CN219350212U

CN219350212U - High-integration capacitor assembly structure for driving motor controller

Info

Publication number: CN219350212U
Application number: CN202223517463.4U
Authority: CN
Inventors: 陈雷; 陈登峰; 周诗君; 叶茂
Original assignee: Shanghai Auto Edrive Co Ltd; Shanghai Auto Edrive Engineering Technology Research Center; Shanghai Edrive Co Ltd
Current assignee: Shanghai Auto Edrive Co Ltd; Shanghai Auto Edrive Engineering Technology Research Center; Shanghai Edrive Co Ltd
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-07-14
Anticipated expiration: 2032-12-28

Abstract

The utility model relates to a high-integration capacitor assembly structure for a driving motor controller, which comprises a heat dissipation base plate (1) for integrating a power IGBT module (2) and a thin film capacitor (4), wherein a module heat dissipation groove (1-1) is formed in the heat dissipation base plate (1), a capacitor encapsulating cavity (1-2) is formed below the heat dissipation base plate (1), the power IGBT module (2) is located above the module heat dissipation groove (1-1), and the thin film capacitor (4) is arranged in the capacitor encapsulating cavity (1-2). The module radiating groove (1-1) is of a rectangular groove structure, and the capacitor encapsulating cavity (1-2) is of a cuboid structure. Compared with the prior art, the utility model simplifies the number of components in the motor controller, reduces the occupation of the control internal plane space, reduces the installation procedure of the production line of the controller, realizes the development requirements of miniaturization and integration of the controller, and reduces the production and assembly cost of the controller.

Description

High-integration capacitor assembly structure for driving motor controller

Technical Field

The utility model relates to the field of automobile parts, in particular to a high-integration capacitor assembly structure for a driving motor controller.

Background

With the rapid development of new energy technologies, the miniaturization and integration trend of new energy motor controllers are increasing. The power IGBT module, the thin film capacitor and the radiator are used as main components in the motor controller, the space layout mode directly influences the integration level in the controller, and meanwhile, the heat dissipation effect of the power IGBT module and the thin film capacitor is determined.

Inside traditional motor controller, in the integrated control box of heat dissipation water course generally, power IGBT module direct mount is in heat dissipation water course top, and thin film electric capacity and power IGBT module lay in the box inside side by side. In the layout mode, although cooling and heat dissipation of the power IGBT can be effectively realized, the film capacitor can only be fixed in a non-water channel covered area in the box body. The thin film capacitor can only indirectly realize heat dissipation through the controller box body, and the heat dissipation effect is not ideal. Secondly, the layout mode also presupposes that the power IGBT module and the film capacitor are required to be respectively arranged in the controller box body, the occupied planar space in the box body is large, the controller integration level is not high, the control and installation procedures are inconvenient to simplify, the manufacturing cost of the controller cannot be reduced, and the development requirements of miniaturization and integration of the controller are not facilitated.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provide the high-integration capacitor component structure for the driving motor controller, which simplifies the number of components in the motor controller, reduces the occupation of the control inner plane space, reduces the installation procedure of the production line of the controller, not only realizes the development requirements of miniaturization and integration of the controller, but also reduces the production and assembly cost of the controller.

The aim of the utility model can be achieved by the following technical scheme:

the utility model designs a high-integration high-efficiency heat dissipation base plate, a heat dissipation groove of a power IGBT module is arranged above the heat dissipation base plate, and a filling and sealing groove of a thin film capacitor is arranged at the bottom of the heat dissipation base plate. The cooling liquid passes through the middle of the heat dissipation bottom plate, so that the dual heat dissipation effect on the power IGBT module and the film capacitor is realized. Meanwhile, the power IGBT module is arranged above the heat dissipation groove of the heat dissipation bottom plate in a bolt fixing mode, and the thin film capacitor is filled in the heat dissipation cavity of the heat dissipation bottom plate in a filling and sealing mode, so that the integrated design of the power IGBT module, the thin film capacitor and the heat dissipation bottom is realized, and the specific scheme is as follows:

the utility model provides a driving motor controller is with high integrated electric capacity subassembly structure, this structure is including being used for the radiating bottom plate of integrated power IGBT module and film electric capacity, is equipped with the module radiating groove on this radiating bottom plate, and radiating bottom plate below is equipped with electric capacity embedment cavity, power IGBT module be located module radiating groove top, film electric capacity setting in electric capacity embedment cavity.

Further, the module radiating groove is of a rectangular groove structure, and the capacitor encapsulating cavity is of a cuboid structure.

Further, the power IGBT module is located right above the module radiating groove, and the capacitor encapsulating cavity is located at a position corresponding to the module radiating groove.

Further, a water inlet is formed in one side, located in the capacitor encapsulation cavity, of the radiating bottom plate, and a water outlet is formed in the other side, located in the capacitor encapsulation cavity, of the radiating bottom plate;

the water inlet and the water outlet are communicated with the module radiating groove.

Further, a water channel cover plate is arranged on one side, far away from the water inlet, of the heat radiation bottom plate, the water outlet is arranged at one end of the water channel cover plate, and a cooling liquid channel used for communicating the module heat radiation groove and the water outlet is arranged on the water channel cover plate.

Further, the water inlet is of a through hole structure.

Further, the heat dissipation bottom plate is also provided with a transfer support, and the transfer support is fixed on the heat dissipation bottom plate close to a terminal of the power IGBT module; and the output copper bar of the thin film capacitor is electrically connected with the terminal of the power IGBT module through the switching support.

Further, the thin film capacitor is fixed in the capacitor encapsulating cavity through epoxy pouring sealant.

Further, the heat dissipation bottom plate is an aluminum heat dissipation plate.

Further, the water channel cover plate is an aluminum plate welded by stirring friction.

Compared with the prior art, the utility model has the following advantages:

(1) In the utility model, the radiating bottom plate is provided with a double-layer radiating structure, the upper layer is provided with a power module radiating groove, and the lower side is integrated with a thin film capacitor radiating cavity;

(2) According to the utility model, the upper surface of the radiating bottom plate is provided with the radiating groove for module installation, and the lower surface of the radiating bottom plate is provided with the cavity for capacitor encapsulation, so that the integrated integration of the power device can be realized, the number of internal parts of the controller is reduced, and the assembly process is simplified;

(3) According to the utility model, the thin film capacitor is directly encapsulated in the cavity at the bottom of the radiating bottom plate, so that the traditional capacitor plastic shell is omitted, the manufacturing cost of the capacitor is reduced, the heat conduction speed of the capacitor core is also improved, and the radiating effect of the thin film capacitor is greatly improved.

Drawings

FIG. 1 is an exploded view of a capacitor assembly according to embodiment 1;

FIG. 2 is a schematic front view of a heat dissipating bottom plate in embodiment 1;

FIG. 3 is a schematic diagram of the back side of the heat dissipating bottom plate in embodiment 1;

the reference numerals in the figures indicate: the heat dissipation base plate 1, the module heat dissipation groove 1-1, the capacitor encapsulation cavity 1-2, the water channel cover plate 1-3, the water inlet 1-4, the water outlet 1-5, the power IGBT module 2, the switching support 3 and the thin film capacitor 4.

Detailed Description

The utility model will now be described in detail with reference to the drawings and specific examples. The present embodiment is implemented on the premise of the technical scheme of the present utility model, and a detailed implementation manner and a specific operation process are provided, but the protection scope of the present utility model is not limited to the following embodiments.

Example 1

As shown in fig. 1, the heat dissipation base plate 1 is an aluminum heat dissipation plate, and is mainly used for integrating the power IGBT module 2 and the thin film capacitor 4. As shown in fig. 2, the heat dissipation base plate 1 is a rectangular block-shaped structural member, the rectangular groove on the upper surface is a module heat dissipation groove 1-1, and the rectangular cavity on the lower surface corresponding to the module heat dissipation groove 1-1 is a capacitor encapsulation cavity 1-2.

As shown in FIG. 3, the heat dissipation bottom plate 1 is provided with a water inlet 1-4 of the high-efficiency heat dissipation bottom plate 1 at the left side of the capacitor encapsulation cavity 1-2, a water channel cover plate 1-3 is provided at the right side of the capacitor encapsulation cavity 1-2, and a water outlet 1-5 of the high-efficiency heat dissipation bottom plate 1 is provided at the right end of the water channel cover plate 1-3. The water inlet 1-4 is of a through hole structure and is communicated with the module radiating groove 1-1. The water channel cover plate 1-3 is an aluminum plate subjected to friction stir welding, a cooling liquid channel is arranged below the water channel cover plate 1-3, and the cooling liquid channel is communicated with the module cooling groove 1-1 and the water outlet 1-5;

as shown in fig. 1, a power IGBT module 2 is mounted directly above a heat dissipation groove 1-1 on the upper surface of a high-efficiency heat dissipation base plate 1, a terminal of a transfer support 3 close to the power IGBT module 2 is fixed on the heat dissipation base plate 1, and a thin film capacitor 4 is fixed in a capacitor potting cavity 1-2 at the bottom of the heat dissipation base plate 1 through an epoxy potting adhesive, so that heat of the thin film capacitor 4 is rapidly transferred to the capacitor potting cavity 1-2. The output copper bar of the thin film capacitor 4 is electrically connected with the terminal of the power IGBT module through the switching support 3.

The assembly mode of this scheme: firstly, the transfer support 3 is fixed to the edge position of the upper surface of the high-efficiency heat dissipation bottom plate 1 through bolts, and then the power IGBT module 2 is fixed to the position right above the module heat dissipation groove 1-1, and the upper surface of the module heat dissipation groove 1-1 is sealed. Next, the thin film capacitor 4 is placed horizontally into the capacitor potting cavity 1-2, and the thin film capacitor 4 is fixed by epoxy potting adhesive. Finally, on the transfer support 3, the output terminal of the thin film capacitor 4 and the terminal of the power IGBT module 2 are fastened through a bolt fastener, so that electrical connection is realized. Thus, the high-integration capacitor assembly structure is assembled.

During operation, the cooling liquid flows into the module radiating groove 1-1 from the water inlet 1-4 of the high-efficiency radiating bottom plate 1, so that the power IGBT module above the module radiating groove 1-1 is cooled, and the thin film capacitor 4 below the module radiating groove 1-1 is cooled. After the cooling liquid flows out from the module radiating groove 1-1, the cooling liquid flows through the water outlet 1-5 through the channel below the water channel cover plate 1-3.

Example 2

Referring to fig. 1-3, a high-integration capacitor assembly structure for a driving motor controller comprises a heat dissipation base plate 1 for integrating a power IGBT module 2 and a thin film capacitor 4, wherein a module heat dissipation groove 1-1 is formed in the heat dissipation base plate 1, a capacitor encapsulation cavity 1-2 is formed below the heat dissipation base plate 1, the power IGBT module 2 is located above the module heat dissipation groove 1-1, and the thin film capacitor 4 is arranged in the capacitor encapsulation cavity 1-2.

The power IGBT module 2 is positioned right above the module radiating groove 1-1, and the capacitor encapsulating cavity 1-2 is positioned at a position corresponding to the module radiating groove 1-1. A water inlet 1-4 is arranged on one side of the heat radiation bottom plate 1, which is positioned on the capacitor encapsulation cavity 1-2, and a water outlet 1-5 is arranged on the other side of the capacitor encapsulation cavity 1-2; the water inlet 1-4 and the water outlet 1-5 are communicated with the module heat dissipation groove 1-1. One side of the radiating bottom plate 1, which is far away from the water inlet 1-4, is provided with a water channel cover plate 1-3, the water outlet 1-5 is arranged at one end of the water channel cover plate 1-3, and the water channel cover plate 1-3 is provided with a cooling liquid channel for communicating the module radiating groove 1-1 and the water outlet 1-5.

The module radiating groove 1-1 is of a rectangular groove structure, and the capacitor encapsulating cavity 1-2 is of a cuboid structure. The water inlets 1-4 are through hole structures. The thin film capacitor 4 is fixed in the capacitor encapsulating cavity 1-2 through epoxy encapsulating glue. The heat dissipation base plate 1 is an aluminum heat dissipation plate. The water channel cover plate 1-3 is an aluminum plate which is welded by stirring friction.

The radiating bottom plate 1 is also provided with a switching support 3, and a terminal of the switching support 3, which is close to the power IGBT module 2, is fixed on the radiating bottom plate 1; the output copper bar of the thin film capacitor 4 is electrically connected with the terminal of the power IGBT module 2 through the switching support 3.

The above description is only a preferred embodiment of the present utility model, and is not intended to limit the utility model in any way, and any person skilled in the art may make modifications or alterations to the disclosed technical content to the equivalent embodiments. However, any simple modification, equivalent variation and variation of the above embodiments according to the technical substance of the present utility model still fall within the protection scope of the technical solution of the present utility model.

Claims

1. The high-integration capacitance assembly structure for the driving motor controller is characterized by comprising a radiating bottom plate (1) for integrating a power IGBT module (2) and a thin film capacitor (4), wherein a module radiating groove (1-1) is formed in the radiating bottom plate (1), a capacitor encapsulating cavity (1-2) is formed below the radiating bottom plate (1), the power IGBT module (2) is located above the module radiating groove (1-1), and the thin film capacitor (4) is arranged in the capacitor encapsulating cavity (1-2).

2. The high-integration capacitor assembly structure for the driving motor controller according to claim 1, wherein the module radiating groove (1-1) is of a rectangular groove structure, and the capacitor encapsulating cavity (1-2) is of a cuboid structure.

3. The high-integration capacitor assembly structure for the driving motor controller according to claim 1, wherein the power IGBT module (2) is located right above the module radiating groove (1-1), and the capacitor encapsulating cavity (1-2) is located at a position corresponding to the module radiating groove (1-1).

4. The high-integration capacitor assembly structure for the driving motor controller according to claim 1, wherein a water inlet (1-4) is arranged on one side of the capacitor encapsulation cavity (1-2) on the radiating bottom plate (1), and a water outlet (1-5) is arranged on the other side of the capacitor encapsulation cavity (1-2);

the water inlet (1-4) and the water outlet (1-5) are communicated with the module radiating groove (1-1).

5. The high-integration capacitor assembly structure for the driving motor controller according to claim 4, wherein a water channel cover plate (1-3) is arranged on one side, far away from the water inlet (1-4), of the heat dissipation base plate (1), the water outlet (1-5) is arranged at one end of the water channel cover plate (1-3), and a cooling liquid channel for communicating the module heat dissipation groove (1-1) and the water outlet (1-5) is arranged on the water channel cover plate (1-3).

6. The structure of a highly integrated capacitor assembly for a driving motor controller according to claim 4, wherein the water inlet (1-4) is a through hole structure.

7. The high-integration capacitor assembly structure for the driving motor controller according to claim 1, wherein the heat dissipation base plate (1) is further provided with a transfer support (3), and a terminal of the transfer support (3) close to the power IGBT module (2) is fixed on the heat dissipation base plate (1); the output copper bar of the thin film capacitor (4) is electrically connected with the terminal of the power IGBT module (2) through the switching support (3).

8. The high-integration capacitor assembly structure for the driving motor controller according to claim 1, wherein the thin film capacitor (4) is fixed in the capacitor encapsulation cavity (1-2).

9. The high-integration capacitor assembly structure for the driving motor controller according to claim 1, wherein the heat dissipation base plate (1) is an aluminum heat dissipation plate.

10. The structure of a highly integrated capacitor assembly for a driving motor controller according to claim 5, wherein the water channel cover plate (1-3) is an aluminum plate.