CN117542769A - Substrate lifting mechanism - Google Patents
Substrate lifting mechanism Download PDFInfo
- Publication number
- CN117542769A CN117542769A CN202210917461.XA CN202210917461A CN117542769A CN 117542769 A CN117542769 A CN 117542769A CN 202210917461 A CN202210917461 A CN 202210917461A CN 117542769 A CN117542769 A CN 117542769A
- Authority
- CN
- China
- Prior art keywords
- lifting mechanism
- horizontal
- substrate lifting
- toothed plate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 72
- 230000007246 mechanism Effects 0.000 title claims abstract description 36
- 239000002184 metal Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 abstract description 9
- 238000009434 installation Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 239000008187 granular material Substances 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 30
- 239000007788 liquid Substances 0.000 description 18
- 238000001035 drying Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000013585 weight reducing agent Substances 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 239000013618 particulate matter Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Abstract
The substrate lifting mechanism comprises a main body support, wherein the main body support comprises a plurality of horizontal supporting rods, the plurality of horizontal supporting rods are mutually parallel and are arranged at intervals, and each horizontal supporting rod comprises two side walls; the top of the toothed plate is provided with a plurality of slots which are distributed at equal intervals and used for holding a plurality of substrates; wherein, at least one lateral wall of every horizontal branch is installed the pinion rack is provided with locating component between horizontal branch and the pinion rack. The toothed plate is fixed with the horizontal strut through the locating component block, can improve the positioning accuracy between the two, reduces the debugging degree of difficulty, improves the reliability of installation and the stability that the base plate kept, avoids the base plate to lead to adjacent base plate part overlapping or contact because of keeping poor slope of stability, influences cleaning performance, produces defects such as granule pollution.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing equipment, in particular to a substrate lifting mechanism.
Background
The tank type cleaning device is capable of simultaneously processing a plurality of substrates, and comprises a cleaning unit and a drying unit. The cleaning unit comprises a plurality of cleaning tanks for containing different types of cleaning liquids, and the substrate is cleaned by the different types of cleaning liquids so as to remove different types of pollutants on the surface of the substrate. The drying unit includes a reservoir containing DIW (deionized water) and a drying chamber located above the reservoir. The cleaning tank and the liquid storage tank are both provided with a substrate lifting mechanism for holding and lifting the substrate.
The drying unit can adopt an ultra-low pressure drying process to dry the substrate. In the drying process, high temperature N2 (nitrogen) and high temperature IPA (isopropyl alcohol) vapor are supplied to the drying chamber, then the substrate lifting mechanism slowly lifts the substrate from the pure water in the liquid storage tank, replaces the surface moisture of the substrate with IPA, and then reduces the pressure in the drying chamber, namely, evaporates the IPA under vacuum condition, thereby realizing the drying of the substrate.
Japanese patent JB 3714763B discloses a substrate lifting mechanism, including main body support and pinion rack, the pinion rack has a plurality of slot for equidistant multi-disc base plate that keeps, and the pinion rack passes through a plurality of screws level to be fixed on main body support, and this kind of assembly mode is because there is no location structure between pinion rack and the main body support, and the installation reliability is difficult to guarantee, can't ensure that all slots of pinion rack remain tangent with the base plate, and then influences the stability that the base plate kept. Therefore, it is necessary to design a substrate lifting mechanism capable of stably holding a substrate.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a substrate lifting mechanism for solving the problem of substrate holding instability in the prior art.
To achieve the above and other related objects, the present invention provides a substrate lifting mechanism, comprising:
the main body support comprises a plurality of horizontal struts which are parallel to each other and are arranged at intervals, and each horizontal strut comprises two side walls;
the top of the toothed plate is provided with a plurality of slots which are arranged at equal intervals and used for holding a plurality of substrates;
wherein,
at least one side wall of each horizontal strut is provided with a toothed plate, and a positioning assembly is arranged between the horizontal strut and the toothed plate.
As an alternative, the positioning assembly includes:
the positioning shaft is arranged on the side wall of the toothed plate;
the positioning hole is arranged on the side wall of the horizontal supporting rod;
the toothed plate and the horizontal support rod are clamped and fixed through the positioning shaft and the positioning hole.
As an alternative, the horizontal strut further comprises a fastener, the positioning shaft is provided with a shaft hole, and the fastener passes through the shaft hole and the positioning hole to fix the toothed plate with the horizontal strut.
As an alternative, the top of each horizontal strut has a flow guiding surface.
As an alternative, the flow guiding surface is any one of an inclined plane, an inclined cambered surface, a herringbone inclined plane and an arched surface.
As an alternative, the toothed plate is spaced apart from the horizontal strut by a predetermined distance.
As an alternative, the slot is a Y-slot.
As an alternative, a diversion trench is arranged at the bottom of the slot.
As an alternative, the main body support further comprises a vertical support, one end of the vertical support is connected with the horizontal strut, the vertical support is provided with a front surface facing the horizontal strut and a back surface facing away from the horizontal strut, and the back surface is provided with a weight reduction groove.
As an alternative, the weight-reducing groove has a groove bottom and a groove wall, wherein the groove wall includes a lower sidewall located below in a vertical direction, and the lower sidewall is a downward inclined surface.
As an alternative, the vertical support is a non-hollowed-out plate.
As an alternative, the main body support is a metal support, and the outer side of the metal support is provided with a corrosion-resistant coating.
As described above, the present invention provides a substrate lifting mechanism, which has the following beneficial effects:
1) The toothed plate is clamped and fixed with the horizontal support rod, so that the positioning precision between the toothed plate and the horizontal support rod can be improved, the debugging difficulty is reduced, the mounting reliability and the substrate holding stability are improved, and the defects that the adjacent substrates are partially overlapped or contacted, the cleaning effect is influenced, the particle pollution is generated and the like due to poor substrate holding stability are avoided;
2) The top surface of the horizontal support rod is provided with a flow guide surface, a preset interval is arranged between the toothed plate and the horizontal support rod, and a Y-shaped slot is adopted, so that liquid residues in a contact area between the substrate and the substrate lifting mechanism can be effectively reduced, and the risk of particle pollution of the substrate is reduced;
3) The main body support adopts a metal support, and compared with the traditional quartz support, the main body support has the advantages of high strength, easiness in processing, light weight, low cost and the like, and the main body support is convenient to process a weight reduction groove due to the adoption of the metal support, so that the load of a driving mechanism for driving the main body support to lift is reduced, and the running stability of a substrate lifting mechanism is improved;
4) The downward design of the lower side wall of the weight reduction groove is beneficial to the downward and timely discharge of the liquid remained in the weight reduction groove, so that the phenomenon that the residual liquid is blown away everywhere by IPA vapor or N2 in the drying process and drops on the surface of a substrate to cause particle pollution is avoided.
Drawings
FIG. 1 is a perspective view of a substrate lifting mechanism according to an embodiment of the invention;
FIG. 2 is a side view of a substrate lifting mechanism according to an embodiment of the invention;
FIG. 3 is a partial enlarged view at B in FIG. 2;
FIG. 4 is a perspective view of a body mount according to an embodiment of the present invention;
FIG. 5 shows a cross-section in the direction A-A of FIG. 2;
FIG. 6 shows a partial enlarged view at C in FIG. 5;
fig. 7 shows a partial enlarged view at D in fig. 5.
1-a main body support; 11-vertical supports; 111-a weight-reducing groove, 112-a lower side wall; 12-horizontal support rod, 121-horizontal support rod one, 122-horizontal support rod two, 123-horizontal support rod three, 124-positioning hole, 125-guide surface, 13-connecting plate, 14-interval
2-toothed plate, 21-slot, 22-diversion trench, 23-positioning shaft, 231-shaft hole
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which is to be read in light of the following specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
As shown in fig. 1 and 2, the substrate lifting mechanism is mainly composed of two parts, namely a main body bracket 1 and a toothed plate 2 mounted on the main body bracket 1. The toothed plate 2 is formed in a thin plate shape as a whole, and has a plurality of equally spaced slots 21 thereon, each slot 21 being for holding a piece of substrate w, the substrate w being held in the slot 21 in a vertical direction. Referring to fig. 3, the slot 21 is a Y-shaped slot 21 such that a gap between a contact point of the substrate w with the slot 21 and a bottom of the slot 21 increases. The bottom of the Y-shaped slot 21 is also provided with a diversion trench 22 for discharging the residual liquid in the slot 21 to the side face of the toothed plate 2. The slot 21 adopts a Y-shaped design and the diversion trench 22 extending at the bottom of the slot 21 can reduce the residue of treatment fluid (such as water, IPA and the like) in the slot 21, and reduce the risk of watermark and particle pollution of the substrate w.
Fig. 4 is a perspective view of the main body holder 1. The main body bracket 1 includes a vertical bracket 11, a plurality of horizontal struts 12, and a connection plate 13. A plurality of horizontal struts 12 are arranged parallel to each other and spaced apart for fixing the toothed plate 2. One end of a plurality of horizontal struts 12 is welded at the lower end of the vertical support 11, and the other ends of the plurality of horizontal struts 12 are all fixed on the connecting plate 13, thereby increasing the stability of the main body support 1. Each horizontal strut 12 comprises two side walls, at least one side wall of each horizontal strut 12 being fitted with a toothed plate 2. As shown in fig. 1 and 4, the horizontal strut 12 has three horizontal struts 12, namely a horizontal strut one 121, a horizontal strut two 122 and a horizontal strut three 123, respectively, the horizontal strut two 122 is located in the middle of the horizontal strut one 121 and the horizontal strut three 123, and toothed plates 2 are mounted on both sides of each horizontal strut 12. The toothed plate 2 fixed on the second horizontal strut 122 is used for supporting the bottommost position of the substrate w, and the toothed plates 2 fixed on the first horizontal strut 121 and the third horizontal strut 123 are used for supporting the edge positions on both sides of the bottommost position of the substrate w.
A positioning assembly is arranged between the toothed plate 2 and the horizontal strut 12 to improve the mounting accuracy and the stability of the substrate holding between the two. Referring to fig. 5 to 7, the toothed plate 2 is provided with a positioning shaft 23, the horizontal strut 12 is provided with a positioning hole 124, the toothed plate 2 and the horizontal strut 12 are engaged and fixed with the positioning hole 124 through the positioning shaft 23, and good installation and positioning can be realized through the matching of the shaft hole 231. The cross-section of the positioning hole 124 and the positioning shaft 23 may be circular, polygonal, or the like. The positioning shaft 23 is further provided with a shaft hole 231, and a fastener (not shown, for example, a bolt) can lock the toothed plate 2 with the horizontal strut 12 through the shaft hole 231 and the positioning hole 124.
Referring to fig. 1 and 4 again, the vertical support 11 is plate-shaped, and includes a non-hollow plate 110, wherein a side of the non-hollow plate 110 facing away from the substrate w is a back surface, a side of the non-hollow plate 110 facing the substrate is a front surface, and the non-hollow plate 110 is a solid plate, and has no holes penetrating the front surface and the back surface of the non-hollow plate 110, so that liquids such as DIW and IPA can be prevented from dripping from the back surface of the plate body to the surface of the substrate. The vertical support 11 serves as a connecting member, and has an upper end connected to a driving mechanism (not shown) for driving the substrate lifting mechanism to rise and fall, and a lower end connected to a horizontal strut 12. In this embodiment, the main body support 1 is a metal support, and the outer side of the metal support is provided with a corrosion-resistant coating. Specifically, the main body support 1 is a stainless steel support, and the corrosion-resistant coating is a polytetrafluoroethylene coating. The main body support 1 is made of stainless steel, and has the advantages of being not fragile, high in strength, easy to process and the like compared with the traditional quartz material.
As shown in fig. 1, in order to reduce the operation load of the driving mechanism and improve the operation stability of the substrate lifting mechanism, a weight-reducing groove 111 is formed on a surface of the vertical support 11 facing away from the horizontal strut 12, so as to reduce the weight of the substrate lifting mechanism. The weight-reducing groove 111 has a groove bottom and a groove wall, and the groove bottom of the weight-reducing groove 111 is a solid plate, i.e. the weight-reducing groove 111 is observed from the back surface of the vertical support 11 to the front surface of the vertical support 11, and the groove bottom of the weight-reducing groove 111 is not hollowed out. The wall of the weight-reducing groove 111 includes a lower side wall 112 located vertically below. The lower side wall 112 of the weight-reducing tank 111 is designed to be inclined downward, so that accumulation of liquid in the weight-reducing tank 111 can be avoided. The illustration in fig. 1 is only an example and is not intended to limit the number and shape of the weight-reducing grooves 111. For example, in the substrate w drying apparatus, the substrate lifting mechanism lifts the substrate w immersed in deionized water upward so that the substrate w is dried in the atmosphere of N2 and IPA in the drying chamber, in this process, the IPA and N2 purge the substrate w and the substrate lifting mechanism downward, and since the lower sidewall 112 of the weight reduction tank 111 is designed to be an inclined downward slope, the residual liquid on the vertical support 11 is discharged downward along the lower sidewall 112, and does not purge from the back surface of the vertical support 11 to the front surface of the vertical support 11, so that the residual liquid in the weight reduction tank 111 is prevented from splashing around and contaminating the substrate surface.
In addition, the processing liquid such as DIW and IPA is easily accumulated in the contact area between the bottom of the substrate w and the toothed plate 2, and eventually particle contamination occurs at the contact point of the bottom of the substrate w. In order to enable the treatment liquid to be smoothly discharged from the bottom of the substrate w, referring to fig. 6 and 7, a space 14 is reserved between the toothed plate 2 and the horizontal strut 12, and residual liquid can be discharged from the space 14, so that the liquid residue in the contact area between the substrate w and the toothed plate is reduced. In the present embodiment, the space 14 is formed between the tooth plate 2 and the horizontal strut 12 by the length of the positioning shaft 23 being greater than the depth of the positioning hole 124.
In order to further avoid water marks and the like on the surface of the substrate w caused by liquid residues, the top of the horizontal strut 12 is provided with a flow guiding surface 125 so as to smoothly discharge the residual liquid dropped onto the horizontal strut 12. The cross-sectional shape of the flow guide surface 125 may be any of an inclined plane, an inclined arc surface, a chevron-shaped inclined surface, and an arc surface. As shown in fig. 6, baffle 125 is a sloped ramp, and as shown in fig. 7, baffle 125 is an arcuate surface.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (12)
1. A substrate lifting mechanism, comprising:
the main body support comprises a plurality of horizontal struts which are parallel to each other and are arranged at intervals, and each horizontal strut comprises two side walls;
the top of the toothed plate is provided with a plurality of slots which are arranged at equal intervals and used for holding a plurality of substrates;
wherein,
at least one side wall of each horizontal strut is provided with a toothed plate, and a positioning assembly is arranged between the horizontal strut and the toothed plate.
2. The substrate lifting mechanism of claim 1, wherein the positioning assembly comprises:
the positioning shaft is arranged on the side wall of the toothed plate;
the positioning hole is arranged on the side wall of the horizontal supporting rod;
the toothed plate and the horizontal support rod are clamped and fixed through the positioning shaft and the positioning hole.
3. The substrate lifting mechanism of claim 2, further comprising a fastener, wherein the positioning shaft is provided with a shaft hole, and wherein the fastener passes through the shaft hole and the positioning hole to fix the toothed plate to the horizontal strut.
4. The substrate lifting mechanism of claim 1, wherein a top portion of each of the horizontal struts has a flow guiding surface.
5. The substrate lifting mechanism of claim 4, wherein the flow guiding surface is any one of an inclined plane, an inclined cambered surface, a herringbone inclined surface, and an arched surface.
6. The substrate lifting mechanism of claim 1, wherein the toothed plate is spaced apart from the horizontal struts by a predetermined distance.
7. The substrate lifting mechanism of claim 1, wherein the slot is a Y-slot.
8. The substrate lifting mechanism of claim 7, wherein a bottom of the slot is provided with a diversion trench.
9. The substrate lifting mechanism of claim 1, wherein the main body support further comprises a vertical support, one end of the vertical support is connected to the horizontal strut, the vertical support has a front face facing the horizontal strut and a back face facing away from the horizontal strut, and the back face is provided with a weight-reducing groove.
10. The substrate lifting mechanism of claim 9, wherein the weight-reducing groove has a groove bottom and a groove wall, wherein the groove wall includes a lower sidewall located vertically below, the lower sidewall being a downwardly sloped ramp.
11. The substrate lifting mechanism of claim 9, wherein the vertical support is a non-hollowed-out plate.
12. The substrate lifting mechanism of claim 1, wherein the body support is a metal support having a corrosion resistant coating on an outside of the metal support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210917461.XA CN117542769A (en) | 2022-08-01 | 2022-08-01 | Substrate lifting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210917461.XA CN117542769A (en) | 2022-08-01 | 2022-08-01 | Substrate lifting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117542769A true CN117542769A (en) | 2024-02-09 |
Family
ID=89794432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210917461.XA Pending CN117542769A (en) | 2022-08-01 | 2022-08-01 | Substrate lifting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117542769A (en) |
-
2022
- 2022-08-01 CN CN202210917461.XA patent/CN117542769A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100357316B1 (en) | Substrate drying apparatus and substrate drying method | |
| KR100481855B1 (en) | Apparatus for manufacturing intergrated circuit device | |
| KR100655431B1 (en) | Wafer carrier for lessoning contact area with wafers and wafer cleaning method using the same | |
| KR100246593B1 (en) | Semiconductor wafer carrier | |
| KR20050044443A (en) | Semiconductor wafer cleaning system and method | |
| US6340090B1 (en) | Substrate fixturing device | |
| CN117542769A (en) | Substrate lifting mechanism | |
| IL161249A (en) | Device for accommodating substrates | |
| JPH07310192A (en) | Washing treatment device | |
| KR100645042B1 (en) | Apparatus for cleaning semiconductor substrates | |
| CN215785546U (en) | Conversion transition device and wafer cleaning equipment | |
| JP2008093525A (en) | Washing apparatus and washing method | |
| JP3714763B2 (en) | Substrate holding member and substrate processing apparatus using the same | |
| KR102301370B1 (en) | Batch type apparatus for treating substrate | |
| CN220914179U (en) | Wafer basket | |
| US20010047817A1 (en) | Wafer cleaning device and tray for use in wafer cleaning device | |
| JP5774341B2 (en) | Substrate holder and substrate processing apparatus | |
| JP5871478B2 (en) | Substrate holder and substrate processing apparatus | |
| RU2510098C1 (en) | Method and device to wash and dry substrates | |
| US20230178387A1 (en) | Apparatus and method of treating substrate | |
| KR20060044186A (en) | Dry cleaning apparatus used in manufacturing semiconductor devices | |
| KR20040022091A (en) | Apparatus for drying a semiconductor wafer using vapor dry method | |
| KR101484162B1 (en) | Apparatus for drying substrate | |
| KR200181482Y1 (en) | A semiconductor device fabrication installation | |
| KR20230024642A (en) | Spin chunk having screw and substrate processing apparatus having the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |