CN117518303A - Optical element and method for manufacturing optical element - Google Patents
Optical element and method for manufacturing optical element Download PDFInfo
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- CN117518303A CN117518303A CN202310578990.6A CN202310578990A CN117518303A CN 117518303 A CN117518303 A CN 117518303A CN 202310578990 A CN202310578990 A CN 202310578990A CN 117518303 A CN117518303 A CN 117518303A
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- carrier
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- 230000003287 optical effect Effects 0.000 title claims abstract description 171
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000010410 layer Substances 0.000 claims abstract description 312
- 239000012790 adhesive layer Substances 0.000 claims abstract description 107
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims description 41
- 238000005530 etching Methods 0.000 claims description 24
- 238000011282 treatment Methods 0.000 claims description 24
- 239000000126 substance Substances 0.000 claims description 20
- 238000004140 cleaning Methods 0.000 claims description 15
- 239000002390 adhesive tape Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000001723 curing Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 238000000231 atomic layer deposition Methods 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 230000004048 modification Effects 0.000 claims description 5
- 238000012986 modification Methods 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 238000000608 laser ablation Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- 238000001029 thermal curing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 12
- 238000002791 soaking Methods 0.000 description 8
- 238000004528 spin coating Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000004049 embossing Methods 0.000 description 4
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 3
- 229910001634 calcium fluoride Inorganic materials 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 3
- XJKVPKYVPCWHFO-UHFFFAOYSA-N silicon;hydrate Chemical compound O.[Si] XJKVPKYVPCWHFO-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 235000012241 calcium silicate Nutrition 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910004762 CaSiO Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00865—Applying coatings; tinting; colouring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Ophthalmology & Optometry (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Environmental & Geological Engineering (AREA)
Abstract
An optical element and a method for manufacturing the same. The optical element comprises a light-transmitting substrate, an optical layer and an adhesive layer. The optical layer is positioned on the surface of the light-transmitting substrate. The optical layer has a first surface and a second surface opposite to each other. The first surface is provided with a plurality of diffractive optical structures. The refractive index of the optical layer is 1 to 4. The adhesive layer is sandwiched between the surface of the transparent substrate and the second surface of the optical layer. Many diffractive optical structures are formed on an optical layer made of a high refractive index material, so that an optical element having a higher diffraction angle can be obtained.
Description
Technical Field
The present disclosure relates to an optical technology. More particularly, the present disclosure relates to an optical device and a method of manufacturing the same.
Background
In the optical field, the use of optical elements with high winding angles gives optical devices with better optical performance. In the conventional method for manufacturing an optical element, an adhesive layer is formed on a transparent substrate, and then a diffractive optical structure is directly imprinted in the adhesive layer. Thus, refraction and diffraction are limited by the refractive index of the adhesive layer.
Disclosure of Invention
It is therefore an object of the present disclosure to provide an optical device and a method for manufacturing an optical device, which can form a plurality of diffractive optical structures on an optical layer made of a high refractive index material, thereby obtaining an optical device with a higher diffraction angle.
According to the above object, the present disclosure provides an optical element. The optical element comprises a light-transmitting substrate, an optical layer and an adhesive layer. The optical layer is positioned on the surface of the light-transmitting substrate. The optical layer has a first surface and a second surface opposite to each other. The first surface is provided with a plurality of diffractive optical structures. The refractive index of the optical layer is 1 to 4. The adhesive layer is sandwiched between the surface of the transparent substrate and the second surface of the optical layer.
According to one embodiment of the disclosure, the adhesive layer includes a transparent optical adhesive (optically clear adhesive, OCA).
According to one embodiment of the present disclosure, the adhesive layer includes a Pressure Sensitive Adhesive (PSA).
According to an embodiment of the disclosure, the refractive index of the adhesive layer is 1 to 4.
According to the above objects, the present disclosure further provides a method for manufacturing an optical device. In this method, a carrier plate is provided. Forming a model layer on the carrier plate. The model layer has a first surface and a second surface opposite to each other. The first surface is adjacent to the carrier plate, and the second surface is provided with a plurality of microstructures. And carrying out anti-sticking treatment on the second surface of the model layer. After the anti-sticking treatment, an optical layer is formed on the second surface of the model layer. The optical layer covers and fills the microstructures. The transparent substrate is attached to the optical layer by using the adhesive layer. The optical layer and the transparent substrate are respectively positioned at two opposite sides of the adhesive layer. The carrier plate is removed from the mold layer. The mold layer is removed from the optical layer.
According to an embodiment of the disclosure, the forming the mold layer on the carrier includes coating a glue layer on the carrier, and forming a microstructure on a surface of the glue layer to form the mold layer.
According to an embodiment of the disclosure, forming the microstructure on the surface of the adhesive layer includes performing an imprinting step on the surface of the adhesive layer to press the imprinting mold onto the surface of the adhesive layer, curing the adhesive layer while the imprinting mold is pressed onto the surface of the adhesive layer, and removing the imprinting mold.
According to an embodiment of the disclosure, the curing adhesive layer includes performing an ultraviolet light exposure treatment or a heat curing treatment.
According to an embodiment of the disclosure, between providing the carrier plate and forming the mold layer, the method further includes attaching an adhesion layer to a surface of the carrier plate, and the mold layer is formed on the adhesion layer.
According to an embodiment of the disclosure, the adhesive layer is an adhesive tape.
According to an embodiment of the disclosure, the forming the mold layer includes coating a glue layer on the adhesive layer, and forming a microstructure on a surface of the glue layer to form the mold layer.
According to an embodiment of the disclosure, the removing the carrier from the mold layer includes: performing heat treatment to reduce the bonding force between the carrier plate and the adhesive layer; and separating the carrier plate from the adhesive layer.
According to an embodiment of the disclosure, removing the carrier from the mold layer includes performing a laser ablation process on the adhesive layer, and separating the carrier from the adhesive layer.
According to an embodiment of the disclosure, removing the carrier from the mold layer includes etching the carrier to shrink the carrier.
According to an embodiment of the disclosure, removing the mold layer from the optical layer includes adhering an adhesive tape to the adhesive layer, and pulling the adhesive layer and the mold layer away from the optical layer with the adhesive tape.
According to an embodiment of the disclosure, removing the mold layer from the optical layer includes etching the adhesion layer and the mold layer.
According to an embodiment of the disclosure, removing the mold layer from the optical layer includes performing a chemical immersion step to remove the adhesion layer and the mold layer.
According to an embodiment of the disclosure, the anti-sticking treatment includes depositing an anti-sticking material on the second surface of the mold layer or performing a surface modification treatment on the second surface of the mold layer.
According to an embodiment of the disclosure, the forming the optical layer includes using Atomic Layer Deposition (ALD), etching, sputtering, evaporation, imprinting, or spin coating.
According to an embodiment of the disclosure, the refractive index of the optical layer is 1 to 4.
According to an embodiment of the disclosure, the method further includes performing a plasma cleaning step on the optical layer between forming the optical layer and attaching the transparent substrate on the optical layer.
In accordance with one embodiment of the present disclosure, the performing a plasma cleaning step includes utilizing an oxygen plasma. The cleaning method is not limited thereto.
According to an embodiment of the disclosure, attaching the transparent substrate to the optical layer using the adhesive layer includes attaching the adhesive layer to the optical layer and attaching the transparent substrate to the adhesive layer.
According to an embodiment of the disclosure, the adhesive layer includes a pressure sensitive adhesive.
According to an embodiment of the disclosure, attaching the transparent substrate to the optical layer by using the adhesive layer includes coating a transparent optical adhesive on the optical layer to form the adhesive layer, and attaching the transparent substrate to the adhesive layer.
According to an embodiment of the disclosure, removing the carrier from the mold layer includes performing a heat treatment to reduce a bonding force between the carrier and the mold layer, and separating the carrier from the mold layer.
According to an embodiment of the disclosure, removing the carrier from the mold layer includes etching the carrier to shrink the carrier.
According to an embodiment of the disclosure, removing the model layer from the optical layer includes etching the model layer.
According to an embodiment of the disclosure, removing the mold layer from the optical layer includes performing a chemical immersion step to remove the mold layer.
According to an embodiment of the disclosure, the method further includes performing a plasma cleaning step on the carrier before forming the mold layer on the carrier.
Drawings
The aspects of the present disclosure will be better understood from the following detailed description taken in conjunction with the accompanying drawings. It should be noted that, according to standard practice in the industry, the features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
FIGS. 1-9, 10A, 11, 12A, 13, 14, 15A, and 16 are schematic diagrams illustrating intermediate stages of a method of fabricating an optical device according to one embodiment of the present disclosure;
FIG. 10B is a schematic diagram illustrating the formation of an adhesion layer on an optical layer according to another embodiment of the disclosure;
FIG. 12B is a schematic diagram illustrating a laser ablation step of an adhesion layer according to another embodiment of the present disclosure;
FIG. 12C is a schematic diagram illustrating an etching step performed on a carrier according to another embodiment of the disclosure;
FIG. 15B is a schematic diagram illustrating an etching step performed on the adhesion layer and the model layer according to another embodiment of the disclosure;
FIG. 15C is a schematic diagram illustrating a chemical soaking step of the adhesion layer and the model layer according to another embodiment of the disclosure;
FIGS. 17-24, 25A, 26, 27A, and 28A are schematic diagrams illustrating intermediate stages of a method of fabricating an optical device according to an embodiment of the present disclosure;
FIG. 25B is a schematic diagram illustrating the formation of an adhesion layer on an optical layer according to another embodiment of the disclosure;
FIG. 27B is a schematic diagram illustrating an etching step performed on a carrier according to another embodiment of the disclosure;
FIG. 28B is a schematic diagram illustrating a chemical soaking step of the adhesion layer and the model layer according to another embodiment of the disclosure.
[ symbolic description ]
100 optical element
110 carrier plate
112 surface
114 surface
120 adhesive layer
130 clamp
140 roller wheel
150 model layer
152 first surface
154 second surface
156 microstructure
158 glue layer
158a surface
158b pattern structure
160 impression mould
162 pattern structure
170 roller wheel
180 optical layer
182 optical material
183 first surface
184 second surface
186 diffractive optical Structure
190 plasma
192 product(s)
200 light-transmitting substrate
202 surface
210a adhesive layer
210b transparent optical cement
220 heat treatment
230 laser device
240 adhesive tape
250 etchant
252 product (I)
260 etchant (etching agent)
262 product of
270 chemical medicine
272 container
280 plasma
282 product(s)
290 etchant
292 products
300 chemical medicine
302 container
P1 anti-sticking material
Detailed Description
Embodiments of the present disclosure are discussed in detail below. However, it is to be understood that the embodiments provide many applicable concepts that can be embodied in a wide variety of specific contexts. The embodiments discussed and disclosed are merely illustrative and are not intended to limit the scope of the present disclosure. All embodiments of the present disclosure disclose a number of different features, which may be implemented alone or in combination as desired.
Furthermore, the terms "first," "second," and the like, as used herein, do not denote a sequential or ordinal sense, but rather are used to distinguish one element or operation from another by the same technical term.
The spatial relationship between the elements described in this disclosure applies not only to the orientations depicted in the figures, but also to orientations not represented in the figures, such as inverted orientations. Furthermore, the terms "connected," "electrically connected," and the like in the present disclosure are not limited to a direct connection or an electrical connection between two elements, but may also include an indirect connection or an electrical connection, as desired.
Referring to fig. 1 to 9, 10A, 11, 12A, 13, 14, 15A, and 16, schematic diagrams illustrating an intermediate stage of a method for manufacturing an optical device according to an embodiment of the disclosure are shown. In fabricating the optical element 100 shown in fig. 16, the carrier 110 may be provided first, as shown in fig. 1. The carrier 110 may be a flat plate. For example, the carrier 110 has two opposite surfaces 112 and 114, wherein at least the surface 112 is planar. The carrier plate 110 may be a glass plate. For example, the thickness of the carrier plate 110 may be 300 μm.
Next, the adhesive layer 120 may be attached to the surface 112 of the carrier plate 110, as shown in fig. 2. Since the surface 112 of the carrier 110 is planar, the adhesive layer 120 can be smoothly attached to the surface 112. Referring again to fig. 1, in some embodiments, the adhesive layer 120 is held by a clamp 130. The adhesive layer 120 may then be pressed against the surface 112 of the carrier plate 110 using, for example, the roller 140. The adhesive layer 120 may be an adhesive tape.
After the adhesive layer 120 is attached to the carrier plate 110, the mold layer 150 shown in fig. 6 can be formed on the adhesive layer 120. The mold layer 150 has a first surface 152 and a second surface 154, wherein the first surface 152 and the second surface 154 are opposite to each other. The first surface 152 abuts the adhesion layer 120. For example, the first surface 152 may directly contact the adhesion layer 120. The second surface 154 is provided with a plurality of microstructures 156.
In some embodiments, the mold layer 150 is fabricated by applying a glue layer 158 to the adhesive layer 120, as shown in fig. 3. For example, the glue layer 158 may be formed on the adhesion layer 120 by spin coating. Next, microstructures 156 are formed on a surface 158a of the glue layer 158, thereby forming a model layer 150 having microstructures 156. That is, the mold layer 150 is composed of a glue layer 158. In some embodiments, the imprinting step is performed on the surface 158a of the glue layer 158 using the imprinting mold 160 when forming the microstructures 156. The imprint template 160 includes a pattern structure 162. In this imprinting step, as shown in fig. 4 and 5, while the adhesive layer 158 is not yet hardened, the imprinting mold 160 is pressed against the surface 158a of the adhesive layer 158, so that a portion of the adhesive layer 158 is embedded in the pattern structure 162. The embossing step may be performed using the roller 170 to press the embossing mold 160 against the surface 158a of the glue layer 158.
In some embodiments, as shown in fig. 5, the glue layer 158 is cured to maintain the shape of the surface 158a of the glue layer 158 when the imprint mold 160 presses against the surface 158a of the glue layer 158. Thus, after curing, a pattern structure 158b opposite the pattern structure 162 of the imprint template 160 is formed on the surface 158a of the adhesive layer 158. In some exemplary embodiments, the glue layer 158 is cured using ultraviolet light UV to expose the glue layer 158 to ultraviolet light. In embodiments utilizing an ultraviolet light UV curable glue layer 158, the imprint mold 160 is transparent to ultraviolet light UV. Alternatively, the glue layer 158 is thermally cured using ultraviolet light UV, and the glue layer 158 is cured. The glue layer 158 may be cured by thermally curing the glue layer 158. The material of the imprint mold 160 may be, for example, a resin polymer, a metal, or an oxide, but the material of the imprint mold 160 is not limited thereto. Next, as shown in fig. 6, the imprint mold 160 is removed, and the fabrication of the microstructure 156 of the model layer 150 is completed.
After the mold layer 150 is formed, the second surface 154 of the mold layer 150 may be subjected to an anti-sticking treatment. In some embodiments, as shown in fig. 7, the stacked structure including the carrier 110, the adhesion layer 120, and the mold layer 150 is turned over during the anti-stiction process, and the anti-stiction material P1 is deposited on the second surface 154 of the mold layer 150 by, for example, evaporation. In another embodiment, during the anti-sticking treatment, the second surface 154 of the mold layer 150 is subjected to a surface modification treatment, so that the second surface 154 has anti-sticking properties. The surface modification treatment may be performed by plasma.
After the anti-sticking treatment, the optical layer 180 may be formed on the second surface 154 of the mold layer 150 by, for example, atomic layer deposition, etching, sputtering, evaporation, imprinting, or spin coating. The optical layer 180 covers the microstructures 156 of the mold layer 150 and fills the microstructures 156 such that a surface structure opposite the topographical structure of the second surface 154 of the mold layer 150 is formed on the optical layer 180. In some exemplary embodiments, as shown in fig. 8, an optical material 182 is deposited on the second surface 154 of the mold layer 150 to form an optical layer 180 on the second surface 154. The optical layer 180 is formed of a high refractive index material. For example, the refractive index of the optical layer 180 may be 1 to 4.
In some embodiments, after the optical layer 180 is formed, the stacked structure including the carrier plate 110, the adhesion layer 120, the mold layer 150, and the optical layer 180 is flipped. Next, as shown in fig. 9, a plasma cleaning step may be optionally performed on the optical layer 180 to clean the optical layer 180 with the plasma 190. For example, the plasma 190 may be an oxygen plasma. During the plasma cleaning step, the products 192 are pumped out. The product 192 may be water and/or carbon dioxide.
Next, as shown in fig. 11, the transparent substrate 200 may be attached to the optical layer 180 by using the adhesive layer 210a, so that the optical layer 180 and the transparent substrate 200 are respectively located at two opposite sides of the adhesive layer 210 a. The light-transmitting substrate 200 is a substrate having a high refractive index. In some exemplary embodiments, the light-transmissive substrate 200 may be a glass substrate or a fused silica substrate.
In some embodiments, as shown in fig. 10A, in the operation of attaching the light-transmitting substrate 200 to the optical layer 180, the adhesive layer 210A is attached to the optical layer 180, and then the light-transmitting substrate 200 is placed on the adhesive layer 210A and attached to the adhesive layer 210A. In such an embodiment, the adhesive layer 210a is a double-sided tape. The adhesive layer 210a may include a pressure sensitive adhesive. The adhesive layer 210a is transparent. The haze of the adhesion layer 210a may be, for example, less than 0.5%, but the disclosure is not limited thereto. In some exemplary embodiments, the material of the subsequent layer 210a is a high refractive index material. For example, the refractive index of the subsequent layer 210a may be 1 to 4.
In some embodiments, as shown in fig. 10B, in the operation of attaching the light-transmitting substrate 200 on the optical layer 180, a transparent optical adhesive 210B is coated on the optical layer 180 to form an adhesive layer. The transparent optical paste 210b may be formed on the optical layer 180 by spin coating. Next, the light-transmitting substrate 200 is placed and attached on the adhesive layer composed of the transparent optical adhesive 210b. The haze of the transparent optical adhesive 210b may be, for example, less than 0.5%, but the disclosure is not limited thereto. In some exemplary embodiments, the material of the transparent optical paste 210b is a high refractive index material. For example, the refractive index of the transparent optical paste 210b may be 1 to 4.
Next, as shown in fig. 13, the carrier 110 is removed from the adhesion layer 120. In some embodiments, as shown in fig. 12A, in the operation of removing the carrier plate 110, a heat treatment 220 is performed to reduce the bonding force between the carrier plate 110 and the adhesive layer 120. Therefore, after the heat treatment 220, the carrier plate110 and the adhesive layer 120 may be more easily separated from each other. In another embodiment, as shown in fig. 12B, in the operation of removing the carrier plate 110, the laser device 230 is used to perform the laser ablation treatment on the adhesion layer 120, so that the carrier plate 110 and the adhesion layer 120 can be separated from each other smoothly. In yet another embodiment, as shown in fig. 12C, in the operation of removing the carrier plate 110, an etching step is performed on the carrier plate 110 by using an etchant 250 to shrink the carrier plate 110 until the carrier plate 110 is removed. On the carrier plate 110, silicon dioxide (SiO 2 ) In the resulting embodiment, the etchant 250 may be Hydrogen Fluoride (HF) and the product 252 generated during the etching step is silicon tetrafluoride (SiF) 4 ) With water (H) 2 O). On the carrier plate 110, a metal oxide is formed of calcium metasilicate (CaSiO 3 ) In the resulting embodiment, etchant 250 may be hydrogen fluoride, while product 252 is silicon tetrafluoride, water, and calcium fluoride (CaF) 2 )。
After the carrier 110 is removed, the adhesion layer 120 and the mold layer 150 may be removed from the optical layer 180. The adhesion layer 120 and the mold layer 150 may be removed simultaneously. For example, in the operation of removing the adhesive layer 120 and the mold layer 150, as shown in fig. 14, the adhesive tape 240 may be adhered on the adhesive layer 120. In some embodiments, the adhesive tape 240 may be held with the clamp 130. The tape 240 may then be pressed against the adhesive layer 120 using the roller 140. Then, as shown in fig. 15A and 16, the adhesive layer 120 and the mold layer 150 can be pulled apart by using the adhesive tape 240, thereby completing the fabrication of the optical element 100.
Since the second surface 154 of the mold layer 150 has been subjected to the anti-sticking treatment, the bonding force between the second surface 154 of the mold layer 150 and the optical layer 180 is smaller than the bonding force between the first surface 152 of the mold layer 150 and the adhesive layer 120. Thus, the mold layer 150 can be successfully separated from the optical layer 180, and the adhesive layer 120 can be easily pulled away from the mold layer 150.
In other embodiments, as shown in fig. 15B, in the operation of removing the adhesion layer 120 and the model layer 150, an etching step is performed on the adhesion layer 120 and the model layer 150 by using an etchant 260 to etch away the adhesion layer 120 and the model layer 150. For example, the etchant 260 may include argon (Ar) 2 ) With chlorine (Cl) 2 ). During the etching step, some of the product 262, and is extracted.
In still other embodiments, as shown in fig. 15C, in the operation of removing the adhesion layer 120 and the mold layer 150, the adhesion layer 120 and the mold layer 150 are subjected to a chemical soaking step by soaking the adhesion layer 120 and the mold layer 150 with a chemical 270. For example, in the chemical soaking step, the stacked structure including the light-transmitting substrate 200, the adhesive layer 210a, the optical layer 180, the mold layer 150, and the adhesive layer 120 is soaked in the chemical 270 in the container 272. After being immersed in the chemical 270, the adhesive layer 120 and the mold layer 150 may be removed from the optical layer 180. In some exemplary embodiments, the chemical 270 is an EKC-series residue remover developed by dupont EKC technologies.
With continued reference to fig. 16, the optical element 100 includes a transparent substrate 200, an adhesive layer 210a, and an optical layer 180. The optical layer 180 has a first surface 183 and a second surface 184 on opposite sides of the optical layer 180. The optical layer 180 is located on the surface 202 of the light transmissive substrate 200. The adhesive layer 210a is sandwiched between the surface 202 of the transparent substrate 200 and the second surface 184 of the optical layer 180. After mold layer 150 is removed from first surface 183 of optical layer 180, first surface 183 is formed with a plurality of diffractive optical structures 186. For example, each diffractive optical structure 186 can be a tilted structure, a binary structure, a stepped structure, a triangular structure, or a trapezoidal structure.
Referring to fig. 17 to 24, 25A, 26, 27A, and 28A, schematic diagrams illustrating an intermediate stage of a method for manufacturing an optical device according to an embodiment of the disclosure are shown. In the present embodiment, when manufacturing the optical element 100 shown in fig. 16, the carrier plate 110 may be provided first. Optionally, a plasma cleaning step may be performed on the carrier plate 110 to clean the carrier plate 110 with the plasma 280 before any material is formed on the carrier plate 110. The plasma may be, for example, an oxygen plasma. During the plasma cleaning step, some of the products 282 are generated and extracted. Product 282 may be water and/or carbon dioxide. In embodiments where the carrier plate 110 is clean, the plasma cleaning step may be omitted.
Next, the model layer 150 shown in fig. 21 may be formed directly on the surface 112 of the carrier plate 110. The first surface 152 and the second surface 154 of the mold layer 150 are opposite to each other, and the first surface 152 is adjacent to the carrier plate 110. For example, the first surface 152 may directly contact the surface 112 of the carrier 110. The second surface 154 is provided with a plurality of microstructures 156.
In some embodiments, as shown in fig. 18, when the mold layer 150 is fabricated, the adhesive layer 158 may be first coated on the surface 112 of the carrier plate 110 by, for example, spin coating. Next, microstructures 156 are formed on a surface 158a of the glue layer 158, thereby forming a model layer 150 having microstructures 156. In forming the microstructures 156, an imprinting step may be performed on the surface 158a of the glue layer 158 using an imprinting mold 160. In this imprinting step, as shown in fig. 19 and 20, the imprinting mold 160 is pressed against the surface 158a of the adhesive layer 158 when the adhesive layer 158 is not yet hardened, so that a portion of the adhesive layer 158 is embedded in the pattern 162 of the imprinting mold 160. The embossing step may be performed using the roller 170 to press the embossing mold 160 against the surface 158a of the glue layer 158.
In some embodiments, as shown in fig. 20, the glue layer 158 is cured to maintain the shape of the surface 158a of the glue layer 158 when the imprint mold 160 presses against the surface 158a of the glue layer 158. After curing, a pattern structure 158b, which is opposite to the pattern structure 162 of the imprint template 160, is formed on the surface 158a of the adhesive layer 158. In the Ultraviolet (UV) embodiment, the glue layer 158 can be cured to expose the glue layer 158 to ultraviolet light. The glue layer 158 is thermally cured by ultraviolet light UV, thereby curing the glue layer 158. Alternatively, the glue layer 158 may be cured by thermally curing the glue layer 158. After curing, the imprint mold 160 is removed to complete the fabrication of the microstructures 156 of the mold layer 150, as shown in FIG. 21.
Next, the second surface 154 of the mold layer 150 may be subjected to an anti-stick treatment. For example, as shown in fig. 22, in the anti-sticking process, the stacked structure including the carrier plate 110 and the model layer 150 is turned over, and then the anti-sticking material P1 is deposited on the second surface 154 of the model layer 150 by evaporation. In another embodiment, during the anti-sticking treatment, a surface modification treatment is performed on the second surface 154 of the mold layer 150 by using, for example, plasma, so that the second surface 154 has anti-sticking properties.
After the anti-sticking treatment, the optical layer 180 may be formed on the second surface 154 of the mold layer 150 by, for example, atomic layer deposition, etching, sputtering, evaporation, imprinting, or spin coating. As shown in fig. 23, the optical layer 180 covers the microstructures 156 of the mold layer 150 and fills the grooves of these microstructures 156 such that a surface structure opposite the topography of the second surface 154 of the mold layer 150 is formed on the optical layer 180. In forming the optical layer 180, an optical material 182 is deposited on the second surface 154 of the mold layer 150. The optical layer 180 is formed of a high refractive index material. For example, the refractive index of the optical layer 180 may be 1 to 4.
In some embodiments, after the optical layer 180 is formed, the stacked structure including the carrier plate 110, the mold layer 150, and the optical layer 180 is flipped. Next, as shown in fig. 24, a plasma cleaning step may be optionally performed on the optical layer 180 to clean the optical layer 180. The plasma cleaning step is performed using a plasma 190, such as an oxygen plasma. During the plasma cleaning step, the products 192 are pumped out. The product 192 may be water and/or carbon dioxide.
Subsequently, as shown in fig. 26, the light-transmitting substrate 200 may be attached to the optical layer 180 by using the adhesive layer 210 a. Therefore, the optical layer 180 and the transparent substrate 200 are respectively located at two opposite sides of the adhesive layer 210 a.
In some embodiments, as shown in fig. 25A, in the operation of attaching the light-transmitting substrate 200 to the optical layer 180, the adhesive layer 210a is attached to the optical layer 180, and then the light-transmitting substrate 200 is placed on the adhesive layer 210a and attached to the adhesive layer 210 a. In such an embodiment, the adhesive layer 210a is a double-sided tape. The adhesive layer 210a may include a pressure sensitive adhesive. The refractive index of the subsequent layer 210a may be 1 to 4.
In some embodiments, as shown in fig. 25B, in the operation of attaching the transparent substrate 200 to the optical layer 180, a transparent optical adhesive 210B is coated on the optical layer 180 by, for example, spin coating, so as to form an adhesive layer. Next, the light-transmitting substrate 200 is placed and attached on the adhesive layer composed of the transparent optical adhesive 210b. The refractive index of the transparent optical paste 210b may be 1 to 4.
After attaching the transparent substrate 200 to the optical layer 180, the carrier 110 is removed from the mold layer 150. In some embodiments, as shown in fig. 27A, in the operation of removing the carrier plate 110, a heat treatment 220 is performed to reduce the bonding force between the carrier plate 110 and the mold layer 150. After the heat treatment 220, the carrier plate 110 and the mold layer 150 can be more easily separated from each other.
In another embodiment, as shown in fig. 27B, in the operation of removing the carrier plate 110, an etching step is performed on the carrier plate 110 by using an etchant 250 to shrink the carrier plate 110 until the carrier plate 110 is removed. In embodiments where carrier 110 is formed of silicon dioxide, etchant 250 may be hydrogen fluoride and product 252 generated during the etching step is silicon tetrafluoride and water. In embodiments where carrier plate 110 is formed from calcium metasilicate, etchant 250 may be hydrogen fluoride and product 252 is silicon tetrafluoride, water, and calcium fluoride.
After the carrier 110 is removed, the mold layer 150 may be removed from the optical layer 180. In some embodiments, as shown in fig. 28A, in the operation of removing the model layer 150, an etching step is performed on the model layer 150 using an etchant 290 to etch away the model layer 150. For example, the etchant 290 may include argon and chlorine. During the etching step, some product 292 is generated and extracted.
In other embodiments, as shown in fig. 28B, in the operation of removing the mold layer 150, the mold layer 150 is subjected to a chemical soaking step by soaking the mold layer 150 with the chemical 300. For example, in the chemical soaking step, the stacked structure including the light-transmitting substrate 200, the adhesive layer 210a, the optical layer 180, and the mold layer 150 is soaked in the chemical 300 in the container 302. After being immersed in the chemical 300, the mold layer 150 can be removed from the optical layer 180, thereby completing the fabrication of the optical element 100. In some exemplary embodiments, the chemical 300 is an EKC series residue remover developed by dupont EKC technologies.
From the above embodiments, it is an advantage of the present disclosure that an optical element having a higher diffraction angle can be obtained because many diffractive optical structures are formed on an optical layer made of a high refractive index material.
The foregoing has outlined features of several embodiments so that those skilled in the art may better understand the aspects of the disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such peer-to-peer architecture does not depart from the spirit and scope of the present disclosure, and that it may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
Claims (30)
1. An optical element, comprising:
a transparent substrate;
an optical layer on a surface of the transparent substrate, wherein the optical layer has a first surface and a second surface opposite to each other, the first surface is provided with a plurality of diffractive optical structures, and a refractive index of the optical layer is 1 to 4; and
and the bonding layer is arranged between the surface of the light-transmitting substrate and the second surface of the optical layer in a clamping way.
2. The optical device of claim 1, wherein the adhesive layer comprises a transparent optical adhesive.
3. The optical element of claim 1, wherein the adhesive layer comprises a pressure sensitive adhesive.
4. The optical element of claim 1, wherein the adhesive layer has a refractive index of 1 to 4.
5. A method of manufacturing an optical element, the method comprising:
providing a carrier plate;
forming a model layer on the carrier, wherein the model layer has a first surface and a second surface opposite to each other, the first surface is adjacent to the carrier, and the second surface is provided with a plurality of microstructures;
performing anti-sticking treatment on the second surface of the model layer;
forming an optical layer on the second surface of the model layer after the anti-sticking treatment, wherein the optical layer covers and fills the microstructures;
attaching a transparent substrate to the optical layer by using an adhesive layer, wherein the optical layer and the transparent substrate are respectively positioned at two opposite sides of the adhesive layer;
removing the carrier plate from the model layer; and
the mold layer is removed from the optical layer.
6. The method of claim 5, wherein forming the model layer on the carrier comprises:
coating a glue layer on the carrier plate; and
forming the plurality of microstructures on one surface of the glue layer to form the model layer.
7. The method of claim 6, wherein forming the plurality of microstructures on the surface of the glue layer comprises:
performing an imprinting step on the surface of the adhesive layer to press an imprinting mold on the surface of the adhesive layer;
curing the glue layer while the imprint mold is pressed against the surface of the glue layer; and
the imprint mold is removed.
8. The method of claim 7, wherein curing the glue layer comprises performing an ultraviolet light exposure treatment or a thermal curing treatment.
9. The method of claim 5, wherein between providing the carrier and forming the mold layer, the method further comprises attaching an adhesion layer to a surface of the carrier, and the mold layer is formed on the adhesion layer.
10. The method of claim 9, wherein the adhesive layer is an adhesive tape.
11. The method of claim 9, wherein forming the model layer comprises:
coating a glue layer on the adhesive layer; and
forming the microstructures on one surface of the glue layer to form the model layer.
12. The method of claim 9, wherein removing the carrier from the mold layer comprises:
performing a heat treatment to reduce the bonding force between the carrier and the adhesive layer; and
separating the carrier plate from the adhesive layer.
13. The method of claim 9, wherein removing the carrier from the mold layer comprises:
performing laser ablation treatment on the adhesive layer; and
separating the carrier plate from the adhesive layer.
14. The method of claim 9, wherein removing the carrier from the mold layer comprises performing an etching step on the carrier to shrink the carrier.
15. The method of claim 9, wherein removing the model layer from the optical layer comprises:
adhering an adhesive tape to the adhesive layer; and
the adhesive layer and the mold layer are pulled away from the optical layer by the adhesive tape.
16. The method of claim 9, wherein removing the mold layer from the optical layer comprises performing an etching step on the adhesion layer and the mold layer.
17. The method of claim 9, wherein removing the mold layer from the optical layer comprises performing a chemical soak step to remove the adhesion layer and the mold layer.
18. The method of claim 5, wherein performing the anti-stiction treatment comprises depositing an anti-stiction material on the second surface of the mold layer or performing a surface modification treatment on the second surface of the mold layer.
19. The method of claim 5, wherein forming the optical layer comprises using an atomic layer deposition, an etching, a sputtering, an evaporation, an imprinting, or a spin-on process.
20. The method of claim 5, wherein the optical layer has a refractive index of 1 to 4.
21. The method of claim 5, further comprising performing a plasma cleaning step on the optical layer between forming the optical layer and attaching the transparent substrate to the optical layer.
22. The method of claim 21, wherein performing the plasma cleaning step comprises using an oxygen plasma.
23. The method of claim 5, wherein attaching the light-transmissive substrate to the optical layer using the adhesive layer comprises:
attaching the adhesive layer to the optical layer; and
the transparent substrate is attached to the adhesive layer.
24. The method of claim 23, wherein the adhesive layer comprises a pressure sensitive adhesive.
25. The method of claim 5, wherein attaching the light-transmissive substrate to the optical layer using the adhesive layer comprises:
coating a transparent optical adhesive on the optical layer to form the adhesive layer; and
the transparent substrate is attached to the adhesive layer.
26. The method of claim 5, wherein removing the carrier from the mold layer comprises:
performing a heat treatment to reduce the bonding force between the carrier plate and the model layer; and
separating the carrier plate from the mold layer.
27. The method of claim 5, wherein removing the carrier from the mold layer comprises performing an etching step on the carrier to shrink the carrier.
28. The method of claim 5, wherein removing the model layer from the optical layer comprises performing an etching step on the model layer.
29. The method of claim 5, wherein removing the model layer from the optical layer comprises performing a chemical soak step to remove the model layer.
30. The method of claim 5, further comprising performing a plasma cleaning step on the carrier before forming the mold layer on the carrier.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/817,346 | 2022-08-03 | ||
| US63/374,003 | 2022-08-31 | ||
| US18/057,233 | 2022-11-21 | ||
| US18/057,233 US20240045104A1 (en) | 2022-08-03 | 2022-11-21 | Optical element and method for manufacturing optical element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117518303A true CN117518303A (en) | 2024-02-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310578990.6A Pending CN117518303A (en) | 2022-08-03 | 2023-05-22 | Optical element and method for manufacturing optical element |
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| Country | Link |
|---|---|
| CN (1) | CN117518303A (en) |
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2023
- 2023-05-22 CN CN202310578990.6A patent/CN117518303A/en active Pending
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