CN117543324A - Synchronous control method and control equipment for dual-cavity excimer laser and laser - Google Patents
Synchronous control method and control equipment for dual-cavity excimer laser and laser Download PDFInfo
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Abstract
The embodiment of the application provides a synchronous control method and control equipment of a dual-cavity excimer laser and the laser. In the embodiment of the application, aiming at each discharging process of the dual-cavity excimer laser, corresponding advanced preset time is collected, and parameters corresponding to delay time for determining discharging of each cavity are collected; and determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge. Because the parameters are used for determining the delay time, the high-precision discharge synchronous control can be performed aiming at the delay time of the double cavities, the discharge signals of the double cavities can be captured and collected in real time, the rapid feedback is formed, and the effect of synchronous delay real-time adjustability is realized.
Description
Technical Field
The invention relates to the field of control, in particular to a synchronous control method and control equipment of a dual-cavity excimer laser and the laser.
Background
The excimer laser is a pulse gas laser applied to deep ultraviolet features, has the characteristics of high repetition frequency, high energy, short wavelength, narrow linewidth and the like, and is an excellent laser light source for a photoetching system. Among them, a dual-cavity excimer laser in an oscillation-amplification (MOPA) structure occupies the dominant position of the laser, and has become a main lithography light source. Since the discharge duration of a dual-cavity laser is extremely short, at the same time, the population inversion failure due to the discharge is rapid, and it can only exist effectively during the discharge. For a dual cavity laser to function properly, the seed beam of the main cavity must pass through its discharge region during inversion of the power amplifying cavity particle count to form amplification. Therefore, the dual-cavity laser is required to discharge in a certain time of the main oscillating cavity advanced power amplifying cavity on the working time sequence, and the two-cavity discharge time sequence is required to be kept synchronous and stable in the certain time.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and providing a synchronous control method and control equipment of a dual-cavity excimer laser and the laser, which can enable the discharge time sequences of two discharge cavities in the dual-cavity excimer laser to be controlled more accurately.
In order to achieve the technical purpose, in one aspect, the invention provides a synchronous control method of a dual-cavity excimer laser, wherein the dual-cavity excimer laser comprises a main vibration cavity and a power amplification cavity, the main vibration cavity is discharged in advance of the power amplification cavity by preset time, so that after the main vibration cavity is discharged, the power amplification cavity is discharged based on a discharge result output by the main vibration cavity; the method comprises the following steps: aiming at each discharging process of the dual-cavity excimer laser, acquiring corresponding advanced preset time and acquiring parameters corresponding to delay time for determining discharging of each cavity, wherein the delay time refers to the delay time from the sending of a discharging signal indicating the discharging to the ending of the discharging of the corresponding cavity of a power switch device in a solid-state switch magnetic pulse booster power supply corresponding to each cavity; and determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time between the discharge signals corresponding to the cavities so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
Specifically, the acquiring the corresponding advanced preset time includes: and collecting discharge signals of zero crossing points corresponding to the cavities, and determining corresponding preset time between the corresponding discharge signals according to a filtering algorithm to serve as the collected preset time.
Furthermore, the method comprises the following steps: after the discharge signals are acquired, the MCU acquires the discharge signals of zero crossing points corresponding to the cavities, so that the preset time is acquired according to a filtering algorithm, and the acquired preset time is sent to the CPU through the MCU, so that the acquisition of the preset time is completed.
Specifically, the acquiring, by the MCU, the discharge signal of the zero crossing point corresponding to each cavity, so as to acquire the preset time according to the filtering algorithm, and sending, by the MCU, the acquired preset time to the CPU, includes: a high-speed microcontroller (402) in the MCU is used for acquiring the discharge signals of zero crossings corresponding to the cavities, and acquiring the preset time according to a filtering algorithm; the high-speed microcontroller (402) sends the acquired preset time to a low-speed microcontroller (401) in the MCU, and the low-speed microcontroller (401) sends the acquired preset time to a delay controller (301) in the CPU, so that the delay controller (301) determines the preset time of the next discharge according to the received preset time.
Specifically, the collecting the parameters corresponding to the delay time for determining the discharge of each cavity includes: the temperature of the main vibration cavity is acquired through a temperature acquisition device (601) of the main vibration cavity in the disturbance variable feedback unit, the temperature of the power amplification cavity is acquired through a temperature acquisition device (602) of the power amplification cavity in the disturbance variable feedback unit, the temperature of a magnetic switch of the main vibration cavity is acquired through a temperature acquisition device (603) of the magnetic switch of the main vibration cavity in the disturbance variable feedback unit, and the temperature of the magnetic switch of the power amplification cavity is acquired through a temperature acquisition device (604) of the magnetic switch of the power amplification cavity in the disturbance variable feedback unit; and acquiring preset charging voltage of the resonant power supply of the main vibration cavity and preset charging voltage of the resonant power supply of the power amplification cavity, so that the acquired corresponding temperature and the acquired corresponding charging voltage are used as preset time for the next discharge under parameters.
Furthermore, the method comprises the following steps: after the preset time of the next discharging is determined, the determined preset time is sent to a low-speed microcontroller (401) in the MCU through a delay controller (301) in the CPU, and then sent to a high-speed microcontroller (402) through the low-speed microcontroller (401), and a pulse output triggering unit (205) is controlled by the high-speed microcontroller (402) to respectively send corresponding pulse signals to corresponding cavities for triggering discharging according to the determined preset time; the method further comprises the steps of: an ignition trigger (302) in the CPU is controlled to work through a delay controller (301) so as to respectively provide charging signals for a resonance power supply of the main vibration cavity and a resonance power supply of the power amplification cavity through the ignition trigger (302) to charge the corresponding resonance power supply; setting the voltage of the resonant power supply of the main vibrating cavity and the voltage of the resonant power supply of the power amplifying cavity respectively through a time delay controller (301); a trigger signal is provided to the MCU by an ignition trigger (302) to cause the MCU to initialize according to the trigger signal.
Furthermore, the method comprises the following steps: the low-speed microcontroller (401) in the MCU receives the corresponding temperature acquired by the corresponding temperature acquisition device and sends the corresponding temperature to the delay controller (301) in the CPU so as to determine the preset time of the next discharge.
In addition, the collecting the discharge signals of the zero crossing points corresponding to the cavities comprises the following steps: the pulse voltage division sampler (501) in the discharge time sequence feedback unit divides the discharge signal of the ultra-high voltage of the main vibration cavity and the discharge signal of the ultra-high voltage of the power amplification cavity according to the resistance-capacitance voltage division circuit; sampling an optical signal of the main vibration cavity and an optical signal of the power amplification cavity by a photoelectric detector (502) in the discharge time sequence feedback unit; the impedance matching module (503) in the discharge time sequence feedback unit is used for carrying out impedance transformation on the divided discharge signal and the light-emitting signal of the main vibration cavity, and the signal conditioning module (504) in the discharge time sequence feedback unit is used for filtering and limiting the corresponding signal after transformation so as to attenuate the corresponding signal in equal proportion to match the voltage grade of the AD conversion module (505) at the later stage; corresponding discharge signals and light-emitting signals attenuated in equal proportion are converted into digital signals which can be processed by an MCU through an AD conversion module (505) in the discharge time sequence feedback unit and stored in a high-speed microcontroller (402) so as to acquire the discharge signals of zero crossing points.
On the other hand, the control equipment is used for synchronously controlling the dual-cavity excimer laser, the dual-cavity excimer laser comprises a main vibration cavity and a power amplification cavity, the main vibration cavity discharges in advance of the power amplification cavity by preset time, so that after the main vibration cavity discharges, the power amplification cavity discharges based on a discharge result output by the main vibration cavity; the apparatus comprises: a processor, a micro control unit; the micro control unit is used for: aiming at each discharging process of the dual-cavity excimer laser, acquiring corresponding advanced preset time and acquiring parameters corresponding to delay time for determining discharging of each cavity, wherein the delay time refers to the delay time from the sending of a discharging signal indicating the discharging to the ending of the discharging of the corresponding cavity of a power switch device in a solid-state switch magnetic pulse booster power supply corresponding to each cavity; the processor is configured to: and determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
On the other hand, the dual-cavity excimer laser provided by the invention comprises a main vibration cavity and a power amplification cavity, wherein the main vibration cavity discharges in advance of the preset time of the power amplification cavity, so that after the main vibration cavity discharges, the power amplification cavity discharges based on a discharge result output by the main vibration cavity; the laser further includes: a processor, a micro control unit; the micro control unit is used for: aiming at each discharging process of the dual-cavity excimer laser, acquiring corresponding advanced preset time and acquiring parameters corresponding to delay time for determining discharging of each cavity, wherein the delay time refers to the delay time from the sending of a discharging signal indicating the discharging to the ending of the discharging of the corresponding cavity of a power switch device in a solid-state switch magnetic pulse booster power supply corresponding to each cavity; the processor is configured to: and determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
In the embodiment of the application, aiming at each discharging process of the dual-cavity excimer laser, corresponding advanced preset time is collected, and parameters corresponding to delay time for determining discharging of each cavity are collected, wherein the delay time refers to the delay time from the sending of a discharging signal for indicating discharging to the ending of discharging of the corresponding cavity of a power switch device in a solid-state switch magnetic pulse booster power supply corresponding to each cavity; and determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge. Because the parameters are used for determining the delay time, the high-precision discharge synchronous control can be performed aiming at the delay time of the double cavities, the discharge signals of the double cavities can be captured and collected in real time, the rapid feedback is formed, and the effect of synchronous delay real-time adjustability is realized. The discharge time sequence of the dual-cavity excimer laser with smaller relative jitter under the synchronous operation of lower than 6kHz and high repetition frequency is ensured.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for synchronously controlling a dual-cavity excimer laser according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a control system according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a CPU master control unit according to an embodiment of the present application;
fig. 4 is a schematic diagram of an MCU micro-control unit according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a discharge timing feedback unit according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of a disturbance variable feedback unit according to an embodiment of the present application;
fig. 7 is a schematic diagram of a synchronous control device of a dual-cavity excimer laser according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, the present application provides a synchronous control method of a dual-cavity excimer laser, where the dual-cavity excimer laser includes a main cavity and a power amplification cavity, where the main cavity discharges in advance of a preset time of the power amplification cavity, so that after the main cavity discharges, the power amplification cavity discharges based on a discharge result output by the main cavity; the method 100 includes:
101: for each discharge process of the dual-cavity excimer laser, corresponding advanced preset time is collected, and parameters corresponding to delay time for determining discharge of each cavity are collected.
The delay time refers to the delay time from the sending of a discharge signal indicating discharge to the end of the discharge of the corresponding cavity of the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity.
102: and determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
The main oscillation cavity can be called MO cavity, the power amplification cavity can be called PA cavity, and the discharge duration time of each cavity is extremely short and is respectively 20 ns-40 ns nanoseconds. In order to make the dual-cavity excimer laser work correctly, the dual-cavity requirement satisfies the requirement that the MO cavity leads the PA cavity to discharge for 20-40 ns on the working time sequence, and the two-cavity discharge time sequence needs to be kept synchronous and stable in the range. The seed beam of the main oscillation cavity (MO cavity) must pass through its discharge region during the inversion of the particle number of the power amplifying cavity (PA cavity) to form amplification. The laser in the embodiments of the present application operates at pulse frequencies below 6 khz, i.e. the discharge of the two cavities is triggered once per pulse of frequency, whereby the laser is pulsed once every 167us microseconds.
In order to realize the advanced synchronous discharge with higher accuracy of the double cavities, the discharge time sequences of the two discharge cavities (namely the main vibration cavity and the power amplification cavity) need to be controlled more accurately. However, the traditional double-cavity advanced synchronous discharge control precision is poor, and long inherent delay exists, so that continuous sporadic double-cavity asynchronization can be caused. With the double-cavity excimer laser, the embodiment of the application can synchronously control the double-cavity discharge with faster feedback, high precision and low jitter after higher requirements are provided for the response speed and the synchronous delay precision of the double-cavity synchronous discharge.
The execution subject of the method 100 may be a control device or a control system deployed in the control device, which may be a terminal with a computing function, such as a laser or the like.
The following is a detailed description of the above steps:
101: for each discharge process of the dual-cavity excimer laser, corresponding advanced preset time is collected, and parameters corresponding to delay time for determining discharge of each cavity are collected.
The delay time refers to the delay time from the sending of a discharge signal indicating discharge to the end of the discharge of the corresponding cavity of the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity. The power switch device may be an IGBT (Insulated Gate Bipolar Transistor ), a thyristor, a MOS (MOSFET for short, metal-Oxide-Semiconductor Field-Effect Transistor, a Metal-Oxide semiconductor field effect transistor for short, a Metal Oxide semiconductor field effect transistor for short), or the like. For example, a delay time of 3us microseconds exists between triggering a discharge signal and ending of discharging of the cavity in an IGBT (Insulated Gate Bipolar Transistor ) in a solid-state switching magnetic pulse boost power supply MO corresponding to the cavity of the MO cavity, and a delay time of 3us microseconds exists between triggering a discharge signal and ending of discharging of the cavity in an IGBT in a solid-state switching magnetic pulse boost power supply PA corresponding to the cavity of the PA cavity.
The parameters may include the charging voltage of the two-path (i.e., the path for the two cavities) resonant power supply (i.e., each cavity corresponds to one resonant power supply charging voltage), the temperature of the magnetic pulse compression switch (i.e., the magnetic switch of the main cavity and the magnetic switch of the power amplification cavity), the temperature of the discharge cavity (i.e., the temperature of the main cavity and the temperature of the power amplification cavity), and so on. As parameters change, the delay time also changes. The charging voltage is preset and can be obtained directly without calculation.
For example, when the laser is in operation, for each discharge (which may also be a control device, and will not be described in detail later), the MCU (micro control unit, microcontroller Unit) of the control system may collect the current advance preset time, and the above parameters.
Specifically, the step of collecting the corresponding advanced preset time includes: and collecting discharge signals of zero crossing points corresponding to the cavities, and determining corresponding preset time between the corresponding discharge signals according to a filtering algorithm to serve as the collected preset time.
For example, as above, the laser collects two paths V at each discharge, i.e. for this discharge process CP The discharge signal of a zero crossing point, namely corresponding to each cavity, is collected and can be a pulse signal. And a filtering algorithm is adopted, so that a discharge delay difference value corresponding to the current pulse (namely, a trigger pulse corresponding to the just completed discharge can be understood as the last pulse), namely, the preset time can be acquired.
Since the acquisition of the preset time can be performed by the MCU, the preset time can be acquired by the processing by the MCU. It should be understood that, besides the MCU, other processing may be performed by other units or devices having control functions, which will not be described in detail.
Specifically, the method 100 further includes: after the discharge signals are acquired, the MCU acquires the discharge signals of zero crossing points corresponding to the cavities, so that the preset time is acquired according to a filtering algorithm, and the acquired preset time is sent to the CPU through the MCU to finish the acquisition of the preset time.
For example, as shown in fig. 2, after the discharge signal is collected, the MCU, i.e., the MCU micro-control unit 202, can obtain the two-way V CP The zero crossing point signal of the discharge signal can be a pulse signal, and according to a filtering algorithm, the preset time is collected, so that the collection of the preset time is completed, and the collected preset time is sent to a CPU (central processing unit ) through the MCU micro-control unit 202, namely the CPU main control unit 201, so that the preset time is processed through the CPU main control unit 201, and the preset time of the next discharge is determined.
It should be noted that, the CPU main control unit 201 may be configured to receive a delay difference value of two discharge signals of the main vibration cavity (MO cavity) and the power amplification cavity (PA cavity) obtained by analysis and processing by the MCU micro control unit 202, that is, a collected preset time, and may also receive a disturbance variable feedback value collected by the MCU micro control unit 202, and simultaneously make a synchronization control policy, set an optimal delay setting value of the next pulse discharge, that is, a determined preset time, and then transmit the optimal delay setting value to the MCU micro control unit 202.
As shown in fig. 2, the MCU micro-control unit 202 may be configured to receive the sampled data of the discharge timing feedback unit 203 and the disturbance variable feedback unit 204, perform analysis processing, upload the data after the analysis processing to the CPU main control unit 201, and simultaneously receive an optimal delay setting value of the next pulse discharge issued by the CPU main control unit 201, and provide a trigger of a two-way discharge signal to the pulse output trigger unit 205, that is, pulse output of the main vibration cavity and pulse output of the power amplification cavity.
In order to enable the MCU to complete the acquisition more efficiently and quickly, the MCU may also continue to be partitioned, where the MCU may include a high speed microcontroller 402 and a low speed microcontroller 401.
Specifically, the discharging signals of zero crossing points corresponding to the cavities are obtained through the MCU, so that the preset time is collected according to a filtering algorithm, and the collected preset time is sent to the CPU through the MCU, and the method comprises the following steps: the method comprises the steps of obtaining discharge signals of zero crossings corresponding to all cavities through a high-speed microcontroller 402 in an MCU, and collecting preset time according to a filtering algorithm; the high-speed microcontroller 402 sends the acquired preset time to the low-speed microcontroller 401, and the low-speed microcontroller 401 sends the acquired preset time to the delay controller 301 of the CPU, so that the delay controller 301 determines the preset time of the next discharge according to the received preset time.
For example, as shown in FIG. 4, after the signal is acquired, a dual-path V is acquired by the high-speed microcontroller 402 in the MCU CP The zero crossing point signal of the discharge signal (such as the zero crossing point discharge signal of the main vibration cavity and the zero crossing point discharge signal of the power amplification cavity) can be pulse signals, a filtering algorithm is adopted, the delay difference value of the discharge of the current pulse, namely the preset time, can be acquired, and the preset time is sent to the low-speed microcontroller 401 through SPI (Serial Peripheral Interface ) communication or other parallel communication modes, and the low-speed microcontroller 401 is further connected with the power amplification cavity through a communication interface The EIA-422 or EIA-485 transmits the acquired preset time (i.e., delay difference) to the CPU, and more specifically, may be the delay controller 301 in the CPU.
It should be noted that, the turning precision of the GPIO (General-purpose input/output) interface of the high-speed microcontroller 402 is less than or equal to 2ns, and the working main frequency and the GPIO interface frequency need to satisfy more than or equal to 500MHz. Because the turning precision of the GPIO interface is required to be less than or equal to 2ns, and the working main frequency and the GPIO interface frequency are required to be more than or equal to 500MHz, the discharge time sequence which ensures that the dual-cavity excimer laser can synchronously run at the high repetition frequency of 6kHz is relatively jittery less than +/-3 ns, the adjustment precision of the two-way preset time is less than or equal to 2ns, and the high-speed microcontroller 402 can realize high-precision and rapid acquisition of the preset time.
In addition, the high-speed microcontroller 402 goes through two main steps: obtaining two-way V CP The zero crossing signal of the discharge signal and the filtering algorithm are adopted to collect the delay difference value of the discharge of the current pulse, so that the high-speed microcontroller 402 can quickly collect the delay difference value.
It should be further noted that, according to the foregoing, since the MCU may include the high-speed microcontroller 402 and the low-speed microcontroller 401, the high-speed microcontroller 402 and the low-speed microcontroller 401 are separately decoupled to perform the corresponding tasks. The high-speed microcontroller 402 may be mainly used for acquiring the delay difference, and the task of the low-speed microcontroller 401, such as acquiring parameters, is not required to be executed, so that the high-speed microcontroller 402 can concentrate on acquiring delay, and the acquisition rate is improved.
The process of collecting the discharge signal is as follows: the acquisition may be performed by a discharge timing feedback unit.
As shown in fig. 2, the discharge timing feedback unit 203 collects two paths of discharge signals of the MO cavity and the PA cavity, and two paths of light-emitting signals, and conditions the two paths of V through potential translation, impedance transformation, filtering, attenuation, and the like CP The discharge signal captures the zero crossing point and feeds back to the MCU micro control unit 202.
Specifically, collecting the discharge signals of zero crossings corresponding to each cavity comprises: the pulse voltage division sampler 501 in the discharge time sequence feedback unit 203 divides the discharge signal of the ultra-high voltage of the main vibration cavity and the discharge signal of the ultra-high voltage of the power amplification cavity according to the resistance-capacitance voltage division circuit; the photoelectric detector 502 in the discharge time sequence feedback unit 203 is used for sampling the light-emitting signal of the main vibration cavity and the light-emitting signal of the power amplification cavity; the impedance matching module 503 in the discharge time sequence feedback unit 203 performs impedance transformation on the divided discharge signal and the light-emitting signal of the main vibration cavity, and the signal conditioning module 504 in the discharge time sequence feedback unit 203 performs filtering and amplitude limiting on the corresponding signal after transformation so as to make the corresponding signal attenuate in equal proportion to match the voltage grade of the AD conversion module 505 at the later stage; the corresponding discharge signal and the light-emitting signal after the equal proportion attenuation are converted into digital signals which can be processed by the MCU through the AD conversion module 505 in the discharge time sequence feedback unit and are stored in the high-speed microcontroller 402 so as to acquire the discharge signal of the zero crossing point.
For example, the discharge signal is collected by the discharge timing feedback unit 203. As shown in fig. 5, the discharge timing feedback unit 203 includes a pulse voltage division sampler 501, a photodetector 502, an impedance matching module 503, a signal conditioning module 504, and an AD (analog-to-digital conversion) conversion module 505, which may also be referred to as a high-speed AD conversion module.
The pulse voltage division sampler 501 can discharge signals MO V of an MO cavity and a PA cavity with peak values of 20kV level and kilovolt level through a resistance-capacitance voltage division circuit CP 、PA V CP (i.e., the discharge signal of the main vibrating cavity and the discharge signal of the power amplifying cavity) is divided to several tens of volts, wherein the waveform a506 is the waveform of the discharge signal. The photodetector 502 samples and captures the light-emitting signals of the gases in the MO cavity and the PA cavity (i.e., the light-emitting signal of the main vibration cavity and the light-emitting signal of the power amplification cavity), where the waveform B507 is the waveform of the light-emitting signal. Because the discharge signals and the light-emitting signals are nanosecond pulse signals, the sampled and captured discharge signals and the light-emitting signals are subjected to potential translation and impedance transformation through the impedance matching module 503, so that the signal-to-noise ratio is improved, the signals are prevented from being greatly attenuated, and the signal integrity is ensured. For signal conditioning module 504 The converted discharge signal and light-emitting signal are filtered and limited to realize equal-proportion attenuation of the signal so as to match the voltage level of the AD conversion circuit in the subsequent AD conversion module 505. The AD conversion module 505 is configured to convert the discharge signal and the light-emitting signal after the equal-proportion attenuation into digital signals that can be processed by the MCU micro-control unit 202, and store the digital signals in the high-speed microcontroller 402. The sampled signal is a nanosecond pulse signal, the rising edge time of the pulse is less than 60ns, and in order to accurately capture the zero crossing point of the pulse signal, the sampling rate of the AD conversion module 505 at least needs to satisfy 500MSPS (Million Samples per Second, millions of samples per second), namely 2ns/step (nanosecond/step).
It should be noted that, the pulse voltage division sampler 501 may divide the discharge signals MO V of the peak ultra-high voltage such as 20kV MO cavity and PA cavity through a resistive-capacitive voltage division circuit CP 、PA V CP (namely, the discharge signal of the main vibration cavity and the discharge signal of the power amplification cavity) to tens of volts, so that the voltage signal of the ultra-high voltage 20 kilovolt voltage environment is rapidly and accurately sampled.
In addition, the pulse voltage division sampler 501, the photodetector 502, the impedance matching module 503, the signal conditioning module 504, the ad (analog-to-digital conversion) conversion module 505 in the discharge timing feedback unit 203 can sample the obtained signal into a nanosecond pulse signal, and the rising edge time of the pulse is less than 60ns, so that the embodiment of the application can collect an ultrahigh-voltage narrow pulse signal. Meanwhile, the sampling rate of the AD conversion module 505 needs to at least meet 500MSPS (Million Samples per Second ), i.e. 2ns/step (nanosecond/step), so that the zero crossing point of the pulse signal can be accurately captured later.
In addition, since the embodiment of the application discharges at the frequency of 6kHZ, according to the foregoing, the trigger is performed about once every 167us, but the embodiment of the application can collect a 60ns narrow pulse signal from 167us, and needs to collect every 2ns therein, and needs to collect at the frequency of 500MHz, which indicates that the collection speed is extremely high and the collection accuracy is also very high.
Therefore, the embodiment of the application can realize the synchronous control of the delay discharge high precision of the double cavities, can capture and collect the ten thousand volt high voltage nanosecond steep pulse signals of the double cavities in real time, form quick feedback, and carry out the synchronous delay of the pulse frequency below 6kHz in real time. The relative jitter of the discharge time sequence of the dual-cavity excimer laser in 6kHz high-repetition frequency synchronous operation is ensured to be less than +/-3 ns.
The parameter acquisition process may be performed by the disturbance variable feedback unit 204. As shown in fig. 2, the disturbance variable feedback unit 204 feeds back the monitoring of the multi-point temperature state to the MCU micro-control unit 202 through the collection of the multi-path state signals.
Specifically, collecting parameters corresponding to delay time for determining discharge of each cavity includes: the temperature of the main vibration cavity is acquired through a temperature acquisition device 601 of the main vibration cavity in the disturbance variable feedback unit 204, the temperature of the power amplification cavity is acquired through a temperature acquisition device 602 of the power amplification cavity in the disturbance variable feedback unit 204, the temperature of the magnetic switch of the main vibration cavity is acquired through a temperature acquisition device 603 of the magnetic switch of the main vibration cavity in the disturbance variable feedback unit 204, and the temperature of the magnetic switch of the power amplification cavity is acquired through a temperature acquisition device 604 of the magnetic switch of the power amplification cavity in the disturbance variable feedback unit 204.
For example, as shown in fig. 6, the disturbance variable feedback unit 204 includes a temperature collector 601 of the main oscillation cavity (i.e., MO cavity), a temperature collector 602 of the power amplification cavity (PA cavity), a temperature collector 603 of the magnetic switch of the main oscillation cavity (i.e., MO magnetic switch), and a temperature collector 604 of the magnetic switch of the power amplification cavity (i.e., PA magnetic switch). And the temperature is collected by the temperature collectors. The temperature collector 601 of the main vibration cavity (i.e. MO cavity) and the temperature collector 602 of the power amplification cavity use a temperature sensing current source to convert each collected temperature of the dual cavities into a current signal, and then the current signal is converted into a voltage value identifiable by the low-speed microcontroller 401 in the MCU through a precision resistor. The MO magnetic switch and the PA magnetic switch are in a high-voltage environment of 20kV level, a common temperature sensor cannot meet the insulation and voltage-resistant requirement, and an optical fiber temperature sensor is used for temperature sampling and then is sent to a low-speed microcontroller.
The collected temperature is fed back to the low-speed microcontroller 401 as a parameter, as shown in fig. 4. And low-speed microcontroller 401, upon receiving these parameters, sends the parameters to delay controller 301.
Specifically, the method 100 further includes: the low-speed microcontroller 401 in the MCU receives the corresponding temperature acquired by the corresponding temperature acquisition unit and sends the corresponding temperature to the delay controller 301 in the CPU for the preset time of the next discharge.
The low-speed microcontroller 401 receives the preset time sent by the delay controller and sends the preset time to the high-speed microcontroller 402 in the MCU, so that the high-speed microcontroller 402 controls the pulse output triggering unit 205 to output a corresponding pulse signal to a corresponding cavity according to the determined preset time.
For example, as shown in fig. 4, the low-speed microcontroller 401 is configured to collect, through disturbance feedback, feedback signals for processing low-frequency disturbance variables of each path, including the temperature of the MO cavity, the temperature of the PA cavity, the temperature of the MO magnetic switch, the temperature of the PA magnetic switch, and the delay variable of the 4 paths of temperature. For each pulse discharge, the above 4-way disturbance values are sent to the delay controller 301 in the CPU main control unit 201 through the communication interface EIA-422 or EIA-485. Meanwhile, the optimal delay set value of the next pulse discharge given by the delay controller 301 is received, namely, the preset time (namely, the optimal delay set is carried out by the delay controller 301), and the set value is sent to the high-speed microcontroller 402 through SPI communication or other parallel communication modes, and a two-way discharge high-precision trigger signal is provided for two paths corresponding to MO and PA cavities through controlling the pulse output trigger unit 205, so that the main vibration cavity trigger discharge and the power amplification cavity trigger discharge are realized.
102: and determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
The preset control relation can be control realized by a preset PID control algorithm, can also be realized by a preset neural network model, and the like.
The parameters include the charging voltage of the resonant power supply of the main vibrating cavity and the charging voltage of the resonant power supply of the power amplifying cavity besides the corresponding temperature. Therefore, specifically, collecting parameters corresponding to the delay time for determining the discharge of each cavity may further include: and acquiring preset charging voltage of the resonant power supply of the main vibration cavity and preset charging voltage of the resonant power supply of the power amplification cavity, so that the acquired corresponding temperature and the acquired corresponding charging voltage are used as preset time for the next discharge under parameters.
Since the charging voltage is preset, the charging voltage can be determined directly by the set value, and can be directly fed back to the CPU main control unit 201 by the MCU micro control unit 202 or directly obtained by the CPU main control unit 201.
For example, as shown in fig. 3, the delay controller 301 sets the optimal delay of the next pulse discharge, i.e. the preset time, according to the delay difference of the discharge signals of the two paths sampled back by feedback and the feedback quantity of each disturbance (i.e. the delay difference+the feedback quantity). The main difficulty in closed-loop control for the double-cavity discharge is that a delay of 3us exists between triggering of the solid-state switching magnetic pulse boost power supply MO and the power switching devices in the solid-state switching magnetic pulse boost power supply PA, such as IGBT, and cavity discharge. The delay varies considerably with the charge voltage of the two resonant power supplies, the temperature of the magnetic pulse compression switch (i.e., the temperature of the magnetic switch), and the temperature of the discharge chamber. Therefore, the delay controller 301 is configured to establish a relationship between the two-way delay difference T0 (i.e. the preset time to be determined) and the charging voltage VC0, the temperature T1 of the magnetic switch, and the temperature T2 of the discharge chamber, i.e. t0=y (VC 0, T1, T2), according to a formulated synchronization control algorithm, i.e. a control relationship.
Based on this, the control relationship may be converted such that T0 has a control relationship with the above-described parameter VC0, T1, or T2, that is, t0=y (VC 0), t0=y (VC 0, T1), t0=y (VC 0, T2), or the like.
It should be noted that the charging voltage VC0, the temperature T1 of the magnetic switch, and the temperature T2 of the discharge chamber referred to herein are for the main vibrating chamber and the power amplifying chamber, respectively, i.e., each chamber has the charging voltage VC0, the temperature T1 of the magnetic switch, and the temperature T2 of the discharge chamber. All need to be considered. Meanwhile, the acquired preset time may be t1, which has a relation with the control relation y, and may be input into y. Whereby a final determined preset time can be obtained.
In addition, the temperature T1 of the magnetic switch and the temperature T2 of the discharge cavity have cumulative effects with time T, and the speed of temperature rise is simultaneously influenced by the discharge frequency f and the discharge duty ratio D of the dual-cavity excimer laser, so that a relation t0=y (VC 0, T, f, D) can be established, and the optimal delay of each pulse discharge is given according to a formulated synchronous control algorithm.
Based on this, the above control relation t0=y (VC 0, t, f, D) may also be transformed such that t0 has a control relation with the above parameters VC0, t, f, or D, that is, t0=y (VC 0, t), t0=y (VC 0, t, f), t0=y (VC 0, D), t0=y (VC 0, t, D), or the like, which will not be described again.
In this relationship t0=y (VC 0, t, f, D), the acquired preset time may also be t1, which also has a relationship with the control relationship y, which may be input into y. Whereby a final determined preset time can be obtained.
It should be further noted that the method 100 further includes: the ignition trigger 302 in the CPU is controlled to work through the delay controller 301, so that charging signals are respectively provided for the resonance power supply of the main vibration cavity and the resonance power supply of the power amplification cavity through the ignition trigger 302, and charging of the corresponding resonance power supply is performed; setting the voltage of the resonant power supply of the main vibrating cavity and the voltage of the resonant power supply of the power amplifying cavity through the delay controller 301 respectively; the trigger signal is provided to the MCU by the ignition trigger 302 to cause the MCU to initialize according to the trigger signal.
As shown in fig. 3, for the CPU main control unit 201 further includes an ignition trigger 302, the delay controller 301 is used for controlling the ignition trigger 302 to operate, and the ignition trigger 302 is used for providing an ignition trigger signal to the resonant power supply (i.e. the resonant power supply MO) of the main vibration cavity, the resonant power supply (i.e. the resonant power supply PA) of the power amplification cavity and the MCU micro control unit, i.e. providing a charging signal and a trigger signal respectively. The ignition trigger 302 outputs three paths of TTL (Transistor-Transistor Logic) narrow pulse trigger signals at the same time, specifically, a coaxial cable with 50 Ω ohm impedance with strict equal length can be adopted to provide charging signals for the resonant power supply MO, i.e. the power supply MO304, and the resonant power supply PA, i.e. the power supply PA303, and simultaneously provide an initialization enabling signal, i.e. a trigger signal, for the MCU micro control unit 202 to initialize and charge the corresponding resonant power supply before each discharging.
In addition, the delay controller 301 may also set the voltages of the power supply MO304 and the power supply PA 303.
In the above, the delay controller 301 in the CPU main control unit 201 determines the preset time of the next pulse, that is, the advanced preset time between the pulse signals corresponding to the two cavities, and triggers the output of the pulse by the pulse output triggering unit 205, so that the two cavities are sequentially discharged according to the preset time.
Wherein the method 100 further comprises: after the preset time of the next discharge is determined, respectively sending corresponding pulse signals to the corresponding cavities for triggering discharge according to the determined preset time.
For example, as described above, the delay controller 301 in the CPU main control unit 201 may determine t0, i.e. the preset time, according to the parameters collected later, such as the corresponding temperature and the corresponding charging voltage. And then the high-speed microcontroller 402 controls the pulse output triggering unit 205 to trigger the pulse signal according to the preset time, so as to realize the discharging of the preset time of the main vibrating cavity advanced power amplifying cavity. The pulse output triggering unit 205 may be used to implement nanosecond delay adjustment of the two-way trigger signal.
It should be noted that, according to the foregoing, since the embodiment of the present application can realize high-precision signal sampling, the pulse output triggering unit 205 can realize triggering of the high-precision low-jitter discharge time sequence, so that the relative jitter of the dual-cavity discharge time sequence is less than ±3ns.
Therefore, the embodiment of the application can realize synchronous control of the double-path trigger pulse high-precision low-jitter of the alignment molecular laser and realize the double-path discharge signal rapid feedback function. The control system is in a high-voltage, high-current and narrow-pulse strong electromagnetic interference environment, and the high-precision synchronous control mode realizes nanosecond-level delay control of the two-way pulse, so that the system has strong electromagnetic interference resistance, and has the characteristics of nanosecond-level low-delay jitter and nanosecond-level high-precision adjustment.
The embodiment of the application also provides a synchronous control device of the dual-cavity excimer laser, which can be applied to a laser and the like, wherein the dual-cavity excimer laser comprises a main vibration cavity and a power amplification cavity, and the main vibration cavity is used for discharging in advance of the preset time of the power amplification cavity, so that after the main vibration cavity is discharged, the power amplification cavity is used for discharging based on a discharging result output by the main vibration cavity. As shown in fig. 7, the apparatus 700 includes:
The acquisition module 701 is configured to acquire a corresponding advanced preset time for each discharge process of the dual-cavity excimer laser, and acquire parameters corresponding to a delay time for determining discharge of each cavity.
The delay time refers to the delay time from the sending of a discharge signal indicating discharge to the end of the discharge of the corresponding cavity of the power switch device in the solid-state switch magnetic pulse boost power supply corresponding to each cavity.
The determining module 702 is configured to determine, according to the collected preset time, parameter and preset control relationship, a preset time for a next discharge, so as to determine a corresponding preset time between discharge signals corresponding to each cavity, so as to trigger a corresponding discharge signal, where the corresponding discharge signal is used to trigger the corresponding cavity to discharge.
Specifically, the acquisition module 701 is specifically configured to: and collecting discharge signals of zero crossing points corresponding to the cavities, and determining corresponding preset time between the corresponding discharge signals according to a filtering algorithm to serve as the collected preset time.
In addition, the apparatus 700 further includes: the acquisition module is used for acquiring the discharge signals of the zero crossing points corresponding to the cavities through the MCU after the discharge signals are acquired, acquiring preset time according to a filtering algorithm, and sending the acquired preset time to the CPU through the MCU so as to complete the acquisition of the preset time.
Specifically, the acquisition module includes: the first acquisition unit is used for acquiring the discharge signals of the zero crossing points corresponding to the cavities through a high-speed microcontroller in the MCU, and acquiring preset time according to a filtering algorithm; the determining unit is used for transmitting the acquired preset time to the low-speed microcontroller in the MCU through the high-speed microcontroller, and transmitting the acquired preset time to the delay controller in the CPU through the low-speed microcontroller, so that the delay controller determines the preset time of the next discharge according to the received preset time.
Specifically, the acquisition module 701 includes: the acquisition unit is used for acquiring the temperature of the main vibration cavity through the temperature acquisition device of the main vibration cavity in the disturbance variable feedback unit, acquiring the temperature of the power amplification cavity through the temperature acquisition device of the power amplification cavity in the disturbance variable feedback unit, acquiring the temperature of the magnetic switch of the main vibration cavity through the temperature acquisition device of the magnetic switch of the main vibration cavity in the disturbance variable feedback unit, and acquiring the temperature of the magnetic switch of the power amplification cavity through the temperature acquisition device of the magnetic switch of the power amplification cavity in the disturbance variable feedback unit; the second acquisition unit is used for acquiring the preset charging voltage of the resonant power supply of the main vibration cavity and the preset charging voltage of the resonant power supply of the power amplification cavity, so that the acquired corresponding temperature and the acquired corresponding charging voltage are used as the preset time of the next discharge under the parameters.
In addition, the determining module 702 is further configured to: after the preset time of the next discharging is determined, the determined preset time is sent to a low-speed microcontroller in the MCU through a delay controller in the CPU, and then is sent to a high-speed microcontroller through the low-speed microcontroller, and a pulse output triggering unit is controlled by the high-speed microcontroller to respectively send corresponding pulse signals to corresponding cavities according to the determined preset time to trigger discharging; the apparatus 700 further comprises: the control module is used for controlling an ignition trigger in the CPU to work through the delay controller so as to respectively provide charging signals for the resonance power supply of the main vibration cavity and the resonance power supply of the power amplification cavity through the ignition trigger to charge the corresponding resonance power supply; the setting module is used for setting the voltage of the resonant power supply of the main vibration cavity and the voltage of the resonant power supply of the power amplification cavity through the delay controller respectively; the providing module is used for providing a trigger signal for the MCU through the ignition trigger so as to initialize the MCU according to the trigger signal.
Furthermore, the acquisition module 701 is further configured to: the low-speed microcontroller in the MCU receives the corresponding temperature acquired by the corresponding temperature acquisition unit and sends the corresponding temperature to the delay controller in the CPU so as to determine the preset time of the next discharge.
Specifically, the acquisition module 701 includes: the voltage dividing unit is used for dividing the voltage of the ultrahigh-voltage discharge signal of the main vibration cavity and the ultrahigh-voltage discharge signal of the power amplification cavity according to the resistance-capacitance voltage dividing circuit through the pulse voltage dividing sampler in the discharge time sequence feedback unit; the collecting unit is also used for sampling the light-emitting signals of the main vibration cavity and the light-emitting signals of the power amplifying cavity through the photoelectric detector in the discharge time sequence feedback unit; the processing unit is used for carrying out impedance transformation on the divided discharge signal and the light-emitting signal of the main vibration cavity through the impedance matching module in the discharge time sequence feedback unit, and carrying out filtering and amplitude limiting on the corresponding signal after transformation through the signal conditioning module in the discharge time sequence feedback unit so as to attenuate the corresponding signal in equal proportion to match the voltage grade of the AD conversion module at the later stage; the conversion unit is used for converting the corresponding discharge signals and the light-emitting signals after the equal proportion attenuation into digital signals which can be processed by the MCU through the AD conversion module in the discharge time sequence feedback unit, and storing the digital signals into the high-speed microcontroller so as to acquire the discharge signals of the zero crossing points.
Since the specific implementation of the apparatus 700 is described above, the description is omitted here.
The embodiment of the application also provides control equipment, which is used for synchronously controlling the dual-cavity excimer laser, wherein the dual-cavity excimer laser comprises a main vibration cavity and a power amplification cavity, and the main vibration cavity discharges in advance of the preset time of the power amplification cavity so that the power amplification cavity discharges based on a discharge result output by the main vibration cavity after the main vibration cavity discharges; the device comprises: a processor, a micro control unit; a micro control unit for: aiming at each discharging process of the dual-cavity excimer laser, acquiring corresponding advanced preset time and acquiring parameters corresponding to delay time for determining discharging of each cavity, wherein the delay time refers to the delay time of a power switch device in a solid-state switch magnetic pulse booster power supply corresponding to each cavity from transmitting a discharging signal for indicating discharging to the end of discharging of the corresponding cavity; a processor for: and determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
The control system is used for synchronously controlling the dual-cavity excimer laser, the dual-cavity excimer laser comprises a main vibration cavity and a power amplification cavity, the main vibration cavity discharges in advance of the preset time of the power amplification cavity, and after the main vibration cavity discharges, the power amplification cavity discharges based on a discharge result output by the main vibration cavity; the device comprises: a processor, a micro control unit; a micro control unit for: aiming at each discharging process of the dual-cavity excimer laser, acquiring corresponding advanced preset time and acquiring parameters corresponding to delay time for determining discharging of each cavity, wherein the delay time refers to the delay time of a power switch device in a solid-state switch magnetic pulse booster power supply corresponding to each cavity from transmitting a discharging signal for indicating discharging to the end of discharging of the corresponding cavity; a processor for: and determining the preset time of the next discharge according to the acquired preset time parameters and the preset control relation, wherein the preset time is used for determining the corresponding preset time between the discharge signals corresponding to the cavities so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
Wherein, control system or controlgear can include CPU master control unit (i.e. processor), MCU micro-control unit (i.e. micro-control unit), can also include: and the discharge time sequence feedback unit, the disturbance variable feedback unit and the pulse output triggering unit. The CPU main control unit is used for receiving the delay difference value of the discharge signals of the main vibration cavity (MO cavity) and the power amplification cavity (PA cavity) which are obtained through analysis and processing of the MCU micro control unit, namely preset time, and the disturbance variable feedback value, namely the parameters, making a synchronous control strategy, setting the optimal delay set value of the next pulse discharge, namely the preset time, and transmitting the optimal delay set value to the MCU micro control unit. The MCU micro-control unit is used for receiving the sampling data of the discharge time sequence feedback unit and the disturbance variable feedback unit, analyzing and processing the sampling data, uploading the data to the CPU main control unit, receiving the optimal delay setting value of the next pulse discharge of the CPU, and providing the triggering of discharge signals for the MO cavity and the PA cavity. The discharge time sequence feedback unit is used for sampling discharge signals of the MO cavity and the PA cavity, outputting optical signals, and conditioning the two paths of V through potential translation, impedance transformation, filtering, attenuation and the like CP And capturing zero crossing points and feeding back to the MCU micro-control unit. The disturbance variable feedback unit is used for acquiring multiple paths of state signals to form a multipoint temperature state monitoring (namely, corresponding temperature) and feeding the multipoint temperature state monitoring back to the MCU. The pulse output triggering unit is used for realizing nanosecond delay adjustment of the two-way triggering signal.
The CPU master control unit can comprise a delay controller and an ignition trigger. The delay controller sets the optimal delay of the next pulse discharge, namely the preset time according to the delay difference of the discharge signals of the two paths, namely the preset time and the feedback quantity of each disturbance. The ignition trigger is used for providing ignition trigger signals for the resonant power supply MO, the resonant power supply PA and the MCU micro-control unit.
The MCU micro-control unit can comprise a high-speed microcontroller and a low-speed microcontroller. Wherein, the high-speed microcontroller collects the two paths V CP The zero crossing point signal of the pulse discharge delay difference value of the last pulse is obtained by adopting a filtering algorithm, namely the preset time is obtained, and the lower pulse discharge delay difference value transmitted to the low-speed microcontroller through the CPU main control unit is receivedAnd a pulse discharge optimal delay set value, namely preset time, provides a double-path discharge high-precision trigger signal for the MO cavity and the PA cavity. The low-speed microcontroller is used for collecting and processing each path of disturbance variable feedback signals and directly transmitting signals between the CPU main control unit and the MCU micro-control unit.
The discharge time sequence feedback unit comprises a pulse voltage division sampler, a photoelectric detector, an impedance matching module, a signal conditioning module and an AD conversion module. Wherein the pulse voltage division sampler is used for discharging signals MO V to MO cavity and PA cavity CP 、PA V CP The steep pulse of ten thousand volts high voltage nanosecond level is sampled. The photoelectric detector is used for sampling and capturing the light-emitting signals of the gas of the MO cavity and the PA cavity. The impedance matching module is used for carrying out impedance transformation on the sampling signal and improving the signal to noise ratio. The signal conditioning module is used for filtering and limiting the sampled signals, and realizing equal proportion attenuation of the signals. The AD conversion module converts the sampling signal into a digital signal which can be processed by the MCU and stores the digital signal into the high-speed microcontroller.
The disturbance variable feedback unit comprises a temperature collector of the MO cavity, a temperature collector of the PA cavity, a temperature collector of the MO magnetic switch and a temperature collector of the PA magnetic switch.
The details are not described here again, but reference is made to the foregoing.
The embodiment of the application also provides a dual-cavity excimer laser, which comprises a main vibration cavity and a power amplification cavity, wherein the main vibration cavity discharges in advance of the preset time of the power amplification cavity, so that after the main vibration cavity discharges, the power amplification cavity discharges based on a discharge result output by the main vibration cavity; the laser further includes: a processor, a micro control unit; the micro control unit is used for: aiming at each discharging process of the dual-cavity excimer laser, acquiring corresponding advanced preset time and acquiring parameters corresponding to delay time for determining discharging of each cavity, wherein the delay time refers to the delay time of a power switch device in a solid-state switch magnetic pulse booster power supply corresponding to each cavity from the transmission of a discharging signal for indicating discharging to the end of discharging of the corresponding cavity; the processor is configured to: and determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
The details are not described here again, but reference is made to the foregoing.
It should be understood that the specific order or hierarchy of steps in the processes disclosed are examples of exemplary approaches. Based on design preferences, it is understood that the specific order or hierarchy of steps in the processes may be rearranged without departing from the scope of the present disclosure. The accompanying method claims present elements of the various steps in a sample order, and are not meant to be limited to the specific order or hierarchy presented.
The foregoing description of the embodiments and specific examples of the present invention has been presented for purposes of illustration and description; this is not the only form of practicing or implementing the invention as embodied. The description covers the features of the embodiments and the method steps and sequences for constructing and operating the embodiments. However, other embodiments may be utilized to achieve the same or equivalent functions and sequences of steps.
In the foregoing detailed description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the subject matter require more features than are expressly recited in each claim. Rather, as the following claims reflect, invention lies in less than all features of a single disclosed embodiment. Thus the following claims are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate preferred embodiment of this invention.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. As will be apparent to those skilled in the art; various modifications to these embodiments will be readily apparent, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description includes examples of one or more embodiments. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the aforementioned embodiments, but one of ordinary skill in the art may recognize that many further combinations and permutations of various embodiments are possible. Accordingly, the embodiments described herein are intended to embrace all such alterations, modifications and variations that fall within the scope of the appended claims. Furthermore, as used in the specification or claims, the term "comprising" is intended to be inclusive in a manner similar to the term "comprising," as interpreted when employed as a transitional word in a claim. Furthermore, any use of the term "or" in the specification of the claims is intended to mean "non-exclusive or".
Those of skill in the art will further appreciate that the various illustrative logical blocks (illustrative logical block), units, and steps described in connection with the embodiments of the invention may be implemented by electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components (illustrative components), elements, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design requirements of the overall system. Those skilled in the art may implement the described functionality in varying ways for each particular application, but such implementation is not to be understood as beyond the scope of the embodiments of the present invention.
The various illustrative logical blocks or units described in the embodiments of the invention may be implemented or performed with a general purpose processor, a digital signal processor, an Application Specific Integrated Circuit (ASIC), a field programmable gate array or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described. A general purpose processor may be a microprocessor, but in the alternative, the general purpose processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a digital signal processor and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a digital signal processor core, or any other similar configuration.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may be stored in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. In an example, a storage medium may be coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC, which may reside in a user terminal. In the alternative, the processor and the storage medium may reside as distinct components in a user terminal.
In one or more exemplary designs, the above-described functions of embodiments of the present invention may be implemented in hardware, software, firmware, or any combination of the three. If implemented in software, the functions may be stored on a computer-readable medium or transmitted as one or more instructions or code on the computer-readable medium. Computer readable media includes both computer storage media and communication media that facilitate transfer of computer programs from one place to another. A storage media may be any available media that can be accessed by a general purpose or special purpose computer. For example, such computer-readable media may include, but is not limited to, RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that may be used to carry or store program code in the form of instructions or data structures and other data structures that may be read by a general or special purpose computer, or a general or special purpose processor. Further, any connection is properly termed a computer-readable medium, e.g., if the software is transmitted from a website, server, or other remote source via a coaxial cable, fiber optic cable, twisted pair, digital Subscriber Line (DSL), or wireless such as infrared, radio, and microwave, and is also included in the definition of computer-readable medium. The disks (disks) and disks (disks) include compact disks, laser disks, optical disks, DVDs, floppy disks, and blu-ray discs where disks usually reproduce data magnetically, while disks usually reproduce data optically with lasers. Combinations of the above may also be included within the computer-readable media.
The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the invention, and is not meant to limit the scope of the invention, but to limit the invention to the particular embodiments, and any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (10)
1. The synchronous control method of the dual-cavity excimer laser is characterized in that the dual-cavity excimer laser comprises a main vibration cavity and a power amplification cavity, wherein the main vibration cavity discharges in advance of the power amplification cavity by preset time, so that after the main vibration cavity discharges, the power amplification cavity discharges based on a discharge result output by the main vibration cavity; the method comprises the following steps:
aiming at each discharging process of the dual-cavity excimer laser, acquiring corresponding advanced preset time and acquiring parameters corresponding to delay time for determining discharging of each cavity, wherein the delay time refers to the delay time of a power switch device in a solid-state switch magnetic pulse booster power supply corresponding to each cavity from the transmission of a discharging signal for indicating discharging to the end of discharging of the corresponding cavity;
And determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
2. The method of claim 1, wherein the acquiring the corresponding advanced preset time comprises:
and collecting discharge signals of zero crossing points corresponding to the cavities, and determining corresponding preset time between the corresponding discharge signals according to a filtering algorithm to serve as the collected preset time.
3. The method according to claim 1 or 2, characterized in that the method further comprises:
after the discharge signals are acquired, the MCU acquires the discharge signals of zero crossing points corresponding to the cavities, so that the preset time is acquired according to a filtering algorithm, and the acquired preset time is sent to the CPU through the MCU, so that the acquisition of the preset time is completed.
4. The method according to claim 3, wherein the acquiring, by the MCU, the discharge signal of the zero crossing point corresponding to each cavity to acquire the preset time according to the filtering algorithm, and transmitting, by the MCU, the acquired preset time to the CPU, includes:
A high-speed microcontroller (402) in the MCU is used for acquiring the discharge signals of zero crossings corresponding to the cavities, and acquiring the preset time according to a filtering algorithm;
the high-speed microcontroller (402) sends the acquired preset time to a low-speed microcontroller (401) in the MCU, and the low-speed microcontroller (401) sends the acquired preset time to a delay controller (301) in the CPU, so that the delay controller (301) determines the preset time of the next discharge according to the received preset time.
5. The method of claim 1, wherein the acquiring parameters for determining a time delay correspondence of each cavity discharge comprises:
the temperature of the main vibration cavity is acquired through a temperature acquisition device (601) of the main vibration cavity in the disturbance variable feedback unit, the temperature of the power amplification cavity is acquired through a temperature acquisition device (602) of the power amplification cavity in the disturbance variable feedback unit, the temperature of a magnetic switch of the main vibration cavity is acquired through a temperature acquisition device (603) of the magnetic switch of the main vibration cavity in the disturbance variable feedback unit, and the temperature of the magnetic switch of the power amplification cavity is acquired through a temperature acquisition device (604) of the magnetic switch of the power amplification cavity in the disturbance variable feedback unit;
And acquiring preset charging voltage of the resonant power supply of the main vibration cavity and preset charging voltage of the resonant power supply of the power amplification cavity, so that the acquired corresponding temperature and the acquired corresponding charging voltage are used as preset time for the next discharge under parameters.
6. The method according to claim 1, wherein the method further comprises:
after the preset time of the next discharging is determined, the determined preset time is sent to a low-speed microcontroller (401) in the MCU through a delay controller (301) in the CPU, and then sent to a high-speed microcontroller (402) through the low-speed microcontroller (401), and a pulse output triggering unit (205) is controlled by the high-speed microcontroller (402) to respectively send corresponding pulse signals to corresponding cavities for triggering discharging according to the determined preset time;
the method further comprises the steps of: an ignition trigger (302) in the CPU is controlled to work through a delay controller (301) so as to respectively provide charging signals for a resonance power supply of the main vibration cavity and a resonance power supply of the power amplification cavity through the ignition trigger (302) to charge the corresponding resonance power supply;
setting the voltage of the resonant power supply of the main vibrating cavity and the voltage of the resonant power supply of the power amplifying cavity respectively through a time delay controller (301);
A trigger signal is provided to the MCU by an ignition trigger (302) to cause the MCU to initialize according to the trigger signal.
7. The method of claim 5, wherein the method further comprises:
the low-speed microcontroller (401) in the MCU receives the corresponding temperature acquired by the corresponding temperature acquisition device and sends the corresponding temperature to the delay controller (301) in the CPU so as to determine the preset time of the next discharge.
8. The method according to claim 2, wherein the collecting the discharge signal of the zero crossing point corresponding to each cavity comprises:
the pulse voltage division sampler (501) in the discharge time sequence feedback unit divides the discharge signal of the ultra-high voltage of the main vibration cavity and the discharge signal of the ultra-high voltage of the power amplification cavity according to the resistance-capacitance voltage division circuit;
sampling an optical signal of the main vibration cavity and an optical signal of the power amplification cavity by a photoelectric detector (502) in the discharge time sequence feedback unit;
the impedance matching module (503) in the discharge time sequence feedback unit is used for carrying out impedance transformation on the divided discharge signal and the light-emitting signal of the main vibration cavity, and the signal conditioning module (504) in the discharge time sequence feedback unit is used for filtering and limiting the corresponding signal after transformation so as to attenuate the corresponding signal in equal proportion to match the voltage grade of the AD conversion module (505) at the later stage;
Corresponding discharge signals and light-emitting signals attenuated in equal proportion are converted into digital signals which can be processed by an MCU through an AD conversion module (505) in the discharge time sequence feedback unit and stored in a high-speed microcontroller (402) so as to acquire the discharge signals of zero crossing points.
9. The control equipment is characterized by being used for synchronously controlling a dual-cavity excimer laser, wherein the dual-cavity excimer laser comprises a main vibration cavity and a power amplification cavity, and the main vibration cavity discharges in advance of the power amplification cavity by preset time so that after the main vibration cavity discharges, the power amplification cavity discharges based on a discharge result output by the main vibration cavity; the apparatus comprises: a processor, a micro control unit;
the micro control unit is used for: aiming at each discharging process of the dual-cavity excimer laser, acquiring corresponding advanced preset time and acquiring parameters corresponding to delay time for determining discharging of each cavity, wherein the delay time refers to the delay time of a power switch device in a solid-state switch magnetic pulse booster power supply corresponding to each cavity from the transmission of a discharging signal for indicating discharging to the end of discharging of the corresponding cavity;
the processor is configured to:
And determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
10. The dual-cavity excimer laser is characterized by comprising a main vibration cavity and a power amplification cavity, wherein the main vibration cavity discharges in advance of the power amplification cavity by preset time, so that after the main vibration cavity discharges, the power amplification cavity discharges based on a discharge result output by the main vibration cavity; the laser further includes: a processor, a micro control unit;
the micro control unit is used for: aiming at each discharging process of the dual-cavity excimer laser, acquiring corresponding advanced preset time and acquiring parameters corresponding to delay time for determining discharging of each cavity, wherein the delay time refers to the delay time of a power switch device in a solid-state switch magnetic pulse booster power supply corresponding to each cavity from the transmission of a discharging signal for indicating discharging to the end of discharging of the corresponding cavity;
the processor is configured to:
And determining the preset time of the next discharge according to the acquired preset time, parameters and preset control relation, wherein the preset time is used for determining the corresponding preset time among the discharge signals corresponding to each cavity so as to trigger the corresponding discharge signals, and the corresponding discharge signals are used for triggering the corresponding cavities to discharge.
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