CN117517917A - Low friction semiconductor test probe - Google Patents
Low friction semiconductor test probe Download PDFInfo
- Publication number
- CN117517917A CN117517917A CN202311513685.5A CN202311513685A CN117517917A CN 117517917 A CN117517917 A CN 117517917A CN 202311513685 A CN202311513685 A CN 202311513685A CN 117517917 A CN117517917 A CN 117517917A
- Authority
- CN
- China
- Prior art keywords
- needle
- needle head
- test probe
- friction
- semiconductor test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 61
- 239000000523 sample Substances 0.000 title claims abstract description 35
- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 229910000831 Steel Inorganic materials 0.000 claims description 9
- 239000010959 steel Substances 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 230000005540 biological transmission Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000010417 needlework Methods 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a low-friction semiconductor test probe which comprises a needle tube, wherein one end of the needle tube is provided with a first needle head in a telescopic manner, the other end of the needle tube is provided with a second needle head in a telescopic manner, a spring is arranged in the needle tube, two ends of the spring are respectively contacted with tail parts of the first needle head and the second needle head, ball bearings are arranged on the outer sides of the tail parts of the first needle head and the second needle head, and the ball bearings are contacted with the inner wall of the needle tube. The low-friction semiconductor test probe solves the problem that the test result is inaccurate because the high impedance requirement on the probe is high in the test process and the excessive friction force of the normal test probe can influence the test data of the semiconductor in the test process.
Description
Technical Field
The invention belongs to the technical field of semiconductor detection, and particularly relates to a low-friction semiconductor test probe.
Background
The common semiconductor testing mode is to set a test point on a PCBA board, and directly contact the test point with a probe through automatic testing equipment or on-line testing equipment to obtain relevant electrical parameters and transmit the parameters to testing software.
Disclosure of Invention
The invention aims to provide a low-friction semiconductor test probe, which solves the problem that the test result is inaccurate because the test data of a semiconductor is influenced by overlarge friction force of a normal test probe in the test process due to high impedance requirement of the probe in the test process.
In order to solve the technical problems, the invention discloses a low-friction semiconductor test probe which comprises a needle tube, wherein one end of the needle tube is provided with a first needle head in a telescopic manner, the other end of the needle tube is provided with a second needle head in a telescopic manner, springs are arranged in the needle tube, two ends of each spring are respectively contacted with tail parts of the first needle head and the second needle head, balls are arranged on the outer sides of the tail parts of the first needle head and the second needle head, and the balls are contacted with the inner wall of the needle tube.
The technical scheme of the invention also has the following characteristics:
as a preferable scheme of the invention, a plurality of sliding grooves are formed in the circumferential direction of the outer walls of the tail parts of the first needle head and the second needle head, a plurality of balls are arranged in each sliding groove, and a first base and a second base are respectively arranged at the tail parts of the first needle head and the second needle head.
As a preferable scheme of the invention, the tail parts of the first needle head and the second needle head are respectively provided with a jack, and the first base and the second base are respectively provided with a plug matched with the jacks.
As a preferable scheme of the invention, the two ends of the needle tube are provided with the necking, the outer diameters of the tail parts of the first needle head and the second needle head are larger than the inner diameter of the necking, and the outer diameters of the rod parts of the first needle head and the second needle head are smaller than the inner diameter of the necking.
As a preferable mode of the invention, the balls are steel balls.
As a preferred embodiment of the present invention, the spring is a compression spring.
The invention has the beneficial effects that: according to the low-friction semiconductor test probe, the first needle head and the second needle head are respectively provided with the steel balls, the steel balls are arranged in the four sliding grooves of the first needle head and the second needle head, the steel balls are in contact with the inner wall of the needle tube in the working process, and when the first needle head and the second needle head are pressed down to work, the steel balls roll, so that the friction force is greatly reduced. The low-friction semiconductor test probe has the advantages that the friction force between the first needle head and the needle tube is small in the test process, the service life of the test probe is prolonged, meanwhile, the data transmission is stable in the test process, the accuracy of the test data is higher, and reliable test data is provided for high-requirement test components.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a cross-sectional view of a low friction semiconductor test probe of the present invention;
FIG. 2 is an exploded view of a low friction semiconductor test probe according to the present invention;
FIG. 3 is an exploded view of the assembly of a first needle in a low friction semiconductor test probe according to the present invention;
fig. 4 is an exploded view of the assembly of a first needle in a low friction semiconductor test probe according to the present invention.
In the figure: 1. the needle tube, 2, the second needle, 3, the spring, 4, the ball, 5, the first needle, 6, the first base, 7, the second base.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Example 1
As shown in fig. 1 and 2, the low-friction semiconductor test probe of the invention comprises a needle tube 1, wherein one end of the needle tube 1 is provided with a first needle 5 in a telescopic way, the other end of the needle tube 1 is provided with a second needle 2 in a telescopic way, a spring 3 is arranged in the needle tube 1, two ends of the spring 3 are respectively contacted with the tail parts of the first needle 5 and the second needle 2, the outer sides of the tail parts of the first needle 5 and the second needle 2 are provided with balls 4, the balls 4 are contacted with the inner wall of the needle tube 1, and the balls 4 are preferably steel balls.
When in use, the first needle head 5 and the second needle head 2 can be respectively contacted with a testing machine and a tested product, then the spring 3 is contracted after the first needle head 5 or the second needle head 2 is pressed, and the first needle head 5 and the second needle head 2 extend into the needle tube 1 so as to form good contact with the tested product.
According to the low-friction semiconductor test probe, the first needle head 5 and the second needle head 2 are respectively provided with the ball 4, so that the ball 4 is contacted with the inner wall of the needle tube 1 in the moving process of the first needle head 5 and the second needle head 2, and when the first needle head 5 and the second needle head 2 are pressed down to work, the ball 4 rolls, so that the friction force is greatly reduced. The low-friction semiconductor test probe has the advantages that the friction force between the first needle head and the needle tube is small in the test process, the service life of the test probe is prolonged, meanwhile, the data transmission is stable in the test process, the accuracy of the test data is higher, and reliable test data is provided for high-requirement test components.
Example 2
Referring to fig. 3 and 4, unlike embodiment 1, in embodiment 2, four sliding grooves are formed in the circumference of the outer walls of the tail portions of the first needle 5 and the second needle 2, a plurality of balls 4 are formed in each sliding groove, and a first base 6 and a second base 7 are formed at the tail portions of the first needle 5 and the second needle 2, respectively.
The four sliding grooves are arranged at equal angles of 90 degrees, and when the needle works, each surface of the first needle head 5 and each surface of the second needle head 2 are contacted with the inner wall of the needle tube 1, so that on one hand, a good guiding effect can be achieved, and on the other hand, a better friction reducing effect can be achieved.
Example 3
As shown in fig. 1, unlike in embodiment 1, in embodiment 3, the low-friction semiconductor test probe of the present invention has a jack at the tail of each of the first needle 5 and the second needle 2, and a plug for mating with the jack is provided on each of the first base 6 and the second base 7.
After the steel balls are assembled in the corresponding sliding grooves, the plugs on the first base 6 and the second base 7 are aligned with the jacks on the first needle head 5 and the second needle head 2 respectively, so that the steel balls can be rotationally packaged in the corresponding sliding grooves, and the assembly is convenient.
Example 4
As shown in fig. 1, unlike in embodiment 1, in embodiment 4, the low-friction semiconductor test probe of the present invention has a reduced mouth formed at both ends of the needle tube 1, and the outer diameters of the tail portion of the first needle 5 and the tail portion of the second needle 2 are larger than the inner diameter of the reduced mouth, and the outer diameters of the shaft portions of the first needle 5 and the second needle 2 are smaller than the inner diameter of the reduced mouth.
By this design, it is ensured that the assembly of the first needle 5 and the second needle 2 is completed quickly at the lowest cost, ensuring that both are telescopically assembled at the two ends of the needle cannula 1, respectively.
Therefore, compared with the existing test probes, the low-friction semiconductor test probe has the advantages that the balls 4 are designed on the first needle head 5 and the second needle head 2, so that the balls 4 are in contact with the inner wall of the needle tube 1 in the moving process of the first needle head 5 and the second needle head 2, and when the first needle head 5 and the second needle head 2 are pressed down to work, the balls 4 roll, so that friction force is greatly reduced. The low-friction semiconductor test probe has the advantages that the friction force between the first needle head and the needle tube is small in the test process, the service life of the test probe is prolonged, meanwhile, the data transmission is stable in the test process, the accuracy of the test data is higher, and reliable test data is provided for high-requirement test components.
While the foregoing description illustrates and describes several preferred embodiments of the invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of use in various other combinations, modifications and environments and is capable of changes or modifications within the spirit of the invention described herein, either as a result of the foregoing teachings or as a result of the knowledge or skill of the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (6)
1. The utility model provides a low friction semiconductor test probe, its characterized in that, includes needle tubing (1), the one end of needle tubing (1) is provided with first syringe needle (5) telescopically, and the other end is provided with second syringe needle (2) telescopically, is provided with spring (3) in needle tubing (1), and the both ends of spring (3) contact with the afterbody of first syringe needle (5) and second syringe needle (2) respectively, and the afterbody outside of first syringe needle (5) and second syringe needle (2) is provided with ball (4), ball (4) contact with the inner wall of needle tubing (1).
2. The low-friction semiconductor test probe according to claim 1, wherein a plurality of sliding grooves are formed in the circumference of the outer walls of the tail parts of the first needle head (5) and the second needle head (2), a plurality of balls (4) are arranged in each sliding groove, and a first base (6) and a second base (7) are respectively arranged at the tail parts of the first needle head (5) and the second needle head (2).
3. The low-friction semiconductor test probe according to claim 2, wherein the tail parts of the first needle head (5) and the second needle head (2) are provided with jacks, and the first base (6) and the second base (7) are provided with plugs matched with the jacks.
4. A low-friction semiconductor test probe according to claim 3, characterized in that the two ends of the needle tube (1) are formed with a necking, the outer diameters of the tail parts of the first needle head (5) and the second needle head (2) are larger than the inner diameter of the necking, and the outer diameters of the rod parts of the first needle head (5) and the second needle head (2) are smaller than the inner diameter of the necking.
5. The low-friction semiconductor test probe according to claim 4, characterized in that the balls (4) are steel balls.
6. The low friction semiconductor test probe of claim 5 wherein the spring is a compression spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311513685.5A CN117517917A (en) | 2023-11-14 | 2023-11-14 | Low friction semiconductor test probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311513685.5A CN117517917A (en) | 2023-11-14 | 2023-11-14 | Low friction semiconductor test probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117517917A true CN117517917A (en) | 2024-02-06 |
Family
ID=89745088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311513685.5A Pending CN117517917A (en) | 2023-11-14 | 2023-11-14 | Low friction semiconductor test probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117517917A (en) |
-
2023
- 2023-11-14 CN CN202311513685.5A patent/CN117517917A/en active Pending
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