of the main body and is perpendicular to the bottom surface of the main body, the limiting wall surrounds the bottom surface of the main body along the circumferential direction of the bottom surface of the main body and forms a limiting area with a downward opening with the bottom surface of the main body, and the limiting area is used for accommodating the capacitor core;

the top surface of main part is sunk inwards and is provided with the heat dissipation water course, including the end of intaking and the play water tip that are connected in the heat dissipation water course, still include the water tip of intaking with go out to inlay between the water tip and run through to the metal heat-conducting plate of the bottom surface of main part, intake the end with go out the water tip and communicate respectively outside the main part, the heat dissipation water course covers in vertical direction spacing region.

Preferably, the water inlet end part is communicated with a water inlet interface, the water inlet interface is perpendicular to the water inlet end part, and the water inlet interface extends out of the bottom surface of the main body;

the water outlet end part is communicated with a water outlet interface, the water outlet interface is perpendicular to the water outlet end part, and the water outlet interface extends out of the bottom surface of the main body.

Preferably, the bonding surface of the metal heat-conducting plate and the heat-dissipating water channel is glued by a spot adhesive, so that the bonding surface of the metal heat-conducting plate and the heat-dissipating water channel is sealed.

Preferably, a positioning part is arranged on one side of the top surface of the main body in an upward protruding manner along the vertical direction, at least one mounting groove is formed in the mounting surface of the positioning part, and the mounting groove is used for internally arranging a current sensor;

and sensing holes are formed in two sides of the mounting groove along the horizontal direction, and are used for being inserted into external terminals of the power module.

Preferably, a plurality of metal nuts for connecting the power module are embedded on the top surface of the main body along the two sides of the heat dissipation water channel.

The invention also discloses an integrated component, which comprises the bus capacitor shell, wherein the capacitor core is packaged in the limit area;

the power module is connected to the top surface of the main body, covers the heat dissipation water channel in the vertical direction, and is connected with the capacitor core through a copper bar.

Preferably, an insulating film is disposed between the capacitor core and the metal heat-conducting plate.

Preferably, one end of the copper bar is connected with the capacitor core, and the other end of the copper bar is bent towards the top surface of the main body so as to be connected with the power module.

The invention also discloses a preparation method of the bus capacitor shell of the integrated water channel, which is characterized by comprising the following steps of,

placing a metal heat-conducting plate in a target insert area in a preset mold, and injecting plastic materials into the preset mold;

and moving the preset die up and down along the direction vertical to the top surface of the main body to enable the preset die to be demolded, so as to obtain the bus capacitor shell.

The invention also discloses a preparation method of the integrated component, which is characterized by comprising the following steps of,

obtaining a capacitor core, a bus capacitor shell as described above or a bus capacitor shell obtained by the preparation method as described above;

fixing the bus capacitor shell through a preset tool, mounting a copper bar on one side of the limiting area, and limiting the bus capacitor shell in the limiting area through the capacitor core;

epoxy resin is filled into the limit area, and after the epoxy resin is cured for 6 hours at 100 ℃, the preset tooling is demolded;

and fixing the power module on the bus capacitor shell and connecting the power module with the capacitor core through a copper bar.

After the technical scheme is adopted, compared with the prior art, the method has the following beneficial effects:

the bus capacitor shell provided by the invention can be formed by one-step injection molding, and can be integrated with a bus capacitor, a power module, a radiating water channel and a current sensor at the same time, so that post-treatment such as welding and machining is not needed, the sealing is reliable, the cost is low, and the bus capacitor shell is suitable for batch production. The bus capacitor shell made of plastic materials has good corrosion resistance, stable reliability and light weight. Meanwhile, a metal heat-conducting plate is added into the heat-radiating water channel, so that the heat-radiating efficiency of the heat-radiating water channel is improved.

Drawings

FIG. 1 is a schematic view of a busbar capacitor housing for an integrated waterway according to the present invention;

FIG. 2 is a schematic view of a limiting area in a busbar capacitor shell of an integrated waterway according to the present invention;

FIG. 3 is a schematic view of the structure of the bottom surface of the busbar capacitor housing of the integrated waterway according to the present invention;

FIG. 4 is a schematic view of a positioning portion of an integrated component according to the present invention;

FIG. 5 is a schematic illustration of the fabrication of an integrated assembly of the present invention;

fig. 6 is a schematic structural diagram of an integrated component according to the present invention.

Reference numerals: 1-a main body; 2-limiting walls; 3-a limit area; 41-a water inlet end; 42-a metal heat-conducting plate; 43-water outlet end; 411-water inlet interface; 431-water outlet interface; 5-a positioning part; 51-mounting slots; 52-a sensing hole; 53-metal nut; 6-copper bars.

Detailed Description

Advantages of the invention are further illustrated in the following description, taken in conjunction with the accompanying drawings and detailed description.

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.

It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "responsive to a determination", depending on the context.

In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

In the description of the present invention, unless otherwise specified and defined, it should be noted that the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, mechanical or electrical, or may be in communication with each other between two elements, directly or indirectly through intermediaries, as would be understood by those skilled in the art, in view of the specific meaning of the terms described above.

In the following description, suffixes such as "module", "component", or "unit" for representing elements are used only for facilitating the description of the present invention, and are not of specific significance per se. Thus, "module" and "component" may be used in combination.

As shown in fig. 1 to 3, the invention discloses a busbar capacitor shell of an integrated water channel, which is characterized by comprising a main body 1 and a limiting wall 2,

the main body 1 and the limiting wall 2 are made of plastic materials;

the limiting wall 2 is arranged on the bottom surface of the main body 1 and is perpendicular to the bottom surface of the main body 1, the limiting wall 2 surrounds the bottom surface of the main body 1 along the circumferential direction and forms a limiting area 3 which is opened downwards with the bottom surface of the main body 1, and the limiting area 3 is used for accommodating a capacitor core;

the top surface of main part 1 is sunk to be provided with the heat dissipation water course, including the end 41 of intaking that is connected with play water tip 43 in the heat dissipation water course, still include intake end 41 with go out water tip 43 between inlay the metal heat-conducting plate 42 that runs through to the bottom surface of main part 1, intake end 41 with go out water tip 43 and communicate respectively outside the main part, the heat dissipation water course covers in vertical direction spacing region.

Specifically, the bus capacitor shell is formed by one-time injection molding of an embedded metal insert. The integrated bus capacitor, the heat dissipation water channel, the power module and the current sensor can be integrated. The main body 1 can be approximately rectangular, a radiating water channel is formed in a recessed groove in the top surface of the main body 1, and the limiting wall 2 surrounds the bottom surface of the main body 1 to form a limiting area 3. The inside of the spacing wall 2 may be provided with a plurality of spacing bars protruding into the spacing area 3 as shown in fig. 2 to help secure the capacitive core. The main body 1 and the limiting wall 22 are made of plastic materials, and the anti-corrosion device has the advantages of good corrosion resistance, stable reliability and light weight. Further, considering that the efficiency of heat dissipation directly through plastic materials is limited, the metal heat-conducting plate 42 penetrating to the bottom surface is embedded in the heat dissipation water channel, and the heat dissipation water channel vertically covers the limit area 3, it can be understood that after the capacitor core is accommodated in the limit area 3, the metal heat-conducting plate 42 is positioned above the capacitor core, and the capacitor core is contacted with the bottom surface of the metal heat-conducting plate 42 from the inside of the limit area 3; when the cooling liquid enters the heat dissipation channel, the capacitor core can transfer heat to the heat dissipation channel through the metal heat conducting plate 42, and heat dissipation efficiency is improved.

In a preferred embodiment, the water inlet end 41 is communicated with a water inlet port 411, the water inlet port 411 is perpendicular to the water inlet end 41, and the water inlet port 411 extends beyond the bottom surface of the main body 1;

the water outlet end 43 is communicated with a water outlet port 431, the water outlet port 431 is perpendicular to the water outlet end 43, and the water outlet port 431 extends out of the bottom surface of the main body 1.

Specifically, the heat dissipation water channel is arranged along the length direction and the width direction of the main body 1 in the same direction, the width and the length of the heat dissipation water channel are slightly smaller than the length and the width of the main body 1, and two ends of the heat dissipation water channel extend out of the main body 1 respectively to control water inlet and water outlet. That is, in this embodiment, the water inlet ports 411 and the water outlet ports 431 are respectively extended to the outside of the bottom surface of the main body 1, and are sequentially connected and communicated from the inside of the heat dissipation water channel to the outside of the heat dissipation water channel, and the water inlet ports 411 and the water outlet ports 431 can be respectively used for externally connecting a water inlet device and a water outlet device, so that the cooling liquid flows in the heat dissipation water channel. Through the heat dissipation water channel after the setting, the integrated injection molding can be integrated on the bus capacitor shell, and additional welding is not needed.

In a preferred embodiment, the bonding surface of the metal heat-conducting plate 43 and the heat dissipation water channel is glued by a spot adhesive, so that the bonding surface of the metal heat-conducting plate 43 and the heat dissipation water channel is sealed.

Because the heat dissipation water channel is made of plastic materials, the metal heat-conducting plate 42 is made of metal materials, and gaps can be generated on the joint surface of the heat dissipation water channel and the metal heat-conducting plate 42 due to the difference of thermal expansion coefficients of different materials in the using process of the bus capacitor shell, and the situation can generate the risk that cooling liquid enters the limit area 3 from the heat dissipation water channel to damage the capacitor core. Therefore, the bonding surface embedded between the heat dissipation water channel and the metal heat conducting plate 42 is glued by a glue, so that the bonding surface is sealed, the heat dissipation water channel and the limit area 3 are further isolated, and cooling liquid is prevented from entering the limit area 3. Specifically, a glue groove surrounding the metal heat-conducting plate 42 can be reserved on the joint surface of the heat-dissipating water channel and the metal heat-conducting plate 42, glue is injected into the glue groove, the glue is solidified at high temperature, and sealing is achieved by bonding the heat-dissipating water channel and the metal heat-conducting plate 42. The width of the glue groove is 2-2.5 mm, and the height is 1.5-2 mm.

In a preferred embodiment, as shown in fig. 3, a plurality of staggered reinforcing ribs are provided on the bottom surface of the main body 1, and the plurality of reinforcing ribs extend to the edge of the limit area 3 with the metal heat-conducting plate 42 as the center, so as to further enhance the stability of the bus capacitor shell.

In a preferred embodiment, a positioning portion 5 is provided on one side of the top surface of the main body 1 in an upward protruding manner along a vertical direction, at least one mounting groove 51 is provided on a mounting surface of the positioning portion 5, and the mounting groove 51 is used for internally providing a current sensor;

sensing holes 52 are formed on two sides of the mounting groove 51 penetrating in the horizontal direction, and the sensing holes 52 are used for inserting external terminals of the power module.

Specifically, at least one mounting groove 51 is provided in the positioning portion 5, and any one of the mounting grooves 51 may be used to provide one current sensor. As shown in fig. 4, a plurality of current sensors may be soldered to a PCB board, respectively, and the PCB board is mounted above the positioning portion 5 such that the plurality of current sensors are simultaneously placed in the plurality of mounting grooves 51. When the power module is installed on the bus capacitor shell, the external terminal of any power module is inserted into the sensing hole 52 of any installation groove 51 and penetrates through the installation groove 51, so that the external terminal of the power module is contacted with the current sensor arranged in the installation groove 51, the current sensor can monitor the output current of the power module, and the working state of the power module is timely obtained.

In a preferred embodiment, a plurality of metal nuts 53 for connecting the power module are embedded on the top surface of the main body 1 along both sides of the heat dissipation channel. The power module can be fixed on the bus capacitor shell through the insertion of screws into the metal nuts 53 for matching.

The invention also discloses an integrated component, which comprises the bus capacitor shell, wherein the capacitor core is packaged in the limit area 3;

the power module is connected to the top surface of the main body 1, covers the heat dissipation water channel in the vertical direction, and is connected with the capacitor core through a copper bar 6.

In a preferred embodiment, an insulating film is provided between the capacitive core and the metal heat-conducting plate 42.

Specifically, after the capacitor core is accommodated in the limit area 3, the metal heat-conducting plate 42 is located above the capacitor core, and the capacitor core is in contact with the bottom surface of the metal heat-conducting plate 42 from the inside of the limit area 3. An insulating isolation process is required between the capacitive core and the metal heat-conducting plate 42. For example, an insulating barrier film is applied to the contact surface between the capacitor core and the metal heat-conducting plate 42, or an insulating coating is applied to the contact surface between the capacitor core and the metal heat-conducting plate 42.

In a preferred embodiment, one end of the copper bar 6 is connected to the capacitor core, and the other end is bent toward the top surface of the main body 1 to be connected to the power module. In addition, the copper bar 6 is bent at the joint of the capacitor core, is attached to the side surface of the bus capacitor shell and extends upwards to the power module, namely, is arranged on one side of the bus capacitor shell, so that a copper bar 6 support frame is conveniently arranged or other modules are connected, and the application scene of the integrated assembly is improved.

The integrated assembly provided by the invention integrates the busbar capacitor, the radiating water channel and the power module, utilizes the busbar capacitor shell integrally formed, has good corrosion resistance, stable reliability and light weight, and does not need a side pumping and discharging core or an additional welding water channel. And realize heat transfer through embedded metal heat-conducting plate in the heat dissipation water course, radiating efficiency is higher, and space utilization is higher, and further integrated component compact structure can be assembled with other modules or components under the motor control, solves the volume occupation that current extra arrangement heat dissipation water course or radiator led to great, the inconvenient problem of module arrangement.

placing a metal heat-conducting plate 42 in a target insert region in a pre-set mold into which a plastic material is injected;

and moving the preset die up and down along the direction vertical to the top surface of the main body 1 to enable the preset die to be demolded, so as to obtain the bus capacitor shell.

Specifically, the water inlet 411 and the water outlet 431 of the bus capacitor shell are communicated with the heat dissipation water channel, so that the whole bus capacitor shell is free of a closed cavity, integral injection molding is facilitated, the water inlet 411 and the water outlet 431 are perpendicular to the heat dissipation water channel, a preset mold can be moved up and down along the direction perpendicular to the top surface of the main body 1 for demolding, and the drawing size (namely, the integral moving distance of the bus capacitor shell during demolding) required by the preparation method can be effectively reduced.

Additionally, in embodiments employing metal nuts 53, after placing metal nuts 53 and metal heat-conducting plates 42, respectively, in the target insert areas in the pre-set mold, plastic material is injected into the pre-set mold.

fixing the bus capacitor shell through a preset tool, installing a copper bar on one side of the limiting area, and limiting the capacitor core in the limiting area;

Specifically, as shown in fig. 5 (a), a bus capacitor shell is obtained, a copper bar is installed at one side of a limiting area, and the capacitor core which is subjected to insulation wrapping is limited in the limiting area. The preset tool is optionally set to be a plate-shaped structure, the size of the preset tool can be slightly larger than the length and the width of the bus capacitor shell, and the preset tool is used for being attached to the limiting wall on the bus capacitor shell, so that the capacitor core is limited in a limiting area and cannot be moved out.

Since the capacitor core can also move in the limit area at this time, it needs to be fixed, as shown in fig. 5 (b), epoxy resin is poured into the limit area, and curing is continued for 6H at 100 ℃. Specifically, a coating or film can be coated on the surface of the preset tooling, which is in contact with the busbar capacitor shell, so as to prevent the preset tooling and the glue filling from adhering, and facilitate demoulding.

The integrated assembly obtained after curing by filling epoxy resin and demoulding by a preset fixture is shown in fig. 5 (c) and 6. The capacitor core is fixed in the limit area and integrated on the capacitor shell.

The power module is fixed on the bus capacitor shell and is connected with the capacitor core through a copper bar. It should be noted that, since the power module and the capacitor core are disposed on two sides of the bus capacitor case, the step may be completed before the capacitor core is assembled, or may be completed after the capacitor core is assembled, which may be selected according to the specific implementation scenario. The power module can be applied to various existing power modules, and other modules can be used for replacing the power module and are connected and matched with the capacitor shell.

Based on the preparation method of the integrated component, the integrated component integrating the bus capacitor, the power module and the radiating water channel can be obtained, and the problems that the existing capacitor shell is additionally provided with the radiating water channel or the radiator, the occupied volume is large and the module arrangement is inconvenient are solved. And no post-treatment such as welding and machining is needed, the sealing is reliable, the cost is low, and the method is suitable for batch production.

It should be noted that the embodiments of the present invention are preferred and not limited in any way, and any person skilled in the art may make use of the above-disclosed technical content to change or modify the same into equivalent effective embodiments without departing from the technical scope of the present invention, and any modification or equivalent change and modification of the above-described embodiments according to the technical substance of the present invention still falls within the scope of the technical scope of the present invention.

Claims

1. A bus capacitor shell of an integrated water channel is characterized by comprising a main body and a limiting wall,

the main body and the limiting wall are made of plastic materials;

2. The bus capacitor case of claim 1, wherein,

the water inlet end part is communicated with a water inlet interface, the water inlet interface is vertical to the water inlet end part, and the water inlet interface extends out of the bottom surface of the main body;

3. The bus capacitor case of claim 1, wherein,

and the bonding surface of the metal heat-conducting plate and the heat-radiating water channel is glued by a spot adhesive, so that the bonding surface of the metal heat-conducting plate and the heat-radiating water channel is sealed.

4. The bus capacitor case of claim 1, wherein,

one side of the top surface of the main body is provided with a positioning part in an upward protruding mode along the vertical direction, a mounting surface of the positioning part is provided with at least one mounting groove, and the mounting groove is used for internally arranging a current sensor;

5. The bus capacitor case of claim 1, wherein,

and a plurality of metal nuts used for connecting the power modules are embedded on the top surface of the main body along the two sides of the radiating water channel.

6. An integrated assembly comprising the busbar capacitor case of any one of claims 1-5, encapsulating a capacitor core within the containment area;

7. The integrated assembly of claim 7, wherein the integrated assembly comprises,

an insulating film is arranged between the capacitor core and the metal heat conducting plate.

8. The integrated assembly of claim 7, wherein the integrated assembly comprises,

one end of the copper bar is connected with the capacitor core, and the other end of the copper bar is bent towards the top surface of the main body so as to be connected with the power module.

9. A method for preparing a bus capacitor shell integrated with a water channel, which is characterized by comprising the following steps of,

10. A process for the preparation of an integrated component, characterized in that it comprises the steps of,

obtaining a capacitor core, a busbar capacitor shell according to any one of claims 1 to 5 or a busbar capacitor shell obtained by the manufacturing method according to claim 9;