CN117501099A - Compact type material analyzer - Google Patents

Abstract

Aspects relate to a compact material analyzer that includes a light source, a detector, and a module including a first optical window on a first face of the module, a second optical window on a second face of the module opposite the first face, and a light modulator. The light source generates high power input light that is passed through the first optical window to the light modulator. The light modulator is configured to attenuate the input light, generate modulated light based on the input light, and direct the modulated light through the second optical window to the sample. The modulated light produced by the light modulator is safe for the sample at a lower power. The detector is configured to pass output light from the sample resulting from interaction with the modulated light through the second optical window and to detect a spectrum of the output light.

Description

Compact type material analyzer

Cross Reference to Related Applications

The present application claims priority and benefit from non-provisional application No. 17,590,781 filed on 1 month 2022 to the U.S. patent and trademark office and provisional application No. 63/144,843 filed on 2 month 2021 to the U.S. patent and trademark office, the entire contents of which are incorporated herein by reference as if fully set forth below for all purposes of applicability.

Technical Field

The techniques discussed below relate generally to compact integrated modulated optical material analyzers, and in particular to mechanisms for avoiding physical proximity between a light source and a sample under test.

Background

Compact material analyzers, such as compact spectrometers, have been developed that enable modulated light to interact with a sample under test and then the resulting scattered light can be analyzed. One example of a compact spectrometer includes a Complementary Metal Oxide Semiconductor (CMOS) image sensor chip, and a glass wiring board with a convex lens and a reflective diffraction grating. Deep etching techniques may be used to form the entrance slit on the CMOS sensor chip, while nanoimprint techniques may be used to form the reflective diffraction grating. The input light is directed into the slit and then diffracted by the grating. The separated wavelengths are then incident on a CMOS linear image sensor array. Each pixel in the sensor may receive light of a particular wavelength. For example, the spectrometer may operate in the wavelength range of 340nm-780nm, limited by the use of CMOS linear image sensors. By replacing the glass lens with a grating chip, a more compact version can be produced. In both cases, it would be costly to extend this concept to the Infrared (IR) range due to the need for a detector array. Furthermore, the sensor directly depends on the light from the sample, so the sensor does not contain a light source.

Another example of a compact spectrometer operating in the Near Infrared (NIR) has been developed based on microelectromechanical systems (MEMS) Fabry-Perot interferometers. The Fabry-Perot interferometer may be used as a tunable filter. The filter is followed by an InGaAs PIN photodiode and a wiring board. An air gap in the interferometer can control the transmission response and allow certain wavelengths to pass through. In this device a single IR detector is used, but the wavelength range (e.g. 1550-1850 nm) is limited by the free spectral range of the tunable filter and the multilayer structure of the filter mirror. There is also a trade-off between wavelength range and spectral resolution. Furthermore, the light source is not part of the sensor, since the spectrometer relies on the reception of light from the sample.

Other miniaturization efforts have also been performed. For example, the photodetector may be a MEMS-based IR detector, wherein light incident on the IR absorbing layer generates a temperature rise and causes a vertical displacement, which can be sensed by a change in capacitance. Furthermore, an integrated die-level optical interferometer system comprising a thin layer of silicon has been developed, in which electronic devices, photodetectors, light sources and movable devices are fabricated.

Furthermore, an integrated device comprising a MEMS interferometer and a light redirecting structure has been developed. The light source may be integrated on the light redirecting structure and oriented to emit the input light beam directly towards the first mirror of the light redirecting structure to direct the light towards the MEMS interferometer. The output beam from the MEMS interferometer may then be redirected by a second mirror of the light redirecting structure to a Sample Under Test (SUT). Light transmitted and/or reflected from the SUT may then be optically coupled into the detector. However, the light source may cause heating of the SUT due to physical proximity and may cause heating of the light redirecting structure in physical proximity to the detector, thereby increasing the temperature of the detector.

Disclosure of Invention

One or more aspects of the disclosure are summarized below to provide a basic understanding of these aspects. This summary is not an extensive overview of all contemplated features of the disclosure, and is intended to neither identify key or critical elements of all aspects of the disclosure nor delineate the scope of any or all aspects of the disclosure. Its sole purpose is to present some concepts of one or more aspects of the disclosure as a prelude to the more detailed description that is presented later.

In one example, a compact material analyzer device is disclosed. The compact material analyzer device includes a light source configured to generate input light, and a module including a first optical window on a first face of the module, a second optical window on a second face of the module opposite the first face, and a light modulator. The light modulator is configured to receive input light from the light source through the first optical window, attenuate the input light, and generate modulated light based on the input light. The light modulator is further configured to direct modulated light through the second optical window to the sample. The compact material analyzer device further comprises a detector configured to receive the output light from the sample resulting from the interaction with the modulated light through the second optical window and to detect a spectrum of the output light.

These and other aspects of the invention will be more fully understood after review of the following detailed description. Other aspects, features and embodiments of the present invention will become apparent to those ordinarily skilled in the art upon review of the following description of specific exemplary embodiments of the invention in conjunction with the accompanying figures. While features of the invention may be discussed with respect to certain embodiments and figures below, all embodiments of the invention may include one or more of the advantageous features discussed herein. In other words, while one or more embodiments may be discussed as having certain advantageous features, one or more of such features may also be used in accordance with the various embodiments of the invention discussed herein. In a similar manner, while exemplary embodiments may be discussed below as device, system, or method embodiments, it should be understood that such exemplary embodiments may be implemented in a variety of devices, systems, and methods.

Drawings

Fig. 1 is a diagram illustrating a spectrometer according to some aspects.

Fig. 2 is a diagram illustrating an example of a compact material analyzer device according to some aspects.

Fig. 3 is a diagram illustrating an example of a compact-type material analyzer device including an optical concentrating element, according to some aspects.

Fig. 4 is a diagram illustrating an example of a distributed arrangement of compact material analyzer devices according to some aspects.

Fig. 5 is a diagram illustrating an example of a compact-type material analyzer device including light redirecting optical elements, according to some aspects.

Fig. 6 is a diagram illustrating an example of a distributed arrangement of compact type material analyzer devices including light redirecting optical elements, according to some aspects.

Fig. 7 is a diagram illustrating another example of a compact-type material analyzer device including light redirecting optics in accordance with some aspects.

Fig. 8 is a diagram illustrating another example of a compact-type material analyzer device including light redirecting optics in accordance with some aspects.

Fig. 9 is a diagram illustrating another example of a compact-type material analyzer device including light redirecting optics in accordance with some aspects.

Fig. 10A and 10B are diagrams illustrating examples of optical concentrating elements according to some aspects.

Fig. 11A is a diagram illustrating an example of a light detection unit including a plurality of detectors according to some aspects.

Fig. 11B and 11C are diagrams illustrating detection at different spatial locations of a sample using multiple detectors, according to some aspects.

Fig. 12A and 12B are diagrams illustrating example configurations of light modulation modules of a compact material analyzer device according to some aspects.

Fig. 13 is a diagram illustrating an example of a compact-type material analyzer device integrated with other components, according to some aspects.

Fig. 14 is a diagram illustrating an example of a stacked configuration of a compact material analyzer device according to some aspects.

Fig. 15 is a diagram illustrating another example of a stacked configuration of a compact material analyzer device according to some aspects.

Fig. 16 is a diagram illustrating an example of a compact material analyzer device including multiple light modulation mechanisms according to some aspects.

Fig. 17A and 17B are diagrams illustrating another example of a compact material analyzer device including a plurality of light modulation mechanisms according to some aspects.

Fig. 18A and 18B are diagrams illustrating another example of a compact material analyzer device including a mach-zehnder interferometer according to some aspects.

Fig. 19 is a diagram illustrating an example of a compact-type material analyzer device including an integrated light source, according to some aspects.

Fig. 20 is a diagram illustrating another example of a compact-type material analyzer device including an integrated light source, according to some aspects.

Fig. 21 is a diagram illustrating another example of a compact-type material analyzer device including an integrated light source, according to some aspects.

Fig. 22A and 22B are diagrams illustrating examples of optical coupling devices according to some aspects.

23A-23C are diagrams illustrating examples of compact-type material analyzer devices including optical coupling devices and optical modulators, according to some aspects.

Fig. 24 is a diagram illustrating another example of a compact-type material analyzer device including an optical coupling device and an optical modulator, according to some aspects.

Fig. 25 is a diagram illustrating an example of a compact material analyzer device including an optical waveguide according to some aspects.

Fig. 26 is a diagram illustrating an example of an optical waveguide according to some aspects.

Fig. 27 is a diagram illustrating an example of an optical waveguide according to some aspects.

Fig. 28A-28C are diagrams illustrating examples of integrated material analyzer devices using a frame according to some aspects.

Fig. 29A-29C are diagrams illustrating examples of integrated material analyzer devices using metal substrates according to some aspects.

Detailed Description

The detailed description set forth below in connection with the appended drawings is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein may be practiced. The detailed description includes specific details for the purpose of providing a thorough understanding of the various concepts. It will be apparent, however, to one skilled in the art that these concepts may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring such concepts.

Aspects of the present disclosure relate to a compact material analyzer that includes a light source, a light modulator, and a detector. The light source generates high power electromagnetic radiation (e.g., input light) that first passes through the light modulator before illuminating the sample under test to avoid damaging the sample. For example, the sample may be a biological sample, such as a skin sample, wherein the analysis is performed in vitro or in vivo. The modulated light produced by the light modulator is at a lower power that is safely incident on the sample. The power attenuation by the light modulator may be in the form of an absorption of electromagnetic radiation to convert the electromagnetic radiation into thermal energy, which may be dissipated without damaging the sample. The reduction in power may also be in the form of a selection of certain wavelengths to be transmitted and directed to the sample. The reduction in power may also be in the form of diffraction losses or optical throughput (etendue) losses in the optical modulator.

The modulated light interacts with the sample and the resulting output light can be detected by a detector and then analyzed. In some examples, the analysis may be based on spectroscopic techniques such as direct absorption spectroscopy, indirect absorption spectroscopy (e.g., photoacoustic spectroscopy), photothermal spectroscopy, or Raman (Raman) spectroscopy. In some examples, the light modulator may include a spectrometer, such as a Michelson (Michelson) interferometer or a Fabry-Perot cavity, a diffraction grating, a spatial light modulator, or a birefringent device. In some examples, the light modulator may be implemented on a light modulation chip, such as an optical microelectromechanical system (MEMS) device.

Fig. 1 is a diagram illustrating a spectrometer 100 according to some aspects. The spectrometer 100 may be, for example, a Fourier Transform Infrared (FTIR) spectrometer. In the example shown in fig. 1, the spectrometer 100 is a michelson FTIR interferometer. In other examples, the spectrometer may include an FTIR fabry-perot interferometer.

FTIR spectroscopy measures a single beam spectrum (power spectral density (PSD)), where the intensity of the single beam spectrum is proportional to the radiation power reaching the detector. To measure the absorbance of a sample, the background spectrum (i.e., single Shu Guangpu in the absence of a sample) may be measured first to compensate for the instrument transfer function. The single beam spectrum of light transmitted or reflected from the sample can then be measured. The absorbance of a sample may be calculated from the transmittance, reflectance, or transmittance-reflectance of the sample. For example, the absorbance of a sample may be calculated as the ratio of the spectrum of transmitted, reflected or transmitted reflected light from the sample to the background spectrum.

Interferometer 100 includes fixed mirror 104, movable mirror 106, beam splitter 110, and detector 112 (e.g., a photodetector). Light source 102 associated with spectrometer 100 is configured to emit an input light beam and direct the input light beam toward beam splitter 110. The light source 102 may comprise, for example, a laser source, one or more broadband thermal radiation sources, or a quantum source having an array of light emitting devices covering a wavelength range of interest.

Beam splitter 110 is configured to split an input beam into two beams. One beam is reflected from fixed mirror 104 back to beam splitter 110, while the other beam is reflected from movable mirror 106 back to beam splitter 110. The movable mirror 106 may be coupled to an actuator 108 to displace the movable mirror 106 to a desired position for reflecting the light beam. An optical path length difference (OPD) is then created between the reflected beams, which OPD is substantially equal to twice the displacement of the mirror 106. In some examples, the actuator 108 may include a microelectromechanical system (MEMS) actuator, a thermal actuator, or other type of actuator.

The reflected light beams interfere at beam splitter 110 to produce modulated light (e.g., an interference pattern) allowing the temporal coherence of the light to be measured at each of the different Optical Path Differences (OPDs) provided by movable mirror 106. The signal corresponding to the modulated light may be directed to a sample (not shown) and the output light (scattered light) from the sample may be detected and measured by detector 112 at a number of discrete positions of movable mirror 106 to produce an interference pattern. In some examples, detector 112 may include a detector array or a single pixel detector. The interferogram data relative to the OPD may then be input to a processor (not shown for simplicity). The spectrum may then be retrieved, for example, using a fourier transform performed by the processor.

In some examples, interferometer 100 can be implemented as a MEMS interferometer 100a (e.g., a MEMS chip). MEMS chip 100a may then be attached to a Printed Circuit Board (PCB) 116, PCB 116 may include, for example, one or more processors, memory devices, buses, and/or other components. As used herein, the term MEMS refers to the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through micro-fabrication techniques. For example, microelectronic devices are typically fabricated using Integrated Circuit (IC) processes, while micromechanical components are fabricated using compatible micromachining processes that selectively etch away parts of silicon wafers or add new structural layers to form mechanical and electromechanical components. One example of a MEMS element is a micro-optical component having a dielectric or metallized surface that operates in either a reflective or refractive mode. Other examples of MEMS elements include actuators, detector grooves, and fiber grooves.

In the example shown in fig. 1, MEMS interferometer 100a may include a fixed mirror 104, a movable mirror 106, a beam splitter 110, and a MEMS actuator 108 for movably controlling movable mirror 106. In addition, MEMS interferometer 100a may include an optical fiber 114 for directing the input beam toward beam splitter 110 and directing the output beam from the beam splitter toward a detector (e.g., detector 112). In some examples, MEMS interferometer 100a may be fabricated on a silicon-on-insulator (SOI) wafer using a Deep Reactive Ion Etching (DRIE) process to create micro-optical components and other MEMS elements capable of processing free-space beams propagating parallel to the SOI substrate. For example, the electromechanical design may be printed on a mask, and the mask may be used to pattern the design on a silicon or SOI wafer by photolithography. The pattern may then be etched using batch processing (e.g., by DRIE), and the resulting chip (e.g., MEMS chip 100 a) may be diced and packaged (e.g., attached to PCB 116).

For example, beam splitter 110 may be a silicon/air interface beam splitter (e.g., a half-plane beam splitter) that is at an angle (e.g., 45 degrees) to the input beam. The input beam may then be split into two beams LI and L2, where LI propagates in air towards the movable mirror 106 and L2 propagates in silicon towards the fixed mirror 104. Here, LI originates from the partial reflection of the input beam by half-plane beam splitter 110, so L1 has a reflection angle equal to the beam incident angle. L2 originates from the partial transmission of the input beam through half-plane beam splitter 110, and L2 propagates in silicon at an angle determined by Snell's Law. In some examples, fixed mirror 104 and movable mirror 106 are metal mirrors, with selective metallization (e.g., using shadow masks during the metallization step) used to protect beam splitter 110. In other examples, mirrors 104 and 106 are vertical Bragg mirrors that may be implemented using, for example, DRIE.

In some examples, MEMS actuator 108 may be an electrostatic actuator formed of a comb drive and springs. For example, by applying a voltage to the comb drive, a potential difference is generated across actuator 108 that induces a capacitance in actuator 108, thereby generating a driving force and a restoring force from a spring, thereby displacing movable mirror 106 to a desired position to reflect the light beam back to beam splitter 110.

In various aspects of the present disclosure, the spectrometer 100 shown in fig. 1 or other suitable light modulator may be incorporated into a compact-type material analyzer. Fig. 2 is a diagram illustrating an example of a compact type material analysis device 200 according to some aspects. Compact-type material analysis device 200 includes a module 202 (such as a package, die, or assembly), and a light source 216. The module includes an optical modulator 204, a detector 206, a first optical window 208, and a second optical window 210. The light modulator 204 may include, for example, a spectrometer (e.g., as shown in fig. 1), a diffraction grating, a spatial light modulator, a birefringent device, or other suitable device configured to modulate light. For example, light modulator 204 may comprise a MEMS chip. In some examples, the detector 206 may be external to the module 202.

The first optical window 208 is positioned on a first face 212 of the module 202 and the second optical window 210 is positioned on a second face 214 of the module 202 opposite the first face 212. The optical windows 208 and 210 may be, for example, glass, sapphire, ceramic, diamond, fused silica, quartz, pyrex, silicon, barium fluoride, calcium fluoride, germanium, zinc selenide, and/or plastic optical windows. In some examples, the first optical window 208 may be positioned over an aperture in the module 202. The aperture size and shape may be selected to control and minimize stray light.

The light source 216 is configured to generate input light 220. The input light 220 is directed through a first optical window 208 in the module 202 to the light modulator 204. In some examples, the input light 220 may be directed through the first optical window 208 to the light modulator 204 using one or more optical elements (such as reflectors and/or lenses). The light modulator 204 is configured to attenuate the input light 220 and generate modulated light 222 (e.g., an interference pattern) based on the input light 220, and the light modulator 204 directs the modulated light through the second optical window 210 to the sample under test 218. The modulated light 222 is attenuated in power relative to the input light 220 by an amount of attenuation to a level (e.g., power) that is safe for illumination of the sample 218 (e.g., a power level that will prevent damage to the sample 218 due to absorption of the modulated light 222 by the sample 218). In addition, the light source 216 is adjacent to the first optical window 208 on the first side 212 of the module 202 and the sample 218 is adjacent to the second optical window 210 on the second side 214 of the module 202 to prevent the sample 218 from being heated by the light source 216. For example, the light source 216 may be blackbody radiation-based, and thus, the temperature of the light source 216 may be high to produce sufficient radiation power.

In the example shown in fig. 2, the small form factor analyzer 200 operates in a reflective mode. Thus, the modulated light 222 interacts with the sample 218 and the resulting scattered reflected light (e.g., output light 224) from the sample 218 is directed back through the second optical window 210 to the detector 206. In other examples, the output light 224 from the sample 218 may be received by the detector 206 in either a transmissive mode or a transflective mode while accounting for diffusion.

In some examples, the detector 206 may be a photodetector having a diameter of about 200-300 μm. Due to the small size of the detector 206, all of the scattered output light 224 from the sample 218 may not reach the detector 206, limiting analysis of the sample 218. Thus, in various aspects, the compact material analyzer device 200 can also include a light collection mechanism, such as an optical concentrating element.

Fig. 3 is a diagram illustrating an example of a compact-type material analyzer device 300 including an optical concentrating element 314, according to some aspects. Compact type material analyzer device 300 includes a first module 302 and a second module 304. Each module 302 and 304 may be a package, die, or component. The first module 302 includes a light modulator 328, a detector 310, a first optical window 306, a second optical window 308, and an optical concentrator element 314. The second module 304 includes a light source 316.

The first module 302 further includes a first substrate 312, the first substrate 312 having a first surface 330 and a second surface 332 opposite the first surface 330. The first substrate 312 is positioned on a first side of the first module 302 and the second optical window 308 is positioned on a second side of the first module 302. The light modulator 328, detector 310, and optical condensing element 314 are positioned on a first surface of the first substrate 312. The first optical window 306 is positioned on a second surface 332 of the first substrate 312, and the first optical window 306 is configured to cover an opening (e.g., a hole or aperture) 334 in the first substrate 312. The second module 304 also includes a second substrate 318, the second substrate 318 having a light source 316 positioned on the second substrate 318.

The light source 316 is configured to generate input light 322. The input light 322 is directed through the first optical window 306 in the first module 302 to the light modulator 328. The light modulator 328 is configured to attenuate the input light 322 and generate modulated light 324 based on the input light 322. The light modulator 328 is also configured to direct modulated light 324 through the second optical window 308 to the sample 320 under test. The modulated light 324 interacts with the sample 320 and the resulting scattered reflected light (e.g., output light 326) from the sample 320 is directed back into the first module 302 through the second optical window 308. The optical condensing element 314 is a non-imaging component configured to collect scattered light (e.g., output light 326) and direct the output light 326 into the detector 310. In some examples, the optical concentrating element 314 serves as a ground shield between the detector 310 and the optical modulator 328.

Fig. 4 is a diagram illustrating an example of a distributed arrangement of compact material analyzer devices 400 according to some aspects. In the example shown in fig. 4, compact material analyzer device 400 includes a light modulation module 402, a source module 404, and a light detection module 406. Each module 402, 404, and 406 may be a package, die, or component. The light modulation module 402 includes a light modulator 408, a first optical window 410, and a second optical window 412. The source module 404 includes a light source 416. The light detection module 406 includes a detector 420 and an optical concentrating element 422. As shown in fig. 4, by isolating the detector 420 in a separate module, the detector 420 may be protected from thermal intrusion in the light modulation module 402. Furthermore, a cooling element (not shown) may be further integrated with the detector 420.

The light modulation module 402 also includes a first substrate 414 positioned on a first side of the light modulation module 402, while a second optical window 412 is positioned on a second side of the light modulation module 402. The light modulator 408 is positioned on a first surface of the first substrate 414 opposite the second optical window 412. The first optical window 410 is positioned on a second surface of the first substrate 414. The first optical window 410 further covers an opening (e.g., a hole or aperture) in the first substrate 414.

The light source module 404 includes a second substrate 418, the second substrate 418 having a light source 416 positioned thereon. The light detection module 406 includes a third substrate 424 on a first side of the light detection module 406 and a third optical window 426 on a second side of the light detection module 406. The detector 420 and the optical concentrating element 422 are positioned on a third substrate 424 opposite a third optical window 426.

The light source 416 is configured to generate input light 430. The input light 430 is directed through a first optical window 410 in the light modulation module 402 to the light modulator 408. The light modulator 408 is configured to attenuate the input light 430 and generate modulated light 432 based on the input light 430. The light modulator 408 is also configured to direct modulated light 432 through the second optical window 412 to the sample under test 428.

In the example shown in fig. 4, the compact type material analyzer 400 operates in a transmission mode. Thus, modulated light 432 interacts with sample 428 and the resulting scattered transmitted light (e.g., output light 434) from sample 428 is directed through third optical window 426 into light detection module 406. The optical concentrating element 422 is configured to collect scattered light (e.g., output light 434) and direct the output light 434 into the detector 420.

Fig. 5 is a diagram illustrating an example of a compact-type material analyzer device 500 including light redirecting optics in accordance with some aspects. Compact material analyzer device 500 includes a first module 502 and a second module 504. Each module 502 and 504 may be a package, die, or assembly. First module 502 includes optical modulator 506, detector 512, first optical window 508, second optical window 510, and optical concentrating element 514. The second module 504 includes a light source 518.

The first module 502 also includes a first substrate 516 positioned on a first side of the first module 502, while the second optical window 510 is positioned on a second side of the first module 502. Light modulator 506, detector 512, and optical concentrating element 514 are positioned on a first surface of first substrate 516. The first optical window 508 is positioned on a second surface of the first substrate 516, and the first optical window 508 is configured to cover an opening (e.g., a hole or aperture) in the first substrate 516. In addition, the first module 502 also includes a first optical element 524, such as a first reflector, and a second optical element 526, such as a second reflector. Reflectors 524 and 526 are configured to change the optical axis direction of the light. Each of reflectors 524 and 526 has a surface profile configured to maximize optical coupling efficiency. Reflectors 524 and 526 may be, for example, free-form optics, and may be molded for mass production. The second module 504 also includes a second substrate 520, the second substrate 520 having light sources 518 positioned on the second substrate 520.

The light source 518 is configured to generate input light 528. The input light 528 is directed through the first optical window 508 in the first module 502 to the first reflector 524. First reflector 524 redirects input light 528 toward optical modulator 506. Accordingly, first reflector 524 changes the optical axis direction of input light 528 from an out-of-plane direction relative to the plane of first substrate 516 to an in-plane direction relative to the plane of first substrate 516, which corresponds to the optical axis of light modulator 506. Optical modulator 506 is configured to attenuate input light 528 and generate modulated light 530 based on input light 530. Optical modulator 506 is also configured to direct modulated light 530 to second reflector 526. The second reflector 526 redirects the modulated light 540 to the sample 522 under test. Thus, the modulated light 530 reflected from the second reflector 526 is directed through the second optical window 510 to the sample 522.

The modulated light 530 interacts with the sample 522 and the resulting scattered reflected light (e.g., output light 532) from the sample 522 is directed back into the first module 502 through the second optical window 510. The optical concentrating element 514 is configured to collect scattered light (e.g., output light 532) and direct output light 534 into the detector 512.

Fig. 6 is a diagram illustrating an example of a distributed arrangement of a compact material analysis device 600 including light redirecting optical elements in accordance with some aspects. In the example shown in fig. 6, the compact material analyzer device 600 includes a light modulation module 602, a source module 604, and a light detection module 606. Each module 602, 604, and 606 may be a package, die, or component. The light modulation module 602 includes a light modulator 608, a first optical window 610, and a second optical window 612. The source module 604 includes a light source 616. The light detection module 606 includes a detector 620. As shown in fig. 6, by isolating the detector 620 in a separate module, the detector 620 may be protected from thermal intrusion in the light modulation module 602. Furthermore, a cooling element (not shown) may be further integrated with the detector 620.

The light modulation module 602 also includes a first substrate 614 positioned on a first side of the light modulation module 602, while a second optical window 612 is positioned on a second side of the light modulation module 602. Light modulator 608 is positioned on a first surface of first substrate 614 opposite second optical window 612. The first optical window 610 is positioned on a second surface of the first substrate 614. The first optical window 610 further covers an opening (e.g., a hole or aperture) in the first substrate 614. In addition, the light modulation module 602 further includes a first reflector 632 and a second reflector 636. The reflectors 632 and 636 are configured to change the optical axis direction of the light.

The light source module 604 includes a second substrate 618, the second substrate 618 having light sources 616 positioned on the second substrate 618. The light detection module 606 includes a third substrate 622 on a first side of the light detection module 606 and a third optical window 624 on a second side of the light detection module 606. The detector 620 is positioned on a third substrate 622 opposite the third optical window 624. Further, an optical focusing element 626, such as a lens, may be integrated on the third optical window 624. In other examples, the optical focusing element 626 may be internal to the light detection module 606.

The light source 616 is configured to generate input light 630. The input light 630 is directed to a first reflector 632. The first reflector 632 redirects the input light 630 toward the light modulator 608. Accordingly, the first reflector 632 changes the optical axis direction of the input light 630 from an out-of-plane direction with respect to the plane of the first substrate 614 to an in-plane direction with respect to the plane of the first substrate 614, which corresponds to the optical axis of the light modulator 608. Light modulator 608 is configured to attenuate input light 630 and generate modulated light 634 based on input light 630. Light modulator 608 is also configured to direct modulated light 634 to a second reflector 636. The second reflector 636 redirects the modulated light 634 toward the sample 628 under test. Thus, modulated light 634 reflected from second reflector 636 is directed through second optical window 612 to sample 628.

In the example shown in fig. 6, compact type material analyzer 600 operates in a transmission mode. Thus, modulated light 634 interacts with sample 628 and the resulting scattered transmitted light (e.g., output light 638) from sample 628 is directed through third optical window 624 into light detection module 606. The optical focusing element 626 is configured to focus the output light 638 into the detector 620.

Fig. 7 is a diagram illustrating another example of a compact-type material analyzer device 700 including light redirecting optics in accordance with some aspects. The compact material analyzer device 700 includes a first module 702 and a second module 704. Each module 702 and 704 may be a package, die, or component. The first module 702 includes a light modulator 706, a detector 712, a first optical window 708, a second optical window 710, and an optical concentrating element 714. The second module 704 includes a light source 718.

The first module 702 also includes a first substrate 716 positioned on a first side of the first module 702, and a second optical window 710 is positioned on a second side of the first module 702. The light modulator 706, detector 712, and optical condensing element 714 are positioned on a first surface of a first substrate 716. The first optical window 708 is positioned on a second surface of the first substrate 716, and the first optical window 708 is configured to cover an opening (e.g., a hole or aperture) in the first substrate 716. In addition, the first module 702 also includes a first reflector 726 and a second reflector 730. Reflectors 726 and 730 are configured to change the direction of the optical axis of the light. The second module 704 also includes a second substrate 720, the second substrate 720 having a light source 718 positioned on the second substrate 720.

The light source 718 is configured to generate input light 724. The input light 724 is directed through a first optical window 708 in the first module 702 to a first reflector 726. The first reflector 726 redirects the input light 724 toward the light modulator 706. Accordingly, the first reflector 726 changes the optical axis direction of the input light 724 from an out-of-plane direction with respect to the plane of the first substrate 716 to an in-plane direction with respect to the plane of the first substrate 716, which corresponds to the optical axis of the light modulator 706. The light modulator 706 is configured to attenuate the input light 724 and generate modulated light 728 based on the input light 724. The light modulator 706 is further configured to direct modulated light 728 to a second reflector 730. The second reflector 730 redirects the modulated light 728 toward the sample under test 722. Thus, the modulated light 728 reflected from the second reflector 730 is directed through the second optical window 710 to the sample 722.

In the example shown in fig. 7, the sample 722 is disposed between the second optical window 710 and a third reflector 732 (e.g., a reflective surface). Thus, a third reflector 732 is shown adjacent to the sample 722 and positioned opposite the second optical window 710. The third reflector 732 may comprise, for example, a specular reflective surface, a diffuse reflective surface, an optical cavity, or a reference material. In some examples, the third reflector 732 is configured to maximize the amount of output light 734 received by the detector 712 from the sample 722. For example, the modulated light 728 may interact with the sample 722 and the resulting scattered light (e.g., output light 734) is coupled directly into the detector 712, or reflected back to the sample by a third reflector 732 for additional scattering and redirection to the detector 712 via the second optical window 710 and the optical concentrating element 714.

Fig. 8 is a diagram illustrating another example of a compact-type material analyzer device 800 including light redirecting optics in accordance with some aspects. Compact material analyzer device 800 includes a first module 802 and a second module 804. Each module 802 and 804 may be a package, die, or component. The first module 802 includes an optical modulator 806, a detector 812, a first optical window 808, a second optical window 810, and an optical concentrating element 814. The second module 804 includes a light source 818.

The first module 802 also includes a first substrate 816 positioned on a first side of the first module 802, while the second optical window 810 is positioned on a second side of the first module 802. The light modulator 806, detector 812, and optical concentrating element 814 are positioned on a first surface of a first substrate 816. The first optical window 808 is positioned on a second surface of the first substrate 816, and the first optical window 808 is configured to cover an opening (e.g., a hole or aperture) in the first substrate 816. In addition, the first module 802 also includes a first reflector 826 and a second reflector 830. Reflectors 826 and 830 are configured to change the optical axis direction of the light. The second module 804 also includes a second substrate 820, the second substrate 820 having a light source 818 positioned on the second substrate 820.

The light source 818 is configured to generate input light 824. The input light 824 is directed through the first optical window 808 in the first module 802 to the first reflector 826. The first reflector 826 redirects the input light 824 toward the light modulator 806. Accordingly, the first reflector 826 changes the optical axis direction of the input light 824 from an out-of-plane direction with respect to the plane of the first substrate 816 to an in-plane direction with respect to the plane of the first substrate 816, which corresponds to the optical axis of the light modulator 806. The light modulator 806 is configured to attenuate the input light 824 and generate modulated light 828 based on the input light 824. The light modulator 806 is also configured to direct modulated light 828 to a second reflector 830. The second reflector 830 redirects the modulated light 828 toward the sample 822 under test. Thus, the modulated light 828 reflected from the second reflector 830 is directed through the second optical window 810 to the sample 822.

In the example shown in fig. 8, the second optical window 810 includes an optical element 832, the optical element 832 being positioned on the second optical window 810. The optical element 832 may be, for example, an optically refractive or diffractive element, such as a lens, prism, or grating. The optical element 832 is configured to increase the angle of the modulated light 828 relative to the normal to the first substrate 816. In some examples, the optical element 832 may be a refractive or diffractive lens deposited on the second optical window 810 or molded with the second optical window 810. The lens surface may be in the form of a prism for light redirection or the lens surface may have a curved surface for transforming the wavefront. The optical element 832 is configured to increase the physical separation between the optical modulator 806 and the detector 812 to reduce direct electromagnetic coupling between the optical modulator 806 and the detector 812.

Modulated light 828 directed to sample 822 via optical element 832 interacts with sample 822 and the resulting scattered reflected light (e.g., output light 834) from sample 822 is directed back into first module 802 through second optical window 810. The optical concentration element 814 is configured to collect scattered light (e.g., output light 834) and direct the output light 834 into the detector 812.

Fig. 9 is a diagram illustrating another example of a compact-type material analyzer device 900 including light redirecting optics in accordance with some aspects. Compact material analyzer device 900 includes a first module 902 and a second module 904. Each module 902 and 904 may be a package, die, or component. The first module 902 includes an optical modulator 906, a detector 912, a first optical window 908, a second optical window 910, and an optical concentrator 914. The second module 904 includes a light source 918.

The first module 902 also includes a first substrate 916 positioned on a first side of the first module 902, and the second optical window 910 is positioned on a second side of the first module 904. The light modulator 906, detector 912, and optical concentrator 914 are positioned on a first surface of a first substrate 916. The first optical window 908 is positioned on a second surface of the first substrate 916, and the first optical window 908 is configured to cover an opening (e.g., a hole or aperture) in the first substrate 916. In addition, the first module 902 also includes a first reflector 926 and a second reflector 930. Reflectors 926 and 930 are configured to change the optical axis direction of light. The second module 904 also includes a second substrate 920, the second substrate 920 having a light source 918 positioned on the second substrate 920.

The light source 918 is configured to generate input light 924. The input light 924 is directed through the first optical window 908 in the first module 902 to the first reflector 926. The first reflector 926 redirects the input light 924 toward the light modulator 906. Accordingly, the first reflector 926 changes the optical axis direction of the input light 924 from an out-of-plane direction relative to the plane of the first substrate 916 to an in-plane direction relative to the plane of the first substrate 916, which corresponds to the optical axis of the light modulator 906. The light modulator 906 is configured to attenuate the input light 924 and generate modulated light 928 based on the input light 924. The light modulator 906 is also configured to direct modulated light 928 to a second reflector 930. The second reflector 930 redirects the modulated light 928 towards the sample under test 922. Thus, the modulated light 928 reflected from the second reflector 930 is directed through the second optical window 910 to the sample 922.

In the example shown in fig. 9, the second optical window 910 is a lens optical window that covers an opening 936 (e.g., a hole or aperture) in the opaque surface 934 of the first module 902. The lens optical window 910 is configured to increase the physical separation between the light modulator 906 and the detector 912 to reduce direct electromagnetic coupling between the light modulator 906 and the detector 912. Modulated light 928 directed to sample 922 via lens optical window 910 interacts with sample 922 and the resulting scattered reflected light (e.g., output light 932) from sample 922 is directed back into first module 902 through opaque surface 934. The optical concentrator element 914 is configured to collect scattered light (e.g., output light 932) and direct the output light 932 into the detector 912.

Fig. 10A and 10B are diagrams illustrating examples of optical concentrating elements 1000 according to some aspects. The optical condensing element 1000 is a reflective compound optical condenser. Composite optical concentrator 1000 includes a deep inner concentrator 1004 surrounded by a shallow outer concentrator 1002. The shallow outer concentrator 1002 is in the form of an annular annulus or lower half of an anchoring ring. In other examples, the external concentrator 1002 can have a free-form shape. The compound optical concentrator 1000 is designed to collect a larger spot size from the sample 1008. For example, first scattered light 1014a from sample 1008 may be collected by internal concentrator 1004 directly from sample 1008 to detector 1006. In addition, during light recycling, light 1010 collected by the external condenser 1002 may be reflected back onto the sample 1008 as reflected light 1012, during which the light 1012 reflected back to the sample 1008 produces second scattered light 1014b, which second scattered light 1014b may be collected by the internal condenser 1004 to the detector 1006.

Fig. 11A is a diagram illustrating an example of a light detection unit 1100 including a plurality of detectors according to some aspects. The light detection unit may be in the form of a separate light detection module as shown in fig. 4 and/or 6 or may be integrated within the light modulation module as shown in fig. 2, 3 and/or 7-9. In the example shown in fig. 11A, the light detection unit 1100 includes more than one optical condensing element and more than one detector. For example, the light detection unit 1100 includes a first optical concentrating element 1102a configured to collect output light from the sample 1106 to a first detector 1104a and a second optical concentrating element 1102b configured to collect output light from the sample 1106 to a second detector 1104 b. In other examples, there may be more than two optical concentrating elements in the form of an array of optical concentrating elements. Furthermore, there may be more than two detectors.

In some examples, optical concentrating elements 1102a and 1102b may fill the angular space, but may be oriented differently relative to sample 1106. For example, the optical concentrating elements 1102a and 1102b may fill the space of the airspace by laterally moving the optical concentrating elements 1102a and 1102b relative to each other.

In some examples, detectors 1104a and 1104b may operate within the same wavelength range. For example, detector 1104a and detector 1104b may each detect output light from sample 1106 simultaneously, and the resulting signals from each of detector 1104a and detector 1104b may be combined (added). In other examples, detector 1104a and detector 1104b may operate in different wavelength ranges, each covering a different portion of the spectrum (e.g., visible, NIR, and mid-infrared (MIR) spectral ranges). Examples of detectors operating in the NIR may include InGaAs, extended InGaAs photodiodes or PbS photodiodes. Examples of detectors operating in MIR may include PbSe or MCT photodetectors or thermal detectors.

In some examples, the detector 1104a and the detector 1104b may be arranged to receive output light from different spatial locations in the sample 1106. For example, as shown in fig. 1B and 11C, the detectors may be arranged to receive output light from different depths or layers of the sample 1106 (e.g., as shown in fig. 11B) and/or different lateral positions of the sample 1106 (e.g., as shown in fig. 11B and 11C). For example, light from the epidermis or dermis layers of the skin is collected. By using more than one detector to collect output light from different spatial locations in the sample 1106, the throughput of the collected light can be increased. In addition, the resulting signal from the detector can be used to determine how the properties of the sample 1106 change with depth.

Fig. 12A and 12B are diagrams illustrating example configurations of light modulation modules 1210a and 1210B of a compact material analyzer device according to some aspects. In some examples, the light modulation module 1210a or 1210b may be a ceramic package, wherein the ceramic layer is built up or post-processed by machining. In the example shown in fig. 12A, the light modulation module 1210a includes a substrate 1200a (e.g., a ceramic substrate) having an opening 1202A therein, a first (bottom) optical window 1204a, and a second (top) optical window 1206a, which second (top) optical window 1206a may serve as a cover or lid for the light modulation module 1210 a. Further, in the example shown in fig. 12B, the light modulation module 1210B includes a substrate 1200B (e.g., a ceramic substrate) having an opening 1202B, a first (bottom) optical window 1204B, and a second (top) optical window 1206B, the second (top) optical window 1206B may serve as a cover or lid for the light modulation module 1210B.

The size of the opening 1202a or 1202b is configured to balance the amount of light coupled into the light modulation module, stray light that may not be properly modulated, and the mechanical stiffness of the substrate 1200a or 1200 b. As shown in fig. 12A, a bottom optical window 1204a may be positioned on an inner surface (inside) of the substrate 1200 a. As shown in fig. 12B, a bottom optical window 1204B may be positioned on an outer surface (outside) of the substrate 1200B. In some examples, other optical components of the light modulation module 1210 (e.g., light modulators, reflectors, etc.) may be positioned over the bottom optical window 1204a or 1204 b. In this example, the window material of the bottom optical window 1204a or 1204b may be selected to have a matched coefficient of thermal expansion and optical transparency over the wavelength range of interest.

Fig. 13 is a diagram illustrating an example of a compact-type material analyzer device 1300 integrated with other components, according to some aspects. Compact material analyzer device 1300 includes a module 1302, such as a package. The module 1302 includes an optical modulator 1304, a detector 1310, a first optical window 1306, a second optical window 1308, and an optical concentrating element 1312. The first optical window 1306 is positioned along the entire length of the first side of the module 1302, while the second optical window 1308 is positioned along the entire length of the second side of the module 1302. Thus, the first optical window 1306 acts as a base or bottom of the module 1302 and the second optical window 1308 acts as a lid (cover) or top of the module 1302. The sample under test 1318 may be placed on the outer surface of the second optical window 1308.

The module 1302 also includes a first substrate 1326, the first substrate 1326 having a first surface and a second surface. The light modulator 1304, detector 1310 and optical concentrating element 1312 are positioned on a first surface of a first substrate 1326. The first optical window 1306 is positioned on a second surface of the first substrate 1326, and the first optical window 1306 is configured to cover an opening (e.g., a hole or aperture) in the first substrate 1326. In addition, the module 1302 further includes a first reflector 1314 and a second reflector 1316. Reflectors 1314 and 1316 are configured to change the direction of the optical axis of the light.

The module 1302 may be integrated with other electronic components 1324 via a second substrate (e.g., a Printed Circuit Board (PCB)) 1320. For example, PCB 1320 may be configured to assemble and connect compact-type material analyzer device 1300 with other electronic components 1324. In one example, the module 1302 may be connected to the PCB 1320 using wire bonding or surface mounting. The PCB 1320 may also include an opening (e.g., hole) 1322 for coupling input light into the module 1302.

Fig. 14 is a diagram illustrating an example of a stacked configuration of compact material analyzer device 1400 according to some aspects. Compact material analyzer device 1400 includes a first module 1402 and a second module 1404. Each module 1402 and 1404 may be, for example, a package. The modules 1402 and 1404 are stacked in a package-on-package (PoP) configuration. The first module 1402 includes an optical modulator 1406, a detector 1412, a first optical window 1408, a second optical window 1410, and an optical concentrating element 1414. Sample 1432 (e.g., skin) may be placed on second optical window 1410.

The first module 1402 also includes a first substrate 1420 positioned on a first side of the first module 1402, and a second optical window 1410 positioned on a second side of the first module 1402. The light modulator 1406, detector 1412 and optical concentrating element 1414 are positioned on a first surface of a first substrate 1420. The first optical window 1408 is positioned on the second surface of the first substrate 1420, and the first optical window 1408 is configured to cover an opening (e.g., a hole or aperture) in the first substrate 1420. In addition, the first module 1402 also includes a first reflector 1416 and a second reflector 1418. The reflectors 1416 and 1418 are configured to change the optical axis direction of the light.

The second module 1404 includes a light source 1422. The second module 1404 also includes a second substrate 1424 and a third substrate 1426. The light source 1422 is positioned on the second substrate 1424. The third substrate 1426 includes an opening (e.g., a hole or aperture) for passing input light from the light source 1422 into the first module 1402. Each of the second substrate 1424 and the third substrate 1426 may be, for example, a PCB. In some examples, the first substrate 1420 may be an interposer with a frame for heat dissipation. Interposer 1420 may be connected to a third substrate (e.g., PCB) 1426 by bump structures 1430 (e.g., solder/flux). Interposer 1420 enables connections to be spread (fanned out) to a wider pitch or rerouted to a different connection. The stacked configuration of substrates 1420, 1424, and 1426 provides mechanical and electrical connection between components in first module (package) 1402, and between components in first module 1402 and second module 1404.

Fig. 15 is a diagram illustrating another example of a stacked configuration of a compact material analyzer device 1500 in accordance with some aspects. The compact material analyzer device 1500 includes a first module 1502 and a second module 1504. Each module 1502 and 1504 may be, for example, a package. The modules 1502 and 1504 are stacked in a package-on-package (PoP) configuration. The first module 1502 includes a light modulator 1506, a first optical window 1508, and a second optical window 1510. Sample 1532 may be placed on second optical window 1510.

In the example shown in fig. 15, the first module 1502 also includes a plurality of detectors. For example, the first module 1502 may include a first detector 1512a and a second detector 1512b. The first module 1502 also includes a respective optical concentrating element 1514a and 1514b for each of the detectors 1512a and 1512b. By having multiple detectors 1512a and 1512b, the spatial throughput may be increased or the spectral range may be extended.

The first module 1502 also includes a first substrate 1520 positioned on a first side of the first module 1502, while a second optical window 1510 is positioned on a second side of the first module 1502. The light modulator 1506, the detectors 1512a and 1512b, and the optical concentrating elements 1514a and 1514b are positioned on a first surface of the first substrate 1520. The first optical window 1508 is positioned on a second surface of the first substrate 1520, and the first optical window 1508 is configured to cover an opening (e.g., a hole or aperture) in the first substrate 1520. In addition, the first module 1502 also includes a first reflector 1516 and a second reflector 1518. The reflectors 1516 and 1518 are configured to change the optical axis direction of the light.

The second module 1504 includes a light source 1522. The second module 1504 also includes a second substrate 1524 and a third substrate 1526. The light source 1522 is positioned on the second substrate 1524. The third substrate 1526 includes an opening (e.g., a hole or aperture) for passing input light from the light source 1522 into the first module 1502. Each of the second substrate 1524 and the third substrate 1526 may be, for example, a PCB. In some examples, the first substrate 1520 may be an interposer with a frame for heat dissipation. The interposer 1520 may be connected to a third substrate (e.g., PCB) 1526 by bump structures 1530 (e.g., solder/flux). As in the example shown in fig. 14, the stacked configuration of substrates 1520, 1524, and 1526 provides mechanical and electrical connections between components in the first module (package) 1502, and between components in the first module 1502 and the second module 1504.

Fig. 16 is a diagram illustrating an example of a compact material analyzer device 1600 that includes multiple light modulation mechanisms, according to some aspects. Compact material analyzer device 1600 includes a first module 1602 and a second module 1604. Each of the modules 1602 and 1604 may be, for example, a package or other integrated device. The first module 1602 includes two or more light modulators. For example, first optical modulator 1606a and second optical modulator 1606b are shown for simplicity. The first module 1602 also includes a first optical window 1608a, a second optical window 1608b, a third optical window 1610, and a first substrate 1618a. The first and second optical windows 1608a, 1608b are positioned on a first side of the first module 1602 and the third optical window 1610 is positioned on a second side of the first module 1602. The first and second optical windows 1608a, 1608b are positioned to cover respective openings (e.g., apertures or holes) in the first substrate 1618a on the first side of the first module 1602. Sample 1630 may be placed on third optical window 1610.

The first module 1602 also includes a detector 1612, an optical concentrating element 1614, a first set of reflectors 1624a, 1624b, and a second set of reflectors 1628a and 1628b. The reflectors 1624a, 1624b, 1628a, and 1628b are configured to change the optical axis direction of the light. The second set of reflectors 1628a and 1628b may be, for example, curved reflectors surrounding the optical concentrating element 1614.

The second module 1604 includes a light source 1616 and a third set of reflectors 1622a and 1622b. The second module 1604 also includes a second substrate 1618b. The light source 1616 and reflectors 1622a and 1622b may be positioned on a second substrate 1618b.

The light source 1616 is configured to generate and emit input light 1620a and 1620b in multiple directions. The third set of reflectors 1622a and 1622b are configured to direct respective input light 1620a and 1620b through the first and second optical windows 1608a and 1608b, respectively, in the first module 1602 to the first set of reflectors 1624a and 1624b. The first set of reflectors 1624a and 1624b are configured to redirect the respective input light 1620a and 1620b toward the respective light modulators 1606a and 1606b. Thus, reflector 1624a directs input light 1620a to first light modulator 1606a, and reflector 1624b directs input light 1620b to second light modulator 1606b. Each optical modulator 1606a and 1606b is configured to attenuate a respective input light 1620a and 1620b and generate a respective modulated light 1626a and 1626b based on the respective input light 1620a and 1620b. Light modulators 1606a and 1606b are also configured to direct respective modulated light 1626a and 1626b to a second set of reflectors 1628a and 1628b. The second set of reflectors 1628a and 1628b redirect modulated light 1626a and 1626b toward sample 1630. Thus, modulated light 1626a and 1626b reflected from the second set of reflectors 1628a and 1628b is directed through a third optical window 1610 to the sample 1630. By using multiple optical modulators 1606a and 1606b, the amount of modulated power incident on sample 1630 can be increased.

Modulated light 1626a and 1626b interacts with sample 1630 and the resulting scattered reflected light (e.g., output light 1632) from sample 1630 is directed back into first module 1602 through third optical window 1610. The optical concentrating element 1614 is configured to collect scattered light (e.g., output light 1632) and direct the output light 1632 into the detector 1612. The detector 1612 collects a superposition (e.g., interference pattern) of the two reflected modulated light beams 1626a and 1626b, doubling the signal-to-noise ratio. In some examples, the two optical modulators 1606a and 1606b (e.g., MEMS chips) may be synchronized to reduce the phase shift between the two interference patterns 1626a and 1626b and maximize the signal.

Fig. 17A and 17B are diagrams illustrating another example of a compact material analyzer device 1700 including a plurality of light modulation mechanisms according to some aspects. Fig. 17B shows an opposite side view of compact material analyzer device 1700. Compact material analyzer device 1700 includes a first module 1702 and a second module 1704. Each of the modules 1702 and 1704 may be, for example, a package or other integrated device. The first module 1702 includes two or more light modulation mechanisms integrated into a single light modulation device 1706 (e.g., MEMS chip). For example, the light modulation device 1706 may include a first light modulator 1706a and a second light modulator 1706b.

The first module 1702 also includes a first optical window 1708, a second optical window 1710, a detector 1712, an optical concentrating element 1714, a first reflector 1728a, a second reflector 1728b, a third reflector 1724, and a first substrate 1716. A first optical window 1708 is positioned on a first side of first module 1702 and a second optical window 1710 is positioned on a second side of first module 1702. The first optical window 1708 is positioned to cover an opening (e.g., an aperture or hole) in the first substrate 1716 on the first side of the first module 1702. Sample 1730 may be placed on second optical window 1710. The second module 1704 includes a light source 1718 and a second substrate 1720. The light source 1718 is positioned on the second substrate 1720.

The light source 1718 is configured to generate input light 1722, and the light source 1718 is oriented relative to the first optical window 1708 to emit the input light 1722 through the first optical window 1708 to the third reflector 1724. The third reflector 1724 is configured to direct the input light 1722 into the light modulation device 1706. The input light 1722 then passes through each of the light modulators 1706a and 1706b within the light modulation device 1706 to produce respective modulated light 1726a and 1726b based on the input light 1722. Each of the light modulators 1706a and 1706b is further configured to direct respective modulated light 1726a and 1726b to a respective one of the first reflector 1728a and the second reflector 1728b. For example, the first modulator 1706a may be configured to direct modulated light 1726a to the first reflector 1728a via a first waveguide 1734 a. Further, the second modulator 1706b may be configured to direct modulated light 1726b to a second reflector 1728b via a second waveguide 1734 b. First reflector 1728a and second reflector 1728b are configured to redirect modulated light 1726a and 1726b, respectively, toward sample 1730. Thus, modulated light 1726a and 1726b reflected from first reflector 1728a and second reflector 1728b is directed through second optical window 1710 to sample 1730.

Modulated light 1726a and 1726b interact with sample 1730 and the resulting scattered reflected light (e.g., output light 1732) from sample 1730 is directed back into first module 1702 through second optical window 1710. The optical concentration element 1714 is configured to collect scattered light (e.g., output light 1732) and direct the output light 1732 into the detector 1712. As in the example shown in fig. 16, detector 1712 collects a superposition (e.g., interference pattern) of the two reflected modulated beams 1726a and 1726b, doubling the signal-to-noise ratio.

Fig. 18A and 18B are diagrams illustrating another example of a compact material analyzer device 1800 including a mach-zehnder interferometer according to some aspects. Compact material analyzer device 1800 includes a first module 1802 and a second module 1804. Each of the modules 1802 and 1804 may be, for example, a package or other integrated device. The first module 1802 includes a mach-zehnder interferometer 1806 (e.g., an optical modulator) configured to produce two complementary optical beams/interference patterns.

The first module 1802 also includes a first optical window 1808, a second optical window 1810, and a first substrate 1818a. The first optical window 1808 is positioned on a first side of the first module 1802 and the second optical window 1810 is positioned on a second side of the first module 1802. The first optical window 1808 is positioned to cover an opening (e.g., an aperture or hole) in the first substrate 1818a on the first side of the first module 1802. Sample 1830 may be placed on second optical window 1810. The first module 1802 also includes a first detector 1812a, a second detector 1812b, a first optical condensing element 1814a, a second optical condensing element 1814b, a first reflector 1828a, a second reflector 1828b, and a third reflector 1824. First reflector 1828a and second reflector 1828b are each integrated with a respective one of first optical concentrating element 1814a and second optical concentrating element 1814 b.

The second module 1804 includes a light source 1816 and a second substrate 1818b. Light sources 1816 are positioned on second substrate 1818b. Light source 1816 is configured to generate input light 1822, and light source 1816 is oriented with respect to first optical window 1808 to emit input light 1822 through first optical window 1808 to third reflector 1824. The third reflector 1824 is configured to direct the input light 1822 into the mach-zehnder interferometer 1806. The mach-zehnder interferometer 1806 may be configured to generate respective modulated light 1826a and 1826b (e.g., complementary beams/interference patterns) based on the input light 1822. The mach-zehnder interferometer 1806 is further configured to direct respective modulated light 1826a and 1826b to a respective one of the first reflector 1828a and the second reflector 1828b. For example, the mach-zehnder interferometer 1806 may be configured to direct modulated light 1826a via a first waveguide 1834a to a first reflector 1828a, and to direct modulated light 1826b via a second waveguide 1834b to a second reflector 1828b. First reflector 1828a and second reflector 1828b are configured to redirect modulated light 1826a and 1826b, respectively, toward sample 1830. Thus, modulated light 1826a and 1826b reflected from the first reflector 1828a and the second reflector 1828b is directed through the second optical window 1810 to the sample 1830.

Each modulated light 1826a and 1826b interacts with a different light spot 1830a and 1830b on the sample 1830 to increase the effective collection spot size of the sample 1830. The resulting scattered reflected light (e.g., output light 1832a and 1832 b) from sample 1830 is directed through second optical window 1810 back into first module 1802. The first optical condensing element 1814a is configured to collect scattered light (e.g., output light 1832 a) from the first light spot 1830a and direct the output light 1832a into the first detector 1812 a. The second optical condensing element 1814b is configured to collect scattered light (e.g., output light 1832 b) from the second light spot 1830b and direct the output light 1832b into the second detector 1812 b. Detectors 1812a and 1812b may be configured to collect respective output light 1832a and 1832b simultaneously, thereby increasing the average of electrical and spatial noise due to non-uniformity of sample 1830, and thus increasing the signal-to-noise ratio.

Fig. 19 is a diagram illustrating an example of a compact-type material analyzer device 1900 that includes an integrated light source, according to some aspects. Compact material analyzer device 1900 includes a single integrated module 1902 (e.g., a double-sided H-package). The module 1902 includes a substrate 1932, the substrate 1932 having a plurality of components located on the substrate 1932. The substrate includes a first surface 1916a (e.g., a top surface) and a second surface 1916b (e.g., a back surface). The module 1902 includes a light source 1914 positioned on a second surface 1916b of a substrate 1932, a first reflector 1920, and a first optical window 1906. The first optical window 1906 is positioned to cover an opening (e.g., an aperture or hole) in the substrate 1932.

The module 1902 also includes a light modulator 1904, a detector 1910, an optical concentrating element 1912, a second reflector 1922, and a third reflector 1926 positioned on a first surface 1916a of a substrate 1932. The detector 1910 is positioned within a recessed portion of the first surface 1916a of the substrate 1932. The third reflector 1926 may be integrated with the optical concentrating element 1912.

The module 1902 also includes a second optical window 1908, and a sample 1928 may be placed over the second optical window 1908. A first optical window 1906 is positioned on a first side of module 1902 (e.g., corresponding to back surface 1916b of substrate 1932), and a second optical window 1908 is positioned on a second side of module 1902. Although not shown, a cover may be added to a first side (e.g., bottom side) of the module 1902 for sealing. In addition, electrical connections may be made by soldering the module (package) 1902 to a board (e.g., PCB) using a package castellation and a back pad or epoxy.

Light source 1914 is configured to generate input light 1918 and to direct input light 1918 to first reflector 1920. First reflector 1920 is configured to direct input light 1918 through first optical window 1906 to second reflector 1922. Second reflector 1922 is configured to direct input light 1918 into light modulator 1904. Light modulator 1904 is configured to attenuate input light 1918 and generate modulated light 1924 based on input light 1918. The light modulator 1904 is also configured to direct modulated light to a third reflector 1926. The third reflector 1926 is configured to redirect the modulated light 1924 toward the sample 1928. Thus, the modulated light 1924 reflected from the third reflector 1926 is directed through the second optical window 1908 to the sample 1928.

The modulated light 1924 interacts with the sample 1928 and the resulting scattered reflected light (e.g., output light 1930) from the sample 1928 is directed back through the second optical window 1908. The optical concentration element 1912 is configured to collect scattered light (e.g., output light 1930) and direct the output light 1930 into the detector 1910.

Fig. 20 is a diagram illustrating another example of a compact material analyzer device 2000 including an integrated light source, according to some aspects. Compact material analyzer device 2000 includes a single integrated module 2002 (e.g., a double sided H-shaped package). The module 2002 includes a substrate 2032, the substrate 2032 having a plurality of components located on the substrate 2032. The substrate includes a first surface 2016a (e.g., top surface) and a second surface 2016b (e.g., back surface). The module 2002 includes a light source 2014, a first set of reflectors 2020a and 2020b, a first optical window 2006a, and a second optical window 2006b positioned on a second surface 2016b of a substrate 2032. The first and second optical windows 2006a, 2006b are positioned to cover respective openings (e.g., apertures or holes) in the substrate 2032.

The module 2002 also includes a first light modulator 2004a, a second light modulator 2004b, a detector 2010, an optical condensing element 2012, a second set of reflectors 2022a and 2022b, and a third set of reflectors 2026a and 2026b positioned on a first surface 2016a of the substrate 2032. The detector 2010 is positioned within a recessed portion of the first surface 2016a of the substrate 2032. The third set of reflectors 2026a and 2026b may be curved reflectors around the optical condensing element 2012.

The module 2002 also includes a third optical window 2008, and the sample 2028 can be placed over the third optical window 2008. The first and second optical windows 2006a, 2006b are positioned on a first side of the module 2002 (e.g., corresponding to the back side 2016b of the substrate 2032), and the third optical window 2008 is positioned on a second side of the module 2002. Although not shown, a cover may be added to a first face (e.g., bottom face) of the module 2002 for sealing.

Light source 2014 is configured to generate and emit input light 2018a and 2018b in multiple directions. The first set of reflectors 2020a and 2020b are configured to direct respective input light 2018a and 2018b through the first and second optical windows 2006a and 2006b, respectively, to the second set of reflectors 2022a and 2022b. The second set of reflectors 2022a and 2022b are configured to redirect the respective input light 2018a and 2018b toward the respective light modulators 2004a and 2004b. Thus, the reflector 2022a directs the input light 2018a to the first light modulator 2004a, and the reflector 2022b directs the input light 2018b to the second light modulator 2004b. Each light modulator 2004a and 2004b is configured to attenuate a respective input light 2018a and 2018b and produce a respective modulated light 2024a and 2024b based on the respective input light 2018a and 2018. The light modulators 2004a and 2004b are also configured to direct respective modulated light 2024a and 2024b to a second set of reflectors 2026a and 2026b. The second set of reflectors 2026a and 2026b redirect the modulated light 2024a and 2024b toward the sample 2028. Thus, the modulated light 2024a and 2024b reflected from the second set of reflectors 2026a and 2026b is directed through the third optical window 2008 to the sample 2028.

Modulated light 2024a and 2024b interact with sample 2028, and the resulting scattered reflected light (e.g., output light 2030) from sample 2028 is directed back through third optical window 2008. The optical focusing element 2012 is configured to collect scattered light (e.g., output light 2030) and direct the output light 2030 into the detector 2010. As in the example shown in fig. 16 and 17, detector 2010 collects a superposition (e.g., an interference pattern) of the two reflected modulated light beams 2024a and 2024b, thereby doubling the signal-to-noise ratio.

Fig. 21 is a diagram illustrating another example of a compact-type material analyzer device 2100 including an integrated light source, according to some aspects. Compact material analyzer device 2100 includes a single integrated module 2102 (e.g., a double-sided H-package). The module 2102 includes a substrate 2132, the substrate 2132 having a plurality of components positioned on the substrate 2132. The substrate includes a first surface 2116a (e.g., a top surface) and a second surface 2116b (e.g., a back surface). The module 2102 includes a light source 2114 positioned on a substrate 2132, a first reflector 2120, and a first optical window 2106. The first optical window 2106 is positioned to cover an opening (e.g., aperture or hole) in the substrate 2132. In addition, the module 2102 includes control electronics 2134 (e.g., an ASIC and other electronics) assembled on the second surface 2116b (e.g., back side) of the substrate 2132.

The module 2102 further includes a light modulator 2104, a detector 2110, an optical condensing element 2112, a second reflector 2122, and a third reflector 2126 positioned on a first surface 2116a of the substrate 23132. The detector 2110 is positioned within a recessed portion of the first surface 2116a of the substrate 2132. The third reflector 2126 may be integrated with the optical condensing element 2112.

The module 2102 further includes a second optical window 2108, and a sample 2128 can be placed over the second optical window 2108. The first optical window 2106 is positioned on a first side of the module 2102 (e.g., corresponding to the back side 2116b of the substrate 2132), and the second optical window 2108 is positioned on a second side of the module 2102. The module 2102 can also include a cover 2136 (e.g., a glass cover) on a first side (e.g., bottom side) for sealing. In addition, electrical connections may be made by soldering the module (package) 2102 to a board (e.g., PCB) using package castellations and backside pads or epoxy.

The light source 2114 is configured to generate input light 2118 and direct the input light 2118 to the first reflector 2120. The first reflector 2120 is configured to direct the input light 2118 through the first optical window 2106 to the second reflector 2122. The second reflector 2122 is configured to direct the input light 2118 into the light modulator 2104. The light modulator 2104 is configured to attenuate the input light 2118 and generate modulated light 2124 based on the input light 2118. The light modulator 2104 is also configured to direct modulated light to a third reflector 2126. The third reflector 2126 is configured to redirect the modulated light 2124 toward the sample 2128. Thus, the modulated light 2124 reflected from the third reflector 2126 is directed through the second optical window 2108 to the sample 2128.

The modulated light 2124 interacts with the sample 2128 and the resulting scattered reflected light (e.g., output light 2130) from the sample 2128 is directed back through the second optical window 2108. The optical condensing element 2112 is configured to collect scattered light (e.g., output light 2130) and direct the output light 2130 into the detector 2110.

Fig. 22A and 22B are diagrams illustrating examples of optical coupling devices 2200 according to some aspects. The optical coupling device 2200 includes an optical concentrating element 2202, a first reflector 2204, and a second reflector 2206. The optical concentrator element 2202 and reflectors 2204 and 2206 may correspond to, for example, the optical concentrator elements and reflectors for a single light modulator and corresponding single detector shown and described above in connection with any of fig. 5, 7-9, 13-16, and/or 18-21.

The optical coupling device 2200 shown in fig. 22A and 22B may be formed from a single piece of optomechanical material to ensure precise alignment of the optical concentrating element 2202, the first reflector 2204, and the second reflector 2206. The core material of the optical coupling device 2200 may be, for example, metal or moldable plastic. The optical coupling device 2200 may be fabricated by, for example, three-dimensional printing, optical stereolithography, precision injection molding, or other suitable fabrication process. The surface reflectivity of the optical coupling device 2200 may be enhanced by including a coating of a thin film layer 2208 on the optical interface (e.g., the optical concentrating element 2202, the first reflector 2204, and the second reflector 2206). Further, the light coupling device 2200 may include an absorbing wall 2210, the absorbing wall 2210 being designed to block stray light from passing from one reflective surface (e.g., the optical concentrating element 2202, the first reflector 2204, or the second reflector 2206) to the other reflective surface.

Fig. 23A-23C are diagrams illustrating examples of compact-type material analyzer devices 2300 including an optical coupling device 2302 and an optical modulator 2304, according to some aspects. Fig. 23A-23C are top oblique views of compact material analyzer device 2300.

The optical coupling device 2302 includes optical alignment features (e.g., alignment fingers) 2306 for passive alignment with an optical modulator 2304 (e.g., a MEMS chip). The alignment fingers 2306 further facilitate the insertion of an optical coupling device directly into the optical modulator 2304. In some examples, complementary alignment features (not shown) on the light modulator 2304 may be used in a male-female fashion in conjunction with the optical alignment fingers 2306. Alignment features on the optical coupling device 2302 and the optical modulator 2304 may be distributed across the device to minimize alignment errors.

In examples where the optical modulator 2304 is fabricated on an SOI substrate, the SOI substrate includes a device layer 2310 and a handle layer 2312 having a glass window (e.g., an optical window) upon which a sample may be placed, and alignment features may be formed in the device layer 2312 of the SOI substrate. In some examples, the alignment fingers 2306 may be based on the mechanical shape of one or more optical components (e.g., one or more mirrors) in the light modulator 2304. By integrating the optical coupling device 2302 with the MEMS chip (optical modulator 2304), a miniaturized material analyzer device with most on-chip components can be fabricated. For example, such a miniaturized material analyzer device may be implemented as a wearable product.

Fig. 24 is a diagram illustrating another example of a compact-type material analyzer device 2400 including an optical coupling device 2402 and an optical modulator 2404, according to some aspects. Fig. 24 is a bottom oblique view of compact material analyzer device 2400 with detector 2408 visible. In some examples, the light coupling device 2402 may include an opening to allow access to the detector 2408 during assembly. Furthermore, the optical coupling device 2402 further includes an electromagnetic shielding wall 2406, the electromagnetic shielding wall 2406 being configured to prevent direct electromagnetic coupling between the detector 2408 and the optical modulator 2404. In some examples, electromagnetic shielding wall 2406 may be metal or plastic with a thick metal coating.

Fig. 25 is a diagram illustrating an example of a compact material analyzer device 2500 that includes an optical waveguide, in accordance with some aspects. In the example shown in fig. 25, the compact type material analyzer device 2500 is a single MEMS chip fabricated in a device layer 2504 of an SOI substrate that includes a device layer and a handle layer 2506. The MEMS chip includes an optical interferometer (not shown), an illumination waveguide 2508 having a waveguide interface 2510, the illumination waveguide 2508 for carrying modulated light to a sample 2514 (e.g., skin tissue), and a collection waveguide 2516 for collecting output light scattered from the sample 2514 and directing the output light to a detector (not shown). MEMS chip 2500 is further packaged for protection using machined glass 2502 on top and glass window 2512 on the sides. Glass window 2512 may further serve as an interface between waveguides 2508 and 2516 and sample 2514.

Fig. 26 is a diagram illustrating an example of optical waveguide 2600 according to some aspects. Optical waveguide 2600 shown in fig. 26 is an illumination waveguide, and may correspond to illumination waveguide 2508 shown in fig. 25, for example. The illumination waveguide 2600 is configured to direct modulated light through an optical window 2606 to a sample 2608 (e.g., skin) under test. In the example shown in fig. 26, illumination waveguide 2600 includes a waveguide interface 2602, with waveguide interface 2602 configured to steer modulated light using, for example, refraction. In some examples, the turning angle of waveguide interface 2602 is less than the critical angle between silicon and air to maintain the optical power of the modulated light. If the turning angle is greater than the critical angle, total internal reflection of the modulated light inside the waveguide may result, which may reduce the optical power. Furthermore, to control the spot size on the sample 2608, the waveguide interface 2602 may have a curved shape (e.g., a curved waveguide interface) to create a lens effect.

Fig. 27 is a diagram illustrating an example of an optical waveguide 2700 according to some aspects. The optical waveguide 2700 shown in fig. 27 is a collecting waveguide, and may correspond to the collecting waveguide 2516 shown in fig. 25, for example. The collecting waveguide 2700 includes an upper collecting waveguide 2702 and a lower collecting waveguide 2704 parallel to the upper collecting waveguide 2702 to increase throughput of the optical system. In one example, the collection waveguide 2700 may be fabricated in a substrate 2706 (e.g., a Buried Oxide (BOX) substrate, such as an SOI substrate). For example, the collection waveguide 2700 may be fabricated in a BOX substrate 2706 of a MEMS chip. Here, the upper collecting waveguide 2702 is fabricated (etched) in the device layer 2712 of the substrate 2706, and the lower collecting waveguide 2704 is fabricated (etched) in the process layer 2710 of the substrate 2706, wherein the gap between the upper waveguide 2702 and the lower waveguide 2704 is caused by the release of the oxide layer in the MEMS chip. This results in the use of two waveguides 2702 and 2704 to enhance coupling of output light to detector 2708.

Furthermore, to facilitate the collection of scattered light (output light) from sample 2714 directly into collection waveguide 2700, collection waveguide 2700 may be placed as close as possible to sample 2714. The minimum distance between sample 2714 and collecting waveguide 2700 is defined by optical window (glass window) 2716 in direct contact with sample 2714. To further increase the power coupled to detector 2708, optical window 2716 may be curved to create a lens optical window. The lens optical window 2716 may reduce divergence losses by redirecting some of the escaping light rays to the input of the collection waveguide 2700. The optical waveguide configurations shown in fig. 25-27 provide a compact, integrated, and cost-effective solution that enables MEMS technology to be used with wearable devices for non-invasive measurements from samples (e.g., skin) with high coupling efficiency.

Fig. 28A-28C are diagrams illustrating examples of an integrated material analyzer device 2800 using a frame 2802 according to some aspects. The integrated material analyzer device 2800 shown in fig. 28A-28C provides a solution for integrating chips/components on a board while reducing costs and eliminating the need for active alignment. The frame 2802 may be, for example, an optical die. Frame 2802 includes features configured to facilitate insertion, fixation, and alignment of detector 2806 and light modulator (e.g., MEMS chip) 2810. For example, frame 2802 may include an opening sized and shaped to physically house detector 2806, MEMS chip 2810, and any electrical connections, such as wire bonds. In addition, frame 2802 includes an opening 2832, with opening 2832 configured to facilitate insertion and securement of a second optical window 2804 (e.g., a top glass window). The frame 2802 may also include additional openings (not shown) for insertion and securement of the first optical window 2808 (e.g., bottom glass window). In some examples, an optical coupling device, such as that shown in fig. 22A and 22B, may be formed in frame 2802 to ensure self-alignment and reduce cost.

The frame 2802 also includes additional features for injection into holes in the board 2812 (e.g., PCB) for each of assembly and alignment. For example, frame 2802 may include protruding alignment portions 2818 extending from sides of the frame, and a plurality of alignment pins 2820 for aligning frame 2802 on PCB 2812. PCB 2812 includes an opening 2814 (e.g., a hole) and a plurality of alignment holes 2832, opening 2814 configured to receive protruding alignment portions 2818 and plurality of alignment holes 2832 configured to receive a plurality of alignment pins 2820. In addition, PCB 2812 includes holes 2816 that align with bottom glass window 2808. The frame 2802 may be assembled on a first surface 2828 (e.g., a top surface) of the PCB 2812, and the protruding alignment portion 2818 may be inserted through the opening 2814 to a second surface 2830 (e.g., a back surface) of the PCB 2812. Further, a light source 2822, reflector 2824, and lens 2826 may be integrated on the second surface 2830 of PCB 2812 to direct input light through aperture 2816 and bottom glass window 2808 to MEMS chip 2810.

Fig. 29A-29C are diagrams illustrating examples of an integrated material analyzer device 2900 using a metal substrate 2902 according to some aspects. The metal substrate 2902 with accurate machining may be used for accurate placement of various components of the material analysis device 2900. In particular, the metal substrate 2902 may include alignment features configured to align the light modulator 2906 (e.g., MEMS chip), the detector 2930, the first optical window 2932 (e.g., bottom glass window), and the light coupling device 2910. For example, the metal substrate 2902 may include mechanical openings as alignment marks, openings for injecting the optical coupling device 2910, placing the MEMS chip 2906, the detector 2930, and the bottom glass window 2932, and allowing wire bonds to be electrically connected to the various components. The frame 2904 may be inserted into (attached to) the metal substrate 2902. Frame 2904 may include an opening 2928, with opening 2928 configured to receive a second optical window 2908 (e.g., a top glass window).

The metal substrate 2902 may be attached to a first surface 2924 (e.g., top surface) of a board 2912 (e.g., PCB). The PCB 2912 includes an opening 2916 (e.g., a hole) aligned with the bottom glass window 2932. Further, the light source 2918, reflector 2920, and lens 2922 may be integrated on (attached to) the second surface 2926 (e.g., the back surface) of the PCB 2912 to direct input light through the aperture 2916 and bottom glass window 2932 to the MEMS chip 2906.

The following provides an overview of examples of the present disclosure.

Example 1: a compact material analyzer device, comprising: a light source configured to generate input light; a module comprising a first optical window on a first face of the module, a second optical window on a second face of the module opposite the first face, and a light modulator configured to receive the input light from the light source through the first optical window, attenuate the input light, and generate modulated light based on the input light, the light modulator further configured to direct the modulated light through the second optical window to a sample; and a detector configured to receive output light from the sample resulting from interaction with the modulated light through the second optical window and to detect a spectrum of the output light.

Example 2. The compact material analyzer device of example 1, wherein the module comprises a first substrate comprising a first surface and a second surface, the light modulator positioned on the first surface of the first substrate.

Example 3. The compact material analyzer device of example 2, further comprising: a printed circuit board having the module positioned on a top surface of the printed circuit board, and the printed circuit board including an aperture configured to couple light from the light source into the module.

Example 4. The compact material analyzer device of example 3, wherein the first substrate includes an interposer, the first substrate being attached to the printed circuit board.

Example 5 the compact material analyzer device of any one of examples 2-4, wherein the first optical window is positioned on the second surface of the first substrate.

Example 6. The compact material analyzer device of example 5, wherein the light source is positioned on the second surface of the first substrate, and wherein the module further comprises: a first reflector; and a second reflector, the first reflector configured to receive the input light from the light source and to direct the input light through the first optical window to the second reflector, the second reflector configured to direct the input light to the light modulator.

Example 7. The compact material analyzer device of example 6, wherein the module further comprises: a third optical window; an additional light modulator; a third reflector; and a fourth reflector, wherein the third reflector is configured to receive the input light from the light source and direct the input light through the third optical window to the fourth reflector, the fourth reflector configured to direct the input light to the additional light modulator, the additional light modulator further configured to generate additional modulated light based on the input light and direct the additional modulated light through the second optical window to the sample to generate additional output light resulting from interaction with the additional modulated light that is directed to the detector.

Example 8 the compact material analyzer device of any one of examples 2-7, wherein the first substrate includes an opening, the first optical window covering the opening.

Example 9 the compact material analyzer device according to any one of examples 2 to 5, further comprising: a source module comprising a second substrate and the light source, wherein the light source is positioned on the second substrate.

Example 10 the compact material analyzer device of example 9, further comprising: a light detection module comprising a third optical window, a third substrate, and the detector, wherein the detector is positioned on the third substrate and is configured to receive the output light from the sample through the third optical window.

Example 11. The compact material analyzer device of example 10, wherein the light detection module further comprises a lens on the third optical window.

Example 12 the compact material analyzer device of any one of examples 2-9, wherein the detector is positioned on the first surface of the first substrate and is configured to receive the output light from the sample through the second optical window.

Example 13 the compact material analyzer device according to any one of examples 1 to 9 or 12, further comprising: a reflector is positioned adjacent to the sample and to the second optical window and is configured to reflect the output light from the sample back to the sample to direct the output light to the detector.

Example 14 the compact material analyzer device of any one of examples 1-13, further comprising: an optical condensing element configured to collect the output light from the sample and reflect the output light to the detector.

Example 15. The compact material analyzer device of example 14, wherein the optical concentrating element is a composite optical concentrating element comprising an inner optical concentrating element having a first depth and an outer optical concentrating element having a second depth, the second depth being less than the first depth, wherein the outer optical concentrating element is configured to reflect the output light back to the sample to produce additional output light that is collected by the inner optical concentrating element for reflection to the detector.

Example 16. The compact material analyzer device of example 15, wherein the external optical concentrating element comprises an annular shape.

Example 17 the compact material analyzer device of any one of examples 14-16, wherein the detector comprises a first detector and a second detector, and the optical concentrating element comprises a first optical concentrating element configured to direct a first portion of the output light to the first detector, and a second optical concentrating element configured to direct a second portion of the output light to the second detector.

Example 18 the compact material analyzer device of example 17, wherein the first portion of the output light is received from a first spatial location on the sample and the second portion of the output light is received from a second spatial location on the sample.

Example 19 the compact material analyzer device of example 17, wherein the first portion of the output light includes a first wavelength range and the second portion of the output light includes a second wavelength range different from the first wavelength range.

Example 20 the compact material analyzer device of any one of examples 1-19, wherein the module further comprises: a first optical element configured to receive the input light and to direct the input light to the light modulator; and a second optical element configured to receive the modulated light and direct the modulated light through the second optical window to the sample.

Example 21. The compact material analyzer device of example 20, wherein the module further comprises an optical element positioned on or formed within the second optical window and configured to direct the modulated light from the second optical element to the sample.

Example 22. The compact material analyzer device of example 20 or 21, further comprising: an optical coupling device comprising the first reflector, the second reflector, and an optical condensing element configured to collect the output light from the sample and reflect the output light to the detector, wherein the optical coupling device is formed from a single piece of material.

Example 23 the compact material analyzer device of example 22, wherein the optical coupling device includes at least one mechanical alignment feature configured to optically align the optical coupling device with the optical modulator.

Example 24. The compact material analyzer device of examples 22 or 23, wherein the optical coupling device includes an electromagnetic shielding wall configured to prevent direct electromagnetic coupling between the detector and the optical modulator.

Example 25 the compact material analyzer device of any one of examples 1-5 or 8-24, wherein the module further comprises an additional light modulator configured to receive the input light from the light source, the additional light modulator further configured to generate additional modulated light based on the input light, and to direct the additional modulated light through the second optical window to the sample to generate additional output light directed to the detector resulting from interaction with the additional modulated light.

Example 26 the compact material analyzer device of example 25, wherein the module further comprises a third optical window on the first face of the module, and the additional light modulator is configured to receive the input light from the light source via the third optical window.

Example 27 the compact material analyzer device of any one of examples 1-5 or 8-24, wherein the optical modulator includes a mach-zehnder interferometer configured to produce the modulated light and additional modulated light, the modulated light and the additional modulated light each being directed to a different spatial location on the sample, and the compact material analyzer device further comprising: an additional detector configured to receive additional output light from the sample resulting from interaction with the additional modulated light and to detect an additional spectrum of the additional output light.

Example 28 the compact material analyzer device of any one of examples 1-5, 8, 9, 12, 13, or 20-27, further comprising: an illumination waveguide configured to direct the modulated light to the sample; and a collecting waveguide configured to guide the output light to the detector.

Example 29. The compact material analyzer device of example 28, wherein the illumination waveguide comprises a curved waveguide interface.

Example 30 the compact material analyzer device of examples 28 or 29, wherein: the second optical window includes a lens configured to couple the output light to the collection waveguide; the optical modulator is formed in a substrate that includes a device layer, an oxide layer, and a handle layer, and the collection waveguide includes a first collection waveguide formed in the device layer and a second collection waveguide formed in the handle layer, the first collection waveguide being parallel to the second collection waveguide.

Example 31 the compact material analyzer device of example 1, wherein the module comprises a frame comprising respective features configured to facilitate insertion and alignment of the light modulator and the detector, the frame further comprising a first opening configured to facilitate insertion of the second optical window, a protruding alignment portion extending from a side of the frame, and a plurality of alignment pins, and wherein the material analyzer device further comprises: a printed circuit board includes a second opening configured to receive the protruding alignment portion, a plurality of alignment holes configured to receive the plurality of alignment pins, and a hole aligned with the second optical window.

Example 32. The compact type material analyzer device of example 31, wherein the light source is integrated on a back side of the printed circuit board.

Example 33. The compact material analyzer device of example 1, wherein the module comprises: a metal substrate comprising an alignment feature configured to align the light modulator, the detector, and the first optical window on the metal substrate; and a frame attached to the metal substrate and including an opening configured to receive the second optical window, and wherein the compact material analyzer device further comprises: a printed circuit board including an aperture aligned with the first optical window, the metal substrate attached to a first surface of the printed circuit board, the light source attached to a second surface of the printed circuit board.

In this disclosure, the term "exemplary" is used to mean "serving as an example, instance, or illustration. Any implementation or aspect described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other aspects of the disclosure. Likewise, the term "aspect" does not require that all aspects of the disclosure include the discussed feature, advantage or mode of operation. The term "coupled" is used herein to refer to either direct or indirect coupling between two objects. For example, if object a physically touches object B, while object B touches object C, objects a and C may still be considered coupled to each other even though they do not directly physically touch each other. For example, a first object may be coupled to a second object even though the first object is never in direct physical contact with the second object. The terms "circuitry" and "circuitry" are used broadly and are intended to encompass both hardware implementations of electrical devices and conductors capable, when connected and configured, of performing the functions described in the present disclosure, not limited to the type of electronic circuitry, and software implementations of information and instructions that, when executed by a processor, enable the performance of the functions described in the present disclosure.

One or more of the components, steps, features, and/or functions illustrated in fig. 1-29C may be rearranged and/or combined into a single component, step, feature, or function, or embodied in several components, steps, or functions. Additional elements, components, steps, and/or functions may also be added without departing from the novel features disclosed herein. The apparatus, devices, and/or components shown in fig. 1-29C may be configured to perform one or more of the methods, features, or steps described herein. The novel algorithms described herein may also be implemented efficiently in software and/or embedded in hardware.

It should be understood that the specific order or hierarchy of steps in the methods disclosed is an illustration of exemplary processes. Based on design preferences, it is understood that the specific order or hierarchy of steps in the methods may be rearranged. The appended method claims present the present elements of the various steps in a sample order and are not meant to be limited to the specific order or hierarchy presented unless specifically recited therein.

The previous description is provided to enable any person skilled in the art to practice the various aspects described herein. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects. Thus, the claims are not intended to be limited to the aspects shown herein, but is to be accorded the full scope consistent with the language of the claims, wherein reference to an element in the singular does not mean "one and only one" unless specifically so stated, but rather "one or more". The term "some" means one or more unless stated otherwise. The phrase referring to "at least one of a list of items" refers to any combination of these items, including individual members. For example, "at least one of a, b, or c" is intended to encompass: a, a; b; c, performing operation; a and b; a and c; b and c; and a, b and c. All structural and functional equivalents to the elements of the various aspects described throughout this disclosure that are known or later come to be known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be encompassed by the claims. Furthermore, nothing disclosed herein is intended to be dedicated to the public regardless of whether such disclosure is explicitly recited in the claims.

Claims (33)

1. A compact material analyzer device, comprising:

a light source configured to generate input light;

a module comprising a first optical window on a first face of the module, a second optical window on a second face of the module opposite the first face, and a light modulator configured to receive the input light from the light source through the first optical window, attenuate the input light, and generate modulated light based on the input light, the light modulator further configured to direct the modulated light through the second optical window to a sample; and

a detector configured to receive output light from the sample resulting from interaction with the modulated light through the second optical window and to detect a spectrum of the output light.

2. The compact material analyzer device according to claim 1, wherein said module comprises a first substrate comprising a first surface and a second surface, said light modulator being positioned on said first surface of said first substrate.

3. The compact material analyzer device according to claim 2, further comprising:

A printed circuit board having the module positioned on a top surface of the printed circuit board, and the printed circuit board including an aperture configured to couple light from the light source into the module.

4. The compact material analyzer device according to claim 3, wherein said first substrate comprises an interposer, said first substrate being attached to said printed circuit board.

5. The compact material analyzer device according to claim 2, wherein said first optical window is positioned on said second surface of said first substrate.

6. The compact material analyzer device according to claim 5, wherein said light source is positioned on said second surface of said first substrate, and wherein said module further comprises:

a first reflector; and

a second reflector, the first reflector configured to receive the input light from the light source and to direct the input light through the first optical window to the second reflector, the second reflector configured to direct the input light to the light modulator.

7. The compact material analyzer device according to claim 6, wherein said module further comprises:

A third optical window;

an additional light modulator;

a third reflector; and

a fourth reflector is provided to be positioned in the first chamber,

wherein the third reflector is configured to receive the input light from the light source and direct the input light through the third optical window to the fourth reflector, the fourth reflector being configured to direct the input light to the additional light modulator, the additional light modulator being further configured to generate additional modulated light based on the input light and direct the additional modulated light through the second optical window to the sample to generate additional output light directed to the detector that results from interaction with the additional modulated light.

8. The compact material analyzer device according to claim 2, wherein said first substrate comprises an opening, said first optical window covering said opening.

9. The compact material analyzer device according to claim 2, further comprising:

a source module comprising a second substrate and the light source, wherein the light source is positioned on the second substrate.

10. The compact material analyzer device according to claim 9, further comprising:

a light detection module comprising a third optical window, a third substrate, and the detector, wherein the detector is positioned on the third substrate and is configured to receive the output light from the sample through the third optical window.

11. The compact material analyzer device according to claim 10, wherein said light detection module further comprises a lens on said third optical window.

12. The compact material analyzer device according to claim 2, wherein said detector is positioned on said first surface of said first substrate and is configured to receive said output light from said sample through said second optical window.

13. The compact material analyzer device according to claim 1, further comprising:

a reflector is positioned adjacent to the sample and opposite the second optical window and configured to reflect the output light from the sample back toward the sample to direct the output light to the detector.

14. The compact material analyzer device according to claim 1, further comprising:

an optical condensing element configured to collect the output light from the sample and reflect the output light to the detector.

15. The compact material analyzer device according to claim 14, wherein said optical light gathering element is a compound optical light gathering element comprising an inner optical light gathering element having a first depth and an outer optical light gathering element having a second depth, said second depth being less than said first depth, wherein said outer optical light gathering element is configured to reflect said output light back to said sample to produce additional output light, said additional output light being collected by said inner optical light gathering element for reflection to said detector.

16. The compact material analyzer device according to claim 15, wherein said external optical concentrating element comprises an annular shape.

17. The compact material analyzer device according to claim 14, wherein said detector comprises a first detector and a second detector, and said optical concentrating element comprises a first optical concentrating element configured to direct a first portion of said output light to said first detector, and a second optical concentrating element configured to direct a second portion of said output light to said second detector.

18. The compact material analyzer device according to claim 17, wherein said first portion of said output light is received from a first spatial location on said sample and said second portion of said output light is received from a second spatial location on said sample.

19. The compact material analyzer of claim 17, wherein the first portion of the output light comprises a first wavelength range and the second portion of the output light comprises a second wavelength range different from the first wavelength range.

20. The compact material analyzer device according to claim 1, wherein said module further comprises:

A first optical element configured to receive the input light and to direct the input light to the light modulator; and

a second optical element configured to receive the modulated light and direct the modulated light through the second optical window to the sample.

21. The compact material analyzer of claim 20, wherein the module further comprises a third optical element positioned on or formed within the second optical window and configured to direct the modulated light from the second optical element to the sample.

22. The compact material analyzer device according to claim 20, further comprising:

an optical coupling device comprising the first optical element, the second optical element, and an optical condensing element configured to collect the output light from the sample and reflect the output light to the detector, wherein the optical coupling device is formed from a single piece of material.

23. The compact material analyzer device of claim 22, wherein the optical coupling device comprises at least one mechanical alignment feature configured to optically align the optical coupling device with the optical modulator.

24. The compact material analyzer device according to claim 22, wherein said optical coupling device comprises an electromagnetic shielding wall configured to prevent direct electromagnetic coupling between said detector and said light modulator.

25. The compact material analyzer device according to claim 1, wherein said module further comprises an additional light modulator configured to receive said input light from said light source, said additional light modulator further configured to generate additional modulated light based on said input light, and to direct said additional modulated light through said second optical window to said sample to generate additional output light directed to said detector that originates from interaction with said additional modulated light.

26. The compact material analyzer device according to claim 25, wherein said module further comprises a third optical window on said first face of said module, and said additional light modulator is configured to receive said input light from said light source via said third optical window.

27. The compact material analyzer device according to claim 1, wherein said optical modulator comprises a mach-zehnder interferometer configured to produce said modulated light and additional modulated light, said modulated light and said additional modulated light each being directed to a different spatial location on said sample, and said compact material analyzer device further comprising:

An additional detector configured to receive additional output light from the sample resulting from interaction with the additional modulated light and to detect an additional spectrum of the additional output light.

28. The compact material analyzer device according to claim 1, further comprising:

an illumination waveguide configured to direct the modulated light to the sample; and

a collection waveguide configured to direct the output light to the detector.

29. The compact material analyzer device of claim 28, wherein the illumination waveguide comprises a curved waveguide interface.

30. The compact material analyzer device according to claim 28, wherein:

the second optical window includes a lens configured to couple the output light to the collection waveguide;

the light modulator is formed in a substrate comprising a device layer, an oxide layer, and a process layer, an

The collecting waveguide includes a first collecting waveguide formed in the device layer and a second collecting waveguide formed in the handle layer, the first collecting waveguide being parallel to the second collecting waveguide.

31. The compact material analyzer device according to claim 1, wherein said module comprises a frame including respective features configured to facilitate insertion and alignment of said light modulator and said detector, said frame further comprising a first opening configured to facilitate insertion of said second optical window, a protruding alignment portion extending from a side of said frame, and a plurality of alignment pins, and wherein said material analyzer device further comprises:

A printed circuit board includes a second opening configured to receive the protruding alignment portion, a plurality of alignment holes configured to receive the plurality of alignment pins, and a hole aligned with the second optical window.

32. The compact profile analyzer device of claim 31, wherein the light source is integrated on a back side of the printed circuit board.

33. The compact material analyzer device according to claim 1, wherein said module comprises:

a metal substrate comprising an alignment feature configured to align the light modulator, the detector, and the first optical window on the metal substrate; and

a frame attached to the metal substrate and including an opening configured to receive the second optical window, and wherein the compact material analyzer device further comprises:

a printed circuit board including an aperture aligned with the first optical window, the metal substrate attached to a first surface of the printed circuit board, the light source attached to a second surface of the printed circuit board.