TW201621946A - Electronic component and method for manufacturing same - Google Patents

Abstract

To improve vibration resistance of electronic components, such as electrolytic capacitors, electric double layer capacitors, lithium batteries and coils, which are provided with surface mounting terminals. The present invention is provided with: a component main body (capacitor main body) having lead terminals that are protruding to the outer side; external terminals; and a base section. On the outer side of the component main body, the external terminals are connected to the lead terminals, and the base section is formed by molding, said base section covering the connecting section, and adhering to at least a part of the lead terminal lead-out section side of the component main body.

Description

Electronic component and method of manufacturing same Field of invention

The technology disclosed in the present disclosure relates to a terminal mounting technology for an electronic component such as an electrolytic capacitor, an electric double layer capacitor, a lithium battery, or a coil.

Background of the invention

Many electronic components such as capacitors are mounted on movable devices such as vehicles and robots. Further, a vibration source that continuously generates vibration, such as an engine or a motor, is mounted on the movable machine. When an electronic component is placed in the vicinity of such a vibration source or an electronic component is directly mounted on the vibration source, continuous vibration can be received from the vibration source.

In the surface mount capacitor, there is known a sealing body in which an insulating plate is provided in a capacitor and the protrusion abuts against the capacitor (for example, Patent Document 1). In such a configuration, even if the projection of the insulating plate abuts against the sealing body of the capacitor, there is a space between the sealing body and the insulating plate, and the vibration resistance is limited.

Advanced technical literature Patent literature

Patent Document 1 Japanese Patent Laid-Open Publication No. 2006-041125

Summary of invention

In the chip type capacitor of the surface mounting capacitor, the capacitor main body and the insulating plate are included, and the lead terminal protruding from the capacitor main body is inserted into the lead terminal insertion hole of the insulating plate, and is bent at the seating surface side of the insulating plate. Surface mount terminals are formed. At this time, the insulating plate is fixed to the capacitor body with lead terminals. That is, the fixing strength of the insulating plate depends on the bending strength of the lead terminals.

When the excessive vibration of the machine in which such a capacitor is mounted exceeds the assumed range, the vibration is applied from the insulating plate to the lead terminal, and the vibration stress acts on the lead terminal. This vibration stress concentrates on the bent portion of the lead terminal, causing metal fatigue in the bent portion and a problem of breaking the lead terminal.

At this time, the insulating plate is a separate member for the capacitor body, and only the lead terminal is kept fixed, so that the capacitor body and the insulating plate are individually shaken or vibrated and resonated. If the weight of the capacitor body and the insulating plate are different, such shaking or vibration resonance is remarkable. When the lead terminal is exposed to such shaking, excessive vibration stress is concentrated on the bent portion. As a result, there is a problem that the lead terminals are finally broken due to the aforementioned metal fatigue or the like.

The product size of the capacitor varies greatly depending on the application and the capacity. When the weight of the capacitor body side increases, the vibration stress on the bent portion of the lead terminal increases. Excessive vibration stress exceeding the allowable range continues to act on When the bent portion of the lead terminal is bent, the lead terminal is finally broken.

This subject is not limited to an electrolytic capacitor, and is the same as an electronic component having a lead terminal.

Therefore, the technology disclosed in the present invention is to improve the vibration resistance of electronic components having surface-mounted terminals such as electrolytic capacitors, electric double-layer capacitors, lithium batteries, and coils.

In order to achieve the above object, according to one aspect of the electronic component of the present disclosure, the component body, the external terminal, and the pedestal portion that protrude the lead terminal to the outside may be included. The external terminal is connected to the lead terminal on the outer side of the component body, and the pedestal portion that covers the connection portion and is fixed to at least a portion of the lead terminal lead-out portion side of the component body is molded.

In the above electronic component, the component body may have a resin case portion or a resin coated case portion, and the pedestal portion may be molded in the resin case portion or the resin coated case portion.

In the above electronic component, an insulating sheet may be provided between the component body and the external terminal.

In the above electronic component, the connection portion may have a lead terminal fitting portion that fits the lead terminal to the external terminal.

In the above electronic component, the component body may have a swage recess on a side surface of the case, and the pedestal portion may be provided in part or all of the swage recess.

In the above electronic component, the external terminal may be disposed on a seating surface of the pedestal portion in a vertical intersecting direction, a parallel direction, a Y-direction, or a T Word direction.

In the above electronic component, the external terminal may have a surface mount connection terminal portion in which the bent portion is exposed in the pedestal portion and exposed on the seat surface side of the pedestal portion.

In order to achieve the above object, according to an aspect of the method of manufacturing an electronic component of the present disclosure, the following steps may be included: a step of forming a component body that protrudes a lead terminal to the outside; (2) a step of forming an external terminal; (3) a step of connecting the lead terminal and the external terminal to the outer side of the component body; (4) a step of molding the pedestal portion, the pedestal portion covering a connection portion between the lead terminal and the external terminal, and being fixed to the aforementioned component At least a portion of the lead terminal lead portion side of the body.

According to the electronic component of the present disclosure or the method of manufacturing the same, any of the following effects can be obtained.

(1) Since the lead terminal and the external terminal are connected to the outside of the component body, the lead terminal has no bent portion, and there is no mechanically weak portion of the lead terminal caused by the bent portion, and even if it is subjected to vibration, there is no bent portion. Therefore, the concentration of the vibration stress on the bent portion can be avoided, and the vibration resistance of the lead terminal can be improved.

(2) Since the pedestal portion is molded by the resin and fixed to the component body, the vibration resistance of the electronic component can be improved by integrating with the component body.

(3) Since the connection portion between the lead terminal and the external terminal is in the pedestal portion molded by the resin, vibration can be avoided even if subjected to vibration. The stress is concentrated on the joint portion, and the vibration resistance of the joint portion can be improved.

(4) Since the pedestal portion is integrally molded with the component body, it is possible to secure the electronic component, and the pedestal portion can be omitted as compared with the conventional device in which the pedestal portion is assembled from the component body. Fixed work.

2‧‧‧ capacitor

4‧‧‧Capacitor body

6‧‧‧Shell

8‧‧‧ capacitor components

10‧‧‧ Sealing body

12‧‧‧Forging

14-1, 14-2‧‧‧ lead terminals

16‧‧‧Lead terminal lead-out side

18-1,18-2‧‧‧External terminals

20‧‧‧Lead terminal insertion hole

22-1, 22-2‧‧‧ Connections

24‧‧‧Deputy Department

26‧‧‧Terminal storage recess

28‧‧‧Seat

30-1, 30-2‧‧‧ Surface connection terminal

32‧‧‧ gap

42‧‧‧ lead frame

44‧‧‧Parallel Frame Division

46‧‧‧Bridge

48‧‧‧Processing area

50-1, 50-2‧‧‧ virtual terminal

52‧‧‧Insulation interval

54‧‧‧Virtual through hole

56‧‧‧Bend

d‧‧‧Diameter of lead terminal insertion hole

D1‧‧‧Center-to-center distance of lead terminals

D2‧‧‧Insulation interval between external terminals

IIA‧‧‧

I‧‧‧current

ψ‧‧‧Magnetic

L1‧‧‧ Width of the pedestal

L2‧‧‧ Width of the terminal accommodation recess

Storage length of L3‧‧‧ terminal storage recess

Lm‧‧‧External terminal length

W‧‧‧Width of external terminals

Fig. 1 is a view showing a cross section of a pedestal portion of a capacitor of the first embodiment of the electronic component of the present invention.

2A and 2B are views showing an enlarged cross section of the IIA portion shown in Fig. 1 and a seating surface of the pedestal portion.

Fig. 3 is a view showing an external terminal and a pedestal portion before molding.

4A and 4B are views showing an example of an assembly procedure of a capacitor.

Fig. 5 is a view for explaining electrical characteristics of a capacitor.

6A and 6B are views showing a plane of a lead frame and a pedestal portion of a capacitor of a second embodiment of the electronic component of the present invention.

7A and 7B are views showing a cross section of a plane of the lead frame and a modification of the pedestal portion.

Fig. 8 is a view showing a modification of the plane of the lead frame.

Form for implementing the invention

According to one aspect of the electronic component of the present disclosure, as long as the component body having the lead terminal, the external terminal connected to the lead terminal, the connection portion covering the lead terminal and the external terminal, and the molded body fixed to the component body are included The pedestal can be.

The part body is an electric function part of an electronic part, and is an electrolysis electric Container body, battery body, coil body, and the like. In the electrolytic capacitor body, a capacitor element is sealed in the outer casing. In the present specification, the electrolytic capacitor body can use the sealing body of the sealed outer casing, or the sealing body can be other members, and the sealing body is not necessarily an indispensable element.

This part body has lead terminals. The external terminal is a separate part for this lead terminal. The external terminal and the lead terminal are connected to the outer side of the component body.

The connection portion between the lead terminal and the external terminal is covered with a resin forming the pedestal portion. Further, the pedestal portion molded by the resin may be fixed to at least a portion of the lead terminal lead-out portion side of the component body.

According to one aspect of the method of manufacturing an electronic component, a component body having a lead terminal and an external terminal connected to the lead terminal are formed. The lead terminals may be columnar or plate-shaped. The external terminal may be an individual terminal component that is processed according to each electronic component, or may be a chain component such as a lead frame that assumes the manufacture of a plurality of electronic components. Next, the lead terminal and the external terminal that are led out to the lead terminal lead-out portion of the component body are connected. The connection may be a mechanical combination such as fitting, or may be soldering or welding. Then, the connection portion between the lead terminal and the external terminal is covered with a resin, and the resin is molded to form a pedestal portion. The pedestal portion is fixed to at least the lead terminal lead-out portion side of the component body, and the pedestal portion is integrated with the component body.

The method of molding the pedestal portion by resin may be either transfer molding or injection molding. The resin may be any of a thermoplastic resin such as an epoxy resin, a polyester resin, a polyamide resin, a polyphenylene sulfide (PPS) resin, or a thermosetting resin. Forming method and temperature of the resins The molding conditions such as the degree may be determined according to the selected resin.

Example

Example 1

Figure 1 shows the capacitor of Example 1. The structure of Fig. 1 is an example, and the technology of the present disclosure is not limited to this structure.

The capacitor 2 is an electronic component directly mounted on a wiring member such as a circuit board, and is an example of a surface mount capacitor. The capacitor 2 may be an electric double layer capacitor or an electrolytic capacitor, or may be another electronic component such as a capacitor or a battery.

The capacitor body 4 is an example of a component body of an electronic component. The capacitor body 4 is a body portion of the capacitor 2 and is, for example, a part functioning as a capacitor. The capacitor body 4 has, for example, an outer casing 6 which is an aluminum molded body. The capacitor 6 is housed in the outer casing 6, and the opening is sealed by the sealing member 10. A swaging recess 12 is formed by swaging at the outer periphery of the outer casing 6. Thereby, the swaging recess 12 holds the sealing body 10 at the opening portion of the outer casing 6, and the outer casing 6 is sealed.

In this capacitor body 4, the anode side and cathode side lead terminals 14-1, 14-2 protrude to the outside. At this time, the capacitor body 4 has the sealing body 10, and the lead terminals 14-1 and 14-2 are taken out from the sealing body 10. Each of the lead terminals 14-1 and 14-2 is a conductive metal material such as a columnar metal wire. The lead terminal 14-1 is connected to the anode side electrode foil of the capacitor element 8, and the lead terminal 14-2 is connected to the cathode side electrode foil of the capacitor element 8.

In this capacitor 2, the face of the capacitor body 4 from which the lead terminals 14-1 and 14-2 are drawn is defined as the lead terminal lead-out portion side 16. The lead terminal lead-out portion side 16 includes the outer surface of the sealing body 10 and its peripheral surface portion.

The lead terminals 14-1 and 14-2 are equivalent to the anode side external terminal 18-1 and the cathode side external terminal 18-2. Similarly to the lead terminals 14-1 and 14-2, each of the external terminals 18-1 and 18-2 is a rectangular strip formed of a conductive metal. A lead terminal insertion hole 20 is formed in each of the external terminals 18-1 and 18-2. The lead terminal insertion hole 20 of the external terminal 18-1 may be inserted into the lead terminal 14-1, and may be connected by soldering or soldering. Similarly, after the lead terminal insertion hole 20 of the external terminal 18-2 is inserted into the lead terminal 14-2, it may be connected by soldering, soldering or the like in the same manner. Thereby, the connection portion 22-1 is formed in the lead terminal 14-1 and the external terminal 18-1, and the connection portion 22-2 is formed in the lead terminal 14-2 and the external terminal 18-2. The connection portion 22-1 can have both the electrical connection and the mechanical fixation of the lead terminal 14-1 and the external terminal 18-1, and the connection portion 22-2 on the cathode side is also the same.

The lead terminal lead-out portion 16 of the capacitor body 4 is formed with a pedestal portion 24 by molding. The pedestal portion 24 is an example of a plate-like body in which the entire surface of the lead terminal lead-out portion side 16 of the capacitor main body 4 is included in a substantially square shape, and the two corner portions are notched to determine the polarity. The pedestal portion 24 covers the connecting portions 22-1 and 22-2 and is fixed to the lead terminal lead-out portion side 16 of the capacitor body 4. Thereby, the capacitor body 4 and the pedestal portion 24 are integrated, and the rubber seal of the sealing body 10 and the resin sealing of the pedestal portion 24 can strengthen the sealing function of the outer casing 6.

As shown in FIG. 2A, in this embodiment, the pedestal portion 24 extends to the swage recess 12 of the outer casing 6. Fig. 2A shows an enlarged cross section of the portion IIA of Fig. 1. The resin for molding the pedestal portion 24 is inserted into the swaging recess 12, and in this embodiment, the swage recess 12 is entirely concealed in the pedestal portion 24. This pedestal The portion 24 may be formed to cover a range of at least the lead terminal lead-out portion side 16 of the capacitor body 4, or may be a portion of the concealed forged recess portion 12.

A plurality of terminal housing recesses 26 that accommodate the respective external terminals 18-1 and 18-2 are formed in the pedestal portion 24 by molding. Each of the terminal housing recesses 26 is formed from the side surface side of the pedestal portion 24 to the seat surface 28 side. Further, the external terminals 18-1 and 18-2 exposed to the pedestal portion 24 are bent from the side surface side of the pedestal portion 24 to the seat surface 28 side, and are disposed in the terminal housing recess portion 26. In the present specification, the seating surface 28 of the pedestal portion 24 refers to the surface on which the pedestal portion 24 is connected to the conductor pattern.

As shown in FIG. 2B, the terminal housing recess 26 is formed in four places where the seating surface 28 of the pedestal portion 24 corresponds to the arrangement of the external terminals 18-1 and 18-2. The surface mounting connection terminal portion 30-1 and the surface mounting connection terminal portion 30-2 on the respective end sides of the external terminal 18-2 on the respective end sides of the external terminal 18-1 are disposed in each of the terminal housing recesses 26. The surface mount connection terminal portions 30-1 and 30-2 and the conductor pattern are structures that are connected by soldering.

Setting of length and width of external terminals 18-1, 18-2

Fig. 3 shows the external terminals 18-1, 18-2 and the pedestal portion 24 before molding. When the width of the pedestal portion 24 is L1, the width between the terminal accommodating recesses 26 is L2, and the storage length of each of the terminal accommodating recesses 26 is L3, the external terminals 18-1 and 18-2 of L2 < L1 (1) The length Lm is Lm=(L2+L3×2)<(L1+L3×2)...(2)

L1+L3×2-L2+L3×2=△L...(3)

ΔL is an external terminal corresponding to the depth of each terminal housing recess 26 The remaining length of 18-1, 18-2. Further, the diameter of the lead terminal insertion hole 20 inserted into each of the lead terminals 14-1 and 14-2 is d, and the distance between the centers of the lead terminals 14-1 and 14-2 is D1, and the external terminals 18-1 and 18 are made. The width of -2 is W, the insulation interval between the external terminals 18-1 and 18-2 is D2, and the lead terminal insertion holes 20 are formed at the centers of the external terminals 18-1 and 18-2. Relationship, that is, D1 + W = D2 + W × 2 (4) Since the diameter d of the lead terminal insertion hole 20, the condition that the width W of the external terminals 18-1, 18-2 is W > d is not owable In the case where the insulating interval D2 is, for example, greater than the width W and less than twice the width W, that is, the range of W≦D2≦W×2, the widths W of the external terminals 18-1 and 18-2 are as long as The range is as follows, that is, D1÷3≦W≦D1÷2 (5) can set the insulation interval D2 based on the distance D1 between the centers of the lead terminals 14-1 and 14-2, and (5) The width W of the external terminals 18-1 and 18-2 having the diameter d of the lead terminal insertion holes 20 into which the lead terminals 14-1 and 14-2 can be inserted is obtained.

Assembly of capacitor 2

4A and 4B show an example of the steps included in the assembly step of the capacitor 2. This assembly step is an example of a method of manufacturing an electronic component disclosed herein.

This assembly step includes a forming step of the capacitor body 4, a forming step of the external terminals 18-1, 18-2, a lead terminal insertion step, a connecting step of the external terminals 18-1, 18-2, and a molding of the pedestal portion 24. Step, external end Forming steps of sub-18-1, 18-2.

A) Step of forming the capacitor body 4

The capacitor body 4 is formed by using a well-known formation method. Thereby, the capacitor body 4 having the lead terminals 14-1, 14-2 is formed. Since the construction of the capacitor body 4 has been described, it will not be described.

B) Formation steps of the external terminals 18-1, 18-2

In the molding step of the external terminals 18-1 and 18-2, the external terminals 18-1 and 18-2 may be formed of a metal having good conductivity as described above, as shown in FIG. Alternatively, the sheet material may be cut into the aforementioned length Lm. Next, a lead terminal insertion hole 20 is formed in a central portion of each of the external terminals 18-1 and 18-2. Each of the lead terminal insertion holes 20 may be formed simultaneously with the formation of the external terminals 18-1, 18-2.

C) Lead terminal insertion step

In this lead terminal insertion step, the external terminals 18-1, 18-2 are positioned, and the lead terminals 14-1, 14-2 of the capacitor body 4 are inserted into the respective lead terminal insertion holes 20 and passed through the external terminals 18- 1, 18-2.

D) Connection steps of the external terminals 18-1, 18-2

In the connecting step of the external terminals 18-1, 18-2, as shown in FIG. 4A, the lead terminals 14-1, 14-2 are forged inside the respective external terminals 18-1, 18-2 by extrusion swaging. After the deformation, cut it off. Thereby, each of the external terminals 18-1 and 18-2 and each of the lead terminals 14-1 and 14-2 can be combined and electrically connected. The aforementioned connecting portions 22-1 and 22-2 are formed. In this case, you can also use a solder or solder joint.

At the time of this connection, a gap 32 is set between each of the external terminals 18-1 and 18-2 and the lead terminal lead-out portion side 16 of the capacitor body 4. This gap 32 It suffices to enter the required gap width Δd for the molding resin used for the pedestal portion 24. This gap 32 can also insert a resin sheet having good affinity for molding the pedestal portion 24, and an insulating sheet made of natural fibers or synthetic fibers into the external terminals 18-1, 18-2 and the capacitor. The lead terminal lead portion side 16 of the body 4 is formed between.

The connection portions 22-1 and 22-2 may be formed by soldering or soldering instead of the front end of the lead terminals 14-1 and 14-2, and may be joined by front end welding and soldering or soldering. When soldering or soldering is used, the amount by which the leading ends of the lead terminals 14-1 and 14-2 protrude from the external terminals 18-1 and 18-2 can be reduced. This reduction contributes to the low profile of the capacitor 2.

E) Molding step of the pedestal 24

When the capacitor body 4 to which the external terminals 18-1, 18-2 are connected is provided, for example, in a molding die, and the cavity is filled with a resin, as shown in Fig. 4B, the pedestal portion 24 can be molded. By this molding, the pedestal portion 24 can cover the aforementioned connecting portions 22-1, 22-2. The resin enters the gap 32 described above, and the insulation of the connecting portions 22-1 and 22-2 can be achieved. The pedestal portion 24 molded of resin is fixed to the lead terminal lead-out portion side 16 of the capacitor body 4.

In the molding of the pedestal portion 24, the side surface of the pedestal portion 24 and the terminal accommodating recess portion 26 on the side of the seat surface 28 are simultaneously molded.

As shown in FIG. 2, the resin for molding the pedestal portion 24 extends to the forged recess portion 12 of the capacitor body 4, and is brought into close contact with the wrought recess portion 12. The pedestal portion 24 of the hardened resin is present in the swaging recess 12, and the anchoring effect by the fitting of the pedestal portion 24 and the swaged recess 12 protruding into the outer casing 6 into the resin can be obtained. Therefore, the pedestal portion 24 and the capacitor body 4 can be A strong fit or a bonding strength exceeding the adhesion strength to the lead terminal lead-out portion side 16 is obtained.

In this embodiment, the external terminals 18-1 and 18-2 integrated with the pedestal portion 24 are in a state of protruding to the side surface side of the pedestal portion 24.

F) Forming steps of the external terminals 18-1, 18-2

Each of the external terminals 18-1 and 18-2 is bent and formed on the side of the seat surface 28 along each of the terminal housing recesses 26 of the pedestal portion 24, and is housed in each of the terminal housing recesses 26. As shown in FIG. 2B, the front end sides of the respective external terminals 18-1 and 18-2 are formed into respective surface mount connection terminal portions 30-1 and 30-2. Since the depth of each of the terminal accommodation recesses 26 is shallower than the surface mount connection terminal portions 30-1 and 30-2 (thicker than the thickness of each of the surface mount connection terminal portions 30-1 and 30-2), each surface mount connection terminal The portions 30-1, 30-2 protrude from the seating surface 28 of the pedestal portion 24. Thereby, the seat surface 28 is floated from the circuit board not shown, and the surface mounting connection terminals 30-1 and 30-2 and the conductor pattern can be connected to each other by soldering or the like.

Resonance point detection test

The capacitor of Example 1 produced was mounted on a test substrate, and a resonance point detection test was performed. The test conditions were a maximum acceleration of 40 [G], a maximum full amplitude of 1.5 [mm], a vibration frequency of 10 to 2000 [Hz], a number of scans of one time, and vibrations in the X direction and the Y direction shown in FIG. 2B.

In the conventional example, the lead terminal of the capacitor main body formed in the same manner as in the first embodiment is inserted into the lead terminal insertion hole of the insulating plate, that is, the lead terminal insertion hole is bent along the insulating substrate to form a capacitor. Here, the insulating sheet used in the conventional example uses an article which is provided with an auxiliary terminal and which has high vibration resistance in a conventional article. Install this capacitor on the test base The plate was tested in the same manner as in Example 1. The vibration direction of the conventional example is such that the X direction is "a direction perpendicular to the lead terminal bent to the insulating plate", and the Y direction is "a direction parallel to the lead terminal bent along the insulating plate".

In this test, since the range of the peak acceleration to 140 [%] (=56 [G]) is within the allowable range for the maximum acceleration of 40 [G], it is determined that there is no resonance point.

Resonance point test result

The resonance point detection test of Example 1 and the conventional example was carried out to show the peak acceleration and its frequency.

From Table 1, it was confirmed that the first embodiment set the maximum acceleration 40 [G], the vibration in the X direction is 53 [G], and the Y direction is 49 [G]. It is considered that the cause of detecting the peak acceleration is due to measurement error or the influence of noise, etc., and it is understood that the resonance point of the maximum acceleration 40 [G] does not exist.

On the other hand, the conventional example detects a peak acceleration of 147 [G] in the X direction and 148 [G] in the Y direction, and it is understood that the influence of the vibration is large. Further, since the lead terminal is formed with a bent portion in the conventional example, the vibration stress is concentrated on the bent portion, and the lead terminal is broken.

The function and effect of the embodiment 1

In the first embodiment described above, the functions and effects are listed as follows.

Improvement of vibration resistance of lead terminals 14-1, 14-2, etc.

(1) When the lead terminals 14-1 and 14-2 on the capacitor main body 4 side are not bent, the lead terminals 14-1 and 14-2 are connected to the external terminals 18-1 and 18-2. That is, each of the lead terminals 14-1 and 14-2 does not have a bent portion. Therefore, since there is no mechanically weak portion of the bent portion, even if the capacitor body 4 or the pedestal portion 24 is externally vibrated, the concentration of the vibration stress can be avoided, so that the lead terminals 14-1 and 14-2 can be resistant. The vibration is improved. Metal fatigue due to vibration of the lead terminals 14-1, 14-2 can be avoided.

(2) Since the bent portions of the lead terminals 14-1 and 14-2 are not present, even when the weight of the capacitor body 4 is increased, the concentration of the vibration stress can be avoided, and the lead terminals 14-1 and 14-2 are not broken.

(3) Since the pedestal portion 24 is molded by the resin and fixed to the capacitor body 4, it is integrated with the capacitor body 4. Thereby, the vibration resistance of the capacitor 2 can be improved.

(4) The connecting portions 22-1 and 22-2 of the lead terminals 14-1 and 14-2 and the external terminals 18-1 and 18-2 are covered with a resin for molding the pedestal portion 24, so that they exist in The pedestal portion 24 is maintained in a fixed state. Therefore, even if the capacitor body 4 or the pedestal portion 24 is subjected to vibration, the concentration of the vibration stress on the connecting portions 22-1 and 22-2 can be avoided, and the vibration resistance of the connecting portions 22-1 and 22-2 can be improved.

(5) The gap between the capacitor body 4 and the external terminals 18-1 and 18-2 is maintained at a gap 32, and the resin for molding the pedestal portion 24 sufficiently enters the gap 32 and is hardened. Thereby, the adhesion between the capacitor body 4 and the pedestal portion 24, the capacitor body 4 and the external terminals 18-1, 18-2, and the connection can be improved. The adhesion of the portions 22-1 and 22-2.

(6) When the resin sheet which can be melted by heating in the mold forming is provided in the gap 32, the resin sheet is integrated with the resin to fill the gap 32, and the pedestal portion 24 and the capacitor body 4 can be complemented. Sex.

(7) When the insulating sheet is disposed between the capacitor body 4 and the external terminals 18-1 and 18-2, the resin enters the gap, and the insulation can be surely ensured. The insulating sheet may be exemplified by a sheet composed of natural fibers or synthetic fibers.

(8) As shown in FIG. 2B, when a plurality of surface mount connection terminal portions 30-1, 30-2 are disposed on the seating surface 28 of the pedestal portion 24 so as to be symmetrical from a line passing through the center point of the pedestal portion 24, The mounting state of the capacitor 2 is maintained in a stable state, and the vibration resistance is improved, and the influence of the moment or the stress caused by the displacement of the center of gravity position can be avoided.

Reinforcement of capacitor 2 and reduction in assembly work

(9) Since the pedestal portion 24 is integrated with the capacitor body 4 by the molding process, the capacitor body 4 is reinforced by the pedestal portion 24, and the pedestal portion 24 is reinforced by the rigidity of the capacitor body 4, and the pedestal portion 24 and the capacitor body can be borrowed. The strength of 4 complements each other, and the capacitor 2 is secured.

(10) Since the pedestal portion 24 is closely attached to the capacitor body 4 without being dependent on the strength of the lead terminals 14-1 and 14-2, and is integrated with the capacitor body 4, the shape of the lead terminals 14-1 and 14-2 The thickness may be a design mainly based on electrical connection, and the degree of freedom in designing the lead terminals 14-1 and 14-2 may be obtained.

(11) Since the pedestal portion 24 is molded into the capacitor body 4, the pedestal portion can be omitted as a member separate from the capacitor body. As in the case of conventional materials, the number of parts can be reduced by fixing the lead terminals.

(12) Since the pedestal portion 24 is molded by allowing the resin to enter the swage recess 12 of the outer casing 6, the anchoring effect of one portion of the pedestal portion 24 coupled to the swage recess 12 can be obtained, and the pedestal portion 24 can be prevented. Separated or peeled off from the capacitor body 4. Since the same effect can be obtained even if the resin enters a part of the swaging recess 12, the weight of the product can be suppressed as compared with the case where the capacitor body 4 is integrally molded.

Protective properties of the connecting portions 22-1, 22-2 of the lead terminals 14-1, 14-2

(13) The connection portions 22-1 and 22-2 of the lead terminals 14-1 and 14-2 and the external terminals 18-1 and 18-2 are integrated with the inside of the molded pedestal portion 24 to be protected. The reinforcing effect of the connecting portions 22-1 and 22-2 fixed to the pedestal portion 24 of the capacitor body 4 can be obtained. Thereby, even if the pedestal portion 24 is vibrated, the respective connecting portions 22-1 and 22-2 can be shielded, so that the vibration of the capacitor body 4 can be alleviated.

Lightweight and low profile of capacitor 2

(14) Since the capacitor body 4 is formed by molding the pedestal portion 24 by molding the capacitor body 4, it is possible to reduce the weight of the outer casing of the capacitor body 4 as compared with the conventional detachment of the pedestal portion. The thickness, weight, or mechanical strength can be arbitrarily selected depending on the choice of the resin. Thereby, the weight reduction and low profile of the capacitor 2 are facilitated. Further, in the case where the capacitor body 4 is integrally molded, the increase in the weight of the product of the capacitor body 2 can be suppressed, and the capacitor 2 can be made lighter.

(15) The connecting portions 22-1 and 22-2 provided in the pedestal portion 24 are preferably electrically connected to each other and can be set to a minimum strength or size. Thereby, the pedestal portion 24 can be made thinner, and the thickness of the resin layer of the pedestal portion 24 can be adjusted.

Heat dissipation

(16) Since the capacitor body 4 is not integrally molded, the outer casing 6 can directly contact the outside air, and the heat dissipation property is improved as compared with the case where the capacitor body 4 is integrally molded.

Suppress electrolyte leakage

(17) The pedestal portion 24 covers the lead terminal lead-out portion side 16 of the capacitor body 4 and is closely fixed to each other. Therefore, the sealing body 10 of the lead terminal lead-out portion side 16 is covered with the resin forming the pedestal portion 24. Therefore, the material of the sealing body 10, for example, the sealing function of the rubber, and the sealing function of the resin of the pedestal portion 24, the sealing function of the sealing body 10 is reinforced by the pedestal portion 24. As a result, it is possible to suppress leakage of the electrolytic solution from the sealing body 10 side of the capacitor 2, and it is possible to extend the life of the capacitor 2. When the pedestal portion 24 is provided, the thickness of the sealing body 10 can be reduced, so that the capacitor 2 can be lowered in height.

Improvement of electrical characteristics such as low ESL (Equivalent Series Inductance) and low ESR (Equivalent Series Resistance) of capacitor 2

(18) FIG. 5 shows the relationship between the current i flowing to the capacitor 2 and the magnetic flux ψ. At this time, the current i flows from, for example, the external terminal 18-1 on the anode side to the lead terminal 14-1, and flows from the capacitor element 8 to the external terminal 18-2 via the lead terminal 14-2 on the cathode side, assuming this time point. By each current i, at each external terminal 18-1, 18-2 generate magnetic flux 个别 individually, and the direction of rotation of each magnetic flux 依 depends on the direction of current i, which is the opposite direction.

Thereby, since the external terminals 18-1 and 18-2 which constitute the path of the current i are arranged in parallel, the magnetic fluxes generated can be offset each other. As a result, the inductance L proportional to the current i and the magnetic flux enthalpy chain can be reduced, and the low ESL of the capacitor 2 can be achieved.

(19) In the capacitor 2, since the current path is in the two directions of the external terminals 18-1 and 18-2, the resistance can be reduced. Therefore, the low ESR of the capacitor 2 can also be achieved.

(20) Since the gap 32 is provided between the external terminals 18-1 and 18-2 and the capacitor body 4, the lead terminals 14-1 and 14-2 and the external terminals 18-1 and 18-2 and the capacitor body can be obtained. The insulation of 4 is further filled with resin by molding of the pedestal portion 24 to enhance insulation.

(21) When the connection of the connecting portions 22-1, 22-2 is used for fitting or welding, the protective connecting portions 22-1, 22-2 are protected from overheating when the solder capacitor 2 is mounted, and the capacitor 2 can be improved. Reliability.

Comparison with conventional knowledge

(22) A conventional method of processing a lead wire as an external electrode (for example, as disclosed in Japanese Laid-Open Patent Publication No. 60-245106), since the lead portion is formed into a bent portion, the vibration resistance is low, and the lead wire is broken, and the relative Here, in the above embodiment, the lead terminals 14-1, 14-2 and the external terminals 18-1, 18-2 form the connecting portions 22-1, 22-2, not the lead terminals 14-1, 14- 2 The bent portion is formed, so that metal fatigue caused by the vibration of the bent portion can be prevented.

(23) Bonding the anode or cathode leads to the insulation In the form of the anode terminal plate or the cathode terminal plate on the lower side of the resin coating layer (for example, as disclosed in Japanese Laid-Open Patent Publication No. 2003-272962), since the entire capacitor element is molded by a resin, the weight of the product is increased, and the influence of vibration is exerted. Large, in contrast, in the above-described Embodiment 1, such drawbacks can be avoided.

Effect of a modification of the lead terminal insertion hole 20

The lead terminal insertion holes 20 of the external terminals 18-1 and 18-2 may be formed in a manner of being fitted to the inserted lead terminals 14-1 and 14-2 instead of the above-mentioned circular holes. For example, the inner diameter of the lead terminal insertion hole 20 is narrower than the diameter of the lead terminal, and the inner side of the lead terminal insertion hole 20 has a plurality of fitting pieces at an angle of, for example, an angle of 90 degrees, and is interposed in the X direction. The fitting piece has a plurality of penetrating portions.

Further, it is also possible to have a pair of penetrating portions in parallel, and to have a pair of fitting pieces facing each other between the penetrating portions. The front end on the opposite side of each of the panels has a V-shaped notch, and the opposing interval of the notches is set to be smaller than the diameter of the lead terminal.

Further, a plurality of penetrating portions may be formed in the Y direction, and a plurality of fitting pieces may be formed such that the interval between the opposing faces of the fitting pieces is narrower than the diameter of the lead terminals.

By having such a lead terminal insertion hole 20 and a lead terminal fitting portion in which the lead terminals 14-1 and 14-2 are fitted to the external terminals 18-1 and 18-2, the following functions and effects can be obtained.

(1) For example, each of the fitting pieces is bent in the insertion direction of the lead terminals 14-1 and 14-2, and the elastic lead springs of the respective fitting pieces are fitted to the lead terminals 14-1, 14- 2 and external terminals 18-1, 18-2, whereby each can be connected The joints 22-1, 22-2 are maintained in a stable connected state. Further, the resin can be introduced into the deformed portion of each of the fitting pieces, and the adhesion strength of the integrated portions 22-1 and 22-2 to the resin can be improved.

(2) Further, when the lead terminal insertion hole 20 is used, the combination of the front end of the opposite side of the fitting piece and the V-shaped notch and the entry of the resin into the penetration portion are remarkable, and in addition to strengthening the electrical connection, the resin and the resin can be improved. The mechanical strength of the penetration.

(3) When such a fitting structure is used for the connecting portions 22-1 and 22-2, since soldering is not used, the connection can be maintained even when used at a high temperature. Moreover, the simplification of the connection procedure can be achieved.

(4) Further, since the resin enters the recess formed by the penetration portion or the fitting, the fixing property of the pedestal portion 24 and the connecting portions 22-1 and 22-2 due to the anchoring effect of the entering resin can be obtained. improve.

Example 2

Fig. 6A shows an example of a capacitor using the lead frame of the second embodiment and a method of manufacturing the same.

In this embodiment 2, the external terminals 18-1, 18-2 are formed by the lead frame 42. The lead frame 42 is formed of a pair of parallel frame portions 44 in the longitudinal direction by using a metal plate having conductivity, and a plurality of bridge portions 46 are formed between the parallel frame portions 44, and are formed by the press processing by the bridge portion 46. A plurality of processing regions 48. Each of the processing regions 48 is a molding unit of the pedestal portion 24.

Each of the processing regions 48 has external terminals 18-1 and 18-2 protruding from the respective parallel frame portions 44 in the opposing direction, and has perpendicularly intersecting the external terminals 18-1 and 18-2 from the respective bridge portions 46 in the cross direction. a pair of virtual points Quasi-terminals 50-1, 50-2. The virtual terminals 50-1, 50-2 are examples of another external terminal. An insulating space 52 is provided between each of the external terminals 18-1 and 18-2 and the front ends of the dummy terminals 50-1 and 50-2, and similarly, the external terminals 18-1 and 18-2 and the dummy terminal 50- are provided. The insulation interval 52 is also set similarly between 1, 50-2.

Lead terminal insertion holes 20 are formed in the external terminals 18-1 and 18-2, and dummy through holes 54 are formed in the dummy terminals 50-1 and 50-2.

The external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 are placed in the cross direction, and then the pedestal portion 24 is formed by resin molding.

In the capacitor 2 having such external terminals 18-1 and 18-2 and dummy terminals 50-1 and 50-2, a pedestal portion 24 is formed as shown in Fig. 6B.

The function and effect of the second embodiment

According to this embodiment 2, in addition to the functions and effects of the embodiment 1, the following functions and effects can be obtained.

(1) When the lead frame 42 is used, a plurality of pedestal portions 24 are simultaneously formed on the capacitor body 4 on the lead frame 42, and productivity can be improved.

(2) By positioning the lead frame 42, the external terminals 18-1, 18-2, the dummy terminals 50-1, 50-2 need not be individually positioned, and the pedestal portion 24 can be formed with high precision to improve the molding accuracy. A uniform pedestal 24 can be formed.

(3) The resin enters the insulating space 52 to maintain insulation between the external terminal 18-1 and the external terminal 18-2, between the external terminals 18-1 and 18-2, and between the dummy terminals 50-1 and 50-2. Further, the insulation between the terminals due to the resin can be improved.

(4) Since the dummy terminals 50-1 and 50-2 have the through holes 54 at the distal end side, the resin penetrates the through holes 54, and the virtual terminals 50-1 can be improved. The fixing strength of 50-2 and the pedestal portion 24.

(5) As shown in FIG. 6B, the surface mounting connection terminal portions 30-1 and 30-2 of the external terminals 18-1 and 18-2 are disposed on the seating surface 28 of the pedestal portion 24, and the dummy terminals 50-1 are provided in the respective dummy terminals 50-1. Further, each of the surface mount connection terminal portions 30-1 and 30-2 is disposed in the same manner as 50-2. Since the seating surface 28 is disposed in the cross direction, the mounting surface of the wiring board or the like can stabilize the installation of the pedestal portion 24. Thereby, the vibration resistance of the entire range of the capacitor 2 disposed on the mounting surface can be improved.

(6) In the second embodiment, as in the first embodiment, low ESL and low ESR can be achieved.

Modification 1 of lead frame 42, its function and effect

As shown in FIGS. 7A and 7B, each of the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 of the lead frame 42 may have a side surface from which the connection terminal portions 30-1 and 30-2 are attached. A curved portion 56 that rises toward the inner side of the pedestal portion 24. Since the other structures are the same as those of the second embodiment, the same reference numerals are attached, and the description thereof is omitted.

According to this modification 1, the following functions and effects can be obtained.

(1) In the lead frame 42, the external terminal 18-1, 18-2 and the dummy terminals 50-1, 50-2 can expose the surface mount connection terminal portions 30-1, 30-2 to the pedestal portion 24 The seat surface 28 is used to mold the resin.

(2) As shown in FIG. 7B, since the surface mounting terminal portions 30-1, 30-2 can be exposed to the seating surface 28, the pedestal portion 24 can be molded, so that the external terminal 18-1, 18-2 and the dummy terminals 50-1 and 50-2 are disconnected from the lead frame 42, and molding processing such as bending is not required. After the pedestal portion 24 is molded, the molding of the external terminals 18-1, 18-2 is not required, and the product can be improved. Shape accuracy.

(3) The external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 have the bent portion 56, and the distance in the pedestal portion 24 is larger than that in the second embodiment, so that the adhesion area with the resin can be enlarged. The fixing strength with the pedestal portion 24 can be improved.

(4) In the first modification, since the current paths of the external terminals 18-1 and 18-2 can be shortened, it is possible to achieve low ESL and low ESR in the same manner as in the first and second embodiments.

Modification 2 of lead frame 42, its function and effect

In the second modification, as shown in FIG. 8, the external terminals 18-1 and 18-2 which are the same as those of the second embodiment are formed by the lead frame 42, and a plurality of processing portions 48 which are divided by a plurality of bridge portions 46 are used. Press forming is formed. The same portions as those of Embodiment 2 are given the same reference numerals. In the second modification, the external terminals 18-1 and 18-2 are formed by the parallel frame portion 44.

According to this modification 2, in addition to the functions and effects of the first and second embodiments, the following functions and effects can be obtained.

(1) In the case where the external terminals 18-1 and 18-2, which are individual components of the first embodiment, are used, the lead frame 42 can be positioned, and the plurality of pedestal portions 24 can be formed in the lead frame 42 at a time, thereby improving productivity.

(2) In the second modification, since the external terminals 18-1 and 18-2 are formed by the parallel frame portion 44, the processed shape of the lead frame 42 can be simplified, and the manufacturing cost including the molding die can be reduced.

(3) According to the second modification, the plurality of surface mount connection terminal portions 30-1 and 30-2 can be arranged in parallel without being provided with the dummy terminals 50-1 and 50-2. At four places of the seat surface 28 of the seat portion 24, the capacitor 2 can be stably arranged, and even if it is subjected to vibration, the pedestal portion 24 can be subjected to vibration evenly, so that the vibration resistance of the capacitor 2 can be improved.

Modifications and effects of virtual terminals

In this modification, a single dummy terminal can be provided in the direction perpendicular to the external terminals 18-1, 18-2 in the insulating spacers 52 of the external terminals 18-1, 18-2. Similarly to the first embodiment (FIG. 2B), the end portion of the dummy terminal can be bent into the terminal housing recess 26 of the pedestal portion 24, and the pair of surface-mounting connection terminal portions 30-1 and 30-2 are formed.

According to this modification, the following functions and effects can be obtained.

(1) Since the pedestal portion 24 is provided with a single dummy terminal in the direction perpendicular to the external terminals 18-1 and 18-2 in the insulating space 52 of the external terminals 18-1 and 18-2, the center of gravity can be disposed in The center portion of the capacitor 2 is provided, and the surface mount connection terminal portions 30-1 and 30-2 can be disposed on each side of the seat surface 28.

(2) When such a dummy terminal is disposed in the processing direction of the lead frame 42 in the longitudinal direction, the lead frame 42 can be reinforced, and deformation can be suppressed, and the external terminals 18-1, 18-2 and the dummy terminal pair pedestal can be improved. Forming accuracy of the insert molding of the portion 24.

(3) When the dummy terminal has the dummy through hole described above, the dummy terminal and the pedestal portion 24 can be integrated, and the adhesion and the fixing property between the dummy terminal and the pedestal portion 24 can be improved.

Modifications and effects of the outer casing 6

The capacitor body 4 can form a resin coating portion on the outer surface of the outer casing 6. The outer peripheral portion 6 can be formed by resin coating the shell portion by the resin coating portion. At this time, pedestal The portion 24 is integrated with the resin coating portion.

According to this modification, the following functions and effects can be obtained.

(1) Since the pedestal portion 24 can be integrated with the resin coating portion that is in close contact with the outer casing 6 and fixed to the capacitor main body 4, the fixing strength of the capacitor main body 4 and the pedestal portion 24 can be improved.

(2) Since the resin coating portion on the outer casing 6 side can be used for the fixing strength, the pedestal portion 24 can be made thinner, and the amount of resin used to mold the pedestal portion 24 can be reduced.

(3) Since the amount of use of the resin is reduced, the weight of the pedestal portion 24 can be reduced, which contributes to the weight reduction of the capacitor 2.

(4) In this modification, the resin coated portion may be added to the outer casing 6, and a part or all of the outer casing 6 may be formed of a resin and the capacitor body 4 may have a resin shell portion.

The choice of molded resin and its effect

As the resin, any of a thermoplastic resin such as an epoxy resin, a thermosetting polyester resin, a thermoplastic polyester resin, a PPS resin, or a polyamide resin, or a thermosetting resin can be used.

(1) In the case of an epoxy resin, it is possible to use transfer molding, and it is excellent in chemical resistance, heat resistance, strength, and adhesion, and the molded article 24, that is, the pedestal portion 24 has such characteristics.

(2) In the case of a thermosetting polyester resin, transfer molding can be used, and the adhesion is excellent and low, and the molded article, that is, the pedestal portion 24 can obtain heat resistance, strength, adhesion, and the like in comparison with other resins. Excellent characteristics.

(3) If it is a thermoplastic polyester resin, it can be injection molded. Low price. The molded article, that is, the pedestal portion 24, can be supplied at a low price.

(4) In the case of PPS resin, injection molding can be used, and heat resistance and strength are excellent, and the molded article 24, that is, the pedestal portion 24 has such characteristics.

(5) In the case of a polyamide resin, injection molding can be used, and heat resistance and strength are excellent, and the molded article 24, that is, the pedestal portion 24 has such characteristics.

Selection of external terminal materials and their effects

The external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 may be made of a metal material such as copper, copper alloy, fine copper, iron or nickel.

(1) When any metal material is used, the affinity with the resin described above can be obtained, and excellent adhesion and fixability can be obtained.

(2) When copper is used for the external terminals 18-1 and 18-2, since copper is a non-magnetic metal, it is possible to achieve low ESL.

(3) When iron is used for the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2, the strength can be improved.

(4) When nickel is used for the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2, the strength is excellent and the corrosion resistance is excellent.

Other embodiments

(a) In the above embodiment, a capacitor is exemplified as an example of an electronic component, and the technology of the present disclosure can also be applied to components such as electronic components, resistors, batteries, coils, and the like other than capacitors.

(b) In the above embodiment, the capacitor body 4 of the cylinder is exemplified, and the outer shape of the component body may be a corner cylinder or the like, and the technique of the present disclosure is not limited to the cylinder.

(c) In the above embodiment, the external terminal is illustrated in the pedestal portion The seating surface 28 of the 24 is disposed in the vertical intersecting direction or the parallel direction, and may be disposed in the Y-direction or the T-direction. When the external terminals are arranged two-dimensionally and the space is provided for the seating surface 28, not only the capacitor 2 but also the mounting of the electronic components can be stabilized, and the vibration resistance of the electronic components can be improved.

As explained above, the preferred embodiment of the invention has been described. The technology of the present disclosure is not limited to the above description. Various changes and modifications can be made by those skilled in the art based on the scope of the invention as disclosed in the appended claims. It is needless to say that such variations and modifications are included in the scope of the invention.

Industrial availability

Since the present invention molds the pedestal portion covering the connection portion between the lead terminal and the external terminal, and the connection portion connects the external terminal and the lead terminal protruding to the outer side of the component body on the outer side of the component body, it is widely applicable. It is useful for electronic parts such as capacitors to realize electronic parts with high vibration resistance.

2‧‧‧ capacitor

4‧‧‧Capacitor body

6‧‧‧Shell

8‧‧‧ capacitor components

10‧‧‧ Sealing body

12‧‧‧Forging

14-1, 14-2‧‧‧ lead terminals

16‧‧‧Lead terminal lead-out side

18-1,18-2‧‧‧External terminals

20‧‧‧Lead terminal insertion hole

22-1, 22-2‧‧‧ Connections

24‧‧‧Deputy Department

26‧‧‧Terminal storage recess

28‧‧‧Seat

IIA‧‧‧

Claims (8)

An electronic component comprising: a component body that protrudes to an outer side; an external terminal connected to the lead terminal; and a pedestal portion that is molded and connected to the outer side of the component body and the aforementioned lead terminal The connection portion of the external terminal covers and is fixed to at least a portion of the lead terminal lead-out portion side of the component body. The electronic component according to claim 1, wherein the component body has a resin case portion or a resin coated case portion, and the pedestal portion is molded in the resin case portion or the resin coated case portion. The electronic component of claim 1 or 2, wherein an insulating sheet is disposed between the part body and the external terminal. The electronic component according to any one of claims 1 to 3, wherein the connecting portion has a lead terminal fitting portion for fitting the lead terminal to the external terminal. The electronic component according to any one of claims 1 to 4, wherein the component body has a swaged recess on a side surface of the casing, and the pedestal portion is provided in part or all of the swage recess. The electronic component according to any one of claims 1 to 5, wherein the external terminal is disposed on a seating surface of the pedestal portion in a vertical intersecting direction, a parallel direction, a Y-direction, or a T-direction. The electronic component of any one of claims 1 to 6, wherein the aforementioned external terminal A surface mount connection terminal portion having a bent portion exposed in the pedestal portion and exposed on a seat surface side of the pedestal portion. A method of manufacturing an electronic component comprising the steps of: forming a component body for projecting a lead terminal to an outer side; forming an external terminal; and connecting the lead terminal and the external terminal to an outer side of the component body; molding In the step of molding the pedestal portion, the pedestal portion covers a connection portion between the lead terminal and the external terminal, and is fixed to at least a portion of the lead terminal lead-out portion side of the component body.