CN117497671A - LED device, backlight module and electronic equipment - Google Patents
LED device, backlight module and electronic equipment Download PDFInfo
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- CN117497671A CN117497671A CN202311844375.1A CN202311844375A CN117497671A CN 117497671 A CN117497671 A CN 117497671A CN 202311844375 A CN202311844375 A CN 202311844375A CN 117497671 A CN117497671 A CN 117497671A
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- 239000003292 glue Substances 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000005538 encapsulation Methods 0.000 claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 claims abstract description 16
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 2
- 239000008393 encapsulating agent Substances 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 abstract description 22
- 239000010410 layer Substances 0.000 abstract description 15
- 238000005286 illumination Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 14
- 239000000843 powder Substances 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- -1 Eu2+ Chemical class 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED device, a backlight module and electronic equipment, wherein the LED device comprises a substrate, a light-emitting chip arranged on the substrate and a packaging structure arranged on one side of the light-emitting chip, the packaging structure comprises a packaging adhesive layer and a fluorescent adhesive layer arranged on one side of the packaging adhesive layer in a surrounding mode, and the light refractive index of the fluorescent adhesive layer is larger than that of the packaging adhesive layer. Through setting up the base plate, be equipped with light emitting chip and packaging structure on the base plate, the encapsulation glue film includes main part and first sphere groove, the light refracting index of fluorescence glue film is greater than the light refracting index of encapsulation glue film simultaneously, utilize the three-layer refracting index difference of encapsulation glue, middle fluorescence glue and outside air, utilize the effect expansion angle of concave mirror, the refraction corresponds with the first sphere groove of reflection the partial light at chip middle part, reduce middle luminous intensity, increase the side and give out light, guide the light of encapsulation glue corner through setting up the tilting part simultaneously, thereby increase the luminous angle of LED device, improve illumination degree simultaneously.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to an LED device, a backlight module and electronic equipment.
Background
Along with the development of technology, the application field of the LED device is wider and wider, and the LED device is very important in the backlight field of LCD+LED, the luminous performance of the LED backlight module and the luminous uniformity; the HDR is added through the local dimming area dimming technology, so that higher visual experience of consumers can be remarkably improved. The regional dimming means that one region emits light with multiple lamps and one region emits light with one lamp, so that the larger the light emitting angle of the LED is, the number of LED regions can be greatly reduced, and the cost of the backlight module is reduced.
In the prior art, the light emitting angle of the LED device is usually 120-160 degrees, the illumination intensity of the central area of the chip is usually larger than that of the side edge, the illumination intensity of the side edge is relatively low, the effective illumination range is influenced, the light emitting angle of the actual LED is small, and the problem of uneven illumination exists.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide an LED device, a backlight module and electronic equipment, and aims to solve the technical problems that the LED in the prior art has smaller luminous angle and uneven illumination.
In order to achieve the above object, the present invention is achieved by the following technical scheme: the utility model provides a LED device, includes the base plate, locates light emitting chip on the base plate, and be located the packaging structure of light emitting chip's light emitting surface one side, packaging structure includes the encapsulation glue film and encloses to be located the fluorescence glue film of encapsulation glue film light emitting surface one side, the light refractive index of fluorescence glue film is greater than the light refractive index of encapsulation glue film, the encapsulation glue film includes main part, and by the first sphere groove that the inside sunken formation in middle part one side of main part, the top both sides of main part are towards light emitting chip one side is sunken to form the tilting part, the fluorescence glue film is including the first fluorescence layer of packing first sphere groove, and enclose the main part with the second fluorescence glue film of tilting part.
According to an aspect of the above technical solution, the encapsulation glue layer further includes a second spherical groove formed by recessing the inclined portion toward one side of the light emitting chip, and the fluorescent glue layer further includes a third fluorescent glue layer filling the second spherical groove.
According to an aspect of the above technical solution, the substrate includes a body portion disposed corresponding to the light emitting chip, and step portions disposed on two sides of the body portion, where one side of the step portion away from the light emitting chip extends downward in a slant manner to form a reflective portion, and the package structure further includes a reflective white glue disposed on the reflective portion.
According to an aspect of the above technical solution, the light emitting chip is a blue light chip.
According to an aspect of the foregoing technical solution, the inclined portion includes a first inclined portion near a surface of the main body portion, and a second inclined portion relatively near a side of the substrate, and a height a of a middle surface of the main body portion relative to the substrate and a height b of the second inclined portion relative to the substrate satisfy: a: b=1: 0.5.
according to an aspect of the foregoing technical solution, the first spherical groove includes a first arc portion near a surface of the main body portion, and a second arc portion relatively near a side of the substrate, where a height a of a middle surface of the main body portion relative to the substrate and a height c of the second arc portion relative to the substrate satisfy: a: c=1: 0.75.
according to an aspect of the above technical solution, the encapsulation adhesive layer is made of silica gel with a refractive index of 1.45-1.52.
According to an aspect of the above technical solution, the fluorescent glue layer includes a packaging glue and a fluorescent powder mixed in the packaging glue, and the fluorescent powder adopts KSF fluorescent powder.
On the other hand, the application also provides a backlight module, which comprises the LED device.
On the other hand, the application also provides electronic equipment, which comprises the backlight module.
Compared with the prior art, the invention has the beneficial effects that: through setting up the base plate, be equipped with light emitting chip on the base plate, light emitting surface one side of chip is equipped with packaging structure, packaging structure includes the encapsulation glue film and encloses the fluorescent glue film of locating encapsulation glue film one side, the encapsulation glue film includes main part, and by the first sphere groove of the inside sunken formation in middle part one side of main part, the light refractive index of fluorescent glue film is greater than the light refractive index of encapsulation glue film simultaneously, utilize the three-layer refractive index difference of encapsulation glue, middle fluorescent glue and outside air, utilize the effect expansion angle of concave mirror, the refraction corresponds with the reflection first sphere groove partial light in chip middle part, reduce middle luminous intensity, increase side luminous, guide the light of encapsulation glue corner through setting up the tilting part simultaneously, thereby increase the luminous angle of LED device, improve illumination degree simultaneously.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic structural diagram of an LED device according to a first embodiment of the present invention;
FIG. 2 is a schematic view of a part of the light path of an LED device according to a first embodiment of the present invention;
the main component symbols in the drawings illustrate:
the light emitting device includes a substrate 10, a body portion 10a, a step portion 10b, a reflecting portion 10c, a light emitting chip 20, a main body portion 30, an inclined portion 31, a first inclined portion 31a, a second inclined portion 31b, a first spherical groove 32, a first arc portion 32b, a second arc portion 32a, a fluorescent glue layer 40, a first fluorescent glue layer 40a, a second fluorescent glue layer 40b, and a third fluorescent glue layer 40c.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Various embodiments of the invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 2, an LED device according to a first embodiment of the present invention includes a substrate 10, a light emitting chip 20 disposed on the substrate 10, and a package structure disposed on a light emitting surface side of the light emitting chip 20, wherein the package structure includes a package adhesive layer and a fluorescent adhesive layer 40 surrounding the light emitting surface side of the package adhesive layer, a light refractive index of the fluorescent adhesive layer 40 is greater than a light refractive index of the package adhesive layer, the package adhesive layer includes a main body portion 30, a first spherical groove 32 formed by recessing a middle portion side of the main body portion 30 inwards, an inclined portion 31 is formed by recessing two top sides of the main body portion 30 towards the light emitting chip 20, and the fluorescent adhesive layer 40 includes a first fluorescent adhesive layer 40a filling the first spherical groove 32, and a second fluorescent adhesive layer 40b surrounding the main body portion 30 and the inclined portion 31.
Preferably, in the present embodiment, the inclined portion 31 includes a first inclined portion 31a near a surface side of the main body portion 30 and a second inclined portion 31b relatively near a side of the substrate 10, and a height a of a middle surface of the main body portion 30 with respect to the substrate 10 and a height b of the second inclined portion 31b with respect to the substrate 10 satisfy: a: b=1: 0.5.
further, in this embodiment, the encapsulation glue layer further includes a second spherical groove formed by recessing the inclined portion 31 toward the light emitting chip 20, and the fluorescent glue layer 40 further includes a third fluorescent glue layer 40c filling the second spherical groove.
Specifically, in the present embodiment, in the LED device, the connecting line angle between the two oppositely disposed first inclined portions 31a and the middle portion of the light emitting chip 20 is 90 ° to 100 °, and the connecting line angle between the two oppositely disposed second inclined portions 31b and the middle portion of the light emitting chip 20 is 140 ° to 150 °. Preferably, in the present embodiment, the line angle between the two first inclined portions 31a and the middle portion of the light emitting chip 20 is 90 °, and the line angle between the two second inclined portions 31b disposed opposite to each other and the middle portion of the light emitting chip 20 is 140 °. By forming the second spherical groove in the concave portion at one side of the inclined portion 31, a portion of light having a light emission range of 90 ° -140 ° is refracted, thereby increasing a light emission angle, that is, relatively increasing light emission intensity at both sides, to enhance light at a portion of the light emission range of 140 ° -170 ° and above, thereby improving light emission uniformity.
Preferably, in this embodiment, the substrate 10 includes a main body portion 10a disposed corresponding to the light emitting chip 20, and step portions 10b disposed on two sides of the main body portion 10a, wherein one side of the step portions 10b away from the light emitting chip 20 extends downward in a slant manner to form a reflective portion 10c, and the package structure further includes a reflective white glue disposed on the reflective portion 10 c. Specifically, the angle between the surface of the reflecting portion 10c and the surface of the stepped portion 10b is 5 ° to 10 °, and in this embodiment, is preferably 6 °.
As shown in fig. 2, in an embodiment of the present application, by providing the reflecting portion 10c and providing the reflecting white glue on the reflecting portion 10c, a part of the light reflected at the first spherical groove 32 can be reflected to the side edge of the light emitting chip 20, so as to further enhance the light emitting intensity of the side edge, thereby realizing light emission at a large angle of 170 ° or more.
In addition, in the present embodiment, the first spherical groove 32 includes a first arc portion 32b near the surface of the main body portion 30 and a second arc portion 32a relatively near the substrate 10, and the height a of the middle surface of the main body portion 30 relative to the substrate 10 and the height c of the second arc portion 32a relative to the substrate 10 are as follows: a: c=1: 0.75.
specifically, in the present embodiment, the light emitting chip 20 is a blue light chip. The fluorescent glue layer 40 comprises a packaging glue and fluorescent powder mixed in the packaging glue, wherein the fluorescent powder adopts KSF fluorescent powder. Blue light emitted from the blue light chip is excited by fluorescent powder to emit white light, so that large-angle white light illumination is realized. The main components of KSF fluorescent powder are fluorescent powder excitant and matrix material. The fluorescent powder excitant is a substance capable of absorbing external energy and emitting fluorescence, and rare earth element ions (such as Eu2+, tb3+ and the like) are common. The matrix material is typically an inorganic compound such as silicate, sulfate, and the like. The blue LED chip emits blue light, and when the blue light impinges on the KSF phosphor, the KSF phosphor absorbs the blue light energy and converts it to white light energy. This conversion process causes the white light emitted from the blue light and the phosphor to be superimposed on each other, thereby forming white light.
Preferably, in this embodiment, the encapsulation adhesive layer is made of a transparent silica gel with a refractive index of 1.45-1.52.
In summary, in the LED device according to the above embodiment of the present invention, the substrate 10 is provided with the light emitting chip 20, the light emitting surface side of the chip is provided with the package structure, the package structure includes the package adhesive layer and the fluorescent adhesive layer 40 surrounding the package adhesive layer, the package adhesive layer includes the main body portion 30, and the first spherical groove 32 formed by the inward recess of the middle portion side of the main body portion 30, meanwhile, the refractive index of the fluorescent adhesive layer 40 is greater than the refractive index of the package adhesive layer, the effect of the concave mirror is utilized to expand the angle, and the partial light of the middle portion of the chip corresponding to the reflective first spherical groove 32 is refracted, so as to reduce the middle luminous intensity, increase the side luminescence, and meanwhile, the inclined portion 31 is provided to guide the light at the corner of the package adhesive, so as to increase the luminous angle of the LED device, and improve the illumination uniformity; the second spherical groove is formed on one side of the inclined part 31 in a recessed way, and partial light rays with the light emitting range of 90-140 degrees are refracted, so that the light emitting angle is increased, namely the light emitting intensity of two sides is relatively increased, and the light rays in the light emitting range of 140-170 degrees and above are enhanced, so that the light emitting uniformity is improved; by providing the reflecting portion 10c and providing the reflecting portion 10c with the reflective white glue, part of the light reflected at the first spherical groove 32 can be reflected to the side edge of the light emitting chip 20, so that the light emitting intensity of the side edge is further enhanced, and thereby the light emitting with a large angle of 170 ° or more is realized.
Example two
The second embodiment of the invention provides a backlight module, which comprises the LED device in the embodiment. Specifically, in this embodiment, the backlight module further includes a PCB board for setting the LED devices, where an optical film assembly is disposed on one side of the PCB board, and by setting the LED devices as described in the foregoing embodiment, a setting pitch of the LED devices may be relatively increased, so as to reduce a usage amount of the LED devices and reduce a cost of the backlight module.
Example III
The third embodiment of the invention provides an electronic device, which comprises the backlight module in the embodiment. It is understood that the electronic device may be a backlight display device such as a television, a tablet, etc.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that various modifications and improvements can be made by those skilled in the art without departing from the spirit of the invention, which falls within the scope of the present invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
1. The utility model provides a LED device, its characterized in that includes the base plate, locates light emitting chip on the base plate, and be located the packaging structure of light emitting chip's light emitting surface one side, packaging structure includes encapsulation glue film and encloses and locate the fluorescence glue film of encapsulation glue film light emitting surface one side, the light refractive index of fluorescence glue film is greater than the light refractive index of encapsulation glue film, encapsulation glue film includes main part, and by the first sphere groove of the inwards sunken formation in middle part one side of main part, the top both sides of main part are towards light emitting chip one side is sunken to form the tilting part, fluorescence glue film is including the first fluorescence layer of packing first sphere groove, and enclose the second fluorescence glue film of closing main part with tilting part.
2. The LED device of claim 1, wherein the encapsulation glue layer further comprises a second spherical groove formed by recessing the inclined portion toward the side of the light emitting chip, and the phosphor glue layer further comprises a third phosphor glue layer filling the second spherical groove.
3. The LED device of claim 1, wherein the substrate comprises a body portion disposed corresponding to the light emitting chip, and step portions disposed on two sides of the body portion, wherein one side of the step portions away from the light emitting chip extends downward in a slanting manner to form a reflective portion, and the package structure further comprises a reflective white glue disposed on the reflective portion.
4. The LED device of claim 1, wherein the light emitting chip is a blue light chip.
5. The LED device of claim 1, wherein the inclined portion includes a first inclined portion near a side of the surface of the main body portion and a second inclined portion relatively near a side of the substrate, a height a of a middle surface of the main body portion relative to the substrate and a height b of the second inclined portion relative to the substrate being satisfied: a: b=1: 0.5.
6. the LED device of claim 1, wherein the first spherical groove includes a first arcuate portion near a side of the surface of the main body portion and a second arcuate portion relatively near a side of the substrate, a height a of the middle surface of the main body portion relative to the substrate and a height c of the second arcuate portion relative to the substrate being: a: c=1: 0.75.
7. the LED device of claim 1, wherein the encapsulant layer is a transparent silica gel having a refractive index of 1.45-1.52.
8. The LED device of claim 1, wherein the phosphor layer comprises a encapsulant and phosphor mixed within the encapsulant, wherein the phosphor is KSF phosphor.
9. A backlight module comprising the LED device of any one of claims 1-8.
10. An electronic device comprising the backlight module of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311844375.1A CN117497671B (en) | 2023-12-29 | 2023-12-29 | LED device, backlight module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311844375.1A CN117497671B (en) | 2023-12-29 | 2023-12-29 | LED device, backlight module and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN117497671A true CN117497671A (en) | 2024-02-02 |
| CN117497671B CN117497671B (en) | 2024-04-05 |
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| CN202311844375.1A Active CN117497671B (en) | 2023-12-29 | 2023-12-29 | LED device, backlight module and electronic equipment |
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| TW201109584A (en) * | 2009-09-04 | 2011-03-16 | Au Optronics Corp | Illumination device with high efficiency and manufacture method thereof |
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