CN117508855A - Wide SOP series packaging integrated circuit tray - Google Patents

Wide SOP series packaging integrated circuit tray Download PDF

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Publication number
CN117508855A
CN117508855A CN202311765210.5A CN202311765210A CN117508855A CN 117508855 A CN117508855 A CN 117508855A CN 202311765210 A CN202311765210 A CN 202311765210A CN 117508855 A CN117508855 A CN 117508855A
Authority
CN
China
Prior art keywords
integrated circuit
sop
tray
wide
broad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311765210.5A
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Chinese (zh)
Inventor
徐彦平
马路平
王峰
马成虎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianshui Huatian Integrated Circuit Packaging Material Co ltd
Original Assignee
Tianshui Huatian Integrated Circuit Packaging Material Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianshui Huatian Integrated Circuit Packaging Material Co ltd filed Critical Tianshui Huatian Integrated Circuit Packaging Material Co ltd
Priority to CN202311765210.5A priority Critical patent/CN117508855A/en
Publication of CN117508855A publication Critical patent/CN117508855A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D19/00—Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
    • B65D19/38—Details or accessories
    • B65D19/44—Elements or devices for locating articles on platforms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D19/00—Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
    • B65D19/38—Details or accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D21/00—Nestable, stackable or joinable containers; Containers of variable capacity
    • B65D21/02—Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
    • B65D21/0209—Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together stackable or joined together one-upon-the-other in the upright or upside-down position

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The invention discloses a wide SOP series packaging integrated circuit tray, which comprises a tray body, wherein a plurality of pockets are formed in the tray body, and each pocket has a front structure and a back structure; the front structure comprises a front supporting surface, a front pocket hole is formed in the front supporting surface, a pair of pin protection ribs and a pair of guide positioning blocks are arranged on the front supporting surface, a pin protection area is arranged between the pin protection ribs and the inner wall of the pocket, the pin protection area is of a gap structure, and the guide positioning blocks are used for positioning a non-pin surface of the integrated circuit; the back structure comprises a back base surface, a protruding structure is arranged on the back base surface, the protruding structure is provided with a supporting surface and a positioning block surrounding the supporting surface, a back pocket hole is further formed in the back base surface, and the back pocket hole and the front pocket hole form a pocket hole together. The invention can avoid contact with pins, thus playing a good role in protecting the structure of the wide SOP in the process of testing, transporting and using.

Description

Wide SOP series packaging integrated circuit tray
Technical field:
the invention belongs to the technical field of integrated circuit packaging materials, and particularly relates to a wide SOP series packaging integrated circuit tray.
The background technology is as follows:
SOP (Small Outline Package) is a form of packaging for the manufacture and assembly of electronic components. SOP packages are a surface mount technology (Surface Mount Technology, SMT) that solder pins of electronic components to the surface of a printed circuit board (Printed Circuit Board, PCB) rather than being connected by vias. SOP package has the characteristics of high system integration level, excellent performance, high reliability, high packaging density and the like.
The packaging technology of the wide SOP is improved from SOP, more pins can be arranged, the structure of the SOP has the characteristics of large and thin plastic packaging body, the pins are led out from two sides of the packaging body to be in a gull wing shape (L shape), the pin spacing is about 0.635mm, the pins have the characteristics of high density and low strength, and if no effective protection measures are carried out on the pins in transportation, the pins are extremely easy to collide into the skewed pins and even break.
IC trays are commonly used as loading tools for wide SOP integrated circuits, but when the existing IC trays are used as loading tools, pins of the integrated circuits are in contact with the body of the tray, and the pins are extremely easy to damage, break, pollute and the like in testing, transporting and using, so that the circuits are damaged and fail. There is therefore a need for improvements to existing trays to overcome the above deficiencies.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
The invention comprises the following steps:
it is an object of the present invention to provide a broad SOP series packaged integrated circuit tray that overcomes the above-described deficiencies of the prior art.
In order to achieve the above purpose, the invention provides a wide SOP series packaging integrated circuit tray, which comprises a tray body, wherein a plurality of pockets are arranged on the tray body, and the pockets have a front structure and a back structure;
the front structure comprises a front supporting surface, a front pocket hole is formed in the front supporting surface, a pair of pin protection ribs and a pair of guide positioning blocks are arranged on the front supporting surface, a pin protection area is arranged between the pin protection ribs and the inner wall of the pocket, the pin protection area is of a gap structure, and the guide positioning blocks are used for positioning a non-pin surface of the integrated circuit;
the back structure comprises a back base surface, a protruding structure is arranged on the back base surface, the protruding structure is provided with a supporting surface and a positioning block surrounding the supporting surface, a back pocket hole is further formed in the back base surface, and the back pocket hole and the front pocket hole form a pocket hole together.
Further, preferably, the plurality of pockets are arranged in a matrix.
Further, preferably, the guiding positioning block is in a slope structure, and the slope of the slope is 10-20 degrees; the inclined plane design is more convenient for processing and forming on one hand and is more convenient for guiding the integrated circuit when taking and placing on the other hand.
Further, preferably, the surface of the pin protection rib facing the center of the front supporting surface is also in an inclined surface structure, and the inclination of the inclined surface is 7-12 degrees; also, the bevel design is more convenient for processing and forming on one hand and is more convenient for guiding the integrated circuit during taking and placing on the other hand.
Further, preferably, the distance between the pair of guide positioning blocks is S, s=d+2×0.2mm, where D is the length of the plastic package body of the wide body SOP; the specification design can ensure the placement space of the integrated circuit on one hand and avoid the placement too tight on the other hand.
Further, preferably, the width of the pin protection rib is W, the height is H, w= (L) 1 L)/2, and W.gtoreq.0.2 mm, wherein L 1 -L is the length of the pin from the plastic package body to the bending point, h=0.35-0.45 mm; the specification design can ensure the supporting strength of the integrated circuit on one hand and ensure that the pins are not contacted on the other hand.
Further, preferably, the height of the supporting surface of the convex structure on the back surface basal surface is 0.3-0.4mm; this specification can ensure effective support at the four corners of the front side of the integrated circuit.
Further, preferably, the height of the positioning block with the convex structure on the back surface basal plane is H1, H1 is less than or equal to A3-0.3mm, wherein A3 is the upper plastic package height of the wide body SOP; the specification design can play a good limiting role on the integrated circuit from four corners above the integrated circuit.
Further, preferably, the tray body is provided with a plurality of criss-cross rib structures, and the rib structures are used for connecting single pockets; meanwhile, the structure can also improve the overall strength of the tray.
Further, preferably, a carrying area is further arranged at the edge of the tray body; the design of this region is more convenient for the operating personnel to get and put the tray.
Compared with the prior art, one aspect of the invention has the following beneficial effects:
(1) According to the invention, the pair of pin protection ribs and the pair of guide positioning blocks are designed on the front structure to limit the length and width directions of the plastic package body of the wide SOP, and meanwhile, the pin protection area with the gap structure is arranged, so that the contact with pins can be avoided, and then, the convex structure is designed on the back structure, so that the two trays can play a role in limiting in the height direction of the wide SOP when being used in superposition, and therefore, the structure of the wide SOP can be well protected in the testing, transportation and use processes;
(2) The invention adopts the design of the front pocket hole and the back pocket hole, which not only can reduce the weight of the tray and increase the exhaust, but also can ensure certain supporting strength;
(3) The supporting surface of the convex structure on the back surface basal plane adopts a specific height design, so that the radiating fins on the wide SOP can be prevented from being contacted, and the wide SOP can be well protected;
(4) The positioning block with the convex structure on the back surface base surface also adopts a specific height design, so that the contact with the pins can be avoided, and the safety distance between the positioning block and the pins is ensured.
Description of the drawings:
FIG. 1 is a schematic diagram of the structure of an SOP wide package integrated circuit of the present invention;
FIG. 2 is a front view of the structure of an SOP wide package integrated circuit of the present invention;
FIG. 3 is a side view of the structure of an SOP wide package integrated circuit of the present invention;
FIG. 4 is a schematic diagram of the front structure of a wide SOP series packaged integrated circuit tray according to the present invention;
FIG. 5 is an enlarged schematic view of FIG. 4A in accordance with the present invention;
FIG. 6 is a schematic diagram of the back structure of a wide SOP series packaged IC tray according to the present invention;
FIG. 7 is an enlarged schematic view of the present invention at B in FIG. 6;
FIG. 8 is a schematic cross-sectional view of a single pocket of a wide SOP series packaged integrated circuit tray of the present invention;
FIG. 9 is a schematic cross-sectional view of a single pocket of the present invention when two trays are nested for use;
FIG. 10 is a schematic cross-sectional view of a single pocket at another angle when two trays of the present invention are nested for use;
FIG. 11 is a schematic view of the backside of a wide SOP series packaged integrated circuit tray of the present invention;
FIG. 12 is a schematic view of the back side of a single pocket of the present invention in contact with a broad body SOP;
description of the drawings: 1-SOP wide package integrated circuit, 2-upper plastic package, 3-lower plastic package, 4-pin, 5-radiating fin, 6-tray body, 61-hand-carrying area, 7-front supporting surface, 8-pin protecting rib, 9-guiding positioning block, 10-front pocket hole, 11-pin protecting area, 12-back base surface, 13-positioning block, 14-supporting surface, 15-back pocket hole, 16-rib structure, 17-height limiting block and 18-pocket.
The specific embodiment is as follows:
the following detailed description of specific embodiments of the invention is, but it should be understood that the invention is not limited to specific embodiments.
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
Examples:
as shown in fig. 1-3, the structure of the SOP wide package integrated circuit 1 includes an upper plastic package body 2, a lower plastic package body 3, and uniformly arranged pins 4 at two sides of the middle of the upper plastic package body 2 and the lower plastic package body 3, and a heat sink 5 is further disposed on the upper plastic package body 2.
As shown in fig. 4-8, the embodiment provides a broad SOP series packaged integrated circuit tray, which comprises a tray body 6, wherein a plurality of pockets 18 are formed on the tray body 6, the pockets 18 are arranged in a matrix, and the pockets 18 have a front structure and a back structure;
the front structure comprises a front supporting surface 7, a front pocket hole 10 is formed in the front supporting surface 7, a pair of pin protection ribs 8 and a pair of guide positioning blocks 9 are arranged on the front supporting surface 7, a pin protection area 11 is arranged between the pin protection ribs 8 and the inner walls of the pockets, the pin protection area 11 is of a gap structure, and the guide positioning blocks 9 are used for positioning non-pin surfaces of the integrated circuit 1.
When loading the structure of the SOP wide package integrated circuit 1, the pair of pin protection ribs 8 on the front support surface 7 are used for limiting the movement of the structure of the SOP wide package integrated circuit 1 in the X direction on the front support surface 7, the pair of guide positioning blocks 9 are used for limiting the movement of the structure of the SOP wide package integrated circuit 1 in the Y direction on the front support surface 7, and the design of the structural size of the pin protection ribs 8 can also ensure that the structure of the SOP wide package integrated circuit 1 is not contacted with pins when the front support surface 7 moves.
The back structure comprises a back base surface 12, the four corners of the back base surface 12 are respectively provided with a protruding structure, the protruding structure is provided with a supporting surface 14 and a positioning block 13 surrounding the supporting surface 14, the positioning block 13 is of an L-shaped structure, the back base surface 12 is also provided with a back pocket hole 15, and the back pocket hole 15 and the front pocket hole 10 form a pocket hole together.
As shown in fig. 9 and 10, the supporting surface 14 of the back structure is used for limiting the height of the structure of the SOP wide package integrated circuit 1 when the two layers of tray bodies 6 are nested, and can also be used as a support when the back of the structure of the SOP wide package integrated circuit 1 needs to be used upwards, because the convex structure is designed on four corners of the back base surface 12, the structure can avoid the cooling fins 5 of the structure of the SOP wide package integrated circuit 1 when the tray bodies are nested, and the L-shaped positioning blocks 13 can limit the four corners of the structure of the SOP wide package integrated circuit 1 from above.
The purpose of adopting the back pocket hole 15 and the front pocket hole 10 to jointly form the pocket hole is to lighten the weight of the tray body 6, and in order to prevent the accuracy of characteristic dimension from being influenced by thermal shrinkage during molding, a sectional design is adopted on a die during the processing of the pocket hole structure, and a sectional die line is selected in the middle of the pocket hole, so that the die dividing defects and burrs are concentrated at the sectional positions, and the sectional positions are far away from the structure of the SOP wide package integrated circuit 1, thereby being more beneficial to smooth demolding of the tray body 6.
When the SOP wide-body packaging integrated circuit 1 is used, a plurality of tray bodies 6 are needed to be stacked for use, and after the tray bodies 6 are stacked, the back surface structure of the first layer of tray bodies 6 and the front surface structure of the second layer of tray bodies 6 jointly form a cavity of the structure of the SOP wide-body packaging integrated circuit 1; the front support surface 7 of the first-layer tray body 6 and the support surface 14 of the back structure of the second-layer tray body 6 limit the displacement of the SOP wide-body packaged integrated circuit 1 in the structure thickness direction together; the pair of pin protection ribs 8 and the pair of guide positioning blocks 9 on the front surface of the first-layer tray body 6 limit the displacement in the length and width directions of the structure of the SOP wide-body packaged integrated circuit 1 together, and the positioning blocks 13 on the back surface of the second-layer tray body 6 limit the displacement in the four corners of the structure of the SOP wide-body packaged integrated circuit 1, and meanwhile, the design of the pin protection area 11 avoids contact with pins.
In this embodiment, the face of the guide block 9 of the frontal structure is of a bevel configuration, the slope of which is 10 ° -20 °, more preferably 15 ° -20 °; the surface of the pin protection rib 8 facing the center of the front support surface 7 is also in an inclined surface structure, and the inclination of the inclined surface is 7-12 degrees; this angle is on the one hand more convenient for injection moulding and on the other hand also more convenient for supporting the structure of the SOP wide package integrated circuit 1.
In this embodiment, the inner wall of the pocket is also a large inclined surface structure on the side of the pin protection rib 8, the inclination is about 10 ° -15 °, and the inclined surface extends from the mouth of the pocket to the back surface 12 of the back surface structure, so that a sufficient space can be ensured to accommodate the pin 4.
As shown in fig. 11, in this embodiment, the tray body 6 is further provided with criss-cross rib structures 16, and the rib structures 16 are used to connect the single pockets 18, and can also improve the strength of the tray body 6 and improve the torsion and warpage of the tray body 6.
In this embodiment, a plurality of height limiting blocks 17 are uniformly arranged on the back of the tray body 6, when the two tray bodies 6 are nested with each other, the height limiting block 17 on the back of the first tray body 6 is 0.1mm away from the edge of the second tray body 6, when the front of the first tray body 6 is stressed, the height limiting block 17 on the back of the first tray body contacts with the front edge of the second tray body 6, so that the buffer effect of force is achieved, and the force can be prevented from directly acting on the structure of the SOP (self-supporting package) integrated circuit 1, so that the SOP (self-supporting package) has a better protection effect.
In the present embodiment, the distance between the pair of guide positioning blocks 9 is S, s=d+2×0.2mm, where D is the length of the plastic package body of the wide body SOP; the width of the pin protection rib is W, the height is H, W= (L) 1 -L)/2, and W.gtoreq.0.2 mm, minimum formed dimension of the material at 0.2mm, wherein L 1 L is the length of the pin from the plastic package body to the bending part, H=0.35-0.45 mm, H is less than or equal to (A2-A3)/2, wherein A2 is the total thickness of the plastic package body of the SOP wide body, and A3 is the thickness of the upper plastic package body; the special specification design can ensure the convenience of the structural support of the SOP wide package integrated circuit 1, can not too tightly clamp the SOP wide, and can also ensure that the pins 4 are not touched.
In this embodiment, the height of the positioning block 13 with the protruding structure on the back base surface 12 is H1,0.35mm is equal to or less than H1 is equal to or less than A3-0.3mm, wherein A3 is the upper molding height of the wide body SOP, 0.35mm is the minimum rib height required by the design specification, and 0.3mm is the tolerance accumulation for eliminating the molding of the mold, so that the pin 4 can be prevented from being touched by the positioning block 13, the positioning block 13 adopts an L-shaped design, and thus, the four corners of the molding body of the SOP wide body can be wrapped.
As shown in fig. 12, in the present embodiment, the supporting surface 14 of the convex structure of the back surface base surface 12 is designed as a facet of 1.0mm×1.4mm, so that the structural heat sink 5 of the SOP wide package integrated circuit 1 can be avoided, and damage to the heat sink 5 is avoided.
In this embodiment, a hand-held area 61 is also designed at the edge of the tray body 6, which is more convenient for the operator to extract the tray.
According to the invention, the pair of pin protection ribs and the pair of guide positioning blocks are designed on the front structure to limit the length and width directions of the plastic package body of the wide SOP, and meanwhile, the pin protection area with the gap structure is arranged, so that the contact with pins can be avoided, and then, the convex structure is designed on the back structure, so that the two trays can play a role in limiting in the height direction of the wide SOP when being used in superposition, and therefore, the structure of the wide SOP can be well protected in the testing, transportation and use processes; the design of the front pocket hole and the back pocket hole is adopted, so that the functions of reducing the weight of the tray and increasing the exhaust are achieved, and certain supporting strength is ensured; the supporting surface of the convex structure on the back surface basal plane adopts a specific height design, so that the radiating fins on the wide SOP can be prevented from being contacted, and the wide SOP can be well protected; the positioning block with the convex structure on the back surface base surface also adopts a specific height design, so that the contact with the pins can be avoided, and the safety distance between the positioning block and the pins is ensured.
The foregoing descriptions of specific exemplary embodiments of the present invention are presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application to thereby enable one skilled in the art to make and utilize the invention in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.

Claims (10)

1. A wide SOP series packaging integrated circuit tray is characterized in that: the tray comprises a tray body, wherein a plurality of pockets are formed in the tray body, and each pocket has a front structure and a back structure;
the front structure comprises a front supporting surface, a front pocket hole is formed in the front supporting surface, a pair of pin protection ribs and a pair of guide positioning blocks are arranged on the front supporting surface, a pin protection area is arranged between the pin protection ribs and the inner wall of the pocket, the pin protection area is of a gap structure, and the guide positioning blocks are used for positioning a non-pin surface of the integrated circuit;
the back structure comprises a back base surface, a protruding structure is arranged on the back base surface, the protruding structure is provided with a supporting surface and a positioning block surrounding the supporting surface, a back pocket hole is further formed in the back base surface, and the back pocket hole and the front pocket hole form a pocket hole together.
2. The broad SOP series packaged integrated circuit tray as defined in claim 1, wherein: the pockets are arranged in a matrix.
3. The broad SOP series packaged integrated circuit tray as defined in claim 1, wherein: the guide positioning block is of an inclined surface structure, and the inclination of the inclined surface is 10-20 degrees.
4. The broad SOP series packaged integrated circuit tray as defined in claim 1, wherein: the pin protection rib is also of an inclined surface structure on one surface facing the center of the front support surface, and the inclination of the inclined surface is 7-12 degrees.
5. The broad SOP series packaged integrated circuit tray as defined in claim 1, wherein: the distance between the pair of guide positioning blocks is S, s=d+2×0.2mm, wherein D is the length of the plastic package body of the wide body SOP.
6. The broad SOP series packaged integrated circuit tray as defined in claim 1, wherein: the width of the pin protection rib is W, the height is H, and W= (L) 1 L)/2, and W.gtoreq.0.2 mm, wherein L 1 L is the length of the pin from the plastic package to the bend, h=0.35-0.45 mm.
7. The broad SOP series packaged integrated circuit tray as defined in claim 1, wherein: the height of the supporting surface of the convex structure on the back surface basal plane is 0.3-0.4mm.
8. The broad SOP series packaged integrated circuit tray as defined in claim 1, wherein: the height of the positioning block with the protruding structure on the back surface basal plane is H1, H1 is less than or equal to A3-0.3mm, wherein A3 is the upper plastic package height of the wide SOP.
9. The broad SOP series packaged integrated circuit tray as defined in claim 1, wherein: the tray body is provided with a plurality of crisscross rib structures, and the rib structures are used for connecting single pockets.
10. The broad SOP series packaged integrated circuit tray as defined in claim 1, wherein: the edge of the tray body is also provided with a hand-carrying area.
CN202311765210.5A 2023-12-21 2023-12-21 Wide SOP series packaging integrated circuit tray Pending CN117508855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311765210.5A CN117508855A (en) 2023-12-21 2023-12-21 Wide SOP series packaging integrated circuit tray

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311765210.5A CN117508855A (en) 2023-12-21 2023-12-21 Wide SOP series packaging integrated circuit tray

Publications (1)

Publication Number Publication Date
CN117508855A true CN117508855A (en) 2024-02-06

Family

ID=89744067

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311765210.5A Pending CN117508855A (en) 2023-12-21 2023-12-21 Wide SOP series packaging integrated circuit tray

Country Status (1)

Country Link
CN (1) CN117508855A (en)

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