TWI683328B - Electronic parts and methods of manufacture - Google Patents

Abstract

The object of the present invention is to improve the vibration resistance of electronic components having surface-mounted terminals such as electrolytic capacitors, electric double layer capacitors, lithium batteries, and coils. The present invention includes a component body (capacitor body) that protrudes the wire terminal to the outside, an external terminal, and a pedestal portion. The external terminal is connected to the lead terminal on the outer side of the component body. At least a part of the pedestal portion covering the connection portion and fixed to the lead terminal lead-out portion side of the component body is molded.

Description

Electronic parts and methods of manufacture Field of invention

The disclosed technology is related to a terminal mounting technology for surface mounting of electronic parts such as electrolytic capacitors, electric double layer capacitors, lithium batteries, and coils.

Background of the invention

Many electronic parts such as capacitors are mounted on mobile devices such as vehicles and robots. In addition, the movable device is equipped with a vibration source that continuously generates vibrations such as an engine or a motor. When electronic parts are installed near the vibration source or electronic parts are directly installed at the vibration source, continuous vibration can be received from the vibration source.

This vibration countermeasure is known from the aspect of a capacitor for surface mounting, in which a projection is provided on an insulating plate of a capacitor and this projection contacts the sealing body of the capacitor (for example, Patent Document 1). In such a structure, even if the protrusion of the insulating plate is brought into contact with the sealing body of the capacitor, there is still a space between the sealing body and the insulating plate, and vibration resistance is limited.

Advanced technical literature Patent Literature

Patent Document 1 Japanese Patent Publication No. 2006-041125

Summary of the invention

A chip type capacitor, which is an example of a surface mount capacitor, includes a capacitor body and an insulating plate, and the lead terminal protruding from the capacitor body is inserted into the lead terminal insertion hole of the insulating plate, and bent on the seating surface side of the insulating plate Surface mount terminals are formed. At this time, the insulating plate is fixed to the capacitor body with lead terminals. That is, the fixing strength of the insulating plate depends on the bending strength of the lead terminal.

When excessive vibration exceeding the assumed range of the machine with such a capacitor continues to act, the vibration is applied to the lead terminal from the insulating plate, and the vibration stress acts on the lead terminal. This vibration stress is concentrated on the bent portion of the lead terminal, causing metal fatigue in the bent portion, and there is a problem of breaking the lead terminal.

At this time, the insulating plate is a separate member from the capacitor body and is only fixed by the lead terminal, so the capacitor body and the insulating plate may be shaken individually or vibration resonance may occur. If the weight of the capacitor body and the insulating plate are different, such shaking or vibration resonance is significant. When the lead terminal is exposed to such shaking, excessive vibration stress is concentrated on its bent portion. As a result, there is a problem that the lead terminal is finally broken due to the aforementioned metal fatigue.

The size of the capacitor product varies greatly depending on the application and capacity. If the weight of the capacitor body increases, the vibration stress on the bent portion of the lead terminal increases. If the excessive vibration stress beyond the allowable range continues to act When the bent part of the lead terminal, the lead terminal is finally broken.

This subject is not limited to electrolytic capacitors, as long as the electronic parts have lead terminals.

Therefore, in view of the above-mentioned problems, the technique of the present disclosure is to improve the vibration resistance of electronic components having surface-mounted terminals such as electrolytic capacitors, electric double layer capacitors, lithium batteries, and coils.

In order to achieve the above object, according to one aspect of the electronic component of the present disclosure, it is sufficient to include a component body, an external terminal, and a pedestal portion that protrude the lead terminal to the outside. The external terminal is connected to the lead terminal on the outer side of the component body, and at least a part of the pedestal portion covering the connection portion and fixed to the lead terminal lead-out portion side of the component body is molded.

In the above electronic component, the component body may have a resin shell portion or a resin-coated shell portion, and the pedestal portion is molded from the resin shell portion or the resin-coated shell portion.

In the above electronic component, an insulating sheet may be further provided between the component body and the external terminal.

In the above electronic component, the connection portion may have a lead terminal fitting portion that fits the lead terminal and the external terminal.

In the above electronic component, the component body may have a swaged recess on the side surface of the case, and the pedestal portion is provided on a part or all of the swaged recess.

In the above electronic component, the external terminal may be arranged on the seating surface of the pedestal part in a perpendicular intersecting direction, a parallel direction, a Y-shaped direction or a T Word direction.

In the above-mentioned electronic component, the external terminal may have a surface mount connection terminal portion in which the bent portion is inside the pedestal portion and exposed on the seat surface side of the pedestal portion.

In order to achieve the above object, according to an aspect of the manufacturing method of the electronic part of the present disclosure, the following steps may be included: a step of forming a part body with lead terminals protruding to the outside; (2) a step of forming an external terminal; (3) The step of connecting the lead terminal and the external terminal to the outside of the body of the part; (4) The step of molding a pedestal part that covers the connection part of the lead terminal and the external terminal and is fixed to the part At least a part of the lead portion of the main body.

According to the disclosed electronic parts or the manufacturing method thereof, any of the following effects can be obtained.

(1) Since the lead terminal and the external terminal are connected on the outer side of the part body, the lead terminal has no bent portion, and there is no mechanical fragile portion of the lead terminal caused by the bent portion. Even if it is subjected to vibration, there is no bent portion. Therefore, the concentration of the vibration stress on the bent portion can be avoided, and the vibration resistance of the lead terminal can be improved.

(2) Since the pedestal part is molded by resin and fixed to the body of the part, by integrating with the body of the part, the vibration resistance of the electronic part can be improved.

(3) Since the connection part of the lead terminal and the external terminal is in the base part molded by resin, even if it is subjected to vibration, it can be avoided Stress is concentrated on the connection part, and the vibration resistance of the connection part can be improved.

(4) Since the pedestal part is integrated with the body of the part by molding, it is possible to secure the electronic parts, and compared with the conventional thing of assembling the pedestal part with a component separate from the part body, the pedestal part can be omitted Fixed work.

2‧‧‧Capacitor

4‧‧‧Capacitor body

6‧‧‧Housing

8‧‧‧Capacitor element

10‧‧‧sealing body

12‧‧‧Forging Department

14-1, 14-2‧‧‧lead terminal

16‧‧‧Lead terminal side

18-1, 18-2‧‧‧External terminal

20‧‧‧Lead terminal insertion hole

22-1, 22-2 ‧‧‧ connection

24‧‧‧Pedestal Department

26‧‧‧Terminal storage recess

28‧‧‧Seat

30-1, 30-2 ‧‧‧ surface connection terminal

32‧‧‧Gap

42‧‧‧Lead frame

44‧‧‧Parallel Frame Department

46‧‧‧Bridge Department

48‧‧‧Processing area

50-1, 50-2‧‧‧ Virtual terminal

52‧‧‧Insulation interval

54‧‧‧Virtual through hole

56‧‧‧Bend

d‧‧‧Diameter of lead terminal insertion hole

D1‧‧‧Distance between centers of lead terminals

D2‧‧‧Insulation interval between external terminals

IIA‧‧‧

i‧‧‧current

ψ‧‧‧ magnetic flux

L1‧‧‧The width of the pedestal

L2‧‧‧Width between terminal receiving recesses

L3‧‧‧The storage length of the terminal storage recess

Lm‧‧‧Length of external terminal

W‧‧‧Width of external terminal

FIG. 1 is a diagram showing a cross-section of a pedestal portion of a capacitor according to Embodiment 1 of the disclosed electronic component.

2A and 2B are diagrams showing an enlarged cross section of the IIA portion shown in FIG. 1 and a seating surface of the pedestal portion.

FIG. 3 is a diagram showing the external terminals and the base portion before molding.

4A and 4B are diagrams showing an example of assembly steps of a capacitor.

FIG. 5 is a diagram for explaining the electrical characteristics of the capacitor.

6A and 6B are diagrams showing the plane of the lead frame of the embodiment 2 of the electronic component of the present disclosure and the cross section of the base portion of the capacitor.

7A and 7B are diagrams showing a modification of the plane of the lead frame and a cross section of the pedestal portion.

FIG. 8 is a diagram showing a modification of the plane of the lead frame.

Forms for carrying out the invention

According to one aspect of the electronic parts of the present disclosure, as long as it includes a part body with a lead terminal, an external terminal connected to the lead terminal, a molded part covering the connection part of the lead terminal and the external terminal and fixed to the part body The pedestal is sufficient.

The body of the part is the electronic function part of the electronic part, which is electrolytic Container body, battery body, coil body, etc. A capacitor element is enclosed in the casing of the electrolytic capacitor body. In this specification, the body of the electrolytic capacitor may use a sealing body of a sealed case, or the sealing body may be other members, and the sealing body is not necessarily an indispensable element.

This part body has lead terminals. The external terminal is a separate part of this lead terminal. The external terminal and the lead terminal are connected to the outside of the part body.

The connection part of the lead terminal and the external terminal is covered with the resin which forms the base part. In addition, the base portion molded by resin may be fixed to at least a part of the lead terminal extraction portion side of the component body.

According to an aspect of the manufacturing method of the electronic component, a component body having a lead terminal and an external terminal connected to the lead terminal are formed. The lead terminals may be columnar or plate-shaped. The external terminal may be an individual terminal part processed according to each electronic part, or it may be a chained part such as a lead frame assuming the manufacture of a plurality of electronic parts. Next, the lead terminal and the external terminal led to the lead terminal lead-out portion of the component body are connected. This connection can be a mechanical combination such as fitting or soldering or soldering. Then, the connection portion of the lead terminal and the external terminal is covered with resin, and the resin is molded to form a pedestal portion. The pedestal portion is fixed to at least the lead terminal lead-out portion side of the component body, and the pedestal portion and the component body are integrated.

The method of molding the pedestal part by resin molding may also be either transfer molding or injection molding. The resin may be any of thermoplastic resins such as epoxy resins, polyester resins, polyamide resins, and polyphenylene sulfide (PPS) resins, and thermosetting resins. The molding method and temperature of these resins The molding conditions such as degree can be determined according to the selected resin.

Examples

Example 1

Figure 1 shows the capacitor of Example 1. The structure shown in FIG. 1 is an example, and the technology of the present disclosure is not limited to this structure.

The capacitor 2 is an electronic component directly mounted on a wiring member such as a circuit board. It is an example of a surface-mounted capacitor, and may be an electric double-layer capacitor or an electrolytic capacitor, or other electronic components such as other capacitors or batteries.

The capacitor body 4 is an example of a component body of an electronic component. The capacitor body 4 is the body part of the capacitor 2 and is, for example, a part that functions as a capacitor. The capacitor body 4 has, for example, a case 6 that is an aluminum molded body. The case 6 houses the capacitor element 8 and seals the opening with a sealing body 10. A swaged recess 12 is formed on the outer peripheral portion of the housing 6 by swaging. As a result, the swaged recessed portion 12 holds the sealing body 10 at the opening of the housing 6, and the housing 6 is sealed.

In this capacitor body 4, the anode-side and cathode-side lead terminals 14-1 and 14-2 protrude to the outside. At this time, the capacitor body 4 has the sealing body 10, and each lead terminal 14-1, 14-2 is drawn out from this sealing body 10. Each lead terminal 14-1, 14-2 is a metal material having conductivity, for example, a columnar metal wire. The lead terminal 14-1 is connected to the anode electrode foil of the capacitor element 8, and the lead terminal 14-2 is connected to the cathode electrode foil of the capacitor element 8.

In this capacitor 2, the surface of the capacitor body 4 from which the lead terminals 14-1 and 14-2 are drawn is defined as the lead terminal lead-out portion side 16. The lead terminal lead-out portion side 16 includes the outer surface of the sealing body 10 and its peripheral surface portion.

Corresponding to the lead terminals 14-1 and 14-2, there are an anode-side external terminal 18-1 and a cathode-side external terminal 18-2. Like the lead terminals 14-1 and 14-2, each external terminal 18-1 and 18-2 is a rectangular strip material formed of a metal having conductivity. Lead terminal insertion holes 20 are formed in the external terminals 18-1 and 18-2. After the lead terminal insertion hole 20 of the external terminal 18-1 is inserted into the lead terminal 14-1, it may be connected by soldering or welding. Similarly, after the lead terminal insertion hole 20 of the external terminal 18-2 is inserted into the lead terminal 14-2, it may be similarly connected by soldering or welding. Thereby, the connection part 22-1 is formed in the lead terminal 14-1 and the external terminal 18-1, and the connection part 22-2 is formed in the lead terminal 14-2 and the external terminal 18-2. The connecting portion 22-1 can perform both electrical connection and mechanical fixing of the lead terminal 14-1 and the external terminal 18-1, and this is the same as the connecting portion 22-2 on the cathode side.

A base portion 24 is formed on the lead terminal lead-out portion side 16 of the capacitor body 4 by molding. This pedestal portion 24 is an example, and is formed into an approximately square shape including the entire face of the lead terminal lead-out portion side 16 of the capacitor body 4 and notched at two corners to determine polarity. The pedestal portion 24 covers the connection portions 22-1 and 22-2, and is fixed to the lead terminal extraction portion side 16 of the capacitor body 4. As a result, the capacitor body 4 and the pedestal portion 24 are integrated, and the rubber seal of the sealing body 10 and the resin seal of the pedestal portion 24 can strengthen the sealing function of the case 6.

As shown in FIG. 2A, in this embodiment, the base portion 24 extends to the swaged recessed portion 12 of the housing 6. FIG. 2A shows an enlarged section of the IIA part of FIG. 1. The resin used to mold the pedestal portion 24 is inserted into the swaged recessed portion 12. In this embodiment, the swaged recessed portion 12 is entirely concealed within the pedestal portion 24. This pedestal The portion 24 may be formed to cover a range of at least the lead terminal lead-out portion side 16 of the capacitor body 4 or a portion of the concealed swaged recess 12.

A plurality of terminal accommodating recesses 26 accommodating the external terminals 18-1 and 18-2 are formed in the pedestal portion 24 by molding. Each terminal accommodating recess 26 is formed from the side surface side of the pedestal portion 24 to the seat surface 28 side. Furthermore, the external terminals 18-1 and 18-2 exposed to the pedestal portion 24 are bent from the side surface side of the pedestal portion 24 to the seat surface 28 side, and are arranged in the terminal accommodating recess 26. In this specification, the seating surface 28 of the pedestal portion 24 refers to the surface where the pedestal portion 24 is connected to the conductor pattern.

As shown in FIG. 2B, at four places where the seating surface 28 of the pedestal part 24 is arranged corresponding to the external terminals 18-1 and 18-2, terminal storage recesses 26 are formed. A surface mount connection terminal portion 30-1 on each end side of the external terminal 18-1 and a surface mount connection terminal portion 30-2 on each end side of the external terminal 18-2 are disposed in each terminal accommodating recess 26. The surface-mounting connection terminal portions 30-1 and 30-2 and the conductor pattern are connected by soldering.

Setting the length and width of external terminals 18-1 and 18-2

FIG. 3 shows the external terminals 18-1 and 18-2 and the pedestal portion 24 before molding. If the width of the pedestal portion 24 is L1, the width between the terminal storage recesses 26 is L2, and the storage length of each terminal storage recess 26 is L3, then L2<L1... (1) each external terminal 18-1, 18-2 The length Lm is Lm=(L2+L3×2)<(L1+L3×2)...(2)

L1+L3×2-L2+L3×2=△L...(3)

△L is an external terminal corresponding to the depth of each terminal receiving recess 26 The remaining length of 18-1 and 18-2. Moreover, let the diameter of the lead terminal insertion hole 20 inserted into each lead terminal 14-1, 14-2 be d, let the distance between the centers of the lead terminals 14-1, 14-2 be D1, and let the external terminals 18-1, 18 The width of -2 is W, the insulation interval between the external terminals 18-1 and 18-2 is D2, and the insertion of each lead terminal insertion hole 20 in the center of the external terminals 18-1 and 18-2 becomes the following Relationship, that is, D1+W=D2+W×2... (4) due to the diameter d of the lead terminal insertion hole 20, the condition that the width W of the external terminals 18-1, 18-2 is W>d is not owed If the insulation interval D2 is, for example, a range greater than the width W and less than twice the width W, that is, a range of W≦D2≦W×2, each width W of the external terminals 18-1 and 18-2 only needs to The range is as follows, that is, D1÷3≦W≦D1÷2... (5) The insulation distance D2 can be set based on the distance D1 between the centers of the lead terminals 14-1 and 14-2, and from (5) The width W of the external terminals 18-1 and 18-2 having the diameter d of the lead terminal insertion hole 20 into which the lead terminals 14-1 and 14-2 can be inserted is determined.

Assembly of capacitor 2

4A and 4B show an example of steps included in the assembly step of the capacitor 2. This assembly step is an example of the manufacturing method of the disclosed electronic parts.

This assembly step includes the formation step of the capacitor body 4, the formation step of the external terminals 18-1, 18-2, the lead terminal insertion step, the connection step of the external terminals 18-1, 18-2, and the molding of the pedestal portion 24 Steps, external Sub 18-1, 18-2 forming steps.

A) Formation steps of capacitor body 4

The formation of the capacitor body 4 only needs to use a well-known forming method. With this, the capacitor body 4 having the lead terminals 14-1, 14-2 is formed. Since the structure of the capacitor body 4 has already been described, it will not be described.

B) Steps for forming external terminals 18-1 and 18-2

In the forming step of the external terminals 18-1 and 18-2, each external terminal 18-1 and 18-2 may be formed of a metal with good conductivity as described above, as shown in FIG. Or the plate-shaped material may be cut to the aforementioned length Lm. Next, lead terminal insertion holes 20 are formed in the central portions of the external terminals 18-1 and 18-2. Each lead terminal insertion hole 20 may be formed simultaneously with the forming of the external terminals 18-1 and 18-2.

C) Lead terminal insertion procedure

In this lead terminal insertion step, the external terminals 18-1, 18-2 are positioned, and the lead terminals 14-1, 14-2 of the capacitor body 4 are inserted into each lead terminal insertion hole 20 and penetrate the external terminal 18- 1. 18-2.

D) Connection steps of external terminals 18-1 and 18-2

In the connecting step of the external terminals 18-1, 18-2, as shown in FIG. 4A, the lead terminals 14-1, 14-2 are made inside the external terminals 18-1, 18-2 by extrusion swaging After deformation, cut it off. Thereby, each external terminal 18-1, 18-2 and each lead terminal 14-1, 14-2 can be combined and electrically connected. The aforementioned connection portions 22-1 and 22-2 are formed. At this time, soldering or welding may also be used.

At this connection, a gap 32 is set between each external terminal 18-1, 18-2 and the lead terminal lead-out portion side 16 of the capacitor body 4. This gap 32 As long as the resin used for the molding of the pedestal portion 24 enters the required gap width Δd. This gap 32 can also be inserted into the external terminals 18-1, 18-2 and the capacitor with a resin sheet having a good affinity with the resin used to mold the pedestal portion 24 and an insulating sheet composed of natural fibers or synthetic fibers The main body 4 is formed between the lead terminal lead-out portion sides 16.

The connection portions 22-1 and 22-2 may be formed by soldering or welding instead of the aforementioned front-end extrusion of the lead terminals 14-1 and 14-2, or may be combined with the front-end extrusion and soldering or welding. When soldering or soldering is used, the amount of protruding ends of the lead terminals 14-1 and 14-2 from the external terminals 18-1 and 18-2 can be reduced. This reduction contributes to the lowering of the capacitor 2.

E) Molding steps of the base part 24

When the capacitor body 4 to which the external terminals 18-1 and 18-2 are connected is provided in, for example, a molding die and its cavity is filled with resin, as shown in FIG. 4B, the pedestal portion 24 may be molded. By this molding, the pedestal portion 24 can cover the aforementioned connection portions 22-1 and 22-2. The resin enters the aforementioned gap 32, and the connection portions 22-1 and 22-2 can be insulated. The base portion 24 molded with resin is fixed to the lead terminal lead-out portion side 16 of the capacitor body 4.

In the molding of the pedestal portion 24, the terminal accommodating recesses 26 on the side surfaces of the pedestal portion 24 and the seat surface 28 side are simultaneously molded.

As shown in FIG. 2, the resin used to mold the pedestal portion 24 extends to the swaged recessed portion 12 located in the capacitor body 4 and enters the swaged recessed portion 12 to be tightly closed. The pedestal portion 24 of the hardened resin can be present in the swaged recessed portion 12, and an anchoring effect due to the fitting of the pedestal portion 24 into the swaged recessed portion 12 protruding to the housing 6 can be obtained. Therefore, the pedestal portion 24 and the capacitor body 4 can The strong fitting and even the bonding strength exceeding the adhesion strength with the lead terminal lead-out portion side 16 are obtained.

In this embodiment, the external terminals 18-1 and 18-2 integrated with the pedestal portion 24 protrude to the side of the pedestal portion 24.

F) The forming steps of external terminals 18-1 and 18-2

The external terminals 18-1 and 18-2 are bent and formed on the seat surface 28 side along the terminal accommodating recesses 26 of the pedestal portion 24, and are accommodated in the terminal accommodating recesses 26. As shown in FIG. 2B, the front ends of the external terminals 18-1 and 18-2 are formed into surface-mounted connection terminal portions 30-1 and 30-2. Since the depth of each terminal accommodating recess 26 is shallower than that of each surface mount connection terminal portion 30-1, 30-2 (thinner than the thickness of each surface mount connection terminal portion 30-1, 30-2), each surface mount connection terminal The parts 30-1 and 30-2 protrude from the seating surface 28 of the pedestal part 24. As a result, the seating surface 28 is raised from a circuit board not shown in the figure, and the surface-mounted connection terminals 30-1 and 30-2 and the conductor pattern can obtain a good connection state by soldering or the like.

Resonance point detection test

The produced capacitor of Example 1 was mounted on a test substrate, and a resonance point detection test was performed. The test conditions are maximum acceleration of 40 [G], maximum full amplitude of 1.5 [mm], vibration frequency of 10 to 2000 [Hz], one scan number, and vibration in the X and Y directions described in FIG. 2B.

In the conventional example, the lead terminal of the capacitor body formed in the same manner as in Example 1 is inserted through the lead terminal insertion hole of the insulating member, that is, the lead terminal is bent along the insulating substrate to form a capacitor. Here, as the insulating plate used in the conventional example, a product equipped with an auxiliary terminal and having high vibration resistance among conventional products is used. Install this capacitor on the test base The board was tested in the same manner as in Example 1. The vibration direction of the conventional example is to make the X direction "the direction perpendicular to the lead terminal bent to the insulating plate" and the Y direction "the direction parallel to the lead terminal bent along the insulating plate".

In this test, since the maximum acceleration is 40 [G], the range from the peak acceleration to 140 [%] (=56 [G]) is within the allowable range, so it is determined that there is no resonance point.

Resonance point test results

The resonance point detection test of Example 1 and the conventional example was conducted to show the peak acceleration and its frequency.

It is confirmed from Table 1 that the vibration of the setting of the maximum acceleration of 40 [G] in Example 1 is 53 [G] in the X direction and 49 [G] in the Y direction. It is believed that the reason for detecting this peak acceleration is due to measurement errors or the influence of noise, etc. It can be seen that the resonance point with the maximum acceleration of 40 [G] does not exist.

In contrast to this, the conventional example detects a peak acceleration of 147 [G] in the X direction and 148 [G] in the Y direction, and it is known that the influence of vibration is large. Furthermore, since the conventional example has a bent portion formed on the lead terminal, vibration stress is concentrated on the bent portion, and the lead terminal may be broken.

The function and effect of Example 1

For the first embodiment described above, the functions and effects are listed as follows.

Improvement of vibration resistance of lead terminals 14-1, 14-2, etc.

(1) The lead terminals 14-1 and 14-2 are connected to the external terminals 18-1 and 18-2 without bending the lead terminals 14-1 and 14-2 on the capacitor body 4 side. That is, there is no bent portion in each of the lead terminals 14-1 and 14-2. Therefore, since there is no mechanically weak portion of the bent portion, even if vibration is applied to the capacitor body 4 or the pedestal portion 24 from the outside, the concentration of vibration stress can be avoided, so that the lead terminals 14-1, 14-2 can be made resistant Vibration is improved. Metal fatigue caused by vibration of the lead terminals 14-1 and 14-2 can be avoided.

(2) Since the bent portions of the lead terminals 14-1 and 14-2 do not exist, even if the weight of the capacitor body 4 increases, the concentration of vibration stress can be avoided, and the lead terminals 14-1 and 14-2 are not broken.

(3) Since the base portion 24 is molded by resin and fixed to the capacitor body 4, it is integrated with the capacitor body 4. With this, the vibration resistance of the capacitor 2 can be improved.

(4) The connecting portions 22-1, 22-2 of the lead terminals 14-1, 14-2 and the external terminals 18-1, 18-2 are covered with resin for molding the base portion 24, so they exist in The pedestal portion 24 is maintained in a fixed state. Therefore, even if the capacitor body 4 or the pedestal portion 24 is subjected to vibration, the concentration of the vibration stress on the connection portions 22-1, 22-2 can be avoided, and the vibration resistance of the connection portions 22-1, 22-2 can be improved.

(5) The gap 32 is maintained between the capacitor body 4 and the external terminals 18-1 and 18-2, and the resin for molding the pedestal portion 24 sufficiently enters the gap 32 and hardens. Thereby, the adhesion between the capacitor body 4 and the pedestal portion 24, the capacitor body 4 and the external terminals 18-1, 18-2 and the connection can be improved Adhesion of parts 22-1 and 22-2.

(6) When a resin sheet that can be melted by heating during molding is provided in the gap 32, the resin sheet and the resin are integrated to fill the gap 32, which can make up the close contact between the pedestal portion 24 and the capacitor body 4 Sex.

(7) When an insulating sheet is arranged between the capacitor body 4 and the external terminals 18-1 and 18-2, resin enters its gap, and insulation can be assured surely. Examples of the insulating sheet include sheets made of natural fibers or synthetic fibers.

(8) As shown in FIG. 2B, when a plurality of surface mount connection terminal portions 30-1 and 30-2 are arranged on the seating surface 28 of the pedestal portion 24 so as to be symmetrical from a line passing through the center point of the pedestal portion 24, Maintain the installed state of the capacitor 2 in a stable state, improve vibration resistance, and avoid the influence of torque or stress caused by the displacement of the center of gravity position.

Strengthening of capacitor 2 and reduction of assembly work

(9) Since the pedestal portion 24 is integrated with the capacitor body 4 by molding, the capacitor body 4 is reinforced by the pedestal portion 24, and the pedestal portion 24 is reinforced by the rigidity of the capacitor body 4, and the pedestal portion 24 and the capacitor body can be borrowed The strengths of 4 are complementary, and the capacitor 2 is strengthened.

(10) The base portion 24 is closely fixed to the capacitor body 4 and is integrated with the capacitor body 4 without depending on the strength of the lead terminals 14-1 and 14-2, so the shape of the lead terminals 14-1 and 14-2 Or, the thickness may be a design mainly based on electrical connection, and the design freedom of the lead terminals 14-1 and 14-2 may be sought.

(11) Since such a pedestal portion 24 is molded into the capacitor body 4, it is possible to omit the pedestal portion as a separate member from the capacitor body As is conventional, the fixed operation of fixing with lead terminals can reduce the number of parts.

(12) Since the resin enters the swaged recessed portion 12 of the housing 6 and the pedestal portion 24 is molded, the anchoring effect of a part of the pedestal portion 24 coupled to the swaged recessed portion 12 can be obtained, and the pedestal portion 24 can be prevented Separated or peeled from the capacitor body 4. Since the resin can enter a part of the swaged recessed portion 12, the same effect can be obtained. Therefore, compared with the case where the capacitor body 4 is fully molded and processed, the weight of the product can be suppressed.

Protection of the connection parts 22-1, 22-2, etc. of the lead terminals 14-1, 14-2

(13) The connection portions 22-1, 22-2 of the lead terminals 14-1, 14-2 and the external terminals 18-1, 18-2 are integrated with the inside of the molded base portion 24 to be protected. The reinforcing effect of the connecting portions 22-1 and 22-2 made by the base portion 24 fixed to the capacitor body 4 can be obtained. Thereby, even if the pedestal portion 24 is vibrated, the connection portions 22-1 and 22-2 can be protected, so the vibration to the capacitor body 4 can be reduced.

Lightening and low profile of capacitor 2

(14) Since the pedestal part 24 is formed by molding the capacitor body 4 by molding to reinforce the capacitor body 4, compared with the conventional thing where the pedestal part is a separate part, the outer shell of the capacitor body 4 can be made lighter, and also The thinning, lightening or mechanical strength can be arbitrarily selected according to the choice of resin. This contributes to the weight reduction and low profile of the capacitor 2. In addition, compared with the case where the capacitor body 4 is fully molded, the increase in the weight of the capacitor body 2 can be suppressed, and the weight of the capacitor 2 can be reduced.

(15) The connecting portions 22-1 and 22-2 provided in the pedestal portion 24 attach importance to electrical connection and can be set to a minimum strength or size. Thereby, the pedestal portion 24 can be thinned, and the thickness of the resin layer forming the pedestal portion 24 can also be adjusted.

Heat dissipation

(16) Since the capacitor body 4 is not fully molded, the housing 6 can directly contact the outside air, and the heat dissipation is improved compared to the case where the capacitor body 4 is fully molded.

Effect of inhibiting electrolyte leakage

(17) The pedestal portion 24 covers the lead terminal lead-out portion side 16 of the capacitor body 4 and is tightly fixed. Therefore, the sealing body 10 of the lead terminal lead-out portion side 16 is covered with the resin forming the pedestal portion 24. Therefore, the material of the sealing body 10, for example, the sealing function of rubber plus the sealing function of the resin of the pedestal portion 24, the sealing function of the sealing body 10 is reinforced by the pedestal portion 24. As a result, leakage of the electrolytic solution from the sealing body 10 side of the capacitor 2 can be suppressed, and the life of the capacitor 2 can be prolonged. When the pedestal portion 24 is provided, the thickness of the sealing body 10 can be reduced, so that the capacitor 2 can be lowered.

Improvement of electrical characteristics such as low ESL (Equivalent Series Inductance) and low ESR (Equivalent Series Resistance) of capacitor 2

(18) FIG. 5 shows the relationship between the current i flowing to the capacitor 2 and the magnetic flux ψ. At this time, the current i flows from, for example, the external terminal 18-1 on the anode side to the lead terminal 14-1, and from the capacitor element 8 to the external terminal 18-2 through the lead terminal 14-2 on the cathode side, assuming this time point. With each current i, at each external terminal 18-1 and 18-2 generate magnetic flux ψ individually, and the rotation direction of each magnetic flux ψ is opposite to the direction of current i.

Thereby, since the external terminals 18-1 and 18-2 constituting the path of the current i are arranged in parallel, the magnetic flux ψ generated can be canceled out. As a result, the inductance L proportional to the current i and the flux ψ chain can be reduced, and the ESL of the capacitor 2 can be reduced.

(19) In the capacitor 2, since the current path is in the two directions of the external terminals 18-1 and 18-2, the resistance can be reduced. Therefore, the ESR of the capacitor 2 can also be reduced.

(20) Since the gap 32 is set between the external terminals 18-1 and 18-2 and the capacitor body 4, the lead terminals 14-1 and 14-2 and the external terminals 18-1 and 18-2 and the capacitor body can be obtained 4. The insulation is further reinforced by the resin filling during the molding of the pedestal portion 24.

(21) When fitting or welding is used for the connection of the connection parts 22-1 and 22-2, the connection parts 22-1 and 22-2 can be protected from overheating when the soldered capacitor 2 is installed, and the capacitor 2 can be improved Reliability.

Comparison with conventional objects

(22) In the conventional method in which the lead is processed as an external electrode (for example, disclosed in Japanese Patent Laid-Open No. 60-245106), since the bent portion is formed on the lead, the vibration resistance is low, and the lead may be broken. Here, in the above embodiment, the connection portions 22-1, 22-2 are formed on the lead terminals 14-1, 14-2 and the external terminals 18-1, 18-2, but not on the lead terminals 14-1, 14- 2. The bent portion is formed, so metal fatigue caused by vibration of the bent portion can be prevented.

(23) When the anode lead or cathode lead is bonded to the insulation In the form of the anode terminal plate or the cathode terminal plate on the lower side of the resin coating layer (for example, disclosed in Japanese Patent Laid-Open Publication No. 2003-272962), since the entire capacitor element is molded with resin, the weight of the product increases and the influence of vibration On the other hand, in the above-mentioned Embodiment 1, such a drawback can be avoided.

Effect of modification of lead terminal insertion hole 20

Each lead terminal insertion hole 20 of each external terminal 18-1, 18-2 may be in a form of fitting with the inserted lead terminal 14-1, 14-2 instead of the aforementioned round hole. For example, the inner diameter of the lead terminal insertion hole 20 is narrower than the diameter of the lead terminal, and the inner side of the lead terminal insertion hole 20 has a plurality of fitting pieces at a certain angle, for example, an angular interval of 90 degrees, and is separated by this in the X direction The fitting piece has a plurality of penetration portions.

Furthermore, a pair of parallel penetration parts may be provided, and a pair of fitting pieces facing each other between the penetration parts may be provided. The front end of the opposite side of each insert has a V-shaped notch, and the opposite interval of the notch is set to be narrower than the diameter of the lead terminal.

In addition, a plurality of penetration portions may be formed in the Y direction, and a plurality of fitting pieces may be formed so that the interval between the facing surfaces of the fitting pieces is narrower than the lead terminal diameter.

By having such a lead terminal insertion hole 20 to fit the lead terminals 14-1 and 14-2 to the external terminals 18-1 and 18-2, the following functions and effects can be obtained.

(1) For example, each of the fitting pieces is bent along the insertion direction of the lead terminals 14-1 and 14-2, and the lead terminals 14-1 and 14- are fitted by the elastic rebound of the fitting pieces 2 and external terminals 18-1, 18-2, by which you can connect each The connection parts 22-1 and 22-2 are maintained in a stable connection state. Moreover, the resin can enter the deformed portion of each fitting piece, and the integrated adhesion strength of the connecting portions 22-1, 22-2 and the resin can be improved.

(2) In addition, when the lead terminal insertion hole 20 is used, the combination of the front end of the opposite side of each fitting piece with the V-shaped notch and the penetration of the resin into the penetration portion are significant, in addition to strengthening the electrical connection, the resin and the The mechanical strength of the penetration.

(3) When such a fitting structure is used for the connecting portions 22-1 and 22-2, since soldering is not used, the connection can be maintained even when used at a high temperature. In addition, the connection procedure can be simplified.

(4) In addition, since the resin enters the recess caused by the penetration portion or the fitting, the anchoring effect of the pedestal portion 24 and the connecting portions 22-1 and 22-2 due to the anchoring effect of the entered resin can be made improve.

Example 2

6A shows an example of a capacitor using the lead frame of Embodiment 2 and a method of manufacturing the same.

In this embodiment 2, the external terminals 18-1, 18-2 are formed with the lead frame 42. The lead frame 42 uses a conductive metal plate, a pair of parallel frame portions 44 is formed in the longitudinal direction, a plurality of bridge portions 46 are formed between the parallel frame portions 44, and the bridge portions 46 are formed by pressing Plural machining areas 48. Each processing area 48 is a molding unit of the pedestal portion 24.

Each processing area 48 has external terminals 18-1 and 18-2 that protrude from the parallel frame portions 44 in the opposite direction, and has perpendicular intersections with the external terminals 18-1 and 18-2 from the bridge portions 46 in the cross direction 1 pair of virtual The terminals 50-1 and 50-2 are planned. The dummy terminals 50-1 and 50-2 are examples of another external terminal. An insulation gap 52 is set between the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 before the end. Similarly, the external terminals 18-1 and 18-2 and the dummy terminal 50- Insulation interval 52 is set in the same way between 1, 50-2.

Lead terminal insertion holes 20 are formed in the external terminals 18-1 and 18-2, and dummy through holes 54 are formed in the dummy terminals 50-1 and 50-2.

After the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 are arranged in the cross direction, the base portion 24 is formed by resin molding.

In the capacitor 2 having such external terminals 18-1, 18-2 and dummy terminals 50-1, 50-2, as shown in FIG. 6B, a pedestal portion 24 is formed.

The function and effect of Example 2

According to this Embodiment 2, in addition to the functions and effects of Embodiment 1, the following functions and effects can be obtained.

(1) When the lead frame 42 is used, a plurality of pedestal portions 24 are simultaneously formed on the lead frame 42 to the capacitor body 4 to improve productivity.

(2) With the positioning of the lead frame 42, there is no need to individually locate the external terminals 18-1, 18-2, and the virtual terminals 50-1, 50-2, and the pedestal portion 24 can be molded with high accuracy to improve the molding accuracy , And can form a uniform pedestal portion 24.

(3) The resin enters the insulating space 52, which can maintain the insulation between the external terminal 18-1 and the external terminal 18-2, and between the external terminals 18-1, 18-2 and each dummy terminal 50-1, 50-2, And can improve the insulation between the terminals caused by resin.

(4) Since the dummy terminals 50-1 and 50-2 have a through hole 54 on the front end side, the resin penetrates the through hole 54 to increase the dummy terminals 50-1 and 50-1. The fixing strength of 50-2 and the base part 24.

(5) As shown in FIG. 6B, on the seating surface 28 of the pedestal portion 24, connection terminals 30-1, 30-2 are mounted on each surface of the external terminals 18-1, 18-2, and each virtual terminal 50-1 And 50-2 are similarly arranged with the surface mount connection terminal portions 30-1 and 30-2. Since this is equal to the arrangement on the seating surface 28 in the cross direction, the mounting surface of the wiring board or the like can stabilize the installation of the pedestal portion 24. With this, the vibration resistance of the capacitor 2 disposed on the mounting surface in all directions can be improved.

(6) In this Example 2, similarly to the above Example 1, it is possible to reduce the ESL and reduce the ESR.

Modification of lead frame 42 1. Functions and effects

As shown in FIGS. 7A and 7B, the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2 of the lead frame 42 may have surface-mounted connection terminal portions 30-1 and 30-2. The curved portion 56 that rises toward the inside of the pedestal portion 24. Since the other structures are the same as in the second embodiment, the same reference numerals are attached, and the description thereof is omitted.

According to this modification 1, the following functions and effects can be obtained.

(1) In such a lead frame 42, each external terminal 18-1, 18-2 and dummy terminal 50-1, 50-2 can expose each surface mount connection terminal portion 30-1, 30-2 to the pedestal portion 24 The seat surface 28 is molded with resin.

(2) As shown in FIG. 7B, each surface mount connection terminal portion 30-1, 30-2 can be exposed to the seat surface 28, and the pedestal portion 24 is molded. Therefore, as long as the external terminal 18-1, The 18-2 and the dummy terminals 50-1 and 50-2 can be disconnected from the lead frame 42 without forming processing such as bending. After molding the pedestal portion 24, the external terminals 18-1 and 18-2 are not required to be molded, and the product can be improved Shape accuracy.

(3) The external terminals 18-1, 18-2, and the dummy terminals 50-1, 50-2 have a bent portion 56, and the distance in the pedestal portion 24 is greater than that in Embodiment 2, so that the area of adhesion with the resin can be expanded. And the fixing strength with the base part 24 can be improved.

(4) In this modification 1, since the current paths of the external terminals 18-1 and 18-2 can also be shortened, the ESL can be reduced and the ESR can be reduced in the same manner as in the embodiments 1 and 2 described above.

Modification 2 of the lead frame 42 and its function and effect

In this modification 2, as shown in FIG. 8, the same external terminals 18-1 and 18-2 as the embodiment 2 are formed by the lead frame 42 and have a plurality of bridge portions 46 and are divided into a plurality of processing areas 48 to Formed by pressing. The same reference numerals are attached to the same parts as in Embodiment 2. In this modification 2, the external terminals 18-1 and 18-2 are formed by the parallel frame portion 44.

According to this modification 2, in addition to the functions and effects of the first and second embodiments, the following functions and effects can be obtained.

(1) Compared to the case of using the external parts 18-1 and 18-2 which are individual components of the first embodiment, the lead frame 42 can be positioned, and a plurality of pedestal portions 24 are formed on the lead frame 42 in one fell swoop, thereby improving productivity.

(2) In this modification 2, the external terminals 18-1 and 18-2 are formed by the parallel frame portion 44, so that the processing shape of the lead frame 42 can be simplified, and the manufacturing cost including the molding die can be reduced.

(3) According to this modified example 2, a plurality of surface mount connection terminal portions 30-1, 30-2 can be arranged in parallel on the table without the dummy terminals 50-1, 50-2 The four places on the seating surface 28 of the seat 24 can provide a stable arrangement of the capacitor 2, and even if subjected to vibration, it can be well balanced to withstand the vibration of the base 24, so that the vibration resistance of the capacitor 2 can be improved.

Modifications and effects of virtual terminals

In this modification, a single dummy terminal may be provided in the direction perpendicular to the external terminals 18-1, 18-2 within the insulating space 52 of the external terminals 18-1, 18-2. The end portion of this dummy terminal can be folded into the terminal accommodating recess 26 of the pedestal portion 24 as in the first embodiment (FIG. 2B ), and formed as a pair of surface mount connection terminal portions 30-1 and 30-2.

According to this modification, the following functions and effects can be obtained.

(1) Since the pedestal portion 24 is provided with a single dummy terminal in a direction perpendicular to the external terminals 18-1 and 18-2 in the insulating space 52 of the external terminals 18-1 and 18-2, the center of gravity can be arranged at The center portion of the capacitor 2 may be provided with surface mount connection terminal portions 30-1 and 30-2 on each side portion of the seat surface 28.

(2) When such dummy terminals are arranged in the processing area 48 of the lead frame 42 in the long direction, the lead frame 42 can be reinforced and deformation can be suppressed, and the external terminals 18-1, 18-2 and the dummy terminal to the pedestal can be improved The forming accuracy of the insert molding of the portion 24.

(3) When the dummy terminal has the above-mentioned dummy through hole, the dummy terminal and the pedestal portion 24 can be integrated, and the adhesion and fixability of the dummy terminal and the pedestal portion 24 can be improved.

Modifications and effects of shell 6

The capacitor body 4 can form a resin coating portion on the outer surface of the case 6. With the resin coating portion, the housing 6 can be constituted by resin coating the shell portion. At this time, the pedestal The portion 24 is integrated with the resin coating portion.

According to this modification, the following functions and effects can be obtained.

(1) Since the pedestal portion 24 can be integrated with the resin coating portion adhering to the casing 6 and fixed to the capacitor body 4, the fixing strength of the capacitor body 4 and the pedestal portion 24 can be improved.

(2) Since the resin coating portion on the case 6 side can be used for fixing strength, the base portion 24 can be thinned, and the amount of resin used to mold the base portion 24 can be reduced.

(3) By reducing the amount of resin used, the weight of the pedestal portion 24 can be reduced, which contributes to the weight reduction of the capacitor 2.

(4) In this modification, a resin coating portion is added to the case 6, or a structure in which a part or all of the case 6 is formed with resin and the capacitor body 4 has a resin case portion.

Selection of molded resin and its effect

As the resin, any one of thermoplastic resin and thermosetting resin such as epoxy resin, thermosetting polyester resin, thermoplastic polyester resin, PPS resin, and polyamide resin can also be used.

(1) If it is an epoxy resin, it is sufficient to use transfer molding, and it is excellent in chemical resistance, heat resistance, strength, and adhesion, and the molded product, that is, the pedestal portion 24 has such characteristics.

(2) If it is a thermosetting polyester resin, it is sufficient to use transfer molding, which has excellent adhesion and low price, and its molded product, that is, the pedestal portion 24, can obtain heat resistance, strength, and adhesion compared to other resins. Excellent characteristics.

(3) If it is a thermoplastic polyester resin, injection molding is sufficient, Low price. The base 24, which is a molded product, can be provided at a low price.

(4) If it is a PPS resin, injection molding may be used, which is excellent in heat resistance and strength, and the molded product, that is, the pedestal portion 24 has such characteristics.

(5) If it is a polyamide resin, injection molding may be used, which is excellent in heat resistance and strength, and the molded product, that is, the pedestal portion 24 has such characteristics.

Selection and effect of external terminal materials

For the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2, metal materials such as copper, copper alloy, refined copper, iron, and nickel may be used.

(1) Using any metal material, the aforementioned affinity with the resin can be obtained, and excellent adhesion and fixability can be obtained.

(2) When copper is used for the external terminals 18-1 and 18-2, since copper is a non-magnetic metal, ESL can be reduced.

(3) When iron is used for the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2, the strength can be improved.

(4) When nickel is used for the external terminals 18-1 and 18-2 and the dummy terminals 50-1 and 50-2, the strength is excellent and the corrosion resistance is excellent.

Other embodiments

(a) In the above embodiment, one example of an electronic component exemplifies a capacitor. The technique of the present disclosure can also be applied to electronic components other than capacitors, resistors, batteries, coils, and other components.

(b) In the above embodiment, the cylindrical capacitor body 4 is exemplified, and the appearance shape of the component body may also be a corner cylinder, etc. The technology of the present disclosure is not limited to the cylinder.

(c) In the above embodiment, the external terminal is illustrated on the pedestal part The seating surface 28 of 24 is arranged in a perpendicular intersection direction or a parallel direction, and may also be arranged in a Y-shaped direction or a T-shaped direction. In this way, when the external terminals are arranged in a two-dimensional configuration and have an extended space for the seating surface 28, not only the capacitor 2 but also the installation of electronic components can be stabilized, and the vibration resistance of the electronic components can be improved.

As described above, the preferred embodiment of the present invention has been described. The technology of the present disclosure is not limited to the above description. According to the gist of the invention described in the scope of the patent application or disclosed in the specification, the manufacturer can make various modifications and changes. It is needless to say that such modifications and changes are included in the scope of the present invention.

Industrial availability

Since the present invention molds the pedestal part covering the connection part of the lead terminal and the external terminal, and the connection part connects the external terminal and the lead terminal protruding to the outside of the part body on the outside of the part body, it can be widely applied It is useful for electronic parts such as capacitors, which can realize electronic parts with high vibration resistance.

2‧‧‧Capacitor

4‧‧‧Capacitor body

6‧‧‧Housing

8‧‧‧Capacitor element

10‧‧‧sealing body

12‧‧‧Forging Department

14-1, 14-2‧‧‧lead terminal

16‧‧‧Lead terminal side

18-1, 18-2‧‧‧External terminal

20‧‧‧Lead terminal insertion hole

22-1, 22-2 ‧‧‧ connection

24‧‧‧Pedestal Department

26‧‧‧Terminal storage recess

28‧‧‧Seat

IIA‧‧‧

Claims (9)

An electronic component comprising: a component body with a lead terminal protruding to the outside; an external terminal connected to the lead terminal; and a pedestal portion which is molded and connected to the outside of the component body The connection portion of the external terminal is covered and fixed to at least a part of the lead terminal extraction portion side of the aforementioned part body. The electronic component according to claim 1, wherein the part body has a resin shell portion or a resin-coated shell portion, and the base portion is molded from the resin shell portion or the resin-coated shell portion. The electronic component according to claim 1, wherein an insulating sheet is further provided between the component body and the external terminal. The electronic component according to claim 2, wherein an insulating sheet is further provided between the component body and the external terminal. The electronic component according to any one of claims 1 to 4, wherein the connection portion has a lead terminal fitting portion that fits the lead terminal and the external terminal. The electronic component according to any one of claims 1 to 4, wherein the part body has a swaged recess on the side of the case, and the pedestal portion is provided on part or all of the swaged recess. The electronic component according to any one of claims 1 to 4, wherein the external terminal is arranged in a perpendicular intersecting direction, a parallel direction, Y direction or T direction. The electronic component according to any one of claims 1 to 4, wherein the external terminal has a surface mount connection terminal portion in which the bent portion is inside the pedestal portion and exposed on the seating surface side of the pedestal portion. An electronic part manufacturing method includes the following steps: a step of forming a part body with lead terminals protruding to the outside; a step of forming an external terminal; a step of connecting the lead terminal and the external terminal on the outside of the part body; and a mold A step of forming a pedestal portion that covers the connection portion of the lead terminal and the external terminal and is fixed to at least a part of the lead terminal extraction portion side of the part body.

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