CN117500147A

CN117500147A - Circuit board and intelligent door lock

Info

Publication number: CN117500147A
Application number: CN202311587147.0A
Authority: CN
Inventors: 秦开冰; 桑胜伟; 祝志凌; 叶飞; 邓业豪; 陈晨
Original assignee: Zhejiang Deboman Intelligent Manufacturing Co ltd; Zhejiang Deshiman Technology Intelligence Co ltd
Current assignee: Zhejiang Deboman Intelligent Manufacturing Co ltd; Zhejiang Deshiman Technology Intelligence Co ltd
Priority date: 2023-11-24
Filing date: 2023-11-24
Publication date: 2024-02-02

Abstract

The invention relates to the technical field of electronic circuits, and discloses a circuit board and an intelligent door lock, wherein the circuit board comprises: a substrate; a chip disposed on the substrate; a plurality of bonding pads are arranged on the bottom end face of the chip; the bonding pad extends along a direction away from the chip; the solder paste is adapted to be placed on the pads and to flow within the pads in a direction away from the chip when the chip is attached to the substrate. According to the embodiment of the invention, the bonding pad is extended along the direction away from the chip, when the chip is attached to the substrate, if the solder paste is in an excessive condition, the solder paste flows along the part, beyond the chip, on the bonding pad, so that the solder paste cannot overflow from the bonding pad, and the solder paste cannot be connected to two adjacent pins at the same time, thereby ensuring that the chip can normally operate and avoiding the risk of short circuit.

Description

Circuit board and intelligent door lock

Technical Field

The invention relates to the technical field of electronic circuits, in particular to a circuit board and an intelligent door lock.

Background

With the development of electronic devices, the integration level of devices on a circuit board is higher and higher, and the miniaturization development of devices is required, so that the space of the circuit board is smaller and smaller, the area of a chip is smaller and the integration level on the chip is higher and higher.

As the area of the chip is smaller and smaller, the distance between two adjacent pins on the chip is directly reduced and smaller. When soldering a chip, it is easy to connect solder paste to two adjacent pins at the same time, resulting in a risk of short circuits in the chip.

Disclosure of Invention

In view of the above, the present invention provides a circuit board and an intelligent door lock to solve the problem that solder paste is easily connected to two adjacent pins at the same time when a chip is soldered.

In a first aspect, the present invention provides a circuit board comprising:

a substrate;

a chip disposed on the substrate; a plurality of bonding pads are arranged on the bottom end face of the chip; the bonding pad extends along a direction away from the chip; the solder paste is adapted to be placed on the pads and to flow within the pads in a direction away from the chip when the chip is attached to the substrate.

The beneficial effects are that: according to the embodiment of the invention, the bonding pad is extended along the direction away from the chip, when the chip is attached to the substrate, if the solder paste is in an excessive condition, the solder paste flows along the part, beyond the chip, on the bonding pad, so that the solder paste cannot overflow from the bonding pad, and the solder paste cannot be connected to two adjacent pins at the same time, thereby ensuring that the chip can normally operate and avoiding the risk of short circuit.

In an alternative embodiment, the bonding pad extends in a direction away from the chip for a predetermined length that matches the size of the chip.

The beneficial effects are that: according to the embodiment of the invention, the extending length of the bonding pad is matched with the size of the chip, so that the bonding pad cannot be fragile in structure due to the fact that the extending length is too long in actual welding. In contrast, the extension length of the bonding pad is matched with the size of the chip, so that the holding capacity of the bonding pad can be improved, the stability of the chip and the substrate can be improved during welding, and the chip can be stably fixed on the substrate without falling off.

In an alternative embodiment, the pads extend 5mil to 10mil in a direction away from the die.

In an alternative embodiment, the pads extend 8 mils in a direction away from the chip.

In an alternative embodiment, a plurality of the pads are disposed at the same interval therebetween.

The beneficial effects are that: according to the embodiment of the invention, the plurality of bonding pads are arranged at the same intervals, so that the stability of the edge of the chip in all directions is ensured to be the same, the same interval between two adjacent bonding pads can be ensured, and the condition of short circuit between the two adjacent bonding pads caused by too small interval is prevented.

In an alternative embodiment, the spacing between a plurality of the pads is less than or equal to 8 mils.

In an alternative embodiment, the pads are in a groove configuration adapted to receive the solder paste therein.

The beneficial effects are that: according to the embodiment of the invention, the solder pad is arranged into the groove structure, compared with the conventional round solder pad and island-shaped solder pad, the accommodating quantity of the solder paste in the solder pad can be obviously improved, so that the solder paste is not easy to squeeze out from the inside of the solder pad in the bonding process, the solder paste can be contained in the inside of the solder pad, and the normal operation of a chip can be further ensured, and the risk of short circuit is avoided.

In an alternative embodiment, the groove depth of the bonding pad gradually decreases in a direction away from the chip.

The beneficial effects are that: according to the embodiment of the invention, the groove depth of the bonding pad is gradually reduced along the direction away from the chip, so that the solder paste can be guided to flow in the direction of reducing the groove depth in the welding process, namely, the solder paste flows along the part, exceeding the chip, on the bonding pad, so that the solder paste cannot overflow from the bonding pad, and the solder paste cannot be connected to two adjacent pins at the same time, thereby ensuring that the chip can normally operate and avoiding the risk of short circuit.

In an alternative embodiment, the internal volume of the recess structure is greater than or equal to the desired volume of solder paste.

In a second aspect, the present invention also provides an intelligent door lock, the door lock comprising: the circuit board according to any one of the above embodiments.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the invention.

Reference numerals illustrate:

1. a substrate; 2. a chip; 3. and a bonding pad.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the above terms in the present invention can be understood in a specific case by a worker of ordinary skill in the art.

In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.

With the development of electronic devices, the integration level of devices on a circuit board is higher and higher, and the miniaturization development of devices is required, so that the space of the circuit board is smaller and smaller, the area of a chip is smaller and the integration level on the chip is higher and higher. As the area of the chip is smaller and smaller, the distance between two adjacent pins on the chip is directly reduced and smaller. When soldering a chip, it is easy to connect solder paste to two adjacent pins at the same time, resulting in a risk of short circuits in the chip.

An embodiment of the present invention is described below with reference to fig. 1.

According to an embodiment of the present invention, in one aspect, there is provided a circuit board including a substrate 1 and a chip 2.

Specifically, in the embodiment of the present invention, the chip 2 is disposed on the substrate 1, and the bottom end surface of the chip 2 is provided with a plurality of pads 3. As shown in fig. 1, six pads 3 may be provided on both sides of the bottom, respectively. Of course, the present embodiment is merely illustrative of the number of the pads 3, but is not limited thereto, and those skilled in the art may change the number according to actual circumstances, and may achieve the same technical effects.

Further, the bonding pad 3 extends in a direction away from the chip 2, and the bonding pad 3 is adapted to receive solder paste thereon, and when the chip 2 is attached to the substrate 1, the solder paste flows in the bonding pad 3 in a direction away from the chip 2.

By extending the bonding pad 3 along the direction away from the chip 2, if the solder paste is redundant during soldering, the solder paste flows along the portion of the bonding pad 3 beyond the chip 2 when the chip 2 is attached to the substrate 1, so that the solder paste cannot overflow from the bonding pad 3, and the solder paste cannot be connected to two adjacent pins at the same time, thereby ensuring that the chip 2 can normally operate without risk of short circuit.

Further, in an alternative embodiment, the bonding pad 3 extends in a direction away from the chip 2 by a predetermined length, the predetermined length matching the size of the chip 2. The preset length may be 8mil, 10mil, 12mil, 14mil, etc. Of course, the present embodiment is merely illustrative of specific values of the preset length, but is not limited thereto, and those skilled in the art can change the values according to actual situations, and can achieve the same technical effects.

By matching the extension length of the bonding pad 3 with the size of the chip 2, the embodiment of the invention ensures that the bonding pad 3 cannot be fragile in structure due to too long extension length during actual welding. In contrast, the extension length of the bonding pad 3 is matched with the size of the chip 2, so that not only can the accommodating amount of the bonding pad 3 be increased, but also the stability of the chip 2 and the substrate 1 can be improved during welding, and the chip 2 can be stably fixed on the substrate 1 without falling off.

Further, in an alternative embodiment, the pads 3 extend 5mil to 10mil in a direction away from the die 2. May be 6mil, 8mil, 10mil, etc. Of course, the present embodiment is merely illustrative, but not limited thereto, and those skilled in the art can change the embodiment according to actual situations, and can achieve the same technical effects.

Further, in an alternative embodiment, the pads 3 extend 8 mils in a direction away from the chip 2.

Further, in an alternative embodiment, a plurality of the pads 3 are arranged at the same interval therebetween.

By arranging the plurality of bonding pads 3 at the same intervals, the embodiment of the invention can ensure that the stability of the edges of the chip 2 in all directions is the same, ensure that the spacing between two adjacent bonding pads 3 is the same, and prevent the short circuit between the two adjacent bonding pads 3 caused by too small spacing.

Further, in an alternative embodiment, the interval between the plurality of pads 3 is 8mil or less.

Further, in an alternative embodiment, the pads 3 are in a groove structure, in which groove structure the solder paste is adapted to be placed.

By arranging the bonding pad 3 in the groove structure, compared with the conventional round bonding pad 3 and island bonding pad 3, the embodiment of the invention can obviously improve the containing amount of the solder paste contained in the bonding pad 3, so that the solder paste is not easy to squeeze out of the bonding pad 3 in the bonding process, and the solder paste can be contained in the bonding pad 3, thereby further ensuring the normal operation of the chip 2 and avoiding the risk of short circuit.

Further, in an alternative embodiment, the groove depth of the bonding pad 3 gradually decreases in a direction away from the chip 2.

By arranging the arrangement, the groove depth of the bonding pad 3 is gradually reduced along the direction away from the chip 2, so that solder paste can be guided to flow in the direction of reducing the groove depth in the welding process, namely, the solder paste can not overflow from the bonding pad 3 and can not be connected to two adjacent pins at the same time, thereby ensuring that the chip 2 can normally operate without the risk of short circuit.

Further, in an alternative embodiment, the internal volume of the recess structure is greater than or equal to the desired volume of solder paste.

Further, the circuit board and the intelligent door lock can be fixedly connected or detachably connected. For the fixed connection, welding, bonding or the like may be adopted. For detachable connection, the fixing can be performed by adopting a screw hole mode, a clamping groove mode and a magnetic sheet attraction mode.

The manner of detachable connection is exemplified below. For example, the fixing plates can be additionally arranged around the inside of the intelligent door lock, the number of the fixing plates can be changed according to actual conditions by a person skilled in the art, 1, 2, 3, 4 and the like, screw holes are formed in the fixing plates, then another screw hole is formed in the circuit board at the position corresponding to the screw hole, and then screws sequentially penetrate through the screw holes in the fixing plates and the screw holes in the circuit board to connect the intelligent door lock with the circuit board. Further, when adopting buckle and draw-in groove's mode to fix, can additionally set up the buckle around intelligent lock's edge, the quantity of buckle can be changed according to actual conditions to the skilled artisan, 1, 2, 3, 4 etc. are offered again on the circuit board and can be with the draw-in groove of buckle cooperation work in the position that corresponds this buckle, then in the direct draw-in groove on the circuit board of buckle on the intelligent door lock to be connected intelligent door lock and circuit board. When the intelligent door lock is fixed in a magnetic attraction mode, magnetic sheets can be additionally arranged around the edge of the intelligent door lock, the number of the magnetic sheets can be changed according to actual conditions by a person skilled in the art, 1, 2, 3, 4 and the like, opposite magnetic sheets which can be attracted with the magnetic sheets are arranged at positions corresponding to the magnetic sheets on the circuit board, and then the magnetic sheets on the intelligent door lock are directly aligned with the opposite magnetic sheets embedded into the circuit board, so that the intelligent door lock is magnetically connected with the circuit board.

Of course, the present embodiment is merely illustrative of the manner of fixing connection and the manner of detachable connection, but is not limited thereto, and those skilled in the art can vary according to actual circumstances, and can achieve the same technical effects.

Although embodiments of the present invention have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope of the invention as defined by the appended claims.

Claims

1. A circuit board, comprising:

a substrate (1);

a chip (2) provided on the substrate (1); a plurality of bonding pads (3) are arranged on the bottom end face of the chip (2); the bonding pads (3) extend in a direction away from the chip (2); the solder paste is adapted to be placed on the pads (3) and flows in a direction away from the chip (2) within the pads (3) when the chip (2) is attached to the substrate (1).

2. Circuit board according to claim 1, characterized in that the pads (3) are extended in a direction away from the chip (2) by a preset length, which preset length matches the size of the chip (2).

3. A circuit board according to claim 2, characterized in that the pads (3) extend 5 to 10mil in a direction away from the chip (2).

4. A circuit board according to claim 3, characterized in that the pads (3) extend 8mil in a direction away from the chip (2).

5. A circuit board according to any one of claims 1 to 4, characterized in that a plurality of the pads (3) are arranged at the same interval therebetween.

6. The circuit board according to claim 5, wherein a spacing between the plurality of pads (3) is 8mil or less.

7. Circuit board according to any of claims 1 to 4, characterized in that the pads (3) are in a groove structure in which the solder paste is adapted to be placed.

8. Circuit board according to claim 7, characterized in that the groove depth of the pads (3) decreases gradually in a direction away from the chip (2).

9. The circuit board of claim 8, wherein the internal volume of the recess structure is greater than or equal to the desired volume of solder paste.

10. An intelligent door lock, characterized by comprising: the circuit board of any one of claims 1 to 9.