CN117525808A - Coaxial line and preparation method and device thereof - Google Patents
Coaxial line and preparation method and device thereof Download PDFInfo
- Publication number
- CN117525808A CN117525808A CN202410021882.3A CN202410021882A CN117525808A CN 117525808 A CN117525808 A CN 117525808A CN 202410021882 A CN202410021882 A CN 202410021882A CN 117525808 A CN117525808 A CN 117525808A
- Authority
- CN
- China
- Prior art keywords
- outer conductor
- printing
- side wall
- insulating
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title abstract description 27
- 239000004020 conductor Substances 0.000 claims abstract description 436
- 238000007639 printing Methods 0.000 claims abstract description 138
- 238000000034 method Methods 0.000 claims abstract description 60
- 238000011049 filling Methods 0.000 claims description 113
- 238000009413 insulation Methods 0.000 claims description 43
- 239000011810 insulating material Substances 0.000 claims description 39
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 238000005245 sintering Methods 0.000 claims description 17
- 238000000151 deposition Methods 0.000 claims description 15
- 238000012545 processing Methods 0.000 claims description 13
- 239000012212 insulator Substances 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000002955 isolation Methods 0.000 abstract description 16
- 230000008569 process Effects 0.000 abstract description 16
- 239000000976 ink Substances 0.000 description 112
- 239000000463 material Substances 0.000 description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052790 beryllium Inorganic materials 0.000 description 5
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 238000010146 3D printing Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/005—Manufacturing coaxial lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/06—Coaxial lines
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Waveguides (AREA)
Abstract
The application provides a coaxial line and a preparation method and device thereof, and relates to the technical field of coaxial line preparation. The preparation method of the coaxial line comprises the step of adopting a direct-writing printing mode to prepare at least part of the outer conductor, the inner conductor and an insulating sleeve sleeved outside the inner conductor. Therefore, the method for preparing the coaxial line is simpler in process, and the prepared coaxial line is smaller in loss and higher in isolation degree when transmitting signals.
Description
Technical Field
The application relates to the technical field of coaxial line preparation, in particular to a coaxial line and a preparation method and a device thereof.
Background
Coaxial lines are one type of transmission line that can be used to transmit radio frequency signals. The coaxial line comprises at least 2 layers of conductor structures which are coaxial and arranged inside and outside, and the miniaturized coaxial line can realize the transmission of microwave millimeter wave signals with low loss, high isolation, high power capacity and ultra-bandwidth, thereby being beneficial to improving the integration level of a radio frequency circuit.
With the development of 3D printing technology, the coaxial line can be prepared by adopting the 3D printing technology. In the related art, the lower outer conductor can be printed by adopting a mode of laser melting paved metal powder, a lower cavity is formed in the lower outer conductor at the same time, then photoresist is filled in the lower cavity, the photoresist is exposed and developed to form a supporting layer, the inner conductor is printed on the surface of the supporting layer by adopting a mode of laser melting paved metal powder, and finally the upper outer conductor is printed on the upper end face of the lower outer conductor by adopting a mode of laser melting paved metal powder, so that the lower outer conductor and the uploading outer conductor are enclosed to form an outer conductor positioned outside the inner conductor.
However, the method for preparing the coaxial line by adopting the 3D printing technology in the related art has complex process, and the prepared coaxial line has larger loss and lower isolation when transmitting signals.
Disclosure of Invention
The coaxial line, the preparation method and the device thereof are simple, and the prepared coaxial line has small loss and high isolation degree when transmitting signals.
In a first aspect, the present application provides a method for preparing a coaxial line, the method comprising:
and printing in a first filling cavity formed between the bottom wall of the outer conductor and the side wall of the first outer conductor in a direct writing printing mode to form a first insulating structure, wherein the side wall of the first outer conductor is arranged on the upper surface of the bottom wall of the outer conductor, and the first insulating structure fills up the first filling cavity.
And printing on the upper surface of the first insulating structure by a direct-writing printing mode to form an inner conductor.
And printing on the surface of the first insulation structure and the surface of the inner conductor in a direct writing printing mode to form an insulation upper covering structure, and printing on the upper end face of the side wall of the first outer conductor and the surface of the insulation upper covering structure to form an upper outer conductor structure, wherein the first insulation structure and the insulation upper covering structure are enclosed to form an insulation sleeve arranged on the outer side of the inner conductor, and the outer conductor bottom wall, the first outer conductor side wall and the upper outer conductor structure are enclosed to form an outer conductor arranged on the outer side of the insulation sleeve.
Optionally, by means of direct writing printing, a first insulating structure is formed by printing in a first filling cavity formed between the bottom wall of the outer conductor and the side wall of the first outer conductor, and the method includes:
the first filling chamber is filled with the insulating material ink, and the volume of the insulating material ink filled in the first filling chamber is multiplied by the curing shrinkage rate of the insulating material ink, so that the volume of the space in the first filling chamber is equal to the volume of the space in the first filling chamber.
And carrying out on-line curing on the insulating material ink filled in the first filling cavity to form a first insulating structure.
Optionally, printing on the upper surface of the first insulating structure by direct writing to form an inner conductor includes:
depositing first conductive material ink at a first preset position to form a first ink structure, wherein the first preset position is positioned on the upper surface of the first insulating structure.
The first ink structure is treated in at least one of an in-line curing and an in-line sintering to form an inner conductor.
Optionally, the first insulating structure and the insulating cover over structure are printed with the same insulating material ink.
Optionally, printing on the surface of the first insulating structure and the surface of the inner conductor to form an insulating upper covering structure, and printing on the upper end surface of the side wall of the first outer conductor and the surface of the insulating upper covering structure to form an upper outer conductor structure by direct writing printing, including:
And printing the upper end surface of the first outer conductor side wall to form a second outer conductor side wall in a direct writing printing mode, wherein the heights of the second outer conductor side wall and the inner conductor are the same, and a second filling cavity and a third filling cavity are respectively formed between the second outer conductor side wall and two sides of the inner conductor.
Printing in the second filling cavity to form a second insulating structure and printing in the third filling cavity to form a third insulating structure in a direct writing printing mode, wherein the second insulating structure fills the second filling cavity, and the third insulating structure fills the third filling cavity.
And printing the upper end surface of the second outer conductor side wall to form a third outer conductor side wall in a direct writing printing mode, wherein a fourth filling cavity is formed among the third outer conductor side wall, the second insulating structure, the inner conductor and the third insulating structure.
And printing in the fourth filling cavity in a direct writing printing mode to form a fourth insulating structure, wherein the fourth insulating structure fills up the fourth filling cavity.
And printing the upper end surface of the side wall of the third layer of outer conductor and the surface of the fourth insulating structure in a direct writing printing mode to form the top wall of the outer conductor.
The first insulating structure, the second insulating structure, the third insulating structure and the fourth insulating structure are enclosed to form an insulating sleeve, and the bottom wall of the outer conductor, the side wall of the first outer conductor, the side wall of the second outer conductor, the side wall of the third outer conductor and the top wall of the outer conductor are enclosed to form an outer conductor.
Optionally, the spacing between the inner conductor and the second outer conductor side wall is equal to the spacing between the inner conductor and the outer conductor bottom wall.
Optionally, the method further comprises:
printing on the surface of the bearing structure by a direct writing printing mode to form an outer conductor bottom wall and a first outer conductor side wall arranged on the upper surface of the outer conductor bottom wall.
Optionally, by direct writing printing, an outer conductor bottom wall and a first outer conductor side wall disposed on an upper surface of the outer conductor bottom wall are formed on a surface of the bearing structure by printing, including:
depositing a second conductive material ink at a second preset position to form a second ink structure, wherein the second preset position is positioned on the upper surface of the bearing structure.
And depositing second conductive material ink at a third preset position to form a third ink structure, wherein the third preset position is positioned on the upper surface of the second ink structure.
And processing the second ink structure and the third ink structure by adopting at least one of online solidification and online sintering so that the second ink structure and the third ink structure form an outer conductor bottom wall and a first outer conductor side wall arranged on the upper surface of the outer conductor bottom wall.
In a second aspect, the present application provides a coaxial line preparation device comprising a processor and a memory communicatively coupled to the processor. The memory stores computer-executable instructions and the processor executes the computer-executable instructions stored by the memory to implement the method of any of the embodiments described above.
In a third aspect, the present application provides a coaxial line manufacturing device comprising respective functional modules for implementing the method in any of the embodiments described above.
In a fourth aspect, the present application provides a computer-readable storage medium having stored therein computer instructions which, when executed by at least one processor of a coaxial line preparation device, perform the method of any of the above embodiments.
In a fifth aspect, the present application provides a computer program product comprising computer instructions which, when executed by at least one processor of a coaxial line preparation device, performs the method of any of the embodiments described above.
In a sixth aspect, the present application provides a coaxial line made using the method of making any of the embodiments described above.
The method for preparing the coaxial line comprises the steps of printing in a first filling cavity formed between the bottom wall of the outer conductor and the side wall of the first outer conductor in a direct writing printing mode to form a first insulating structure, wherein the side wall of the first outer conductor is arranged on the upper surface of the bottom wall of the outer conductor, and the first insulating structure fills up the first filling cavity; printing on the upper surface of the first insulating structure by a direct-writing printing mode to form an inner conductor; printing on the surface of the first insulating structure and the surface of the inner conductor to form an upper insulating cover structure and printing on the upper end face of the side wall of the first outer conductor and the surface of the upper insulating cover structure to form an upper outer conductor structure, wherein the first insulating structure and the upper insulating cover structure are enclosed to form an insulating sleeve arranged outside the inner conductor, and the bottom wall of the outer conductor, the side wall of the first outer conductor and the upper outer conductor structure are enclosed to form an outer conductor arranged outside the insulating sleeve
Through above-mentioned setting, inner conductor, last outer conductor structure, first insulation construction and insulating cover structure all adopt the mode of direct-write to print and form, and the surface smoothness of the structure of direct-write mode printing formation is better, does not need to carry out the surface grinding processing to the structure of printing formation at every turn for the technology is comparatively simple. In addition, as the surface evenness of the structure formed by direct-writing printing is good, the structure can be printed with higher precision, the coaxiality of the manufactured coaxial line is higher, and the manufactured coaxial line has lower loss and higher isolation when transmitting signals. In addition, because the direct-writing printing mode can print the structure with higher precision, the coaxial line with higher precision (for example, the processing precision requirement is nano-scale) can be processed and formed, the coaxial line with smaller size can be processed and formed conveniently, and the miniaturized integration of the radio frequency circuit system with the coaxial line is facilitated. Furthermore, the material used for printing the conductor does not need to be a material that can be melted by laser light, and there is little limitation on the material used for printing the conductor.
In addition, the first insulating structure for supporting the inner conductor does not need to be subjected to exposure, development and the like, the process is simple, and the limitation on the material forming the first insulating structure is small. In addition, the periphery of the inner conductor is covered by the first insulating sleeve, the dielectric constants of the mediums at all positions outside the inner conductor are less in difference, and the manufactured coaxial line is smaller in loss and higher in isolation degree when transmitting signals. In addition, each side of the inner conductor can be fixed with the outer conductor through the first insulating sleeve, the fixing between the inner conductor and the outer conductor is stable, and the problem that the signal transmission is influenced by the displacement between the inner conductor and the outer conductor is not easy to occur.
Drawings
For a clearer description of the present application or of the prior art, the drawings that are used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a method for manufacturing a coaxial line according to an embodiment of the present application;
fig. 2 is a process diagram of forming a coaxial line according to a method for manufacturing a coaxial line according to an embodiment of the present application;
fig. 3 is a schematic diagram of a preparation method of another coaxial line according to an embodiment of the present application;
fig. 4 is a schematic diagram of a coaxial line preparation device according to an embodiment of the present application;
fig. 5 is a schematic diagram of another coaxial line manufacturing apparatus according to an embodiment of the present application.
Reference numerals illustrate:
10. an outer conductor; 20. a load bearing structure; 30. an inner conductor; 41. a first filling chamber; 42. a second filling chamber; 43. a third filling chamber; 44. a fourth filling chamber; 50. a first insulating sleeve;
100. an outer conductor bottom wall;
200 first outer conductor sidewalls; 210. a left side wall of the first outer conductor; 220. a first outer conductor right side wall;
300. an upper outer conductor structure;
310. a second outer conductor sidewall; 311. a second outer conductor left side wall; 312. a second outer conductor right side wall;
320. a third layer outer conductor sidewall; 321. the left side wall of the third layer outer conductor; 322. a third layer outer conductor right side wall;
330. an outer conductor top wall;
400. a first insulating structure;
500. an insulating cover structure;
510. a second insulating structure; 520. a third insulating structure; 530. a fourth insulating structure;
610. a first printing module; 620. a second printing module; 630. a third printing module;
710. a processor; 720. a memory; 730. a communication interface.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the present application will be clearly and completely described below with reference to the drawings in the present application, and it is apparent that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
As described in the background art, in the related art, a method of manufacturing a coaxial line using a 3D printing technology, a conductor structure is often printed by melting laid metal powder using a laser, and a supporting structure for supporting an inner conductor is formed by filling a photoresist and exposing and developing the photoresist.
However, the surface flatness of the structure formed by printing by melting the laid metal powder with laser is low, and the surface grinding treatment is required after each printing, so that the process is complex. In addition, as the surface flatness of the conductor structure is lower, the accuracy of the printed conductor structure is poorer, the coaxiality of the coaxial line is lower, and the manufactured coaxial line has larger loss and lower isolation when transmitting signals. In addition, since the accuracy of the printed conductor structure is poor, it is difficult to process the coaxial line with a small size, which has a high accuracy requirement (for example, the processing accuracy requirement is nano-scale). Furthermore, the metal powder laid needs to be melted by the laser, and there is also a large limit to the material from which the conductors are printed.
In addition, the supporting layer for supporting the inner conductor is formed by filling photoresist, exposing and developing the photoresist, the process is complex, and the material for forming the supporting layer is limited greatly. In addition, between the inner conductor and the outer conductor, except for the supporting layer below the inner conductor, the rest part is air, and the difference between the dielectric constants of the air and the supporting layer is large, that is, the difference between the dielectric constants of the side, on which the supporting layer is arranged, of the inner conductor and the dielectric constants of the outside medium on each side, on which the supporting layer is not arranged, is large, so that the loss of the manufactured coaxial line is large and the isolation degree is low when the coaxial line transmits signals. In addition, because the inner conductor is connected with the outer conductor through the supporting layer on only one side, the fixing stability between the inner conductor and the outer conductor is poor, and the problem that the signal transmission is influenced by the displacement between the inner conductor and the outer conductor is easy to occur.
Based on this, the embodiment of the application provides a method for preparing a coaxial line, which adopts a direct writing printing mode to prepare at least part of an outer conductor, an inner conductor and an insulating sleeve sleeved outside the inner conductor, so that the process of the method for preparing the coaxial line is simpler, and the manufactured coaxial line has smaller loss and higher isolation degree when transmitting signals.
Fig. 1 is a schematic diagram of a method for manufacturing a coaxial line according to an embodiment of the present application, and fig. 2 is a process diagram of forming the coaxial line according to the method for manufacturing the coaxial line according to the embodiment of the present application.
As shown in fig. 1 and fig. 2, the method for manufacturing the coaxial line provided in the embodiment of the present application may be performed by a manufacturing device of the coaxial line, and the method includes:
s200: the first insulation structure 400 is printed in the first filling cavity 41 formed between the outer conductor bottom wall 100 and the first outer conductor side wall 200 by means of direct writing printing, wherein the first outer conductor side wall 200 is arranged on the upper surface of the outer conductor bottom wall 100, and the first insulation structure 400 fills up the first filling cavity 41.
The coaxial line preparation device may comprise a 3D printer, and the printing step in the method may be performed by the 3D printer.
The outer conductor bottom wall 100 and the first outer conductor side wall 200 may be a prefabricated structural member, which may be printed by direct-writing printing, or may be formed by other methods (for example, photolithography, laser melting printing, mounting of the outer conductor bottom wall 100 and the first outer conductor side wall 200, etc.).
The first outer conductor side wall 200 includes a first outer conductor left side wall 210 and a first outer conductor right side wall 220 having the same height and thickness, and a first filling cavity 41 is formed between the first outer conductor left side wall 210, the outer conductor bottom wall 100, and the first outer conductor right side wall 220.
The outer conductor bottom wall 100 and the first outer conductor side wall 200 may be formed of metal, for example, the outer conductor bottom wall 100 and the first outer conductor side wall 200 may be formed of one or more of the following materials: silver, copper, gold, palladium, platinum, nickel, aluminum, iron, beryllium, zinc, and the like.
The first insulating structure 400 may be formed of one or more of the following materials: epoxy, silicone, photosensitive resin, ceramic, polyimide, and the like.
After the first insulating structure 400 fills up the first filling cavity 41, the upper end surface of the first outer conductor left side wall 210, the upper surface of the first insulating structure 400, and the upper end surface of the first outer conductor right side wall 220 are coplanar.
S300: the inner conductor 30 is printed on the upper surface of the first insulating structure 400 by direct write printing.
The inner conductor 30 may be formed of metal, for example, the inner conductor 30 may be formed of one or more of the following materials: silver, copper, gold, palladium, platinum, nickel, aluminum, iron, beryllium, zinc, and the like.
The material forming the inner conductor 30 may be the same as the material forming the outer conductor bottom wall 100 and the first outer conductor side wall 200, or the material forming the inner conductor 30 may be different from the material forming the outer conductor bottom wall 100 and the first outer conductor side wall 200.
The first insulating structure 400 and the inner conductor 30 may be printed using different printheads of a 3D printer.
S400: an insulation upper cover structure 500 is printed on the surface of the first insulation structure 400 and the surface of the inner conductor 30 by a direct writing printing mode, and an upper outer conductor structure 300 is printed on the upper end face of the first outer conductor side wall 200 and the surface of the insulation upper cover structure 500, wherein the first insulation structure 400 and the insulation upper cover structure 500 are enclosed to form a first insulation sleeve 50 arranged outside the inner conductor 30, and the outer conductor bottom wall 100, the first outer conductor side wall 200 and the upper outer conductor structure 300 are enclosed to form an outer conductor 10 sleeved outside the first insulation sleeve 50.
The cover-over-insulator structure 500 may be formed from one or more of the following materials: epoxy, silicone, photosensitive resin, ceramic, polyimide, and the like.
The first insulating structure 400 and the insulating cover-over-insulator structure 500 may be formed of the same material or may be formed of different materials having small differences in dielectric constants.
The upper outer conductor structure 300 may be formed of metal, for example, the upper outer conductor structure 300 may be formed of one or more of the following materials: silver, copper, gold, palladium, platinum, nickel, aluminum, iron, beryllium, zinc, and the like.
The first insulating structure 400 and the insulating cover over structure 500 may be printed using the same or different printheads of the 3D printer.
The upper outer conductor structure 300 and the inner conductor 30 may be printed using the same or different printheads of a 3D printer.
The inner surface of the first insulating sheath 50 is bonded to the surface of the inner conductor 30 so that the first insulating sheath 50 is fixed to the inner conductor 30.
The inner surface of the outer conductor 10 is fitted with the outer surface of the first insulation sleeve 50 to fix the outer conductor 10 with the first insulation sleeve 50.
In this way, the inner conductor 30, the upper outer conductor structure 300, the first insulation structure 400 and the insulation upper covering structure 500 are all formed by printing in a direct-writing printing mode, the surface flatness of the structure formed by printing in the direct-writing printing mode is good, and surface grinding treatment is not required for the structure formed by printing every time, so that the process is simpler. In addition, as the surface evenness of the structure formed by direct-writing printing is good, the structure can be printed with higher precision, the coaxiality of the manufactured coaxial line is higher, and the manufactured coaxial line has lower loss and higher isolation when transmitting signals. In addition, because the direct-writing printing mode can print the structure with higher precision, the coaxial line with higher precision (for example, the processing precision requirement is nano-scale) can be processed and formed, the coaxial line with smaller size can be processed and formed conveniently, and the miniaturized integration of the radio frequency circuit system with the coaxial line is facilitated. Furthermore, the material used for printing the conductor does not need to be a material that can be melted by laser light, and there is little limitation on the material used for printing the conductor.
In addition, the first insulating structure 400 for supporting the inner conductor 30 does not require exposure, development, etc., and the process is simple and the limitation of the material forming the first insulating structure 400 is small. In addition, the periphery of the inner conductor 30 is covered by the first insulating sleeve 50, so that the difference of dielectric constants of the mediums at all positions outside the inner conductor 30 is small, and the manufactured coaxial line has small loss and high isolation when transmitting signals. In addition, each side of the inner conductor 30 can be fixed with the outer conductor 10 through the first insulating sleeve 50, so that the fixation between the inner conductor 30 and the outer conductor 10 is stable, and the problem that the signal transmission is affected by the displacement between the inner conductor 30 and the outer conductor 10 is not easy to occur.
It should be noted that the shapes of the outer conductor bottom wall 100 and the first outer conductor side wall 200, and the shapes of the printed inner conductor 30 and the upper outer conductor structure 300 may be manufactured according to the shape of the desired coaxial line, so that the coaxial line having various shapes such as a circular shape, an elliptical shape, a square shape, a triangular shape, a pentagonal shape, a hexagonal shape, etc. may be supported.
Fig. 3 is a schematic diagram of a preparation method of another coaxial line according to an embodiment of the present application.
As shown in fig. 3, and referring to fig. 2, in some possible embodiments, the method further comprises:
S100: the outer conductor bottom wall 100 and the first outer conductor side wall 200 provided on the upper surface of the outer conductor bottom wall 100 are printed on the surface of the carrier structure 20 by direct writing printing.
The carrier structure 20 may be a substrate. The substrate may be a circuit board for carrying radio frequency circuitry, on which coaxial lines may be made directly. The substrate may also be a releasable substrate for the preparation of the coaxial lines, from which the coaxial lines may be released after the coaxial lines have been prepared on the substrate.
The carrier structure 20 may also be an insulating structure of a sliced layer below the bottom wall 100 of the outer conductor for forming a second insulating sleeve around the outer side of the outer conductor 10.
The outer conductor bottom wall 100, the first outer conductor side wall 200 and the upper outer conductor structure 300 may be printed using the same printhead of a 3D printer.
In this way, the process of forming the outer conductor bottom wall 100 and the first outer conductor side wall 200 is relatively simple. In addition, the formed outer conductor bottom wall 100 and the first outer conductor side wall 200 have better surface flatness and higher structural precision, which is beneficial to making the manufactured coaxial line have lower loss and higher isolation when transmitting signals, and also beneficial to manufacturing the coaxial line with higher requirement on processing precision and smaller size.
In some possible embodiments, step S100 includes:
s110: depositing a second conductive material ink at a second predetermined location to form a second ink structure, wherein the second predetermined location is located on the upper surface of the carrier structure 20.
The second conductive material ink may be a metallic material ink, and the second conductive material ink may include one or more of the following materials: silver, copper, gold, palladium, platinum, nickel, aluminum, iron, beryllium, zinc, and the like.
S120: and depositing second conductive material ink at a third preset position to form a third ink structure, wherein the third preset position is positioned on the upper surface of the second ink structure.
The second conductive material ink may be a better conformal ink, so that the second ink structure and the third ink structure can better maintain the morphology.
S130: the second ink structure and the third ink structure are processed in at least one of an in-line curing and an in-line sintering such that the second ink structure and the third ink structure form an outer conductor bottom wall 100 and a first outer conductor side wall 200 provided on an upper surface of the outer conductor bottom wall 100.
The preparing means of the coaxial line may further include at least one of an in-line solidifying device, by which the in-line solidifying step may be performed, and an in-line sintering device, by which the in-line sintering step may be performed.
Thus, the second ink structure and the third ink structure are formed in one step, which makes the process of preparing the outer conductor bottom wall 100 and the first outer conductor side wall 200 simpler. In addition, the second ink structure and the third ink structure are molded by at least one of in-line curing and in-line sintering, so that the influence on the processing precision caused by the movement of the second ink structure and the third ink structure is less likely to occur, and the precision of the formed outer conductor bottom wall 100 and the first outer conductor side wall 200 is higher. In addition, the execution parts of the on-line curing equipment and the on-line sintering equipment are easy to move, and the processing efficiency is high.
In some possible embodiments, step S200 includes:
s210: the insulating material ink is filled into the first filling chamber 41, and the volume of the insulating material ink filled into the first filling chamber 41 is multiplied by the curing shrinkage rate of the insulating material ink, so that the volume of the space in the first filling chamber 41 is equal to the volume.
The insulating material ink may include one or more of the following materials: epoxy, silicone, photosensitive resin, ceramic, polyimide, and the like.
The insulating material ink may be an ink having a good shape retention property so that the insulating material ink filled in the first filling chamber 41 can maintain a good shape before curing.
The insulating material ink filled in the first filling chamber 41 may partially protrude from the opening of the first filling chamber 41 before curing to form a bulge-like structure, and the insulating material ink may not flow under the action of surface tension.
S220: the insulating material ink filled in the first filling chamber 41 is cured in-line to form the first insulating structure 400.
The insulating material ink filled in the first filling chamber 41 may be cured in-line by ultraviolet curing or white light heating, etc.
The insulating material ink filled in the first filling chamber 41 is shrunk after curing so that the upper surface of the formed first insulating structure 400 can be coplanar with the upper end surfaces of the first outer conductor left side wall 210 and the first outer conductor right side wall 220.
In this way, the first insulating structure 400 is formed to fill up the first filling cavity 41, which is advantageous for manufacturing a coaxial line with good coaxiality between the inner conductor 30 and the outer conductor 10.
In some possible embodiments, step S300 includes:
s310: the first conductive material ink is deposited at a first predetermined location to form a first ink structure, wherein the first predetermined location is located on the upper surface of the first insulating structure 400.
The first conductive material ink may be a metallic material ink, and the first conductive material ink may include one or more of the following materials: silver, copper, gold, palladium, platinum, nickel, aluminum, iron, beryllium, zinc, and the like.
The first conductive material ink may be a better conformal ink, so that the first ink structure can better maintain the morphology.
The first conductive material ink and the second conductive material ink may be the same ink or different inks.
S320: the first ink structure is treated in at least one of an in-line curing and an in-line sintering to form the first ink structure into the inner conductor 30.
In this way, the first ink structure is molded by at least one of in-line curing and in-line sintering, and the influence on the processing accuracy due to the movement of the first ink structure is less likely to occur, and the accuracy of the formed inner conductor 30 is high. In addition, the execution parts of the on-line curing equipment and the on-line sintering equipment are easy to move, and the processing efficiency is high.
In some possible embodiments, step S400 includes:
s410: the second outer conductor side wall 310 is formed by printing on the upper end surface of the first outer conductor side wall 200 in a direct writing printing manner, wherein the heights of the second outer conductor side wall 310 and the inner conductor 30 are the same, and a second filling cavity 42 and a third filling cavity 43 are respectively formed between the second outer conductor side wall 310 and two sides of the inner conductor 30.
The second outer conductor sidewall 310 may be printed from a second conductive material ink. Specifically, the second conductive material ink may be deposited on the upper end surface of the first outer conductor sidewall 200 to form a fourth ink structure, which may be processed to form the second outer conductor sidewall 310 while being processed to form the inner conductor 30 in at least one of an in-line curing and an in-line sintering. Thus, the precision of the formed second outer conductor sidewall 310 can be higher, and the manufacturing process of the coaxial line can be simpler.
The second outer conductor side wall 310 includes a second outer conductor left side wall 311 and a second outer conductor right side wall 312 having the same height and thickness, the second outer conductor left side wall 311 is formed on the upper end surface of the first outer conductor left side wall 210, the second outer conductor right side wall 312 is formed on the upper end surface of the first outer conductor right side wall 220, and the upper end surface of the second outer conductor left side wall 311 and the upper end surface of the second outer conductor right side wall 312 are coplanar.
A second filling cavity 42 is formed between the second outer conductor left side wall 311 and the left side surface of the inner conductor 30, a third filling cavity 43 is formed between the second outer conductor right side wall 312 and the right side surface of the inner conductor 30, and the distance between the second outer conductor left side wall 311 and the left side surface of the inner conductor 30 is equal to the distance between the second outer conductor right side wall 312 and the right side surface of the inner conductor 30.
S420: the second insulating structure 510 is printed in the second filling cavity 42 and the third insulating structure 520 is printed in the third filling cavity 43 by a direct writing printing mode, wherein the second insulating structure 510 fills up the second filling cavity 42, and the third insulating structure 520 fills up the third filling cavity 43.
The second insulating structure 510 and the third insulating structure 520 may be formed by first filling the insulating material ink into the second filling chamber 42 and the third filling chamber 43, multiplying the filling volume of the insulating material ink filled into the second filling chamber 42 by the volume of the space in the second filling chamber 42, and multiplying the filling volume of the insulating material ink filled into the third filling chamber 43 by the volume of the space in the third filling chamber 43, and then performing on-line curing of the insulating material ink filled into the second filling chamber 42 and the third filling chamber 43. In this way, the second filling cavity 42 is conveniently filled with the formed second insulating structure 510 and the third filling cavity 43 is conveniently filled with the formed third insulating structure 520, so that a coaxial line with better coaxiality between the inner conductor 30 and the outer conductor 10 can be manufactured.
The insulating material ink filled in the second filling chamber 42 and the third filling chamber 43 may be cured in-line by ultraviolet curing or white light heating, etc.
The insulating material ink filled in the second filling chamber 42 and the third filling chamber 43 is shrunk after being cured, so that the upper surfaces of the formed second insulating structure 510 and the third insulating structure 520 can be coplanar with the upper end surfaces of the second outer conductor left side wall 311 and the second outer conductor right side wall 312.
The second insulating structure 510 is formed to have the same thickness and height as the third insulating structure 520.
S430: and printing the upper end surface of the second outer conductor side wall 310 to form a third outer conductor side wall 320 by a direct writing printing mode, wherein a fourth filling cavity 44 is formed between the third outer conductor side wall 320 and the second insulating structure 510, the inner conductor 30 and the third insulating structure 520.
The third layer outer conductor sidewall 320 may be printed from a second conductive material ink. Specifically, a second conductive material ink may be deposited on the upper end surface of the second layer outer conductor sidewall 310 to form a fifth ink structure, which may be processed in at least one of an in-line curing and an in-line sintering to form a third layer outer conductor sidewall 320. Thus, the precision of the formed third layer outer conductor sidewall 320 can be higher, and the manufacturing process of the coaxial line can be simpler.
The third-layer outer-conductor side wall 320 includes a third-layer outer-conductor left side wall 321 and a third-layer outer-conductor right side wall 322 which have the same height and thickness, the third-layer outer-conductor left side wall 321 is formed on the upper end face of the second-layer outer-conductor left side wall 311, the third-layer outer-conductor right side wall 322 is formed on the upper end face of the second-layer outer-conductor right side wall 312, and the upper end face of the third-layer outer-conductor left side wall 321 and the upper end face of the third-layer outer-conductor right side wall 322 are coplanar.
A fourth filling cavity 44 is formed between the third layer outer conductor left side wall 321, the upper surface of the second insulating structure 510, the upper surface of the inner conductor 30, the upper surface of the third insulating structure 520 and the third layer outer conductor right side wall 322.
S440: a fourth insulating structure 530 is printed in the fourth filling cavity 44 by direct writing, wherein the fourth insulating structure 530 fills up the fourth filling cavity 44.
The fourth insulating structure 530 may be formed by first filling the insulating material ink into the fourth filling chamber 44, multiplying the filling volume of the insulating material ink filled into the fourth filling chamber 44 by the volume of the space in the fourth filling chamber 44, which has a curing shrinkage rate equal to that of the insulating material ink, and then performing on-line curing of the insulating material ink filled into the fourth filling chamber 44. In this way, the fourth insulating structure 530 is formed to fill up the fourth filling cavity 44, which is convenient for manufacturing a coaxial line with good coaxiality between the inner conductor 30 and the outer conductor 10.
The insulating material ink filled in the fourth filling chamber 44 may be cured in-line by ultraviolet curing or white light heating.
The insulating material ink filled in the fourth filling cavity 44 is shrunk after curing, so that the upper surface of the formed fourth insulating structure 530 is coplanar with the upper end surfaces of the left side wall 321 and the right side wall 322 of the third layer outer conductor.
The fourth insulating structure 530 is formed to have the same thickness and height as the first insulating structure 400.
S450: the outer conductor top wall 400 is formed by printing on the upper end surface of the third layer outer conductor side wall 320 and the surface of the fourth insulating structure 530 by direct writing printing.
The outer conductor top wall 400 may be printed from a second conductive material ink. Specifically, a second conductive material ink may be deposited on the upper end surface of the third layer outer conductor sidewall 320 and the upper surface of the fourth insulating structure 530 to form a sixth ink structure, which may be processed in at least one of an in-line curing and an in-line sintering to form the outer conductor top wall 400. Thus, the precision of the formed outer conductor top wall 400 can be made higher, and the manufacturing process of the coaxial line can be made simpler.
The first insulating structure 400, the second insulating structure 510, the third insulating structure 520, and the fourth insulating structure 530 enclose to form a first insulating sleeve 50, and the outer conductor bottom wall 100, the first outer conductor side wall 200, the second outer conductor side wall 310, the third outer conductor side wall 320, and the outer conductor top wall 400 enclose to form an outer conductor 10.
The outer conductor top wall 400 is the same as the outer conductor bottom wall 100 in both height and thickness.
In this way, the upper outer conductor structure 300 and the insulation upper cover structure 500 with higher precision are conveniently formed, so that the formed coaxial line has smaller loss and higher isolation when transmitting signals. In addition, the process for preparing the coaxial line is simpler.
In some possible embodiments, the first insulating structure 400 and the insulating cover over structure 500 are printed using the same insulating material ink. That is, the first, second, third and fourth insulating structures 400, 510, 520 and 530 may be formed using the same insulating material ink.
In this way, however, the difference in dielectric constant of the medium is small around the outer side of the inner conductor 30 of the coaxial line, so that the loss of the coaxial line is small and the isolation is high. In addition, the first insulating structure 400, the second insulating structure 510, the third insulating structure 520 and the fourth insulating structure 530 may be formed by printing using the same print head, so that the structure of the coaxial line manufacturing apparatus may be simpler. In addition, the variety of printing inks required for preparing coaxial lines is also small.
In some possible embodiments, the first conductive material ink and the second conductive material ink are the same ink.
In this way, the parts of the outer conductor 10 and the inner conductor 30 can be printed by the same printing head, so that the structure of the coaxial line preparation device is simpler. In addition, the variety of printing inks required for preparing coaxial lines is also small.
In some possible embodiments, the spacing between the inner conductor 30 and the second outer conductor sidewall 310 is equal to the spacing between the inner conductor 30 and the outer conductor bottom wall 100. That is, the interval between the inner conductor 30 and the second outer conductor left side wall 311, the interval between the inner conductor 30 and the second outer conductor right side wall 312, the interval between the inner conductor 30 and the outer conductor bottom wall 100, and the interval between the inner conductor 30 and the outer conductor top wall 400 are all equal. Alternatively, the thicknesses of the first insulating structure 400, the second insulating structure 510, the third insulating structure 520, and the fourth insulating structure 530 are all the same.
Thus, the thickness of the first insulating sleeve 50 is the same throughout the coaxial line, so that the loss of the coaxial line is small and the isolation is high.
Illustratively, the thickness is equal throughout the outer conductor 10. That is, the outer conductor top wall 400, the outer conductor bottom wall 100, the first outer conductor left side wall 210, the first outer conductor right side wall 220, the second outer conductor left side wall 311, the second outer conductor right side wall 312, the third outer conductor left side wall 321, and the third outer conductor right side wall 322 have the same thickness. Therefore, the manufactured coaxial line has smaller loss and higher isolation degree when transmitting signals.
When the coaxial line to be prepared includes an insulating jacket and a conductor layer which are sleeved outside the outer conductor 10, a direct writing printing method may be adopted, and printing is performed layer by layer in the order from the lower slicing layer to the upper slicing layer. Before printing the outer conductor bottom wall 100, printing forms a conductor structure and an insulation structure located under the outer conductor bottom wall 100, in the process of printing forms the outer conductor 10, the inner conductor 30 and the first insulation cover 50, printing forms other conductor structures and insulation structures in the same layer as the outer conductor 10, the inner conductor 30 and the first insulation cover 50, and after printing forms the outer conductor top wall 400, printing forms a conductor structure and an insulation structure located above the outer conductor top wall 400, so that a coaxial line including 3 layers and more of conductor layers can be prepared.
The embodiment of the application also provides a coaxial line which is manufactured by adopting the manufacturing method in any embodiment.
Fig. 4 is a schematic diagram of a coaxial line preparation device according to an embodiment of the present application.
As shown in fig. 4, the embodiment of the present application further provides a coaxial line preparation device, where the preparation device includes each functional module for implementing the method in any of the foregoing embodiments.
Specifically, the coaxial line preparing apparatus includes a first printing module 610, a second printing module 620, and a third printing module 630.
The first printing module 610 is configured to print in a first filling cavity 41 formed between the outer conductor bottom wall 100 and the first outer conductor side wall 200 by direct writing printing to form a first insulating structure 400, where the first outer conductor side wall 200 is disposed on the upper surface of the outer conductor bottom wall 100, and the first insulating structure 400 fills up the first filling cavity 41.
The second printing module 620 is used to print the inner conductor 30 on the upper surface of the first insulation structure 400 by direct write printing.
The third printing module 630 is configured to print an insulation upper covering structure 500 on the surface of the first insulation structure 400 and the surface of the inner conductor 30 by direct-writing printing, and print an upper outer conductor structure 300 on the upper end surface of the first outer conductor sidewall 200 and the surface of the insulation upper covering structure 500, where the first insulation structure 400 and the insulation upper covering structure 500 enclose a first insulation sleeve 50 that is disposed outside the inner conductor 30, and the outer conductor bottom wall 100, the first outer conductor sidewall 200, and the upper outer conductor structure 300 enclose an outer conductor 10 that is disposed outside the first insulation sleeve 50.
In some examples, the coaxial line preparation apparatus further comprises a fourth printing module.
The fourth printing module is used for printing on the surface of the bearing structure 20 by direct writing to form an outer conductor bottom wall 100 and a first outer conductor side wall 200 arranged on the upper surface of the outer conductor bottom wall 100.
In some examples, the fourth printing module includes a first deposition unit, a second deposition unit, and a first patterning unit.
The first depositing unit is configured to deposit a second conductive material ink at a second predetermined position to form a second ink structure, where the second predetermined position is located on the upper surface of the carrier structure 20.
The second depositing unit is used for depositing the second conductive material ink at a third preset position to form a third ink structure, wherein the third preset position is positioned on the upper surface of the second ink structure.
The first forming unit is configured to process the second ink structure and the third ink structure by at least one of in-line curing and in-line sintering, so that the second ink structure and the third ink structure form an outer conductor bottom wall 100 and a first outer conductor side wall 200 disposed on an upper surface of the outer conductor bottom wall 100.
In some examples, the first printing module 610 includes a filling unit and a curing unit.
The filling means is for filling the insulating material ink into the first filling chamber 41, and the filling volume of the insulating material ink filled into the first filling chamber 41 is multiplied by the curing shrinkage rate of the insulating material ink to be equal to the volume of the space in the first filling chamber 41.
The curing unit is used for in-line curing the insulating material ink filled in the first filling cavity 41 to form the first insulating structure 400.
In some examples, the second printing module 620 includes a third deposition unit and a second sizing unit.
The third deposition unit is configured to deposit the first conductive material ink at a first preset position to form a first ink structure, where the first preset position is located on the upper surface of the first insulation structure 400.
The second shaping unit is configured to process the first ink structure in at least one of an in-line curing and an in-line sintering to form the first ink structure into the inner conductor 30.
In some examples, the third printing module 630 includes a first printing unit, a second printing unit, a third printing unit, a fourth printing unit, and a fifth printing unit.
The first printing unit is configured to print on the upper end surface of the first outer conductor sidewall 200 by direct writing to form a second outer conductor sidewall 310, where the heights of the second outer conductor sidewall 310 and the inner conductor 30 are the same, and a second filling cavity 42 and a third filling cavity 43 are formed between the second outer conductor sidewall 310 and two sides of the inner conductor 30, respectively.
The second printing unit is configured to print a second insulating structure 510 in the second filling cavity 42 and print a third insulating structure 520 in the third filling cavity 43 by means of direct writing, where the second insulating structure 510 fills the second filling cavity 42 and the third insulating structure 520 fills the third filling cavity 43.
The third printing unit is configured to print on the upper end surface of the second outer conductor sidewall 310 by direct-writing printing to form a third outer conductor sidewall 320, where a fourth filling cavity 44 is formed between the third outer conductor sidewall 320 and the second insulating structure 510, the inner conductor 30, and the third insulating structure 520.
The fourth printing unit is configured to print in the fourth filling cavity 44 by means of direct writing to form a fourth insulating structure 530, where the fourth insulating structure 530 fills up the fourth filling cavity 44.
The fifth printing unit is used for forming the outer conductor top wall 400 by printing on the upper end surface of the third layer outer conductor side wall 320 and the surface of the fourth insulating structure 530 in a direct writing printing manner.
The first insulating structure 400, the second insulating structure 510, the third insulating structure 520, and the fourth insulating structure 530 enclose to form a first insulating sleeve 50, and the outer conductor bottom wall 100, the first outer conductor side wall 200, the second outer conductor side wall 310, the third outer conductor side wall 320, and the outer conductor top wall 400 enclose to form an outer conductor 10.
Fig. 5 is a schematic diagram of another coaxial line manufacturing apparatus according to an embodiment of the present application.
As shown in fig. 5, the coaxial line preparation device is used to implement the method steps in any of the method embodiments described above. The coaxial line preparation device of the present embodiment may include: memory 720, processor 710, and communication interface 730.
Memory 720 is used to store computer instructions. The Memory 720 may include a high-speed random access Memory (Random Access Memory, RAM), and may further include a Non-Volatile Memory (NVM), such as at least one magnetic disk Memory, and may also be a U-disk, a removable hard disk, a read-only Memory, a magnetic disk, or an optical disk.
Processor 710 is configured to execute computer instructions stored in memory 720 to implement the method steps of any of the method embodiments described above. Reference may be made in particular to the relevant description of the embodiments of the method described above. The processor 710 may be a central processing unit (Central Processing Unit, CPU), but may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of a method disclosed in connection with the present invention may be embodied directly in hardware processor 710 for execution, or in a combination of hardware and software modules in processor 710.
Alternatively, memory 720 may be separate or integrated with processor 710.
Communication interface 730 may be coupled to processor 710. Processor 710 may control communication interface 730 to perform the functions of receiving and transmitting signals.
The present application also provides a computer readable storage medium, in which computer instructions are stored, from which computer instructions can be read and executed by at least one processor of the coaxial line preparation device, which computer instructions, when executed by at least one processor of the coaxial line preparation device, implement the method steps in any of the method embodiments described above.
The present application also provides a computer program product comprising computer instructions that may be stored in a computer readable storage medium. The computer instructions may be read from and executed by at least one processor of the coaxial line preparation device, which when executed by the at least one processor of the coaxial line preparation device, performs the method steps of any of the method embodiments described above.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limited thereto. Although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments may be modified or some or all of the technical features may be replaced with equivalents. Such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A method of manufacturing a coaxial line, the method comprising:
printing in a first filling cavity formed between the bottom wall of the outer conductor and the side wall of the first outer conductor in a direct writing printing mode to form a first insulating structure, wherein the side wall of the first outer conductor is arranged on the upper surface of the bottom wall of the outer conductor, and the first insulating structure fills up the first filling cavity;
printing on the upper surface of the first insulating structure by a direct-writing printing mode to form an inner conductor;
through the direct writing printing mode, an upper insulation cover structure is formed on the surface of the first insulation structure and the surface of the inner conductor, and an upper outer conductor structure is formed on the upper end face of the side wall of the first outer conductor and the surface of the upper insulation cover structure, wherein the first insulation structure and the upper insulation cover structure are enclosed to form an insulation sleeve which is arranged on the outer side of the inner conductor, and the outer conductor bottom wall, the side wall of the first outer conductor and the upper outer conductor structure are enclosed to form an outer conductor which is arranged on the outer side of the insulation sleeve.
2. The method of claim 1, wherein printing in the first fill cavity formed between the outer conductor bottom wall and the first outer conductor side wall by direct write printing forms a first insulating structure, comprising:
filling insulating material ink into the first filling cavity, and multiplying the filling volume of the insulating material ink filled into the first filling cavity by the curing shrinkage rate of the insulating material ink to be equal to the volume of a space in the first filling cavity;
and carrying out on-line curing on the insulating material ink filled in the first filling cavity to form the first insulating structure.
3. The method of claim 1, wherein printing the inner conductor on the upper surface of the first insulating structure by direct write printing comprises:
depositing first conductive material ink at a first preset position to form a first ink structure, wherein the first preset position is positioned on the upper surface of the first insulating structure;
the first ink structure is treated in at least one of an in-line curing and an in-line sintering to form the first ink structure into the inner conductor.
4. The method of claim 1, wherein the first insulating structure and the cover-over-insulator structure are printed using the same insulating material ink.
5. The method of any one of claims 1-4, wherein printing by direct write printing a cover-over-insulator structure on a surface of the first insulating structure and a surface of the inner conductor and printing a cover-over-insulator structure on an upper end surface of the first outer conductor sidewall and a surface of the cover-over-insulator structure comprises:
printing on the upper end surface of the first outer conductor side wall in a direct writing printing mode to form a second outer conductor side wall, wherein the heights of the second outer conductor side wall and the inner conductor are the same, and a second filling cavity and a third filling cavity are respectively formed between the second outer conductor side wall and two sides of the inner conductor;
printing in the second filling cavity to form a second insulating structure and printing in the third filling cavity to form a third insulating structure in a direct writing printing mode, wherein the second insulating structure fills up the second filling cavity, and the third insulating structure fills up the third filling cavity;
Printing the upper end surface of the second layer outer conductor side wall to form a third layer outer conductor side wall in a direct writing printing mode, wherein a fourth filling cavity is formed among the third layer outer conductor side wall, the second insulating structure, the inner conductor and the third insulating structure;
printing in the fourth filling cavity in a direct writing printing mode to form a fourth insulating structure, wherein the fourth insulating structure fills up the fourth filling cavity;
printing on the upper end surface of the side wall of the third layer of outer conductor and the surface of the fourth insulating structure in a direct writing printing mode to form the top wall of the outer conductor;
the first insulating structure, the second insulating structure, the third insulating structure and the fourth insulating structure enclose to form the insulating sleeve, and the outer conductor bottom wall, the first outer conductor side wall, the second outer conductor side wall, the third outer conductor side wall and the outer conductor top wall enclose to form the outer conductor.
6. The method of claim 5, wherein a spacing between the inner conductor and the second outer conductor sidewall is equal to a spacing between the inner conductor and the outer conductor bottom wall.
7. The method according to any one of claims 1-4, further comprising:
and printing on the surface of the bearing structure in a direct-writing printing mode to form the outer conductor bottom wall and the first outer conductor side wall arranged on the upper surface of the outer conductor bottom wall.
8. The method of claim 7, wherein printing the outer conductor bottom wall and the first outer conductor side wall on the upper surface of the outer conductor bottom wall on the surface of the carrier structure by direct write printing comprises:
depositing a second conductive material ink at a second preset position to form a second ink structure, wherein the second preset position is positioned on the upper surface of the bearing structure;
depositing the second conductive material ink at a third preset position to form a third ink structure, wherein the third preset position is positioned on the upper surface of the second ink structure;
and processing the second ink structure and the third ink structure by adopting at least one of on-line solidification and on-line sintering, so that the second ink structure and the third ink structure form the outer conductor bottom wall and the first outer conductor side wall arranged on the upper surface of the outer conductor bottom wall.
9. A coaxial line manufacturing apparatus, comprising: a processor, and a memory communicatively coupled to the processor;
the memory stores computer-executable instructions;
the processor executes computer-executable instructions stored in the memory to implement the method of any one of claims 1-8.
10. Coaxial line, characterized in that it is manufactured by a method according to any of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410021882.3A CN117525808A (en) | 2024-01-08 | 2024-01-08 | Coaxial line and preparation method and device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410021882.3A CN117525808A (en) | 2024-01-08 | 2024-01-08 | Coaxial line and preparation method and device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117525808A true CN117525808A (en) | 2024-02-06 |
Family
ID=89755418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410021882.3A Pending CN117525808A (en) | 2024-01-08 | 2024-01-08 | Coaxial line and preparation method and device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117525808A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111509349A (en) * | 2020-05-20 | 2020-08-07 | 上海航天电子通讯设备研究所 | Micro-coaxial transmission line, preparation method thereof and metal 3D printing device |
| EP3768449A1 (en) * | 2018-03-19 | 2021-01-27 | Digital Alloys Incorporated | Apparatuses, methods and systems for printing three-dimensional objects |
| CN113334767A (en) * | 2021-06-16 | 2021-09-03 | 上海联泰科技股份有限公司 | 3D printing method, device, data processing method, system and storage medium |
| WO2023006076A1 (en) * | 2021-07-30 | 2023-02-02 | 长春捷翼汽车零部件有限公司 | Method for manufacturing wire harness, and wire harness |
| CN116111309A (en) * | 2023-02-20 | 2023-05-12 | 中国电子科技集团公司第三十八研究所 | Wafer-level preparation method of micro coaxial power divider structure |
| CN116811256A (en) * | 2023-06-30 | 2023-09-29 | 芯体素(杭州)科技发展有限公司 | Coaxial probe preparation method and 3D printing equipment |
-
2024
- 2024-01-08 CN CN202410021882.3A patent/CN117525808A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3768449A1 (en) * | 2018-03-19 | 2021-01-27 | Digital Alloys Incorporated | Apparatuses, methods and systems for printing three-dimensional objects |
| CN111509349A (en) * | 2020-05-20 | 2020-08-07 | 上海航天电子通讯设备研究所 | Micro-coaxial transmission line, preparation method thereof and metal 3D printing device |
| CN113334767A (en) * | 2021-06-16 | 2021-09-03 | 上海联泰科技股份有限公司 | 3D printing method, device, data processing method, system and storage medium |
| WO2023006076A1 (en) * | 2021-07-30 | 2023-02-02 | 长春捷翼汽车零部件有限公司 | Method for manufacturing wire harness, and wire harness |
| CN116111309A (en) * | 2023-02-20 | 2023-05-12 | 中国电子科技集团公司第三十八研究所 | Wafer-level preparation method of micro coaxial power divider structure |
| CN116811256A (en) * | 2023-06-30 | 2023-09-29 | 芯体素(杭州)科技发展有限公司 | Coaxial probe preparation method and 3D printing equipment |
Non-Patent Citations (4)
| Title |
|---|
| WEN SUN等: "3D Printed Coaxial Millimeter-wave Leaky-wave Slot Antenna", 2020 13TH UK-EUROPE-CHINA WORKSHOP ON MILLIMETRE-WAVES AND TERAHERTZ TECHNOLOGIES (UCMMT), 30 December 2020 (2020-12-30) * |
| YANG GAO等: "3D-Printed Coaxial Fibers for Integrated Wearable Sensor Skin", ADVANCED MATERIALS TECHNOLOGIES, 20 August 2019 (2019-08-20) * |
| 史光华;王建;徐达;郭诚;常青松;王真;周彪;张延青;: "铜基空气微同轴工艺技术", 微纳电子技术, no. 08, 24 July 2020 (2020-07-24) * |
| 姜一帆，等: "墨水直写增材制造技术及其在含能材料领域的研究进展", 火炸药学报, 28 February 2022 (2022-02-28), pages 2 - 3 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11652264B2 (en) | Microelectronic assemblies with substrate integrated waveguide | |
| US5260170A (en) | Dielectric layered sequentially processed circuit board | |
| US11588222B2 (en) | Chip antenna module array and chip antenna module | |
| US11942334B2 (en) | Microelectronic assemblies having conductive structures with different thicknesses | |
| US11417959B2 (en) | Chip antenna module and electronic device | |
| US20220278038A1 (en) | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | |
| WO2004006331A1 (en) | Multilayer wiring circuit module and method for fabricating the same | |
| US11502037B2 (en) | Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating | |
| US11328996B2 (en) | Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating | |
| CN117525808A (en) | Coaxial line and preparation method and device thereof | |
| CN1491156A (en) | Method for producing housing of mobile communication terminal, housing and mobile communication terminal | |
| US8053175B2 (en) | Method of forming measuring targets for measuring dimensions of substrate in substrate manufacturing process | |
| JP2767312B2 (en) | Connection method between electromagnetic wave shielding layer and ground circuit in printed wiring board | |
| JPH09116247A (en) | Manufacture of capacitor including build up type printed wiring board, its printed wiring board, and mounting structure of capacitor on the board | |
| CN109661725A (en) | Tube core with embedded communication cavity | |
| KR20210136819A (en) | An interposer structure and an electronic device including the same | |
| CN104427751A (en) | Printed circuit board and manufacturing method thereof | |
| WO2017146848A1 (en) | Redistribution layer lines | |
| KR20240034750A (en) | Reduced impedance substrate | |
| US10446533B2 (en) | Package on package with integrated passive electronics method and apparatus | |
| KR100462835B1 (en) | Method of manufacturing build-up printed circuit board using metal bump | |
| JP4934101B2 (en) | Method for manufacturing printed circuit board | |
| CN103887601B (en) | Folded slot antenna structure and preparation method thereof | |
| US20240215163A1 (en) | Substrate glass core patterning for ctv improvement and layer count reduction | |
| US11792916B2 (en) | Printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |