CN117501430A - 一种电容、集成电路、射频电路以及电子设备 - Google Patents

一种电容、集成电路、射频电路以及电子设备 Download PDF

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Publication number
CN117501430A
CN117501430A CN202180099523.4A CN202180099523A CN117501430A CN 117501430 A CN117501430 A CN 117501430A CN 202180099523 A CN202180099523 A CN 202180099523A CN 117501430 A CN117501430 A CN 117501430A
Authority
CN
China
Prior art keywords
electrode
capacitor
semiconductor substrate
finger
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180099523.4A
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English (en)
Chinese (zh)
Inventor
王邦麟
王生荣
童庆强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN117501430A publication Critical patent/CN117501430A/zh
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN202180099523.4A 2021-06-25 2021-06-25 一种电容、集成电路、射频电路以及电子设备 Pending CN117501430A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/102445 WO2022267025A1 (fr) 2021-06-25 2021-06-25 Condensateur, circuit intégré, circuit à radiofréquence et dispositif électronique

Publications (1)

Publication Number Publication Date
CN117501430A true CN117501430A (zh) 2024-02-02

Family

ID=84545085

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180099523.4A Pending CN117501430A (zh) 2021-06-25 2021-06-25 一种电容、集成电路、射频电路以及电子设备

Country Status (2)

Country Link
CN (1) CN117501430A (fr)
WO (1) WO2022267025A1 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4883780B2 (ja) * 2006-11-14 2012-02-22 ルネサスエレクトロニクス株式会社 チャージポンプ回路
CN105632889A (zh) * 2014-11-04 2016-06-01 北大方正集团有限公司 电容的制作方法、电容和电容组件
CN106411136A (zh) * 2016-08-25 2017-02-15 浙江大学 一种隔离型功率变换器基于高压电容耦合的控制芯片

Also Published As

Publication number Publication date
WO2022267025A1 (fr) 2022-12-29

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