CN117492275A - Backlight module and display device - Google Patents

Backlight module and display device Download PDF

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Publication number
CN117492275A
CN117492275A CN202311682654.2A CN202311682654A CN117492275A CN 117492275 A CN117492275 A CN 117492275A CN 202311682654 A CN202311682654 A CN 202311682654A CN 117492275 A CN117492275 A CN 117492275A
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CN
China
Prior art keywords
thermistor
circuit layer
backlight module
semiconductor
driving circuit
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311682654.2A
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Chinese (zh)
Inventor
吕仕林
谢俊烽
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HKC Co Ltd
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HKC Co Ltd
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Application filed by HKC Co Ltd filed Critical HKC Co Ltd
Priority to CN202311682654.2A priority Critical patent/CN117492275A/en
Publication of CN117492275A publication Critical patent/CN117492275A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

The application discloses a backlight module and a display device. Wherein, backlight unit includes: the LED lamp comprises a back plate, a driving circuit layer, a heat dissipation circuit layer, a refrigeration semiconductor and a thermistor, wherein the driving circuit layer is arranged between the back plate and the LED, the driving circuit layer is used for driving the LED to be lightened, one end of the refrigeration semiconductor is abutted against the lower surface of the driving circuit layer, and the other end of the refrigeration semiconductor is abutted against the upper surface of the back plate; the thermistor is arranged on the lower surface of the driving circuit layer; the heat dissipation circuit layer is arranged between the backboard and the driving circuit layer, the heat dissipation circuit layer is respectively and electrically connected with the thermistor and the refrigeration semiconductor, and the thermistor is used for controlling the driving circuit layer to electrify and cut off the power of the refrigeration semiconductor so as to conduct the refrigeration semiconductor when electrifying the refrigeration semiconductor. According to the technical scheme, heat can be effectively dissipated, and the service life of the display panel is prolonged.

Description

Backlight module and display device
Technical Field
The application belongs to the technical field of display, and particularly relates to a backlight module and a display device.
Background
With the development of display technology, more and more backlight modules use a MiniLED (Light-Emitting Diode) as a direct type backlight source. The MiniLED can improve the brightness of the display panel, but because the number of MiniLEDs to be paved is more, the MiniLED can generate a large amount of heat during working, and the heat is accumulated in the backlight module, so that the service life of the whole display panel is easily shortened.
Disclosure of Invention
An object of the application is to provide a backlight module and display device, can effectually dispel the heat, improve display panel's life.
Other features and advantages of the present application will be apparent from the following detailed description, or may be learned in part by the practice of the application.
According to an aspect of the embodiments of the present application, the present application provides a backlight module including a back plate, a light emitting diode, and a driving circuit layer, where the driving circuit layer is disposed between the back plate and the light emitting diode, and the driving circuit layer is used for driving to light the light emitting diode, and the backlight module further includes:
one end of the refrigerating semiconductor is abutted against the lower surface of the driving circuit layer, and the other end of the refrigerating semiconductor is abutted against the upper surface of the backboard;
the thermistor is arranged on the lower surface of the driving circuit layer; and
the heat dissipation circuit layer is arranged between the back plate and the driving circuit layer, the heat dissipation circuit layer is respectively and electrically connected with the thermistor and the refrigeration semiconductor, and the thermistor is used for controlling the driving circuit layer to electrify and de-electrify the refrigeration semiconductor so that the refrigeration semiconductor is conducted when the refrigeration semiconductor is electrified.
In one aspect, the heat dissipation circuit layer comprises a control component, the control component comprises a comparator, a response switch and a voltage dividing resistor, one end of the thermistor is used for being connected with a first power supply, the other end of the thermistor is connected with a reverse input end of the comparator, one end of the voltage dividing resistor is connected with a circuit between the thermistor and the comparator, the other end of the voltage dividing resistor is grounded, the first power supply provides contrast voltage for the reverse input end of the comparator through the thermistor, one end of the refrigeration semiconductor is connected with a second power supply, the other end of the refrigeration semiconductor is connected with the first end of the response switch, and the second end of the response switch is grounded;
the positive input end of the comparator is used for being connected with a threshold voltage, and the output end of the comparator is connected with the control end of the response switch;
the temperature of the thermistor is increased, the resistance of the thermistor is reduced, the comparison voltage is larger than the threshold voltage, the output end of the comparator provides a conduction signal, the control end of the response switch responds to the conduction signal, the first end and the second end of the response switch are conducted, and the refrigeration semiconductor is conducted;
the temperature of the thermistor is reduced, the resistance of the thermistor is increased, the comparison voltage is smaller than the threshold voltage, the output end of the comparator provides a disconnection signal, the control end of the response switch responds to the disconnection signal, the first end and the second end of the response switch are disconnected, and the refrigeration semiconductor is disconnected.
In one aspect, the driving circuit layer is provided with a plurality of mounting positions, one of the mounting positions is provided with one of the light emitting diodes, and one of the refrigeration semiconductors is provided corresponding to one of the mounting positions.
In one aspect, a thermistor of the installation position is correspondingly connected with the control assembly;
or, the thermistors of a plurality of installation positions are correspondingly connected with the same control assembly.
In one aspect, the thermistor is disposed opposite the light emitting diode, and the cooling semiconductor is disposed around the thermistor.
In one aspect, the orthographic projection of the thermistor on the back plate is within the orthographic projection range of the light emitting diode on the back plate;
the orthographic projection of the refrigeration semiconductor on the backboard is at least partially overlapped with the orthographic projection of the light emitting diode on the backboard.
In one aspect, the light emitting direction of the backlight module is used for setting a display panel, the backlight module is provided with an edge area corresponding to a non-display area of the display panel and a middle area corresponding to a display area of the display panel, the light emitting diode is arranged in the middle area, and the control component is arranged in the edge area.
In one aspect, the heat dissipation circuit layer is arranged on the upper surface of the backboard, the refrigeration semiconductor penetrates through the heat dissipation circuit layer, and the thermistor is positioned between the heat dissipation circuit layer and the driving circuit layer;
the heat dissipation circuit layer and the driving circuit layer are arranged at intervals;
or an insulating layer is arranged between the heat dissipation circuit layer and the driving circuit layer.
In one aspect, the backlight module further includes a heat conductive layer, and the heat conductive layer is disposed between the refrigeration semiconductor and the back plate.
In addition, in order to solve the above-mentioned problem, the present application still provides a display device, the display device includes diffusion piece, display panel and backlight unit as described above, display panel locates backlight unit's light-emitting direction, the diffusion piece is located display panel with between the backlight unit.
In this application, the light emitting diode generates heat during operation, and the heat acts on the thermistor. The temperature of the thermistor also changes, so that the resistance value of the thermistor changes. The drive circuit layer can be controlled to electrify or cut off the refrigeration semiconductor by utilizing the resistance value change of the thermistor. After the refrigerating semiconductor is electrified, the refrigerating semiconductor works for refrigerating, so that heat generated by the light emitting diode is absorbed, and the temperature of the light emitting diode is reduced. It can be understood that the technical scheme of this application can effectually dispel the heat to improve display panel's life.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application. It is apparent that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
Fig. 1 schematically shows a schematic structural diagram of a backlight module of the present application.
Fig. 2 schematically shows a schematic structural diagram of a medium-refrigeration semiconductor and a thermistor of the backlight module.
Fig. 3 schematically illustrates a connection structure of the middle control assembly of the backlight module of the present application.
Fig. 4 schematically illustrates a schematic top view of a refrigeration semiconductor disposed on a middle back plate of a backlight module of the present application.
The reference numerals are explained as follows:
100. a back plate; 200. a light emitting diode; 300. a driving circuit layer; 400. a refrigerating semiconductor; 500. a thermistor; 600. a heat dissipation circuit layer; 700. a heat conducting layer; 800. a diffusion sheet; 900. a display panel;
110. an intermediate zone; 120. an edge region; 310. a control assembly; 311. a comparator; 312. a response switch; 313. a voltage dividing resistor; 910. a display area; 920. a non-display area.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art.
Referring to fig. 1 and 2, the present application provides a backlight module, including: the backlight module comprises a back plate 100, light emitting diodes 200 and a driving circuit layer 300, wherein the driving circuit layer 300 is arranged between the back plate 100 and the light emitting diodes 200, and the driving circuit layer 300 is used for driving the light emitting diodes 200 to be lightened. The back plate 100 may form a mounting groove in which the light emitting diode 200 and the driving circuit layer 300 are disposed. The light emitting diode 200 may be a MiniLED or a Micro LED (Micro light emitting diode). The driving circuit layer 300 is connected to the light emitting diode 200, and the driving circuit layer 300 is used to supply power to the light emitting diode 200, thereby controlling the light emitting diode 200 to be turned on or off.
The backlight module further comprises: the cooling semiconductor 400, the thermistor 500, and the heat dissipation circuit layer 600 are arranged such that one end of the cooling semiconductor 400 abuts against the lower surface of the driving circuit layer 300 and the other end abuts against the upper surface of the back plate 100, whereby the cooling semiconductor 400 can be positioned closer to the light emitting diode 200, and the absorbed heat can be transferred to the back plate 100 in time when the cooling semiconductor 400 is turned on for cooling. The thermistor 500 is disposed on the lower surface of the driving circuit layer 300, and it is also known that the thermistor 500 can be located closer to the led 200 at this position, so that the thermistor 500 can detect the heat generated by the led 200. The heat dissipation circuit layer 600 is disposed between the back plate 100 and the driving circuit layer 300, and the heat dissipation circuit layer 600 is electrically connected to the thermistor 500 and the refrigeration semiconductor 400, respectively, and the thermistor 500 is used for controlling the driving circuit layer 300 to power on and off the refrigeration semiconductor 400, so that the refrigeration semiconductor 400 is turned on when the refrigeration semiconductor 400 is powered on. After the refrigeration semiconductor 400 is turned on, the operation is started, and the temperature of the surrounding environment can be actively reduced. Thus, the heat of the light emitting diode 200 is transferred to the low temperature, and the heat of the light emitting diode 200 is transferred to the back plate 100 through the refrigerating semiconductor 400, thereby improving the heat dissipation effect of the light emitting diode 200.
The refrigerating semiconductor 400 is also called a semiconductor refrigerating sheet or a thermoelectric refrigerating sheet, and utilizes the peltier effect (also called a thermoelectric cooling effect) of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the purpose of refrigeration can be achieved.
In this application, the led 200 generates heat during operation, and the heat acts on the thermistor 500. The temperature of the thermistor 500 also changes, so that the resistance of the thermistor 500 changes. The driving circuit layer 300 can be controlled to power on or off the cooling semiconductor 400 by using the variation of the resistance value of the thermistor 500. After the cooling semiconductor 400 is energized, the cooling semiconductor 400 operates to cool, thereby absorbing heat generated from the light emitting diode 200 and reducing the temperature of the light emitting diode 200. It can be appreciated that the technical solution of the present application can effectively dissipate heat, thereby improving the service life of the display panel 900.
In order to further improve the heat dissipation effect, the back plate 100 may be made of a metal material, such as steel, aluminum or copper, so that the heat conduction effect of the back plate 100 made of the metal material is better, and the absorbed heat generated by the refrigeration semiconductor 400 can be dissipated through the back plate 100 more quickly.
Referring to fig. 3, in order to ensure that the thermistor 500 can control the on/off of the refrigeration semiconductor 400, in this application, the heat dissipation circuit layer 600 includes a control component 310, where the control component 310 includes a comparator 311, a response switch 312 and a voltage dividing resistor 313, one end of the thermistor 500 is used for connecting a first power supply, the other end of the thermistor 500 is connected to a reverse input end of the comparator 311, one end of the voltage dividing resistor 313 is connected to a line between the thermistor 500 and the comparator 311, the other end of the voltage dividing resistor 313 is grounded, the first power supply provides a contrast voltage to the reverse input end of the comparator 311 through the thermistor 500, one end of the refrigeration semiconductor 400 is connected to a second power supply, the other end is connected to the first end of the response switch 312, and the second end of the response switch 312 is grounded.
The positive input end of the comparator 311 is used for connecting the threshold voltage, and the output end of the comparator 311 is connected with the control end of the response switch 312; the threshold voltage may be an adjustable voltage, which may also be understood as the voltage at which refrigeration is turned on. By adjusting the magnitude of the threshold voltage, the refrigeration semiconductor 400 can be turned on at different temperatures.
The on-off process of the refrigeration semiconductor 400 is specifically as follows for the thermistor 500:
when the temperature of the thermistor 500 increases due to heating, the resistance of the thermistor 500 decreases, and the resistance of the voltage dividing resistor 313 is maintained unchanged, and the first voltage supplied from the first power supply is unchanged, the voltage divided by the thermistor 500 decreases due to the decrease in the resistance of the thermistor 500, and the voltage divided by the voltage dividing resistor 313 increases. And one end of the voltage dividing resistor 313 is grounded, the voltage of the grounding end of the voltage dividing resistor 313 is zero, the voltage on the voltage dividing resistor 313 rises, and the voltage at the position between the voltage dividing resistor 313 and the thermistor 500 rises, namely the comparison voltage rises. When the comparison voltage continuously rises, the comparison voltage rises to be greater than the threshold voltage, the output end of the comparator 311 provides a conduction signal, the conduction signal can be a low level signal, the control end of the switch 312 responds to the conduction signal, the first end and the second end of the switch 312 respond to conduction, and the refrigeration semiconductor 400 responds to conduction; the refrigeration semiconductor 400 is turned on to exert a refrigeration effect. Typically, the control terminal of the response switch 312 is a gate, the first terminal is a source, the second terminal is a drain, and of course, the first terminal may be a drain, and the second terminal is a source.
When the heat generated by the light emitting diode 200 is low, the temperature of the thermistor 500 is also reduced, the resistance of the thermistor 500 is increased, the resistance of the voltage dividing resistor 313 is maintained unchanged, and when the first voltage supplied by the first power supply is unchanged, the voltage divided by the thermistor 500 is also increased due to the increase of the resistance of the thermistor 500, so that the voltage divided by the voltage dividing resistor 313 is reduced. And one end of the voltage dividing resistor 313 is grounded, the voltage of the grounding end of the voltage dividing resistor 313 is zero, and the voltage on the voltage dividing resistor 313 is reduced, namely the comparison voltage is reduced. When the comparison voltage continues to decrease, the comparison voltage decreases to be less than the threshold voltage, the output terminal of the comparator 311 provides an off signal, which may be a high level signal, and the control terminal of the switch 312 is responsive to the off signal, and the refrigeration semiconductor 400 is turned off in response to the first terminal and the second terminal of the switch 312 being turned off. The cooling effect of the cooling semiconductor 400 is lost after the cooling semiconductor 400 is disconnected, so that the technical scheme can automatically cool according to the heat generated by the light emitting diode 200, and the heating efficiency is improved. When the temperature is not required to be reduced, the power supply of the refrigeration semiconductor 400 is actively disconnected, so that more energy is saved.
The response switch 312 is a PMOS transistor, the PMOS transistor is turned on at a low level, the comparator 311 is a voltage comparator 311, the first voltage provided by the first power supply is typically 5 volts, and the second voltage provided by the second power supply is typically 12 volts.
In addition, in the case of fixed threshold voltage, the voltage dividing resistor 313 may be set as an adjustable resistor, and the thermistor 500 may be adjusted to achieve the resistance value of the control contrast voltage by adjusting the size of the voltage dividing resistor 313, that is, the on-off control of the refrigeration semiconductor 400 at different target temperatures of the thermistor 500 may be achieved by adjusting the size of the voltage dividing resistor 313.
The thermistor 500 has two types, namely a negative temperature coefficient thermistor 500 and a positive temperature coefficient thermistor 500, and the thermistor 500 in the above embodiment belongs to the negative temperature coefficient thermistor 500, and the negative temperature coefficient thermistor 500 is also called as NTC (Negative Temperature Coefficient) thermistor 500, and is a type of sensor resistor with resistance value decreasing with temperature.
It is understood that the thermistor 500 may also be a PTC thermistor 500 (Positive Temperature Coefficient, PTC) in the present application, and the PTC thermistor 500 mainly refers to a semiconductor material or component with a very large PTC. The PTC is generally referred to as a positive temperature coefficient thermistor 500, and simply referred to as PTC thermistor 500.PTC thermistor 500 is a semiconductor resistor typically having temperature sensitivity, and its resistance value increases stepwise with an increase in temperature above a certain temperature. The PTC thermistor 500 is typically a semiconductor ceramic obtained by sintering barium titanate (strontium or lead) as a main component, and adding small amounts of rare earth (Y, nb, bi, sb), acceptor (Mn, fe) elements, and additives such as glass (silica, alumina).
In the case where the thermistor 500 is a positive temperature coefficient thermistor 500, the responsive switch 312 is an NMOS tube. The thermistor 500 is connected to the positive input terminal of the comparator 311, the negative input terminal is connected to the threshold voltage, the heated temperature of the thermistor 500 increases, the resistance of the voltage dividing resistor 313 is maintained unchanged, and under the condition that the first voltage provided by the first power supply is unchanged, the voltage divided across the thermistor 500 also increases due to the increase of the resistance of the thermistor 500, so that the voltage divided across the voltage dividing resistor 313 decreases. And one end of the voltage dividing resistor 313 is grounded, the voltage of the grounding end is zero, and the voltage on the voltage dividing resistor 313 is reduced, namely the comparison voltage is reduced. When the comparison voltage continues to decrease, the comparison voltage decreases to be less than the threshold voltage, the output terminal of the comparator 311 provides a high level, and the control terminal of the switch 312 is responsive to the high level, and the refrigeration semiconductor 400 is responsive to the first terminal and the second terminal of the switch 312 being turned on.
When the temperature to which the thermistor 500 is subjected is lowered and the resistance of the thermistor 500 is lowered and the resistance of the voltage dividing resistor 313 is maintained unchanged, and the first voltage supplied from the first power supply is reduced, the voltage divided by the thermistor 500 is also lowered due to the lowering of the resistance of the thermistor 500, and the voltage divided by the voltage dividing resistor 313 is raised. And one end of the voltage dividing resistor 313 is grounded, the voltage of the grounding end is zero, and the voltage on the voltage dividing resistor 313 is increased, namely the comparison voltage is increased. When the comparison voltage continues to rise, the comparison voltage rises to be greater than the threshold voltage, the output terminal of the comparator 311 provides a low level, and the refrigeration semiconductor 400 is turned off in response to the control terminal of the switch 312 being turned off in response to the first terminal and the second terminal of the switch 312 being turned off in response to the control terminal of the switch 312 being turned on in response to the control terminal being turned on.
Referring to fig. 2 and 4, in order to improve the cooling effect, the driving circuit layer 300 is provided with a plurality of mounting positions, which are provided with connection points for connecting the cathodes and anodes of the light emitting diodes 200. One mounting position is provided with the light emitting diode 200, and one refrigeration semiconductor 400 is provided corresponding to one mounting position. That is, one refrigeration semiconductor 400 is disposed corresponding to one led 200, so that the heat emitted by each led 200 is absorbed by one refrigeration semiconductor 400, which is more specific to the cooling of the led 200 and better in refrigeration effect.
In this application, there are at least two kinds to the setting mode of accuse group subassembly:
in the first case, a thermistor 500 at a mounting location is correspondingly connected to a control component 310; that is, a control unit 310 controls the heat dissipation of a light emitting diode 200. The refrigerating semiconductors 400 corresponding to each light emitting diode 200 can be independently controlled, and the heat dissipation effect is improved.
In the second case, the plurality of thermistors 500 are correspondingly connected to the same control unit 310. A control assembly 310 controls the heat dissipation of the plurality of leds 200. The plurality of refrigeration semiconductors 400 can be controlled together, so that the control efficiency is higher, the number of the control components 310 can be reduced, the space can be saved, and the cost can be reduced. For example, one control unit 310 may be disposed in the entire backlight module, and all the cooling semiconductors 400 are controlled by one control unit 310. Or the backlight module is partitioned, and a few control components 310 can complete the active cooling control of the backlight module. For another example, the backlight module is divided into two control areas, one control area is provided with half the number of the refrigerating semiconductors 400, and the control unit 310 is provided with two, each controlling all the refrigerating semiconductors 400 in one control area. Likewise, the control assembly 310 may be provided with three or four.
In order to further improve the heat dissipation effect of the light emitting diode 200, the thermistor 500 is disposed opposite to the light emitting diode 200, and the refrigerating semiconductor 400 is disposed around the thermistor 500. For example, the thermistor 500 is disposed under the led 200, and the thermistor 500 is close enough to the led 200, so that the heat change generated by the led 200 can be detected more directly, and the on or off of the refrigeration semiconductor 400 can be controlled more accurately.
In the present application, the orthographic projection of the thermistor 500 on the back plate 100 is located within the orthographic projection range of the light emitting diode 200 on the back plate 100; that is, the thermistor 500 and the light emitting diode 200 are disposed up and down, avoiding the thermistor 500 from being located far from the light emitting diode 200. The front projection of the refrigerated semiconductor 400 onto the back plane 100 at least partially overlaps with the front projection of the light emitting diode 200 onto the back plane 100. Similarly, the refrigerating semiconductor 400 is also arranged up and down with the light emitting diode 200, so that the distance between the refrigerating semiconductor 400 and the light emitting diode 200 is ensured to be relatively close, and the refrigerating semiconductor 400 can better dissipate heat.
The light emitting direction of the backlight module in the present application is used for setting the display panel 900, the backlight module has an edge area 120 corresponding to a non-display area 920 of the display panel 900, and a middle area 110 corresponding to a display area 910 of the display panel 900, the non-display area 920 is set around the display area 910, and the display area 910 is used for presenting a display screen. The light emitting diode 200 is disposed in the middle region 110, the control component 310 is disposed in the edge region 120, and the edge region 120 is disposed around the middle region 110. The display panel 900 may be a liquid crystal display panel 900, and the liquid crystal display panel 900 does not emit light, and the backlight module is required to provide a backlight source. Positioning the control assembly 310 in the edge region 120 can reduce the space occupied by the light emitting diodes 200, thereby arranging more light emitting diodes 200.
In addition, the control assembly 310 may be disposed in the middle region 110, such as between two adjacent leds 200.
In this application, the heat dissipation circuit layer 600 is disposed on the upper surface of the back plate 100, the refrigeration semiconductor 400 is disposed through the heat dissipation circuit layer 600, and the thermistor 500 is disposed between the heat dissipation circuit layer 600 and the driving circuit layer 300. To reduce shorting between the heat sink circuit layer 600 and the driver circuit layer 300, the present application provides two solutions.
The first solution is that the heat dissipation circuit layer 600 and the driving circuit layer 300 are arranged at intervals; i.e. a certain distance is provided between the two, preventing the two from direct contact, thereby avoiding short circuit.
The second solution is to provide an insulating layer between the heat dissipation circuit layer 600 and the driving circuit layer 300, which is not conductive, so that a short circuit is not contacted between the heat dissipation circuit layer 600 and the driving circuit layer 300. Meanwhile, the insulating layer can also be supported between the heat dissipation circuit layer 600 and the driving circuit layer 300, so as to play a role in supporting a stable structure.
In order to improve the heat dissipation effect, the backlight module further includes a heat conductive layer 700, and the heat conductive layer 700 is disposed between the refrigeration semiconductor 400 and the back plate 100. The heat conducting layer 700 may be graphene, which has good heat conducting property, and can propagate the heat absorbed by the refrigeration semiconductor 400 to the back plate 100 as soon as possible.
Also, the heat conductive layer 700 may cover a larger area, for example, the heat conductive layer 700 may be provided in plurality, and one heat conductive layer 700 may be provided corresponding to one mounting position. The projected area of the heat conductive layer 700 on the back plate 100 covers the projected area of the light emitting diode 200 on the back plate 100, and also covers the projected area of the cooling semiconductor 400 on the back plate 100.
In addition, the heat conducting layer 700 may be disposed on the top surface of the back plate 100 entirely, so only one heat conducting layer 700 is required to be disposed, and the number of disposing steps is relatively small.
Referring to fig. 1 again, the present application further provides a display device, where the display device includes a diffusion sheet 800, a display panel 900 and a backlight module as above, the display panel 900 is disposed in a light emitting direction of the backlight module, and the diffusion sheet 800 is disposed between the display panel 900 and the back plate 100.
The brightness of the individual beads of the led 200 is high, which, if directly irradiated on the display panel 900, easily results in an area of the display panel 900 where light and shade are alternately present. Diffusion sheet 800 (Diffuser) may also be referred to as a Diffuser, and has a primary function of providing a uniform surface light source for the display. The base material of the diffusion sheet 800 is selected from materials with high light transmittance such as PET (Polyethylene terephthalate ), PC (Polycarbonate), PMMA (polymethyl methacrylate (polymethyl methacrylate), abbreviated as PMMA). Scattering particles are added to the substrate of the diffusion sheet 800, so that light rays are refracted, reflected and scattered by the scattering particles when passing through the diffusion sheet 800, thereby forming an optical diffusion effect. As can be seen from this, by providing the diffusion sheet 800, light can be more uniformly incident on the display panel 900.
The specific embodiments and beneficial effects of the display device refer to the above-mentioned scheme of the backlight module, and are not described herein again.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains.
It is to be understood that the present application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (10)

1. The utility model provides a backlight unit, backlight unit includes backplate, emitting diode and drive circuit layer, drive circuit layer locates the backplate with between the emitting diode, drive circuit layer is used for the drive to lighten emitting diode, its characterized in that, backlight unit still includes:
one end of the refrigerating semiconductor is abutted against the lower surface of the driving circuit layer, and the other end of the refrigerating semiconductor is abutted against the upper surface of the backboard;
the thermistor is arranged on the lower surface of the driving circuit layer; and
the heat dissipation circuit layer is arranged between the back plate and the driving circuit layer, the heat dissipation circuit layer is respectively and electrically connected with the thermistor and the refrigeration semiconductor, and the thermistor is used for controlling the driving circuit layer to electrify and de-electrify the refrigeration semiconductor so that the refrigeration semiconductor is conducted when the refrigeration semiconductor is electrified.
2. The backlight module according to claim 1, wherein the heat dissipation circuit layer comprises a control component, the control component comprises a comparator, a response switch and a voltage dividing resistor, one end of the thermistor is used for being connected with a first power supply, the other end of the thermistor is connected with a reverse input end of the comparator, one end of the voltage dividing resistor is connected with a circuit between the thermistor and the comparator, the other end of the voltage dividing resistor is grounded, the first power supply provides contrast voltage for the reverse input end of the comparator through the thermistor, one end of the refrigeration semiconductor is connected with a second power supply, the other end of the refrigeration semiconductor is connected with the first end of the response switch, and the second end of the response switch is grounded;
the positive input end of the comparator is used for being connected with a threshold voltage, and the output end of the comparator is connected with the control end of the response switch;
the temperature of the thermistor is increased, the resistance of the thermistor is reduced, the comparison voltage is larger than the threshold voltage, the output end of the comparator provides a conduction signal, the control end of the response switch responds to the conduction signal, the first end and the second end of the response switch are conducted, and the refrigeration semiconductor is conducted;
the temperature of the thermistor is reduced, the resistance of the thermistor is increased, the comparison voltage is smaller than the threshold voltage, the output end of the comparator provides a disconnection signal, the control end of the response switch responds to the disconnection signal, the first end and the second end of the response switch are disconnected, and the refrigeration semiconductor is disconnected.
3. A backlight module according to claim 2, wherein the driving circuit layer is provided with a plurality of mounting positions, one of the mounting positions is provided with one of the light emitting diodes, and one of the refrigeration semiconductors is provided corresponding to one of the mounting positions.
4. A backlight module according to claim 3, wherein a thermistor at the mounting position is correspondingly connected to the control assembly;
or, the thermistors of a plurality of installation positions are correspondingly connected with the same control assembly.
5. A backlight module according to claim 3, wherein the thermistor is disposed opposite the light emitting diode, and the cooling semiconductor is disposed around the thermistor.
6. A backlight module according to any one of claims 1 to 5, wherein the orthographic projection of the thermistor on the back plate is within the orthographic projection range of the light emitting diode on the back plate;
the orthographic projection of the refrigeration semiconductor on the backboard is at least partially overlapped with the orthographic projection of the light emitting diode on the backboard.
7. A backlight module according to claim 2, wherein the light emitting direction of the backlight module is used for setting a display panel, the backlight module has an edge region corresponding to a non-display region of the display panel and a middle region corresponding to a display region of the display panel, the light emitting diode is disposed in the middle region, and the control component is disposed in the edge region.
8. A backlight module according to any one of claims 1 to 5, wherein the heat dissipation circuit layer is provided on an upper surface of the back plate, the cooling semiconductor is provided through the heat dissipation circuit layer, and the thermistor is located between the heat dissipation circuit layer and the driving circuit layer;
the heat dissipation circuit layer and the driving circuit layer are arranged at intervals;
or an insulating layer is arranged between the heat dissipation circuit layer and the driving circuit layer.
9. A backlight module according to claim 8, further comprising a heat conductive layer disposed between the cooling semiconductor and the back plate.
10. A display device, characterized in that the display device comprises a diffusion sheet, a display panel and the backlight module according to any one of claims 1 to 9, wherein the display panel is arranged in the light emitting direction of the backlight module, and the diffusion sheet is arranged between the display panel and the backlight module.
CN202311682654.2A 2023-12-07 2023-12-07 Backlight module and display device Pending CN117492275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311682654.2A CN117492275A (en) 2023-12-07 2023-12-07 Backlight module and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311682654.2A CN117492275A (en) 2023-12-07 2023-12-07 Backlight module and display device

Publications (1)

Publication Number Publication Date
CN117492275A true CN117492275A (en) 2024-02-02

Family

ID=89676565

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311682654.2A Pending CN117492275A (en) 2023-12-07 2023-12-07 Backlight module and display device

Country Status (1)

Country Link
CN (1) CN117492275A (en)

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