CN117528905A - Circuit board semi-finished product and processing equipment thereof - Google Patents
Circuit board semi-finished product and processing equipment thereof Download PDFInfo
- Publication number
- CN117528905A CN117528905A CN202311391974.2A CN202311391974A CN117528905A CN 117528905 A CN117528905 A CN 117528905A CN 202311391974 A CN202311391974 A CN 202311391974A CN 117528905 A CN117528905 A CN 117528905A
- Authority
- CN
- China
- Prior art keywords
- substrate
- positioning
- circuit board
- marking
- positioning part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011265 semifinished product Substances 0.000 title claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 136
- 230000013011 mating Effects 0.000 claims description 12
- 239000000047 product Substances 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
The invention discloses a circuit board semi-finished product and processing equipment thereof, comprising a substrate, wherein a first positioning part and a second positioning part are arranged on the substrate, the first positioning part is arranged at one end of the substrate, the second positioning part is arranged at the other end of the substrate, and the first positioning part and the second positioning part are both used for being connected with the processing equipment; one end of the substrate is provided with two corners, the first positioning part is arranged at one corner of one end of the substrate, and one side of the first positioning part is provided with a marking part; the first positioning part, the second positioning part and the marking part are all arranged on two sides of the substrate in a penetrating way, when the marking part is positioned at one corner of one end of the substrate, the front side of the substrate is upwards connected to the processing equipment, and when the marking part is positioned at the other corner of the one end of the substrate, the back side of the substrate is upwards connected to the processing equipment. The positions of the marking parts are observed, so that the front and the back of the circuit board semi-finished product are judged, and the circuit board semi-finished product can be processed according to requirements to obtain a required product.
Description
Technical Field
The invention relates to the field of PCB boards, in particular to a circuit board semi-finished product and processing equipment thereof.
Background
The PCB, also called a printed wiring board, is an important electronic component, is a support for electronic components, and is a carrier for electrically interconnecting the electronic components.
In the processing process, the semi-finished product of the circuit board is often required to be drilled, however, after copper coating, the front surface and the back surface of the semi-finished product of the circuit board are identical in appearance, and the front surface and the back surface of the semi-finished product of the circuit board cannot be distinguished.
Disclosure of Invention
Based on this, it is necessary to provide a circuit board semifinished product that facilitates distinguishing between the front and back sides.
In addition, it is necessary to provide a processing apparatus for matching with the above-mentioned circuit board semifinished product so as to process the circuit board semifinished product.
In order to solve the problems, the invention provides a circuit board semi-finished product, which comprises a substrate, wherein a first positioning part and a second positioning part are arranged on the substrate, the first positioning part is arranged at one end of the substrate, the second positioning part is arranged at the other end of the substrate, and the first positioning part and the second positioning part are both used for being connected with processing equipment;
the first positioning part is arranged at one corner of one end of the substrate, and one side of the first positioning part is provided with a marking part;
the first positioning part, the second positioning part and the marking part penetrate through two sides of the substrate, when the marking part is positioned at one corner of one end of the substrate, the front side of the substrate is upwards connected to the processing equipment, and when the marking part is positioned at the other corner of one end of the substrate, the back side of the substrate is upwards connected to the processing equipment.
In one embodiment, the first positioning portion, the second positioning portion, and the marking portion are through holes.
In one embodiment, the apertures of the first positioning portion, the second positioning portion, and the marking portion are all the same.
In one embodiment, the substrate is rectangular.
In one embodiment, the first positioning portion is disposed at a corner between two adjacent sides of the substrate, and the second positioning portion is disposed at a corner between two other adjacent sides of the substrate.
In one embodiment, the circuit board semi-finished product further comprises a third positioning part and a fourth positioning part, wherein the third positioning part and the fourth positioning part are arranged at the corners of the substrate;
the third positioning part and the fourth positioning part are diagonally arranged on the substrate, the second positioning part corresponds to the marking part, and the third positioning part corresponds to the fourth positioning part.
In one embodiment, the marking part is disposed at a side of the first positioning part near the side of the substrate.
In one embodiment, the number of the marking parts is two, and the two marking parts and the first positioning part are positioned on the same straight line.
In one embodiment, a processing device is used for processing the circuit board semi-finished product, the circuit board semi-finished product comprises a substrate, a first positioning part and a second positioning part are arranged on the substrate, the first positioning part is arranged at one end of the substrate, and the second positioning part is arranged at the other end of the substrate;
the first matching piece corresponds to the first positioning piece, so that one end of the substrate is connected to the workbench, and the second matching piece corresponds to the second positioning piece, so that the other end of the substrate is connected to the workbench.
In one embodiment, the first mating member and the second mating member are each raised.
By implementing the embodiment of the invention, the two ends of the substrate can be installed on the processing equipment through the first positioning part and the second positioning part which are arranged on the substrate, so that the semi-finished circuit board is installed and fixed, and the processing equipment can process the substrate;
the marking part is arranged close to the first positioning part, so that the position of the marking part can be conveniently observed, and whether the substrate is on the front side or the back side can be judged;
therefore, the circuit board semi-finished product can judge the front surface and the back surface of the circuit board semi-finished product by observing the positions of the marking parts, and the front surface and the back surface of the circuit board semi-finished product can be distinguished to respectively process the two surfaces of the circuit board semi-finished product according to the requirements, so that the required product is obtained.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Wherein:
fig. 1 is a schematic structural diagram of a circuit board semi-finished product according to an embodiment.
Fig. 2 is a schematic view of a table of a processing apparatus for matching with the circuit board semifinished product shown in fig. 1.
Fig. 3 is a schematic diagram of a circuit board semi-finished product after being connected with a workbench of a processing device.
Reference numerals:
10-circuit board semi-finished products, 11-substrates, 12-production holes, 13-first positioning parts, 14-marking parts, 15-second positioning parts, 17-third positioning parts and 19-fourth positioning parts;
200-processing equipment, 210-work station, 230-first mating member, 250-second mating member, 270-third mating member, 290-fourth mating member.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the members in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicators are correspondingly changed.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
Referring to fig. 1-3, the circuit board semi-finished product 10 according to an embodiment of the present invention includes a substrate 11, a first positioning portion 13 and a second positioning portion 15 are disposed on the substrate 11, the first positioning portion 13 is disposed at one end of the substrate 11, the second positioning portion 15 is disposed at the other end of the substrate 11, and the first positioning portion 13 and the second positioning portion 15 are both used for being connected with a processing device 200.
The one end of the base plate 11 has two corners, the first positioning portion 13 is disposed at one of the corners of the one end of the base plate 11, and a marking portion 14 is disposed on one side of the first positioning portion 13.
The first positioning portion 13, the second positioning portion 15 and the marking portion 14 are all disposed through two sides of the substrate 11, when the marking portion 14 is located at one corner of one end of the substrate 11, the front side of the substrate 11 is connected to the processing apparatus 200, and when the marking portion 14 is located at the other corner of one end of the substrate 11, the back side of the substrate 11 is connected to the processing apparatus 200.
Specifically, the circuit board blank 10 is connected to the processing apparatus 200 via the first positioning portion 13 and the second positioning portion 15, and the processing apparatus 200 can be fixed so that the processing apparatus 200 processes the circuit board blank 10.
The first positioning portion 13 and the second positioning portion 15 are provided through the substrate 11 so as to be connected to the processing apparatus 200 through both the front surface of the circuit board semi-finished product 10 and the back surface of the circuit board semi-finished product 10.
One end of the substrate 11 is provided with two corners, one corner of one end of the substrate 11 is positioned at the left lower end, and the other corner of one end of the substrate 11 is positioned at the right lower end; the first positioning portion 13 and the marking portion 14 are disposed at one of corners of one end of the substrate 11, that is, the first positioning portion 13 and the marking portion 14 are disposed at a left lower end of the substrate 11.
The marking portion 14 is provided through the substrate 11, and thus the marking portion 14 can be observed when the circuit board blank 10 is on the front surface or the circuit board blank 10 is on the back surface, and the front and back surfaces of the circuit board blank 10 can be distinguished by observing the position of the marking portion 14.
When the marking portion 14 and the first positioning portion 13 are located at the left lower end of the substrate 11, the substrate 11 is connected to the processing apparatus 200 through the first positioning portion 13 and the second positioning portion 15 with the front surface facing upward, and the processing apparatus 200 can process the front surface of the substrate 11; conversely, when the marking portion 14 and the first positioning portion 13 are located at the right lower end of the substrate 11, the substrate 11 is connected to the processing apparatus 200 through the first positioning portion 13 and the second positioning portion 15 with the reverse surface facing upward, and the processing apparatus 200 can process the reverse surface of the substrate 11.
By implementing the embodiment of the invention, the two ends of the substrate 11 can be mounted on the processing equipment 200 through the first positioning part 13 and the second positioning part 15 arranged on the substrate 11, so that the circuit board semi-finished product 10 is mounted and fixed, and the processing equipment 200 can process the substrate 11.
The marking portion 14 is disposed near the first positioning portion 13, so that it is possible to easily determine whether the substrate 11 is on the front or the back by observing the position of the marking portion 14, when the marking portion 14 is located at one of the corners of one end of the substrate 11, the front side of the substrate 11 is connected to the processing apparatus 200, and when the marking portion 14 is located at the other corner of one end of the substrate 11, the back side of the substrate 11 is connected to the processing apparatus 200.
Therefore, by observing the positions of the marking portions 14, the circuit board semi-finished product 10 can be judged to be the front and back surfaces of the circuit board semi-finished product 10, and the front and back surfaces of the circuit board semi-finished product 10 can be distinguished from each other, and the both surfaces of the circuit board semi-finished product 10 can be processed as required to obtain a desired product.
In one embodiment, the processing tool 200 is an exposure machine. The front or back of the circuit board semi-finished product 10 can be printed to obtain a required circuit board according to the requirements.
In another embodiment, the machining apparatus 200 is a drilling apparatus. The inner layer alignment hole can be drilled on the circuit board semi-finished product 10.
Referring to fig. 1, the first positioning portion 13, the second positioning portion 15, and the marking portion 14 are through holes.
Preferably, the apertures of the first positioning portion 13, the second positioning portion 15, and the marking portion 14 are the same.
Specifically, the first positioning portion 13, the second positioning portion 15, and the marking portion 14 are all through holes having the same aperture, so that the processing is convenient, and the labor and the cost can be saved.
The lower left end of the substrate 11 has two continuous through holes, so that the lower left end of the substrate 11 is marked such that the position of the substrate 11 provided with the marking portion 14 is different from other portions of the substrate 11, i.e., the lower left end of the substrate 11, the lower right end of the substrate 11, the upper left end of the substrate 11, the upper right end of the substrate 11 are separated from each other. The positions of the mark portions 14 can be judged by observing the positions of the two continuous through holes so as to distinguish the front and back surfaces of the circuit board semifinished product 10.
Preferably, the substrate 11 is rectangular.
The substrate 11 has four corners, namely, a corner at the lower left end of the substrate 11, a corner at the lower right end of the substrate 11, a corner at the upper left end of the substrate 11, and a corner at the upper right end of the substrate 11.
Specifically, one end of the substrate 11 is a left end of the rectangular substrate 11, the other end of the substrate 11 is a right end of the rectangular substrate 11, one corner of one end of the substrate 11 is a corner of a left lower end of the substrate 11, and the other corner of one end of the substrate 11 is a corner of a right lower end of the substrate 11.
Preferably, the first positioning portion 13 is disposed at a corner between two adjacent sides of the substrate 11, and the second positioning portion 15 is disposed at a corner between two adjacent sides of the substrate 11.
Specifically, the first positioning portion 13 and the marking portion 14 are provided at the corner of the lower left end of the substrate 11, and the second positioning portion 15 is provided at the corner of the upper right end of the substrate 11. This makes the first positioning portion 13 and the second positioning portion 15 diagonally arranged, and such arrangement enables the substrate 11 to be stably attached to the upper surface of the processing apparatus 200 when the substrate 11 is connected to the processing apparatus 200 through the first positioning portion 13 and the second positioning portion 15, so that the connection of the substrate 11 and the processing apparatus 200 can be more stable.
Preferably, the circuit board semi-finished product 10 further includes a third positioning portion 17 and a fourth positioning portion 19, where the third positioning portion 17 and the fourth positioning portion 19 are disposed at corners of the substrate 11; the third positioning portion 17 and the fourth positioning portion 19 are diagonally disposed on the substrate 11, and the second positioning portion 15 corresponds to the marking portion 14, and the third positioning portion 17 corresponds to the fourth positioning portion 19.
Specifically, the third positioning portion 17 and the fourth positioning portion 19 are through holes, and the apertures of the third positioning hole and the fourth positioning hole are the same as those of the first positioning hole. The processing of the circuit board semi-finished product 10 can be facilitated.
The third positioning portion 17 is provided at the corner of the upper left end of the base plate 11, and the fourth positioning portion 19 is provided at the corner of the lower right end of the base plate 11. By providing the first positioning portion 13, the second positioning portion 15, the third positioning portion 17, and the fourth positioning portion 19 at the four corners of the substrate 11, respectively, the substrate 11 can be connected to the table 210 of the processing apparatus 200 by connecting the four corners of the substrate 11, so that the substrate 11 can be connected to the processing apparatus 200 conveniently.
The line connecting the mark portion 14 and the second positioning portion 15 is one diagonal line of the rectangular substrate 11, and the line connecting the third positioning portion 17 and the fourth positioning portion 19 is the other diagonal line of the rectangular substrate 11. The marking portion 14 corresponds to the second positioning portion 15, which makes the pattern enclosed by the four positioning portions be trapezoidal instead of rectangular.
The configuration of the pattern surrounded by the four positioning portions into a trapezoid can enable the circuit board semi-finished product 10 to have only two connection modes when being connected with the processing equipment 200, namely, the case that the first positioning portion 13 and the marking portion 14 are located at the left lower end and the case that the first positioning portion 13 and the marking portion 14 are located at the right lower end. It is possible to easily distinguish between the front side, i.e., either the front side or the back side, of the circuit board blank 10.
It will be appreciated that if the pattern surrounded by the four positioning portions is configured as a rectangle, the circuit board semi-finished product 10 has four connection prevention when connected to the processing apparatus 200, that is, the case where the first positioning portion 13 and the marking portion 14 are located at the left lower end, the case where the first positioning portion 13 and the marking portion 14 are located at the right lower end, the case where the first positioning portion 13 and the marking portion 14 are located at the left upper end, and the case where the first positioning portion 13 and the marking portion 14 are located at the right upper end. This increases the probability of judgment and increases the difficulty in distinguishing the square face of the circuit board blank 10.
Preferably, the marking part 14 is disposed at a side of the first positioning part 13 near the side of the substrate 11.
Further, the number of the marking portions 14 is two, and the two marking portions 14 and the first positioning portion 13 are located on the same straight line.
Specifically, the marking portion 14 is disposed on the left side of the first positioning portion 13, the two marking portions 14, the first positioning portion 13, and the fourth positioning portion 19 are positioned on the same horizontal line, the leftmost marking portion 14 and the third positioning portion 17 are positioned on the same vertical line, the second positioning portion 15 and the fourth positioning portion 19 are positioned on the same vertical line, and the second positioning portion 15 and the third positioning portion 17 are positioned on the same horizontal line.
The two marking portions 14 can facilitate the user to observe the positions of the marking portions 14, thereby distinguishing the front and back sides of the circuit board blank 10.
Referring to fig. 2 and 3, a processing apparatus 200 is configured to process the above-mentioned circuit board semi-finished product 10, where the circuit board semi-finished product 10 includes a substrate 11, a first positioning portion 13 and a second positioning portion 15 are disposed on the substrate 11, the first positioning portion 13 is disposed at one end of the substrate 11, the second positioning portion 15 is disposed at the other end of the substrate 11, and the processing apparatus 200 includes a workbench 210, and a first fitting member 230 and a second fitting member 250 are disposed on an upper surface of the workbench 210.
The first mating member 230 corresponds to the first positioning member, so that one end of the substrate 11 is connected to the table 210, and the second mating member 250 corresponds to the second positioning member, so that the other end of the substrate 11 is connected to the table 210.
Further, the first mating element 230 and the second mating element 250 are both protrusions.
Specifically, the processing apparatus 200 has a table 210 for connecting the circuit board semifinished product 10.
The first fitting 230 and the second fitting 250 are protrusions that match the through holes.
The upper surface of the working table 210 is provided with a first matching member 230, a second matching member 250, a third matching member 270 and a fourth matching member 290, wherein the first matching member 230 corresponds to the first positioning member, the second matching member 250 corresponds to the second positioning member, the third matching member 270 corresponds to the third positioning member, and the fourth matching member 290 corresponds to the fourth positioning member. The substrate 11 is placed on the stage 210, the protrusions are inserted into the corresponding through holes, and the substrate 11 is connected to the stage 210.
The working table 210 can install and position the circuit board semi-finished product 10 by providing the first fitting 230, the second fitting 250, the third fitting 270 and the fourth fitting 290, and can prevent the circuit board semi-finished product 10 from moving when the processing equipment 200 processes the circuit board semi-finished product 10 again, thereby affecting the processing precision.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. The circuit board semi-finished product is characterized by comprising a substrate, wherein a first positioning part and a second positioning part are arranged on the substrate, the first positioning part is arranged at one end of the substrate, the second positioning part is arranged at the other end of the substrate, and the first positioning part and the second positioning part are both used for being connected with processing equipment;
the first positioning part is arranged at one corner of one end of the substrate, and one side of the first positioning part is provided with a marking part;
the first positioning part, the second positioning part and the marking part penetrate through two sides of the substrate, when the marking part is positioned at one corner of one end of the substrate, the front side of the substrate is upwards connected to the processing equipment, and when the marking part is positioned at the other corner of one end of the substrate, the back side of the substrate is upwards connected to the processing equipment.
2. The circuit board semi-finished product according to claim 1, wherein the first positioning portion, the second positioning portion and the marking portion are through holes.
3. The circuit board semi-finished product according to claim 2, wherein the apertures of the first positioning portion, the second positioning portion and the marking portion are all the same.
4. A circuit board blank according to any one of claims 1 to 3, wherein the substrate is rectangular.
5. The circuit board blank of claim 4, wherein the first locating portion is disposed at a corner between two of the adjacent sides of the substrate and the second locating portion is disposed at a corner between two other adjacent sides of the substrate.
6. The circuit board semi-finished product according to claim 5, further comprising a third positioning portion and a fourth positioning portion, wherein the third positioning portion and the fourth positioning portion are both disposed at corners of the substrate;
the third positioning part and the fourth positioning part are diagonally arranged on the substrate, the second positioning part corresponds to the marking part, and the third positioning part corresponds to the fourth positioning part.
7. The circuit board semi-finished product according to claim 5, wherein the marking portion is provided on a side of the first positioning portion near the side edge of the substrate.
8. The circuit board semi-finished product according to claim 7, wherein the number of the marking portions is two, and the two marking portions and the first positioning portion are positioned on the same straight line.
9. A processing device for processing the circuit board semi-finished product according to any one of claims 1 to 8, the circuit board semi-finished product comprising a substrate, wherein a first positioning part and a second positioning part are arranged on the substrate, the first positioning part is arranged at one end of the substrate, and the second positioning part is arranged at the other end of the substrate;
the first matching piece corresponds to the first positioning piece, so that one end of the substrate is connected to the workbench, and the second matching piece corresponds to the second positioning piece, so that the other end of the substrate is connected to the workbench.
10. The processing apparatus of claim 9, wherein the first mating member and the second mating member are each raised.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311391974.2A CN117528905A (en) | 2023-10-25 | 2023-10-25 | Circuit board semi-finished product and processing equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311391974.2A CN117528905A (en) | 2023-10-25 | 2023-10-25 | Circuit board semi-finished product and processing equipment thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117528905A true CN117528905A (en) | 2024-02-06 |
Family
ID=89761631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311391974.2A Pending CN117528905A (en) | 2023-10-25 | 2023-10-25 | Circuit board semi-finished product and processing equipment thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117528905A (en) |
-
2023
- 2023-10-25 CN CN202311391974.2A patent/CN117528905A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5704535A (en) | Shield and method for selective wave soldering | |
| US5005814A (en) | Product carrier for circuit boards | |
| US8009432B2 (en) | Retaining apparatus for a flexible printed circuit board | |
| US20020109775A1 (en) | Back-lighted fiducial recognition system and method of use | |
| US6917524B2 (en) | Extension mechanism and method for assembling overhanging components | |
| US8038451B2 (en) | Multi-board printed circuit assembly having aligned connectors | |
| CN117528905A (en) | Circuit board semi-finished product and processing equipment thereof | |
| JP4175492B2 (en) | PCB inspection jig | |
| US20060186182A1 (en) | Cream solder printing metal mask with positioning function and its positioning method | |
| US7587816B2 (en) | Method of improving the stability of a circuit board | |
| JP3872482B2 (en) | Printed board | |
| EP0787992A3 (en) | Housing for an electricity meter | |
| US6268616B1 (en) | Electrical wiring board and method for identifying same | |
| US6191369B1 (en) | Printed circuit board having a marker trace for component alignment | |
| JPH05167219A (en) | Substrate printing method | |
| JPH0223006Y2 (en) | ||
| EP3799537A1 (en) | Reversible electronic card and method of implementation thereof | |
| US11385002B2 (en) | Implementing modular baffling mechanism for selectively redirecting and impeding airflow | |
| KR100688452B1 (en) | Alignment Structure for Boards of printed Circuit Board | |
| JP2938010B1 (en) | Semiconductor device mounting positioning jig and semiconductor device mounting positioning method | |
| JPH10135692A (en) | Base table for mounting printed wiring board | |
| KR200250844Y1 (en) | Back up pin of Surface Mounting Device | |
| JPH11214824A (en) | Printing mask and manufacture of printed wiring board using the same | |
| JPS58303Y2 (en) | printed wiring board | |
| CN114727485A (en) | PCB with high element integration level and production method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |