CN117555402A

CN117555402A - Wind scooper and network card cooling system

Info

Publication number: CN117555402A
Application number: CN202311501105.0A
Authority: CN
Inventors: 马俊; 李�诚; 谷成一; 孙志华
Original assignee: Shanghai Yunmai Xinlian Technology Co ltd; Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Center Co Ltd
Current assignee: Shanghai Yunmai Xinlian Technology Co ltd; Shandong Yunhai Guochuang Cloud Computing Equipment Industry Innovation Center Co Ltd
Priority date: 2023-11-10
Filing date: 2023-11-10
Publication date: 2024-02-13

Abstract

The invention discloses a wind scooper and a network card heat dissipation system, which are applied to a half-height card and comprise a first wind guiding part, a second wind guiding part and a third wind guiding part. The first induced draft part is arranged at the edge position of the half-height card; the second induced draft part is obliquely arranged at the end part of the first induced draft part in the direction away from the half height card; the third induced draft portion is arranged at the bottom of the second induced draft portion, and one side, far away from the second induced draft portion, of the third induced draft portion is connected with the edge position of the half-height clamp. The invention can keep the air duct on the half-height card, avoid generating an air duct bypass, solve the problem that the half-height card cannot fully dissipate heat only by using the baffle in the prior art, and improve the heat dissipation efficiency of the half-height card.

Description

Wind scooper and network card cooling system

Technical Field

The invention relates to the technical field of network card heat dissipation equipment, in particular to a wind scooper and a network card heat dissipation system.

Background

As the demands of computers for special-purpose cooperative chips (such as GPU, NPU, DPU) increase, the functional demands of the special-purpose cooperative chips increase, so that the heat consumption of the main chip increases gradually, which also makes it difficult for the main chip to dissipate heat. The form of the half-height card becomes the main delivery form of the network card due to the characteristics of small size, flexibility, cost advantage and the like, however, the heat dissipation means of the half-height card is also greatly limited due to the size limitation of the half-height card.

In the prior art, a heat dissipation device special for a half-height card is lacked, so that the half-height card is usually provided with a full-height baffle. As shown in fig. 1, when the full-height baffle is used for radiating the half-height card, all non-corresponding areas of the half-height card and the full-height baffle are not perforated, so that although the problem of air duct bypass when air flows enter from an IO port of the half-height card can be solved, when the air flows enter from the tail part of the half-height card, the air duct flows out from the non-corresponding areas of the half-height card and the full-height baffle through a panel of the half-height card, thereby causing the air duct bypass, and the problem that the air outlet is reduced and the air resistance is increased is also caused by the fact that all non-corresponding areas of the half-height card and the full-height baffle are not perforated; as shown in fig. 2, in the prior art, all openings of non-corresponding areas of the half-height card and the full-height baffle plate can be arranged, and the scheme can bypass the air duct no matter the direction of the air flow, so that the air quantity of the radiator is insufficient, and the air conditioner is only suitable for a main chip with low power consumption and low air quantity requirement.

Based on this, a new technical solution is needed to solve the problem that the prior art lacks a special device for sufficiently dissipating heat of the half-height card.

Disclosure of Invention

In view of the above, the embodiment of the invention provides a wind scooper and a network card heat dissipation system, so as to solve the problem that special equipment for fully dissipating heat of a half-high card is lacking in the prior art.

The embodiment of the invention provides the following technical scheme:

the embodiment of the invention provides a wind scooper, which is applied to a half-height card and comprises the following components:

the first air inducing part is arranged at the edge position of the half-height card;

the second air guiding part is obliquely arranged at the end part of the first air guiding part in the direction away from the half height card;

the third induced draft part is arranged at the bottom of the second induced draft part, and one side of the third induced draft part far away from the second induced draft part is connected with the edge position of the half height card.

Further, the wind scooper further includes:

and the fourth air inducing part is arranged at the end part of the second air inducing part far away from the first air inducing part.

Further, the fourth air inducing part is of an arc-shaped structure.

Further, the included angle between the extension line of the first induced draft portion and the extension line of the second induced draft portion is 16-26 degrees.

Further, a front end inclined plate is arranged on one side, away from the first air guiding part, of the third air guiding part.

Further, the first air inducing portion, the second air inducing portion and the third air inducing portion are integrally formed.

The invention also provides a network card heat dissipation system, which comprises:

the wind scooper according to any of the above;

the baffle, the baffle set up in the tip of wind scooper, the baffle with the second induced air portion of wind scooper corresponds the setting to be connected with one side that the first induced air portion was kept away from to the third induced air portion, wherein, be provided with on the baffle with the trompil region that the second induced air portion corresponds.

Further, the side edge, close to the baffle, of the fourth air guiding part of the air guiding cover is flush with the edge of the opening area.

Further, the network card heat dissipation system further includes:

the radiator is arranged on the half-height card, and the connection point of the first air guiding part and the second air guiding part of the air guiding cover is correspondingly arranged with one side of the radiator, which is close to the baffle plate.

Further, the heights of the first air guiding part, the second air guiding part and the fourth air guiding part of the air guiding cover are the same as the height of the radiator.

Compared with the prior art, the beneficial effects achieved by the at least one technical scheme adopted by the embodiment of the invention at least comprise:

according to the air guide cover, the first air guide part, the second air guide part and the third air guide part are arranged on the side part of the half-height card, so that the air flow direction on the half-height card can be conveniently controlled, the air duct is kept on the half-height card, the generation of an air duct bypass is avoided, the problem that the half-height card cannot sufficiently dissipate heat only by using the baffle in the prior art is solved, and the heat dissipation efficiency of the half-height card is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of a prior art full height baffle and half height card structure with no openings in non-corresponding areas;

FIG. 2 is a schematic view of a prior art structure of openings in non-corresponding areas of a full-height baffle and half-height card;

FIG. 3 is a schematic diagram of a wind scooper according to an embodiment of the present invention;

fig. 4 is a perspective view of a heat dissipation system of a network card according to an embodiment of the present invention;

fig. 5 is a top view (a) of a network card heat dissipation system according to an embodiment of the invention;

fig. 6 is a top view (second) of a network card heat dissipation system according to an embodiment of the invention;

fig. 7 is a top view (III) of a network card heat dissipation system according to an embodiment of the invention;

FIG. 8 is a graph showing the variation of the heat dissipation effect from the radiator to the baffle in the air inlet direction according to the embodiment of the present invention;

FIG. 9 is a graph showing the variation of the heat dissipation effect from the baffle to the radiator when the air inlet direction is in the embodiment of the invention;

the reference numerals of the present invention are as follows:

10. a wind scooper;

11. a first induced draft portion; 12. a second induced draft portion; 13. a third induced draft portion; 14. a fourth induced draft part; 15. a front end sloping plate;

20. a baffle; 21. an open area;

30. a heat sink;

40. half height card.

Detailed Description

Embodiments of the present application are described in detail below with reference to the accompanying drawings.

Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.

It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the application by way of illustration, and only the components related to the application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.

In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details.

The following describes the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.

Example 1

As shown in fig. 3, an embodiment of the present invention provides a wind scooper 10, which is applied to a half height card, and includes a first wind guiding portion 11, a second wind guiding portion 12, and a third wind guiding portion 13. The first induced air part 11 is arranged at the edge position of the half-height card and is used for keeping the air duct on the half-height card and preventing cooling air in the half-height card area from flowing out of the half-height card; the second induced draft part 12 is obliquely arranged at the end part of the first induced draft part 11 in a direction away from the half height card, and is used for guiding the wind flow on the half height card and enlarging the wind outlet area; the third induced air portion 13 is disposed at the bottom of the second induced air portion 12, and one side of the third induced air portion 13 away from the second induced air portion 12 is connected to the edge position of the half height card, so as to block the cooling air from flowing to the outside of the half height card.

The first induced draft portion 11 extends toward the tail of the half height card, so as to expand the induced draft area as much as possible.

The first induced air portion 11 is further configured to gather the air path to an area above the half-height card, so as to dissipate heat of the half-height card, prevent the air path from being dispersed to an area beyond the half-height card, and reduce heat dissipation efficiency.

The first induced air part 11 is closely attached to the edge of the PCB of the half-height card and is perpendicular to the PCB of the half-height card.

The second air guiding portion 12 is used for enlarging the air outlet area so as to reduce the air outlet resistance, so that hot air on the half-height card can be timely guided out.

In some embodiments, when the radiator is used to make the cold air flow from the second air guiding portion 12 to the first air guiding portion 11, the second air guiding portion 12 can prevent the cold air from flowing out of the ineffective area, so that the cold air is prevented from flowing out and cannot gather above the half-height card, and the heat dissipation efficiency of the half-height card is improved.

Wherein, the included angle between the first induced draft part 11 and the second induced draft part 12 is 16-26 degrees.

The cross section of the third induced draft portion 13 is triangular, one end of the third induced draft portion is located at the connection position of the first induced draft portion 11 and the second induced draft portion 12, one side of the third induced draft portion is connected with the second induced draft portion 12, and the other side of the third induced draft portion is connected with the half height card.

The third air guiding portion 13 is perpendicular to the first air guiding portion 11 and the second air guiding portion 12, and is used for supplementing an air channel constructed by the first air guiding portion 11 and the second air guiding portion 12, so as to prevent air flow from escaping from the lower side.

In some embodiments, the first induced draft portion 11, the second induced draft portion 12, and the third induced draft portion 13 are integrally formed.

Further, the wind scooper 10 can be configured into a horn mouth shape through a sheet metal processing technology and is integrally formed through a sheet metal bending technology, so that the design strength is improved, and the complexity of assembly and application and the material cost are reduced.

In some of these embodiments, the wind scooper 10 further includes a fourth wind scooper 14, the fourth wind scooper 14 being disposed at an end of the second wind scooper 12 that is remote from the first wind scooper 11.

The fourth air guiding portion 14 is used for adjusting the wind direction of the hot air guided by the second air guiding portion 12 so as to reduce the wind resistance of the hot air flowing out.

Preferably, the fourth air guiding portion 14 has an arc structure, so that hot air flows smoothly, and wind resistance is further reduced.

Wherein the third induced draft portion 13 is disposed perpendicular to the fourth induced draft portion 14.

In some of these embodiments, the side of the third induced draft portion 13 remote from the first induced draft portion 11 is provided with a front end sloping plate 15 to facilitate connection with external structures, such as a baffle 20.

In some embodiments, the wind scooper 10 further includes a plurality of bending connectors, and the plurality of bending connectors are processed through sprouting and tapping, and are used for being assembled and connected with other components, such as being connected with other baffles 20 or a half-height card PCB through screws.

According to the embodiment of the invention, the wind scooper 10 is arranged on the half-height card, so that the temperature of the main chip can be effectively reduced under the condition of the same wind resistance; and by giving the optimum air guiding angle of the second air guiding part 12, the air guiding efficiency of the air guiding cover 10 is improved; in addition, the wind scooper 10 is combined with the half-height card main body to form a horn mouth, so that the drainage effect on a wind path can be achieved, the air inlet volume or the air outlet volume of the radiator 30 is increased, and the requirements of different scenes can be met.

Example 2

As shown in fig. 4 to 7, the present embodiment provides a heat dissipation system for a network card, which includes the wind scooper 10 and the baffle 20 described in embodiment 1. The baffle 20 is disposed at an end of the air guiding cover 10, the baffle 20 is disposed corresponding to the second air guiding portion 12 of the air guiding cover 10, and is connected to a side of the third air guiding portion 13 away from the first air guiding portion 11, wherein an opening area 21 corresponding to the second air guiding portion 12 is disposed on the baffle 20.

The first air guiding portion 11 of the air guiding cover 10 extends towards the tail of the half height card 40, so as to enlarge the air guiding area as much as possible.

The third air guiding portion 13 in the air guiding cover 10 is used for preventing the cooling air from flowing to the perforated area 21 of the baffle 20 through the ineffective area outside the half height card 40.

Wherein, the wind scooper 10 is combined with the half-height card 40 and clings to the edge of the PCB board of the half-height card 40, and forms a horn mouth shape at the baffle 20, thereby effectively playing a role in guiding cooling wind and improving heat dissipation performance.

Wherein, the front end inclined plate 15 is arranged on the second air guiding portion 12 of the air guiding cover 10, so that the second air guiding portion 12 can be lapped at the bottom of the baffle 20 to be bent, thereby ensuring a seamless gap between the baffle 20 and the second air guiding portion 12 and improving the drainage effect of the air guiding cover 10.

Further, the side edge of the fourth air guiding portion 14 of the air guiding cover 10, which is close to the baffle 20, is flush with the edge of the opening area 21, so as to achieve the maximum air outlet area, and improve the air guiding effect.

The second air guiding portion 12 in the air guiding cover 10 is used for guiding the hot air passing through the radiator 30 to the opening area 21 on the baffle 20, so that the air outlet area can be effectively enlarged, the air resistance is reduced, the air inlet quantity of the half-height card 40 is increased, and the cooling air can be blocked from flowing to the opening area 21 through the ineffective area outside the half-height card 40, so that the cooling air cannot enter the half-height card 40 area, the air inlet quantity of the radiator 30 is insufficient, the main chip is overtemperature is caused, and the air channel bypass phenomenon is formed.

The fourth air guiding portion 14 of the air guiding cover 10 is disposed perpendicular to the PCB board of the half height card 40, and the height of the fourth air guiding portion 14 is the same as the height of the heat sink 30.

The fourth air guiding portion 14 changes the air flow direction passing through the second air guiding portion 12, so that the air flow direction is perpendicular to the baffle 20, and the air outlet air resistance is reduced.

In some of these embodiments, the heights of the first induced draft portion 11, the second induced draft portion 12, and the fourth induced draft portion 14 of the wind scooper 10 are the same as the height of the radiator 30.

In some embodiments, the heights of the first air guiding part 11, the second air guiding part 12 and the fourth air guiding part 14 are consistent with the single slot height limit of the half height card 40, so that the cooling air can be effectively prevented from flowing to the ineffective area outside the half height card 40 through the gap.

The first air guiding portion 11 of the air guiding cover 10 is used for preventing the cooling air entering the area of the half height card 40 from flowing to the ineffective area outside the half height card 40, gathering the air flow into the radiator 30, and improving the effective air intake of the radiator 30.

The second air guiding part 12 of the air guiding cover 10 is used for guiding the hot air passing through the radiator 30 to the opening area 21 of the baffle 20 outside the half height card 40 so as to enlarge the air outlet area and increase the air inlet quantity of the radiator 30; while serving to block cooling air from flowing to the open area 21 of the baffle 20 via the inactive area outside the half height card 40.

Specifically, a plurality of bending features are arranged on the wind scooper 10, the screw thread and the wind scooper 10 can be reliably connected through a sprouting and tapping processing technology, the bending feature A and the baffle 20 are fixedly connected through screws, the bending feature B and the bending feature C can be connected with the main body of the half-height card 40, and other components can be fixed and connected with the main body of the half-height card 40 through the bending feature D.

Further, the network card heat dissipation system further includes a heat sink 30, the heat sink 30 is disposed on the half height card 40, and a connection point of the first air guiding portion 11 and the second air guiding portion 12 of the air guiding cover 10 is disposed corresponding to a side of the heat sink 30 near the baffle 20.

Further, the included angle between the first induced draft portion 11 and the second induced draft portion 12 is the included angle between the extension line of the first induced draft portion 11 and the extension line of the second induced draft portion 12, and the included angle may be changed with the position of the radiator 30.

Preferably, the connection between the first induced draft portion 11 and the second induced draft portion 12 may be located between the center line of the radiator 30 to the tail (the tail is the end near the baffle 20).

For example, as shown in fig. 3 and 8 to 9, when the included angle between the first air guiding portion 11 and the second air guiding portion 12 is 0 °, the first air guiding portion 11 and the second air guiding portion 12 are on a straight line, when the included angle is 90 ° and the first air guiding portion 11 and the second air guiding portion 12 are perpendicular, when the included angle (the included angle between the first air guiding portion 11 and the second air guiding portion 12) is 16-26 °, the effect is optimal, and at this time, the connection position of the first air guiding portion 11 and the second air guiding portion 12 is located between the radiator 30 and the side of the radiator 30 close to the air outlet; when the included angle is too large, the hot air passing through the radiator 30 cannot be effectively guided in the area of the second air guiding part 12, so that the hot air cannot enter the open hole area 21 efficiently, and then the air outlet resistance of the hot air is too large, and the air quantity is reduced; when the angle is too small, the cooling air cannot be completely guided to the radiator 30 area, and the air intake of the radiator 30 is increased. The optimum angle of the included angle may vary due to the size of the heat sink 30 and the change in chip position.

When the intake air direction is reversed, the second air guiding portion 12 converges the cooling air passing through the opening area 21 to the effective area (area above the half height card 40), and simultaneously blocks the cooling air from flowing to the ineffective area (area outside the half height card 40) through the opening area 21, thereby effectively avoiding the phenomenon of air duct bypass.

Compared with the traditional scheme, the invention can effectively improve the air inlet quantity of the radiator 30 under the condition of the same air pressure, thereby greatly reducing the temperature of the main chip; compared with other structures with wind gathering effects, the wind scooper provided by the embodiment of the invention can more efficiently play a role in drainage; the wind scooper 10 can be installed without tools, and is convenient to assemble and disassemble, so that the wind scooper 10 can be selected and matched in different scenes; the invention has simple structure and low cost.

In this specification, identical and similar parts of the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the product embodiments described later, since they correspond to the methods, the description is relatively simple, and reference is made to the description of parts of the system embodiments.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A wind scooper for use with a half height card, comprising:

2. The wind scooper of claim 1 further comprising:

3. The air guide cover according to claim 2, wherein the fourth air guide portion has an arc-shaped structure.

4. A wind scooper according to claim 1 wherein an angle between an extension of the first wind scooper and an extension of the second wind scooper is in the range of 16 ° to 26 °.

5. The wind scooper of claim 1 wherein a front end sloping plate is provided on a side of the third wind scooper remote from the first wind scooper.

6. The air guide cover according to claim 1, wherein the first air guide portion, the second air guide portion, and the third air guide portion are integrally formed.

7. A network card heat dissipation system, comprising:

a wind scooper according to any of claims 1 to 6;

8. The network card cooling system of claim 7, wherein a side of the fourth induced draft portion of the air cap adjacent the baffle is flush with an edge of the open area.

9. The network card heat dissipation system of claim 7, further comprising:

10. The network card cooling system of claim 7, wherein the first, second, and fourth induced draft portions of the air cap have the same height as the radiator.