CN117529788A - Capacitor module, method for using capacitor module, and method for manufacturing capacitor module - Google Patents
Capacitor module, method for using capacitor module, and method for manufacturing capacitor module Download PDFInfo
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- CN117529788A CN117529788A CN202280042284.3A CN202280042284A CN117529788A CN 117529788 A CN117529788 A CN 117529788A CN 202280042284 A CN202280042284 A CN 202280042284A CN 117529788 A CN117529788 A CN 117529788A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 332
- 238000000034 method Methods 0.000 title claims description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000007791 liquid phase Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000005266 casting Methods 0.000 description 17
- 230000008878 coupling Effects 0.000 description 16
- 238000010168 coupling process Methods 0.000 description 16
- 238000005859 coupling reaction Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 12
- 239000011104 metalized film Substances 0.000 description 10
- 229920001187 thermosetting polymer Polymers 0.000 description 9
- 230000004907 flux Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The capacitor module is configured by connecting a plurality of capacitors (1 st capacitor, 2 nd capacitor). Each capacitor comprises: a capacitor element having a pair of end surfaces and electrodes formed on the end surfaces; bus bars connected to the electrodes; and an exterior body covering the whole of the capacitor element and a part of the bus bar. The plurality of capacitors are arranged such that electrodes of adjacent capacitors face each other with the exterior body interposed therebetween.
Description
Technical Field
The invention relates to a capacitor module, a method for using the capacitor module, and a method for manufacturing the capacitor module.
Background
For example, patent document 1 describes a capacitor in which a plurality of capacitor elements each having electrode portions at both end surfaces are arranged so that the electrode portions face each other, and are housed in a case, and the case is filled with a resin.
In the capacitor of patent document 1, in each capacitor element, a 1 st lead terminal is connected to one electrode portion, and a 2 nd lead terminal is connected to the other electrode portion. Each 1 st lead terminal is connected to the 1 st electrode plate, and each 2 nd lead terminal is connected to the 2 nd electrode plate. Each electrode plate has an external connection terminal extending outward of the case.
The 2 electrode portions facing each other are connected to the same electrode plate via lead terminals so that the polarities are the same.
Prior art literature
Patent literature
Patent document 1: JP-A2011-54616
Disclosure of Invention
Problems to be solved by the invention
In the capacitor described above, for example, the polarities of the electrode portions can be made different by connecting the opposing 2 electrode portions to different electrode plates via lead terminals.
In the case of such a configuration, when a current flows through the plurality of capacitor elements, magnetic fluxes in opposite directions are generated in adjacent capacitor elements, and therefore, these magnetic fluxes cancel each other out and become small. This reduces the equivalent series inductance (ESL) of each capacitor element.
However, if the positioning accuracy is low when a plurality of capacitor elements are accommodated in the case, the electrode portions of the adjacent capacitor elements having different poles may come too close to or come into contact with each other, and there is a possibility that insulation may not be sufficiently ensured between the electrode portions.
Accordingly, an object of the present invention is to provide a capacitor module, a method of using the capacitor module, and a method of manufacturing the capacitor module, which can reduce equivalent series inductance and ensure sufficient insulation between electrodes of adjacent capacitor elements.
Means for solving the problems
A 1 st aspect of the present invention relates to a capacitor module capacitor configured by connecting a plurality of capacitors. In the capacitor module according to the present embodiment, each of the capacitors includes: a capacitor element having a pair of end surfaces and an electrode formed on each of the end surfaces; a bus bar connected to each of the electrodes; and an exterior body that covers the whole of the capacitor element and a part of the bus bar. The plurality of capacitors are arranged such that the electrodes of adjacent capacitors face each other with the exterior body interposed therebetween.
The 2 nd aspect of the present invention relates to a method for using the capacitor module. The method of using the capacitor according to the present embodiment uses the capacitor module according to the above-described 1 st embodiment such that 2 electrodes facing each other in adjacent capacitors are at different potentials.
A 3 rd aspect of the present invention relates to a method for manufacturing a capacitor module. The manufacturing method according to the present embodiment includes the steps of: forming a capacitor element assembly by connecting bus bars at electrodes formed at a pair of end surfaces of the capacitor element; the capacitor element assembly is accommodated in a mold member, resin in a liquid phase state is injected into the mold member so that the whole capacitor element is immersed in the resin and the resin is cured, and the cured resin is used as an outer package to cover the capacitor of the capacitor element assembly; and connecting a plurality of the capacitors such that the electrodes of adjacent capacitors face each other with the exterior body interposed therebetween.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, it is possible to provide a capacitor module, a method of using the capacitor module, and a method of manufacturing the capacitor module, which can reduce equivalent series inductance and can ensure sufficient insulation between electrodes of adjacent capacitor elements.
The effects and the meaning of the present invention will be further clarified by the following description of the embodiments. However, the embodiments described below are merely examples of the present invention in practice, and the present invention is not limited to the embodiments described below.
Drawings
Fig. 1 is a perspective view of a capacitor module according to an embodiment.
Fig. 2 (a) and (B) are a perspective view and an exploded perspective view, respectively, of the 1 st capacitor element assembly constituting the 1 st capacitor according to the embodiment.
Fig. 3 (a) is a plan view of the 1 st holding member holding a pair of bus bars according to the embodiment, and fig. 3 (B) and (C) are A-A 'and B-B' sectional views of fig. 3 (a), respectively.
Fig. 4 (a) and (B) are a perspective view and an exploded perspective view, respectively, of a 2 nd capacitor element assembly constituting a 2 nd capacitor according to the embodiment.
Fig. 5 is a front view of the capacitor module according to the embodiment, in which the exterior body is drawn in a transparent state and the strapping is omitted.
Fig. 6 is a diagram for explaining a method for manufacturing a capacitor module according to the embodiment.
Fig. 7 (a) and (B) are diagrams for explaining a method of manufacturing a capacitor module according to an embodiment.
Fig. 8 is a front view of a capacitor module according to a modification.
Fig. 9 is a diagram showing a structure for holding a pair of bus bars to the 1 st holding member according to a modification.
Fig. 10 is a diagram for explaining the configuration of the 1 st connecting portion and the 2 nd connecting portion according to the modification.
Fig. 11 (a) is a plan view of a fixing portion provided with a connecting portion according to a modification, and fig. 11 (B) is a plan view of a 2 nd holding member holding a bus bar according to a modification.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience, in each drawing, the front-back, left-right, and up-down directions are appropriately noted. In addition, the illustrated directions are merely representative of the relative directions of the capacitor modules, and not the absolute directions.
Fig. 1 is a perspective view of a capacitor module 1. Fig. 2 (a) and (B) are a perspective view and an exploded perspective view of the 1 st capacitor element assembly C1 constituting the 1 st capacitor 10A, respectively. Fig. 3 (a) is a plan view of the 1 st holding member 300A holding the pair of bus bars 200, and fig. 3 (B) and (C) are A-A 'and B-B' sectional views of fig. 3 (a), respectively. Fig. 4 (a) and (B) are a perspective view and an exploded perspective view of the 2 nd capacitor element assembly C2 constituting the 2 nd capacitor 10B, respectively.
Referring to fig. 1, a capacitor module 1 is provided with a plurality of, for example, 21 st capacitors 10A and 2 nd capacitors 10B. The 1 st capacitors 10A are connected in the left-right direction, and the 1 st capacitor 10A at the left-right end is connected to the 2 nd capacitor 10B. The front and rear directions of the left and right 2 nd capacitors 10B are opposite. The number of 1 st capacitors 10A is determined in accordance with a required specification such as capacitance. Therefore, according to the required specification, the capacitor module 1 may have a configuration in which the 1 st capacitor 10A is not provided and only the 2 nd capacitors 10B are provided.
Referring to fig. 1 to 3 (C), the 1 st capacitor 10A includes a capacitor element 100, a pair of bus bars 200, a 1 st holding member 300A, and an exterior body 400. The 1 st capacitor element assembly C1 is constituted by the capacitor element 100, the pair of bus bars 200, and the 1 st holding member 300A.
The capacitor element 100 is formed by stacking 2 metallized films obtained by depositing aluminum on a dielectric film, and winding or laminating the stacked metallized films and pressing the stacked metallized films into a flat shape. The capacitor element 100 is formed in a shape close to a flat long cylinder, and has a pair of end faces 101 and a peripheral face 102 sandwiched by the pair of end faces 101. In capacitor element 100, electrodes 110 are formed on both end surfaces 101 by blowing a metal such as zinc.
The capacitor element 100 of the present embodiment is formed by depositing a metallized film obtained by plating aluminum on the dielectric film, but may be formed by depositing a metallized film obtained by plating other metals such as zinc and magnesium. Alternatively, the capacitor element 100 may be formed of a metallized film obtained by vapor deposition of a plurality of metals among these metals, or may be formed of a metallized film obtained by vapor deposition of an alloy of these metals.
The pair of bus bars 200 are formed into a given shape by suitably cutting and bending from a plate of conductive material such as a copper plate. Each bus bar 200 is composed of the following elements: an electrode terminal portion 210 having a rectangular plate shape extending in the front-rear direction; a connection terminal portion 220 having a rectangular plate shape extending in the up-down direction; and a relay 230 extending in the left-right direction and having a rectangular plate shape and connecting the electrode terminal 210 and the connection terminal 220.
Each bus bar 200 is a terminal member electrically connected to each electrode 110, and its electrode terminal portion 210 is joined to each electrode 110 of the capacitor element 100 by a joining method such as soldering.
The 1 st holding member 300A is formed of a thermoplastic resin such as polyphenylene sulfide (PPS), and includes a main body 310, a 1 st connecting portion 320, and a 2 nd connecting portion 330.
The main body 310 has a rectangular plate shape. 21 st openings 311, 2 nd openings 312, and 2 rd openings 313 are formed in the main body 310. The 21 st openings 311 have a rectangular shape and are provided in the centers of the front end and the rear end of the main body 310. The 2 nd opening 312 has a rectangular shape and is provided at the left rear and right front corners of the main body 310. The 23 rd openings 313 have a rectangular shape and are provided at left front and right rear corners of the main body 310. The 1 st opening 311 has a larger area than the 2 nd opening 312, and the 2 nd opening 312 has a larger area than the 3 rd opening 313.
As shown in fig. 3B, the inner wall surfaces of the 1 st opening 311, the 2 nd opening 312, and the 3 rd opening 313 are tapered, and the diameters of these openings become larger as going from the lower surface side of the main body 310 to the upper surface side, i.e., upward (in the direction away from the capacitor element 100).
The 1 st connecting portion 320 and the 2 nd connecting portion 330 are formed to stand up from the opposite ends of the main body 310, i.e., the left and right ends, respectively. In the 1 st coupling portion 320, a recess 321 is provided on the front side of the upper end portion, an engagement piece 322 protruding leftward is formed, and an engagement protrusion 323 protruding upward is formed on the rear side of the upper end portion. In the 2 nd coupling portion 330, a recess 331 is formed at the rear side of the upper end portion, an engagement piece 332 protruding rightward is formed, and an engagement protrusion 333 protruding upward is formed at the front side of the upper end portion. The engaging piece 322 and the engaging protrusion 323 of the 1 st coupling portion 320 and the engaging piece 332 and the engaging protrusion 333 of the 2 nd coupling portion 330 have the same structure, and the 2 concave portions 321 and 331 have shapes corresponding to the 2 engaging protrusions 323 and 333.
The 1 st holding member 300A is disposed close to the upper side of the capacitor element 100 so as to face the peripheral surface 102 of the capacitor element 100, and holds the pair of bus bars 200. That is, as shown in fig. 3 (C), the pair of bus bars 200 are insert-molded to the 1 st holding member 300A so that the root portions of the connection terminal portions 220 are embedded in the body portion 310, and are held so as not to move in the up-down, front-back, and left-right directions. The connection terminal portion 220 protrudes upward from the main body portion 310. In this way, by holding the pair of bus bars 200 to the 1 st holding member 300A, good dimensional accuracy between the 2 connection terminal portions 220 is ensured.
The package 400 is formed of a thermosetting resin such as an epoxy resin, and has a rectangular parallelepiped shape. The exterior body 400 covers the entire capacitor element 100, the pair of bus bars 200, and a part of the 1 st holding member 300A. The connection terminal portions 220 of the pair of bus bars 200 and the 1 st connecting portions 320 and 2 nd connecting portions 330 of the 1 st holding member 300A are exposed to the outside from the upper surface 400A that is one surface of the outer body 400.
Referring to fig. 1, 4 (a) and (B), the 2 nd capacitor 10B includes a capacitor element 100, a pair of bus bars 200, and an exterior body 400, similarly to the 1 st capacitor 10A. Further, the 2 nd capacitor 10B includes a 2 nd holding member 300B in place of the 1 st holding member 300A. The 2 nd capacitor element assembly C2 is constituted by the capacitor element 100, the pair of bus bars 200, and the 2 nd holding member 300B.
The 2 nd holding member 300B is disposed close to the upper side of the capacitor element 100 so as to face the peripheral surface 102 of the capacitor element 100, and holds the pair of bus bars 200, similarly to the 1 st holding member 300A.
The 2 nd holding member 300B includes a main body portion 310 and a 1 st coupling portion 320, similarly to the 1 st holding member 300A. Further, the 2 nd holding member 300B includes a fixing portion 340 instead of the 2 nd connecting portion 330.
The fixing portion 340 has a plate shape of a semi-oblong shape. A circular hole 341 is formed in the fixing portion 340. A metal collar 342 is embedded in the hole 341 for reinforcement.
In the 2 nd capacitor 10B, the connection terminal portion 220 of the pair of bus bars 200 and the 1 st connecting portion 320 of the 2 nd holding member 300B are exposed to the outside from the upper surface 400A of the outer package 400, and the fixing portion 340 of the 2 nd holding member 300B is exposed from the side surface 400B of the outer package 400.
As shown in fig. 1, in the 2 nd holding member 300B of the 2 nd capacitor 10B on the left side facing in the opposite direction from the front to the rear, the 1 st connecting portion 320 has the same structure as the 2 nd connecting portion 330, and functions as the 2 nd connecting portion 330.
The 1 st connection portion 320 of one 1 st capacitor 10A and the 2 nd connection portion 330 of the other 1 st capacitor 10A are connected to each other, whereby the plurality (2 in fig. 1) of 1 st capacitors 10A are connected in the right-left direction, that is, in the direction parallel to the upper surface 400A of the package 400 to which the connection terminal portions 220 of the pair of bus bars 200 are exposed. At this time, the engaging protrusion 323 of the 1 st coupling portion 320 is fitted into the recess 331 of the engaging piece 332 of the 2 nd coupling portion 330, so that the engaging protrusion 323 is engaged with the engaging piece 332, and the engaging protrusion 333 of the 2 nd coupling portion 330 is fitted into the recess 321 of the engaging piece 322 of the 1 st coupling portion 320, so that the engaging protrusion 333 is engaged with the engaging piece 322. Thus, the movement of the plurality of 1 st capacitors 10A in the up-down direction and the front-back direction is restricted. The position of the 1 st capacitor 10A in the up-down, front-back, and left-right directions is determined.
Similarly, the 1 st capacitor 10A and the 2 nd capacitor 10B are connected in the left-right direction by connecting the 2 nd connection portion 330 of the 1 st capacitor 10A at the right end and the 1 st connection portion 320 of the 2 nd capacitor 10B at the right end. The 1 st connection portion 320 of the 1 st capacitor 10A at the left end and the 1 st connection portion 320 (functioning as the 2 nd connection portion 330) of the 2 nd capacitor 10B at the left end are connected to each other, whereby the 1 st capacitor 10A and the 2 nd capacitor 10B are connected in the left-right direction. The position between the 1 st capacitor 10A and the 2 nd capacitor 10B in the up-down, front-back, and left-right directions is determined.
The 1 st capacitor 10A and the 2 nd capacitor 10B are fixed by an adhesive between the 1 st connecting portion 320 and the 2 nd connecting portion 330, and the strapping 500 is wound around the side surface (peripheral surface) of the exterior body 400 which is integrally connected. The method for fixing the 1 st capacitor 10A and the 2 nd capacitor 10B is not limited to the above method. For example, the following method may be adopted: the 1 st connecting portion 320 and the 2 nd connecting portion 330 are fixed with an adhesive, and the side surfaces of the adjacent 2 outer packages 400 are fixed with an adhesive, without using the strapping 500; a method of fixing only the strapping 500 without using an adhesive may also be employed. For example, instead of the strapping 500, the adhesive tape may be wound around the side surface (peripheral surface) of the package 400 as a single body.
Fig. 5 is a front view of the capacitor module 1 in which the exterior body 400 is drawn in a transparent state and the strapping 500 is omitted.
In the 1 st capacitor 10A, the 1 st connecting portion 320 and the 2 nd connecting portion 330 of the 1 st holding member 300A are provided in the direction (left-right direction) in which the pair of end surfaces 101, i.e., the pair of electrodes 110, of the capacitor element 100 face. In the 2 nd capacitor 10B, the 1 st connecting portion 320 of the 2 nd holding member 300B is provided in a direction (left-right direction) in which the pair of electrodes 110 of the capacitor element 100 face. Therefore, as shown in fig. 5, the 1 st capacitor 10A and the 2 nd capacitor 10B are connected in a direction in which the pair of electrodes 110 are oriented. As a result, in the adjacent capacitors 10A and 10B (capacitor element 100), the electrodes 110 are opposed to each other with the exterior body 400 interposed therebetween.
Fig. 6, 7 (a) and (B) are diagrams for explaining a method of manufacturing the capacitor module 1. Fig. 6 is a flowchart showing a flow of the capacitor module manufacturing process, and fig. 7 (a) and (B) are diagrams for explaining a flow of the exterior body forming process.
The manufacturing process of the capacitor module 1 includes a capacitor manufacturing process and a module assembling process. In the capacitor manufacturing process, the 1 st capacitor 10A and the 2 nd capacitor 10B are formed. In the module assembling step, the capacitor module 1 is assembled by connecting the 1 st capacitor 10A and the 2 nd capacitor 10B which are produced in the capacitor manufacturing step.
The capacitor manufacturing process includes an element assembly forming process and an exterior body forming process. First, an element assembly forming process is performed. The 1 st capacitor element assembly C1 is formed by connecting the pair of bus bars 200 held by the 1 st holding member 300A with the two electrodes 110 of the capacitor element 100. Further, the 2 nd capacitor element assembly C2 is formed by connecting the pair of bus bars 200 held by the 2 nd holding member 300B with the two electrodes 110 of the capacitor element 100.
Next, an exterior body forming process is performed. In the exterior body forming step, as mold members, a casting container 2A for the 1 st capacitor 10A and a casting container 2B for the 2 nd capacitor 10B are used. The casting containers 2A and 2B are made of metal, and have a substantially rectangular parallelepiped box shape with an upper surface opening corresponding to the shape of the outer body 400. In the casting container 2B, a recess 21 corresponding to the fixing portion 340 of the 2 nd holding member 300B is formed at the upper end portion.
As shown in fig. 7 (a), the 1 st capacitor element assembly C1 is housed in the casting container 2A. At this time, the 1 st connecting portion 320 and the 2 nd connecting portion 330 are fixed by a fixing jig, not shown, and the 1 st capacitor element assembly C1 is positioned with respect to the casting container 2A. Next, a thermosetting resin such as an epoxy resin in a liquid phase state is injected into the casting container 2A. The capacitor element 100, the electrode terminal portions 210 of the pair of bus bars 200, the relay portion 230, and the main body portion 310 of the 1 st holding member 300A are immersed in a thermosetting resin in a liquid phase. Thereafter, the thermosetting resin in the casting container 2A is heated. Thus, the thermosetting resin is cured to form the package 400, and the 1 st capacitor 10A formed by coating the 1 st capacitor element assembly C1 with the package 400 is formed. The 1 st connecting portion 320, the 2 nd connecting portion 330, and the 2 connecting terminal portions 220 are exposed to the outside from the exterior body 400.
Similarly, as shown in fig. 7 (B), the 2 nd capacitor element assembly C2 is housed in the casting container 2B. At this time, the 1 st connecting portion 320 is fixed by a fixing jig, not shown, and the base end portion of the fixing portion 340 is fitted into the recess 21, whereby the 2 nd capacitor element assembly C2 is positioned with respect to the casting container 2B. The fixing portion 340 protrudes out of the casting container 2B. The concave portion 21 is closed by the sealing member 22 after being inserted into the fixing portion 340. The casting container 2B is filled with a thermosetting resin in a liquid phase and heated. Thus, the thermosetting resin is cured to form the package 400, and the 2 nd capacitor 10B formed by coating the package 400 with the 2 nd capacitor element component C2 is formed. The 1 st connecting portion 320, the fixing portion 340, and the 2 connection terminal portions 220 are exposed from the exterior body 400.
Further, 21 st openings 311, 2 nd openings 312, and 2 rd openings 313 are formed in the body portion 310 of the 1 st holding member 300A and the 2 nd holding member 300B, and the thermosetting resin in a liquid phase state flows through these openings 311, 312, 313 when injected into the casting containers 2A, 2B. Thus, the thermosetting resin can easily spread over the casting containers 2A and 2B, and the exterior body 400 can be molded smoothly.
Next, a module assembling process is performed. The 1 st capacitor 10A and the 2 nd capacitors 10B are connected to each other by the 1 st connecting portion 320 and the 2 nd connecting portion 330 so that the electrodes 110 of the adjacent capacitors 10A and 10B face each other via the exterior body 400, and are fixed by an adhesive or a strapping 500.
Thus, the capacitor module 1 is completed as in fig. 1.
The capacitor module 1 can be mounted on an inverter device for driving a motor in an external device such as an electric vehicle. In the capacitor module 1, the left and right fixing portions 340 of the 2 nd capacitor 10B are fixed to an external device by screw fixation using holes 341. A pair of external bus bars (external terminals) from an external device are connected to the connection terminal portions 220 of the pair of bus bars 200 of the 1 st capacitor 10A and the 2 nd capacitor 10B.
For example, the external bus bar serving as the anode is connected to the electrode 110 on the left side of the capacitor element 100 of the capacitors 10A, 10B, and the external bus bar serving as the cathode is connected to the electrode 110 on the right side of the capacitor element 100 of the capacitors 10A, 10B. In this case, since the left electrode 110 serves as an anode and the right electrode 110 serves as a cathode, 2 electrodes 110 facing each other in adjacent capacitors 10A and 10B have different potentials.
In this way, when the capacitor module 1 is used such that the 2 electrodes 110 facing each other in the adjacent capacitors 10A and 10B have different potentials, when current flows through each capacitor element 100 by energizing the capacitor module 1, magnetic fluxes having opposite directions are generated in the adjacent capacitor elements 100, and therefore, these magnetic fluxes cancel each other out and become small. Thereby, the equivalent series inductance (ESL) of each capacitor element 100 is reduced.
< effects of embodiments >
As described above, according to the present embodiment, the following effects are achieved.
The capacitor module 1 is configured by connecting a plurality of capacitors (1 st capacitor 10A, 2 nd capacitor 10B). Each capacitor comprises: a capacitor element 100 having a pair of end faces 101 and electrodes 110 formed on each end face 101; bus bars 200 connected to the respective electrodes 110; and an exterior body 400 covering the whole of the capacitor element 100 and a part of the bus bar 200. The plurality of capacitors are arranged such that the electrodes 110 of adjacent capacitors face each other with the exterior body 400 interposed therebetween.
According to this configuration, the capacitor module 1 can be used such that the 2 electrodes 110 facing each other in the adjacent capacitors (1 st capacitor 10A and 2 nd capacitor 10B) have different potentials, and when a current flows through each capacitor element 100, magnetic fluxes having opposite directions are generated in the adjacent capacitor elements 100, and these magnetic fluxes can be canceled and reduced. This reduces the equivalent series inductance (ESL) of each capacitor element 100.
Further, since the capacitor elements 100 which have been covered with the exterior body 400 are disposed adjacently, the opposing electrodes 110 are prevented from contacting each other or from being too close to each other by the exterior body 400 being interposed therebetween. This can sufficiently secure insulation between the opposing electrodes 110.
Further, the capacitor module 1 has the following structure: the holding members (1 st holding member 300A, 2 nd holding member 300B) that hold the bus bar 200 and are covered with the exterior body are provided with connection portions (1 st connection portion 320, 2 nd connection portion 330) that are exposed from the exterior body 400 and are connected to the holding members of the adjacent capacitors (1 st capacitor 10A, 2 nd capacitor 10B).
According to this configuration, a plurality of capacitors are connected using these connecting portions (1 st connecting portion 320 and 2 nd connecting portion 330), whereby the capacitor module 1 having the number of capacitor elements 100 corresponding to the required specification can be produced. As a result, a common capacitor can be used for the capacitor modules 1 having different numbers of capacitor elements 100, and therefore, components and manufacturing processes related to the capacitor can be shared, and productivity can be improved. In addition, the production cost can be reduced by the improvement of productivity.
Further, since the holding members (1 st holding member 300A, 2 nd holding member 300B) holding the pair of bus bars 200 among the adjacent capacitors (1 st capacitor 10A, 2 nd capacitor 10B) are connected to each other by the connecting portion (1 st connecting portion 320, 2 nd connecting portion 330), the dimensional accuracy between the bus bars 200 of the adjacent capacitors becomes high in the capacitor module 1.
Further, the capacitor module 1 has the following structure: the capacitor element 100 has a peripheral surface 102 sandwiched between a pair of end surfaces 101, and is arranged such that the holding members (1 st holding member 300A, 2 nd holding member 300B) face the peripheral surface 102.
According to this structure, since the holding members (1 st holding member 300A, 2 nd holding member 300B) are located between the 2 electrodes 110, it is easy to hold the 2 bus bars 200 extending from the 2 electrodes 110 with the holding members.
Further, the capacitor module 1 has the following structure: the package 400 has a rectangular parallelepiped shape, a part of the bus bar 200 is exposed from one surface (upper surface 400A) of the package 400, and the bus bar 200 has a connection terminal portion 220 for connecting an external terminal to the outside of the package 400, and the connection portions (1 st connection portion 320, 2 nd connection portion 330) are connected to other capacitors in a direction parallel to the one surface.
According to this structure, in the capacitor module 1, since the connection terminal portions 220 of the respective capacitors (1 st capacitor 10A, 2 nd capacitor 10B) are arranged on the same surface, it is easy to connect the external terminal to the connection terminal portions 220.
Further, the capacitor module 1 has the following structure: the holding members (1 st holding member 300A, 2 nd holding member 300B) are formed of a resin material, and the bus bar 200 is insert-molded to the holding members.
According to this structure, in the capacitor (1 st capacitor 10A, 2 nd capacitor 10B), the dimensional accuracy between the 2 bus bars 200 held by the holding members (1 st holding member 300A, 2 nd holding member 300B) can be improved.
Further, the capacitor module 1 has the following structure: the holding members (1 st holding member 300A, 2 nd holding member 300B) are provided with openings (1 st opening 311, 2 nd opening 312, 3 rd opening 313) penetrating the holding members in the direction in which the holding members and the capacitor element 100 are arranged.
According to this structure, since the contact area between the surfaces of the holding members (the 1 st holding member 300A, the 2 nd holding member 300B) and the outer package 400 along the arrangement direction can be increased, the bonding force between the holding members and the outer package 400 in the arrangement direction becomes strong. As a result, even if a large force is applied to the holding members in the arrangement direction, particularly in the direction in which the holding members are separated from the capacitor element 100, via the connecting portions (the 1 st connecting portion 320 and the 2 nd connecting portion 330), breakage or the like is less likely to occur in the package 400.
Further, the capacitor module 1 has the following structure: the inner wall surfaces of the openings (1 st opening 311, 2 nd opening 312, and 3 rd opening 313) have a tapered shape in which the aperture of the opening increases in a direction away from the capacitor element 100.
According to this structure, since the anchoring effect is generated by the resin entering the openings (the 1 st opening 311, the 2 nd opening 312, and the 3 rd opening 313), when the large force in the separating direction is applied to the holding members (the 1 st holding member 300A and the 2 nd holding member 300B), it is more difficult for breakage or the like to occur in the package 400.
Further, the capacitor module 1 can be configured as follows: the holding member (2 nd holding member 300B) of the capacitor (2 nd capacitor 10B) is provided with a fixing portion 340 that can be fixed to an external device.
According to this structure, the capacitor module 1 can be fixed to an external device using the fixing portion 340. Further, since the fixing portion 340 is provided to the holding member (the 2 nd holding member 300B) holding the bus bar 200, the positional accuracy of the bus bar 200 with respect to the fixing portion 340 can be improved.
Further, the capacitor module 1 is used such that 2 electrodes 110 facing each other in adjacent capacitors (1 st capacitor 10A and 2 nd capacitor 10B) have different potentials.
According to this usage method, when a current flows through each capacitor element 100, magnetic fluxes in opposite directions are generated in adjacent capacitor elements 100, and these magnetic fluxes can be canceled and reduced. This reduces the equivalent series inductance (ESL) of each capacitor element 100.
Further, the capacitor module 1 is manufactured by a manufacturing method including the steps of: a step of forming capacitor element assemblies C1 and C2 by connecting bus bars 200 to electrodes 110 formed on a pair of end faces 101 of capacitor element 100 (element assembly forming step); a step (exterior body forming step) of accommodating the capacitor element assemblies C1, C2 in a mold member (casting containers 2A, 2B), injecting a resin (thermally curable resin) in a liquid phase state into the mold member so that the entire capacitor element 100 is immersed in the resin and curing the resin, thereby forming a cured resin as an exterior body 400 to cover the capacitors (1 st capacitor 10A, 2 nd capacitor 10B) of the capacitor element assemblies C1, C2; and a step (module assembling step) of connecting the plurality of capacitors so that the electrodes 110 of adjacent capacitors face each other with the exterior body 400 interposed therebetween.
According to this manufacturing method, the capacitor module 1 can be provided in which the equivalent series inductance (ESL) of each capacitor element 100 can be reduced and insulation between the opposing electrodes 110 can be sufficiently ensured.
The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. The operation example of the present invention is also variously modified in addition to the above-described embodiments.
For example, in the above embodiment, the capacitor (1 st capacitor 10A, capacitor 10B) has a structure in which the entire body portion 310 of the holding member (1 st holding member 300A, 2 nd holding member 300B) is embedded in the interior of the exterior body 400. However, as shown in fig. 8, the capacitors 10A and 10B may be configured such that the upper side, which is a part of the main body 310 of the holding members 300A and 300B, is exposed from the exterior body 400. With the above-described configuration, the capacitor 10A or 10B is prevented from being broken by the increase in the contact area between the holding members 300A or 300B and the package 400 due to the opening (the 1 st opening 311, the 2 nd opening 312, or the 3 rd opening 313) formed in the main body 310 and the anchoring effect due to the taper of the opening, so that the holding members 300A or 300B are separated from the upper end portion of the package 400.
In the above embodiment, the pair of bus bars 200 are held by the holding members 300A, 300B by insert molding to the main body portion 310 of the holding member (the 1 st holding member 300A, the 2 nd holding member 300B). However, the structure for holding the pair of bus bars 200 to the holding members 300A, 300B is not limited to insert molding. For example, a pair of bus bars 200 may be mounted to the holding members 300A, 300B by a given mounting configuration.
Fig. 9 (a) and (B) are diagrams showing the structure of the 1 st holding member 300A for holding the pair of bus bars 200 according to the modification, and are a bottom view and a side view in cross section of the 1 st holding member 300A for holding the bus bars 200.
In the pair of bus bars 200, a circular hole 231 is formed in the relay portion 230. In the 1 st holding member 300A, 2 slit-shaped holes 314 corresponding to the connection terminal portions 220 of the pair of bus bars 200 are formed in the main body portion 310. Further, circular protrusions 315 corresponding to the holes 231 of the pair of bus bars 200 are formed in the body portion 310. The connection terminal portions 220 of the pair of bus bars 200 pass through the holes 314 from the lower surface side of the main body portion 310. Further, the protrusions 315 of the body portion 310 are fitted into the holes 231 of the pair of bus bars 200. Thereby, the pair of bus bars 200 are held by the 1 st holding member 300A. The 2 nd holding member 300B also has the same structure as the 1 st holding member 300A.
The structures of the 1 st connecting portion 320 and the 2 nd connecting portion 330 are not limited to those of the above-described embodiment, and may be any structures. For example, as shown in fig. 10, the following structure can be adopted: the 1 st coupling portion 320 includes a flange portion 326 having a plurality (2) of protrusions 325, and the 2 nd coupling portion 330 includes a flange portion 336 having a plurality (2) of holes 335. In this structure, the 2 flange portions 326 and 336 are overlapped so that the protrusion 325 is inserted into the hole 335, thereby coupling the 1 st coupling portion 320 and the 2 nd coupling portion 330. Further, the 1 st connecting portion 320 and the 2 nd connecting portion 330 may be fixed not only in the front-rear, left-right direction but also in the up-down direction by applying heat to the protrusion 325 and pressing the protrusion 325 toward the hole 335 side.
Further, in the above embodiment, the fixing portion 340 is integrally formed with the main body portion 310 of the 2 nd holding member 300B. However, the fixing portion 340 may be formed separately from the body portion 310 of the 2 nd holding member 300B and coupled to the body portion 310. For example, as shown in fig. 11 (a), a connecting portion 345 is provided in the fixing portion 340. The coupling portion 345 has the same structure as the 1 st coupling portion 320, and includes an engagement piece 347 having a recess 346 and an engagement protrusion 348. As shown in fig. 11 (B), the 2 nd holding member 300B integrally having the fixing portion 340 is configured by connecting the connecting portion 345 of the fixing portion 340 to the 2 nd connecting portion 330 of the 1 st holding member 300A and fixing the same with an adhesive or the like.
The timing of forming the 2 nd holding member 300B by attaching the fixing portion 340 to the 1 st holding member 300A may be any timing (process) of the process of manufacturing the capacitor module 1. For example, the formation timing may be before the capacitor manufacturing process of fig. 6, may be at the end of the element assembly forming process of the capacitor manufacturing process, or may be after the exterior body forming process of the capacitor manufacturing process. Alternatively, the module assembly process of fig. 6 may be completed.
Further, in the above embodiment, the main body portion 310 of the holding member (1 st holding member 300A, 2 nd holding member 300B) is provided with 21 st opening portions 311, 2 nd opening portions 312, and 2 rd opening portions 313. However, the number, position, size, and shape of the openings provided in the main body 310 may be arbitrary. Furthermore, the opening may not be provided in the main body 310.
Furthermore, in the above embodiment, the taper is provided on the inner wall surface of the opening (the 1 st opening 311, the 2 nd opening 312, and the 3 rd opening 313), but the taper may not be provided.
Further, in the above embodiment, the capacitor module 1 is constituted by a plurality of 1 st capacitors 10A and 2 nd capacitors 10B. However, the number of the 2 nd capacitors 10B may be 1. Further, in the case where the fixing portion 340 is not required when the external device is mounted, the capacitor module 1 may be constituted by only the plurality of 1 st capacitors 10A.
Further, in the embodiment described above, in the 2 nd holding member 300B, 1 fixing portion 340 is provided at the right end portion of the main body portion 310. However, the positions and the number of the fixing portions 340 may be changed as appropriate. The shape of the fixing portion 340 may be any shape as long as it can be fixed to an external device.
Furthermore, in the above embodiment, 1 connection terminal portion 220 is provided in the bus bar 200. The number of the connection terminal portions 220 may be changed as appropriate. The electrode terminal portion 210 may include a connection pin, and the connection pin may be connected to the electrode 110 of the capacitor element 100 by soldering or the like. In this way, the structure (shape) of the bus bar 200 can be changed as appropriate.
Further, in the above embodiment, 1 capacitor element 100 is included in the capacitor (1 st capacitor 10A, 2 nd capacitor 10B). However, a plurality of capacitor elements 100 may be included in these capacitors 10A and 10B.
Further, in the above embodiment, the exterior body 400 is formed in a rectangular parallelepiped shape. However, the exterior body 400 may be formed in other shapes, such as a long cylindrical shape similar to the shape of the capacitor element 100.
Further, in the above embodiment, 2 metallized films obtained by depositing aluminum on the dielectric film are stacked, and the stacked metallized films are wound or laminated to form the capacitor element 100, but other than this, a metallized film obtained by depositing aluminum on both surfaces of the dielectric film and an insulating film may be stacked, and these may be wound or laminated to form the capacitor element 100.
Furthermore, in the above embodiment, the capacitors (1 st capacitor 10A, 2 nd capacitor 10B) are film capacitors. However, the capacitors 10A and 10B may be other than film capacitors.
In addition, the embodiments of the present invention can be modified in various ways within the scope of the technical idea shown in the claims.
In the description of the above embodiment, terms such as "upper" and "lower" indicate relative directions depending only on the relative positional relationship of the structural members, and do not indicate absolute directions such as the vertical direction and the horizontal direction.
Industrial applicability
The present invention is useful for a capacitor used for various electronic devices, electric devices, industrial devices, electric devices of vehicles, and the like.
Description of the reference numerals
1. Capacitor module
2A casting container (mould component)
2B casting container (mould component)
10A 1 st capacitor (capacitor)
10B 2 nd capacitor (capacitor)
100. Capacitor element
101. End face
102. Peripheral surface
110. Electrode
200. Bus bar
220. Connection terminal part
300A 1 st holding member (holding member)
300B 1 st holding member (holding member)
311. An opening part
320. 1 st connecting part (connecting part)
330. 2 nd connecting portion (connecting portion)
340. Fixing part
400. Outer package
400A upper surface (one side)
C1 1 st capacitor element assembly (capacitor element assembly)
C2 2 nd capacitor element assembly (capacitor element assembly).
Claims (10)
1. A capacitor module is constituted by connecting a plurality of capacitors,
each of the capacitors includes:
a capacitor element having a pair of end surfaces and an electrode formed on each of the end surfaces;
a bus bar connected to each of the electrodes; and
an exterior body covering the whole of the capacitor element and a part of the bus bar,
the plurality of capacitors are arranged such that the electrodes of adjacent capacitors face each other with the exterior body interposed therebetween.
2. The capacitor module of claim 1, wherein,
each of the capacitors includes:
a holding member that holds the bus bar and is covered with the exterior body,
a connecting portion is provided on the holding member, which is exposed from the exterior body and is connected to the holding member of the capacitor.
3. The capacitor module of claim 2, wherein,
the capacitor element has a peripheral surface sandwiched by the pair of end surfaces,
the holding member is disposed so as to face the peripheral surface.
4. A capacitor module according to claim 2 or 3, wherein,
the outer package body has a rectangular parallelepiped shape,
a part of the bus bar is exposed from one surface of the outer package, and the bus bar has a connection terminal portion for connecting an external terminal outside the outer package,
the connecting portion is connected to the holding member of the capacitor on the side in a direction parallel to the one surface.
5. The capacitor module according to any one of claims 2 to 4, wherein,
the holding member is formed of a resin material,
the bus bar is insert molded to the holding member.
6. The capacitor module according to any one of claims 2 to 5, wherein,
an opening portion penetrating the holding member in a direction in which the holding member and the capacitor element are arranged is provided.
7. The capacitor module of claim 6, wherein,
the opening portion has a tapered shape in which the diameter of the opening portion increases in a direction away from the capacitor element, on an inner wall surface of the opening portion.
8. The capacitor module according to any one of claims 2 to 7, wherein,
in at least one of the capacitors, a fixing portion that can be fixed to an external device is provided on the holding member.
9. A method of using a capacitor module,
the capacitor module according to any one of claims 1 to 8 is used so that 2 electrodes facing each other in adjacent capacitors are at different potentials.
10. A method for manufacturing a capacitor module, comprising the steps of:
forming a capacitor element assembly by connecting bus bars at electrodes formed at a pair of end surfaces of the capacitor element;
the capacitor element assembly is accommodated in a mold member, resin in a liquid phase state is injected into the mold member so that the whole capacitor element is immersed in the resin and the resin is cured, and the cured resin is used as an outer package to cover the capacitor of the capacitor element assembly; and
and connecting the plurality of capacitors such that the electrodes of adjacent capacitors face each other with the exterior body interposed therebetween.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-104820 | 2021-06-24 | ||
| JP2021104820 | 2021-06-24 | ||
| PCT/JP2022/022002 WO2022270239A1 (en) | 2021-06-24 | 2022-05-30 | Capacitor module, method for using capacitor module, and method for manufacturing capacitor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117529788A true CN117529788A (en) | 2024-02-06 |
Family
ID=84545587
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280042284.3A Pending CN117529788A (en) | 2021-06-24 | 2022-05-30 | Capacitor module, method for using capacitor module, and method for manufacturing capacitor module |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022270239A1 (en) |
| CN (1) | CN117529788A (en) |
| WO (1) | WO2022270239A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60124907A (en) * | 1983-12-12 | 1985-07-04 | 株式会社指月電機製作所 | Method of producing resin-sealed capacitor |
| JP3697594B2 (en) * | 1996-03-19 | 2005-09-21 | 株式会社指月電機製作所 | Low inductance capacitor |
| JP2002324727A (en) * | 2001-04-25 | 2002-11-08 | Matsushita Electric Ind Co Ltd | Capacitor |
| JP3855813B2 (en) * | 2002-03-20 | 2006-12-13 | 松下電器産業株式会社 | Metallized film capacitors |
| US20110102966A1 (en) * | 2008-07-10 | 2011-05-05 | Hiroki Takeoka | Molded capacitor and method for manufacturing the same |
| JP5424030B2 (en) * | 2009-08-31 | 2014-02-26 | 株式会社指月電機製作所 | Capacitor |
| JP2016192480A (en) * | 2015-03-31 | 2016-11-10 | 日本ケミコン株式会社 | Capacitor and method of manufacturing the same |
-
2022
- 2022-05-30 CN CN202280042284.3A patent/CN117529788A/en active Pending
- 2022-05-30 JP JP2023529754A patent/JPWO2022270239A1/ja active Pending
- 2022-05-30 WO PCT/JP2022/022002 patent/WO2022270239A1/en active Application Filing
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| WO2022270239A1 (en) | 2022-12-29 |
| JPWO2022270239A1 (en) | 2022-12-29 |
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